Preparation method of Mn alloy additive

Abstract

The invention relates to the technical field of alloy additive preparation, in particular to a Mn alloy additive preparation method which comprises the steps that a fluxing agent and a binding agent are added into Mn metal powder to be mixed to obtain Mn alloy additive powder, a pressing die cavity is filled with the Mn alloy additive powder for pulse pressing, and the pressing die cavity is heated for preset heating duration; and demolding the pressed Mn alloy additive, obtaining a temperature attenuation curve of the temperatures of a plurality of preset point locations in the mold pressing cavity along with time, judging whether the preset point locations are powder bonding residue point locations or not, and judging the powder bonding residue type according to the number of the powder bonding residue point locations. In the continuous pressing process, the pressing adjustment mode that the Mn alloy additive powder is refilled into the pressing die cavity for pulse pressing is selected, then the state of powder residues is rapidly detected in the continuous pressing process, the subsequent pressing link is adjusted in time, and the stability of continuous pressing of the manganese alloy additive is improved.

Description

Technical Field

[0001] The invention relates to the technical field of alloy additive preparation, and in particular to a method for preparing a Mn alloy additive. Background Art

[0002] In industrial production, manganese is an important element that can improve the strength, hardness, wear resistance and hardenability of alloys. With the continuous advancement of metallurgical technology, the requirements for alloy quality are constantly increasing, and the quality and performance requirements for manganese alloy additives are also getting higher and higher. Advanced production processes and testing technologies make the production of manganese alloy additives more efficient and accurate, meeting the needs of serving different users.

[0003] The traditional preparation method of Mn alloy additives often faces many problems during the pressing process. On the one hand, due to the characteristics of Mn metal powder itself and the limitations of the existing preparation process, the powder is prone to adhere to the inner wall of the die cavity during the pressing process, which not only affects the quality and appearance of the product, but also may lead to unstable product performance. On the other hand, the current preparation method lacks effective monitoring and solution methods for the powder adhesion problem, and can often only rely on experience for adjustment, which is not only inefficient, but also difficult to ensure the consistency of product quality. Therefore, there is an urgent need for a new preparation method of Mn alloy additives that can effectively monitor and solve the powder adhesion problem and improve product quality and production efficiency.

[0004] For example, Chinese Patent Publication No.: CN116275034A, the invention discloses an alloy powder pressing mold, belongs to the field of powder metallurgy technology, includes an operating table, the upper surface of the operating table is fixedly installed with a support plate and a lower module, the side wall of the support plate is fixedly installed with a fixed plate, one end of the electric telescopic column is fixedly installed with an upper module, and the inner wall of the upper module is provided with an oscillation component; by providing the oscillation component, the movable plate drives the striker to move toward the side of the upper module through the thread on the outer surface, when one end of the movable rod is squeezed with the lower surface of the fixed plate, when the buckle loses the fixation of the movable plate, the striker will be driven by the movable plate to hit the forming block under the action of the spring rod, and the forming block will be automatically hit after each extrusion. With the oscillation of the forming block, the powder attached to its outer surface can be shaken off, so as to avoid the powder attached to the outer surface of the forming block from affecting the subsequent pressing, thereby further improving the success rate of the mold during pressing.

[0005] The prior art still has the following problems: The prior art does not take into account that the manganese alloy additive powder is prone to adhere to the inner wall of the die cavity during the continuous pressing process to produce trace powder residue. The prior art cannot quickly detect the state of powder residue during the continuous pressing process, and cannot adjust the subsequent pressing links in time, affecting the stability of the continuous pressing of the manganese alloy additive. Summary of the invention

[0006] To this end, the present invention provides a method for preparing a Mn alloy additive to overcome the problems in the prior art that the state of powder residue cannot be quickly detected during the continuous pressing process and that the subsequent pressing links cannot be adjusted in time.

[0007] To achieve the above object, the present invention provides a method for preparing a Mn alloy additive, comprising: Adding flux and binder to Mn metal powder and mixing them to obtain Mn alloy additive powder; Filling the Mn alloy additive powder into a die cavity for pulse pressing, heating the die cavity for a preset heating time, and demolding the pressed Mn alloy additive; Obtaining temperature decay curves of the temperature of a plurality of preset points inside the die cavity over time, and calculating the overlap of a plurality of curves based on the temperature decay curves corresponding to the preset points, so as to determine whether the preset points are powder bonding residual points; Determining a powder bonding residue characterization factor according to the number of the powder bonding residue points to determine the powder bonding residue category; The pressing adjustment method of selecting Mn alloy additive powder according to the powder bonding residue category and filling it into the die cavity again for pulse pressing includes: adjusting the pulse frequency of pulse pressing for the Mn alloy additive powder refilled into the die cavity; Or, the die cavity is again filled with Mn alloy additive powder in batches, and each batch of Mn alloy additive powder filled in the die cavity is pulse pressed in batches to obtain the Mn alloy additive; The pulse suppression of each batch lasts for a preset time.

[0008] Furthermore, the preset points include a point at the center of the bottom and several points at the bottom edge of the die cavity.

[0009] Furthermore, the process of determining the curve coincidence degree includes: Obtaining the temperature attenuation curve corresponding to each point selected along the bottom edge and the temperature attenuation curve corresponding to the point at the center position of the bottom; The temperature attenuation curve corresponding to the point at the center of the bottom is determined as a reference curve, and the degree of overlap between the temperature attenuation curves at the edge points of the bottom and the temperature attenuation curve is calculated.

[0010] Furthermore, the process of determining whether the preset point is a powder bonding residual point includes: Comparing the curve coincidence with a preset curve coincidence threshold; If the curve overlap is less than the curve overlap threshold, the point on the bottom edge of the die cavity corresponding to the curve overlap is determined to be a powder bonding residual point.

[0011] Further, the process of determining the powder bonding residue characterization factor includes: Obtaining the number of the powder bonding residual points and the total number of the preset points; Calculating the ratio of the number of the powder bonding residual points to the total number; The ratio is determined as the powder bonding residue characterization factor.

[0012] Furthermore, the process of determining the category of the powder bonding residue includes: Comparing the powder bonding residue characterization factor with a preset powder bonding residue characterization factor reference value; If the powder bonding residue characterization factor is less than or equal to the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue weakly dominant category; If the powder bonding residue characterization factor is greater than the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue strong dominant category.

[0013] Furthermore, the process of selecting the pressing adjustment method includes: If the powder bonding residue category is the powder bonding residue weak dominant category, the pressing adjustment method is selected to adjust the pulse frequency of the pulse pressing of the Mn alloy additive powder filled into the die cavity again; If the powder bonding residue category is a strongly dominant powder bonding residue category, the pressing adjustment method is selected to refill the die cavity with Mn alloy additive powder in batches, and pulse press each batch of Mn alloy additive powder filled in the die cavity in batches, and the pulse pressing of each batch lasts for a preset time to obtain the Mn alloy additive.

[0014] Furthermore, the pulse frequency of pulse pressing of the Mn alloy additive powder refilled into the die cavity is adjusted according to the average value of the curve overlap corresponding to each powder bonding residual point, and the pulse frequency is negatively correlated with the average value of the curve overlap.

[0015] Furthermore, the process of refilling the die cavity with Mn alloy additive powder in batches further includes: The number of batches for refilling the die cavity with the Mn alloy additive powder is determined according to the standard deviation of the curve coincidence corresponding to each powder bonding residual point, and the number of batches is positively correlated with the standard deviation of the curve coincidence.

[0016] Furthermore, the flux is sodium chloride, and the binder is aluminum dihydrogen phosphate.

[0017] Compared with the prior art, the beneficial effect of the present invention lies in that the present invention fills the mixed Mn alloy additive powder into the die cavity for pulse pressing, heats the die cavity for a preset heating time, demolds the Mn alloy additive obtained by pressing, obtains the temperature decay curve of several preset points inside the die cavity over time, determines whether the preset point is a powder bonding residue point, determines the powder bonding residue category according to the number of powder bonding residue points, selects the Mn alloy additive powder to be filled into the die cavity again for pulse pressing, and thus realizes the rapid detection of the state of powder residue during continuous pressing, timely adjusts the subsequent pressing links, and improves the stability of continuous pressing of manganese alloy additives.

[0018] In particular, the present invention obtains temperature decay curves of the temperature of several preset points inside the die cavity over time. Those skilled in the art can understand that Mn metal powder has a certain heat capacity. When there is powder bonding residue in the die cavity, the different thermal conductivity between the powder and the inner wall of the die cavity makes the temperature decay trend over time at the position where the powder remains different from the temperature decay trend of the material of the inner wall of the die cavity itself. Under the condition of heating the die cavity, the temperature decay curves of the temperature of several preset points over time can be obtained to characterize the powder bonding residue phenomenon at different points in the die cavity, thereby realizing the rapid discovery of the powder residue phenomenon in the pressing process during the continuous pressing process.

[0019] In particular, the present invention selects a point at the center of the bottom and several points at the bottom edge of the die cavity as preset points. It can be understood that the surface of the die cavity at the center of the bottom of the die cavity is smooth, the alloy additive powder is evenly and fully compressed, and it is not easy for the alloy additive powder to remain at this position. The temperature decay curve of this point can represent the temperature change inside the die cavity under the theoretical state. Due to the limitation of the mold geometry at the bottom edge of the die cavity, it is easy to cause uneven internal structure during the pressing process. By selecting the point at the center of the bottom and several points at the bottom edge of the die cavity as preset points, and performing temperature decay comparison, the data representativeness of the powder residue phenomenon during the pressing process is improved.

[0020] In particular, the present invention determines whether a point on the bottom edge of a preset die cavity is a powder bonding residual point by means of the curve overlap of the temperature decay curve. Those skilled in the art can understand that the curve overlap characterizes the powder bonding residual situation of the Mn alloy additive powder at the bottom edge point of the die cavity. The higher the curve overlap, the less obvious the powder bonding residual phenomenon of the Mn alloy additive powder at the bottom edge point of the die cavity corresponding to the curve overlap; the lower the curve overlap, the less obvious the powder bonding residual phenomenon of the Mn alloy additive powder at the bottom edge point of the die cavity corresponding to the curve overlap. Thus, the screening of powder bonding residual points is realized, and the data characterization of the powder residual phenomenon during the pressing process is improved.

[0021] In particular, under the condition that the powder adhesion residue phenomenon of the Mn alloy additive powder is less obvious, the present invention improves the powder residue phenomenon in the die cavity by adjusting the pulse frequency in the pulse pressing process. It can be understood that different pulse frequencies will affect the pressure distribution in the die cavity. By increasing the pulse frequency, the Mn alloy additive powder in the edge area can be subjected to more pressure in a short time, thereby enhancing the compaction effect, ensuring that the Mn alloy additive powder can be fully compacted in the edge area where powder residue is prone to occur, thereby improving the powder residue phenomenon in the die cavity, and further, realizing timely adjustment of subsequent pressing links, thereby improving the stability of continuous pressing of manganese alloy additives.

[0022] In particular, under the condition that the powder adhesion residue phenomenon of the Mn alloy additive powder is more obvious, the present invention fills the Mn alloy additive powder into the die cavity in batches to avoid a large amount of Mn alloy additive powder remaining at the bottom of the die cavity causing uneven pressure distribution of the powder residue in the subsequent pressing process, resulting in local powder agglomeration, and affecting the stability of continuous pressing of the manganese alloy additive. The present invention injects powder in batches and performs multiple pulse pressing. After each powder injection, the powder can be better filled into the mold through pulse pressing, reducing the adverse effect of residual powder agglomerates on the pressure uniformity during the pressing process, making the Mn alloy additive powder more evenly fused inside, thereby achieving timely adjustment of subsequent pressing links and improving the stability of continuous pressing of the manganese alloy additive. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a step diagram of a method for preparing a Mn alloy additive according to an embodiment of the present invention; Figure 2 A schematic diagram of the distribution of several preset points in an embodiment of the present invention; Figure 3 Schematic diagram of temperature attenuation curve at each point of the die cavity according to an embodiment of the present invention; Figure 4A logic flow chart of determining whether a preset point is a powder bonding residual point according to an embodiment of the present invention; Figure 5 A logic flow chart for determining the category of powder bonding residue according to an embodiment of the present invention; In the figure, there is a die cavity 1, a point 2 at the center of the bottom, and a point 3 at the bottom edge of the die cavity. DETAILED DESCRIPTION

[0024] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0025] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0026] It should be noted that, in the description of the present invention, terms such as "upper", "lower", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0027] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] See also Figure 1 As shown, it is a step diagram of a method for preparing a Mn alloy additive according to an embodiment of the present invention. A method for preparing a Mn alloy additive according to the present invention comprises: Step S100, adding flux and binder to Mn metal powder and mixing them to obtain Mn alloy additive powder; Step S200, filling the Mn alloy additive powder into a die cavity for pulse pressing, heating the die cavity for a preset heating time, and demolding the pressed Mn alloy additive; Specifically, the present invention does not limit the process of pulse pressing. The amplitude and pulse frequency of pulse pressing can be set by those skilled in the art according to the pressing process requirements of the Mn alloy additive powder. Preferably, the amplitude of pulse pressing can be in the range of [150, 200], and the unit of interval is MPa. The frequency of pulse pressing can be in the range of [10, 15], and the unit of interval is Hz.

[0029] Specifically, the preset heating time can be set by those skilled in the art according to the pressing process requirements of the Mn alloy additive powder. Preferably, for the preparation of the Mn alloy additive powder, the preset heating time can be set to a value of [10,30], with the interval unit being min. The preset heating time starts at the start time of each pressing process and ends at the end time of each pressing process.

[0030] Specifically, the temperature for heating the die cavity is set to be no higher than the melting points of the Mn metal powder, the binder and the flux. Preferably, the heating temperature may be in the range of [35, 50], with the interval unit being degrees Celsius.

[0031] Step S300, obtaining temperature decay curves of the temperature of a plurality of preset points inside the die cavity over time, and calculating the overlap of a plurality of curves based on the temperature decay curves corresponding to the preset points, so as to determine whether the preset points are powder bonding residual points; Specifically, the present invention obtains the temperature decay curve of several preset points inside the die cavity as a function of time. Those skilled in the art can understand that Mn metal powder has a certain heat capacity. When there is powder bonding residue in the die cavity, the different thermal conductivity between the powder and the inner wall of the die cavity makes the temperature decay trend over time at the position where the powder remains different from the temperature decay trend of the material of the inner wall of the die cavity itself. Under the condition of heating the die cavity, the temperature decay curve of several preset points as a function of time can be obtained to characterize the powder bonding residue phenomenon at different points in the die cavity, thereby realizing the rapid discovery of the powder residue phenomenon in the pressing process during the continuous pressing process.

[0032] Step S400, determining a powder bonding residue characterization factor according to the number of the powder bonding residue points to determine the powder bonding residue category; Step S500, selecting a Mn alloy additive powder according to the powder bonding residue category and filling it into the die cavity again for pulse pressing to adjust the pressing method, including: adjusting the pulse frequency of pulse pressing for the Mn alloy additive powder refilled into the die cavity; Or, the die cavity is again filled with Mn alloy additive powder in batches, and each batch of Mn alloy additive powder filled in the die cavity is pulse pressed in batches to obtain the Mn alloy additive; The pulse suppression of each batch lasts for a preset time.

[0033] Specifically, see Figure 2 As shown, it is a schematic diagram of the distribution of several preset points in an embodiment of the present invention, and the preset points include point 2 at the center of the bottom and several points at the bottom edge of the die cavity.

[0034] Specifically, the present invention selects a point at the bottom center and several points at the bottom edge of the die cavity as preset points. It can be understood that the surface of the die cavity at the bottom center of the die cavity is smooth, the alloy additive powder is evenly and fully compressed, and it is not easy for the alloy additive powder to remain at this position. The temperature decay curve of this point can represent the temperature change inside the die cavity under the theoretical state. Due to the limitation of the mold geometry at the bottom edge of the die cavity, it is easy to cause uneven internal structure during the pressing process. By selecting the point at the bottom center and several points at the bottom edge of the die cavity as preset points, and performing temperature decay comparison, the data representativeness of the powder residue phenomenon during the pressing process is improved.

[0035] Specifically, the process of determining the curve coincidence degree includes: Obtaining the temperature attenuation curves corresponding to each point 3 selected along the bottom edge and the temperature attenuation curve corresponding to the point 2 at the center of the bottom; The temperature attenuation curve corresponding to the point 2 at the center position of the bottom is determined as the reference curve, and the degree of overlap between the temperature attenuation curves of the bottom edge points 3 and the temperature attenuation curve is calculated.

[0036] Specifically, the present invention does not limit the method for calculating the overlap of curves. The correlation coefficient of the values ​​of corresponding points on two curves can be calculated by a correlation algorithm. The closer the correlation coefficient is to 1, the higher the overlap of the two curves; the closer the correlation coefficient is to 0, the greater the difference between the two curves. The algorithm for calculating the correlation coefficient of the curves is prior art and will not be described in detail here.

[0037] Specifically, the process of determining the curve overlap can refer to the following embodiment 1; Example 1

[0038] The temperature values ​​of the bottom center point at each time after demoulding and the temperature values ​​of the bottom edge points at each time after demoulding are shown in Table 1. Table 1 Temperature measurement records at each point of the die cavity

[0039] See also Figure 3 As shown, it is a schematic diagram of the temperature decay curve of each point in the die cavity of the embodiment of the present invention, with the temperature value of each point at each moment after demolding as the vertical axis and the time as the horizontal axis plotting the temperature decay curve corresponding to each point. Figure 3 The temperature attenuation curves corresponding to the temperature values ​​at +1min after demolding from high to low are the temperature attenuation curve of bottom edge point 5, the temperature attenuation curve of bottom edge point 3, the temperature attenuation curve of bottom edge point 4, the temperature attenuation curve of bottom edge point 1, the temperature attenuation curve of bottom edge point 2, and the temperature attenuation curve corresponding to the bottom center. The temperature attenuation curve corresponding to the bottom center and the temperature attenuation curve corresponding to bottom edge point 1 have a curve overlap of 0.98, the temperature attenuation curve corresponding to the bottom center and the temperature attenuation curve corresponding to bottom edge point 2 have a curve overlap of 0.95, the temperature attenuation curve corresponding to the bottom center and the temperature attenuation curve corresponding to bottom edge point 3 have a curve overlap of 0.6, the temperature attenuation curve corresponding to the bottom center and the temperature attenuation curve corresponding to bottom edge point 4 have a curve overlap of 0.7, and the temperature attenuation curve corresponding to the bottom center and the temperature attenuation curve corresponding to bottom edge point 5 have a curve overlap of 0.75.

[0040] Specifically, see Figure 4 As shown, it is a logic flow chart of determining whether a preset point is a residual point of powder bonding according to an embodiment of the present invention. The process of determining whether a preset point is a residual point of powder bonding includes: Comparing the curve coincidence with a preset curve coincidence threshold; If the curve overlap is less than the curve overlap threshold, then it is determined that a plurality of points 3 on the bottom edge of the die cavity corresponding to the curve overlap are powder bonding residual points; If the curve overlap is greater than or equal to the curve overlap threshold, the point 3 on the bottom edge of the die cavity corresponding to the curve overlap is not screened.

[0041] Specifically, the preset curve coincidence threshold can be set by technical personnel in this field according to the requirements of the pressing stability of the Mn alloy additive powder. The higher the requirements of the pressing stability of the Mn alloy additive powder, the larger the value of the curve coincidence threshold. Preferably, the value range of the curve coincidence threshold can be [0.8, 0.9].

[0042] Specifically, the present invention determines whether a point on the bottom edge of a preset die cavity is a powder bonding residual point through the curve overlap of the temperature decay curve. Those skilled in the art can understand that the curve overlap characterizes the powder bonding residual of the Mn alloy additive powder at the bottom edge point of the die cavity. The higher the curve overlap, the less obvious the powder bonding residual phenomenon of the Mn alloy additive powder at the bottom edge point of the die cavity corresponding to the curve overlap. The lower the curve overlap, the less obvious the powder bonding residual phenomenon of the Mn alloy additive powder at the bottom edge point of the die cavity corresponding to the curve overlap. Furthermore, the screening of powder bonding residual points is realized, and the data characterization of the powder residual phenomenon during the pressing process is improved.

[0043] Specifically, the process of determining whether the preset point is a powder bonding residual point can refer to the following embodiment 2; Example 2

[0044] The value of the curve coincidence threshold is set to 0.8; When the curve coincidence degree of the temperature attenuation curve corresponding to the bottom center position and the temperature attenuation curve corresponding to the bottom edge point 1 is 0.98, the curve coincidence degree 0.98 is greater than the curve coincidence degree threshold value 0.8, and the bottom edge point 1 is not screened; When the curve coincidence degree of the temperature attenuation curve corresponding to the bottom center position and the temperature attenuation curve corresponding to the bottom edge point 2 is 0.95, the curve coincidence degree 0.95 is greater than the curve coincidence degree threshold value 0.8, and the bottom edge point 2 is not screened; When the curve coincidence degree of the temperature attenuation curve corresponding to the bottom center position and the temperature attenuation curve corresponding to the bottom edge point 3 is 0.6, the curve coincidence degree 0.6 is less than the curve coincidence degree threshold value 0.8, and the bottom edge point 3 is determined to be a powder bonding residual point; When the curve coincidence degree of the temperature attenuation curve corresponding to the bottom center position and the temperature attenuation curve corresponding to the bottom edge point 4 is 0.7, the curve coincidence degree 0.7 is less than the curve coincidence degree threshold value 0.8, and the bottom edge point 4 is determined to be a powder bonding residual point; When the temperature attenuation curve corresponding to the bottom center position and the temperature attenuation curve corresponding to the bottom edge point 5 have a curve overlap of 0.75, which is less than the curve overlap threshold of 0.8, the bottom edge point 5 is determined to be a powder bonding residual point.

[0045] Specifically, the process of determining the powder bonding residue characterization factor includes: Obtaining the number of the powder bonding residual points and the total number of the preset points; Calculating the ratio of the number of the powder bonding residual points to the total number; The ratio is determined as the powder bonding residue characterization factor.

[0046] Specifically, the process of determining the powder bonding residue characterization factor can refer to the following Example 3; Example 3

[0047] According to Example 2, the number of powder bonding residual points is 3, the total number of preset points is 5, and the ratio of the number of powder bonding residual points to the total number is 0.6, that is, the powder bonding residual characterization factor is 0.6.

[0048] Specifically, see Figure 5 As shown, it is a logic flow chart of determining the category of powder bonding residues according to an embodiment of the present invention. The process of determining the category of powder bonding residues includes: Comparing the powder bonding residue characterization factor with a preset powder bonding residue characterization factor reference value; If the powder bonding residue characterization factor is less than or equal to the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue weakly dominant category; If the powder bonding residue characterization factor is greater than the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue strong dominant category.

[0049] Specifically, the preset reference value of the powder bonding residue characterization factor can be set by technical personnel in this field according to the requirements of the pressing stability of the Mn alloy additive powder. The higher the requirements of the pressing stability of the Mn alloy additive powder, the smaller the reference value of the powder bonding residue characterization factor. Preferably, the reference value of the powder bonding residue characterization factor can be in the range of [0.4, 0.6].

[0050] Specifically, the process of selecting the pressing adjustment method includes: If the powder bonding residue category is the powder bonding residue weak dominant category, the pressing adjustment method is selected to adjust the pulse frequency of the pulse pressing of the Mn alloy additive powder filled into the die cavity again; If the powder bonding residue category is a strongly dominant powder bonding residue category, the pressing adjustment method is selected to fill the die cavity with Mn alloy additive powder in batches again, and each batch of Mn alloy additive powder filled in the die cavity is pulse pressed in batches. The pulse pressing of each batch lasts for a preset time to obtain Mn alloy additive.

[0051] Specifically, the pulse frequency of pulse pressing of the Mn alloy additive powder refilled into the die cavity is adjusted according to the average value of the curve overlap corresponding to each powder bonding residual point, and the pulse frequency is negatively correlated with the average value of the curve overlap.

[0052] Specifically, the present invention improves the powder residue phenomenon in the die cavity by adjusting the pulse frequency in the pulse pressing process under the condition that the powder adhesion residue phenomenon of the Mn alloy additive powder is less obvious. It can be understood that different pulse frequencies will affect the pressure distribution in the die cavity. By increasing the pulse frequency, the Mn alloy additive powder in the edge area can be subjected to more pressure in a short time, thereby enhancing the compaction effect, ensuring that the Mn alloy additive powder can be fully compacted in the edge area where powder residue is prone to occur, thereby improving the powder residue phenomenon in the die cavity, and further, realizing timely adjustment of subsequent pressing links, thereby improving the stability of continuous pressing of manganese alloy additives.

[0053] Specifically, the process of refilling the die cavity with Mn alloy additive powder in batches further includes: The number of batches for refilling the die cavity with the Mn alloy additive powder is determined according to the standard deviation of the curve coincidence corresponding to each powder bonding residual point, and the number of batches is positively correlated with the standard deviation of the curve coincidence.

[0054] Specifically, under the condition that the powder adhesion residue phenomenon of the Mn alloy additive powder is more obvious, the present invention fills the Mn alloy additive powder into the die cavity in batches to avoid a large amount of Mn alloy additive powder remaining at the bottom of the die cavity causing uneven pressure distribution of the powder residue in the subsequent pressing process, resulting in local powder agglomeration, and affecting the stability of continuous pressing of the manganese alloy additive. The present invention injects powder in batches and performs multiple pulse pressing. After each powder injection, the powder can be better filled into the mold through pulse pressing, reducing the adverse effect of residual powder agglomerates on the pressure uniformity during the pressing process, making the Mn alloy additive powder more evenly fused inside, thereby achieving timely adjustment of subsequent pressing links and improving the stability of continuous pressing of the manganese alloy additive.

[0055] Specifically, the flux is sodium chloride, and the binder is aluminum dihydrogen phosphate.

[0056] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for preparing a Mn alloy additive, characterized in that: include: Adding flux and binder to Mn metal powder and mixing them to obtain Mn alloy additive powder; Filling the Mn alloy additive powder into a die cavity for pulse pressing, heating the die cavity for a preset heating time, and demolding the pressed Mn alloy additive; Obtaining temperature decay curves of the temperature of a plurality of preset points inside the die cavity over time, and calculating the overlap of a plurality of curves based on the temperature decay curves corresponding to the preset points, so as to determine whether the preset points are powder bonding residual points; Determining a powder bonding residue characterization factor according to the number of the powder bonding residue points to determine the powder bonding residue category; The pressing adjustment method of selecting the Mn alloy additive powder to be filled into the die cavity again for pulse pressing according to the powder bonding residue category includes: adjusting the pulse frequency of pulse pressing for the Mn alloy additive powder refilled into the die cavity; Or, the die cavity is again filled with Mn alloy additive powder in batches, and each batch of Mn alloy additive powder filled in the die cavity is pulse pressed in batches to obtain the Mn alloy additive; The pulse suppression of each batch lasts for a preset time.

2. The method for preparing the Mn alloy additive according to claim 1, characterized in that: The preset points include a point at the center of the bottom and several points at the bottom edge of the die cavity.

3. The method for preparing the Mn alloy additive according to claim 2, characterized in that: The process of determining curve coincidence includes: Obtaining the temperature attenuation curve corresponding to each point selected along the bottom edge and the temperature attenuation curve corresponding to the point at the center position of the bottom; The temperature attenuation curve corresponding to the point at the center of the bottom is determined as a reference curve, and the degree of overlap between the temperature attenuation curves at the edge points of the bottom and the temperature attenuation curve is calculated.

4. The method for preparing the Mn alloy additive according to claim 3, characterized in that: The process of determining whether a preset point is a powder bonding residual point includes: Comparing the curve coincidence with a preset curve coincidence threshold; If the curve overlap is less than the curve overlap threshold, the point on the bottom edge of the die cavity corresponding to the curve overlap is determined to be a powder bonding residual point.

5. The method for preparing the Mn alloy additive according to claim 4, characterized in that: The process of determining the powder bonding residue characterization factor includes: Obtaining the number of the powder bonding residual points and the total number of the preset points; Calculating the ratio of the number of the powder bonding residual points to the total number; The ratio is determined as the powder bonding residue characterization factor.

6. The method for preparing the Mn alloy additive according to claim 5, characterized in that: The process of determining the powder bonding residue category includes: Comparing the powder bonding residue characterization factor with a preset powder bonding residue characterization factor reference value; If the powder bonding residue characterization factor is less than or equal to the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue weakly dominant category; If the powder bonding residue characterization factor is greater than the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue strong dominant category.

7. The method for preparing the Mn alloy additive according to claim 6, characterized in that: The process of selecting a compression adjustment method includes: If the powder bonding residue category is the powder bonding residue weak dominant category, the pressing adjustment method is selected to adjust the pulse frequency of the pulse pressing of the Mn alloy additive powder filled into the die cavity again; If the powder bonding residue category is a strongly dominant powder bonding residue category, the pressing adjustment method is selected to refill the die cavity with Mn alloy additive powder in batches, and pulse press each batch of Mn alloy additive powder filled in the die cavity in batches, and the pulse pressing of each batch lasts for a preset time to obtain the Mn alloy additive.

8. The method for preparing the Mn alloy additive according to claim 7, characterized in that: The pulse frequency of pulse pressing of the Mn alloy additive powder refilled into the die cavity is adjusted according to the average value of the curve overlap corresponding to each powder bonding residual point, and the pulse frequency is negatively correlated with the average value of the curve overlap.

9. The method for preparing the Mn alloy additive according to claim 7, characterized in that: The process of refilling the die cavity with Mn alloy additive powder in batches further includes: The number of batches for refilling the die cavity with the Mn alloy additive powder is determined according to the standard deviation of the curve coincidence corresponding to each powder bonding residual point, and the number of batches is positively correlated with the standard deviation of the curve coincidence.

10. The method for preparing the Mn alloy additive according to claim 1, characterized in that: The flux is sodium chloride, and the binder is aluminum dihydrogen phosphate.

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