LED packaging support and integrated packaging device

Abstract

The invention relates to the technical field of LEDs, and particularly discloses an LED packaging support and an integrated packaging device, and the LED packaging support comprises a plurality of matrix units. The bonding wire bonding pads are arranged on the two sides of the die bonding pad; the two adjacent matrix units are connected through the metal connecting ribs, and at least one part of the bonding wire bonding pad is connected with the die bonding pad through the metal connecting ribs; the plastic package body is filled in a gap between the solid crystal bonding pad and the bonding wire bonding pad and covers the metal connecting rib, the plastic package body located between the solid crystal bonding pad and the bonding wire bonding pad forms a separation column, and the separation column is connected with the solid crystal bonding pad and the bonding wire bonding pad; and the plastic package body is filled in a gap between two adjacent matrix units. According to the invention, the die bonding pads are separated from the bonding wire pads, so that each LED chip is electrically independent, and the thermoelectric separation of the device is realized at the same time.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to an LED packaging bracket and an integrated packaging device. Background Art

[0002] At present, the application of interactive screens is developing rapidly. One screen usually requires more LED particles, the PCB mounting time is long, and mounting errors are prone to occur; limited by the size of the LED package, the pitch design of the interactive screen PCB is also relatively limited; with the development of lighting technology, it has become a development trend to pixelate LED light sources and realize intelligent matrix lighting. At present, multi-pixel integrated devices are mostly packaged using ceramic substrates, and the integrated packaging of multi-pixel LEDs is realized by designing a multi-layer structure of EMC brackets. However, although this packaging method has advantages in structural arrangement and heat dissipation, it is relatively expensive. In addition, this packaging method cannot achieve the electrical independence of each LED chip and the thermal and electrical separation of the device. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an LED packaging bracket and an integrated packaging device, which have the advantages of separating the die bonding pad from the wire bonding pad so that each LED chip is electrically independent and thermal and electrical separation of the device is achieved.

[0004] The above technical objectives of the present invention are achieved through the following technical solutions:

[0005] An LED package bracket includes a plurality of matrix units, wherein the matrix units include:

[0006] Die bonding pad;

[0007] Wire bonding pads, the wire bonding pads are arranged on both sides of the die bonding pad;

[0008] Metal connecting ribs, two adjacent matrix units are connected by the metal connecting ribs, and at least a portion of the wire bonding pads are connected to the die-bonding pads by the metal connecting ribs;

[0009] A plastic encapsulation body, the plastic encapsulation body fills the gap between the die-bonding pad and the wire bonding pad and covers the metal rib, the plastic encapsulation body located between the die-bonding pad and the wire bonding pad forms a separation column, the separation column is connected to the die-bonding pad and the wire bonding pad; the plastic encapsulation body fills the gap between two adjacent matrix units.

[0010] Compared with the prior art, the LED packaging bracket in the present application includes multiple matrix units, and the LED packaging bracket is designed in a matrix form, which provides a basis for the subsequent multi-pixel LED chip integrated packaging, and helps to improve the packaging efficiency and heat dissipation performance while reducing costs.

[0011] As a preferred solution of the present invention, the height of the upper surface of the separation column is higher than the height of the upper surface of the wire bonding pad and the height of the upper surface of the die bonding pad.

[0012] By adopting the above solution, the upper surface height of the separation column is higher than the wire bonding pad and the die bonding pad, which helps to improve the stability and reliability of the packaging structure and prevent short circuit between the wire bonding pad and the die bonding pad.

[0013] As a preferred solution of the present invention, the spacer column is arranged to cover at least a portion of the die-bonding pad, and the spacer column is arranged to cover at least a portion of the wire bonding pad.

[0014] With the above solution, the separation column covers a portion of the die bonding pad and the wire bonding pad, which helps to improve the overall strength and stability of the packaging structure and is also beneficial for heat dissipation.

[0015] As a preferred solution of the present invention, the structure of the wire bonding pad is a square or rectangular three-dimensional structure.

[0016] With the above solution, the shape of the wire bonding pad is designed to be square or rectangular, which helps to optimize current distribution and improve welding quality and electrical performance.

[0017] As a preferred solution of the present invention, the width of the wire bonding pad is greater than or equal to the width of the metal rib.

[0018] By adopting the above solution, the width of the wire bonding pad is greater than or equal to the width of the metal connecting rib, which helps to improve the current transmission efficiency and reduce the resistance loss.

[0019] As a preferred solution of the present invention, the structure of the die-bonding pad is a square or rectangular three-dimensional structure.

[0020] With the above solution, the shape of the die-bonding pad is designed to be square or rectangular, which helps to optimize the fixation and heat dissipation of the LED chip and improve the packaging quality.

[0021] As a preferred solution of the present invention, the thickness of the die-bonding pad is the same as the thickness of the wire bonding pad.

[0022] With the above solution, the thickness of the die bonding pad and the wire bonding pad are the same, which helps to simplify the production process and reduce costs while maintaining good electrical connection performance.

[0023] As a preferred solution of the present invention, the width of the die-bonding pad is greater than twice the width of the wire-bonding pad, and the area of ​​the die-bonding pad is greater than the area of ​​the wire-bonding pad.

[0024] With the above solution, the width and area of ​​the die-bonding pad are larger than those of the wire-bonding pad, which helps to improve the heat dissipation efficiency of the LED chip and extend its service life.

[0025] As a preferred embodiment of the present invention, the material of the wire bonding pad, the die bonding pad and the metal connecting rib is one or more of Cu, Ni, Pd, Ag and Au.

[0026] Adopting the above scheme, using materials such as Cu, Ni, Pd, Ag, Au as materials for wire bonding pads, die bonding pads and metal connecting ribs helps to improve conductivity and corrosion resistance and extend the service life of the packaged device.

[0027] The present invention also includes an integrated packaging device, including the above-mentioned LED packaging bracket, a plurality of LED chips, metal connecting wires and a packaging glue layer, wherein the LED chip is arranged on the die-bonding pad, the LED chip is connected to the wire bonding pad via a metal connecting wire, the overall connection mode of the LED chip is series connection, parallel connection or multiple series and multiple parallel connection, the LED chip can independently control the power through the wire bonding pad, and can also be lit together through the wire bonding pad; the height of the plastic sealing body filled between two adjacent matrix units is greater than the height of the metal connecting wire; the packaging glue The LED chip, the metal connecting wire and the wire bonding pad are covered with a layer, and the entire bowl bracket is filled. After filling, the upper surface of the encapsulation glue layer is flush with the upper surface of the plastic package body; the bottom wall of the LED package bracket is provided with a dividing groove, the position of the dividing groove corresponds to the metal connecting rib between the die-bonding pad and the wire bonding pad, the depth of the dividing groove is greater than the thickness of the metal connecting rib and less than the height of the dividing column, so that the die-bonding pad and the wire bonding pad in the same matrix unit are separated by the dividing groove, and the width of the dividing groove is less than the width of the metal connecting rib;

[0028] Wherein, the LED chip is a front mounted chip or a vertical chip.

[0029] Compared with the prior art, the above-mentioned integrated packaging device efficiently integrates multiple LED chips through an LED packaging bracket, which not only improves production efficiency and heat dissipation performance, but also reduces manufacturing costs; the packaging structure supports independent or common lighting of LED chips and adapts to different electrical connection requirements. At the same time, the filling of the packaging glue layer protects the internal components and ensures the integrity and reliability of the package; and through the setting of the dividing groove, the solid crystal pad and the wire bonding pad in each matrix unit are not connected to each other, and the solid crystal pad and the wire bonding pad in each matrix unit are separated separately, which can effectively realize the electrical independence of the LED chip and isolate its positive and negative poles to prevent short circuit; it is suitable for both upright and vertical chips, effectively improving adaptability and flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of an LED packaging bracket and an integrated packaging device in the present invention;

[0031] Figure 2 for Figure 1 Sectional view at AA in the middle;

[0032] Figure 3 for Figure 1 Sectional view at the middle BB;

[0033] Figure 4 This is a schematic structural diagram of an LED packaging bracket and an integrated packaging device in another embodiment of the present invention;

[0034] Figure 5 for Figure 4 Sectional view at AA in the middle;

[0035] Figure 6 for Figure 4 Sectional view at the middle BB;

[0036] In the figure: 1. Matrix unit; 2. Die bonding pad; 3. Wire bonding pad; 4. Metal ribs; 5. Plastic package; 6. Spacer column; 7. LED chip; 8. Metal connecting wire; 9. Packaging glue layer; 10. LED packaging bracket; 11. Cutting groove.

[0037] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0040] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0041] Example 1

[0042] Reference Figures 1 to 6 In one embodiment of the present invention, an LED package bracket 10 is provided for an integrated package device. The LED package bracket 10 includes a plurality of matrix units 1. The matrix unit 1 includes a die bonding pad 2, a wire bonding pad 3, a metal connecting rib 4 and an EMC plastic package 5. In this embodiment, the number of the wire bonding pads 3 in a single matrix unit 1 is four, which are respectively distributed on both sides of the die bonding pad 2, with two wire bonding pads 3 on each side; two adjacent matrix units 1 are connected by a metal connecting rib 4. Specifically, the metal connecting rib The two ends of 4 are respectively connected to one of the wire bonding pads 3 in two adjacent matrix units 1, and at least two wire bonding pads 3 located on the same side are connected to the die bonding pad 2 through the metal connecting rib 4; the EMC plastic encapsulation body 5 fills the gap between the die bonding pad 2 and the wire bonding pad 3, and covers the metal connecting rib 4, and the EMC plastic encapsulation body 5 located between the die bonding pad 2 and the wire bonding pad 3 forms a separation column 6, and the separation column 6 is connected to the die bonding pad 2 and the wire bonding pad 3; the EMC plastic encapsulation body 5 fills the gap between two adjacent matrix units 1. By arranging a plurality of matrix units 1 on the EMC plastic encapsulation body 5, the LED package bracket 10 is designed in a matrix, which provides a basis for the subsequent multi-pixel LED chip integrated packaging, and helps to improve the packaging efficiency and heat dissipation performance, while reducing the cost.

[0043] In the present embodiment, the height of the upper surface of the partition column 6 is higher than the height of the upper surface of the wire bonding pad 3 and the height of the upper surface of the crystal bonding pad 2, and the partition column 6 covers at least a portion of the crystal bonding pad 2, and the partition column 6 covers at least a portion of the wire bonding pad 3; the structure of the wire bonding pad 3 and the structure of the crystal bonding pad 2 are both square or rectangular three-dimensional structures, and the thickness of the wire bonding pad 3 is the same as the thickness of the crystal bonding pad 2, the width of the crystal bonding pad 2 is greater than twice the width of the wire bonding pad 3, and the area of ​​the crystal bonding pad 2 is greater than the area of ​​the wire bonding pad 3. Specifically, the structure of the wire bonding pad 3 is a square three-dimensional structure, and the structure of the crystal bonding pad 2 is a square three-dimensional structure; the width of the wire bonding pad 3 is greater than or equal to the width of the metal rib 4. In the present embodiment, the width of the wire bonding pad 3 is equal to the width of the metal rib 4.

[0044] In this embodiment, the materials of the wire bonding pad 3, the die bonding pad 2 and the metal rib 4 are one or more of Cu, Ni, Pd, Ag and Au.

[0045] Example 2

[0046] like Figures 1 to 3 As shown, the present invention also includes an integrated packaging device, including an LED packaging bracket 10 as in Example 1, the integrated packaging device also includes a plurality of LED chips 7, metal connecting wires 8 and a packaging adhesive layer 9. In order to better illustrate this embodiment, the LED packaging bracket 10 has 8 matrix units 1, which are arranged in a 2*4 matrix and include eight pixel points. The number of corresponding LED chips 7 is 8. The welding wire pads 3 of 1 in the same matrix unit are all connected to the solid crystal pads 2 through metal connecting ribs 4, but the welding wire pads 3 are not connected to each other. It is worth noting that the height of the plastic sealing body 5 filled between two adjacent matrix units 1 in the LED packaging bracket 10 should be greater than the height of the metal connecting wire 8, and the height of the partition column 6 should be less than the height of the metal connecting wire 8 In each matrix unit 1, an LED chip 7 is fixed at the center of the die bonding pad 2. The LED chip 7 is a positive chip and is connected to the wire bonding pad 3 in the same matrix unit 1 through a metal connecting wire 8. Specifically, the LED chips 7 in the three matrix units 1 on the lower left side of the LED package bracket 10 are connected to the left wire bonding pad 3 in the same matrix unit 1 through two metal connecting wires 8. The LED chip 7 in the uppermost matrix unit 1 on the left side is connected to the lower left wire bonding pad 3 in the same matrix unit 1 through one metal connecting wire 8, and the other metal connecting wire 8 is connected to the upper right wire bonding pad 3 in the same matrix unit 1. The connection mode of the metal connecting wire 8 of the LED chip 7 in the right matrix unit 1 is mirror-opposite to the LED chip 7 in the left matrix unit 1. The overall connection mode of the above-mentioned LED chips 7 is eight-crystal series connection. The LED chips 7 can be independently controlled to light up through the wire bonding pad 3, or they can be lit up together.

[0047] The encapsulation adhesive layer 9 covers the LED chip 7, the die bonding pad 2, the metal connection wire 8 and the wire bonding pad 3, and fills the entire bowl, and the upper surface of the filled encapsulation adhesive layer 9 is flush with the upper surface of the EMC plastic package 5. The encapsulation adhesive layer 9 can be a transparent adhesive layer or a light conversion layer with fluorescent powder.

[0048] After the packaging process is completed, the bottom wall of the LED packaging bracket 10 is cut, and the cutting position corresponds to the metal rib 4 between the solid crystal pad 2 and the wire bonding pad 3. After cutting, an inwardly recessed dividing groove 11 is formed at the corresponding position. The depth of the dividing groove 11 formed by cutting should be controlled to be greater than the thickness of the metal rib 4 but less than the height of the partition column 6, so as to achieve the cutting of the metal rib 4 between the solid crystal pad 2 and the wire bonding pad 3 but not the partition column, so that the solid crystal pad 2 and the wire bonding pad 3 in the same matrix unit 1 are separated by the dividing groove 11, so that the positive and negative poles in the same matrix unit 1 are separated to realize the electrical independence of the LED chip and avoid short circuit; secondly, the width of the dividing groove 11 formed by cutting should be smaller than the width of the metal rib 4 to avoid damage to the solid crystal pad 2 or the wire bonding pad 3 during cutting.

[0049] Example 3

[0050] like Figures 4 to 6As shown, the present invention also includes an integrated packaging device, including an LED packaging bracket 10 as in Example 1, the integrated packaging device also includes a plurality of LED chips 7, metal connecting wires 8 and a packaging adhesive layer 9. In order to better illustrate this embodiment, the LED packaging bracket 10 has 8 matrix units 1, which are arranged in a 2*4 matrix and include eight pixel points. The number of corresponding LED chips 7 is 8. In the four matrix units 1 located on the left side of the LED packaging bracket 10, the two welding wire pads 3 located on the right side of the solid crystal pad 2 are connected to the solid crystal pad 2 through the metal connecting rib 4; in the four matrix units 1 located on the right side of the LED packaging bracket 10, the two welding wire pads 3 located on the left side of the solid crystal pad 2 are connected to the solid crystal pad 2 through the metal connecting rib 4. It is worth noting that the LED packaging bracket 10 is filled with two corresponding The height of the plastic encapsulation body 5 between adjacent matrix units 1 should be greater than the height of the metal connection wire 8, and the height of the partition column 6 should be less than the height of the metal connection wire 8. An LED chip 7 is fixed in the center of the die-bonding pad 2 in each matrix unit 1. The LED chip 7 is a vertical chip, which is connected to the wire bonding pad 3 in the same matrix unit 1 through the metal connection wire 8. Specifically, the LED chips 7 in the three matrix units 1 on the lower left side of the LED package bracket 10 are connected to the upper left wire bonding pad 3 of the same matrix unit 1 through a metal connection wire 8, and the LED chip 7 in the uppermost matrix unit 1 on the left side is connected to the upper right wire bonding pad 3 in the same matrix unit 1 through a metal connection wire 8; the LED chip 7 in the right matrix unit 1 is connected to the lower right wire bonding pad 3 in the same matrix unit 1 through a metal connection wire 8. The overall connection mode of the above-mentioned LED chips 7 is eight-crystal series connection. The LED chips 7 can be independently controlled to light up through the wire bonding pad 3, or they can be lit up together.

[0051] The encapsulation adhesive layer 9 covers the LED chip 7, the die bonding pad 2, the metal connection wire 8 and the wire bonding pad 3, and fills the entire bowl, and the upper surface of the filled encapsulation adhesive layer 9 is flush with the upper surface of the EMC plastic package 5. The encapsulation adhesive layer 9 can be a transparent adhesive layer or a light conversion layer with fluorescent powder.

[0052] After the packaging process is completed, the bottom wall of the LED packaging bracket 10 is cut, and the cutting position corresponds to the metal rib 4 between the solid crystal pad 2 and the wire bonding pad 3. After cutting, an inwardly recessed dividing groove 11 is formed at the corresponding position. The depth of the dividing groove 11 formed by cutting should be controlled to be greater than the thickness of the metal rib 4 but less than the height of the partition column 6, so as to achieve the cutting of the metal rib 4 between the solid crystal pad 2 and the wire bonding pad 3 but not the partition column, so that the solid crystal pad 2 and the wire bonding pad 3 in the same matrix unit 1 are separated by the dividing groove 11, so that the positive and negative poles in the same matrix unit 1 are separated to realize the electrical independence of the LED chip and avoid short circuit; secondly, the width of the dividing groove 11 formed by cutting should be smaller than the width of the metal rib 4 to avoid damage to the solid crystal pad 2 or the wire bonding pad 3 during cutting. The structure of the above embodiments designs an EMC bracket and designs it in a matrix to realize the packaging of multiple LED chips 7 of the EMC bracket. Different LED chips 7 can be independently controlled according to lighting requirements, and by cutting the transverse metal ribs 4, each LED chip 7 of the multi-pixel integrated packaging device is electrically independent. At the same time, the solid crystal pad 2 is separated from the wire bonding pad 3 to realize the thermal and electrical separation of the device. The manufacturing process is simple, and the EMC bracket can be manufactured by a practical etching process. At the same time, the packaging can be realized by a practical existing cutting process, and the device structure after packaging is simple.

[0053] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An LED package bracket, comprising a plurality of matrix units, characterized in that: The matrix unit comprises: Die bonding pad; Wire bonding pads, the wire bonding pads are arranged on both sides of the die bonding pad; Metal connecting ribs, two adjacent matrix units are connected by the metal connecting ribs, and at least a portion of the wire bonding pads are connected to the die-bonding pads by the metal connecting ribs; A plastic encapsulation body, the plastic encapsulation body fills the gap between the die-bonding pad and the wire bonding pad and covers the metal rib, the plastic encapsulation body located between the die-bonding pad and the wire bonding pad forms a separation column, the separation column is connected to the die-bonding pad and the wire bonding pad; the plastic encapsulation body fills the gap between two adjacent matrix units.

2. The LED package bracket according to claim 1, characterized in that: The height of the upper surface of the separation column is higher than the height of the upper surface of the wire bonding pad and the height of the upper surface of the die bonding pad.

3. The LED package bracket according to claim 1, characterized in that: The spacer column is disposed to cover at least a portion of the die-bonding pad, and the spacer column is disposed to cover at least a portion of the wire bonding pad.

4. The LED package bracket according to claim 1, characterized in that: The structure of the wire bonding pad is a square or rectangular three-dimensional structure.

5. The LED package bracket according to claim 1, characterized in that: The width of the wire bonding pad is greater than or equal to the width of the metal rib.

6. The LED package bracket according to claim 1, characterized in that: The structure of the die-bonding pad is a square or rectangular three-dimensional structure.

7. The LED package bracket according to claim 1, characterized in that: The thickness of the die-bonding pad is the same as the thickness of the wire-bonding pad.

8. The LED package bracket according to claim 1, characterized in that: The width of the die-bonding pad is greater than twice the width of the wire-bonding pad, and the area of ​​the die-bonding pad is greater than the area of ​​the wire-bonding pad.

9. The LED package bracket according to claim 1, characterized in that: The materials of the wire bonding pad, the die bonding pad and the metal connecting rib are one or more of Cu, Ni, Pd, Ag and Au.

10. An integrated packaging device, characterized in that: The LED package bracket comprises the LED chip as claimed in any one of claims 1 to 9, a plurality of LED chips, metal connecting wires and a packaging adhesive layer, wherein the LED chip is arranged on the die-bonding pad, the LED chip is connected to the wire bonding pad through a metal connecting wire, the overall connection mode of the LED chip is series connection, parallel connection or multiple series and multiple parallel connection, and the LED chips are independently controlled to light up or light up together through the wire bonding pad; the height of the plastic sealing body filled between two adjacent matrix units is greater than the height of the metal connecting wire; the packaging adhesive layer covers the LED chip, the metal connecting wire and the wire bonding pad, and fills the entire bowl bracket, and after filling, the upper surface of the packaging adhesive layer is flush with the upper surface of the plastic sealing body; the bottom wall of the LED package bracket is provided with a dividing groove, the position of the dividing groove corresponds to the metal connecting rib between the die-bonding pad and the wire bonding pad, the depth of the dividing groove is greater than the thickness of the metal connecting rib and less than the height of the dividing column, so that the die-bonding pad and the wire bonding pad in the same matrix unit are separated by the dividing groove, and the width of the dividing groove is less than the width of the metal connecting rib; Wherein, the LED chip is a front mounted chip or a vertical chip.

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