Electronic device

Abstract

The application discloses an electronic device, the electronic device comprises a metal frame antenna component, a metal component and a tuning component, the metal component and the metal frame antenna component are spaced, the tuning component comprises an equivalent device area and a plurality of welding areas, the plurality of welding areas are respectively located at two ends of the equivalent device area, and the welding areas are located at two ends of the equivalent device area. The welding area located at one end of the equivalent device area is welded to the metal frame antenna component, the welding area located at the other end of the equivalent device area is welded to the metal component, and the equivalent device area and the welding areas are integrally arranged. The welding areas are arranged at the two ends of the equivalent device area respectively, so that the tuning component can be directly welded to the metal frame antenna component and the metal component through the welding areas, the connection structure is simple, the occupied space is small, and miniaturization design of electronic equipment is facilitated.

Description

[0001] This application is a divisional application of the Chinese patent application submitted to the State Intellectual Property Office on September 7, 2023, with application number "202311146409.X" and application name "Electronic Device". Technical Field

[0002] The present application relates to the technical field of antenna structures in electronic devices, and in particular to an electronic device. Background Art

[0003] In the prior art, in order to facilitate the transmission or reception of signals, an antenna is generally required to be installed in an electronic device (such as a mobile phone, tablet, watch, etc.), and a component (capacitor or inductor) is generally installed in the antenna gap (the distance between two antenna components) or the antenna slot position (the distance between the antenna component and the metal component) to tune the antenna. However, the existing tuning scheme of installing components in the antenna gap or antenna slot position occupies a large space, has a complex electrical connection form, has a small antenna clearance, and is costly. Summary of the invention

[0004] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of the present application is to provide an electronic device which occupies a small space and is conducive to miniaturized design.

[0005] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0006] The present application provides an electronic device, the electronic device comprising:

[0007] Metal frame antenna components;

[0008] A metal component, wherein there is a distance between the metal component and the metal frame antenna component;

[0009] A tuning component, the tuning component comprising an equivalent device area and a plurality of welding areas, the plurality of welding areas are respectively located at two ends of the equivalent device area, the welding area located at one end of the equivalent device area is welded to the metal frame antenna component, and the welding area located at the other end of the equivalent device area is welded to the metal component;

[0010] Wherein, the equivalent device area and the welding area are arranged integrally.

[0011] In this embodiment, welding areas are respectively provided at both ends of the equivalent device area, so that the tuning component can be directly welded to the metal frame antenna component and the metal component through the welding areas. Its connection structure is simple and occupies less space, which is conducive to the miniaturization design of electronic equipment.

[0012] In some embodiments, the welding area at one end of the equivalent device area is further connected to the metal frame antenna component by bonding, and the welding area at the other end of the equivalent device area is further connected to the metal component by bonding. In this embodiment, the welding area is further connected to the metal frame antenna component and the metal component by bonding, so that the tuning component can be more firmly connected to the metal frame antenna component and the metal component.

[0013] In some embodiments, the equivalent device area and the welding area both include a metal layer and an anti-oxidation layer arranged in a stacked manner, and the anti-oxidation layer is stacked on a side of the metal layer facing away from the metal frame antenna component and the metal component. In this embodiment, the anti-oxidation layer is provided to prevent the metal layer from being exposed to air and oxidized.

[0014] In some embodiments, the equivalent device area and the welding area also include a reinforcement layer, and the reinforcement layer is stacked on a side of the metal layer facing the metal frame antenna component and the metal component. In this embodiment, the reinforcement layer is provided, so that the anti-reliability of the tuning component can be improved through the reinforcement layer.

[0015] In some embodiments, the welding area is provided with a welding position, at which the side of the metal layer facing the anti-oxidation layer can be exposed outside the anti-oxidation layer through the welding position, and the side of the metal layer facing the reinforcement layer can be exposed outside the reinforcement layer through the welding position. In this embodiment, by providing a welding position in the welding area, it is convenient to make way for the welding head, so that the welding head can extend from the welding position and weld the metal layer with the metal frame antenna component and the metal component, thereby improving the welding effect.

[0016] In some embodiments, there are multiple welding positions, and the multiple welding positions are spaced apart along the length extension direction of the equivalent device area. In this embodiment, by providing multiple welding positions, the tuning component is welded to the metal frame antenna component and the metal component through the multiple welding positions, thereby improving the welding stability of the tuning component, the metal frame antenna component and the metal component, and further ensuring the electrical connection stability of the tuning component, the metal frame antenna component and the metal component.

[0017] In some embodiments, the reinforcing layer is connected to one side of the metal layer by bonding, and the anti-oxidation layer is connected to the other side of the metal layer by bonding. In this embodiment, the reinforcing layer and the anti-oxidation layer are respectively connected to the opposite sides of the metal layer by bonding, so that the connection between the reinforcing layer and the anti-oxidation layer and the metal layer is more stable.

[0018] In some embodiments, the material of the anti-oxidation layer is polyester film or ink; or

[0019] The material of the metal layer is copper foil, aluminum foil, silver foil or gold foil; or

[0020] The reinforcing layer is made of polyimide, polyester film or glass fiber cloth.

[0021] In some embodiments, the welding area is welded to the metal frame antenna component or the metal component by ultrasonic welding, spot welding or laser filling.

[0022] In some embodiments, the equivalent device region can be equivalent to a capacitor or an inductor. In this embodiment, the capacitor or inductor is used to adjust the resonant frequency of the antenna, and the adjustment method is simple.

[0023] Accordingly, the present application also provides another electronic device, which includes:

[0024] Metal frame antenna components;

[0025] A metal component, wherein there is a distance between the metal component and the metal frame antenna component;

[0026] A tuning component, the tuning component comprising an equivalent device area and a plurality of welding areas, the plurality of welding areas are respectively located at two ends of the equivalent device area, the welding area located at one end of the equivalent device area is welded to the metal frame antenna component, and the welding area located at the other end of the equivalent device area is welded to the metal component;

[0027] Wherein, the tuning component includes a silver paste layer.

[0028] In this embodiment, welding areas are respectively provided at both ends of the equivalent device area, so that the tuning component can be directly welded to the metal frame antenna component and the metal component through the welding areas. Its connection structure is simple and occupies less space, which is conducive to the miniaturization design of electronic equipment.

[0029] In some embodiments, the welding area is welded to the metal frame antenna component and the metal component by pad printing or spraying. In this embodiment, the welding area is welded to the metal frame antenna component and the metal component by pad printing or spraying, and the manufacturing process is simple.

[0030] In some embodiments, the welding area at one end of the equivalent device area is further connected to the metal frame antenna component by bonding, and the welding area at the other end of the equivalent device area is further connected to the metal component by bonding. In this embodiment, the welding area is further connected to the metal frame antenna component and the metal component by bonding, so that the tuning component can be more firmly connected to the metal frame antenna component and the metal component.

[0031] In some embodiments, the equivalent device region can be equivalent to a capacitor or an inductor. In this embodiment, the capacitor or inductor is used to adjust the resonant frequency of the antenna, and the adjustment method is simple.

[0032] In some embodiments, when the equivalent device area is equivalent to an inductor, the silver paste layer of the equivalent device area is set as a silver paste routing.

[0033] In some embodiments, the corresponding shape of the silver paste routing is formed by a customized shape press head, or the corresponding shape of the silver paste routing is formed by laser engraving to carve out excess areas in the entire silver paste layer.

[0034] In some embodiments, when the equivalent device region is equivalent to a capacitor, the tuning component further includes a dielectric layer, the silver paste layer is provided with multiple layers, and the dielectric layer is provided between each of the silver paste layers.

[0035] Compared with the prior art, the electronic device of the present application includes a metal frame antenna component, a metal component and a tuning component, and there is a spacing between the metal component and the metal frame antenna component. The tuning component includes an equivalent device area and multiple welding areas, and the multiple welding areas are respectively located at both ends of the equivalent device area. The welding area located at one end of the equivalent device area is welded to the metal frame antenna component, and the welding area located at the other end of the equivalent device area is welded to the metal component. The equivalent device area and the welding area are integrally arranged. In this embodiment, welding areas are respectively provided at both ends of the equivalent device area, so that the tuning component can be directly welded to the metal frame antenna component and the metal component through the welding areas. Its connection structure is simple and occupies less space, which is conducive to the miniaturization design of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0037] Figure 1 The present invention is a structural schematic diagram of setting a tuning point and a feeding point between a middle frame and a reference ground in an electronic device provided by the prior art.

[0038] Figure 2 A partial cross-sectional view of an electronic device provided in the prior art.

[0039] Figure 3 A structural diagram of a tuning device provided between a middle frame and a battery in an electronic device provided by prior art.

[0040] Figure 4 A schematic diagram of the connection structure between a metal frame antenna and a flexible circuit board in an electronic device provided by the prior art.

[0041] Figure 5 for Figure 4 Cross-sectional view of .

[0042] Figure 6 A diagram of the connection structure between metal components and tuning components in an electronic device provided in an embodiment of the present application.

[0043] Figure 7 for Figure 6 Cross-sectional view of .

[0044] Figure 8 A top view of a tuning component in an electronic device provided in an embodiment of the present application.

[0045] Fig. 9 for Figure 8 Cross-sectional view at AA in FIG.

[0046] Fig.10 for Figure 8 Cross-sectional view at BB in FIG.

[0047] Fig.11 This is a structural diagram of the metal layer.

[0048] FIG. 12( a ) and FIG. 12( b ) are schematic structural diagrams of equivalent device regions in a metal layer in other embodiments of the present application.

[0049] Fig.13 The invention discloses a connection manufacturing process of a metal frame antenna and a flexible circuit board in an electronic device in the prior art.

[0050] Fig.14 The present invention provides a process for connecting a metal component and a tuning component in an electronic device according to an embodiment of the present application.

[0051] Fig.15 A diagram of the connection structure between a metal component and a tuning component in an electronic device provided in another embodiment of the present application.

[0052] Fig.16 for Fig.15 Cross-sectional view of .

[0053] Fig.17 A cross-sectional view of the connection between a metal component and a tuning component in an electronic device provided in yet another embodiment of the present application.

[0054] Fig.18 A cross-sectional view of the connection between a metal component and a tuning component in an electronic device provided in yet another embodiment of the present application.

[0055] Figure ID:

[0056] 1. Metal frame antenna component; 2. Metal component; 3. Tuning component; 31. Anti-oxidation layer; 32. Metal layer; 33. Reinforcement layer; 34. Adhesive backing; 3a. Equivalent device area; 3b. Welding area; 3c. Welding position; 35. Silver paste layer; 36. Dielectric layer; 4. Insulating double-sided adhesive; 5. Injection molded part; 6. Welding head; 101. Middle frame; 102. Reference ground; 103. Circuit board; 104. Elastic part; 105 , injection molded part; 201, battery; 202, side panel; 203, circuit board; 204, tuning device; 205, middle frame; 206, elastic member; 301, first metal frame antenna; 301a, first connection area; 302, second metal frame antenna; 302a, second connection area; 303, flexible circuit board; 303a, tuning part; 303b, redundant part; 304, connecting piece; 305, injection molded part. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0058] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0060] The electronic device usually includes a battery case, a middle frame and a screen. The battery case and the screen are connected to both sides of the middle frame to form a cavity that can be used to accommodate batteries, circuit boards and electronic components. The antenna and the middle frame are integrated, so the middle frame can also be generally referred to as an antenna radiator. A tuning point and a feeding point can usually be set between the middle frame 101 and the reference ground 102 of the electronic device (that is, an inductor or capacitor is set between the middle frame and the reference ground of the electronic device) to tune the antenna radiator through the tuning point C and the feeding point D. Figure 1 As shown in Figure 1 A schematic diagram of a structure in which a tuning point and a feeding point are set between a middle frame and a reference ground in an electronic device provided by the prior art. In an actual application scenario, an injection molded part 105, a circuit board 103 and an elastic part 104 are provided in the middle frame 101, a tuning device is provided on the circuit board 103, and one side of the circuit board 103 is connected to the middle frame 101 through the elastic part 104, and the other side of the circuit board 103 is connected to the reference ground through the elastic part 104 ( Figure 2 The abutment structure between the elastic member and the middle frame and the reference ground is not shown in FIG. Figure 2 As shown, Figure 2 A partial cross-sectional view of an electronic device provided in the prior art.

[0061] The prior art provides an electronic device having an LB antenna C-mode antenna. The LB antenna C-mode antenna needs to be provided with a small inductor (0-1.5 NH) for ground return. The common solution in the industry is a side stand plate, that is, a side plate is inserted into the side wall of the battery compartment to realize antenna return. Specifically, refer to Figure 3 As shown, Figure 3 The structural diagram of a tuning device provided between the middle frame and the battery in an electronic device provided by the prior art, wherein a certain distance is provided between the side wall of the battery 201 and the middle frame 205 (antenna radiator), a side panel 202 is provided on the side wall of the battery 201, a circuit board 203 is provided between the side panel 202 and the middle frame 205 (antenna radiator), a tuning device 204 is provided on the circuit board 203, and the tuning device 204 is abutted against the middle frame 205 and the side panel 202 through an elastic member 104. However, this solution of vertically inserting the side panel on the side wall of the battery compartment squeezes the battery compartment space, and the electrical connection form is complicated, requiring multiple transfers, small antenna clearance, and high cost.

[0062] Reference Figure 4 and Figure 5 As shown, Figure 4 A schematic diagram of the connection structure between a metal frame antenna and a flexible circuit board in an electronic device provided by the prior art. Figure 5 for Figure 4The prior art also provides an electronic device, which includes a first metal frame antenna 301, a second metal frame antenna 302, a flexible circuit board 303 and an injection molded part 305, wherein the injection molded part 305 is disposed between the first metal frame antenna 301 and the second metal frame antenna 302, wherein the first metal frame antenna 301 is provided with a first connection area 301a, and the second metal frame antenna 302 is provided with a second connection area 302a, and the flexible circuit board 303 includes a tuning part 303a and a redundant part 303b, wherein the redundant part 303b is connected to the first connection area 301a through a connecting piece 304, and the tuning part 303a is connected to the second connection area 302a through a connecting piece 304. The antenna electrical connection structure of the electronic device is to weld the flexible circuit board to the spot welding spring sheet of the structural part, and then weld the spot welding spring sheet to the middle frame, and the process structure is complex and the supply chain involves multiple manufacturers, resulting in problems such as long processing cycle and high cost.

[0063] The present application discloses an electronic device, which includes a metal frame antenna component, a metal component and a tuning component. There is a gap between the metal component and the metal frame antenna component, and an injection molded part or other non-conductive component can be arranged in the gap, or it can be an air medium. The two ends of the tuning component are electrically connected to the metal frame antenna component and the metal component by welding and bonding, respectively. Among them, the tuning component includes an equivalent device area and a plurality of welding areas, and the plurality of welding areas are respectively located at the two ends of the equivalent device area. The welding area located at one end of the equivalent device area is welded to the metal frame antenna component, and the welding area located at the other end of the equivalent device area is welded to the metal component. The tuning component includes a metal layer and an anti-oxidation layer arranged in a stacked manner, or the tuning component includes a silver paste layer, and the metal component is a metal frame antenna component or a reference ground metal component.

[0064] The present application adjusts the resonant frequency of the antenna radiator through a tuning component to ensure that the antenna can work normally. At the same time, the two ends of the tuning component are directly electrically connected to the metal frame antenna component and the metal component through welding, so that the electrical connection structure between the tuning component and the metal component occupies a small space, the electrical connection method is simple, and the antenna clearance is small.

[0065] Reference Figure 6 and Figure 7 As shown, Figure 6 A diagram showing the connection structure between a metal component and a tuning component in an electronic device provided in an embodiment of the present application. Figure 7 for Figure 6A cross-sectional view. An embodiment of the present application discloses an electronic device, which includes a metal frame antenna component 1, a metal component 2 and a tuning component 3. There is a spacing between the metal component 2 and the metal frame antenna component 1. In this embodiment, an injection molded part 5 is provided between the metal component 2 and the metal frame antenna component 1. The tuning component 3 includes an equivalent device area 3a and two welding areas 3b. The two welding areas 3b are respectively located at the two ends of the equivalent device area 3a. The two welding areas 3b are respectively welded to the metal frame antenna component 1 and the metal component 2. At the same time, the two welding areas 3b are also bonded to the metal frame antenna component 1 and the metal component 2 through an insulating double-sided tape 4. That is, one of the welding areas 3b is welded and bonded to the metal frame antenna component 1, and the other welding area 3b is welded and bonded to the metal component 2, so as to realize the electrical connection between the tuning component 3 and the metal frame antenna 1 and the metal component 2.

[0066] The present application provides welding areas at both ends of the equivalent device area, so that the tuning component can be directly welded to the metal frame antenna component and the metal component through the welding areas. The connection structure is simple and takes up less space, which is conducive to the miniaturization design of the electronic device. At the same time, the present embodiment also connects the welding area to the metal frame antenna component and the metal component by bonding, so that the tuning component can be more firmly connected to the metal frame antenna component and the metal component.

[0067] Reference Figures 8 to 10 As shown, Figure 8 A top view of a tuning component in an electronic device provided in an embodiment of the present application, Fig. 9 for Figure 8 The cross-sectional view at AA in Fig.10 for Figure 8 The cross-sectional view at BB in FIG. The tuning component 3 includes a reinforcing layer 33, a metal layer 32 and an anti-oxidation layer 31 which are stacked. The reinforcing layer 33 is connected to the side of the metal layer 32 facing the metal frame antenna component 1 and the metal component 2 by bonding, and the anti-oxidation layer 31 is connected to the side of the metal layer 32 facing away from the reinforcing layer 33 by bonding, so as to prevent the metal layer 32 from being exposed to the air and oxidized by the anti-oxidation layer 31, and improve the anti-reliability of the electronic device by the reinforcing layer 33. For example, when the electronic device falls, the metal layer of the tuning component may be broken or partially deformed, and by providing a reinforcing layer on the surface of the metal layer, the anti-reliability of the metal layer can be improved by the anti-stretchability of the reinforcing layer. In this embodiment, the reinforcing layer 33 is bonded to one side of the metal layer 32 by the self-adhesive backing 34, and the anti-oxidation layer 31 is bonded to the side of the metal layer 32 facing away from the reinforcing layer 33 by the self-adhesive backing 34.

[0068] Furthermore, the two welding areas 3b are also bonded to the metal frame antenna component 1 and the metal component 2 respectively through the insulating double-sided adhesive tape 4, that is, one of the welding areas 3b is bonded and fixed to the metal frame antenna component 1 on the side facing the metal frame antenna component 1, and the other welding area 3b is bonded and fixed to the metal component 2 on the side facing the metal component 2. In this embodiment, the two welding areas 3b are bonded to the metal frame antenna component 1 and the metal component 2 respectively, so that the connection between the tuning component 3 and the metal frame antenna component 1 and the metal component 2 is more stable.

[0069] In some embodiments, the anti-oxidation layer 31 can be a polyester film (Mylar) or ink, etc., and the thickness of the anti-oxidation layer 31 can be any thickness according to different usage requirements. For example, the thickness of the anti-oxidation layer 31 can be 0.01um. The material of the metal layer 32 can be copper foil, aluminum foil, silver foil, gold foil, etc., and the thickness of the metal layer 32 can be any thickness according to different usage requirements. For example, the thickness of conventional copper foil can be 18um or 27um. The material of the reinforcement layer 33 can be polyimide (PI), polyester film (Mylar), glass fiber cloth (FR4), etc., and the thickness of the reinforcement layer 33 can be any thickness according to different usage requirements. For example, the thickness of the reinforcement layer 33 can be 0.01um. The thickness of the insulating double-sided tape 4 can be 0.01um.

[0070] In some embodiments, the reinforcing layer may not be provided, and the reinforcing layer may be provided based on the actual usage in the whole system. If a reinforcing layer is provided, since the reinforcing layer has its own adhesive backing, the welding area of ​​the tuning component can be directly bonded to the metal frame antenna component and the metal component through the reinforcing layer; if the reinforcing layer is not provided, an adhesive backing layer may be provided, and the welding area of ​​the tuning component can be bonded to the metal frame antenna component and the metal component through the adhesive backing layer.

[0071] Continue to refer to Fig. 9 As shown, the welding area 3b is provided with a welding position 3c, at the welding position 3c, the side of the metal layer 32 facing the anti-oxidation layer 31 can be exposed outside the anti-oxidation layer 31 through the welding position 3c, and the side of the metal layer 32 facing the reinforcement layer 33 can be exposed outside the reinforcement layer 33 through the welding position 3c, so that the welding head 6 can extend from the welding position 3c to perform the welding operation, so that the metal layer 32 at the welding position 3c is welded to the metal frame antenna component 1 and the metal component 2, thereby improving the welding effect.

[0072] Continue to refer to Figure 8 As shown, each welding area 3b is provided with a plurality of welding positions 3c, and the plurality of welding positions 3c are respectively arranged along the length extension direction of the welding area 3b ( Figure 8The Y direction in the figure) is spaced apart, and each welding position 3c can be welded with the metal frame antenna component 1 and the metal component 2. In this embodiment, each welding area 3b is provided with a plurality of welding positions 3c, and the metal layer 32 at each welding area 3b is welded with the metal frame antenna component 1 and the metal component 2, so that the connection between the tuning component 3 and the metal frame antenna component 1 and the metal component 2 is more stable, thereby ensuring the electrical connection stability between the tuning component and the metal frame antenna component and the metal component.

[0073] In this embodiment, the equivalent device area 3a and the welding area 3b are arranged as an integral whole, that is, the equivalent device area 3a and the welding area 3b both include a reinforcement layer 33, a metal layer 32 and an anti-oxidation layer 31 which are stacked. The difference between the equivalent device area 3a and the welding area 3b is that the welding area 3b needs to be provided with a welding position 3c, while the equivalent device area 3a does not need to be provided with a welding position.

[0074] In this embodiment, the welding area 3b is ultrasonically welded to the same side of the metal frame antenna component 1 and the metal component 2. It can be understood that in other embodiments, spot welding, laser filler welding, etc. can also be used to weld the welding area to the metal frame antenna component and the metal component.

[0075] The metal layer of the equivalent device area 3a can be made into a single layer or multiple layers as required. In some embodiments, the equivalent device area 3a can be equivalent to a capacitor or an inductor. When the equivalent device area 3 is equivalent to a capacitor, the tuning component 3 also includes a dielectric layer, and the equivalent device area 3a includes at least two metal layers, and the dielectric layer is located between the metal layers, so that the metal layers and the dielectrics sandwiched between the metal layers constitute a large capacitor. The capacitance value of the equivalent device area capacitor can be calculated according to the following flat plate capacitor calculation formula.

[0076]

[0077] Among them, C is the capacitance of the capacitor, ε is the dielectric constant, that is, the dielectric constant of the substrate of the conventional flexible circuit board, S is the area of ​​the metal layer, and D is the distance between the two metal layers. The capacitance of the coupling capacitor can be adjusted by changing ε, S and D. For example, when ε is the dielectric substrate of the conventional flexible circuit board, D is the minimum distance between the two metal layers that can form a capacitor, and S is 3mm*5mm, the maximum capacitance of the capacitor formed by the metal layer and the substrate is 10pf. When ε is increased, the capacitance of the capacitor can be increased or the metal layer area of ​​the capacitor can be reduced.

[0078] Reference Figure 11 to Figure 12(b) As shown, Fig.1112(a) and 12(b) are schematic diagrams of the structure of the equivalent device area in the metal layer in other embodiments of the present application. When the equivalent device area 3a is equivalent to an inductor, the metal layer of the equivalent device area 3a can be set as a straight line or a serpentine line. At this time, the equivalent device area 3a can be equivalent to an inductor of 1nH to 8.8nH.

[0079] Depending on the needs, the metal layer structure of the equivalent device area can be processed by die cutting, etching and other processing methods. For example, if the equivalent device area is a double metal layer (a high DK dielectric material can be cut between the two metal layers, where DK refers to the dielectric constant), the die cutting processing method can be used. This processing method is relatively less sensitive to dimensional processing, and die cutting can save costs. If the equivalent device area is an equivalent inductor and has high requirements for line width consistency, an etching process can be used. In addition, since the tuning component of the present application has a simple structure, it can also be welded using the auxiliary material resources of the die cutting factory, or the conventional FPC antenna of the antenna factory can be used (fine-tuning of the laminated structure in the welding area, that is, the lead-out welding part), that is, the physical device can also be welded in the equivalent device area, and then glue is dispensed for protection.

[0080] Reference Fig.13 and Fig.14 As shown, Fig.13 The connection manufacturing process between the metal frame antenna and the flexible circuit board in the prior art electronic equipment is as follows: Fig.14 The connection manufacturing process of the metal parts and the tuning parts in the electronic device provided in the embodiment of the present application, in the prior art, the process flow of the antenna electrical connection structure is: firstly, the FPC antenna is made by the process of printing exposure-etching-gold plating-stripping off the dry film-spraying-cutting the outer contour-adding reinforcement-antenna detection, and then the FPC antenna is welded to the steel sheet, and then the assembly of the FPC antenna and the steel sheet is pre-fixed with the middle frame fixture, and finally the assembly of the FPC antenna and the steel sheet is welded and fixed with the middle frame by a laser welding machine. The process flow of the antenna electrical connection structure of this embodiment is: firstly, the copper foil (tuning part) is made by the process of printing exposure-etching-lamination-cutting the outer contour-antenna detection, and then the copper foil is pre-fixed with the middle frame fixture, and then the copper foil is welded and fixed with the middle frame by an ultrasonic welding machine. Compared with the prior art, the copper foil (tuning part) processing method of the present application is different. From the perspective of resource field, the prior art needs to be processed in the antenna factory, and the present application can be processed in the auxiliary material factory, that is, the manufacturability is reduced, and one processing flow can be omitted.

[0081] In other embodiments, referring to Figures 15 to 17 As shown, Fig.15 A diagram showing a connection structure between a metal component and a tuning component in an electronic device provided in another embodiment of the present application. Fig.16 for Fig.15 A cross-sectional view of Fig.17A cross-sectional view of the connection between a metal component and a tuning component in an electronic device provided in another embodiment of the present application. The tuning component 3 may also include a silver paste layer 35. The silver paste layer 35 may be provided with one or more layers as required. The silver paste layer 35 is usually made by multiple printing processes such as printing-drying-printing-drying. At this time, the welding area 3b of the tuning component 3 may be welded to the metal frame antenna component 1 and the metal component 2 by pad printing or spraying to achieve electrical connection between the tuning component 3 and the metal frame antenna component 1 and the metal component 2.

[0082] When the equivalent device area 3a is equivalent to an inductor, the silver paste layer of the equivalent device area 3a is set as a silver paste routing, and the corresponding shape of the silver paste routing can be formed by a customized shape press head, that is, the required routing shape is directly formed by the customized shape press head; or the corresponding shape of the silver paste routing can also be formed by laser engraving to carve out the redundant areas in the entire silver paste layer, that is, first form the entire metal layer, and then use laser engraving to carve out the unnecessary areas in the entire metal layer to form the required routing shape.

[0083] Reference Fig.18 As shown, Fig.18 A cross-sectional view of the connection between a metal component and a tuning component in an electronic device provided for another embodiment of the present application. When the equivalent device area 3a is equivalent to a capacitor, the tuning component 3 also includes a dielectric layer 36, and the silver paste layer 35 is provided with multiple layers, and a dielectric layer 36 is provided between each silver paste layer 35, so that each silver paste layer 35 and the dielectric sandwiched between each silver paste layer 35 form a capacitor, wherein the dielectric can be a dielectric with a substrate, and in actual application, the dielectric constant and thickness of the dielectric layer 36 can be adjusted according to the required capacitance value. In this embodiment, the tuning component 3 includes two layers of silver paste layers 35 and one layer of dielectric layer 36, wherein one layer of silver paste layer 35 is welded to the metal frame antenna component 1, and the other layer of silver paste layer 35 is welded to the metal component 2, and a dielectric layer 36 is provided between the two layers of silver paste layers 35, that is, there is no direct connection point between the two layers of silver paste layers 35 (no short circuit point is allowed).

[0084] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: Metal frame antenna components; A metal component, wherein there is a distance between the metal component and the metal frame antenna component; A tuning component, the tuning component comprising an equivalent device area and a plurality of welding areas, the plurality of welding areas are respectively located at two ends of the equivalent device area, the welding area located at one end of the equivalent device area is welded to the metal frame antenna component, and the welding area located at the other end of the equivalent device area is welded to the metal component; Wherein, the equivalent device area and the welding area are arranged integrally.

2. The electronic device according to claim 1, characterized in that: The welding area located at one end of the equivalent device area is also connected to the metal frame antenna component by bonding, and the welding area located at the other end of the equivalent device area is also connected to the metal component by bonding.

3. The electronic device according to claim 1, characterized in that: The equivalent device area and the welding area both include a metal layer and an anti-oxidation layer which are stacked, and the anti-oxidation layer is stacked on a side of the metal layer which is away from the metal frame antenna component and the metal component.

4. The electronic device according to claim 3, characterized in that: The equivalent device area and the welding area both further include a reinforcement layer, and the reinforcement layer is stacked on a side of the metal layer facing the metal frame antenna component and the metal component.

5. The electronic device according to claim 4, characterized in that: The welding area is provided with a welding position, at which the side of the metal layer facing the anti-oxidation layer can be exposed outside the anti-oxidation layer through the welding position, and the side of the metal layer facing the reinforcement layer can be exposed outside the reinforcement layer through the welding position.

6. The electronic device according to claim 5, characterized in that: There are a plurality of welding positions, and the plurality of welding positions are distributed at intervals along the length extension direction of the equivalent device region.

7. The electronic device according to claim 4, characterized in that: The reinforcing layer is connected to one side of the metal layer by bonding, and the anti-oxidation layer is connected to the other side of the metal layer by bonding.

8. The electronic device according to claim 4, characterized in that: The material of the anti-oxidation layer is polyester film or ink; or The material of the metal layer is copper foil, aluminum foil, silver foil or gold foil; or The reinforcing layer is made of polyimide, polyester film or glass fiber cloth.

9. The electronic device according to claim 1, characterized in that: The welding area is welded to the metal frame antenna component or the metal component by ultrasonic welding, spot welding or laser filling.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The equivalent device area can be equivalent to a capacitor or an inductor.

11. An electronic device, characterized in that: include: Metal frame antenna components; A metal component, wherein there is a distance between the metal component and the metal frame antenna component; A tuning component, the tuning component comprising an equivalent device area and a plurality of welding areas, the plurality of welding areas are respectively located at two ends of the equivalent device area, the welding area located at one end of the equivalent device area is welded to the metal frame antenna component, and the welding area located at the other end of the equivalent device area is welded to the metal component; Wherein, the tuning component includes a silver paste layer.

12. The electronic device according to claim 11, characterized in that: The welding area is welded to the metal frame antenna component and the metal component by pad printing or spraying.

13. The electronic device according to claim 11, characterized in that: The welding area located at one end of the equivalent device area is also connected to the metal frame antenna component by bonding, and the welding area located at the other end of the equivalent device area is also connected to the metal component by bonding.

14. The electronic device according to claim 11, characterized in that: The equivalent device area can be equivalent to a capacitor or an inductor.

15. The electronic device according to claim 14, characterized in that: When the equivalent device area is equivalent to an inductor, the silver paste layer in the equivalent device area is set as a silver paste routing.

16. The electronic device according to claim 15, characterized in that: The corresponding shape of the silver paste routing is formed by a customized shape press head, or the corresponding shape of the silver paste routing is formed by laser engraving to carve out redundant areas in the entire silver paste layer.

17. The electronic device according to claim 14, characterized in that: When the equivalent device region is equivalent to a capacitor, the tuning component further includes a dielectric layer, the silver paste layer is provided with multiple layers, and the dielectric layer is provided between each of the silver paste layers.

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