Semiconductor laser and semiconductor laser side pump module

Abstract

The invention belongs to the technical field of lasers, and discloses a semiconductor laser and a semiconductor laser side pump module, and the semiconductor laser comprises a mounting plate, a quick mounting structure located on the top surface of the mounting plate, a gain structure located above the mounting plate, and protection structures at the bottom and the top of the mounting plate. Each rapid installation structure comprises twelve fixing blocks which are evenly divided into six groups, inserting grooves formed in the tops of the fixing blocks and installation grooves formed in the inner walls of the fixing blocks, the rapid installation structures are matched with the inserting blocks, the installation process of the multiple laser side pump module bodies is greatly simplified, and in the installation process, the installation efficiency is greatly improved. When the laser side pump module body is locked, only the plug-in block outside the laser side pump module body needs to be aligned and inserted into the plug-in groove, the plug-in block slides into the plug-in groove, the built-in spring elastically deforms under the action of extrusion force, the abutting block is driven to move backwards, and the plug-in block moves downwards to a preset limiting position, so that the position of the laser side pump module body is firmly locked.

Description

Technical Field

[0001] The invention belongs to the technical field of lasers, in particular to a semiconductor laser and a semiconductor laser side pump module. Background Art

[0002] As an important optoelectronic device, semiconductor lasers have extremely wide applications in the field of modern science and technology. Its development history and background involve multiple aspects of technology promotion and demand traction. In the early days, although traditional lasers such as gas lasers and solid-state lasers met some scientific research and industrial application needs to a certain extent, they generally had limitations such as large size, high energy consumption, and complex structure. With the rapid development of electronic technology, especially the rise of semiconductor technology, it has provided a new idea and technical foundation for the research and development of new lasers. Currently, many laser devices generally use multiple pump sources to emit light sources, which correspondingly requires the installation of multiple laser side pump modules. However, in the existing installation technology, the usual practice is to place the graphite sheet under the laser side pump module and then fix it with screws. When a large number of laser side pump modules need to be installed, this method becomes quite cumbersome and inconvenient. In addition, after the installation is completed, the lines of multiple laser side pump modules are often complicated, and it takes a lot of time to organize these lines, that is, to perform beam work. At the same time, most of the laser gain designs in the existing technology only use one reflection surface, aiming to allow more optical fibers to enter the crystal, but unfortunately, the gain effect achieved by this gain method is not significant. Summary of the invention

[0003] To solve the problems raised in the above background technology, the present invention provides a semiconductor laser, comprising a mounting plate and a quick mounting structure located on the top surface of the mounting plate, and a gain structure located above the mounting plate, and a protective structure at the bottom and top of the mounting plate; The quick installation structure includes twelve fixed blocks that are evenly divided into six groups, a plug-in slot on the top of the fixed block, and a mounting slot on the inner wall of the fixed block. A hydraulic buffer rod is installed on the inner wall of the mounting slot. A spring is sleeved on the outer side of the hydraulic buffer rod. The other end of the spring is fixedly connected to an abutment block. A harness block A is provided on both sides of the mounting plate. The gain structure comprises a mounting plate and a reflecting plate mounted on the bottom of the mounting plate, a crystal rod located below the reflecting plate, and total reflecting mirrors and half mirrors at both ends of the crystal rod.

[0004] Preferably, a cooling circulation pipeline is arranged inside the mounting plate, and a heat dissipation hole is opened on the inner top wall of the mounting plate.

[0005] Preferably, the protective structure comprises a lower protective cover installed at the bottom of the mounting plate and an upper protective cover plugged onto the lower protective cover, and a B harness block adapted to the A harness block is provided on the inner wall of the upper protective cover.

[0006] Preferably, a groove adapted to the mounting plate is formed on the top of the upper protective cover.

[0007] Preferably, two groups of cooling fans are arranged on the top of the mounting plate, and a water inlet pipe and a water outlet pipe connected to both ends of the cooling circulation pipeline are arranged on one side of the mounting plate.

[0008] Preferably, the mounting plate is mounted on the inner wall of the groove by screws and a C harness block adapted to the A harness block and the B harness block is provided at the bottom of the mounting plate.

[0009] The present invention also provides a semiconductor laser side pump module, comprising a laser side pump module body and plug-in blocks located on both sides of the laser side pump module body, wherein the laser side pump module bodies are arranged in six pieces and are respectively located in the middle of a group of fixed blocks.

[0010] Preferably, the inner wall of the plug-in block is provided with a limiting groove which is plug-fitted with the abutment block.

[0011] Preferably, the laser side pump module body is plugged into the inner wall of the plug-in slot through the plug-in block and as the plug-in block moves downward, the spring is deformed and drives the abutment block to move backward until the abutment block is engaged with the limiting slot.

[0012] Compared with the prior art, the present invention has the following beneficial effects: The present invention greatly simplifies the installation process of multiple laser side pump module bodies by cooperating with the quick installation structure and the plug-in block. During the installation process, it is only necessary to align the plug-in block outside the laser side pump module body and insert it into the plug-in slot. As the plug-in block slides into the plug-in slot, the built-in spring undergoes elastic deformation under the action of the extrusion force, driving the abutment block to move backward. As the plug-in block moves down to the preset limit position, the spring immediately rebounds rapidly using its stored elastic potential energy, driving the abutment block to accurately snap into the limit slot, thereby achieving a firm locking of the position of the laser side pump module body. After the installation and fixation are completed, the lines of the laser side pump module body are neatly and orderly constrained and fixed by using the A beam line block, the B beam line block and the C beam line block, thereby significantly optimizing the installation efficiency and comprehensively ensuring the stable operation and long-term reliability of the laser side pump module body.

[0013] The present invention adopts the design of gain structure and protection structure. After the laser side pump module body is installed, it is respectively located on the front and rear sides of the crystal rod, forming an optimized optical environment. When the laser side pump module body starts to emit light, the reflector plate, by virtue of its special optical reflection characteristics, efficiently changes the light propagation path, so that more light that may have originally escaped is redirected and converged into the crystal rod. Inside the crystal rod, under the excitation of the pump light, the particle number inversion distribution is achieved, thereby successfully generating laser light. The generated laser light is directed to the half-mirror and the total reflector. The laser starts a process of multiple back-and-forth reflections between the two reflectors. During this reflection process, the laser side pump module body continuously and stably provides pump energy, just like continuously injecting a source of power into the growth of the laser beam. With each reflection, the laser beam can absorb more energy, and its energy intensity can be gradually accumulated and improved. With the increase in the number of reflections, the energy of the laser beam gradually becomes stronger like a snowball. When the power of the laser beam is finally strong enough to penetrate the half-mirror, the efficient gain effect of the beam laser is achieved. This gain effect not only significantly improves the energy intensity of the laser beam. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 ; Figure 2 The overall structure of the present invention is shown in FIG. Figure 2 ; Figure 3 It is a schematic diagram of the top view structure of the present invention; Figure 4 It is a schematic diagram of the overall cross-sectional structure of the present invention; Figure 5 This is a schematic diagram of the structure of the mounting plate of the present invention; Figure 6 It is a schematic diagram of the overall structure of the present invention; Figure 7 This is a schematic diagram of the structure of the laser side pump module body, the plug-in block and the fixing block of the present invention; Figure 8 It is a cross-sectional schematic diagram of the fixing block and the plug-in block of the present invention.

[0015] In the figure: 1. Mounting plate; 11. Cooling circulation pipeline; 12. Water inlet pipe; 13. Water outlet pipe; 2. Quick installation structure; 21. Fixing block; 22. Plug-in slot; 23. Hydraulic buffer rod; 24. Spring; 25. Abutment block; 26. Beam block A; 3. Gain structure; 31. Top plate; 311. Beam block C; 312. Cooling fan; 32. Reflection plate; 33. Crystal rod; 34. Full mirror; 35. Half mirror; 4. Protective structure; 41. Lower protective cover; 42. Upper protective cover; 421. Groove; 43. Beam block B; 5. Laser side pump module body; 6. Plug-in block. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] like Figures 1 to 8 As shown, the present invention provides a semiconductor laser, comprising a mounting plate 1 and a quick mounting structure 2 located on the top surface of the mounting plate 1, a gain structure 3 located above the mounting plate 1, and a protective structure 4 at the bottom and top of the mounting plate 1; The quick installation structure 2 includes twelve fixed blocks 21 that are evenly divided into six groups, a plug-in slot 22 opened on the top of the fixed block 21, and a mounting slot opened on the inner wall of the fixed block 21. A hydraulic buffer rod 23 is installed on the inner wall of the mounting slot. A spring 24 is sleeved on the outer side of the hydraulic buffer rod 23. The other end of the spring 24 is fixedly connected to an abutment block 25. A harness block 26 is provided on both sides of the mounting plate 1. The gain structure 3 includes a top plate 31 and a reflection plate 32 mounted on the bottom of the top plate 31 , a crystal rod 33 located below the reflection plate 32 , and total reflection mirrors 34 and a semi-transparent mirror 35 at both ends of the crystal rod 33 .

[0018] The above scheme is adopted: through the clever cooperation of the quick installation structure 2 and the plug-in block 6, not only the installation process of multiple laser side pump module bodies 5 is greatly simplified, but also many significant advantages are brought. First, this installation method greatly shortens the installation time and improves work efficiency. The traditional installation method may require complicated steps and tools, while the design of the quick installation structure 2 and the plug-in block 6 makes the installation process simple and quick. It is only necessary to align the plug-in block 6 outside the laser side pump module body 5 and insert it into the plug-in slot 22. As the plug-in block 6 slides, the built-in spring 24 will automatically complete the movement and locking of the abutment block 25 without the need for additional operations or tools. This not only saves time, but also reduces the errors that may occur during the installation process and improves the accuracy and consistency of the installation. Secondly, this installation method enhances the laser side The stability and reliability of the pump module body 5, the close fit between the plug-in block 6 and the plug-in slot 22, and the elastic deformation and rebound of the spring 24 ensure that the laser side pump module body 5 can be firmly locked in the predetermined position after installation. This firm locking mechanism not only prevents the module from shaking or shifting during operation, but also improves the shock resistance and durability of the entire system. In addition, by using the A beam block 26, the B beam block 43 and the C beam block 311 to neatly and orderly constrain and fix the lines of the laser side pump module body 5, the installation efficiency is further optimized. These beam blocks not only ensure the neatness and beauty of the lines, but also avoid interference and entanglement between the lines, thereby improving the safety and reliability of the device. At the same time, this orderly line layout also facilitates subsequent maintenance and overhaul work, reducing maintenance costs and time.

[0019] like Figures 1 to 8 As shown, a cooling circulation pipe 11 is arranged inside the mounting plate 1, a heat dissipation hole is opened on the inner top wall of the mounting plate 1, and the protective structure 4 includes a lower protective cover 41 installed on the bottom of the mounting plate 1 and an upper protective cover 42 plugged on the upper part of the lower protective cover 41, a B harness block 43 adapted to the A harness block 26 is arranged on the inner wall of the upper protective cover 42, and a groove 421 adapted to the top plate 31 is opened on the top of the upper protective cover 42.

[0020] The above scheme is adopted: through the design of the gain structure 3 and the protective structure 4, after the laser side pump module body 5 is installed, they are respectively located on the front and rear sides of the crystal rod 33, forming an optimized optical environment. When the laser side pump module body 5 starts to emit light, the reflector 32, with its special optical reflection characteristics, efficiently changes the light propagation path, so that more light that may originally escape is redirected and converged into the crystal rod 33. Inside the crystal rod 33, under the stimulation of the pump light, the particle number inversion distribution is achieved, thereby successfully generating laser light. The generated laser light is directed to the semi-transparent mirror 35 and the total reflective mirror 34. The laser light is reflected by these two reflective mirrors. During this reflection process, the laser side pump module body 5 continuously and stably provides pump energy, just like injecting a continuous source of power into the growth of the laser beam. With each reflection, the laser beam can absorb more energy, and its energy intensity can be gradually accumulated and improved. With the increase in the number of reflections, the energy of the laser beam gradually becomes stronger like a snowball. When the power of the laser beam is finally strong enough to penetrate the semi-transparent mirror 35, the efficient gain effect of the beam laser is achieved. This gain effect not only significantly improves the energy intensity of the laser beam, but also the cooling circulation pipe 11 inside the top plate 31 cooperates with the heat dissipation holes to effectively The heat dissipation problem generated by the laser during operation is solved effectively. When the laser is running, a large amount of heat will be generated. If the heat cannot be dissipated in time, the performance of the equipment will be reduced or even damaged. The cooling circulation pipeline 11 can take away the heat through the circulating coolant, and the heat dissipation holes further promote the heat dissipation to the outside, ensuring that the laser is always in a suitable operating temperature range, thereby ensuring its stable operation and extending its service life. Secondly, the combination of the lower protective cover 41 and the upper protective cover 42 in the protective structure 4 forms an effective protection for the key components of the laser. The lower protective cover 41 can prevent foreign matter such as dust and impurities from entering the bottom, avoiding pollution to the internal circuits and optical components. Or damage, the B harness block 43 of the upper protective cover 42 is adapted to the A harness block 26, which helps to organize and fix the internal lines, prevent short circuits, signal interference and other problems caused by disordered lines, and ensure the reliability and stability of the electrical connection. The groove 421 adapted to the top plate 31 opened on the top of the upper protective cover 42 makes the entire protective structure 4 more stable after installation and is not easy to loosen or move, further improving the protection effect of the laser, reducing equipment failures caused by external interference, and improving the overall reliability and safety of the laser, enabling it to work stably in a more complex environment, ensuring the continuous and efficient progress of related laser applications.

[0021] like Figures 1 to 8As shown, two groups of cooling fans 312 are arranged on the top of the top plate 31, and a water inlet pipe 12 and a water outlet pipe 13 connected to both ends of the cooling circulation pipe 11 are arranged on one side of the mounting plate 1. The top plate 31 is installed on the inner wall of the groove 421 by screws and a C harness block 311 adapted to the A harness block 26 and the B harness block 43 is arranged at the bottom of the top plate 31.

[0022] The above solution is adopted: the two groups of heat dissipation fans 312 arranged on the top of the top plate 31 can further enhance the heat dissipation effect. During the operation of the laser, in addition to the function of the cooling circulation pipe 11, the heat dissipation fans 312 can accelerate the air flow, so as to quickly dissipate the heat from the inside of the device. Especially for those areas where local heat accumulation is more obvious, the heat dissipation fans 312 can dissipate the heat in time to avoid the adverse effect of heat accumulation on the performance of the device. The heat dissipation system is formed by working in coordination with the cooling circulation pipe 11 to ensure that the laser operates in a stable temperature environment, improve the reliability and stability of its operation, and reduce the risk of overheating. The failure rate caused by this is reduced, and the service life of the equipment is extended. The water inlet pipe 12 and the water outlet pipe 13 arranged on one side of the top plate 31 are connected to the cooling circulation pipeline 11, which is convenient for the circulation supply and discharge of the coolant, so that the coolant can flow continuously in the cooling circulation pipeline 11, and effectively take away the heat generated by the equipment. At the same time, the setting of the water inlet pipe 12 and the water outlet pipe 13 is convenient for connection with the external coolant supply system, and it is easy to maintain and manage the circulation process of the coolant. The flow rate, temperature and other parameters of the coolant can be flexibly adjusted according to actual needs to adapt to the heat dissipation requirements of the laser under different working conditions, ensuring that the heat dissipation effect is always in the best state.

[0023] like Figures 1 to 8 As shown, the present invention also provides a semiconductor laser side pump module, including a laser side pump module body 5 and plug-in blocks 6 located on both sides of the laser side pump module body 5, and the laser side pump module body 5 is set to six and respectively located in the middle of a group of fixed blocks 21.

[0024] By adopting the above scheme, multiple side pump module bodies work together to gather more pump energy, thereby generating a stronger laser beam. Secondly, the design of the plug-in blocks 6 on both sides provides great convenience for the installation, disassembly and maintenance of the laser side pump modules. During the production and assembly process, the laser side pump module body 5 can be quickly and accurately connected to other related components through the plug-in blocks 6, thereby improving production efficiency and reducing assembly difficulty.

[0025] like Figures 1 to 8 As shown, the inner wall of the plug-in block 6 is provided with a limiting groove adapted for plugging with the abutment block 25. The laser side pump module body 5 is plugged into the inner wall of the plug-in groove 22 through the plug-in block 6 and as the plug-in block 6 moves downward, the spring 24 is deformed and drives the abutment block 25 to move backward until the abutment block 25 is engaged with the limiting groove.

[0026] The above scheme is adopted: the connection and snap-in are achieved through the clever cooperation of the plug-in block 6, the abutment block 25 and the limit groove, thereby constructing a convenient and stable installation method. When installing the laser side pump module body 5, it is only necessary to insert the plug-in block 6 into the plug-in slot 22. The process is simple and efficient, which significantly improves the assembly speed and reduces the labor cost and assembly difficulty. It is particularly suitable for large-scale production and manufacturing scenarios and can effectively improve production efficiency. Secondly, the elastic deformation mechanism of the spring 24 and the abutment block 25 is utilized to not only realize the automatic snap-in locking function, but also give the connection structure a certain buffering capacity. When the equipment encounters slight vibration, impact or thermal expansion and contraction caused by temperature changes during operation, the spring 24 can absorb and disperse these external forces to prevent component damage or loose connection that may be caused by rigid connection, thereby ensuring the stability and reliability of the connection between the laser side pump module body 5 and the overall structure and reducing equipment failures caused by connection problems.

[0027] The working principle and use process of the present invention: First, install the laser side pump module body 5, align the six laser side pump module bodies 5 with the middle positions of the six groups of fixed blocks 21 respectively, align the plug-in blocks 6 on both sides of the laser side pump module body 5 with the plug-in slots 22 at the top of the fixed blocks 21, and then insert the plug-in blocks 6 into the inner wall of the plug-in slots 22. During the insertion process, as the plug-in blocks 6 move downward, they will squeeze the springs 24 in the installation slots of the fixed blocks 21, and the springs 24 will deform and drive the abutment blocks 25 to move backward. When the plug-in blocks 6 are fully inserted, The abutment block 25 is engaged with the limit groove on the inner wall of the plug-in block 6 under the rebound action of the spring 24, completing the stable installation of the laser side pump module body 5. Then, the lower protective cover 41 is installed at the bottom of the top plate 31, and then the upper protective cover 42 is plugged on the top of the lower protective cover 41, so that the B harness block 43 on the inner wall of the upper protective cover 42 cooperates with the A harness blocks 26 on both sides of the top plate 31 to organize and fix the internal lines. At the same time, the top plate 31 is installed on the inner wall of the groove 421 at the top of the upper protective cover 42 by screws, and the top plate 31 The C beam line block 311 at the bottom is adapted to the A beam line block 26 and the B beam line block 43 to further fix the line and stabilize the protective structure 4. Subsequently, the cooling circulation system is connected, and the external coolant supply system is connected to the water inlet pipe 12 and the water outlet pipe 13 on one side of the top plate 31, so that the coolant can circulate in the cooling circulation pipeline 11 inside the top plate 31 to prepare for the heat dissipation of the laser when it is working. When the laser side pump module body 5 starts to emit light, the light is reflected by the reflector 32 at the bottom of the top plate 31, and more light is gathered into the crystal rod 33. Under the excitation of the pump light, the crystal rod 33 generates laser light to the semi-transparent mirror 35 and the total reflector 34. The laser is reflected back and forth between the two reflectors. During this period, the laser side pump module body 5 continues to provide pump energy to gradually increase the energy of the laser beam until it penetrates the semi-transparent mirror 35 to achieve efficient gain. At the same time, the two sets of cooling fans 312 on the top of the top plate 31 are started, and work together with the cooling circulation pipeline 11 and the heat dissipation holes to accelerate heat dissipation and ensure stable operation of the laser.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor laser, characterized in that: It comprises a mounting plate (1), a quick mounting structure (2) located on the top surface of the mounting plate (1), and a gain structure (3) located above the mounting plate (1), and protective structures (4) at the bottom and top of the mounting plate (1); The quick installation structure (2) comprises twelve fixed blocks (21) equally divided into six groups, a plug-in slot (22) provided on the top of the fixed block (21), and a mounting slot provided on the inner wall of the fixed block (21); a hydraulic buffer rod (23) is installed on the inner wall of the mounting slot; a spring (24) is sleeved on the outside of the hydraulic buffer rod (23); the other end of the spring (24) is fixedly connected to an abutment block (25); and A harness blocks (26) are provided on both sides of the mounting plate (1); The gain structure (3) comprises a top plate (31), a reflection plate (32) mounted on the bottom of the top plate (31), a crystal rod (33) located below the reflection plate (32), and full reflection mirrors (34) and a half mirror (35) at both ends of the crystal rod (33).

2. A semiconductor laser according to claim 1, characterized in that: A cooling circulation pipeline (11) is arranged inside the mounting plate (1), and a heat dissipation hole is provided on the inner top wall of the mounting plate (1).

3. A semiconductor laser according to claim 1, characterized in that: The protective structure (4) comprises a lower protective cover (41) mounted on the bottom of the mounting plate (1) and an upper protective cover (42) plugged onto the upper part of the lower protective cover (41), wherein a B harness block (43) adapted to the A harness block (26) is provided on the inner wall of the upper protective cover (42).

4. A semiconductor laser according to claim 3, characterized in that: The top of the upper protective cover (42) is provided with a groove (421) adapted to the top plate (31).

5. A semiconductor laser according to claim 1, characterized in that: Two groups of cooling fans (312) are arranged on the top of the top plate (31), and a water inlet pipe (12) and a water outlet pipe (13) connected to both ends of the cooling circulation pipeline (11) are arranged on one side of the mounting plate (1).

6. A semiconductor laser according to claim 3, characterized in that: The top plate (31) is mounted on the inner wall of the groove (421) by means of screws, and a C harness block (311) adapted to the A harness block (26) and the B harness block (43) is provided at the bottom of the top plate (31).

7. A semiconductor laser side pump module, applied to a semiconductor laser according to any one of claims 1 to 6, characterized in that: It comprises a laser side pump module body (5) and plug-in blocks (6) located on both sides of the laser side pump module body (5), wherein six laser side pump module bodies (5) are arranged and are respectively located in the middle of a group of fixing blocks (21).

8. A semiconductor laser side pump module according to claim 7, characterized in that: The inner wall of the plug-in block (6) is provided with a limiting groove which is plugged and adapted to the abutment block (25).

9. A semiconductor laser side pump module according to claim 7, characterized in that: The laser side pump module body (5) is plugged into the inner wall of the plug-in slot (22) through the plug-in block (6) and as the plug-in block (6) moves downward, the spring (24) is deformed and drives the abutment block (25) to move backward until the abutment block (25) is engaged with the limit slot.

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