Laser bonding wire cutting device for chip detection

Abstract

The invention relates to a laser cutting-off technology, in particular to a laser bonding wire cutting-off device for chip detection, which comprises a workbench and the like, a fixed block is arranged above the workbench, and the fixed block moves through a first linear module mounted on the top surface of the workbench; a laser cutting device used for cutting off a welding wire is installed on the fixing block, and a datum plate is fixedly connected to the top face of the fixing block. The laser cutting device is provided with wiping blocks and other parts, the vertical positions of the wiping blocks are adjusted through the adjusting part, so that one wiping block can make contact with the bottom face of the lens of the laser cutting device, and when tiny impurities or dust on the lens of the laser cutting device needs to be wiped, the second linear module is started; the second linear module drives the moving block to move, so that one wiping block can wipe the lens of the laser cutting device, wiping can be completed in a laser cutting gap, manual wiping is not needed after each time of use, and time and manpower resources are saved.

Description

Technical Field

[0001] The invention relates to laser cutting technology, and in particular to a laser welding line cutting device for chip detection. Background Art

[0002] Bonding wires are a very important component in chip packaging, and their quality directly affects the performance and stability of the chip. During the chip production process, the bonding wires need to be strictly inspected. If the bonding wires are bad, loose, or broken, they need to be cut off and removed from the production line.

[0003] Existing welding wires are cut by laser, and laser cutting is extremely sensitive to tiny impurities or dust. If tiny impurities or dust adhere to the lens, it may affect the focus of the laser beam or cause uneven distribution of beam energy, thereby reducing the cutting accuracy. Therefore, laser cutting has high requirements for the cleanliness of the lens surface. The cleaning of existing laser lenses mainly relies on manual operation, which is not only inefficient and difficult to ensure the degree of cleanliness, but also may cause the production line to stop or delay, thereby affecting the overall production efficiency. In view of this, the present invention proposes a laser welding wire cutting device for chip detection to solve the above-mentioned technical problems. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the background technology, the present invention provides a laser welding line cutting device for chip detection.

[0005] The technical solution is: a laser welding wire cutting device for chip detection, comprising a workbench, a fixed block is arranged above the workbench, the fixed block is moved by a first linear module installed on the top surface of the workbench, a laser cutting device for cutting welding wires is installed on the fixed block, a reference plate is fixedly connected to the top surface of the fixed block, a cleaning component for cleaning the lens of the laser cutting device is installed below the reference plate through an adjusting component, and a transport component for transporting chips is also installed on the top surface of the workbench;

[0006] The cleaning assembly includes a cleaning box mounted on the lens of the laser cutting device, an upper plate and a lower plate are fixedly connected in the cleaning box, the upper plate and the lower plate separate the cleaning box into an upper layer, a middle layer and a lower layer, the middle layer is symmetrically provided with moving blocks with the lens of the laser cutting device as the center, a rotating rod is rotatably connected between the two moving blocks, two wiping blocks are fixedly connected to the rotating rod, the two wiping blocks are symmetrically arranged with the rotating rod as the center, one of the wiping blocks is in contact with the bottom surface of the lens of the laser cutting device, the moving blocks are moved by a second linear module installed in the middle layer, both ends of the rotating rod are fixedly connected with transmission gears, a driving component is provided in the upper layer and cooperates with the transmission gear to drive the rotating rod to rotate.

[0007] As an improvement on the above scheme, the upper plate is symmetrically provided with slide grooves, and the driving component includes a fixed box fixedly connected to the slide groove, a rack is slidably connected in the fixed box, the rack slides into the slide groove and cooperates with the transmission gear to rotate the rotating rod one hundred and eighty degrees, a second electromagnet is fixedly connected to the fixed box, a first electromagnet is arranged directly above the second electromagnet, a first elastic member is arranged between the first electromagnet and the second electromagnet, and the first electromagnet is fixedly connected to the rack.

[0008] As an improvement of the above scheme, a water tank is installed in the upper layer, a socket is provided on the upper plate, a nozzle is installed in the socket, the nozzle is connected to the water tank through a water pump and a pipeline, the water tank is filled with cleaning liquid for cleaning the lens of the laser cutting device, and the nozzle sprays the cleaning liquid so that one of the wiping blocks is soaked.

[0009] As an improvement of the above scheme, a blowing part and a cleaning part are provided in the lower layer, a blowing hole is provided in the blowing part, a nozzle is installed in the blowing hole, a first air pump is installed in the blowing part, the nozzle is connected to the first air pump through a pipeline, the nozzle blows air to blow impurities or dust toward the cleaning part, and there are multiple nozzles, and the multiple nozzles can simultaneously spray gas to form a rectangular wind curtain, and the size of the rectangular wind curtain is larger than the lens of the laser cutting device.

[0010] As an improvement of the above scheme, a temporary storage box is fixedly connected to the upper layer, and the temporary storage box is connected to the cleaning part through a connecting pipe. A second air pump is installed in the upper layer, and the second air pump is connected to the temporary storage box through a pipeline and a one-way valve. A movable door is rotatably connected to the upper end of the connecting pipe, and a torsion spring is provided at the connection between the movable door and the connecting pipe.

[0011] As an improvement of the above-mentioned scheme, the adjusting component includes a motor installed on the top surface of the reference plate, a screw is arranged between the reference plate and the cleaning box, the screw is fixedly connected to the cleaning box, a first bevel gear is rotatably connected to the reference plate, the first bevel gear is threadedly connected to the screw, a second bevel gear is fixedly connected to the output shaft of the motor, and the first bevel gear and the second bevel gear are meshed with each other.

[0012] As an improvement of the above solution, a laser rangefinder is installed on the bottom surface of the reference plate, and the cleaning box is made of stainless steel.

[0013] As an improvement of the above scheme, the transport component includes two fixed plates fixedly connected to the top surface of the workbench, the two fixed plates are provided with movable grooves, a carrier for loading chips is slidably connected in the movable groove, a limiting hole is provided on the carrier, a limiting rod matching the limiting hole is slidably connected to the fixed plate, a third electromagnet is fixedly connected to the fixed plate, the third electromagnet is sleeved on the limiting rod, a fourth electromagnet is fixedly connected to one end of the limiting rod, a second elastic member is provided between the third electromagnet and the fourth electromagnet, a transport component for transporting the carrier is installed between the two fixed plates, and a photoelectric sensor is provided on the outer wall of the cleaning box.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] 1. The present invention is provided with components such as wiping blocks. The upper and lower positions of the wiping blocks are adjusted by adjusting components so that one of the wiping blocks can contact the bottom surface of the lens of the laser cutting device. When it is necessary to wipe tiny impurities or dust on the lens of the laser cutting device, the second linear module is started, and then the second linear module drives the moving block to move, so that one of the wiping blocks can wipe the lens of the laser cutting device. In this way, wiping can be completed quickly in the gap between laser cutting, and there is no need to wipe manually after each use, saving time and human resources.

[0016] 2. The present invention is provided with components such as a transmission gear, a rack and a nozzle. When the wiping block moves to the bottom of the nozzle through the second linear module, the water pump and the nozzle are started, so that one of the wiping blocks can be soaked and adhered with cleaning liquid. Then, the wiping block with cleaning liquid is used to wipe the lens through the second linear module to ensure that the cleaning process is more thorough. When the wet wiping block has finished wiping, the first electromagnet and the second electromagnet are started at the same time, and then the first electromagnet and the second electromagnet are magnetically connected, so that the first elastic member 216 is squeezed, and at the same time, the first electromagnet moves to make the rack slide into the slide groove, and at the same time, the second linear module drives the rotating rod to move, and then the transmission gear is meshed with the rack, and then the transmission gear rotates one hundred and eighty degrees, so that the position of the wet wiping block and the dry wiping block is interchanged, and then the dry wiping block is driven by the second linear module to wipe the water stains on the lens. The exchange of the wet wiping block and the dry wiping block ensures the thoroughness of the lens cleaning and improves the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 2 It is a structural schematic diagram of another viewing angle of the present invention.

[0019] Figure 3 It is a schematic diagram of components such as a reference plate and a laser cutting device of the present invention.

[0020] Figure 4 It is a cross-sectional view of the cleaning box and other components of the present invention.

[0021] Figure 5 It is a schematic diagram of components such as the wiping block and the moving block of the present invention.

[0022] Figure 6 It is an exploded view of the wiping block, the moving block and other components of the present invention.

[0023] Figure 7 It is a cross-sectional view of the upper plate, the nozzle and other components of the present invention.

[0024] Figure 8 It is a cross-sectional view of the first electromagnet and the second electromagnet of the present invention.

[0025] Fig. 9 It is a cross-sectional view of the lower layer of the cleaning box of the present invention.

[0026] Fig.10 It is a cross-sectional view of the cleaning box, temporary storage box and other components of the present invention.

[0027] Fig.11 It is a cross-sectional view of the reference plate, motor and other components of the present invention.

[0028] Fig.12 It is an exploded view of the carrier, fixing plate and other components of the present invention.

[0029] Fig.13 It is a cross-sectional view of the fourth electromagnet and the third electromagnet and other components of the present invention.

[0030] Names of the numbers in the figure: 100-working table, 101-fixed block, 102-first linear module, 103-laser cutting device, 201-reference plate, 202-cleaning box, 2021-upper layer, 2022-middle layer, 2023-lower layer, 2024-blowing part, 2025-cleaning part, 2026-blowing hole, 203-upper plate, 2031-slide groove, 2032-jack, 204-lower plate, 205-moving block, 206-rotating rod, 207-wiping block, 208-second linear module, 211-transmission gear, 212-fixed box, 213-rack, 214-second electromagnet, 215 -first electromagnet, 216-first elastic member, 221-water tank, 222-sprinkler, 231-nozzle, 232-first air pump, 233-temporary storage box, 234-second air pump, 235-movable door, 236-connecting pipe, 241-motor, 242-screw, 243-first bevel gear, 244-second bevel gear, 245-laser rangefinder, 301-fixed plate, 3011-movable slot, 302-carrier, 3021-limiting hole, 303-limiting rod, 304-third electromagnet, 305-fourth electromagnet, 306-second elastic member, 307-transport component, 308-photoelectric sensor. DETAILED DESCRIPTION

[0031] The technical solution is further described below in conjunction with specific embodiments. It should be noted that the words indicating directions such as up, down, left, and right mentioned in this article are only for the position of the structure shown in the corresponding drawings. The serial numbers of the parts in this article, such as first, second, etc., are only used to distinguish the objects described and do not have any order or technical meaning. The words such as connection and coupling in this application include direct and indirect connection (coupling) unless otherwise specified.

[0032] A laser welding wire cutting device for chip detection, such as Figure 1-Figure 13As shown, a workbench 100 is included, a fixed block 101 is arranged above the workbench 100, the fixed block 101 is moved left and right by a first linear module 102 installed on the top surface of the workbench 100, a laser cutting device 103 for cutting the welding wire is installed on the fixed block 101, the laser cutting device 103 is a prior art, and the specific structure includes a laser emitter, a lens body and a lens, wherein the laser emitter is installed on the fixed block 101, the bottom surface of the laser emitter is connected to one end of the lens body, and the other end of the lens body is installed with a lens, and a transport component for transporting chips is installed on the top surface of the workbench 100, it can be known that the chip is transported to a specific position by the transport component, and then the defective welding wire is cut by the laser cutting device 103, before the device cuts the welding wire, the defective chip has been marked by the previous process, so the laser cutting device 103 can be moved to the corresponding position for cutting by the first linear module 102.

[0033] like Figure 2-Figure 10 As shown, a reference plate 201 is fixedly connected to the top surface of the fixed block 101, and a cleaning component for cleaning the lens of the laser cutting device 103 is installed below the reference plate 201 through an adjusting component. The cleaning component includes a cleaning box 202 sleeved on the lens of the laser cutting device 103. The cleaning box 202 is cylindrical, coaxially arranged with the laser cutting device 103, and sleeved on the lens of the laser cutting device 103. An upper plate 203 and a lower plate 204 are fixedly connected in the cleaning box 202. The upper plate 203 and the lower plate 204 separate the cleaning box 202 into an upper layer 2021, a middle layer 2022 and a lower layer 2023. Moving blocks 205 are symmetrically arranged in the middle layer 2022 with the lens of the laser cutting device 103 as the center. A rotating rod 206 is rotatably connected between the two moving blocks 205, and two wiping blocks 207 are fixedly connected to the rotating rod 206. The two wiping blocks 207 are symmetrically arranged with the rotating rod 206 as the center, and one of the wiping blocks 207 is in contact with the bottom surface of the lens of the laser cutting device 103. The moving blocks 205 are moved by the second linear module 208 installed in the middle layer 2022. It can be seen that the upper and lower positions of the wiping blocks 207 are adjusted by adjusting the adjustment components so that one of the wiping blocks 207 can contact the bottom surface of the lens of the laser cutting device 103. When it is necessary to wipe the tiny impurities or dust on the lens of the laser cutting device 103, the second linear module 208 is started, and then the second linear module 208 drives the moving block 205 to move, so that one of the wiping blocks 207 can wipe the lens of the laser cutting device 103. In this way, the wiping can be completed quickly in the gap between laser cutting, and there is no need for manual wiping after each use, saving time and human resources.

[0034] Furthermore, in order to achieve a better cleaning effect, both ends of the rotating rod 206 are fixedly connected with a transmission gear 211, a driving component is arranged in the upper layer 2021 and cooperates with the transmission gear 211 to drive the rotating rod 206 to rotate, and a slide groove 2031 is symmetrically arranged on the upper plate 203, and the driving component includes a fixed box 212 fixedly connected to the slide groove 2031, and a rack 213 is slidably connected in the fixed box 212, and the rack 213 slides into the slide groove 2031 and cooperates with the transmission gear 211 so that the rotating rod 206 can rotate 180 degrees, and a second electromagnet 214 is fixedly connected to the fixed box 212, and a first electromagnet 215 is arranged directly above the second electromagnet 214, and a first electromagnet 215 is arranged between the first electromagnet 215 and the second electromagnet 214. The first elastic member 216 is a spring. The center of the first electromagnet 215 and the second electromagnet 214 is concave. The first elastic member 216 is arranged in the concave part of the first electromagnet 215 and the second electromagnet 214. When the first electromagnet 215 and the second electromagnet 214 are magnetically connected, the first elastic member 216 is squeezed and thus stores elastic potential energy. The first electromagnet 215 is fixedly connected to the rack 213. A water tank 221 is installed in the upper layer 2021. A socket 2032 is arranged on the upper plate 203. A nozzle 222 is installed in the socket 2032. The nozzle 222 is connected to the water tank 221 through a water pump and a pipeline. The water tank 221 is filled with a cleaning liquid for cleaning the lens of the laser cutting device 103. The water tank 221 includes a box body and a water injection port. The box body is connected with the water injection pipe, and the water injection pipe passes through the upper layer 2021 of the cleaning box 202 and extends to the outside, so that it is convenient for the operator to add cleaning liquid into the box body. The box body is connected with the nozzle 222 through a water pump and a pipe. The nozzle 222 sprays the cleaning liquid so that one of the wiping blocks 207 is soaked. It can be seen that when the wiping block 207 moves to the bottom of the nozzle 222 through the second linear module 208, the water pump and the nozzle 222 are started, so that one of the wiping blocks 207 can be soaked and sticked with the cleaning liquid, so that the wiping block 207 becomes a wet wiping block 207, and then the wiping block 207 with the cleaning liquid is used to wipe the lens through the second linear module 208, so as to ensure that the cleaning process is more thorough. When the wet wiping block After wiping 207 is completed, the first electromagnet 215 and the second electromagnet 214 are started at the same time, so that the first electromagnet 215 and the second electromagnet 214 attract each other, and the first electromagnet 215 and the second electromagnet 214 are magnetically connected to squeeze the first elastic member 216, so that the first elastic member 216 is squeezed, and the first elastic member 216 stores elastic potential energy. At the same time, the first electromagnet 215 moves to make the rack 213 slide into the slide groove 2031, and at the same time, the second linear module 208 drives the rotating rod 206 to move, and then the transmission gear 211 is meshed with the rack 213, so that the transmission gear 211 rotates 180 degrees, and then the first electromagnet 215 and the second electromagnet 214 are turned off, so that the first elastic member 216 releases the elastic potential energy.The first electromagnet 215 moves upward, and the rack 213 slides out of the slide slot 2031, and the rack 213 is no longer engaged with the transmission gear 211, so that the wet wiping block 207 and the dry wiping block 207 are interchanged, and then the second linear module 208 drives the dry wiping block 207 to wipe the water stains on the lens. The exchange of the wet wiping block 207 and the dry wiping block 207 ensures the thoroughness of the lens cleaning and improves the cleaning efficiency.

[0035] Furthermore, in order to prevent debris from splashing onto the lens when the laser cutting device 103 is cutting, a blowing part 2024 and a cleaning part 2025 are provided in the lower layer 2023, and a blowing hole 2026 is provided in the blowing part 2024, and a nozzle 231 is installed in the blowing hole 2026, and a first air pump 232 is installed in the blowing part 2024. The nozzle 231 is connected to the first air pump 232 through a pipeline, and the nozzle 231 blows air to blow impurities or dust toward the cleaning part 2025. There are six nozzles 231, and the six nozzles 231 simultaneously eject gas to form a rectangular wind curtain, and the size of the rectangular wind curtain is larger than that of the laser cutting device 103. The lens is large, a temporary storage box 233 is fixedly connected in the upper layer 2021, and the temporary storage box 233 is connected to the cleaning part 2025 through a connecting pipe 236. A second air pump 234 is installed in the upper layer 2021, and the second air pump 234 is connected to the temporary storage box 233 through a pipeline and a one-way valve. The upper end of the connecting pipe 236 is rotatably connected to a movable door 235, and a torsion spring is provided at the connection between the movable door 235 and the connecting pipe 236. It can be seen that when the laser cutting device 103 is cutting, cutting debris will splash onto the lens, causing scratches on the lens surface. The present device can solve this problem. When the laser cutting device 103 is cutting, the first An air pump 232 and a nozzle 231 are provided, and the nozzle 231 ejects gas to form a rectangular wind curtain, which can be blown into the cleaning portion 2025. When debris splashes, the debris will be intercepted by the rectangular wind curtain, and then the debris is blown into the cleaning portion 2025 under the guidance of the rectangular wind curtain. At the same time, the second air pump 234 is started, and the second air pump 234 sucks air to generate negative pressure in the temporary storage box 233, so that the movable door 235 rotates, and then the movable door 235 opens, and then the cleaning portion 2025 is connected with the temporary storage box 233. The torsion spring stores elastic potential energy, and then the debris is sucked into the temporary storage box 233 under the action of the negative pressure. This can protect the lens surface from being scratched by debris. At the same time, through the guidance of the rectangular wind curtain, the debris is blown into the cleaning section 2025 to ensure that the debris does not spread to other components or areas. Under the action of the second air pump 234, the debris is sucked into the temporary storage box 233 under the action of negative pressure, thereby improving the debris cleaning efficiency. When the laser cutting device 103 completes cutting, the first air pump 232 and the second air pump 234 are turned off, and the torsion spring releases the elastic potential energy, causing the movable door 235 to rotate, and the movable door 235 blocks the connection between the cleaning section 2025 and the temporary storage box 233, thereby preventing the debris from flowing back.

[0036] like Figure 11-13As shown, the adjusting component includes a motor 241 installed on the top surface of the reference plate 201, a screw 242 is arranged between the reference plate 201 and the cleaning box 202, the screw 242 is fixedly connected to the cleaning box 202, a first bevel gear 243 is rotatably connected to the reference plate 201, the first bevel gear 243 is threadedly connected to the screw 242, a second bevel gear 244 is fixedly connected to the output shaft of the motor 241, the first bevel gear 243 and the second bevel gear 244 are meshed with each other, a laser rangefinder 245 is installed on the bottom surface of the reference plate 201, the cleaning box 202 is made of stainless steel, and stainless steel can well reflect the laser of the laser rangefinder 245. It can be seen that since the position of the lens is known at the moment the laser cutting device 103 is installed, the laser rangefinder 245 can be used as the reference plate 201 Starting point, measure the distance between the cleaning box 202 and the reference plate 201, and because the positions of the middle layer 2022 and the wiping block 207 in the cleaning box 202 are fixed, it is only necessary to adjust the distance between the cleaning box 202 and the reference plate 201 to make the wiping block 207 contact with the lens of the laser cutting device 103, start the motor 241, and then the output shaft of the motor 241 drives the second bevel gear 244 to rotate, and the second bevel gear 244 drives the first bevel gear 243 to rotate through meshing transmission, and then the first bevel gear 243 rotates to move the screw 242, and then the position of the cleaning box 202 can be adjusted, and then the wiping block 207 can be made to contact with the lens of the laser cutting device 103, so that the position of the wiping block 207 can be automatically adjusted without manual intervention, saving operation time.

[0037] Furthermore, the transport assembly includes two fixed plates 301 fixedly connected to the top surface of the workbench 100, the two fixed plates 301 are provided with movable grooves 3011, a carrier 302 for loading chips is slidably connected in the movable grooves 3011, three limiting holes 3021 are symmetrically provided on the carrier 302, a limiting rod 303 matching with the limiting holes 3021 is slidably connected to the fixed plate 301, a third electromagnet 304 is fixedly connected to the fixed plate 301, the third electromagnet 304 is sleeved on the limiting rod 303, and one end of the limiting rod 303 is fixedly connected to a fourth electromagnet 305, a second elastic member 306 is arranged between the third electromagnet 304 and the fourth electromagnet 305, and the second elastic member 306 is a spring. A transport component 307 for transporting the carrier 302 is installed between the two fixed plates 301. The transport component 307 is specifically a conveyor belt component, which specifically includes a conveyor belt and a conveyor motor. It is a prior art. A photoelectric sensor 308 is arranged on the outer wall of the cleaning box 202. It can be seen that after the transport component 307 transports the carrier 302 loaded with chips to a specific position, the photoelectric sensor 308 senses the carrier 302, and then The signal is transmitted to the external control system, thereby closing the transport component 307, and simultaneously starting the third electromagnet 304 and the fourth electromagnet 305, the third electromagnet 304 and the fourth electromagnet 305 attract each other, and then the third electromagnet 304 and the fourth electromagnet 305 are magnetically connected, and then the fourth electromagnet 305 drives the limit rod 303 to slide, and then the limit rod 303 slides into the limit hole 3021, and then the limit rod 303 fixes the carrier 302, and the second elastic member 306 stores elastic potential energy, and then the defective welding line is cut by the laser cutting device 103. Cutting. Before the device cuts the welding wire, the chip that has been marked as defective by the previous process can be moved to the corresponding position for cutting through the first linear module 102. After the cutting is completed, the third electromagnet 304 and the fourth electromagnet 305 are turned off, and then the second elastic member 306 releases the elastic potential energy, so that the limit rod 303 no longer restricts the carrier 302. In this way, the carrier 302 is accurately positioned by the third electromagnet 304, the fourth electromagnet 305 and the limit rod 303 to avoid incorrect cutting due to inaccurate position.

[0038] The above description is only an example of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention should be included in the protection scope of the present invention. The contents not elaborated in detail in the present invention belong to the existing technologies known to those skilled in the art.

Claims

1. A laser welding line cutting device for chip detection, comprising a workbench (100), a fixed block (101) is arranged above the workbench (100), the fixed block (101) is moved by a first linear module (102) installed on the top surface of the workbench (100), and a laser cutting device (103) for cutting the welding line is installed on the fixed block (101), characterized in that: A reference plate (201) is fixedly connected to the top surface of the fixed block (101), a cleaning component for cleaning the lens of the laser cutting device (103) is installed below the reference plate (201) through an adjusting component, and a transport component for transporting chips is also installed on the top surface of the workbench (100); The cleaning assembly comprises a cleaning box (202) sleeved on the lens of the laser cutting device (103), an upper plate (203) and a lower plate (204) being fixedly connected in the cleaning box (202), the upper plate (203) and the lower plate (204) dividing the cleaning box (202) into an upper layer (2021), a middle layer (2022) and a lower layer (2023), the middle layer (2022) being symmetrically provided with moving blocks (205) with the lens of the laser cutting device (103) as the center, a rotating rod (206) being rotatably connected between the two moving blocks (205), the rotating rod (206) Two wiping blocks (207) are fixedly connected to the rotating rod (206), and the two wiping blocks (207) are symmetrically arranged with the rotating rod (206) as the center, one of the wiping blocks (207) contacts the bottom surface of the lens of the laser cutting device (103), and the moving blocks (205) are moved by the second linear module (208) installed in the middle layer (2022). Both ends of the rotating rod (206) are fixedly connected with a transmission gear (211), and a driving component is arranged in the upper layer (2021) to cooperate with the transmission gear (211) to drive the rotating rod (206) to rotate.

2. A laser welding wire cutting device for chip detection as claimed in claim 1, characterized in that: The upper plate (203) is symmetrically provided with a slide groove (2031), and the driving component comprises a fixed box (212) fixedly connected to the slide groove (2031), a rack (213) is slidably connected in the fixed box (212), and the rack (213) slides into the slide groove (2031) and cooperates with the transmission gear (211) to make the rotating rod (206) rotate one hundred and eighty degrees, and a second electromagnet (214) is fixedly connected to the fixed box (212), and a first electromagnet (215) is arranged directly above the second electromagnet (214), and a first elastic member (216) is arranged between the first electromagnet (215) and the second electromagnet (214), and the first electromagnet (215) is fixedly connected to the rack (213).

3. A laser welding wire cutting device for chip detection as claimed in claim 2, characterized in that: A water tank (221) is installed in the upper layer (2021), a socket (2032) is provided on the upper plate (203), a nozzle (222) is installed in the socket (2032), the nozzle (222) is connected to the water tank (221) through a water pump and a pipeline, the water tank (221) is filled with cleaning liquid for cleaning the lens of the laser cutting device (103), and the nozzle (222) sprays the cleaning liquid so that one of the wiping blocks (207) is soaked.

4. A laser welding wire cutting device for chip detection as claimed in claim 3, characterized in that: The lower layer (2023) is provided with a blowing section (2024) and a cleaning section (2025), the blowing section (2024) is provided with a blowing hole (2026), a nozzle (231) is installed in the blowing hole (2026), a first air pump (232) is installed in the blowing section (2024), the nozzle (231) is connected to the first air pump (232) through a pipeline, the nozzle (231) blows air to blow impurities or dust toward the cleaning section (2025), a plurality of nozzles (231) are provided, and the plurality of nozzles (231) eject gas simultaneously to form a rectangular wind curtain, the size of the rectangular wind curtain being larger than the lens of the laser cutting device (103).

5. A laser welding wire cutting device for chip detection as claimed in claim 4, characterized in that: A temporary storage box (233) is fixedly connected to the upper layer (2021), and the temporary storage box (233) is connected to the cleaning part (2025) through a connecting pipe (236). A second air pump (234) is installed in the upper layer (2021), and the second air pump (234) is connected to the temporary storage box (233) through a pipeline and a one-way valve. A movable door (235) is rotatably connected to the upper end of the connecting pipe (236), and a torsion spring is provided at the connection between the movable door (235) and the connecting pipe (236).

6. A laser welding wire cutting device for chip detection as claimed in claim 5, characterized in that: The adjusting component comprises a motor (241) mounted on the top surface of the reference plate (201); a screw rod (242) is arranged between the reference plate (201) and the cleaning box (202); the screw rod (242) is fixedly connected to the cleaning box (202); a first bevel gear (243) is rotatably connected to the reference plate (201); the first bevel gear (243) is threadedly connected to the screw rod (242); a second bevel gear (244) is fixedly connected to the output shaft of the motor (241); the first bevel gear (243) and the second bevel gear (244) are meshed with each other.

7. A laser welding wire cutting device for chip detection as claimed in claim 6, characterized in that: A laser rangefinder (245) is installed on the bottom surface of the reference plate (201), and the cleaning box (202) is made of stainless steel.

8. A laser welding wire cutting device for chip detection as claimed in claim 7, characterized in that: The transport assembly comprises two fixed plates (301) fixedly connected to the top surface of the workbench (100), the two fixed plates (301) being provided with movable grooves (3011), a carrier (302) for loading chips being slidably connected in the movable grooves (3011), a limiting hole (3021) being provided on the carrier (302), a limiting rod (303) matching with the limiting hole (3021) being slidably connected to the fixed plate (301), and a first fixed plate (301) being fixedly connected to the fixed plate (301). Three electromagnets (304), the third electromagnet (304) is sleeved on the limiting rod (303), one end of the limiting rod (303) is fixedly connected to the fourth electromagnet (305), a second elastic member (306) is arranged between the third electromagnet (304) and the fourth electromagnet (305), a transport component (307) for transporting the carrier (302) is installed between the two fixing plates (301), and a photoelectric sensor (308) is arranged on the outer wall of the cleaning box (202).

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