Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a display module; the vapor chamber is located on the side, away from the display face, of the display module and connected with the display module, the vapor chamber is provided with functional holes, and the functional holes penetrate through the surfaces of the two sides of the vapor chamber; the edge transition structure is at least arranged at the connecting position of the hole wall surface of the functional hole and the surface of the side, facing the display module, of the vapor chamber. According to the display module, the problem that the display uniformity and the production yield of the display module in the prior art are difficult to consider at the same time is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of display equipment, and in particular to a display module and a display device. Background Art

[0002] For the spliced ​​display module, since it uses a small-sized MicroLED display module to achieve spliced ​​display, when working, the display module will generate heat due to the passage of current, which will cause the temperature of different light-emitting areas to be inconsistent. Therefore, the display module needs to reasonably set up a heat dissipation structure to avoid the situation where uneven heating affects the display uniformity. The display panel in the inventor's research process is equipped with a heat spreader in the display module to minimize the temperature difference at different positions through the heat spreader, reducing the risk of poor display effect due to excessive temperature difference.

[0003] However, in order to ensure the normal use of the display module, the heat spreader is usually provided with functional holes. The setting of the functional holes makes the heat spreader prone to burrs and sharp edges, which in turn causes the metal wires on the surface of the board bonded to the heat spreader in the display module to be scratched during the heat spreader pasting process, thereby affecting the production yield and even causing the interruption of signal transmission in severe cases.

[0004] That is to say, the display module in the prior art has the problem that it is difficult to take both display uniformity and production yield into consideration at the same time. Summary of the invention

[0005] The main purpose of the present invention is to provide a display module and a display device to solve the problem that display uniformity and production yield are difficult to be taken into account at the same time in the display module in the prior art.

[0006] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, there is provided a display module, comprising: a display module; a heat spreader, the heat spreader is located on the side of the display module away from the display surface and is connected to the display module, the heat spreader has a functional hole, and the functional hole penetrates to both side surfaces of the heat spreader; an edge transition structure, at least the edge transition structure is provided at the connection position between the hole wall surface of the functional hole and the side surface of the heat spreader facing the display module.

[0007] According to another aspect of the present invention, there is provided a display device, comprising a carrier board; the above-mentioned display module, wherein there are a plurality of display modules, and the plurality of display modules are arranged in an array on the carrier board.

[0008] By applying the technical solution of the present invention, the display module includes a display module, a heat spreader and an edge transition structure. By arranging the heat spreader on the side of the display module away from the display surface and connected to the display module, the heat spreader can disperse the heat, effectively avoid the situation where the temperature difference at different positions of the display module is large due to heat concentration, which is conducive to ensuring the temperature uniformity, and then ensuring the display uniformity of the display module. By opening a functional hole on the heat spreader, the functional hole can avoid the electrical connection position or the QR code area, thereby ensuring the display reliability. By arranging the edge transition structure at least at the connection position of the hole wall of the functional hole and the surface of one side of the heat spreader facing the display module, the edge transition structure can improve the burr and sharp edge problem at the connection position of the hole wall of the functional hole and the surface of one side of the heat spreader facing the display module, and realize the burr-free transition of the connection position, thereby avoiding the situation of scratching the display module in the attachment process, which is conducive to reducing the damage of the metal connection line on the surface of the display module, improving the working reliability of the display module, and improving the production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0010] Figure 1 A schematic structural diagram of a display module according to an optional embodiment of the present invention is shown;

[0011] Figure 2 Shows Figure 1 A side view of a vapor chamber in FIG.

[0012] Figure 3 A top view of a vapor chamber according to an alternative embodiment of the present invention is shown;

[0013] Figure 4 A side view of a vapor chamber according to another alternative embodiment of the present invention is shown;

[0014] Figure 5 A schematic structural diagram of a display module according to another optional embodiment of the present invention is shown;

[0015] Figure 6 A schematic structural diagram of a display module according to another optional embodiment of the present invention is shown;

[0016] Figure 7 A schematic structural diagram of a display module according to another optional embodiment of the present invention is shown;

[0017] Figure 8 A schematic structural diagram of a display module according to another optional embodiment of the present invention is shown;

[0018] Fig. 9 A schematic structural diagram of a display device according to an optional embodiment of the present invention is shown.

[0019] The above drawings include the following reference numerals:

[0020] 10. Display module; 11. Protection layer; 12. Metal wiring layer; 13. Display substrate; 14. BM layer; 15. Transparent ink layer; 16. Functional film layer; 17. Frame structure; 20. Heat spreader; 21. Functional hole; 22. Edge transition structure; 221. Chamfered surface; 222. Arc surface; 30. Coating layer; 40. Adhesive layer; 100. Display module; 200. Carrier board. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0023] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0024] The display panel studied by the inventors usually has a vapor chamber in the display module, so that the temperature difference at different positions can be minimized through the vapor chamber, thereby reducing the risk of poor display effect due to excessive temperature difference.

[0025] The inventors have found that the current vapor chambers are usually provided with functional holes to meet the needs of exposing the underlying structure or electrical connection. However, the setting of the functional holes makes it easy for the vapor chambers to have burrs and sharp edges, which in turn causes the surface metal wires of the display module to be scratched during the vapor chamber lamination process, thereby affecting the production yield and even causing interruption of signal transmission in severe cases.

[0026] In order to solve the problem in the prior art that it is difficult to take both display uniformity and production yield into consideration at the same time, the present invention provides a display module and a display device.

[0027] like Figure 1As shown, in one embodiment of the present application, the display module includes a display module 10, a heat spreader 20 and an edge transition structure 22. The heat spreader 20 is located on the side of the display module 10 away from the display surface and is connected to the display module 10. The heat spreader 20 has a functional hole 21, and the functional hole 21 penetrates to the two side surfaces of the heat spreader 20; at least the edge transition structure 22 is provided at the connection position between the hole wall of the functional hole 21 and the side surface of the heat spreader 20 facing the display module 10.

[0028] Optionally, the display module 10 can use MicroLED or MiniLED as the display unit. These tiny LEDs have the advantages of high brightness, high contrast, low power consumption and long life, and are suitable for high-definition splicing display devices. In order to achieve borderless splicing, each display unit needs to be precisely aligned and have good packaging technology to ensure the reliability and stability of the display unit.

[0029] Specifically, the display module 10 may include a protective layer 11, a metal wiring layer 12, a display substrate 13, a BM layer 14, a transparent ink layer 15 and a functional film layer 16. Figure 1 As shown in the figure, the display module 10 is composed of a protective layer 11, a metal wiring layer 12, a display substrate 13, a BM layer 14, a transparent ink layer 15 and a functional film layer 16 stacked in sequence in the direction away from the heat spreader 20. The functional film layer 16 can be a 3A film layer. A frame structure 17 is also provided on the outer peripheral side of the display module 10 to cover the outer peripheral side of the protective layer 11, the metal wiring layer 12, the display substrate 13, the BM layer 14, the transparent ink layer 15 and the functional film layer 16 to form a whole. In practical applications, the display module 10 can specifically be a MicroLED display module.

[0030] Optionally, the protective layer 11 may be a glue layer to prevent scratches and contamination during manufacturing, assembly and use, and also provide additional support and protection for the metal wiring layer 12. The selection of the material of the protective layer 11 needs to take into account the thermal conductivity and electrical insulation, and common materials include epoxy resin, polyimide, polyurethane, etc.

[0031] Optionally, the metal wiring layer 12 has an electrical connection structure and metal wiring on one side surface facing the protective layer 11 and on one side surface facing the display substrate 13 to achieve signal transmission and power transmission. The metal wiring layer 12 is usually made of a metal material with good electrical conductivity and welding properties, such as copper (Cu), silver (Ag), aluminum (Al) or gold (Au). Copper is the most commonly used material because it has good electrical conductivity, cost-effectiveness and processability. At the same time, in order to prevent oxidation and improve reliability, the surface of the metal wiring layer 12 may be surface treated with gold or nickel-palladium-gold (ENIG). The metal wiring layer 12 is usually designed into a complex circuit pattern, including signal lines, power lines, ground lines, and possible clock, data and control signal lines. These wirings need to be precisely laid out to ensure that each display unit can obtain accurate and stable signals. High-frequency transmission of signals, signal integrity, electromagnetic compatibility (EMC) and thermal management need to be taken into account when designing the wiring. The main function of the metal wiring layer 12 is to accurately distribute signals and power from the external control circuit to each display unit on the display module. The signals include data signals, clock signals and control signals, which are transmitted to the display unit through the metal wiring layer 12 to control the display state of the unit and realize the display of the image. The production of the metal wiring layer 12 needs to take into account the process compatibility with other structures of the display module. For example, the bonding process with the display substrate 13, the binding process with the flexible circuit board (FPC), and the processing during the splicing manufacturing process, such as cutting, cleaning and bonding.

[0032] Optionally, the display substrate 13 is specifically an Array Glass substrate. The Array Glass substrate is usually made of high-purity glass and has excellent flatness, thermal stability and good optical transparency. The high mechanical strength of the glass substrate enables it to withstand the weight of the display unit and the pressure in subsequent processes, such as bonding and cutting. On the Array Glass substrate, there may be one or more metal wiring layers for transmitting voltage and data signals to each display unit. These wiring layers are composed of various metals (such as copper, aluminum or gold) and are designed as complex circuit networks to ensure fast and accurate signal transmission. Pixel circuits, including transistors (TFTs), capacitors and resistors, are also integrated on the ArrayGlass substrate to control the brightness and color of each pixel. These circuits usually use low-temperature polycrystalline silicon (LTPS) or oxide TFT technology to achieve high-precision signal control. For non-luminous display technologies (such as LCD), there may also be a backlight management structure under the Array Glass substrate to ensure that light is evenly irradiated on the display unit to improve display quality. In order to optimize the display effect, optical structures such as polarizers, diffusers or brightness enhancement films may also be set on the Array Glass substrate to control the direction and intensity of light and improve contrast and color saturation. As the "skeleton" of the entire display module, the Array Glass substrate provides the necessary mechanical support and stability to ensure the long-term stable operation of the display unit and internal circuits in physical and chemical environments.

[0033] Optionally, the BM layer 14 is specifically a black matrix layer (Black Matrix layer). The main function of the BM layer is to block the gaps and non-luminous areas between pixels to prevent light leakage, thereby improving the contrast and clarity of the display. At the same time, it can also absorb ambient light, reduce reflections, and make the displayed image more vivid, especially when viewed in a bright environment, to enhance the user experience. The BM layer 14 is usually composed of two types of materials, one is a black organic material, such as black polymer ink (BlackInk), and the other is a metal material, such as chromium (Cr) or nickel (Ni). Black polymer ink is widely used because of its good light-shielding and printability, while metal materials are used in some high-end or special applications because of their higher light-shielding and durability. The structural design of the BM layer 14 needs to accurately match the layout and size of the display unit to form a light-shielding area corresponding to the pixel. In MicroLED or MiniLED displays, the BM layer 14 will be designed into a fine structure at the micron level to ensure the independence and display performance of each display unit. The BM layer also plays a protective and isolating role in the display module. It can prevent environmental factors such as moisture and oxygen from affecting the display unit and circuit, while forming physical isolation between display units to reduce cross-interference. Although the main function of the BM layer 14 is to block light, in some designs, it may also participate in thermal management, helping the display module to dissipate heat and reduce the impact of local overheating on display performance by selecting specific materials or structural designs. The BM layer 14 can integrate other functions, such as color filters (CFs) to improve color saturation, or be combined with 3A film materials (dust-proof, oil-proof, and fingerprint-proof) to enhance the surface protection and anti-fouling capabilities of the display module.

[0034] Optionally, the transparent ink layer 15 can be a transparent conductive ink layer, which is a key component for enhancing the display effect, realizing the touch function or optimizing the optical performance. Transparent conductive ink is usually composed of a transparent conductive material and an adhesive, wherein the transparent conductive material is such as ITO (indium tin oxide), IZO (indium zinc oxide), graphene or metal nanowires, etc., which can provide good conductivity while maintaining high transparency. The adhesive is used to firmly fix the transparent conductive material on the substrate while ensuring the stability of the material under various environmental conditions (such as temperature changes, humidity). The transparent ink layer 15 can be used as part of the touch sensor to form a touch electrode through a patterned design. When the user touches the screen, the touch electrode can detect the contact position and realize the touch operation. The transparent ink layer 15 can be used to improve the optical performance of the display module, such as increasing the transmittance of light, reducing reflection, and enhancing color contrast or saturation. This is usually achieved by adding specific optical elements to the ink. In order to adapt to different display technologies (such as MicroLED, MiniLED, OLED, etc.), the structure and thickness of the transparent ink layer 15 can also be adjusted as needed to achieve optimal display performance and touch response. The transparent ink layer 15 can be made by inkjet printing, which can form a patterned ink layer on the substrate with high precision and low material consumption. The transparent ink layer 15 needs to be compatible with other components of the display module, such as the BM layer 14 and the display substrate 13, to ensure that it does not interfere with signal transmission or optical performance. For a display module with integrated touch function, the transparent ink layer 15 can also be integrated with the touch control circuit to ensure accurate transmission of touch signals.

[0035] Optionally, the functional film layer 16 can be a 3A film layer, which is called Anti-Dust, Anti-Oil, and Anti-Fingerprint film layer, which is a composite thin film coating specially designed to protect the surface of electronic equipment, especially the surface of the display screen. This film layer is treated by a series of physical and chemical methods to make the surface dust-proof, oil-proof and anti-fingerprint, thereby keeping the screen clean and clear and improving the user experience. The 3A film layer usually uses nanotechnology or special coating materials, such as hydrophobic and oleophobic nanomaterials, silica gel or polymers, which can form a microstructured surface to effectively prevent the adhesion of dust, oil stains and fingerprints. In addition to these basic protective functions, the 3A film layer may also have certain scratch-resistant, impact-resistant and UV-resistant properties to further enhance the durability of the screen. During the manufacturing process, the 3A film layer is usually coated on the outermost layer of the display panel / display module, or between the touch screen and the display panel / display module to ensure its protective effect.

[0036] Optionally, in addition to being a 3A film layer (dustproof, oil-proof, and anti-fingerprint), the functional film layer 16 can also be a variety of other types of film layers to meet specific performance requirements and application requirements. The functional film layer 16 can also be an anti-reflection film (AR film) to reduce the reflection on the surface of the display module, improve readability and viewing experience, especially in high-brightness environments. The anti-reflection film can be achieved by coating multiple layers of materials with different refractive indices to minimize the reflection of light. In addition, the functional film layer 16 can also be an anti-reflection film to increase the light transmittance, which is used to increase display brightness and reduce energy consumption. The anti-reflection film is usually designed as a multi-layer structure, and the thickness and refractive index of each layer are accurately calculated to match the light of a specific wavelength to achieve the maximum light transmission effect. In addition, the functional film layer 16 can also be a hardcoat to increase the hardness of the display module surface, prevent scratches and wear, and protect the underlying material. The hardcoat is usually made of acrylic, polyurethane or silicon-based materials and has good transparency and mechanical strength. In addition, the functional film layer 16 can also be an anti-glare film (AG film) to reduce specular reflection and glare and increase the visual comfort of the image. The anti-glare film scatters light and reduces direct reflection by forming microstructures on the surface, such as micron-level concave and convex.

[0037] In addition, the functional film layer 16 can also be an anti-blue light film to reduce the radiation of harmful blue light and protect the user's eyesight. The anti-blue light film usually contains special materials that can absorb or reflect blue light, such as a polymer film doped with specific nanoparticles. In addition, the functional film layer 16 can also be a touch layer (Touch Layer) to realize the touch function, which can be a resistive, capacitive or infrared touch layer integrated on the surface or inside of the display module. The touch layer is composed of conductive materials and insulating materials, and can detect and locate the touch input of the user's finger. In addition, the functional film layer 16 can also be an optical compensation film (OCF) to improve the polarization characteristics, compensate for the color distortion under the viewing angle, and improve the display quality. The OCF film usually contains special optical materials, such as anisotropic liquid crystal polymers, which can adjust the polarization state of light. In addition, the functional film layer 16 can also be an antistatic film (ESD Protection Layer). In sensitive electronic devices, the antistatic film can prevent electrostatic discharge from damaging the display unit and circuits, and disperse the static charge by adding conductive materials in the film layer. In addition, the functional film layer 16 can also be an isolation film. In some display technologies (such as OLED), the isolation film is used to prevent water vapor and oxygen from entering, protect the display unit from environmental factors, and extend the service life. The selection and design of the functional film layer 16 should be based on the specific application environment, performance requirements and cost considerations of the display module. Through precise material selection and process optimization, the functional film layer can significantly improve the performance and user experience of the display module, while protecting it from the adverse effects of the external environment.

[0038] Specifically, the heat spreader is usually made of materials with good thermal conductivity, such as copper, aluminum, copper alloy, graphite or graphene. Among them, copper and aluminum are widely used due to their high thermal conductivity and good processability, while graphite and graphene are particularly important in lightweight devices due to their lightness and high thermal conductivity. The heat spreader may contain one or more layers, the center layer of which is usually a material with high thermal conductivity, while the outer layer may have an anti-oxidation and anti-wear coating. In some cases, the heat spreader may also contain tiny heat pipes or capillary structures to increase the thermal conductivity area and improve the heat transfer efficiency. Good heat diffusion capability means that the heat spreader can effectively reduce the temperature of local hot spots and improve thermal balance, which is crucial to maintaining the display quality and extending the service life of MicroLED or MiniLED displays.

[0039] In a specific embodiment of the present application, the heat spreader 20 is located on the side of the display module 10 away from the display surface, and the heat spreader 20 is connected to the protective layer 11 of the display module 10. Optionally, the heat spreader 20 can also be set close to the surface of the side of the display substrate 13 away from the BM layer, or the heat spreader 20 can also be set close to the surface of the metal wiring layer 12 away from the display substrate 13. The purpose of this design is to absorb heat directly from the heat source and quickly disperse it to the entire surface of the heat spreader 20, and then discharge the heat through the heat dissipation surface of the heat spreader 20 or the combined heat sink, heat pipe and other structures to avoid heat concentration in local areas and cause excessive temperatures. In splicing display technology, the role of the heat spreader 20 is more critical because it needs to handle complex heat sources composed of multiple display units while ensuring the beauty and compactness of borderless splicing. The design of the heat spreader 20 needs to take into account the thermal coupling between different display units and the uneven distribution of heat sources, and adopt appropriate thermal conduction paths and structural optimization to ensure the thermal balance of the entire display module.

[0040] Specifically, the edge transition structure 22 can be a chamfered surface formed by chamfering the sharp edge of the heat spreader 20, or a circular arc surface formed by rounding. The edge transition structure 22 can first improve the sharpness of the edge of the heat spreader 20 by chamfering or rounding. Chamfering or rounding can not only remove possible burrs, but also smooth the edges and reduce potential damage to metal traces during the bonding process. The angle and width of the chamfer or fillet or the fillet need to be carefully designed to balance heat conduction efficiency and mechanical safety.

[0041] Optionally, an edge transition structure 22 is provided at the connection position between the hole wall of the functional hole 21 and the side surface of the vapor chamber 20 facing the display module 10. In addition, at least one of the edge region of the side surface of the vapor chamber 20 facing the display module 10, the connection position between the hole wall of the functional hole 21 and the side surface of the vapor chamber 20 away from the display module 10, and the edge region of the side surface of the vapor chamber 20 away from the display module 10 is provided with an edge transition structure 22. The edge region of the side surface of the vapor chamber 20 facing the display module 10 and the edge region of the side surface of the vapor chamber 20 away from the display module 10 specifically refer to the outermost edge of the surface. By providing the edge transition structure 22 at the edge region of the side surface of the vapor chamber 20 facing the display module 10, the sharp corners and burrs of the edge region of the side surface of the vapor chamber 20 facing the display module 10 can be eliminated, thereby avoiding the risk of the sharp corners and burrs scratching the display module 10. By providing an edge transition structure 22 at the connection position between the hole wall surface of the functional hole 21 and the surface of the side of the vapor chamber 20 facing away from the display module 10, it is possible to prevent the sharp corners and burrs at the connection position from scratching or damaging the carrier board. Similarly, the edge transition structure 22 of the edge area of ​​the side surface of the vapor chamber 20 facing away from the display module 10 is also to prevent the sharp corners and burrs at the edge from scratching or damaging the carrier board.

[0042] In summary, by setting the heat spreader 20 to be located on the side of the display module 10 away from the display surface and connected to the display module 10, the heat spreader 20 can play a role in dispersing heat, which can effectively avoid the situation where the temperature difference at different positions of the display module 10 is large due to heat concentration, which is conducive to ensuring temperature uniformity, and then ensuring the display uniformity of the display module 10. By opening the functional hole 21 on the heat spreader 20, the functional hole 21 can avoid the electrical connection position or the QR code area to ensure display reliability. By setting at least the edge transition structure 22 at the connection position between the hole wall of the functional hole 21 and the surface of one side of the heat spreader 20 facing the display module 10, the edge transition structure 22 can improve the burrs and sharp edges at the connection position between the hole wall of the functional hole 21 and the surface of one side of the heat spreader 20 facing the display module 10, and realize the burr-free transition of the connection position, thereby reducing the damage to the metal connection with the surface of the display module 10, improving the working reliability of the display module, and helping to improve the production yield. The core principle of this description is to improve the physical properties of the connection position between the hole wall of the functional hole 21 and the surface of the heat sink 20 facing the display module 10 to reduce potential damage to the surface metal connection, thereby improving the working reliability and production yield of the display module.

[0043] Specifically, its working principle can be broken down into the following key points:

[0044] Removing burrs and sharp edges: During the processing, whether it is laser cutting, mechanical stamping or chemical etching, burrs or sharp edges may be generated at the edge where the wall of the functional hole 21 contacts the heat spreader 20. These burrs and sharp edges can easily damage the surface metal connections on the display module 10 in subsequent assembly processes, such as when the heat spreader is attached, causing problems such as short circuits, signal distortion or complete failure. By chamfering or rounding the edges or coating them, these burrs and sharp edges can be effectively removed or covered to avoid direct physical damage to the metal connections.

[0045] Smooth transition: The edge transition structure 22 is smoothed to form a burr-free smooth transition between the functional hole 21 and the heat spreader 20, which can significantly reduce the friction and pressure of the edge on the metal connection during the bonding or assembly process. The smooth transition reduces the concentration of mechanical stress and avoids excessive wear or cutting of the metal connection at the edge area, thereby protecting the integrity and functionality of the metal connection.

[0046] Reducing potential failure points: By eliminating burrs and sharp edges, smoothing transition edges, and enhancing the protection and compatibility of edge areas, the edge transition structure 22 reduces potential failure points during the production process and use, and reduces the metal connection failure rate caused by edge damage, thereby improving the overall operating reliability and production yield of the display module.

[0047] In summary, the principle of the edge transition structure 22 is to achieve a burr-free, smooth and protective transition by improving the physical properties of the contact edge between the vapor chamber and the display module, thereby protecting the surface metal connection of the display module from damage without sacrificing the heat dissipation performance of the vapor chamber, and ultimately achieving the purpose of improving the working reliability and production efficiency of the display module. This design and processing method is based on the inventor's in-depth understanding of material science, micro-machining technology and display technology, as well as the prevention and control of potential problems in the production process.

[0048] Combination Figure 1 and Figure 2 As shown, the connection position between the hole wall of the functional hole 21 and the surface of the side of the vapor chamber 20 facing the display module 10, the edge area of ​​the surface of the side of the vapor chamber 20 facing the display module 10, the connection position between the hole wall of the functional hole 21 and the surface of the side of the vapor chamber 20 away from the display module 10, and the edge area of ​​the surface of the side of the vapor chamber 20 away from the display module 10 are all provided with an edge transition structure 22, and the edge transition structure 22 is a chamfered structure. The chamfered structure is a chamfered surface 221 formed by chamfering, that is, the edge transition structure 22 is actually a chamfered surface 221, which is equivalent to the inclined surface formed by cutting off the sharp corners of the edges of the two side surfaces of the vapor chamber 20 and the edges of the two ends of the functional hole 21.

[0049] like Figure 2 As shown, Figure 2 Shows Figure 1 Schematic diagram of the structure of the heat spreader 20 in FIG. The chamfered surface 221 is set at an obtuse angle or an acute angle with one side surface of the heat spreader 20, and both side surfaces of the heat spreader 20 are planes and are set in parallel. The chamfered surface 221 is an inclined surface and is set at an obtuse angle or an acute angle with any side surface of the heat spreader 20. Preferably, the angle between the chamfered surface 221 and one side surface of the heat spreader 20 is greater than or equal to 40° and less than or equal to 50°. Figure 2 The angle between the chamfered surface 221 and the surface of the heat spreader 20 is 45°, but in other optional embodiments of the present application, the angle between the chamfered surface 221 and the surface of the heat spreader 20 is not limited to 45° and can be set according to actual conditions.

[0050] like Figure 3 As shown, Figure 3 A top view of a heat spreader 20 of an optional embodiment of the present application is shown, wherein the cross-sectional area of ​​the functional hole 21 along the direction parallel to the heat spreader 20 is always equal from the side close to the display module 10 to the side away from the display module 10. The cross-sectional shape of the functional hole 21 along the direction parallel to the heat spreader 20 includes one of a rectangle and a square, which can be set according to actual needs. The number of functional holes 21 on a heat spreader 20 can be set to one or more, and the present application does not limit the number of functional holes 21 on the heat spreader 20. The sizes of the functional holes 21 on a heat spreader 20 can also be set in a variety of ways. The functional hole 21 can specifically be a hole opened to expose a QR code, or a hole opened to expose a circuit board or an electrical connection position.

[0051] Of course, the edge transition structure 22 may not be configured as a chamfered structure. Figure 4In another embodiment shown, the edge transition structure 22 is an arc structure, and the connection position between the hole wall of the functional hole 21 and the surface of the side of the vapor chamber 20 facing the display module 10, the edge area of ​​the surface of the side of the vapor chamber 20 facing the display module 10, the connection position between the hole wall of the functional hole 21 and the surface of the side of the vapor chamber 20 away from the display module 10, and the edge area of ​​the surface of the side of the vapor chamber 20 away from the display module 10 are all provided with an arc structure, and the arc structure is specifically an arc surface 222. The arc surface 222 is equivalent to the arc surface 222 formed by rounding the sharp corner of the vapor chamber 20, which is the surface of the vapor chamber 20 itself, and is not a separately provided structure. By setting the edge transition structure 22 to an arc structure, the sharp corners and burrs on the edges of the two sides of the heat spreader 20 and the two ends of the functional hole 21 can also be eliminated, so that the heat spreader 20 will not scratch or damage the metal connection wires of the display module 10 during the process of attaching the heat spreader 20 to the display module 10; at the same time, when the heat spreader 20 is attached to the carrier board, the metal connection wires on the carrier board will not be damaged, and the stability of the structure connected to the two sides of the heat spreader 20 is ensured, thereby ensuring the stability of signal transmission and the consistency of display effects. In addition, the arc structure can also provide better mechanical strength, reduce potential damage during production, assembly and transportation, and further improve the reliability and manufacturing yield of the product.

[0052] Specifically, the ratio of the height of the edge transition structure 22 in the thickness direction of the heat spreader 20 to the thickness of the heat spreader 20 is greater than 0 and less than or equal to 0.5. By rationally planning the size of the edge transition structure 22, the stress in the edge area when the heat spreader 20 is attached to the display module 10 or the carrier can be effectively dispersed to avoid edge damage or crack formation caused by excessive stress concentration. This is because the introduction of the arc structure or chamfered structure makes the contact surface smoother, reducing the impact and friction when the sharp edge contacts sensitive parts such as metal wires. The appropriate height of the edge transition structure 22 contributes to the uniform distribution of heat energy. If the size of the edge transition structure 22 is too large, it may affect the overall conduction efficiency of heat energy from the MicroLED light-emitting area to the heat spreader 20; if it is too small, it may not be enough to eliminate burrs and sharp angles, and there is still a risk of damage. The upper limit of 0.5 is based on the balance between maintaining good thermal conductivity and sufficient edge protection.

[0053] In addition, the edge transition structure 22 has an appropriate height and can also enhance the mechanical strength of the heat spreader 20, especially when subjected to external forces, such as extrusion or collision during assembly, and can better resist deformation and damage. This not only improves the durability of the heat spreader 20 itself, but also indirectly improves the stability of the entire display module. At the same time, it is conducive to the optimization of the bonding process, reduces the difficulty of alignment and adjustment during bonding, and also reduces defects such as bubbles and gaps caused by improper bonding, ensuring good thermal and electrical contact between the heat spreader 20 and the display module 10 or the carrier. In summary, controlling the ratio of the height of the edge transition structure 22 to the thickness of the heat spreader 20 within a range greater than 0 and less than or equal to 0.5 is an optimal choice after comprehensive consideration of multiple factors such as thermal management, mechanical properties, process adaptability and cost control, aiming to achieve high-quality and high-efficiency production of borderless spliced ​​displays.

[0054] exist Figure 5 In the specific embodiment shown, the display module also includes a coating layer 30, and at least the edge transition structure 22 is covered with the coating layer 30. That is to say, the annular edge transition structure 22 located at both ends of the functional hole 21 and the annular edge transition structure 22 located at the outer edges of both sides of the heat spreader 20 are covered with a coating layer 30, and the edge transition structure 22 is completely covered by the coating layer 30. The coating layer 30 needs to have good mechanical protection, and can prevent external physical impact and scratches from damaging the edge transition structure 22 and the display module 10, especially during daily use and transportation of the device. It should also have good sealing properties, and can isolate moisture, dust and other pollutants in the air, and prevent these impurities from entering the interior of the display module and affecting its performance and life. The coating layer 30 needs to maintain the stability of physical and chemical properties in a wide temperature range, and not deform or fail due to thermal expansion or contraction, so as to ensure the durability of its protection and sealing functions. At the position where the coating layer 30 contacts the metal wires, it needs to have electrical insulation to prevent short circuits or signal interference between the metal wires and ensure the normal operation of the display module.

[0055] Optionally, the coating layer 30 may be a polymer material, such as polyimide (PI), polyethylene terephthalate (PET), acrylic acid or silicone, etc. These materials not only have good thermal stability, but are also easy to process into thin films to provide the required mechanical protection and electrical insulation. The coating layer 30 can also be a thermally conductive material. In areas where thermal conductivity needs to be enhanced, the coating layer 30 may contain thermally conductive glue, graphene, copper powder-filled polymers, etc. These materials can improve the efficiency of thermal conduction and help the heat of the heat spreader 20 to quickly diffuse. The coating layer 30 can also integrate special functional materials such as anti-static, waterproof or oil-proof to adapt to specific application environments or enhance the protection capabilities of the display module.

[0056] Optionally, the coating layer 30 is attached to the edge of the heat spreader 20: the coating layer 30 is tightly attached to the peripheral edge area of ​​the heat spreader 20, including the location of the edge transition structure 22, and the edges of possible functional holes 21 and other open structures, forming a burr-free, smooth and sealed surface. Optionally, the coating layer 30 can also extend to the upper and lower surfaces of the heat spreader 20 to form a continuous protective and sealing layer to ensure the edge protection performance of the entire display module. In some designs, the coating layer 30 may be composed of multiple layers of thin films of different materials, and each layer of material is selected according to its position and functional requirements to achieve the best overall performance. Through a carefully designed coating layer 30, the overall protection, sealing and heat dissipation performance of the display module can be significantly improved, and the failure rate caused by external environmental factors and improper internal thermal management can be reduced, thereby extending the service life of the equipment, improving user experience and production yield. The material and structure of the coating layer need to be optimized according to the specific needs and application environment of the display module to ensure that it can perform best under various conditions.

[0057] like Figure 5 As shown, specifically, the hole wall surface of the functional hole 21 is covered with a coating layer 30, and the upper and lower sides of the coating layer 30 extend to the two side surfaces of the heat spreader 20 respectively, so as to cover the annular edge transition structure 22 at both ends of the functional hole 21; the outer peripheral side surface of the heat spreader 20 is covered with a coating layer 30, and the upper and lower sides of the coating layer 30 extend to the two side surfaces of the heat spreader 20 respectively, so as to cover the edge transition structure of the outermost edge of the upper and lower surfaces of the heat spreader 20. In this embodiment, the coating layer 30 is a glue layer, and the glue layer is formed by coating. By providing the coating layer 30, the edge of the heat spreader 20 and the edge of the functional hole 21 can be further protected to prevent the risk of the wiring being cut due to the edge being too sharp.

[0058] Furthermore, the setting of the coating layer 30 further enhances the protective function of the edge transition structure 22 of the heat spreader 20, which can not only prevent the burrs of the heat spreader 20 from scratching the metal connecting wires of the display module, but also protect the edges from the influence of the external environment, such as preventing the intrusion of dust, moisture, etc., to maintain the long-term stability and reliability of the display module. By setting the coating layer 30 as a glue layer, the glue layer can be used as an auxiliary medium for heat conduction, so that the heat energy is more evenly transferred from the heat spreader 20 to the coating layer 30, and then further evenly distributed to the entire display module through the coating layer 30, thereby improving the thermal management efficiency and maintaining the consistency of the display effect. The coating layer 30 can enhance the mechanical strength of the edge of the heat spreader 20 and reduce the risk of deformation or damage when subjected to external forces during production, assembly and transportation. The coverage of the coating layer 30 helps to improve the surface quality of the display module, making the overall appearance smoother and flatter, reducing the tiny bumps that may be caused by improper edge treatment of the heat spreader 20, thereby improving the aesthetics and user perception of the display module.

[0059] At the same time, the edge transition structure 22 is completely covered by the coating layer 30, which can simplify the edge processing steps in the manufacturing process, avoid additional deburring, polishing and other processes, and reduce production costs and process complexity. In some designs, the coating layer 30 may also play an electrical insulation role to prevent the metal part of the heat spreader 20 from accidentally contacting other metal connecting wires of the display module, avoiding the occurrence of electrical faults such as short circuits.

[0060] Specifically, the display module also includes an adhesive layer 40, and the display module 10 is bonded to the surface of the heat spreader 20 facing the display module 10 through the adhesive layer 40. The adhesive layer 40 is a key part in the display module, especially in MicroLED and MiniLED technology, to ensure that the heat spreader 20 is closely connected to the display module 10 or other components and to achieve efficient heat conduction. It not only affects the thermal management performance, but also plays an important role in the overall integration, reliability and service life of the display module 10. The adhesive layer 40 needs to have high thermal conductivity, can effectively transfer heat, ensure the thermal conduction efficiency between the heat spreader 20 and the display panel or the metal wiring layer, reduce thermal resistance, and improve heat dissipation performance. The adhesive layer 40 has excellent adhesion to the surfaces of different materials, whether it is metal, glass or polymer, it can ensure a long-lasting and stable bonding effect, and avoid component separation caused by vibration, temperature changes and other reasons during use. In applications close to the metal wiring layer, the adhesive layer 40 needs to have good electrical insulation to prevent short circuits or signal interference, and ensure the electrical safety of the display module and the accuracy of signal transmission. The adhesive layer 40 needs to have high chemical stability, be able to resist aging, corrosion and oxidation during long-term use, and maintain its thermal conductivity and bonding properties. At the connection between components, the adhesive layer 40 can also provide a certain shock absorption and stress buffering effect, reduce the mechanical stress caused by external impact or thermal expansion and contraction, and protect the structural integrity of the display module.

[0061] Optionally, the adhesive layer 40 can be specifically a heat-conducting adhesive, which is the most common type of material in the adhesive layer 40, including silver glue, silicone grease, heat-conducting epoxy resin, etc., which have high thermal conductivity while maintaining good adhesion. The adhesive layer 40 can also be a silicone polymer, which is often used for bonding and sealing display modules due to its excellent thermal stability, chemical stability and elasticity, especially in occasions where good stress buffering is required. The adhesive layer 40 can also be an acrylic glue, which has good transparency and weather resistance, and is suitable for display module designs that require visual transparency and long-term stability, while being able to provide sufficient thermal conductivity and adhesion effects. The adhesive layer 40 can also be a liquid cooling glue. In some high-performance display modules, liquid cooling glue may be used as the adhesive layer 40 to achieve more efficient heat conduction and cooling effects, but it must be ensured to have good sealing and electrical insulation.

[0062] exist Figure 6 and Figure 7In the specific embodiment shown, the adhesive layer 40 is a double-sided adhesive layer and a whole layer structure, and the viscosity of the two side surfaces of the adhesive layer 40 can be the same or different. A whole layer of double-sided adhesive structure provides uniform bonding force, ensures the close connection between the heat spreader 20 and the display module 10, avoids local poor bonding, and improves the stability and reliability of the overall structure. As a heat conduction medium, the uniform distribution of the adhesive layer 40 helps to achieve efficient and uniform transfer of heat energy, optimizes thermal management, and ensures the uniformity and stability of the display effect. Using a whole layer of double-sided adhesive for bonding simplifies the pasting process, reduces the difficulty of alignment, reduces bubbles and residual stress, and improves production efficiency and product yield. The double-sided adhesive layer also has certain electrical insulation properties, prevents electrical short circuits between the display module 10 and the heat spreader 20, and ensures the safe operation of the display module. At the same time, the setting of the adhesive layer 40 increases the mechanical strength of the display module, improves the impact resistance and vibration resistance, and extends the service life of the product.

[0063] exist Figure 6 In the specific embodiment shown, the projection area of ​​the adhesive layer 40 on the display module 10 is smaller than the surface area of ​​the side of the heat spreader 20 facing the display module 10, and the projection of the adhesive layer 40 on the heat spreader 20 is in the surface of the side of the heat spreader 20 facing the display module 10. It should be noted here that the surface area of ​​the side of the heat spreader 20 facing the display module 10 does not include the area of ​​the functional hole 21, but only the surface area of ​​the heat spreader 20. And the projection of the adhesive layer 40 on the display module 10 and the projection of the edge transition structure 22 on the display module 10 are arranged at intervals, that is, the adhesive layer 40 avoids the edge transition structure 22. Here, the edge transition structure 22 includes the edge transition structure 22 located at the outermost edge of the heat spreader 20 and the edge transition structure 22 at the end of the functional hole 21. That is to say, the edge of the adhesive layer 40 of this embodiment is somewhat retracted from the edge of the heat spreader 20, and the edge of the adhesive layer 40 is somewhat retracted from the edge of the functional hole 21. This design not only ensures the structural integrity and thermal management performance of the display module, but also provides additional mechanical protection, making it suitable for a variety of display devices that require high performance and high reliability.

[0064] exist Figure 7In the specific embodiment shown, the projection area of ​​the adhesive layer 40 on the display module 10 is larger than the surface area of ​​the side of the vapor chamber 20 facing the display module 10, and the projection of the vapor chamber 20 on the adhesive layer 40 is in the adhesive layer 40. And the projection of the edge transition structure 22 on the display module 10 is in the projection of the adhesive layer 40 on the display module 10. That is, the projection of the adhesive layer 40 on the vapor chamber 20 covers the edge transition structure 22 at the end of the functional hole 21, and also covers the edge transition structure 22 at the outer edge of the vapor chamber 20. At least a portion of the adhesive layer 40 extends toward the functional hole 21, so that the peripheral portion of the end of the functional hole 21 facing the display module 10 is covered by the adhesive layer 40, and at least another portion of the adhesive layer 40 extends outward, and the length of the outward extension exceeds the peripheral edge of the vapor chamber 20. That is, the edge of the adhesive layer 40 of the embodiment has a certain outward expansion from the edge of the vapor chamber 20, and the edge of the adhesive layer 40 has a certain outward expansion from the edge of the functional hole 21. This design not only ensures the structural integrity and thermal management performance of the display module, but also provides additional mechanical protection, making it suitable for a variety of display devices that require high performance and high reliability. Figure 7 In order to clearly show the structure of the adhesive layer 40, the coating layer is not drawn, but there is actually a coating layer, and the coating layer is set at the same position as Figure 6 The same embodiment can be referred to Figure 6 as shown in .

[0065] exist Figure 8 In the specific embodiment shown, the adhesive layer 40 of the display module is Figure 6 and Figure 7 The difference between the embodiments shown is that the adhesive layer 40 is different. In the present embodiment, the adhesive layer 40 is a liquid adhesive layer and is a whole layer structure. The connection position between the hole wall of the functional hole 21 and the surface of the side of the heat spreader 20 facing the display module 10 and the edge position of the surface of the side of the heat spreader 20 facing the display module 10 are all covered by the adhesive layer 40, and the projection of the edge transition structure 22 on the display module 10 is in the projection of the adhesive layer 40 on the display module 10. In other words, the surface of the side of the heat spreader 20 facing the display module 10 is completely covered by the adhesive layer 40, and the annular edge transition structure 22 at one end of the functional hole 21 facing the display module 10 is also completely covered by the adhesive layer 40, and the edge transition structure 22 of a circle of the edge of the surface of the side of the heat spreader 20 facing the display module 10 is also completely covered by the adhesive layer 40. This arrangement not only realizes a stable sealing connection between the display module 10 and the vapor chamber 20, but also further protects the edge transition structure 22 of the vapor chamber 20 facing the display module 10, further enhancing the protective function of the edge transition structure 22 of the vapor chamber 20, and further preventing the vapor chamber 20 from scratching the back of the display module 10. Figure 8 In order to clearly show the structure of the adhesive layer 40, the coating layer is not drawn, but there is actually a coating layer, and the location of the coating layer is similar to that of the adhesive layer 40. Figure 6 The same embodiment can be referred to Figure 6 as shown in .

[0066] like Fig. 9 As shown, the present application also provides a display device, which includes a carrier board 200 and the above-mentioned display module 100, and the display module 100 is multiple, and the multiple display modules 100 are arranged in an array on the carrier board 200. Although only two display modules 100 are shown in the figure, the present application does not limit the number of display modules 100, and the specific number can be set according to actual conditions. Such a setting can realize splicing display, ensure the precise alignment and seamless splicing between the display modules, improve the splicing accuracy of the overall display device, make the picture smoother, without obvious splicing marks, and enhance the visual experience. Combined with the design of the heat spreader 20, multiple display modules 100 are connected together through the carrier board 200, which is more conducive to the uniform distribution and rapid dissipation of the overall heat energy, avoid local overheating affecting the display effect, and protect the circuit from heat damage, thereby extending the service life of the device. The use of the carrier board 200 provides a stable support structure for multiple display modules 100, enhances the mechanical strength of the entire display device, improves the ability to resist external shock and vibration, and is suitable for use in various environments and conditions. By adjusting the number and array layout of the display modules 100, display devices of different sizes and shapes can be flexibly designed to meet diverse market demands and application scenarios, such as large spliced ​​screens, curved display screens, etc. The metal connecting wires on the carrier board 200 can efficiently and stably transmit signals to each display module 100, reducing signal attenuation and interference and ensuring display quality.

[0067] Optionally, the carrier 200 is the basic platform constituting the display module. It not only carries the various components of the display module, but also has a key impact on display performance, component layout, signal transmission and thermal management. In advanced display technologies such as MicroLED and MiniLED, the design and material selection of the carrier 200 are particularly critical.

[0068] Optionally, the carrier 200 is made of one or more materials, such as glass (such as Array Glass), metal (such as copper, aluminum), various polymer materials (such as PI, PET), ceramics or composite materials. Choosing different material substrates will directly affect the weight, cost, thermal management capabilities, etc. of the display module. The carrier 200 of a modern display device may include a multi-layer structure, each layer having a specific function, such as a signal transmission layer, an insulation layer, a heat dissipation layer, a protective layer, etc. This allows the realization of highly integrated and complex functions while optimizing the performance of the display module. The carrier provides the necessary mechanical support to ensure the structural stability of the display assembly during processing, assembly and use. For borderless splicing technology, the strength and dimensional stability of the carrier 200 are particularly important to support and align each display module. The thermal conductivity of the carrier 200 directly affects the thermal management of the display module. In MicroLED and MiniLED, the carrier 200 may have a built-in heat pipe, a heat sink, or an externally bonded heat spreader to quickly disperse the heat generated by the display unit, prevent local overheating, and ensure display quality. The metal wiring layer (fanout area) inside or on the surface of the carrier 200 is responsible for the transmission of signals, such as power, data signals, and control signals. The layout, materials, and processes of these lines are directly related to the response speed and image quality of the display module. The carrier 200 needs to have good insulation properties to avoid short circuits between different signal lines. At the same time, it also needs to have a certain degree of protection to prevent the intrusion of moisture and external impurities to maintain the long-term reliability of the display module. For display technologies that require transparency (such as transparent MicroLED), the material of the carrier needs to have good optical transparency to ensure that light can pass through unimpeded without affecting the display effect.

[0069] Optionally, the carrier 200 may specifically be a glass substrate Array Glass. Glass substrate is one of the most common carrier materials. It is particularly suitable for MicroLED and MiniLED display technologies due to its high stability, good thermal conductivity, mechanical strength and optical transparency. The carrier 200 may also be a polymer substrate. Polymer materials such as polyimide (PI) and polyethylene terephthalate (PET) are used in flexible display devices due to their light weight, flexibility and good insulation to achieve curved or foldable display effects. The carrier 200 may also be a metal substrate. Metal substrates such as copper and aluminum are used in high-performance or high-heat-load display devices due to their high thermal conductivity to improve heat dissipation efficiency. The carrier 200 may also be a ceramic substrate. In some applications that require extremely high thermal conductivity and dimensional stability, such as high-performance server display applications, ceramic carriers are selected due to their excellent thermal conductivity and chemical stability.

[0070] In summary, the carrier board 200 of the display device is a component that integrates structural support, thermal management, signal transmission and protection functions. Its design and material selection need to comprehensively consider the characteristics of display technology, application requirements, cost control and manufacturability to ensure the high performance and high reliability of the display device under various conditions. With the continuous advancement of display technology, the design of the carrier board is also constantly innovating to meet the display requirements of higher brightness, higher resolution and more complex functions.

[0071] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0072] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0073] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A display module, characterized in that: include: Display module; A vapor chamber, the vapor chamber is located on a side of the display module away from the display surface and connected to the display module, the vapor chamber has functional holes, and the functional holes penetrate to both side surfaces of the vapor chamber; The edge transition structure is provided at least at the connection position between the hole wall surface of the functional hole and the surface of the heat spreader facing the display module.

2. The display module according to claim 1, characterized in that: The edge transition structure is provided in at least one of an edge area of ​​a side surface of the heat spreader facing the display module, a connection position between a hole wall of the functional hole and a side surface of the heat spreader facing away from the display module, and an edge area of ​​a side surface of the heat spreader facing away from the display module.

3. The display module according to claim 1, characterized in that: The edge transition structure includes one of an arc structure and a chamfer structure.

4. The display module according to claim 1, characterized in that: A ratio of a height of the edge transition structure in a thickness direction of the vapor chamber to a thickness of the vapor chamber is greater than 0 and less than or equal to 0.

5.

5. The display module according to claim 1, characterized in that: The edge transition structure is a chamfered structure, and the chamfered structure includes a chamfered surface, and the chamfered surface is arranged at an obtuse angle or an acute angle with a side surface of the heat spreader.

6. The display module according to claim 5, characterized in that: The included angle between the chamfered surface and a side surface of the heat spreader is greater than or equal to 40° and less than or equal to 50°.

7. The display module according to claim 1, characterized in that: The display module further comprises a coating layer, and at least the edge transition structure is covered with the coating layer.

8. The display module according to claim 7, characterized in that: The hole wall of the functional hole is covered with the coating layer, and both sides of the coating layer extend to both side surfaces of the vapor chamber respectively; and / or, The outer peripheral side surface of the vapor chamber is covered with the coating layer, and two sides of the coating layer extend to two side surfaces of the vapor chamber respectively.

9. The display module according to claim 7, characterized in that: The coating layer is a glue layer.

10. The display module according to claim 1, characterized in that: The display module further includes an adhesive layer, and the display module is bonded to the heat spreader via the adhesive layer.

11. The display module according to claim 10, characterized in that: The adhesive layer is a double-sided adhesive layer or a liquid adhesive layer.

12. The display module according to claim 10, characterized in that: The projection area of ​​the adhesive layer on the display module is smaller than the surface area of ​​the heat spreader facing the display module, and the projection of the adhesive layer on the display module is spaced apart from the projection of the edge transition structure on the display module; or, The projection area of ​​the adhesive layer on the display module is larger than the surface area of ​​the heat spreader facing the display module, and the projection of the edge transition structure on the display module is within the projection of the adhesive layer on the display module; or, The connection position between the hole wall of the functional hole and the surface of one side of the heat spreader facing the display module and the edge position of the surface of one side of the heat spreader facing the display module are covered by the adhesive layer, and the projection of the edge transition structure on the display module is within the projection of the adhesive layer on the display module.

13. The display module according to any one of claims 1 to 12, characterized in that: The display module includes a protective layer, a metal wiring layer, a display substrate, a BM layer, a transparent ink layer and a functional film layer which are stacked in sequence along a direction away from the heat spreader.

14. A display device, characterized in that: include Carrier board; The display module according to any one of claims 1 to 13, wherein there are multiple display modules, and the multiple display modules are arranged in an array on the carrier board.

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