Shell for improving heat dissipation of electronic component and electronic equipment

Abstract

The embodiment of the invention provides a shell for improving heat dissipation of an electronic component and electronic equipment, and relates to the technical field of heat dissipation, the shell for improving heat dissipation of the electronic component comprises a shell body, and a plurality of electronic elements are contained in the shell body; the shell comprises a plurality of heat dissipation areas in one-to-one correspondence with the electronic elements and separation and heat insulation units, and the heat dissipation areas are separated by the separation and heat insulation units so as to reduce heat transfer among the heat dissipation areas. The separation and heat insulation units are used for effectively reducing heat transfer among the heat dissipation areas, so that the heat dissipation areas independently dissipate heat for the corresponding electronic elements, the heat among the electronic elements cannot be transferred mutually, the heat of the high-heating electronic element is effectively prevented from being transferred to the low-heating electronic element, and the heat dissipation efficiency is improved. And the heat dissipation problem of the low-heating electronic component is aggravated.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to a housing and electronic equipment for improving heat dissipation of electronic components. Background Art

[0002] In hardware devices that dissipate heat from electronic components through a structural casing, a single board is usually fixed inside the casing. The surface of the electronic components on the single board is coated with a thermally conductive material and is in direct contact with the inner surface of the casing. The casing is a thermally conductive metal material, so that the heat of the electronic components can be conducted into the air for dissipation, thereby achieving the purpose of dissipating heat from the electronic components.

[0003] In traditional designs, the shell is mostly an integrated molding design. The defect of this design method is that the heat generated by different electronic components will be mutually transferred through the shell, so that the heat of the high-temperature electronic components is superimposed on the relatively low-temperature electronic components, exacerbating the heat dissipation problem. Summary of the invention

[0004] The present invention provides a housing and an electronic device for improving heat dissipation of electronic components, so as to solve at least one technical problem in the above-mentioned background technology.

[0005] In a first aspect, the present invention provides a housing for improving the heat dissipation of electronic components, the housing for improving the heat dissipation of electronic components comprises a shell, wherein a plurality of electronic components are accommodated in the shell; the shell comprises a plurality of heat dissipation areas corresponding to each of the electronic components and a separation insulation unit, wherein the separation insulation unit separates the plurality of heat dissipation areas to reduce heat transfer between the heat dissipation areas.

[0006] A further technical solution is that the separation and insulation unit includes an insulation member arranged between each of the heat dissipation areas.

[0007] A further technical solution is that the thermal insulation member is a non-heat-conducting material filled between the heat dissipation areas.

[0008] A further technical solution is that an installation cavity is opened in the shell, and a plurality of electronic components are arranged in the installation cavity.

[0009] A further technical solution is that a PCB board is arranged in the installation cavity, and each of the electronic components is arranged on the PCB board.

[0010] A further technical solution is that the electronic components are arranged on the PCB board at intervals from each other.

[0011] A further technical solution is that a heat conducting unit is further provided in the shell, and the heat conducting unit is used to transfer the heat of the electronic component to the shell.

[0012] A further technical solution is that the heat conducting unit includes a plurality of heat conducting parts corresponding to each of the electronic components, and the heat conducting parts are respectively in contact with the electronic components and the heat dissipation areas corresponding to the electronic components, so as to transfer the heat generated by the electronic components to the heat dissipation areas corresponding to the electronic components.

[0013] A further technical solution is that the heat conducting member is a heat conducting material coated on the surface of the electronic component.

[0014] In a second aspect, the present invention provides an electronic device, comprising the housing for improving heat dissipation of electronic components as described in the first aspect.

[0015] The above technical solution provided by the embodiment of the present invention has the following advantages compared with the prior art:

[0016] In the technical solution of the embodiment of the present invention, the housing for improving the heat dissipation of electronic components includes a shell, wherein a plurality of electronic components are accommodated in the shell; the shell includes a plurality of heat dissipation areas corresponding to each of the electronic components and a separation and heat insulation unit, wherein the separation and heat insulation unit separates the plurality of heat dissipation areas to reduce the heat transfer between the heat dissipation areas. The separation and heat insulation unit is used to effectively reduce the heat transfer between the heat dissipation areas, so that each heat dissipation area independently dissipates the heat for the corresponding electronic component, so that the heat between the electronic components will not be transferred to each other, effectively avoiding the heat transfer of the high-heat electronic component to the low-heat electronic component, which leads to the aggravation of the heat dissipation problem of the low-heat electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0020] Figure 1 A schematic structural diagram of a housing for improving heat dissipation of electronic components provided by an embodiment of the present invention.

[0021] Description of reference numerals:

[0022] The housing 10 , the electronic component 20 , the heat dissipation area 30 , the heat insulating member 40 , the mounting inner cavity 50 , the PCB board 60 , and the heat conducting member 70 . DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] The disclosure below provides many different embodiments or examples to implement different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0025] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0026] In order to solve the technical problem in the prior art that heat transfer between electronic components is serious, heat from high-heat-generating electronic components is transferred to low-heat-generating electronic components, resulting in aggravated heat dissipation problem of low-heat-generating electronic components, the present invention provides a housing for improving heat dissipation of electronic components, which can effectively avoid heat transfer between electronic components and avoid heat transfer from high-heat-generating electronic components to low-heat-generating electronic components.

[0027] See also Figure 1 , an embodiment of the present invention provides a housing for improving heat dissipation of electronic components, the housing for improving heat dissipation of electronic components includes a housing 10, and the specific structure is described as follows:

[0028] The housing 10 contains a plurality of electronic components 20. It can be understood that the housing 10 is provided with an installation space for accommodating the electronic components 20. The electronic components 20 generate heat during operation.

[0029] In the embodiment of the present invention, the housing 10 includes a plurality of heat dissipation regions 30 corresponding to the electronic components 20 and a separation heat insulation unit. That is, each electronic component 20 is provided with a corresponding heat dissipation region 30 , and the heat dissipation region 30 is a part of the housing 10 .

[0030] Specifically, the separation and insulation unit separates the plurality of heat dissipation regions 30 to reduce the heat transfer between the heat dissipation regions 30. Further, the separation and insulation unit is used to effectively reduce the heat transfer between the heat dissipation regions 30, so that each heat dissipation region 30 independently dissipates heat for the corresponding electronic component 20, so that the heat between the electronic components 20 will not be transferred to each other, effectively avoiding the heat transfer of the high-heat electronic component 20 to the low-heat electronic component 20, which leads to the problem of aggravation of the heat dissipation problem of the low-heat electronic component 20.

[0031] In the technical solution of the embodiment of the present invention, the housing for improving the heat dissipation of electronic components includes a housing 10, wherein a plurality of electronic components 20 are accommodated in the housing 10; the housing 10 includes a plurality of heat dissipation areas 30 corresponding to each of the electronic components 20 and a separation and heat insulation unit, wherein the separation and heat insulation unit separates the plurality of heat dissipation areas 30 to reduce the heat transfer between the heat dissipation areas 30. The separation and heat insulation unit is used to effectively reduce the heat transfer between the heat dissipation areas 30, so that each heat dissipation area 30 independently dissipates heat for the corresponding electronic component 20, so that the heat between the electronic components 20 will not be transferred to each other, effectively avoiding the heat transfer of the high-heat electronic component 20 to the low-heat electronic component 20, which leads to the aggravation of the heat dissipation problem of the low-heat electronic component 20.

[0032] Furthermore, in an embodiment, such as this embodiment, the separation and insulation unit includes a thermal insulation member 40 disposed between each of the heat dissipation areas 30 .

[0033] Specifically, the heat insulating member 40 is a non-thermal conductive material filled between the heat dissipation areas 30. The non-thermal conductive material is a material with very poor thermal performance, which can effectively isolate heat transfer, thereby effectively reducing the heat transfer between the heat dissipation areas 30, so that each heat dissipation area 30 independently dissipates heat for the corresponding electronic component 20, and the heat between the electronic components 20 will not be transferred to each other. Those skilled in the art can select a suitable non-thermal conductive material according to the heat dissipation requirements, and the present invention is not specifically limited to this.

[0034] Furthermore, in one embodiment, such as the present embodiment, a mounting cavity 50 is defined in the housing 10 , and the plurality of electronic components 20 are disposed in the mounting cavity 50 .

[0035] Specifically, a PCB board 60 is disposed in the installation inner cavity 50, and each of the electronic components 20 is disposed on the PCB board 60. Each of the electronic components 20 is electrically connected to the PCB board 60. When the electronic components 20 are working, heat is generated.

[0036] Furthermore, the electronic components 20 are arranged at intervals on the PCB board 60. By arranging the electronic components 20 at intervals, heat transfer between the electronic components 20 can be effectively avoided, thereby effectively avoiding thermal influence between the electronic components 20.

[0037] Furthermore, a heat conduction unit is provided in the housing 10, and the heat conduction unit is used to transfer the heat of the electronic component 20 to the housing 10. The heat of the electronic component 20 is transferred to the housing 10 through the heat conduction unit, so that the housing 10 can reliably dissipate heat for the electronic component 20.

[0038] Specifically, the heat conduction unit includes a plurality of heat conduction members 70 corresponding to each of the electronic components 20 , and the heat conduction members 70 are respectively in contact with the electronic components 20 and the heat dissipation areas 30 corresponding to the electronic components 20 , and are used to transfer the heat generated by the electronic components 20 to the heat dissipation areas 30 corresponding to the electronic components 20 .

[0039] It can be seen that each electronic component 20 is configured with a heat conducting member 70 to transfer its heat to the corresponding heat dissipation area 30 , thereby effectively avoiding thermal interference between the electronic components 20 .

[0040] Furthermore, in some embodiments, such as the present embodiment, the heat conducting member 70 is a heat conducting material coated on the surface of the electronic component 20 .

[0041] The thermal conductive material is a material with good thermal conductivity, which can effectively transfer heat, thereby transferring the heat of the electronic component 20 to the corresponding heat dissipation area 30 to achieve reliable heat dissipation. Those skilled in the art can select a suitable thermal conductive material according to the heat dissipation requirements, and the present invention is not specifically limited to this. For example, the thermal conductive material can be thermal conductive silicone.

[0042] An embodiment of the present invention provides an electronic device, wherein the electronic device includes the housing for improving heat dissipation of electronic components provided by any of the above embodiments.

[0043] The electronic device may specifically be an SSD (solid state drive) and a handheld electronic device, etc., which is not specifically limited in the present invention.

[0044] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0050] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

[0051] The above is a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A housing for improving heat dissipation of electronic components, characterized in that: It comprises a shell, wherein a plurality of electronic components are accommodated in the shell; the shell comprises a plurality of heat dissipation areas corresponding to each of the electronic components and a separation and insulation unit, wherein the separation and insulation unit separates the plurality of heat dissipation areas to reduce heat transfer between the heat dissipation areas.

2. The housing for improving heat dissipation of electronic components according to claim 1, characterized in that: The separation and heat insulation unit includes a heat insulation member arranged between the heat dissipation areas.

3. The housing for improving heat dissipation of electronic components according to claim 2, characterized in that: The heat insulating member is a non-heat conductive material filled between the heat dissipation areas.

4. The housing for improving heat dissipation of electronic components according to claim 3, characterized in that: An installation cavity is provided in the shell, and a plurality of electronic components are arranged in the installation cavity.

5. The housing for improving heat dissipation of electronic components according to claim 4, characterized in that: A PCB board is arranged in the installation inner cavity, and each of the electronic components is arranged on the PCB board.

6. The housing for improving heat dissipation of electronic components according to claim 5, characterized in that: The electronic components are arranged on the PCB board at intervals.

7. The housing for improving heat dissipation of electronic components according to claim 6, characterized in that: A heat conduction unit is also provided in the shell, and the heat conduction unit is used to transfer the heat of the electronic component to the shell.

8. The housing for improving heat dissipation of electronic components according to claim 7, characterized in that: The heat conduction unit includes a plurality of heat conduction members corresponding to each of the electronic components. The heat conduction members are respectively in contact with the electronic components and the heat dissipation areas corresponding to the electronic components, and are used to transfer the heat generated by the electronic components to the heat dissipation areas corresponding to the electronic components.

9. The housing for improving heat dissipation of electronic components according to claim 8, characterized in that: The heat conducting member is a heat conducting material coated on the surface of the electronic component.

10. An electronic device, characterized in that: The electronic device comprises a housing for improving heat dissipation of electronic components as described in any one of claims 1 to 9.

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