Missile-borne antenna and missile-borne device

Abstract

The application relates to a missile-borne antenna and a missile-borne device. The missile-borne antenna comprises an antenna reflecting plate, at least one first antenna, each first antenna comprising a first dielectric layer, a first radiation patch and a first circuit board, the first dielectric layer being located on one side of the first circuit board, and the first radiation patch being located on the side of the first dielectric layer away from the first circuit board; the first radiation patch is used for receiving a first feeding signal through a first antenna feeding needle to transmit a first satellite positioning signal under the excitation of the first feeding signal; a second antenna comprising at least one second radiation branch and a second circuit board, each second radiation branch being located on one side of the second circuit board, and each second radiation branch being in a spiral shape and extending in a direction perpendicular to the plane where the second circuit board is located; the second radiation branch is used for receiving a second feeding signal to transmit a second satellite positioning signal under the excitation of the second feeding signal. The missile-borne device comprises the missile-borne antenna.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a missile-borne antenna and missile-borne device. Background Technology

[0002] With the development of satellite navigation technology and the successful networking of BeiDou-3 in recent years, BeiDou navigation technology has been widely used in both military and civilian fields. At present, navigation antennas are easily interfered with in complex environments. Therefore, navigation antennas need to have anti-interference performance to cope with some specific application environments, so as to ensure that they still have a certain navigation and positioning function in cluttered signal environments.

[0003] Currently, array antennas remain the primary form of navigation antennas for achieving anti-jamming capabilities, with microstrip antennas still dominating conventional array configurations. The standard practice for anti-jamming arrays using microstrip antennas is to set the array spacing to half the air wavelength of the corresponding frequency. However, due to the increasingly high integration requirements for BeiDou antennas, smaller antenna reflectors have emerged. But in smaller reflectors, the coupling between antenna elements becomes stronger due to the smaller spacing between microstrip antennas, which can interfere with anti-jamming capabilities. Summary of the Invention

[0004] Therefore, it is necessary to provide a missile-borne antenna and missile-borne device that can improve anti-jamming capability.

[0005] In a first aspect, this application provides a missile-borne antenna. The missile-borne antenna includes:

[0006] Antenna reflector;

[0007] At least one first antenna, each first antenna including a first dielectric layer, a first radiating patch and a first circuit board, the first dielectric layer being located on one side of the first circuit board, and the first radiating patch being located on the side of the first dielectric layer away from the first circuit board; the first radiating patch is used to receive a first feed signal through the first antenna feed pin, so as to transmit a first satellite positioning signal under the excitation of the first feed signal;

[0008] The second antenna includes at least one second radiating stub and a second circuit board. Each second radiating stub is located on one side of the second circuit board and is spiral-shaped with its extension direction perpendicular to the plane of the second circuit board. The second radiating stub is used to receive a second feed signal to transmit a second satellite positioning signal under the excitation of the second feed signal.

[0009] The first antenna and the second antenna are located on the reflective surface of the antenna reflector; the first antenna feed pin passes through the first dielectric layer and is then soldered onto the first circuit board, and the second radiating branch is soldered onto the second circuit board.

[0010] Secondly, this application provides a missile-borne device. The missile-borne device includes any of the missile-borne antennas described in the first aspect of this application.

[0011] The aforementioned missile-borne antenna and missile-borne device, wherein the missile-borne antenna includes: an antenna reflector; at least one first antenna, each first antenna including a first dielectric layer, a first radiating patch, and a first circuit board, the first dielectric layer being located on one side of the first circuit board, and the first radiating patch being located on the side of the first dielectric layer away from the first circuit board; the first radiating patch being used to receive a first feed signal through the first antenna feed pin, so as to transmit a first satellite positioning signal under the excitation of the first feed signal; a second antenna including at least one second radiating stub and a second circuit board, each second radiating stub being located on one side of the second circuit board, each second radiating stub being spiral-shaped and extending perpendicularly to the plane of the second circuit board; the second radiating stub being used to receive a second feed signal, so as to transmit a second satellite positioning signal under the excitation of the second feed signal; wherein each first antenna and the second antenna are located on the reflective surface of the antenna reflector; the first antenna feed pin is soldered to the first circuit board after passing through the first dielectric layer, and the second radiating stub is soldered to the second circuit board. The missile-borne antenna provided in this application embodiment has a second antenna mounted on an antenna reflector in which each of the second radiating branches is spiral-shaped and extends perpendicularly to the plane of the second circuit board of the second antenna. This reduces the coupling between the second antenna and at least one first antenna, significantly improves the low elevation angle gain of the second antenna, and further improves the low elevation angle anti-interference capability of the missile-borne antenna. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of a missile-borne antenna provided in an embodiment of this application;

[0014] Figure 2 This is a schematic diagram of the structure of a missile-borne antenna provided in an embodiment of this application. Detailed Implementation

[0015] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0017] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0018] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0019] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.

[0020] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0021] This application was made by the inventor based on his understanding and research into the following issues:

[0022] Currently, array antennas remain the primary form of navigation antennas for achieving anti-jamming capabilities, with microstrip antennas still dominating conventional array configurations. The standard practice for anti-jamming array antennas using microstrip antennas is to set the array spacing to half the air wavelength of the corresponding frequency. However, within the relatively small reflective surface of the antenna reflector, the coupling between antenna elements increases as the center-to-center spacing between elements decreases. This coupling significantly impacts the array antenna's anti-jamming capability. Furthermore, while microstrip antennas have lower low-elevation gain, a better low-elevation gain is crucial for improving the anti-jamming capability of missile-borne devices with such antennas during flight when the array antenna is missile-borne. Therefore, how to reduce the coupling between antenna elements while simultaneously increasing the low-elevation gain to enhance the antenna's anti-jamming capability within a smaller reflective surface area is a pressing issue.

[0023] Based on this, embodiments of this application provide a missile-borne antenna. For example... Figure 1 As shown, one embodiment of the missile-borne antenna includes:

[0024] Antenna reflector 10.

[0025] At least one first antenna 20, each first antenna 20 including a first dielectric layer 202, a first radiating patch 204 and a first circuit board 206, the first dielectric layer 202 being located on one side of the first circuit board 206, and the first radiating patch 204 being located on the side of the first dielectric layer 202 away from the first circuit board 206; the first radiating patch 204 is used to receive a first feed signal through the first antenna feed pin 208, so as to transmit a first satellite positioning signal under the excitation of the first feed signal.

[0026] The second antenna 30 includes at least one second radiating stub 302 and a second circuit board 304. Each second radiating stub 302 is located on one side of the second circuit board 304. Each second radiating stub 302 is spiral-shaped and extends perpendicularly to the plane of the second circuit board 304. The second radiating stub 302 is used to receive a second feed signal to transmit a second satellite positioning signal under the excitation of the second feed signal.

[0027] Each of the first antennas 20 and the second antenna 30 is located on the reflective surface of the antenna reflector 10; the first antenna feed pin 208 passes through the first dielectric layer 202 and is then soldered onto the first circuit board 206, and the second radiating branch 302 is soldered onto the second circuit board 304.

[0028] The antenna reflector 10 includes a reflective surface and a back surface. The reflective surface refers to the part of the antenna reflector 10 used to reflect radio waves. Specifically, the reflective surface is used to concentrate and reflect the electromagnetic waves emitted by the missile-borne antenna in a specific direction, and / or reflect the received electromagnetic waves back to the missile-borne antenna. The back surface serves as a structural support for the entire antenna reflector 10, providing the antenna reflector 10 with the necessary strength and rigidity to maintain the shape and stability of the antenna reflector 10.

[0029] Optionally, the first antenna 20 is a rectangular microstrip antenna. Therefore, the first dielectric layer 202 can be a rectangular dielectric layer, the first radiating patch 204 can be a rectangular radiating patch, and the first circuit board 206 can be a rectangular circuit board. Optionally, when the first antenna 20 is a rectangular microstrip antenna, it can be a rounded rectangular microstrip antenna or a rectangular microstrip antenna with corners cut off. Further, the rounded rectangular microstrip antenna can be a rectangular microstrip antenna with the same-side rounded corners removed, or other shapes. The rectangular microstrip antenna with corners cut off can be a rectangular microstrip antenna with the same-side corners cut off, or other shapes. Optionally, the shapes of the first dielectric layer 202, the first radiating patch 204, and the first circuit board 206 can be the same or different.

[0030] Specifically, the second antenna 30 is a helical antenna, and thus, the second radiating stub 302 is a helical radiating stub extending perpendicularly to the plane of the second circuit board 304. Optionally, the second circuit board 304 can be a circular circuit board. Further, the second circuit board 304 may have at least one notch at its edge, so that the second circuit board 304 can be soldered to the reflective surface of the antenna reflector 10 by soldering at the notch, thereby soldering the second antenna 30 to the reflective surface of the antenna reflector 10.

[0031] Specifically, the first circuit board 206 and the second circuit board 304 serve as the physical and electrical foundations of the first antenna 20 and the second antenna 30, respectively. The first circuit board 206 and the second circuit board 304 provide the necessary mechanical support and electrical connection functions for the first antenna 20 and the second antenna 30, respectively. Optionally, the first circuit board 206 and the second circuit board 304 can be manufactured using printed circuit technology. Copper foil traces, pads, vias, and surface mount components can be arranged on the first circuit board 206 and the second circuit board 304 to respectively realize the electrical connection between the first antenna 20 and the external circuit providing the first feed signal, and between the second antenna 30 and the external circuit providing the second feed signal.

[0032] Optionally, a first ground patch is provided on the side of the first circuit board 206 away from the first radiating patch 204. The shape of the first ground patch is the same as that of the first circuit board 206. For example, if the first antenna 20 is a rectangular microstrip antenna, the first ground patch is a rectangular ground patch. A second ground patch is provided on the side of the second circuit board 304 away from the second radiating stub 302. The shape of the second ground patch is the same as that of the second circuit board 304. For example, if the second circuit board 304 is a circular circuit board, the second ground patch is a circular ground patch. It should be noted that the first ground patch and the second ground patch are the "ground" of the feed network of the first circuit board 206 and the "ground" of the feed network of the second circuit board 304, respectively.

[0033] Optionally, the number of first antennas 20 can be seven, and the number of second antennas 30 can be one. Thus, the seven first antennas 20 serve as the four antenna elements of the missile-borne antenna, and the second antenna 30 serves as the central antenna element of the missile-borne antenna.

[0034] Optionally, the first radiating patch 204 is a metal layer on the surface of the first dielectric layer 202. Further optionally, when the first radiating patch 204 is a metal layer on the surface of the first dielectric layer 202, the first radiating patch 204 may be coated on the surface of the first dielectric layer 202, or the first radiating patch 204 may be aligned and nested on the surface of the first dielectric layer 202.

[0035] Optionally, the first antenna feed pin 208 is sleeved in the dielectric tube, passes through the first dielectric layer 202, and is then soldered onto the first circuit board 206.

[0036] Specifically, the first antenna feed pin 208 passes through the first dielectric layer 202 and is then soldered onto the feed network of the first circuit board 206.

[0037] Optionally, the second radiating branch 302 can be soldered onto the second circuit board 304. To further secure the second radiating branch 302 more stably onto the second circuit board 304, at least one groove can be provided on the second circuit board 304. This allows each second radiating branch 302 to be inserted into the groove and then soldered onto the second circuit board 304 through the groove. This achieves connection between the second radiating branch 302 and the second circuit board 304, while also ensuring more stable fixation of the second radiating branch 302 onto the second circuit board 304. Specifically, each second radiating branch 302 is connected to the power supply network of the second circuit board 304.

[0038] Optionally, the number of second radiating stubs 302 can be four, thus the second antenna 30 is a quadruple spiral antenna; further, when grooves are provided on the second circuit board 304, the number of grooves is the same as the number of second radiating stubs 302, which is four, so that the four spiral radiating stubs can be inserted into the four grooves respectively, so that the four radiating stubs can be connected to the feed network of the second circuit board 304 respectively.

[0039] Optionally, the frequency band of the first satellite positioning signal and the frequency band of the second satellite positioning signal can be the same.

[0040] Specifically, the distance between each second radiating branch 302 is the same; in other words, at least one second radiating branch 302 is symmetrically disposed on one side of the second circuit board 304.

[0041] Specifically, since each of the second radiating branches 302 is spiral-shaped and extends perpendicularly to the plane of the second circuit board 304, the second antenna 30 changes the direction of the radiated current to reduce the coupling between the second antenna 30 and each of the first antennas 20. Thus, by adopting the spiral-shaped second antenna 30, the low elevation angle radiation gain of the second antenna 30 can be greatly improved, thereby enhancing the anti-interference capability of the missile-borne antenna at low elevation angles.

[0042] The aforementioned missile-borne antenna includes: an antenna reflector; at least one first antenna, each first antenna including a first dielectric layer, a first radiating patch, and a first circuit board, the first dielectric layer being located on one side of the first circuit board, and the first radiating patch being located on the side of the first dielectric layer away from the first circuit board; the first radiating patch being used to receive a first feed signal through the first antenna feed pin, so as to transmit a first satellite positioning signal under the excitation of the first feed signal; a second antenna including at least one second radiating stub and a second circuit board, each second radiating stub being located on one side of the second circuit board, each second radiating stub being spiral-shaped and extending perpendicularly to the plane of the second circuit board; the second radiating stub being used to receive a second feed signal, so as to transmit a second satellite positioning signal under the excitation of the second feed signal; wherein, each first antenna and the second antenna are located on the reflective surface of the antenna reflector; the first antenna feed pin passes through the first dielectric layer and is then soldered onto the first circuit board, and the second radiating stub is soldered onto the second circuit board. The missile-borne antenna provided in this application embodiment has a second antenna mounted on an antenna reflector in which each of the second radiating branches is spiral-shaped and extends perpendicularly to the plane of the second circuit board of the second antenna. This reduces the coupling between the second antenna and at least one first antenna, significantly improves the low elevation angle gain of the second antenna, and further improves the low elevation angle anti-interference capability of the missile-borne antenna.

[0043] like Figure 1As shown, in an exemplary embodiment, each first antenna 20 is disposed at the edge of the reflective surface of the antenna reflector 10; the second antenna 30 is disposed at the center of the reflective surface.

[0044] The edge position of the reflective surface of the antenna reflector 10 can also be understood as the perimeter of the reflective surface of the antenna reflector 10. Thus, each first antenna 20 can be understood as the perimeter antenna array element of the missile-borne antenna. The center position of the reflective surface can be understood as the geometric center position of the reflective surface of the antenna reflector 10. Thus, the second antenna 30 can be understood as the central antenna array element of the missile-borne antenna.

[0045] In this embodiment, a specific antenna radiation pattern can be formed through a specific arrangement of antenna elements. Furthermore, by placing the second antenna, which is in a spiral shape, at the center of the reflector, the anti-interference performance of the missile-borne antenna in the low elevation direction can be enhanced. Therefore, placing each first antenna at the edge of the reflector surface of the antenna reflector, while placing the second antenna at the center of the reflector surface, can improve the space utilization of the missile-borne antenna to increase its integration, while simultaneously improving its anti-interference capability.

[0046] In some applications, excessively small center-to-center spacing between antenna elements in a complete antenna system can enhance mutual coupling between different antennas, causing radiation from the antenna elements to cancel each other out, ultimately leading to a decrease in the overall antenna system gain. When developing anti-interference algorithms for a complete antenna system, as the coupling between antenna elements increases, phenomena such as shallowing nulls in directional synthesis, rapid attenuation of nulls in the spatial response, and null drift will occur. These phenomena reduce the signal-to-noise ratio (SNR) of the output signal, thereby decreasing the overall antenna's anti-interference capability. Therefore, the degree of mutual coupling between antenna elements directly determines the maximum SNR of the complete antenna system; the stronger the mutual coupling between antenna elements, the lower the SNR of the output signal, and consequently, the smaller the SNR.

[0047] Due to the size limitations of the antenna reflector, the spacing between adjacent antenna elements cannot be too large. Compared to traditional microstrip antennas, the radiating surfaces of each antenna element are located in the same horizontal plane, and adjacent antenna elements have a smaller center-to-center spacing in the horizontal plane. This results in stronger current coupling between the radiating surfaces of each antenna element, causing the radiation from each antenna element to cancel each other out. Consequently, the gain of the entire antenna system decreases, leading to a reduction in its anti-interference capability. This embodiment of the application changes the radiation pattern of the central antenna element by replacing the traditional microstrip antenna with a helical antenna. By changing the direction of the radiated current, the coupling between the central antenna element and the surrounding antenna elements is reduced. Simultaneously, increasing the isolation between the central antenna element and the surrounding antenna elements also improves the gain of the entire antenna system. This significantly enhances the low-elevation radiation gain of the central antenna element, thereby improving the anti-interference capability of the entire antenna system at low elevation angles.

[0048] Based on this, in an exemplary embodiment, the center-to-center distance between adjacent first antennas 20 is smaller than the center-to-center distance between each first antenna 20 and the second antenna 30.

[0049] The center-to-center distance between adjacent first antennas 20 refers to the distance between the two center points of each pair of adjacent first antennas 20 in at least one first antenna 20; the center-to-center distance between each first antenna 20 and the second second antenna 30 refers to the distance between the center point of each first antenna 20 and the center point of the second second antenna 30 respectively.

[0050] Specifically, if the center-to-center spacing between adjacent first antennas 20 is too small, the mutual coupling between adjacent first antennas 20 will be enhanced, resulting in mutual cancellation of radiation between each first antenna 20, and consequently, a decrease in the gain of the first antenna 20. Therefore, to avoid the center-to-center spacing between adjacent first antennas 20 being too small, the center-to-center spacing between adjacent first antennas 20 can optionally be set to be greater than or equal to a first preset spacing, which should not be too small.

[0051] For example, the center-to-center distance between adjacent first antennas 20 is 0.26λ, and the center-to-center distance between each first antenna 20 and the second second antenna 30 is 0.3λ. It should be noted that the center-to-center distance between adjacent first antennas 20 and the center-to-center distance between each first antenna 20 and the second second antenna 30 provided in this application embodiment are merely exemplary embodiments, and this application embodiment does not limit the center-to-center distance between adjacent first antennas 20 or the center-to-center distance between each first antenna 20 and the second second antenna 30.

[0052] In this embodiment, the center-to-center distance between adjacent first antennas is smaller than the center-to-center distance between each first antenna and the second second antenna. Furthermore, the center-to-center distance between adjacent first antennas is not too small, thereby avoiding excessive mutual coupling between adjacent first antennas to prevent mutual cancellation of radiation between each first antenna. At the same time, since the second second antenna is a spiral antenna and its extension direction is perpendicular to the plane where the second circuit board is located, by changing the radiation mode of the second antenna, which serves as the central main array element, the direction of the radiated current is changed, which can further reduce the coupling degree between the central main array element and the first antenna, which serves as the surrounding antenna array element. In turn, by increasing the isolation between each first antenna and the second second antenna, the gain of the missile-borne antenna is improved. At the same time, while increasing the integration of the missile-borne antenna, the low elevation angle radiation gain of the central main array element can be greatly improved to enhance the anti-interference capability of the missile-borne antenna at low elevation angles.

[0053] like Figure 1 As shown, in an exemplary embodiment, the second antenna 30 further includes:

[0054] At least one matching stub 306 is provided, and each matching stub 306 is connected to each second radiating stub 302. The distance between each matching stub 306 and the connected second radiating stub 302 satisfies a preset spacing condition to achieve impedance matching.

[0055] Each matching branch 306 is soldered onto the second circuit board 304.

[0056] Optionally, the distance between each matching branch 306 and the connected second radial branch 302 can refer to the shortest distance between the geometric center of each matching branch 306 and the connected second radial branch 302.

[0057] Specifically, each matching branch 306 is soldered onto the second ground patch of the second circuit board 304.

[0058] In this embodiment, the second antenna also includes at least one matching stub. By reasonably setting the distance between each matching stub and the connected second radiating stub, impedance adjustment can be achieved. Impedance matching is achieved when the distance between each matching stub and the connected second radiating stub meets the preset spacing condition, thereby reducing signal reflection and improving the signal transmission efficiency of the missile-borne antenna.

[0059] like Figure 2 As shown, in an exemplary embodiment, the missile-borne antenna further includes:

[0060] The third antenna 40 includes a third dielectric layer 402, a third radiating patch 404, and a third circuit board 406. The third dielectric layer 402 is located on one side of the third circuit board 406, and the third radiating patch 404 is located between the third dielectric layer 402 and the second circuit board 304. The third radiating patch 404 is used to receive a third feed signal through the third antenna feed pin 408, so as to transmit a third satellite positioning signal under the excitation of the third feed signal.

[0061] The third antenna feed pin 408 passes through the third dielectric layer 402 and is then soldered onto the third circuit board 406.

[0062] Among them, the third antenna 40 is a circular microstrip antenna, and thus, the third dielectric layer 402 is a circular dielectric layer, the third radiating patch 404 is a circular radiating patch, and the third circuit board 406 is a circular circuit board.

[0063] The third radiating patch 404 is used to form a conductive path on the surface of the third dielectric layer 402 for the transmission of the third feed signal.

[0064] The third circuit board 406 is the physical and electrical foundation of the third antenna 40, providing the necessary mechanical support and electrical connection functions for the third antenna 40. Optionally, the third circuit board 406 can be manufactured using printed circuit technology, and copper foil traces, pads, vias, and surface mount components can be arranged on the third circuit board 406 to realize the electrical connection between the third antenna 40 and the external circuit that provides the third feed signal.

[0065] Optionally, the third radiating patch 404 is a metal layer on the surface of the third dielectric layer 402. Further optionally, when the third radiating patch 404 is a metal layer on the surface of the third dielectric layer 402, the third radiating patch 404 may be coated on the surface of the third dielectric layer 402, or the third radiating patch 404 may be nested in alignment on the surface of the third dielectric layer 402.

[0066] Optionally, the third antenna feed pin 408 is sleeved in the dielectric tube, passes through the third dielectric layer 402, and is then soldered onto the third circuit board 406.

[0067] Optionally, if at least one notch is provided at the edge of the second circuit board 304, the second circuit board 304 can be soldered to the third radiating patch 404 by soldering at the notch, thereby enabling the second antenna 30 to be soldered to the side of the third antenna 40 away from the antenna reflector 10.

[0068] Optionally, a third ground patch is provided on the side of the third circuit board 406 away from the third radiating patch 404. The shape of the third ground patch is the same as that of the third circuit board 406. For example, when the third antenna 40 is a circular microstrip antenna, the third ground patch is a circular ground patch. It should be noted that the third ground patch is the "ground" of the feed network of the third circuit board 406.

[0069] In the absence of interference, the positioning accuracy of the third satellite positioning signal is greater than that of the first satellite positioning signal and the second satellite positioning signal, respectively. Optionally, the frequency band of the third satellite positioning signal may be different from the frequency band of the first satellite positioning signal and the second satellite positioning signal.

[0070] As is easily understood, the third radiating patch 404 is located between the third dielectric layer 402 and the second circuit board 304. Therefore, the second antenna 30 is disposed on the side of the third antenna 40 away from the antenna reflector 10. Furthermore, when the second antenna 30 is disposed at the center of the reflective surface, the third antenna 40 is also disposed at the center of the reflective surface of the antenna reflector 10.

[0071] In this embodiment, the missile-borne antenna also includes a third antenna. Under the action of the third antenna, the missile-borne antenna can also transmit the third satellite positioning signal. Since the third satellite positioning signal has high positioning accuracy in the absence of interference, the missile-borne antenna can have higher anti-interference capability at low elevation angles.

[0072] In an exemplary embodiment, each first radiating patch 204 corresponds to two first antenna feed pins 208, and each third radiating patch 404 corresponds to two third antenna feed pins 408. The distances between the two first antenna feed pins 208 and the geometric center position of the corresponding first antenna 20 are equal, and the distances between the two third antenna feed pins 408 and the geometric center position of the corresponding third antenna 40 are equal.

[0073] The distance between the two first antenna feed pins 208 and the geometric center of the corresponding first antenna 20 can both be a second preset spacing, and the size of the second preset spacing should meet the condition of achieving impedance matching of the first antenna 20; similarly, the distance between the two third antenna feed pins 408 and the geometric center of the corresponding third antenna 40 can both be a third preset spacing, and the size of the third preset spacing should meet the condition of achieving impedance matching of the third antenna 40.

[0074] In this embodiment, both the first and third antennas adopt a dual-feed design, and the two feed points of each first antenna are equidistant from the geometric center of the first antenna. Similarly, the two feed points of the third antenna are equidistant from the geometric center of the third antenna. Thus, the dual-feed design can ensure the balance and symmetry of the first and third satellite positioning signals, reduce the reflection and standing waves of the first and third satellite positioning signals, and thereby improve the energy transmission efficiency of the first and third satellite positioning signals.

[0075] In one exemplary embodiment, the first dielectric layer 202 is a ceramic dielectric substrate, and the third dielectric layer 402 is a high-frequency dielectric substrate.

[0076] Optionally, the ceramic dielectric substrate may be composed of at least one of alumina, aluminum nitride, quartz, and titanate ceramics; the high-frequency dielectric substrate may be composed of at least one of polytetrafluoroethylene, polyimide, and epoxy resin glass fiber reinforced board.

[0077] In this embodiment, since the ceramic dielectric substrate has a high dielectric constant, which allows for the storage of more electrical energy in a smaller physical space, the antenna elements using the ceramic dielectric substrate can be appropriately reduced in size to achieve miniaturization. Therefore, the first dielectric layer of each first antenna being a ceramic dielectric substrate can appropriately reduce the size of each first antenna to improve the space utilization of each first antenna on the antenna reflector. Since the high-frequency dielectric substrate has a low dielectric constant, it has better transmission performance and lower loss. Therefore, the third dielectric layer of the third antenna being a high-frequency dielectric substrate can improve the anti-interference capability of the missile-borne antenna while maintaining its signal radiation capability.

[0078] In an exemplary embodiment, the first circuit board 206, the second circuit board 304, and the third circuit board 406 are all implemented using a 3dB orthogonal bridge.

[0079] In this embodiment, the power supply networks on the first circuit board, the second circuit board, and the third circuit board are all implemented using a 3dB orthogonal bridge. Since the 3dB orthogonal bridge can distribute each input signal to the output port with equal amplitude so that each output port receives the same signal power, and at the same time, the 3dB orthogonal bridge can also ensure that the signal phases of each output port are 90 degrees apart (i.e., orthogonal), it can ensure that each of the first antenna, the second antenna, and the third antenna in the missile-borne antenna can receive uniform signal power, thereby improving the anti-interference capability of the missile-borne antenna.

[0080] In an exemplary embodiment, the frequency bands of the first satellite positioning signal and the second satellite positioning signal are respectively a first preset frequency band, and the frequency band of the third satellite positioning signal is a second preset frequency band.

[0081] The first preset frequency band covers the frequency range of the B3 band, which is 1250.618MHz-1286.432MHz. Therefore, the first preset frequency band should at least cover 1250.618MHz-1286.432MHz. The frequency bands of both the first and second satellite positioning signals satisfy the B3 band, providing higher positioning accuracy and stronger anti-interference capabilities for the missile-borne antenna.

[0082] The second preset frequency band covers the frequency range of the B1 band, which is 1559.052MHz-1591.788MHz. Therefore, the second preset frequency band should at least cover 1559.052MHz-1591.788MHz. The third satellite positioning signal's frequency band meets the B1 band requirement, further providing higher positioning accuracy for the missile-borne antenna. In other words, the third satellite positioning signal transmitted by the third antenna 40 plays an auxiliary enhancement role in the missile-borne antenna.

[0083] In this embodiment, the frequency bands of the first satellite positioning signal and the second satellite positioning signal respectively cover the frequency range of the B3 frequency band, and the frequency band of the third satellite positioning signal covers the frequency range of the B1 frequency band. Thus, when the missile-borne antenna includes seven first antennas, one second antenna, and one third antenna, the missile-borne antenna has eight antenna array elements covering the B3 frequency band and one antenna array element covering the B1 frequency band. That is to say, the missile-borne antenna is an 8B3+B1 array antenna. Furthermore, the missile-borne antenna can operate simultaneously on the B3 and B1 frequency bands, has a wider range of applications and better communication transmission compatibility, and while having higher positioning accuracy, the missile-borne antenna also has better anti-interference capability in complex electromagnetic environments.

[0084] It is understood that the above-mentioned missile-borne antenna can also take other forms, and is not limited to the forms already mentioned in the above embodiments, as long as it can achieve the function of improving anti-interference capability.

[0085] This application also provides a missile-borne device. The missile-borne device includes the missile-borne antenna in any of the above-described missile-borne antenna embodiments.

[0086] The aforementioned missile-borne antenna can be applied to missile-borne devices or similar equipment that require certain anti-jamming capabilities, such as missile systems, drones, or spacecraft.

[0087] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0088] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A missile-borne antenna, characterized in that, The missile-borne antenna includes: Antenna reflector; At least one first antenna, each first antenna including a first dielectric layer, a first radiating patch and a first circuit board, the first dielectric layer being located on one side of the first circuit board, and the first radiating patch being located on the side of the first dielectric layer away from the first circuit board; the first radiating patch is used to receive a first feed signal through the first antenna feed pin, so as to transmit a first satellite positioning signal under the excitation of the first feed signal; The second antenna includes at least one second radiating stub and a second circuit board. Each second radiating stub is located on one side of the second circuit board, and each second radiating stub is spiral-shaped and extends perpendicularly to the plane of the second circuit board. The second radiating stub is used to receive a second feed signal to transmit a second satellite positioning signal under the excitation of the second feed signal. Wherein, each of the first antennas and the second antennas is located on the reflective surface of the antenna reflector; the first antenna feed pin passes through the first dielectric layer and is soldered to the first circuit board, and the second radiating branch is soldered to the second circuit board; Each of the first antennas is positioned at the edge of the reflective surface of the antenna reflector; the second antenna is positioned at the center of the reflective surface. The missile-borne antenna also includes: The third antenna includes a third dielectric layer, a third radiating patch, and a third circuit board. The third dielectric layer is located on one side of the third circuit board, and the third radiating patch is located between the third dielectric layer and the second circuit board. The third radiating patch is used to receive a third feed signal through the third antenna feed pin, so as to transmit a third satellite positioning signal under the excitation of the third feed signal. The third antenna feed pin passes through the third dielectric layer and is then soldered onto the third circuit board.

2. The missile-borne antenna according to claim 1, characterized in that, The center-to-center distance between adjacent first antennas is less than the center-to-center distance between each first antenna and the second antenna.

3. The missile-borne antenna according to claim 1, characterized in that, The second antenna also includes: At least one matching stub, each of the matching stubs being connected to each of the second radiating stubs, and the distance between each of the matching stubs and the connected second radiating stubs satisfying a preset spacing condition to achieve impedance matching; Each of the matching branches is soldered onto the second circuit board.

4. The missile-borne antenna according to claim 1, characterized in that, Each first radiating patch corresponds to two first antenna feed pins, and each third radiating patch corresponds to two third antenna feed pins. The distance between the two first antenna feed pins and the geometric center position of the corresponding first antenna is equal, and the distance between the two third antenna feed pins and the geometric center position of the corresponding third antenna is equal.

5. The missile-borne antenna according to claim 1, characterized in that, The first dielectric layer is a ceramic dielectric substrate, and the third dielectric layer is a high-frequency dielectric substrate.

6. The missile-borne antenna according to claim 1, characterized in that, The first circuit board, the second circuit board, and the third circuit board are all implemented using a 3dB orthogonal bridge.

7. The missile-borne antenna according to claim 1, characterized in that, The frequency bands of the first satellite positioning signal and the second satellite positioning signal are respectively the first preset frequency band, and the frequency band of the third satellite positioning signal is the second preset frequency band.

8. A missile-borne device, characterized in that, Includes the missile-borne antenna as described in any one of claims 1-7.

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