Water-collecting, waterproof and anti-laser-damage water-guided laser processing method and tool

Abstract

The invention relates to a water-collecting waterproof and laser-damage-preventing water-guided laser processing method which is achieved through a water-collecting waterproof and laser-damage-preventing water-guided laser processing tool. The water-jet guided laser machining tool comprises a tool body. A two-stage recess for storing water is formed in the middle of the tool main body, and a raised waterproof groove is formed in the edge of the tool main body; the surface of the tool body is covered with a laser protection layer. The water-jet-guided laser machining method comprises the steps that the water-jet-guided laser machining tool is installed on a machine tool, and a water-jet-guided laser machining workpiece is installed on the water-jet-guided laser machining tool; when the water-jet-guided laser machining workpiece is subjected to water-jet-guided laser machining, waste water is intercepted through the waterproof groove and discharged to a waste water treatment device. According to the water-jet guided laser machining device, the problems of water prevention, waste water collection and tool laser protection in the water-jet guided laser machining process can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of water-conducting laser processing, and in particular to a water-conducting laser processing method and tooling for water collection, waterproofing and laser damage prevention. Background Art

[0002] With the rapid development of aerospace technology, new composite materials are widely used in high-temperature resistant aerospace components. However, new composite materials will be accompanied by obvious defects such as cracks, delamination, and fiber pull-out during traditional mechanical processing. At the same time, ultrafast lasers and long pulse lasers are not suitable for processing large composite structural parts due to low efficiency and severe damage. However, water-guided laser processing has the following advantages: small processing heat-affected zone, less thermal damage to materials, long processing distance, no taper in cutting, and less environmental pollution. However, there is still no suitable design for clamping tooling for water-guided laser processing of large composite structural parts, and waterproofing, wastewater collection, and laser protection of tooling during processing are all problems that need to be urgently solved in water-guided laser processing technology. Summary of the invention

[0003] (1) Technical issues to be solved

[0004] The present application provides a water-conducting laser processing method that is water-collecting, waterproof and laser-damage-resistant, and solves the problems of waterproofing, wastewater collection and laser protection of tooling during water-conducting laser processing.

[0005] (2) Technical solution

[0006] In a first aspect, the present application provides a water-conducting laser processing method for water collection, water resistance and laser damage prevention, which is realized by a water-conducting laser processing tooling for water collection, water resistance and laser damage prevention;

[0007] The water-conducting laser processing tool comprises a tool body; a two-level depression for water storage is provided in the middle of the tool body, and a raised waterproof groove is provided on the edge; and a surface of the tool body is covered with a laser protection layer;

[0008] The water-conducting laser processing method comprises:

[0009] The water-conducting laser processing tool is installed on the machine tool, and the water-conducting laser processing workpiece is installed on the water-conducting laser processing tool;

[0010] When the water-conducting laser processed workpiece is subjected to water-conducting laser processing, waste water is intercepted by the waterproof groove and discharged to a waste water treatment device.

[0011] Furthermore, when the water-conducting laser processing workpiece is processed by the water-conducting laser, waste water is intercepted by the waterproof groove, including:

[0012] When the water-guided laser processed workpiece is processed by the water-guided laser with a small inclination angle, waste water is intercepted by the waterproof groove.

[0013] Furthermore, the water-guided laser processing tooling also includes a waterproof plate, and a guide rail is provided on the edge of the tooling body, and the waterproof plate is installed on the guide rail and can slide;

[0014] The water-conducting laser processing method further comprises:

[0015] When the water-conducting laser processing workpiece is subjected to water-conducting laser processing, the waterproof board is slid to a low water level to intercept waste water through the waterproof board.

[0016] Furthermore, when the water-conducting laser processing workpiece is subjected to water-conducting laser processing, the waterproof board is slid to a low water level, and wastewater is intercepted by the waterproof board, including:

[0017] When the water-conducting laser processed workpiece is subjected to large-angle water-conducting laser processing, the waterproof board is slid to a low water level to intercept wastewater through the waterproof board.

[0018] Furthermore, a guide port is provided on the tool body;

[0019] The step of discharging wastewater to a wastewater treatment device comprises:

[0020] The diversion port is connected to a wastewater treatment device through a diversion pipe, so that wastewater is discharged from the diversion port to the wastewater treatment device.

[0021] In a second aspect, the present application provides a water-conducting laser processing tooling that is water-collecting, waterproof and laser-damage-resistant, and is used to implement the water-conducting laser processing method as described above;

[0022] The water-conducting laser processing tool comprises a tool body; a two-level depression for water storage is provided in the middle of the tool body, and a raised waterproof groove is provided on the edge; and a laser protection layer is provided on the surface of the tool body.

[0023] Furthermore, the water-guided laser processing tooling also includes a waterproof plate, and a guide rail is provided on the edge of the tooling body, and the waterproof plate is installed on the guide rail and can slide.

[0024] Furthermore, a guide port is provided on the tool body.

[0025] Furthermore, a plurality of first threaded holes are provided in the middle of the tool body, and a plurality of second threaded holes are provided around the tool body;

[0026] The first threaded hole is used to install the water-conducting laser processing tool on a machine tool, and the second threaded hole is used to install a water-conducting laser processing workpiece on the water-conducting laser processing tool.

[0027] Furthermore, the tooling body is in the shape of a disc, the waterproof plate is in the shape of an arc, and the laser protection layer is made of polytetrafluoroethylene.

[0028] (3) Beneficial effects

[0029] The above technical solution of the present application has the following advantages:

[0030] The first aspect of the present application provides a water-collecting, waterproof and laser-damage-proof water-conducting laser processing method, which uses the waterproof groove on the edge of the tooling body to intercept wastewater and prevent wastewater from flowing onto the machine tool. The intercepted wastewater is discharged to the wastewater treatment device for unified purification treatment. The laser protection layer covering the surface of the tooling body can effectively prevent the laser from damaging the tooling surface due to penetrating the material. Through this method, the technical problems of water collection, waterproofing and laser damage prevention during laser processing of large composite structural parts can be solved.

[0031] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the water-guided laser processing tooling provided in this application;

[0034] Figure 2 The front view of the water-guided laser processing tooling provided in this application;

[0035] Figure 3 A side view of the water-guided laser processing tooling provided for this application;

[0036] Figure 4 A top view of the water-guided laser processing tooling provided in this application.

[0037] Figure numerals: 1. tooling body; 2. waterproof groove; 3. laser protection layer; 4. waterproof plate; 5. guide rail; 6. diversion port; 7. first threaded hole; 8. second threaded hole. DETAILED DESCRIPTION

[0038] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0039] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0040] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0041] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. "Multiple" means "two or more".

[0042] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but are not intended to limit the scope of the present application.

[0043] This embodiment provides a water-conducting laser processing method for water collection, water resistance and laser damage prevention, which is implemented by a water-conducting laser processing tool for water collection, water resistance and laser damage prevention. Figure 1 As shown, the water-conducting laser processing tooling includes a tooling body 1; a two-level depression for water storage is opened in the middle of the tooling body 1, and a raised waterproof groove 2 is opened on the edge; the surface of the tooling body 1 is covered with a laser protection layer 3.

[0044] The water-conducting laser processing method comprises: installing the water-conducting laser processing tool on a machine tool, and installing a water-conducting laser processing workpiece on the water-conducting laser processing tool; when the water-conducting laser processing workpiece is subjected to water-conducting laser processing, wastewater is intercepted by the waterproof groove 2, and the wastewater is discharged to a wastewater treatment device.

[0045] Since water-conducting laser processing will generate wastewater, the waterproof groove 2 on the edge of the tooling body can be used to intercept the wastewater to prevent it from flowing onto the machine tool. The intercepted wastewater is discharged to the wastewater treatment device for unified purification treatment. The laser protection layer 3 covering the surface of the tooling body can effectively prevent the laser from damaging the tooling surface due to penetrating the material. The water-conducting laser processing method provided in this embodiment can solve the technical problems of water collection, waterproofing and laser damage prevention during laser processing of large composite structural parts.

[0046] In some embodiments, when the water-conducting laser processed workpiece is subjected to water-conducting laser processing, waste water is intercepted by the waterproof groove, including: when the water-conducting laser processed workpiece is subjected to small-angle water-conducting laser processing, waste water is intercepted by the waterproof groove 2.

[0047] In some embodiments, the water-conducting laser processing tool further includes a waterproof plate 4, and a guide rail 5 is provided at the edge of the tool body, and the waterproof plate 4 is mounted on the guide rail 5 and can slide. The water-conducting laser processing method further includes: when the water-conducting laser processing workpiece is subjected to water-conducting laser processing, the waterproof plate 4 is slid to a low water level, and wastewater is intercepted by the waterproof plate 4.

[0048] In some embodiments, when the water-conductive laser processed workpiece is subjected to water-conductive laser processing, the waterproof board is slid to a low water level, and waste water is intercepted by the waterproof board, including: when the water-conductive laser processed workpiece is subjected to large-angle water-conductive laser processing, the waterproof board 4 is slid to a low water level, and waste water is intercepted by the waterproof board 4.

[0049] In some embodiments, a diversion port 6 is further provided on the tooling body 1; discharging the wastewater to the wastewater treatment device includes: connecting the diversion port 6 to the wastewater treatment device through a diversion pipe, so that the wastewater is discharged from the diversion port 6 to the wastewater treatment device.

[0050] This embodiment also provides a water-collecting, waterproof and laser-damage-proof water-conducting laser processing tool, which is used to implement the water-conducting laser processing method described above. The water-conducting laser processing tool comprises a tool body 1; a two-level depression for water storage is provided in the middle of the tool body 1, and a raised waterproof groove 2 is provided on the edge; a laser protection layer 3 is provided on the surface of the tool body 1.

[0051] In some embodiments, the water-guided laser processing tool further includes a waterproof plate 4 , and a guide rail 5 is provided at the edge of the tool body 1 , and the waterproof plate 4 is installed on the guide rail 5 and can slide.

[0052] In some embodiments, a guide port 6 is further provided on the tool body 1 .

[0053] In some embodiments, a plurality of first threaded holes 7 are provided in the middle of the tool body 1, and a plurality of second threaded holes 8 are provided around it; the first threaded holes 7 are used to install the water-conducting laser processing tool on a machine tool, and the second threaded holes 8 are used to install a water-conducting laser processing workpiece on the water-conducting laser processing tool.

[0054] In some embodiments, the tool body 1 is in the shape of a disc, the waterproof plate 4 is in the shape of an arc, and the laser protection layer 3 is made of polytetrafluoroethylene.

[0055] The water-conducting laser processing tooling includes a disc-shaped tooling body 1 made of stainless steel, with a two-stage depression in the middle for storing water, and a raised waterproof groove 2 at its edge. The first threaded hole 7 located in the middle of the tooling body 1 can fix the tooling on various types of CNC machine tools, and the second threaded holes 8 located around the tooling body 1 are used to clamp large samples for water-conducting laser processing. The advantage of this type of tooling is that it is suitable for various types of CNC machine tools and can clamp large samples of various shapes to be processed.

[0056] The waterproof groove 2 can intercept a small amount of wastewater to prevent it from flowing onto the machine tool; the guide rail 5 can allow the arc-shaped waterproof plate 4 to move freely; the arc-shaped waterproof plate 4 is used to slide on the guide rail 5 to a position with a lower water level when the workpiece is processed at a large inclination angle, thereby intercepting a large amount of wastewater, avoiding the problem of interference between the tooling and the water-guided laser processing head due to the waterproof plate on the tooling being too high; the diversion port 6 can discharge the wastewater collected by the waterproof groove 2 and the arc-shaped waterproof plate 4 from the disc-shaped tooling body 1 through the diversion pipe to the wastewater treatment device for unified purification treatment. The polytetrafluoroethylene protective layer covering the upper surface of the tooling can effectively prevent the laser from penetrating the material and damaging the tooling surface.

[0057] First, when the workpiece is processed by water-guided laser with a small inclination angle, the waterproof groove 2 on the edge of the tooling body is mainly used to intercept a small amount of wastewater to prevent the wastewater from flowing onto the machine tool. When the workpiece is processed at a large inclination angle, the curved waterproof plate 4 can slide on the guide rail 5 to a position with a lower water level to intercept a large amount of wastewater. The intercepted wastewater is collected from the diversion port 6 on the tooling through the diversion pipe to the wastewater treatment device for unified purification treatment. The polytetrafluoroethylene covering the upper surface of the tooling can effectively prevent the laser from damaging the tooling surface due to penetrating the material.

[0058] Since water-guided laser processing will generate wastewater, the waterproof groove 2 on the edge of the tooling body can be used to intercept a small amount of wastewater to prevent it from flowing onto the machine tool. However, when the workpiece is processed at a large inclination angle, the edge waterproof groove 2 has a poor effect on collecting wastewater. The arc-shaped waterproof plate 4 can be slid on the guide rail 5 to a position with a lower water level so as to intercept a large amount of wastewater. The guide rail 5 and the arc-shaped waterproof plate 4 are waterproofed by a waterproof gasket. The intercepted wastewater is collected from the diversion port 6 on the tooling through the diversion pipe to the wastewater treatment device for unified purification treatment. The polytetrafluoroethylene protective layer covering the upper surface of the tooling can effectively prevent the laser from damaging the surface of the tooling due to penetrating the material.

[0059] The water-conducting laser processing method and device for water collection, waterproofing and laser damage prevention provided in the embodiments of the present application realize the stable clamping of large composite material structural parts for multi-angle processing on the water-conducting laser machine tool, and properly collect the wastewater generated during the water-conducting laser processing process to prevent the wastewater from contacting the CNC machine tool and causing corrosion of the machine tool or even electric shock to the technicians. The problem of interference between the tooling and the water-conducting laser processing head due to the excessive height of the tooling waterproof device is solved, and the problem of damage to the tooling surface due to laser penetration of the material during the water-conducting laser processing process is prevented.

[0060] The following is an explanation through specific embodiments.

[0061] Example 1

[0062] First, the disc-shaped fixture and its accessories are assembled on the water-guided laser CNC machine tool, and then the large ceramic matrix composite structure is fixed to the threaded hole of the fixture using pins and bolts. After that, the workpiece can be formally processed. When the workpiece is processed at a small angle, a small amount of wastewater is mainly intercepted by the waterproof groove on the edge of the fixture body. The intercepted wastewater is collected from the diversion port on the fixture through the diversion pipe to the wastewater treatment device for unified purification treatment. The polytetrafluoroethylene covering the surface of the fixture can effectively prevent the laser from damaging the surface of the fixture due to penetrating the material.

[0063] Example 2

[0064] First, the disc-shaped fixture and its accessories are assembled on the water-guided laser CNC machine tool, and then the large-scale structural parts of the resin-based composite material are fixed to the threaded holes of the fixture using pins and bolts. After that, the workpiece can be formally processed. When the workpiece is processed at a large angle, the arc-shaped waterproof plate can be mainly used to slide on the guide rail to a position with a lower water level so as to intercept a large amount of wastewater. The intercepted wastewater is collected from the diversion port on the fixture through the diversion pipe to the wastewater treatment device for unified purification treatment. The polytetrafluoroethylene covering the surface of the fixture can effectively prevent the laser from damaging the surface of the fixture due to penetrating the material.

[0065] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application.

[0066] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A water-conducting laser processing method for water collection, water prevention and laser damage prevention, characterized in that: This is achieved through water-collecting and water-proof laser processing tooling that prevents laser damage; The water-conducting laser processing tool comprises a tool body; a two-level depression for water storage is provided in the middle of the tool body, and a raised waterproof groove is provided on the edge; and a surface of the tool body is covered with a laser protection layer; The water-conducting laser processing method comprises: The water-conducting laser processing tool is installed on the machine tool, and the water-conducting laser processing workpiece is installed on the water-conducting laser processing tool; When the water-conducting laser processed workpiece is subjected to water-conducting laser processing, waste water is intercepted by the waterproof groove and discharged to a waste water treatment device.

2. The water-conducting laser processing method according to claim 1, characterized in that: When the water-conducting laser processed workpiece is subjected to water-conducting laser processing, waste water is intercepted by the waterproof groove, including: When the water-guided laser processed workpiece is processed by the water-guided laser with a small inclination angle, waste water is intercepted by the waterproof groove.

3. The water-conducting laser processing method according to claim 1, characterized in that: The water-guided laser processing tooling also includes a waterproof plate, and a guide rail is provided on the edge of the tooling body, and the waterproof plate is installed on the guide rail and can slide; The water-conducting laser processing method further comprises: When the water-conducting laser processing workpiece is subjected to water-conducting laser processing, the waterproof board is slid to a low water level to intercept waste water through the waterproof board.

4. The water-conducting laser processing method according to claim 3, characterized in that: When the water-conducting laser processing workpiece is subjected to water-conducting laser processing, the waterproof plate is slid to a low water level, and waste water is intercepted by the waterproof plate, including: When the water-conducting laser processed workpiece is subjected to large-angle water-conducting laser processing, the waterproof board is slid to a low water level to intercept wastewater through the waterproof board.

5. The water-conducting laser processing method according to claim 1, characterized in that: The tool body is also provided with a flow guide port; The step of discharging wastewater to a wastewater treatment device comprises: The diversion port is connected to a wastewater treatment device through a diversion pipe, so that wastewater is discharged from the diversion port to the wastewater treatment device.

6. A water-conducting laser processing tooling for water collection, water resistance and laser damage prevention, characterized in that: Used to implement the water-conducting laser processing method according to any one of claims 1 to 5; The water-conducting laser processing tool comprises a tool body; a two-level depression for water storage is provided in the middle of the tool body, and a raised waterproof groove is provided on the edge; and a laser protection layer is provided on the surface of the tool body.

7. The water-conducting laser processing tool as claimed in claim 6, characterized in that: The water-guided laser processing tool also includes a waterproof plate. A guide rail is provided at the edge of the tool body. The waterproof plate is installed on the guide rail and can slide.

8. The water-conducting laser processing tool as claimed in claim 6, characterized in that: The tool body is also provided with a flow guide port.

9. The water-conducting laser processing tool as claimed in claim 6, characterized in that: A plurality of first threaded holes are formed in the middle of the tool body, and a plurality of second threaded holes are formed around the tool body; The first threaded hole is used to install the water-conducting laser processing tool on a machine tool, and the second threaded hole is used to install a water-conducting laser processing workpiece on the water-conducting laser processing tool.

10. The water-conducting laser processing tool as claimed in claim 7, characterized in that: The tooling body is in the shape of a disc, the waterproof plate is in the shape of an arc, and the laser protection layer is made of polytetrafluoroethylene.

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