LED packaging device and packaging method

Abstract

The LED packaging device comprises a support, a chip, a first packaging adhesive layer, a second packaging adhesive layer and a light blocking layer, a groove is formed in the upper end of the support, the chip is located in the groove, the upper end of the chip protrudes out of the upper portion of the groove, the chip is covered with the first packaging adhesive layer, the gap between the chip and the groove can be filled with the bottom of the first packaging adhesive layer, and the second packaging adhesive layer is located in the groove. The outer surface of the first packaging adhesive layer is an arc-shaped convex surface, and KSF fluorescent powder is contained in the first packaging adhesive layer; the bottom surface of the second packaging adhesive layer is tightly connected with the outer surface of the first packaging adhesive layer and the upper surface of the bracket, and the top surface of the second packaging adhesive layer is horizontally arranged; the light blocking layer is cylindrical and covers the second packaging adhesive layer. According to the scheme, the method for manufacturing the LED packaging device is used for manufacturing the LED packaging device, the light emitting angles of the LED device in all directions are consistent, the adhesive layer is not prone to being stripped from the support, and the KSF powder is not prone to making contact with moisture in air to cause blackening.

Description

Technical Field

[0001] The invention belongs to the technical field of LED packaging, and in particular relates to an LED packaging device and a packaging method. Background Art

[0002] At present, four-sided LEDs mostly use a multi-layer adhesive packaging structure, and common four-sided LED products using a multi-layer adhesive packaging structure usually face the following problems:

[0003] (1) The adhesive layer is easily peeled off from the stent;

[0004] (2) KSF powder used in fluorescent powder is easily exposed to moisture in the air and turns black;

[0005] (3) The light angle is inconsistent.

[0006] Therefore, a new technology is needed to solve the problems in the prior art that the adhesive layer of the light-emitting LED device is easy to peel off, the KSF powder is easy to blacken, and the light output angle is inconsistent. Summary of the invention

[0007] In order to solve the above problems in the prior art, the present invention provides an LED packaging device and a packaging method. The adhesive layer is cylindrical in shape, which can achieve consistent light output angles on all four sides of the LED device. The adhesive layer is not easy to peel off from the bracket, and the KSF powder is not easy to come into contact with moisture in the air and cause blackening.

[0008] The present invention adopts the following technical solutions:

[0009] An LED packaging device, comprising a bracket, a chip, a first packaging glue layer, a second packaging glue layer and a light blocking layer, wherein the upper end of the bracket is provided with a groove, the chip is located in the groove and the upper end is convexly arranged in the groove, the first packaging glue layer covers the outside of the chip and can fill the gap between the chip and the groove, the outer surface of the first packaging glue layer is spherical, and the first packaging glue layer contains KSF phosphor;

[0010] The side surface of the second packaging adhesive layer is a cylindrical side surface, the bottom surface is tightly connected to the outer surface of the first packaging adhesive layer and the upper surface of the bracket, and the top surface is horizontally arranged;

[0011] The light blocking layer is cylindrical and covers the second packaging glue layer.

[0012] As a further improvement of the technical solution of the present invention, the bracket includes an etching sheet and a plastic package body, the etching sheet includes a base, a first boss is protruded upward at the center of the base, an insulating groove is opened on the first boss and the groove is located on the upper end surface thereof;

[0013] The plastic package body comprises a filling portion, the filling portion is not filled in the insulating groove and the upper surface is flush with the first boss;

[0014] The plastic package body further includes a main body portion, the main body portion covers the base and surrounds the outer side of the first boss, and the upper end surface of the main body portion is flush with the upper end surface of the first boss;

[0015] The plastic package body further comprises a positioning convex portion, which is located above the main body and has a ring-shaped horizontal cross section, and the inner side surface of the positioning convex portion forms the inner wall of the groove;

[0016] The upper end surface of the first boss is used to form a portion of the bottom of the groove.

[0017] As a further improvement of the technical solution of the present invention, the main body is provided with an upwardly opening annular groove, which surrounds the outer side of the positioning protrusion in the horizontal direction, and the bottom part of the second packaging glue layer is filled in the annular groove.

[0018] As a further improvement of the technical solution of the present invention, the etching sheet includes a first metal plate and a second metal plate arranged at an interval, the gap between the first metal plate and the second metal plate forms an insulating groove, and the filling part is filled between the first metal plate and the second metal plate;

[0019] The first metal plate includes a first plate and a second plate connected to each other in an L shape, the second metal plate includes a third plate and a fourth plate connected to each other, the first plate and the third plate are both vertically arranged and jointly form the first boss, and the upper end surfaces both form a part of the bottom of the groove, the insulating groove is located between the first plate and the third plate, and the second plate and the fourth plate form the base and are both horizontally arranged;

[0020] The main body covers the upper surfaces of the second plate and the fourth plate.

[0021] As a further improvement of the technical solution of the present invention, the connection structure between the positioning protrusion and the main body is stepped on the side close to the first boss, and the upper end surface of the main body forms a stepped surface and is used to form a part of the bottom of the groove;

[0022] The outer side surface vertically arranged on the positioning protrusion is connected to the inner wall of the annular groove.

[0023] As a further improvement of the technical solution of the present invention, the annular groove has a first side wall and a second side wall relative to each other. The first side wall and the second side wall are both inclined and inclined from bottom to top in a direction away from each other. The first side wall is connected to the outer side surface vertically arranged on the positioning protrusion.

[0024] As a further improvement of the technical solution of the present invention, two metal pads are further provided in the groove, which are respectively arranged at intervals with the chip. The two metal pads are respectively located on opposite sides of the chip and are connected to the chip through metal connection lines.

[0025] As a further improvement of the technical solution of the present invention, the bottom of the annular groove is in a zigzag shape.

[0026] As a further improvement of the technical solution of the present invention, the diameter of the side surface of the light blocking layer is the same as that of the side surface of the second encapsulation glue layer and they are coaxially arranged.

[0027] A packaging method for an LED device, used to manufacture the LED packaging device as described above, includes the following steps:

[0028] S1. Die bonding: Fix the chip on the die bonding area of the bracket;

[0029] S2. Wire bonding: Connect the chip to the wire bonding area on the bracket through a metal connection line to achieve electrical conduction;

[0030] S3. Form the first encapsulation glue layer through a dispensing process;

[0031] S4. Form the second encapsulation glue layer through a molding process;

[0032] S5. Form the light blocking layer through a molding process.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0034] In the LED packaging device of this solution, the overall external shape of the glue layer formed by the first encapsulation glue layer and the second encapsulation glue layer is cylindrical, and the light-emitting angles in all directions of the LED device can be made consistent. At the same time, since the upper end of the chip protrudes from the groove, the overall height of the bracket is lower than the height of the chip, thereby reducing the blockage of the side light of the chip. And the second encapsulation glue layer covers the outside of the first encapsulation glue layer, and the first encapsulation glue layer is wrapped between the bracket and the second encapsulation glue layer. The KSF powder in the first encapsulation glue layer is not easily in contact with the moisture in the air and cause blackening, which can effectively prevent the KSF powder from blackening. In addition, the inner wall of the groove on the bracket is tightly connected to the first encapsulation glue layer, and the part of the upper surface of the bracket outside the inner wall of the groove, that is, the bottom of the groove, is tightly connected to the second encapsulation glue layer. The setting of the groove can improve the bonding force between the bracket and the first encapsulation glue layer and the second encapsulation glue layer, making the glue layer not easily peeled off from the bracket. Description of the Drawings

[0035] The following further details the technology of the present invention in conjunction with the drawings and specific embodiments:

[0036] Figure 1is a cross-sectional view of the overall structure of the LED packaging device of the present invention;

[0037] Figure 2 is a partial cross-sectional view of the LED package device of the present invention when viewed from above;

[0038] Figure 3 It is a top view of the LED packaging device of the present invention.

[0039] Reference numerals:

[0040] 1-light blocking layer;

[0041] 2- second encapsulation glue layer;

[0042] 3- first encapsulation glue layer;

[0043] 4- Chip;

[0044] 5-bracket; 51-etching sheet; 511-first metal plate; 5111-first plate; 5112-second plate; 512-second metal plate; 5121-third plate; 5122-fourth plate; 52-plastic package; 521-filling part; 522-main body; 523-positioning convex part; 524-annular groove; 5241-first side wall; 5242-second side wall; 5243-annular groove bottom; 53-insulating groove; 54-groove;

[0045] 6-Metal pad;

[0046] 7-Metal connecting wire. DETAILED DESCRIPTION

[0047] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other without conflict. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0048] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the drawings.

[0049] Reference Figures 1 to 3, an LED packaging device, comprising a bracket 5, a chip 4, a first packaging adhesive layer 3, a second packaging adhesive layer 2 and a light blocking layer 1, wherein the chip 4 is an LED chip 4, and the LED chip 4 can be a front-mounted chip 4 or a vertical chip 4. The LED chip 4 is mounted on the top of the bracket 5, and is connected to the pad in the wire bonding area on the bracket 5 through a metal wire. A groove 54 is provided at the upper end of the bracket 5, and the size of the groove 54 is smaller than the size of the bottom of the bracket 5. The chip 4 is located in the groove 54 and the upper end is convexly disposed in the groove 54. The overall height of the bracket 5 is lower than the chip 4, so that the blocking of the side light of the chip 4 can be reduced.

[0050] The first packaging adhesive layer 3 covers the outside of the chip 4 and can fill the gap between the chip 4 and the groove 54. The outer surface of the first packaging adhesive layer 3 is an arc-shaped convex surface. The first packaging adhesive layer 3 contains KSF phosphor. Since the first packaging adhesive layer 3 is wrapped between the second packaging adhesive layer 2 and the bracket 5, the first packaging adhesive layer 3 is not exposed to the air. The KSF powder used in the phosphor is not easy to contact with moisture in the air and cause blackening, which can effectively prevent the KSF powder from blackening.

[0051] The side surface of the second encapsulation adhesive layer 2 is cylindrical, the bottom surface is tightly connected to the outer surface of the first encapsulation adhesive layer 3 and the upper surface of the bracket 5, and the top surface is arranged horizontally. The light blocking layer 1 is cylindrical and covers the upper surface of the second encapsulation adhesive layer 2. The overall structure of the adhesive layer formed by the first encapsulation adhesive layer 3 and the second encapsulation adhesive layer 2 is cylindrical in external form, so that the light output angle is consistent in all directions. The inner wall of the groove 54 on the bracket 5 is tightly connected to the first encapsulation adhesive layer 3, and the upper surface of the bracket 5 outside the inner wall of the groove 54, i.e., the bottom of the groove, is tightly connected to the second encapsulation adhesive layer 2. The arrangement of the groove 54 can improve the bonding force between the bracket 5 and the first encapsulation adhesive layer 3 and the second encapsulation adhesive layer 2, so that the adhesive layer is not easily peeled off from the bracket 5.

[0052] The entire adhesive layer can be formed into a cylindrical packaging adhesive layer structure through a molding process to achieve consistent light output angles in all directions of the LED device. At the same time, through a multi-layer dispensing process, the second packaging adhesive layer 2 covers the outside of the first packaging adhesive layer 3 to prevent the KSF powder in the first packaging adhesive layer 3 from turning black due to moisture.

[0053] Specifically, the bracket 5 includes an etching sheet 51 and a plastic package body 52. ​​The etching sheet 51 includes a base. The center of the base is provided with a first boss protruding upward. The first boss is provided with an insulating groove 53 and the notch is located on its upper end surface. The plastic package body 52 includes a filling portion 521, which is not filled in the insulating groove 53 and the upper surface is flush with the first boss. The plastic package body 52 also includes a main body 522, which covers the top of the base and surrounds the outside of the first boss. The upper end surface of the main body 522 is flush with the upper end surface of the first boss. The plastic package body 52 also includes a positioning convex portion 523, which is located above the main body 522 and has a ring-shaped horizontal cross section. The inner side surface of the positioning convex portion 523 forms the inner wall of the groove 54. The upper end surface of the first boss is used to form a partial groove bottom of the groove 54.

[0054] Specifically, the main body 522 is provided with an annular groove 524 with an opening facing upward, the annular groove 524 surrounds the outer side of the positioning protrusion 523 in the horizontal direction, and the bottom part of the second packaging adhesive layer 2 is filled in the annular groove 524 .

[0055] Specifically, the etching sheet 51 includes a first metal plate 511 and a second metal plate 512 arranged at intervals, and the first metal plate 511 and the second metal plate 512 are placed on the same plane, and the upper end surfaces are arranged flush. The gap between the first metal plate 511 and the second metal plate 512 forms an insulating groove 53, and the filling portion 521 is filled between the first metal plate 511 and the second metal plate 512. The first metal plate 511 includes a first plate 5111 and a second plate 5112 connected to each other in an L shape, and the second metal plate 512 includes a third plate 5121 and a fourth plate 5122 connected to each other, and the first plate 5111 and the third plate 5121 are both arranged vertically and form the first boss together, and the upper end surfaces form part of the bottom of the groove 54, and the insulating groove 53 is located between the first plate 5111 and the third plate 5121, and the second plate 5112 and the fourth plate 5122 form the base and are arranged horizontally. The main body 522 covers the upper surface of the second plate 5112 and the fourth plate 5122. The plastic package body 52 covers and fills the edges of the two metal plates, the etched area and the insulating groove 53 between the two metal plates by injection molding. The die-bonding and wire-bonding area is located at the bottom of the groove 54, that is, the metal pad 6 forms the wire-bonding area, and the place where the chip 4 is placed forms the die-bonding area. The positioning protrusion 523 is square and surrounds the periphery of the die-bonding and wire-bonding area.

[0056] Specifically, the connection structure between the positioning convex portion 523 and the main body portion 522 is stepped on the side close to the first boss. The upper end surface portion of the main body portion 522 forms a stepped surface and is used to form a part of the bottom of the groove 54. The laterally arranged outer side surface on the positioning convex portion 523 is connected to the inner wall of the annular groove 524.

[0057] In this solution, the upper end of the positioning convex portion 523 on the bracket 5 is tightly connected to the second encapsulation glue layer 2, the inner side is tightly connected to the first encapsulation glue layer 3, and the part of the upper end surface of the main body portion 522 connected to the inner side of the positioning convex portion 523 is tightly connected to the bottom surface of the first encapsulation glue layer 3. Both side walls and the bottom of the annular groove 524 are tightly connected to the second encapsulation glue layer 2. The part of the upper end surface of the main body portion 522 surrounding the outside of the opening of the annular groove 524 is tightly connected to the second encapsulation glue layer 2. The arrangement of the positioning convex portion 523 and the annular groove 524 on the bracket 5 can increase the bonding force between the bracket 5 and the first encapsulation glue layer 3 and the second encapsulation glue layer 2, making it difficult for the glue layer to peel off from the bracket 5. In addition, the upper end surface of the positioning convex portion 523 is lower than the upper end of the chip 4, that is, the overall height of the injection molded body is lower than that of the chip 4, thereby reducing the blockage of the side light of the chip 4. Among them, the overall structure of the plastic package 52 can be made by injection molding, and the positioning convex portion 523 and the annular groove 524 can both be formed during the injection molding process.

[0058] Specifically, the annular groove 524 has opposite first side walls 5241 and second side walls 5242. Both the first side wall 5241 and the second side wall 5242 are inclined and inclined away from each other from bottom to top. The first side wall 5241 is connected to the laterally arranged outer side surface on the positioning convex portion 523. Among them, the bottom 5243 of the annular groove 524 is in a zigzag shape. The first side wall 5241 and the second side wall 5242 in the annular groove 524 are in a slope structure, which can further improve the bonding force between the bracket 5 and the second encapsulation glue layer 2, making it difficult for the glue layer to peel off from the bracket 5.

[0059] Specifically, two metal pads 6 are further provided in the groove 54 and are respectively arranged at intervals from the chip 4. The two metal pads 6 are respectively located on opposite sides of the chip 4 and are connected to the chip 4 through metal connection lines 7. In this solution, the fluorescent glue 3 with KSF powder is the first encapsulation glue layer 3 and is completely covered by the second encapsulation glue layer 2, which can effectively prevent the KSF powder from contacting the water vapor in the air and turning black.

[0060] Specifically, the diameter of the side surface of the light blocking layer 1 is the same as the diameter of the side surface of the second encapsulation glue layer 2 and they are coaxially arranged.

[0061] Specifically, the first packaging glue layer 3 can be obtained by a dispensing method. The first packaging glue layer 3 is a light conversion layer, which contains KSF phosphor, covers the LED chip 4, and covers the area enclosed by the positioning protrusion 523 of the plastic package 52. The first packaging glue layer 3 is in the shape of a circular convex lens. The height of the first packaging glue layer 3 is greater than the height of the chip 4 and less than the height of the second packaging glue layer 2.

[0062] Specifically, the second encapsulation adhesive layer 2 can be obtained by a molding method, and the second encapsulation adhesive layer 2 can be a light conversion layer or a transparent adhesive layer. The second encapsulation adhesive layer 2 is cylindrical and covers the bracket 5, and the bottom end can fill the annular groove 524 on the bracket 5, and covers the first encapsulation adhesive layer 3. Because the first encapsulation adhesive layer 3 contains KSF powder, the problem of KSF powder turning black due to contact with moisture in the air can be prevented after being covered and wrapped by the second encapsulation adhesive layer 2. The height of the second encapsulation adhesive layer 2 is greater than the height of the first encapsulation adhesive layer 3, the diameter of the cylinder of the second encapsulation adhesive layer 2 is the same as the width of the bracket 5, and the projection of the bracket 5 in the vertical direction can be square.

[0063] Specifically, the light blocking layer 1 can be obtained by molding, and the light blocking layer 1 is cylindrical and covers the second encapsulation adhesive layer 2. The light blocking layer 1 is filled with a reflective material to block the light emitted directly above the LED chip 4. The outer side of the second encapsulation adhesive layer 2 is cylindrical, that is, the light emitting surface of the LED package device is cylindrical, and the light emitting angles in all directions can be controlled to be consistent. Among them, the height of the light blocking layer 1 is less than the height of the second encapsulation adhesive layer 2.

[0064] A packaging method for an LED device can be used to manufacture the LED packaging device as described above, and can be specifically used to manufacture a light-emitting LED packaging device, comprising the following steps:

[0065] S1. Die bonding: Fix the chip to the die bonding area on the bracket.

[0066] S2. Wire bonding: Connect the chip to the wire bonding area on the bracket through metal connecting wires to achieve electrical conduction.

[0067] S3. Forming a first encapsulation glue layer through a dispensing process.

[0068] S4. Forming a second encapsulation adhesive layer through a molding process.

[0069] S5. Forming a light blocking layer through a molding process.

[0070] For other contents of the LED packaging device and packaging method described in the present invention, please refer to the prior art and will not be described in detail here.

[0071] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An LED packaging device, characterized in that: The invention comprises a bracket, a chip, a first encapsulation layer, a second encapsulation layer and a light blocking layer, wherein the upper end of the bracket is provided with a groove, the chip is located in the groove and the upper end is convexly arranged in the groove, the first encapsulation layer covers the outside of the chip and can fill the gap between the chip and the groove, the outer surface of the first encapsulation layer is an arc-shaped convex surface, and the first encapsulation layer contains KSF phosphor; The side surface of the second packaging adhesive layer is a cylindrical side surface, the bottom surface is tightly connected to the outer surface of the first packaging adhesive layer and the upper surface of the bracket, and the top surface is horizontally arranged; The light blocking layer is cylindrical and covers the second packaging glue layer.

2. The LED package device according to claim 1, characterized in that: The bracket includes an etching sheet and a plastic package body, the etching sheet includes a base, a first boss is protruding upward from the center of the base, an insulating groove is opened on the first boss and the groove is located on the upper end surface thereof; The plastic package body comprises a filling portion, which is filled in the insulating groove and has an upper surface flush with the first boss; The plastic package body further includes a main body portion, the main body portion covers the base and surrounds the outer side of the first boss, and the upper end surface of the main body portion is flush with the upper end surface of the first boss; The plastic package body further comprises a positioning convex portion, which is located above the main body and has a ring-shaped horizontal cross section, and the inner side surface of the positioning convex portion forms the inner wall of the groove; The upper end surface of the first boss is used to form a portion of the bottom of the groove.

3. The LED package device according to claim 2, characterized in that: The main body is provided with an annular groove with an opening facing upwards, the annular groove surrounds the outer side of the positioning protrusion in the horizontal direction, and the bottom part of the second packaging glue layer is filled in the annular groove.

4. The LED package device according to claim 3, characterized in that: The etching sheet comprises a first metal plate and a second metal plate arranged at an interval, the gap between the first metal plate and the second metal plate forms an insulating groove, and the filling portion is filled between the first metal plate and the second metal plate; The first metal plate includes a first plate and a second plate connected to each other in an L shape, the second metal plate includes a third plate and a fourth plate connected to each other, the first plate and the third plate are both vertically arranged and jointly form the first boss, and the upper end surfaces both form a part of the bottom of the groove, the insulating groove is located between the first plate and the third plate, and the second plate and the fourth plate form the base and are both horizontally arranged; The main body covers the upper surfaces of the second plate and the fourth plate.

5. The LED package device according to claim 4, characterized in that: The connection structure between the positioning protrusion and the main body is stepped on the side close to the first boss, and the upper end surface of the main body forms a stepped surface and is used to form a part of the bottom of the groove; The outer side surface vertically arranged on the positioning protrusion is connected to the inner wall of the annular groove.

6. The LED package device according to claim 5, characterized in that: The annular groove has a first side wall and a second side wall opposite to each other. The first side wall and the second side wall are both inclined and inclined from bottom to top in a direction away from each other. The first side wall is connected to the outer side surface vertically arranged on the positioning protrusion.

7. The LED package device according to claim 6, characterized in that: Two metal pads are also arranged in the groove and are spaced apart from the chip. The two metal pads are located on two opposite sides of the chip and are connected to the chip through metal connecting wires.

8. The LED package device according to claim 7, characterized in that: The bottom of the annular groove is in a square-within-a-square shape.

9. The LED package device according to claim 1, characterized in that: The diameter of the side surface of the light-blocking layer is the same as that of the side surface of the second encapsulation adhesive layer and they are coaxially arranged.

10. A method for packaging an LED device, for manufacturing the LED package device according to any one of claims 1 to 9, characterized in that: It includes the following steps: S1. Die bonding: Fix the chip to the die-bonding area on the bracket. S2. Wire bonding: Connect the chip and the wire-bonding area on the bracket through a metal connecting wire to achieve electrical conduction. S3. Form the first encapsulation adhesive layer through a dispensing process. S4. Form the second encapsulation adhesive layer through a molding process. S5. Form the light-blocking layer through a molding process.

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