Waste silicon wafer recycling and grading system

Abstract

The invention discloses a waste silicon wafer recycling and grading system, which belongs to the field of waste silicon wafer recycling and processing, and comprises an operation table, detection parts are arranged in the operation table and at the rear end, grading parts are arranged on the upper side and the left side of the interior of the operation table, and detection mechanisms are arranged in the interior and the lower side of the operation table. The surface state of the material is judged through the arranged probe capable of generating up-down fluctuation, finally, the material is graded, due to the fact that when the surface of the material is detected, the probe can have different states according to the surface state of the material, and the detected material can be sent to different positions after being detected by the probe, the detection accuracy is improved, and the detection efficiency is improved. According to the utility model, materials can be conveniently classified and conveyed, and omission of silicon wafers with larger dents or cracks due to visual fatigue caused by long-time visual inspection is avoided, so that the workload of instrument detection is reduced, and the recovery efficiency of waste silicon wafers is effectively improved.

Description

Technical Field

[0001] The invention relates to the field of waste silicon wafer recycling and processing, and more specifically to a waste silicon wafer recycling and grading system. Background Art

[0002] Silicon wafers are semiconductor materials with conductivity, but their conductivity is between that of conductors and insulators. Silicon wafers have the characteristics of high hardness, high brittleness and high melting point, which requires special processes and equipment during processing. They mainly come from semiconductor manufacturers, solar cell manufacturers and integrated circuit manufacturers. Waste silicon wafers are one of the wastes generated in the semiconductor industry, including scraps, defective products and used silicon wafers in the production process. Waste silicon wafers may contain harmful substances, such as heavy metals, harmful gases, etc., which need to be properly handled to avoid pollution to the environment.

[0003] According to the quality difference of silicon wafers, they can be generally divided into four grades: A wafers, B wafers, C wafers and waste wafers. The cleanliness and smoothness of the silicon wafer surface and the presence of stains, line marks, dents, broken edges and other defects; whether the geometric dimensions of the silicon wafers meet the standards, including the length of the side and the length of the diagonal line, are all the criteria for judging the quality of silicon wafers. Therefore, when recycling waste silicon wafers, they need to be graded and processed step by step;

[0004] In the prior art, the difference between grade A silicon wafers and grade B silicon wafers is mainly whether there are scratches or stains on the surface of the waste silicon wafers, which does not affect their overall performance, while the surface of grade C silicon wafers will have obvious dents or cracks, and their performance and economic benefits are lower. Therefore, they need to be distinguished during classification. However, when inspecting grade C silicon wafers, visual inspection can be used as a preliminary inspection method, but long-term visual inspection will cause visual fatigue, which will lead to omission of silicon wafers with large dents or cracks, thereby increasing the workload of instrument inspection and the time required for instrument inspection, which will ultimately affect the recycling efficiency of waste silicon wafers. Summary of the invention

[0005] In view of the problems existing in the prior art, the object of the present invention is to provide a waste silicon wafer recycling and grading system.

[0006] To solve the above problems, the present invention adopts the following technical solution, which can realize the display of different states of the material surface through probe fluctuations, so as to facilitate the grading and transportation of materials, so as to avoid the material with large dents or cracks from still being tested for electrical properties by instruments later.

[0007] A waste silicon wafer recycling and grading system, comprising an operating table and a control console arranged at the upper and rear ends of the operating table, characterized in that: a detection component is provided inside and at the rear end of the operating table, the detection component comprises a placing table slidably connected to the upper side of the inner part of the operating table, and a grading component is provided on the upper side and the left side of the inner part of the operating table;

[0008] The interior and lower side of the console are provided with a detection mechanism, a first electric push rod is fixedly installed inside the operating table, a push plate is fixedly connected to the telescopic end of the first electric push rod, and a discharging conveyor belt is provided on the front of the operating table;

[0009] The detection mechanism includes a telescopic electric cylinder fixedly connected to the inside of the console, the telescopic end of the telescopic electric cylinder is fixedly connected to a control box, a first movable groove is opened in the lower inner part of the control box, a pressure sensor is fixedly installed on the inner upper side of the first movable groove, an extrusion plate is slidably connected in the first movable groove, the bottom end of the extrusion plate is fixedly connected to the top end of the first pressure spring, and the probe is fixedly connected to the top end of the first pressure spring.

[0010] Furthermore, the upper side of the extrusion plate is in squeeze contact with the lower side of the pressure sensor, the first pressure spring is located inside the first movable groove, a servo motor is fixedly installed at the rear end of the console, there are multiple fixed blocks, an extension rod is fixedly connected to the right side of the bottom of the placement table, and the fixed block is in squeeze contact with the extension rod after rotation, a transmission part is provided inside the operating table, and a fixed block is provided on the outside of the transmission part.

[0011] Furthermore, the transmission member includes a connecting rod rotatably connected to the right side and center of the operating table, sprockets are fixedly connected to the front and rear ends of the outer sides of the connecting rod, and a chain is movably connected between the left and right adjacent connecting rods. The output shaft of the operating table is fixedly connected to the right connecting rod, the fixed block is fixedly connected to the outer side of the chain, and the output end of the servo motor is fixedly connected to the sprocket located on the left side of the rear end.

[0012] Furthermore, a material-returning assembly is provided inside and on the front of the operating table, and the material-returning assembly includes a rotating plate hinged on the left side of the placing table in a longitudinal array.

[0013] Furthermore, a movable groove is provided on the lower side of the rotating plate, and a movable block is slidably connected inside the movable groove. The inclined surface of the lower side of the movable block is fixedly installed with a first magnetic block, and a second pressure spring is fixedly connected between the upper end of the movable block and the movable groove, and the other end of the second pressure spring is fixedly connected to the inside of the movable groove. A limiting groove is provided on the right side of the interior of the placing table, and the number of limiting grooves is multiple. After the rotating plate rotates, the movable groove corresponds to the limiting groove, and after the movable groove corresponds to the limiting groove, the movable block is inserted into the limiting groove. A second movable groove is provided on the right side of the interior of the placing table, and the second movable groove is communicated with multiple limiting grooves. A push column is slidably connected in the second movable groove, and the push column is in the shape of an "E". After the push column moves to the left, it is inserted into the limiting groove. A second electric push rod is fixedly connected to the upper right part of the interior of the operating table, and the telescopic end of the second electric push rod is fixedly connected to the push column. The first electric push rod, the second electric push rod, the pressure sensor and the control console are all electrically connected to the external power supply.

[0014] Furthermore, a material guide component is provided inside the operating table, and the material guide component includes a first collecting chamber opened on the lower side of the inner part of the operating table. The inner lower side of the first collecting chamber is inclined. A second magnetic block is fixedly connected to the left side of the push column, and there are multiple second magnetic blocks. After the second magnetic block moves to the left, it slides into the limiting groove, and the first magnetic block and the second magnetic block are magnetically adsorbed.

[0015] Furthermore, the grading component includes a feed conveyor belt arranged on the left side of the operating table, a material discharge slope is arranged on the upper side of the operating table, a through hole is opened through the surface of the material discharge slope, and the number of through holes is multiple, and a second collection chamber is opened on the lower side of the interior of the operating table, and the multiple through holes are all connected to the second collection chamber.

[0016] Furthermore, a mitigation component is provided inside the operating table, and the mitigation component includes a guide groove opened on the upper side of the operating table, and the guide groove is connected to the second collection chamber. After the placement table moves to the left, it is inserted into the second collection chamber through the guide groove.

[0017] Furthermore, a partition component is provided on the inner upper side of the operating table, and the partition component includes an embedding groove opened at the center of the inner upper side of the operating table.

[0018] Furthermore, a moving frame is slidably connected inside the embedding groove, a support block is slidably connected inside the upper side of the moving frame, a third pressure spring is fixedly connected in a longitudinal linear array between the lower end of the support block and the moving frame, and a fourth pressure spring is fixedly connected in a longitudinal linear array between the left side of the moving frame and the embedding groove. A buffer pad is fixedly connected to the upper inclined surface of the support block, and moving bars are fixedly connected to the front and rear ends of the upper right side of the placement table, and the two moving bars are pressed and contacted with the left side of the moving frame after moving to the left.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] (1) The present invention determines the surface state of the material by setting a probe that can generate up and down fluctuations, and finally grades the material. When detecting the surface of the material, the probe will appear in different states according to the state of the material surface, and the detected material will be sent to different positions after passing the probe detection, so as to facilitate the grading and transportation of the material, thereby avoiding visual fatigue caused by long-term visual inspection, resulting in the omission of silicon wafers with large dents or cracks, reducing the workload of instrument detection, and effectively improving the recovery efficiency of waste silicon wafers.

[0021] (2) The present invention can quickly discharge materials that have been detected to have defects by means of the rotating plate. After a large dent or crack is detected on the surface of the material, the lock between the rotating plate and the placement table will be released, so that the detected material can directly fall from the top of the placement table into the storage chamber. The rapid discharge of the material can ensure the detection efficiency of subsequent materials and avoid remixing of materials with intact or less damaged surfaces, so as to achieve the purpose of quickly grading materials of different qualities.

[0022] (3) The present invention provides a rotatable rotating plate which is in an inclined state after the restriction is released and guides the material. Since the rotating plate can be in an inclined state with the help of the side wall of the first collecting chamber after the lock with the placement table is released, the material can slide smoothly from the top of the rotating plate into the first collecting chamber, so as to avoid the material from getting stuck and being obstructed during the material discharge process, and at the same time reduce the speed of the material when sliding inside the first collecting chamber, to prevent the material from being damaged again. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the present invention;

[0024] Figure 2 It is a cross-sectional structural schematic diagram of the present invention;

[0025] Figure 3 It is a schematic cross-sectional structural diagram of the operating table of the present invention;

[0026] Figure 4 It is a structural schematic diagram of the placement table of the present invention;

[0027] Figure 5 It is a schematic cross-sectional structural diagram of the guide groove of the present invention;

[0028] Figure 6 It is a schematic cross-sectional structural diagram of the placement table of the present invention;

[0029] Figure 7 is a schematic cross-sectional structural diagram of the second collecting chamber of the present invention;

[0030] Figure 8 It is a schematic cross-sectional structural diagram of the control box of the present invention.

[0031] Description of the numbers in the figure:

[0032] 1. Operating table; 11. Control console; 111. Telescopic electric cylinder; 2. Detection component; 21. Servo motor; 22. Transmission component; 221. Sprocket; 222. Chain; 223. Connecting rod; 23. Fixed block; 24. Placement table; 241. Extension rod; 25. Detection mechanism; 251. Control box; 252. First moving groove; 253. Pressure sensor; 254. First pressure spring; 255. Extrusion plate; 256. Probe; 26. First electric push rod; 27. Push plate; 28. Material return assembly; 281. Rotating plate; 282. Movable groove; 283. Movable block; 284. First magnetic block; 28 5. Second pressure spring; 286. Limiting groove; 287. Second moving groove; 288. Push column; 289. Second electric push rod; 2891. Discharging conveyor belt; 29. ​​Material guiding assembly; 291. First collecting chamber; 292. Second magnetic block; 3. Grading component; 31. Feeding conveyor belt 31; 32. Discharging slope; 33. Through hole; 34. Second collecting chamber; 35. Relief assembly; 351. Guide groove; 36. Partition assembly; 361. Embedding groove; 362. Moving frame; 363. Support block; 364. Third pressure spring; 365. Fourth pressure spring; 366. Moving bar; 367. Buffer pad. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0034] See also Figures 1 to 8 A waste silicon wafer recycling and grading system comprises an operating table 1 and a control console 11 arranged at the upper rear end of the operating table 1, characterized in that: a detection component 2 is provided inside and at the rear end of the operating table 1, the detection component 2 comprises a placing table 24 slidably connected to the upper side of the operating table 1, and a grading component 3 is provided on the upper side and left side of the operating table 1;

[0035] A detection mechanism 25 is provided inside and on the lower side of the control console 11. A first electric push rod 26 is fixedly installed inside the operating table 1. A push plate 27 is fixedly connected to the telescopic end of the first electric push rod 26. A discharge conveyor belt 2891 is provided on the front of the operating table 1.

[0036] The upper side of the extrusion plate 255 is in compression contact with the lower side of the pressure sensor 253, the first pressure spring 254 is inside the first moving groove 252, the rear end of the control console 11 is fixedly mounted with a servo motor 21, the number of fixed blocks 23 is multiple, the bottom right side of the placement table 24 is fixedly connected with an extension rod 241, the fixed block 23 is rotated and in compression contact with the extension rod 241, the interior of the operating table 1 is provided with a transmission member 22, and the outer side of the transmission member 22 is provided with a fixed block 23;

[0037] The detection mechanism 25 includes a telescopic electric cylinder 111 fixedly connected to the inside of the control console 11, the telescopic end of the telescopic electric cylinder 111 is fixedly connected to a control box 251, a first moving groove 252 is provided in the lower part of the control box 251, a pressure sensor 253 is fixedly installed on the upper side of the first moving groove 252, a pressing plate 255 is slidably connected in the first moving groove 252, the bottom end of the pressing plate 255 is fixedly connected to the top of a first pressure spring 254, and a probe 256 is fixedly connected to the top of the first pressure spring 254;

[0038] The transmission member 22 includes a connecting rod 223 rotatably connected to the right side and center of the operating platform 1, sprockets 221 are fixedly connected to the front and rear ends of the outer side of the connecting rod 223, and a chain 222 is movably connected between the left and right adjacent connecting rods 223. The output shaft of the operating platform 1 is fixedly connected to the right connecting rod 223, the fixed block 23 is fixedly connected to the outer side of the chain 222, and the output end of the servo motor 21 is fixedly connected to the sprocket 221 located on the left side of the rear end.

[0039] By adopting the above technical solution, firstly, after the material to be inspected is transported to the top of the placement table 24 through the grading component 3, the servo motor 21 on the back of the operating table 1 will drive the transmission member 22 to run slowly. Because the single chain 222 is sleeved on the outside of multiple sprockets 221, and the two corresponding sprockets 221 in the front and rear are connected by the connecting rod 223, when the servo motor 21 drives one of the sprockets 221 to rotate, the sprocket 221 will drive the fixed block 23 to start rotating through the chain 222. After the material contacts the placement table 24, the fixed block 23 will push the extension rod 241 on the right side of the placement table 24, so that the placement table 24 carries the material and moves straight to the left. At the same time, the telescopic electric cylinder 1 11 pushes the control box 251 downward so that the probe 256 extending from the bottom thereof will first contact the material. At this time, after the probe 256 contacts the material, it will move further downward under the push of the electric cylinder 111, so that the first spring 254 is compressed. As the material continues to move, if there is no dent or crack on the surface of the material, the probe 256 will remain in a stable state on the upper surface of the material. After the material detection is completed, the control console 11 will start the first electric push rod 26 to push the material with the help of the push plate 27, so that the material slides out of the placement table 24. If the probe 256 contacts the dent or crack on the surface of the material, the probe 256 will extend into the dent or crack under the push of the first spring 254. After the probe 256 passes over the dent or crack, it will be squeezed against the surface of the material again, so that the probe 256 drives the first spring 254 to return to the first moving groove 252, and then the probe 256 will appear in a vertical fluctuation state with the placement table 24, that is, the probe 256 will move up and down inside the first moving groove 252. As the probe 256 moves up and down, the first pressure spring 254 fixed to the probe 256 will first expand and then contract, and the extrusion plate 255 that is always in contact with the pressure sensor 253 begins to apply pressure to the pressure sensor 253 with the pressure provided by the first pressure sensor 253, and when the pressure felt by the pressure sensor 253 decreases, it will transmit itself. The information is given to the control console 11, and finally the material is put down from the top of the placement table 24 in cooperation with the material return component 28. After the servo motor 21 rotates in the opposite direction, the placement table 24 can be pushed back to its original position through another fixed block 23 to place the next material. When the surface of the material is detected, the probe 256 will appear in different states according to the state of the material surface, and the detected material will be sent to different positions after being detected by the probe 256, so as to facilitate the grading and transportation of the material, avoiding visual fatigue caused by long-term visual inspection and resulting in the omission of silicon wafers with large dents or cracks, thereby reducing the workload of instrument detection and effectively improving the recovery efficiency of waste silicon wafers.

[0040] like Figures 1 to 6As shown, a material stripping assembly 28 is provided inside and on the front of the operating table 1. The material stripping assembly 28 includes a rotating plate 281 which is hinged on the left side inside the placing table 24 and is arranged in a longitudinal array.

[0041] A movable groove 282 is provided at the lower side of the rotating plate 281, and a movable block 283 is slidably connected inside the movable groove 282. A first magnetic block 284 is fixedly installed on the inclined surface at the lower side of the movable block 283. A second pressure spring 285 is fixedly connected between the upper end of the movable block 283 and the movable groove 282. The other end of the second pressure spring 285 is fixedly connected to the inside of the movable groove 282. A limiting groove 286 is provided on the right side of the interior of the placing table 24, and the number of the limiting grooves 286 is multiple. After the rotating plate 281 rotates, the movable groove 282 corresponds to the limiting groove 286, and after the movable groove 282 corresponds to the limiting groove 286, the movable block 284 is fixedly installed. 83 is inserted into the limiting groove 286, a second movable groove 287 is opened on the inner right side of the placing table 24, the second movable groove 287 is connected with multiple limiting grooves 286, a push column 288 is slidably connected in the second movable groove 287, the push column 288 is in the shape of an "E", and the push column 288 is inserted into the limiting groove 286 after moving to the left, a second electric push rod 289 is fixedly connected to the upper right part of the inner part of the operating table 1, and the telescopic end of the second electric push rod 289 is fixedly connected to the push column 288, and the first electric push rod 26, the second electric push rod 289, the pressure sensor 253 and the control console 11 are all electrically connected to the external power supply.

[0042] By adopting the above technical solution, first, when the probe 256 fluctuates up and down, the control console 11 will control the second electric push rod 289 to push the push column 288. As the push column 288 slides from the second moving groove 287 into the limiting groove 286, the movable block 283 originally inserted into the limiting groove 286 will be retracted into the movable groove 282 opened in the rotating plate 281. After the rotating plate 281 loses the support from the movable block 283 cooperating with the limiting groove 286, the rotating plate 281 hinged on the placement table 24 will start to rotate clockwise due to the weight of the material and enter the first collecting chamber 291 together. Finally, the material is collected in the first receiving chamber. When the placement table 24 starts to reset, if the rotating plate 281 has entered the first collecting chamber 291, the placement table 24 moving to the left will drive the rotating plate 281 to rotate clockwise. At the same time, it moves to the left. At this time, the rotating plate 281 will gradually re-merge with the placement table 24, and when the movable block 283 contacts the placement table 24 again, it will contact it through the inclined surface, and then gradually be pushed into the movable groove 282. When the movable groove 282 is docked with the limiting groove 286, the second pressure spring 285 inside the movable groove 282 will push the movable block 283, so that the movable block 283 is reinserted into the limiting groove 286. After detecting large dents or cracks on the surface of the material, the lock between the rotating plate 281 and the placement table 24 will be released, so that the detected material can directly fall from the top of the placement table 24 into the storage chamber. The rapid discharge of the material can ensure the detection efficiency of the subsequent material, and also avoid the re-mixing of the material with intact or less damaged surface, so as to achieve the purpose of rapid classification of materials of different qualities.

[0043] like Figures 2 to 6 As shown, a material guide assembly 29 is provided inside the operating table 1, and the material guide assembly 29 includes a first collecting chamber 291 opened on the lower side of the inner part of the operating table 1. The inner lower side of the first collecting chamber 291 is inclined. A second magnetic block 292 is fixedly connected to the left side of the push column 288, and the number of the second magnetic blocks 292 is multiple. After the second magnetic block 292 moves to the left, it slides into the limiting groove 286, and the first magnetic block 284 and the second magnetic block 292 are magnetically adsorbed.

[0044] By adopting the above technical solution, first, when the push rod approaches the movable block 283, the magnetic field generated by the second magnetic block 292 fixed by the push rod will be attracted by the first magnetic block 284 fixed by the movable block 283. After the movable block 283 is completely pushed out of the limiting groove 286, the rotating plate 281 will start to rotate clockwise due to the weight of the material and its own weight. When the movable block 283 just leaves the limiting groove 286, the first magnetic block 284 and the second magnetic block 292 are close to each other, so that the rotation speed of the rotating plate 281 will be slightly reduced. As the two gradually move away from each other, at the same time, the servo motor 21 has started to rotate in the opposite direction, and the other fixed block 23 of the chain 222 will rotate on the other side of the extension rod 241. Pushing causes the placement table 24 to gradually move to the left. After the rotating plate 281 rotates, its bottom will contact the edge of the inner wall of the first collecting chamber 291, so that the clockwise rotating plate 281 is supported. At this time, the material will slide into the first collecting chamber 291 with the help of the inclined rotating plate 281. Since the rotating plate 281 can be tilted with the help of the side wall of the first collecting chamber 291 after being unlocked from the placement table 24, the material can smoothly slide from the top of the rotating plate 281 into the first collecting chamber 291, so as to avoid jamming and obstruction of the material during the unloading process, and at the same time reduce the speed of the material when sliding inside the first collecting chamber 291, to prevent the material from being damaged secondary.

[0045] like Figure 3 As shown, the grading component includes a feed conveyor belt 31 arranged on the left side of the operating table 1, a material discharge slope 32 is arranged on the upper side of the operating table 1, a through hole 33 is opened through the surface of the material discharge slope 32, and the number of through holes 33 is multiple, and a second collection chamber 34 is opened on the lower side of the inner part of the operating table 1, and multiple through holes 33 are all connected to the second collection chamber 34.

[0046] By adopting the above technical solution, the material to be inspected is first transported by the feed conveyor belt 31. When the material enters the area of ​​the material discharge slope 32, the smaller material will fall into the second collection chamber 34 through the through hole 33, and the remaining material will be blocked by the partition component 36. Finally, it is placed and inspected by the placement table 24. Since the material sliding down the material discharge slope 32 can first screen out the smaller material when passing through the through hole 33, it can not only improve the inspection efficiency of the material, but also eliminate the unqualified material in advance, and achieve the purpose of rapid material classification again.

[0047] like Figure 3 , Figure 5 and Figure 7 As shown, a deceleration component 35 is provided inside the operating table 1, and the deceleration component 35 includes a guide groove 351 opened on the upper side of the operating table 1, and the guide groove 351 is connected to the second collection chamber 34. After the placement table 24 moves to the left, it passes through the guide groove 351 and is inserted into the second collection chamber 34.

[0048] By adopting the above technical scheme, first, in the process of smaller-volume materials entering the second collecting chamber 34 through the through hole 33, the partial placement table 24 inserted into the second collecting chamber 34 through the guide groove 351 can collect the materials, and after the placement table 24 is pushed to the right, the intersection of the second collecting chamber 34 and the guide groove 351 can scrape the materials above the placement table 24. Since the materials falling into the second collecting chamber 34 are briefly collected by the placement table 24, the materials can be prevented from directly entering the second collecting chamber 34 and then breaking and raising granular powder due to mutual collision, which effectively prevents the remaining materials from affecting the detection efficiency of the probe 256 due to contamination with granular powder, and at the same time avoids the granular powder from contaminating the working patients.

[0049] like Figures 5 to 7 As shown, a partition component 36 is provided on the inner upper side of the operating table 1 , and the partition component 36 includes an embedding groove 361 opened at the center of the inner upper side of the operating table 1 .

[0050] A moving frame 362 is slidably connected inside the embedded groove 361, a support block 363 is slidably connected inside the upper side of the moving frame 362, a third pressure spring 364 is fixedly connected in a longitudinal linear array between the lower end of the support block 363 and the moving frame 362, and a fourth pressure spring 365 is fixedly connected in a longitudinal linear array between the left side of the moving frame 362 and the embedded groove 361. A buffer pad 367 is fixedly connected to the upper inclined surface of the support block 363, and moving bars 366 are fixedly connected to the front and rear ends of the upper right side of the placement table 24. After the two moving bars 366 move to the left, they are pressed and contacted with the left side of the moving frame 362.

[0051] By adopting the above technical solution, first, after the larger material is blocked by the moving frame 362 and the support block 363, if the placement table 24 is still in the state of being inserted into the second collecting chamber 34 at this time, the moving bar 366 above the placement table 24 will push the moving frame 362, so that the moving frame 362 gradually enters the embedding groove 361 and squeezes the fourth pressure spring 365. At the same time, the moving frame 362 gradually retracted into the embedding groove 361 will squeeze the support block 363 with the help of the material discharge slope 32, so that the support block 363 is retracted into the depth of the moving frame 362 until the moving frame 362 completely enters the embedding groove 361. At this time, the support block 363 squeezes the third pressure spring 365 inside the moving frame 362. The force spring 364 is squeezed, and the material will lose the support block 363 and the moving block, and finally slide to the placement table 24. After the placement table 24 leaves with the material, the fourth pressure spring 365 pushes the moving frame 362 to reset the moving frame 362, and the third pressure spring 364 inside the moving frame 362 pushes the support block 363 upward, so that the lifted support block 363 and the moving frame 362 re-separate the material. While the smaller material is being removed, the material that meets the requirements can be blocked to facilitate subsequent detection. The materials separated in batches can ensure the detection efficiency of the materials and avoid the impact of multiple materials moving at the same time on the overall detection efficiency of the materials.

[0052] Working principle: First, when the material passes through the feed conveyor belt 31 and enters the area of ​​the discharge slope 32, the smaller material will fall into the second collecting chamber 34 through the through hole 33, and the part of the placing table 24 inserted into the second collecting chamber 34 through the guide groove 351 can collect the material. After the placing table 24 is pushed to the right, the intersection of the second collecting chamber 34 and the guide groove 351 can scrape the material above the placing table 24. After the larger material is blocked by the moving frame 362 and the supporting block 363, if the placing table 24 is still in the state of being inserted into the second collecting chamber 34, the moving bar 366 above the placing table 24 will push the moving frame 362, so that the moving frame 362 gradually enters the embedding groove 361 and presses the fourth pressing The third pressure spring 365 is squeezed, and at the same time, the moving frame 362 gradually retracted into the embedded groove 361 will squeeze the support block 363 with the help of the material discharge slope 32, so that the support block 363 is retracted into the depth of the moving frame 362 until the moving frame 362 completely enters the embedded groove 361. At this time, the support block 363 squeezes the third pressure spring 364 inside the moving frame 362. At the same time, the material will lose the support block 363 and the movement barrier, and finally slide to the placement table 24. After the placement table 24 leaves with the material, the fourth pressure spring 365 can cooperate with the third pressure spring 364 to reset the support block 363 and the moving frame 362. Then, the servo motor 21 on the back of the operating table 1 is started to drive the transmission member 22 to run slowly. After the motor 21 drives one of the sprockets 221 to rotate, the sprocket 221 will drive the fixed block 23 to start rotating through the chain 222. After the material contacts the placement table 24, the fixed block 23 will push the extension rod 241 on the right side of the placement table 24, so that the placement table 24 moves straight to the left with the material. At the same time, the telescopic electric cylinder 111 pushes the control box 251 downward, and the probe 256 extending from the bottom of the control box 251 will first contact the material. If there are no dents or cracks on the surface of the material, the probe 256 will remain in a stable state on the upper surface of the material. After the material detection is completed, the control console 11 will start the first electric push rod 26 to push the material with the help of the push plate 27, so that the material slides out of the placement table 24. If the probe 25 When the probe 256 contacts the dent or crack on the surface of the material, the probe 256 will move up and down inside the first moving groove 252, and the first pressure spring 254 fixed to the probe 256 will be squeezed, and the squeezing plate 255 in contact with the pressure sensor 253 will start to apply pressure to the pressure sensor 253 with the help of the pressure provided by the first pressure sensor 253. When the pressure on the pressure sensor 253 changes, it will transmit information to the control console 11, and the control console 11 will control the second electric push rod 289 to push the push column 288. As the push column 288 slides from the second moving groove 287 into the limiting groove 286, the movable block 283 originally inserted into the limiting groove 286 will retract into the movable groove 282 opened in the rotating plate 281.After the rotating plate 281 loses the support from the movable block 283 and the limiting groove 286, the rotating plate 281 hinged inside the placing table 24 will start to rotate clockwise due to the weight of the material and enter the first collecting chamber 291 together, and finally the material is collected in the first receiving chamber;

[0053] After the servo motor 21 rotates in the opposite direction, the placement table 24 can be pushed back to its original position through another fixed block 23 for placing the next material. When the placement table 24 starts to reset, if the rotating plate 281 has entered the first collecting chamber 291, the placement table 24 moving to the left will drive the rotating plate 281 to move to the left together. At this time, the rotating plate 281 will gradually re-merge with the placement table 24, and when the movable block 283 contacts the placement table 24 again, it will contact it through the inclined surface, and then gradually be pushed into the movable groove 282. When the movable groove 282 is docked with the limiting groove 286, the second pressure spring 285 inside the movable groove 282 will push the movable block 283, so that the movable block 283 is reinserted into the limiting groove 286. The magnetic field generated by the second magnetic block 292 fixed by the push rod will be attracted by the first magnetic block 284 fixed by the movable block 283. After the movable block 283 is completely pushed out of the limiting groove 286, the rotating plate 281 will start to rotate clockwise due to the weight of the material and its own weight. When the movable block 283 just leaves the limiting groove 286, the servo motor 21 has started to rotate in the opposite direction, and the other fixed block 23 of the chain 222 will push the other side of the extension rod 241, causing the placement table 24 to gradually move to the left. After the rotating plate 281 rotates, its lower part will contact the edge of the inner wall of the first collecting chamber 291, so that the clockwise rotating rotating plate 281 is supported. At this time, the material will slide into the first collecting chamber 291 with the help of the inclined rotating plate 281.

[0054] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A waste silicon wafer recycling and grading system, comprising an operating table (1) and a control console (11) arranged at the upper rear end of the operating table (1), characterized in that: The interior and rear end of the operating table (1) are provided with a detection component (2), the detection component (2) comprises a placement table (24) slidably connected to the upper side of the interior of the operating table (1), and the upper side and left side of the interior of the operating table (1) are provided with a grading component (3); The interior and lower side of the control console (11) are provided with a detection mechanism (25); a first electric push rod (26) is fixedly installed inside the operating table (1); a push plate (27) is fixedly connected to the telescopic end of the first electric push rod (26); and a discharge conveyor belt (2891) is provided on the front of the operating table (1); The detection mechanism (25) comprises a telescopic electric cylinder (111) fixedly connected to the inside of the control console (11); the telescopic end of the telescopic electric cylinder (111) is fixedly connected to a control box (251); a first movable groove (252) is provided at the lower part of the inside of the control box (251); a pressure sensor (253) is fixedly installed on the upper side of the inside of the first movable groove (252); a compression plate (255) is slidably connected in the first movable groove (252); the bottom end of the compression plate (255) is fixedly connected to the top end of a first pressure spring (254); and the probe (256) is fixedly connected to the top end of the first pressure spring (254).

2. A waste silicon wafer recycling and grading system according to claim 1, characterized in that: The upper side of the extrusion disk (255) is in compression contact with the lower side of the pressure sensor (253); the first pressure spring (254) is located inside the first movable groove (252); a servo motor (21) is fixedly installed at the rear end of the console (11); there are multiple fixed blocks (23); an extension rod (241) is fixedly connected to the right side of the bottom of the placement table (24); the fixed block (23) is in compression contact with the extension rod (241) after rotation; a transmission member (22) is provided inside the operating table (1); and a fixed block (23) is provided on the outside of the transmission member (22).

3. A waste silicon wafer recycling and grading system according to claim 2, characterized in that: The transmission member (22) comprises a connecting rod (223) rotatably connected to the right side and the center of the operating table (1); the front and rear ends of the outer side of the connecting rod (223) are fixedly connected to sprockets (221); the connecting rods (223) adjacent to each other on the left and right are movably connected to a chain (222); the output shaft of the operating table (1) is fixedly connected to the right connecting rod (223); the fixed block (23) is fixedly connected to the outer side of the chain (222); and the output end of the servo motor (21) is fixedly connected to the sprocket (221) located on the left side of the rear end.

4. A waste silicon wafer recycling and grading system according to claim 3, characterized in that: The interior and the front of the operating table (1) are provided with a material-removing assembly (28), and the material-removing assembly (28) comprises a rotating plate (281) hingedly connected to the left side of the interior of the placement table (24) in a longitudinal array.

5. A waste silicon wafer recycling and grading system according to claim 4, characterized in that: A movable groove (282) is provided on the lower side of the rotating plate (281), and a movable block (283) is slidably connected inside the movable groove (282). A first magnetic block (284) is fixedly installed on the inclined surface on the lower side of the movable block (283). A second pressure spring (285) is fixedly connected between the upper end of the movable block (283) and the movable groove (282), and the other end of the second pressure spring (285) is fixedly connected inside the movable groove (282). A limiting groove (286) is provided on the right side of the interior of the placing table (24), and the number of the limiting grooves (286) is multiple. After the rotating plate (281) rotates, the movable groove (282) corresponds to the limiting groove (286), and after the movable groove (282) corresponds to the limiting groove (286), the movable block (283) is inserted into the limiting groove (286), a second movable groove (287) is opened on the right side of the interior of the placing platform (24), the second movable groove (287) is connected with multiple limiting grooves (286), a push column (288) is slidably connected in the second movable groove (287), the push column (288) is in the shape of an "E", and the push column (288) is inserted into the limiting groove (286) after moving to the left, a second electric push rod (289) is fixedly connected to the upper right side of the interior of the operating platform (1), and the telescopic end of the second electric push rod (289) is fixedly connected to the push column (288), and the first electric push rod (26), the second electric push rod (289), the pressure sensor (253) and the control console (11) are all electrically connected to the external power supply.

6. A waste silicon wafer recycling and grading system according to claim 5, characterized in that: A material guide component (29) is provided inside the operating table (1), and the material guide component (29) includes a first collecting chamber (291) opened on the lower side of the operating table (1). The lower side of the first collecting chamber (291) is tilted. A second magnetic block (292) is fixedly connected to the left side of the push column (288), and the number of the second magnetic blocks (292) is multiple. After the second magnetic block (292) moves to the left, it slides into the limiting groove (286), and the first magnetic block (284) and the second magnetic block (292) are magnetically attracted to each other.

7. A waste silicon wafer recycling and grading system according to claim 6, characterized in that: The grading component comprises a feed conveyor belt (31) arranged on the left side of the operating table (1); a material discharge slope (32) is arranged on the upper side of the operating table (1); a through hole (33) is provided through the surface of the material discharge slope (32); and the number of the through holes (33) is multiple; a second collection chamber (34) is provided on the lower side of the interior of the operating table (1); and the multiple through holes (33) are all connected to the second collection chamber (34).

8. The waste silicon wafer recycling and grading system according to claim 7, characterized in that: A deceleration component (35) is provided inside the operating table (1), and the deceleration component (35) comprises a guide groove (351) opened on the upper side of the operating table (1), and the guide groove (351) is connected to the second collection chamber (34). After the placement table (24) moves to the left, it passes through the guide groove (351) and is inserted into the second collection chamber (34).

9. A waste silicon wafer recycling and grading system according to claim 8, characterized in that: A partition component (36) is provided on the inner upper side of the operating table (1), and the partition component (36) comprises an embedding groove (361) opened at the center of the inner upper side of the operating table (1).

10. A waste silicon wafer recycling and grading system according to claim 9, characterized in that: The interior of the embedding groove (361) is slidably connected to a moving frame (362), the interior upper side of the moving frame (362) is slidably connected to a support block (363), a third pressure spring (364) is fixedly connected in a longitudinal linear array between the lower end of the support block (363) and the moving frame (362), and a fourth pressure spring (365) is fixedly connected in a longitudinal linear array between the left side of the moving frame (362) and the embedding groove (361). A buffer pad (367) is fixedly connected to the upper inclined surface of the support block (363), and the front and rear ends of the upper right side of the placement platform (24) are fixedly connected to moving bars (366), and the two moving bars (366) are pressed and contacted with the left side of the moving frame (362) after moving to the left.

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