A waste silicon wafer recycling and grading system

Abstract

The application discloses a kind of waste silicon wafer recycling grading systems, belong to waste silicon wafer recycling processing field, including operation platform, the inside and rear end of operation platform are equipped with detection component, the inside upper side and left side of operation platform are equipped with grading component, the inside and downside of control panel are equipped with detection mechanism, the probe of being set can generate up and down fluctuation and determine material surface state, finally material is graded, since when detecting the surface of material, probe will appear different state according to the state of material surface, and the material to be detected will be sent to different positions after being detected by probe, so as to classify and convey material, avoid visual fatigue after long time visual inspection, so that there is a large concave or crack silicon wafer appears omission, reduce the workload of instrument detection, effectively improve the recovery efficiency of waste silicon wafer.

Description

Technical Field

[0001] This invention relates to the field of waste silicon wafer recycling and processing, and more specifically, to a waste silicon wafer recycling and grading system. Background Technology

[0002] Silicon wafers are semiconductor materials with electrical conductivity, but their conductivity lies between that of conductors and insulators. Silicon wafers are characterized by high hardness, high brittleness, and high melting point, which makes their processing require special processes and equipment. They mainly come from semiconductor manufacturing plants, solar cell manufacturing plants, and integrated circuit manufacturing plants. Waste silicon wafers are one of the wastes generated in the semiconductor industry, including scraps, defective products, and used silicon wafers from the production process. Waste silicon wafers may contain hazardous substances such as heavy metals and harmful gases, and need to be properly disposed of to avoid environmental pollution.

[0003] Based on the quality differences of silicon wafers, they can be generally divided into four grades: A-wafers, B-wafers, C-wafers, and waste wafers. The cleanliness and smoothness of the silicon wafer surface, as well as the presence of defects such as stains, lines, dents, and chipped edges, are all criteria for judging the quality of silicon wafers. Therefore, when recycling waste silicon wafers, they need to be graded and processed according to their grade.

[0004] In existing technologies, the main difference between Grade A and Grade B silicon wafers lies in the presence of scratches or stains on the surface of the waste silicon wafers, which do not affect their overall performance. Grade C silicon wafers, on the other hand, have obvious dents or cracks on their surface, resulting in lower performance and economic benefits. Therefore, they need to be distinguished during classification. However, while visual inspection can serve as a preliminary check when inspecting Grade C silicon wafers, prolonged visual inspection can cause eye fatigue, leading to the omission of silicon wafers with large dents or cracks. This increases the workload of instrument inspection, increases the time required for instrument inspection, and ultimately affects the recycling efficiency of waste silicon wafers. Summary of the Invention

[0005] In view of the problems existing in the prior art, the purpose of this invention is to provide a waste silicon wafer recycling and grading system.

[0006] To solve the above problems, the present invention adopts the following technical solution, which can realize the display of different states of the material surface through probe fluctuation, so as to facilitate the classification and transportation of the material, thereby avoiding the purpose of testing the electrical properties of materials with large dents or cracks through instruments.

[0007] A waste silicon wafer recycling and grading system includes an operating table and a control console disposed on the upper and rear ends of the operating table. The system is characterized in that: a detection component is provided both inside and at the rear end of the operating table, the detection component includes a placement platform slidably connected to the upper inside of the operating table, and a grading component is provided both inside the upper and left sides of the operating table.

[0008] The control console has a detection mechanism inside and on its lower side. A first electric push rod is fixedly installed inside the control panel. A push plate is fixedly connected to the telescopic end of the first electric push rod. A discharge conveyor belt is provided on the front of the control panel.

[0009] The detection mechanism includes a telescopic electric cylinder fixedly connected inside the control console. The telescopic end of the telescopic electric cylinder is fixedly connected to a control box. A first moving groove is provided in the lower part of the control box. A pressure sensor is fixedly installed on the upper side of the inside of the first moving groove. A squeezing disc is slidably connected in the first moving groove. The bottom end of the squeezing disc is fixedly connected to the top end of a first pressure spring. The probe is fixedly connected to the bottom end of the first pressure spring.

[0010] Furthermore, the upper side of the extrusion plate is in extrusion contact with the lower side of the pressure sensor, the first pressure spring is located inside the first moving groove, a servo motor is fixedly installed at the rear end of the control console, an extension rod is fixedly connected to the bottom right side of the placement platform, the fixed block is in extrusion contact with the extension rod after rotation, a transmission component is provided inside the operating table, and a fixed block is provided on the outside of the transmission component.

[0011] Furthermore, the transmission component includes a connecting rod rotatably connected to the right side and center of the inside of the operating table. Both the front and rear ends of the outer side of the connecting rod are fixedly connected to sprockets. A chain is movably connected between the left and right adjacent connecting rods. The output shaft of the operating table is fixedly connected to the right connecting rod. The fixing block is fixedly connected to the outside of the chain. The output end of the servo motor is fixedly connected to the sprocket located on the left side of the rear end.

[0012] Furthermore, the inside and front of the operating table are provided with a material ejection assembly, which includes a rotating plate that is hinged to the left side of the placement table in a longitudinal array.

[0013] Furthermore, a movable groove is provided on the lower side of the rotating plate, and a movable block is slidably connected inside the movable groove. A first magnetic block is fixedly installed on the inclined surface of the lower side of the movable block. A second pressure spring is fixedly connected between the upper end of the movable block and the movable groove, and the other end of the second pressure spring is fixedly connected inside the movable groove. A limit groove is provided on the right side of the interior of the placement platform, and there are multiple limit grooves. After the rotating plate rotates, the movable groove corresponds to the limit groove. After the movable groove corresponds to the limit groove, the movable block is inserted into the limit groove. A second moving groove is provided on the right side of the interior of the placement platform. The second moving groove is connected to multiple limit grooves. A push column is slidably connected inside the second moving groove. The push column is "E" shaped. After the push column moves to the left, it is inserted into the limit groove. A second electric push rod is fixedly connected to the upper part of the right side of the interior of the operating platform, and the telescopic end of the second electric push rod is fixedly connected to the push column. The first electric push rod, the second electric push rod, the pressure sensor, and the control console are all electrically connected to an external power supply.

[0014] Furthermore, the operating table is provided with a material guiding assembly, which includes a first collection cavity opened on the lower side of the operating table. The lower side of the first collection cavity is inclined. A second magnetic block is fixedly connected to the left side of the push column, and there are multiple second magnetic blocks. After the second magnetic block moves to the left, it slides into the limiting groove, and the first magnetic block and the second magnetic block are magnetically attracted to each other.

[0015] Furthermore, the operating platform is equipped with a grading component, which includes a feeding conveyor belt located on the left side of the operating platform. The upper side of the operating platform is provided with a discharge slope, and the surface of the discharge slope is provided with multiple through holes. The lower side of the operating platform is provided with a second collection chamber, and the multiple through holes are connected to the second collection chamber.

[0016] Furthermore, the operating table is provided with a deceleration component, which includes a guide groove on the upper side of the operating table. The guide groove is connected to the second collection cavity. After the placement table moves to the left, it passes through the guide groove and inserts into the second collection cavity.

[0017] Furthermore, the upper interior of the control panel is provided with a partition component, which includes an embedded groove located at the center of the upper interior of the control panel.

[0018] Furthermore, a movable frame is slidably connected inside the embedding groove, and a support block is slidably connected to the upper side of the movable frame. A third pressure spring is fixedly connected in a longitudinal linear array between the lower end of the support block and the movable frame. A fourth pressure spring is fixedly connected in a longitudinal linear array between the left side of the movable frame and the embedding groove. A buffer pad is fixedly connected to the upper inclined surface of the support block. Movable strips are fixedly connected to both the front and rear ends of the upper right side of the placement platform. After the two movable strips move to the left, they press and contact the left side of the movable frame.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] (1) The present invention determines the surface state of the material by setting a probe that can generate up and down fluctuations, and finally classifies the material. When the surface of the material is detected, the probe will show different states according to the surface state of the material. The material being detected will be sent to different positions after being detected by the probe, so as to facilitate the classification and transportation of the material. This avoids the visual fatigue caused by long-term visual inspection, which may lead to the omission of silicon wafers with large dents or cracks. This reduces the workload of instrument detection and effectively improves the recycling efficiency of waste silicon wafers.

[0021] (2) The present invention can quickly discharge the material that has been detected to have defects by setting a rotating plate. After a large dent or crack is detected on the surface of the material, the locking between the rotating plate and the placement table will be released, so that the material being tested can fall directly from above the placement table into the storage cavity. The rapid discharge of the material can ensure the detection efficiency of subsequent materials and avoid the re-mixing of materials with no surface damage or minor damage, so as to achieve the purpose of rapid grading of materials of different quality.

[0022] (3) The present invention provides a rotatable rotating plate that is tilted after the restriction is lifted and guides the material. Since the rotating plate is tilted after the lock with the placement table is released, the material can slide smoothly from above the rotating plate into the first collection chamber, so as to avoid the material getting stuck and obstructed during the feeding process. At the same time, it reduces the speed of the material sliding into the first collection chamber and prevents the material from being damaged. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0025] Figure 3 This is a cross-sectional view of the operating table of the present invention;

[0026] Figure 4This is a schematic diagram of the placement platform of the present invention;

[0027] Figure 5 This is a cross-sectional view of the guide groove of the present invention;

[0028] Figure 6 This is a cross-sectional view of the placement platform of the present invention;

[0029] Figure 7 This is a cross-sectional view of the second collecting cavity of the present invention;

[0030] Figure 8 This is a cross-sectional view of the control box of the present invention.

[0031] Explanation of the labels in the diagram:

[0032] 1. Operating table; 11. Control console; 111. Telescopic electric cylinder; 2. Detection component; 21. Servo motor; 22. Transmission component; 221. Sprocket; 222. Chain; 223. Connecting rod; 23. Fixing block; 24. Placement platform; 241. Extension rod; 25. Detection mechanism; 251. Control box; 252. First moving groove; 253. Pressure sensor; 254. First pressure spring; 255. Extrusion plate; 256. Probe; 26. First electric push rod; 27. Push plate; 28. Unloading assembly; 281. Rotating plate; 282. Movable groove; 283. Movable block; 284. First magnetic block; 28 5. Second pressure spring; 286. Limiting groove; 287. Second moving groove; 288. Push column; 289. Second electric push rod; 2891. Discharge conveyor belt; 29. ​​Material guiding assembly; 291. First collecting chamber; 292. Second magnetic block; 3. Grading component; 31. Feeding conveyor belt; 32. Discharge slope; 33. Through hole; 34. Second collecting chamber; 35. Slowing component; 351. Guide groove; 36. Separating component; 361. Embedded groove; 362. Moving frame; 363. Support block; 364. Third pressure spring; 365. Fourth pressure spring; 366. Moving bar; 367. Buffer pad. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0034] Please see Figures 1 to 8A waste silicon wafer recycling and grading system includes an operating table 1 and a control console 11 located at the upper rear end of the operating table 1. The system is characterized in that: a detection component 2 is provided inside and at the rear end of the operating table 1, the detection component 2 includes a placement platform 24 slidably connected to the upper inside of the operating table 1, and a grading component 3 is provided inside the upper and left sides of the operating table 1.

[0035] The control panel 11 has a detection mechanism 25 inside and on the lower side. The control panel 1 has a first electric push rod 26 fixedly installed inside. The extension end of the first electric push rod 26 is fixedly connected to a push plate 27. The control panel 1 has a discharge conveyor belt 2891 on the front.

[0036] The upper side of the extrusion plate 255 is in extrusion contact with the lower side of the pressure sensor 253. The first pressure spring 254 is located inside the first moving groove 252. The rear end of the control console 11 is fixedly installed with a servo motor 21. The bottom right side of the placement platform 24 is fixedly connected with an extension rod 241. After the fixed block 23 rotates, it is in extrusion contact with the extension rod 241. The inside of the operating table 1 is provided with a transmission component 22. The outside of the transmission component 22 is provided with a fixed block 23.

[0037] The testing mechanism 25 includes a telescopic electric cylinder 111 fixedly connected inside the control console 11. The telescopic end of the telescopic electric cylinder 111 is fixedly connected to a control box 251. A first moving groove 252 is provided in the lower part of the inside of the control box 251. A pressure sensor 253 is fixedly installed on the upper side of the inside of the first moving groove 252. A squeezing disc 255 is slidably connected in the first moving groove 252. The bottom end of the squeezing disc 255 is fixedly connected to the top end of the first pressure spring 254. A probe 256 is fixedly connected to the bottom end of the first pressure spring 254.

[0038] The transmission component 22 includes a connecting rod 223 rotatably connected to the right side and center of the inside of the operating table 1. Both the front and rear ends of the outer side of the connecting rod 223 are fixedly connected to sprockets 221. A chain 222 is movably connected between the left and right adjacent connecting rods 223. The output shaft of the operating table 1 is fixedly connected to the right connecting rod 223. A fixing block 23 is fixedly connected to the outer side of the chain 222. The output end of the servo motor 21 is fixedly connected to the sprocket 221 located on the left side of the rear end.

[0039] By adopting the above technical solution, the material to be tested is first conveyed to the top of the placement platform 24 by the grading component 3. At the same time, the servo motor 21 on the back of the operating table 1 drives the transmission component 22 to run slowly. Since a single chain 222 is sleeved on the outside of multiple sprockets 221, and two corresponding sprockets 221 are connected by a connecting rod 223, when the servo motor 21 drives one of the sprockets 221 to rotate, the sprocket 221 will drive the fixing block 23 to start rotating through the chain 222. After the material comes into contact with the placement platform 24, the fixing block 23 will push the extension rod 241 on the right side of the placement platform 24, so that the placement platform 24 carries the material and moves linearly to the left. At the same time, the telescopic electric cylinder 1... 11. Push the control box 251 downwards so that the probe 256 extending from below will first contact the material. After contact with the material, the probe 256 will move further downwards under the push of the electric cylinder 111, thereby compressing the first spring 254. As the material continues to move, if there are no dents or cracks on the material surface, the probe 256 will remain stable on the upper surface of the material. After the material detection is completed, the control console 11 will activate the first electric push rod 26 to push the material with the help of the push plate 27, causing the material to slide out of the placement table 24. If the probe 256 contacts a dent or crack on the material surface, the probe 256 will extend into the dent or crack under the push of the first spring 254. In the process, after the probe 256 crosses the dent or crack, it will press against the surface of the material again, causing the probe 256 to drive the first spring 254 back into the first moving groove 252. This results in the probe 256 oscillating vertically with the placement platform 24, meaning the probe 256 will move up and down inside the first moving groove 252. As the probe 256 moves up and down, the first pressure spring 254, which is fixed to the probe 256, will first extend and then retract. The extrusion plate 255, which is always in contact with the pressure sensor 253, begins to apply pressure to the pressure sensor 253 with the help of the pressure provided by the first pressure sensor 253. When the pressure sensed by the pressure sensor 253 decreases, it will transmit pressure to the pressure sensor 253. The information is sent to the control console 11, and finally, the material is lowered from the placement table 24 by the unloading component 28. After the servo motor 21 rotates in the reverse direction, it can push the placement table 24 back to its original position through another fixing block 23 for the placement of the next material. When the surface of the material is inspected, the probe 256 will show different states according to the surface condition of the material. The material being inspected will be sent to different positions after being inspected by the probe 256, so as to facilitate the classification and transportation of the material. This avoids the omission of silicon wafers with large dents or cracks due to visual fatigue caused by long-term visual inspection, reduces the workload of instrument inspection, and effectively improves the recycling efficiency of waste silicon wafers.

[0040] like Figures 1 to 6As shown, the inside and front of the operating table 1 are provided with a material ejection assembly 28, which includes a rotating plate 281 that is hinged to the left side of the placement table 24 in a longitudinal array.

[0041] A movable groove 282 is provided on the lower side of the rotating plate 281. A movable block 283 is slidably connected inside the movable groove 282. A first magnetic block 284 is fixedly installed on the inclined surface on the lower side of the movable block 283. A second pressure spring 285 is fixedly connected between the upper end of the movable block 283 and the movable groove 282. The other end of the second pressure spring 285 is fixedly connected inside the movable groove 282. A limit groove 286 is provided on the right side of the interior of the placement platform 24. There are multiple limit grooves 286. After the rotating plate 281 rotates, the movable groove 282 corresponds to the limit groove 286. After the movable groove 282 corresponds to the limit groove 286, the movable block 283... 83 Insert the limiting groove 286. The inner right side of the placement platform 24 is provided with a second moving groove 287. The second moving groove 287 is connected to multiple limiting grooves 286. A push column 288 is slidably connected in the second moving groove 287. The push column 288 is "E" shaped. After the push column 288 moves to the left, it is inserted into the limiting groove 286. The upper part of the inner right side of the operating platform 1 is fixedly connected to a second electric push rod 289. The telescopic end of the second electric push rod 289 is fixedly connected to the push column 288. The first electric push rod 26, the second electric push rod 289, the pressure sensor 253 and the control console 11 are all electrically connected to an external power supply.

[0042] By adopting the above technical solution, when the probe 256 fluctuates up and down, the control console 11 will control the second electric push rod 289 to push the push column 288. As the push column 288 slides from the second moving groove 287 into the limiting groove 286, the movable block 283, which was originally inserted into the limiting groove 286, will retract into the movable groove 282 opened inside the rotating plate 281. After the rotating plate 281 loses the support from the movable block 283 and the limiting groove 286, the rotating plate 281, which is hinged inside the placement platform 24, will start to rotate clockwise due to the weight of the material and enter the first collection chamber 291 together. Finally, the material is collected in the first collection chamber. When the placement platform 24 starts to reset, if the rotating plate 281 has entered the first collection chamber 291, the placement platform 24, which moves to the left, will drive the rotating plate 281 to move clockwise. Moving to the left, the rotating plate 281 will gradually merge back with the placement platform 24. When the movable block 283 contacts the placement platform 24 again, it will contact it through the inclined surface and then be gradually pushed into the movable groove 282. When the movable groove 282 aligns with the limiting groove 286, the second pressure spring 285 inside the movable groove 282 will push the movable block 283, causing the movable block 283 to re-insert into the limiting groove 286. Since the locking between the rotating plate 281 and the placement platform 24 will be released after a large dent or crack is detected on the material surface, the material being tested can fall directly from above the placement platform 24 into the receiving cavity. The rapid discharge of the material can ensure the efficiency of subsequent material testing and avoid the re-mixing of materials with no surface damage or minor damage, so as to achieve the purpose of rapid grading of materials of different qualities.

[0043] like Figures 2 to 6 As shown, the operating table 1 is equipped with a material guiding assembly 29. The material guiding assembly 29 includes a first collection cavity 291 opened on the lower side of the operating table 1. The lower side of the first collection cavity 291 is inclined. A second magnetic block 292 is fixedly connected to the left side of the push column 288. There are multiple second magnetic blocks 292. After the second magnetic block 292 moves to the left, it slides into the limiting groove 286. The first magnetic block 284 and the second magnetic block 292 are magnetically attracted to each other.

[0044] By adopting the above technical solution, firstly, as the push rod approaches the movable block 283, the magnetic field generated by the second magnetic block 292 fixed to the push rod will attract the first magnetic block 284 fixed to the movable block 283. After the movable block 283 is completely pushed out of the limiting groove 286, the rotating plate 281 will start to rotate clockwise due to the weight of the material and its own weight. When the movable block 283 just leaves the limiting groove 286, the rotation speed of the rotating plate 281 will decrease slightly because the first magnetic block 284 and the second magnetic block 292 are close together. As the two gradually move away, at the same time, the servo motor 21 has started to rotate in the opposite direction, and the other fixing block 23 of the chain 222 will be on the other side of the extension rod 241. The push causes the placement platform 24 to gradually move to the left. After the rotating plate 281 rotates, its lower part will contact the edge of the inner wall of the first collection chamber 291, thus supporting the clockwise rotating plate 281. At this time, the material will slide into the first collection chamber 291 with the help of the inclined rotating plate 281. Since the rotating plate 281 can be in an inclined state with the help of the side wall of the first collection chamber 291 after it is released from the locking of the placement platform 24, the material can smoothly slide into the first collection chamber 291 from above the rotating plate 281, so as to avoid the material getting stuck or obstructed during the feeding process. At the same time, it reduces the speed of the material sliding into the first collection chamber 291, preventing the material from being damaged secondary.

[0045] like Figure 3 As shown, the operating table 1 is equipped with a grading component 3 inside. The grading component 3 includes a feeding conveyor belt 31 located on the left side of the operating table 1. A discharge slope 32 is provided on the upper side of the operating table 1. Through holes 33 are provided through the surface of the discharge slope 32. There are multiple through holes 33. A second collection chamber 34 is provided on the lower side of the interior of the operating table 1. All the multiple through holes 33 are connected to the second collection chamber 34.

[0046] By adopting the above technical solution, the material to be tested is first conveyed by the feeding conveyor belt 31. When the material enters the area of ​​the discharge slope 32, the smaller materials will fall into the second collection chamber 34 through the through hole 33, and the remaining materials will be blocked by the separator component 36. Finally, the material is placed and tested through the placement table 24. Since the smaller materials can be screened out first when the material sliding down the discharge slope 32 passes through the through hole 33, the detection efficiency of the material can be improved, and the unqualified materials can be removed in advance, so as to achieve the purpose of rapid classification of the material again.

[0047] like Figure 3 , Figure 5 and Figure 7 As shown, the operating table 1 is provided with a slowing component 35. The slowing component 35 includes a guide groove 351 opened on the upper side of the operating table 1. The guide groove 351 is connected to the second collection chamber 34. After the placement table 24 moves to the left, it passes through the guide groove 351 and is inserted into the second collection chamber 34.

[0048] By adopting the above technical solution, when small materials enter the second collection chamber 34 through the through hole 33, the placement platform 24 inserted into the second collection chamber 34 through the guide groove 351 can collect the materials. After the placement platform 24 is pushed to the right, the material above the placement platform 24 can be scraped off at the junction of the second collection chamber 34 and the guide groove 351. Since the materials falling into the second collection chamber 34 are briefly collected by the placement platform 24, it can prevent the materials from breaking due to mutual collision and raising particles and powder after directly entering the second collection chamber 34. This effectively prevents the remaining materials from being contaminated with particles and powder, thus affecting the detection efficiency of the probe 256, and at the same time avoids the contamination of the working patients by particles and powder.

[0049] like Figures 5 to 7 As shown, the upper interior of the control panel 1 is provided with a partition component 36, which includes an embedded groove 361 located at the center of the upper interior of the control panel 1.

[0050] A movable frame 362 is slidably connected inside the embedded groove 361. A support block 363 is slidably connected to the upper side of the movable frame 362. A third pressure spring 364 is fixedly connected in a longitudinal linear array between the lower end of the support block 363 and the movable frame 362. A fourth pressure spring 365 is fixedly connected in a longitudinal linear array between the left side of the movable frame 362 and the embedded groove 361. A buffer pad 367 is fixedly connected to the upper inclined surface of the support block 363. Movable strips 366 are fixedly connected to both the front and rear ends of the upper right part of the placement platform 24. After the two movable strips 366 move to the left, they press and contact the left side of the movable frame 362.

[0051] By adopting the above technical solution, when a large material is blocked by the moving frame 362 and the support block 363, if the placement platform 24 is still inserted into the second collection chamber 34, the moving bar 366 above the placement platform 24 will push the moving frame 362, causing the moving frame 362 to gradually enter the embedding groove 361 and squeeze the fourth pressure spring 365. At the same time, the moving frame 362, which is gradually retracting into the embedding groove 361, will squeeze the support block 363 with the help of the discharge slope 32, causing the support block 363 to retract deep into the moving frame 362 until the moving frame 362 is completely inside the embedding groove 361. At this time, the support block 363 exerts pressure on the third pressure spring 365 inside the moving frame 362. The force spring 364 compresses the material, causing it to lose contact with the support block 363 and the moving obstruction, eventually sliding onto the placement platform 24. After the placement platform 24 carries the material away, the fourth pressure spring 365 pushes the moving frame 362, causing it to reset. Inside the moving frame 362, the third pressure spring 364 pushes the support block 363 upward, causing the raised support block 363 and the moving frame 362 to re-separate the material. This process not only removes smaller materials but also blocks those that meet the requirements for subsequent testing. The batch separation of materials ensures testing efficiency and avoids the impact of multiple materials moving simultaneously on the overall testing efficiency.

[0052] Working principle: First, when the material enters the area of ​​the discharge slope 32 through the feeding conveyor belt 31, smaller materials will fall into the second collection chamber 34 through the through hole 33. The placement platform 24, which is inserted into the second collection chamber 34 through the guide groove 351, can collect the material. When the placement platform 24 is pushed to the right, the material above the placement platform 24 at the junction of the second collection chamber 34 and the guide groove 351 can be scraped off. When larger materials are blocked by the moving frame 362 and the support block 363, if the placement platform 24 is still inserted into the second collection chamber 34, the moving bar 366 above the placement platform 24 will push the moving frame 362, causing the moving frame 362 to gradually enter the embedded groove 361 and exert pressure on the fourth pressure. The force spring 365 compresses the material, while the moving frame 362, which gradually retracts into the embedding groove 361, compresses the support block 363 with the help of the feeding ramp 32, causing the support block 363 to retract deep into the moving frame 362 until the moving frame 362 is completely inside the embedding groove 361. At this time, the support block 363 compresses the third pressure spring 364 inside the moving frame 362, and the material loses its resistance from the support block 363 and the moving obstruction, eventually sliding onto the placement table 24. After the placement table 24 carries the material away, the fourth pressure spring 365, in conjunction with the third pressure spring 364, resets the support block 363 and the moving frame 362. Then, the servo motor 21 on the back of the operating table 1 is activated, which drives the transmission component 22 to move slowly. After motor 21 drives one of the sprockets 221 to rotate, the sprocket 221 will drive the fixed block 23 to start rotating via chain 222. After the material contacts the placement platform 24, the fixed block 23 will push the extension rod 241 on the right side of the placement platform 24, causing the placement platform 24 to move linearly to the left carrying the material. At the same time, the telescopic electric cylinder 111 pushes the control box 251 downward, and the probe 256 extending from below the control box 251 will first contact the material. If there are no dents or cracks on the surface of the material, the probe 256 will remain stable on the upper surface of the material. After the material detection is completed, the control console 11 will activate the first electric push rod 26 to push the material with the help of the push plate 27, causing the material to slide out of the placement platform 24. If the probe 256... When the probe 256 comes into contact with an indentation or crack on the material surface, it will move up and down inside the first moving groove 252. The first pressure spring 254 fixed to the probe 256 will be compressed. The extrusion disc 255, which is in contact with the pressure sensor 253, will begin to apply pressure to the pressure sensor 253 with the help of the pressure provided by the first pressure sensor 253. When the pressure on the pressure sensor 253 changes, it will transmit information to the control console 11. The control console 11 will control the second electric push rod 289 to push the push column 288. As the push column 288 slides from the second moving groove 287 into the limiting groove 286, the movable block 283, which was originally inserted into the limiting groove 286, will retract into the movable groove 282 opened inside the rotating plate 281.After the rotating plate 281 loses its support from the movable block 283 and the limiting groove 286, the rotating plate 281, hinged inside the placement platform 24, will begin to rotate clockwise due to the weight of the material, and will enter the first collection chamber 291 along with it, ultimately collecting the material in the first storage chamber;

[0053] After the servo motor 21 rotates in the reverse direction, it can push the placement platform 24 back to its original position via another fixed block 23 for placing the next material. When the placement platform 24 begins to reset, if the rotating plate 281 has already entered the first collection chamber 291, the leftward-moving placement platform 24 will drive the rotating plate 281 to move to the left as well. At this time, the rotating plate 281 will gradually merge back with the placement platform 24. When the movable block 283 contacts the placement platform 24 again, it will contact it through the inclined surface and then be gradually pushed into the movable groove 282. When the movable groove 282 aligns with the limiting groove 286, the second pressure spring 285 inside the movable groove 282 will push the movable block 283, causing the movable block 283 to re-insert into the limiting groove 286. The magnetic field generated by the second magnetic block 292 fixed by the push rod will attract the first magnetic block 284 fixed by the movable block 283. After the movable block 283 is completely pushed out of the limiting groove 286, the rotating plate 281 will start to rotate clockwise due to the weight of the material and its own weight. When the movable block 283 just leaves the limiting groove 286, the servo motor 21 has started to rotate in the opposite direction, and the other fixed block 23 of the chain 222 will push the other side of the extension rod 241, causing the placement platform 24 to gradually move to the left. After the rotating plate 281 rotates, its lower part will contact the edge of the inner wall of the first collection chamber 291, so that the clockwise rotating plate 281 is supported. At this time, the material will slide into the first collection chamber 291 by means of the inclined rotating plate 281.

[0054] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. A waste silicon wafer recycling and grading system, comprising an operating table (1) and a control console (11) disposed on the upper rear side of the operating table (1), characterized in that: The operation table (1) is provided with a detection component (2) inside and at the rear end. The detection component (2) includes a placement platform (24) that is slidably connected to the upper side inside the operation table (1). The operation table (1) is provided with a grading component (3) on the upper side and the left side inside. The control console (11) is equipped with a detection mechanism (25) inside and below. The operating table (1) is fixedly installed with a first electric push rod (26). The telescopic end of the first electric push rod (26) is fixedly connected with a push plate (27). The front of the operating table (1) is equipped with a discharge conveyor belt (2891). The detection mechanism (25) includes a telescopic electric cylinder (111) fixedly connected inside the control console (11). The telescopic end of the telescopic electric cylinder (111) is fixedly connected to a control box (251). A first moving groove (252) is provided in the lower part of the inside of the control box (251). A pressure sensor (253) is fixedly installed on the upper side of the inside of the first moving groove (252). A pressing plate (255) is slidably connected inside the first moving groove (252). The bottom end of the pressing plate (255) is fixedly connected to the top end of the first pressure spring (254). A probe (256) is slidably connected through the lower side of the inside of the first moving groove (252). The probe (256) is fixedly connected to the bottom end of the first pressure spring (254). The operating table (1) is provided with a material ejection assembly (28) on its interior and front. The material ejection assembly (28) includes a rotating plate (281) that is hinged to the left side of the placement table (24) in a longitudinal array. The rotating plate (281) has a movable groove (282) on its lower side. A movable block (283) is slidably connected inside the movable groove (282). A first magnetic block (284) is fixedly installed on the inclined surface of the lower side of the movable block (283). A second pressure spring (285) is fixedly connected between the upper end of the movable block (283) and the movable groove (282). The other end of the second pressure spring (285) is fixedly connected inside the movable groove (282). A limit groove (286) is opened on the right side inside the placement platform (24). There are multiple limit grooves (286). After the rotating plate (281) rotates, the movable groove (282) corresponds to the limit groove (286). After the movable groove (282) corresponds to the limit groove (286), the movable block... (283) Insert the limiting groove (286). The right side of the placement platform (24) is provided with a second moving groove (287). The second moving groove (287) is connected to multiple limiting grooves (286). A push column (288) is slidably connected in the second moving groove (287). The push column (288) is in the shape of "E". After the push column (288) moves to the left, it is inserted into the limiting groove (286). The upper right side of the operating table (1) is fixedly connected with a second electric push rod (289). The telescopic end of the second electric push rod (289) is fixedly connected to the push column (288). The first electric push rod (26), the second electric push rod (289), the pressure sensor (253) and the control console (11) are all electrically connected to an external power supply.

2. The waste silicon wafer recycling and grading system according to claim 1, characterized in that: The upper side of the extrusion plate (255) is in extrusion contact with the lower side of the pressure sensor (253). The first pressure spring (254) is located inside the first moving groove (252). A servo motor (21) is fixedly installed at the rear end of the control console (11). An extension rod (241) is fixedly connected to the bottom right side of the placement platform (24). A fixing block (23) is provided on the outside of the transmission component (22). After the fixing block (23) rotates, it is in extrusion contact with the extension rod (241). The transmission component (22) is provided inside the operating table (1).

3. The waste silicon wafer recycling and grading system according to claim 2, characterized in that: The transmission component (22) includes a connecting rod (223) rotatably connected to the right side and center of the operating table (1). Both the front and rear ends of the connecting rod (223) are fixedly connected to sprockets (221). A chain (222) is movably connected between the left and right adjacent connecting rods (223). The output shaft of the operating table (1) is fixedly connected to the right connecting rod (223). The fixing block (23) is fixedly connected to the outside of the chain (222). The output end of the servo motor (21) is fixedly connected to the sprocket (221) located on the left rear end.

4. The waste silicon wafer recycling and grading system according to claim 1, characterized in that: The operating table (1) is provided with a material guiding assembly (29). The material guiding assembly (29) includes a first collection chamber (291) opened on the lower side of the operating table (1). The lower side of the first collection chamber (291) is inclined. A second magnetic block (292) is fixedly connected to the left side of the push column (288). There are multiple second magnetic blocks (292). After the second magnetic block (292) moves to the left, it slides into the limiting groove (286). The first magnetic block (284) and the second magnetic block (292) are magnetically attracted to each other.

5. The waste silicon wafer recycling and grading system according to claim 4, characterized in that: The operating table (1) is provided with a grading component (3) inside. The grading component (3) includes a feeding conveyor belt (31) located on the left side of the operating table (1). The upper side of the operating table (1) is provided with a discharge slope (32). The surface of the discharge slope (32) is provided with through holes (33), and there are multiple through holes (33). The lower side of the interior of the operating table (1) is provided with a second collection chamber (34). All of the multiple through holes (33) are connected to the second collection chamber (34).

6. The waste silicon wafer recycling and grading system according to claim 5, characterized in that: The operating table (1) is provided with a slowing component (35). The slowing component (35) includes a guide groove (351) opened on the upper side of the operating table (1). The guide groove (351) is connected to the second collection chamber (34). After the placement table (24) moves to the left, it passes through the guide groove (351) and inserts into the second collection chamber (34).

7. A waste silicon wafer recycling and grading system according to claim 6, characterized in that: The upper interior of the control panel (1) is provided with a partition component (36), which includes an embedded groove (361) located at the center of the upper interior of the control panel (1).

8. The waste silicon wafer recycling and grading system according to claim 7, characterized in that: The inner side of the embedding groove (361) is slidably connected to a movable frame (362). The upper side of the inner side of the movable frame (362) is slidably connected to a support block (363). The lower end of the support block (363) is fixedly connected to the movable frame (362) in a longitudinal linear array with a third pressure spring (364). The left side of the movable frame (362) is fixedly connected to the embedding groove (361) in a longitudinal linear array with a fourth pressure spring (365). The upper inclined surface of the support block (363) is fixedly connected to a buffer pad (367). The front and rear ends of the upper right side of the placement platform (24) are fixedly connected to movable strips (366). After the two movable strips (366) move to the left, they press against the left side of the movable frame (362).

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