Glass laser chamfering method and laser processing system

Abstract

The invention relates to the technical field of laser processing, and discloses a glass laser chamfering method and a laser processing system.The glass laser chamfering method comprises the following steps that laser processing points of a cutting laser are controlled to be located at multiple height positions above glass in sequence; the glass is controlled to do circumferential movement with the corresponding length at the multiple height positions of the laser machining point, so that microcracks are formed in the circumferential side of the glass; and splitting the glass along the path direction of the microcrack so as to form a chamfer on the peripheral side of the glass. By means of the glass laser chamfering method, the glass chamfering machining quality can be improved, and the glass chamfering production cost can be reduced.

Description

Technical Field

[0001] The invention relates to the technical field of laser processing, and in particular to a glass laser chamfering method and a laser processing system. Background Art

[0002] Due to the rapid development and rapid demand of the current electronic consumer and automotive markets, more display screens use glass as display screens or touch screens. Glass chamfering can not only make the display screen smooth, beautiful and safe, but also achieve higher precision. Therefore, the market for glass chamfering machines is becoming increasingly huge. Due to the high efficiency, good stability and easy maintenance of laser processing, laser chamfering machines have basically replaced mechanical chamfering machines.

[0003] In the related technology of glass laser chamfering, the glass is placed on a lifting platform and lifted, and the periphery of the glass is scanned by a laser galvanometer, so that the glass has different scanning widths at different lifting heights, so that microcracks are initially formed on the glass. Then, the glass is cracked along the path of the microcracks using a cracking device, so that the periphery of the glass is chamfered. However, due to the limited scanning width of the laser galvanometer, it is impossible to chamfer glass with a larger diameter. Summary of the invention

[0004] The object of the present invention is to provide a glass laser chamfering method, which aims to chamfer and mark micro-cracks in glass by platform movement, thereby achieving chamfering of glass with a larger diameter.

[0005] In order to achieve the above-mentioned purpose, an embodiment of the present invention proposes a glass laser chamfering method, which includes the following steps: controlling the laser processing point of the cutting laser to be located at multiple height positions above the glass in sequence; controlling the glass to make circumferential movements of corresponding lengths at the multiple height positions of the laser processing point, so that microcracks are formed on the circumferential side of the glass; and cracking the glass along the path direction of the microcracks, so that the circumferential side of the glass is chamfered.

[0006] Optionally, the step of controlling the laser processing point of the cutting laser to be located at multiple height positions above the glass in sequence includes: controlling the laser processing point to be located at an initial processing position of the glass; obtaining a first trigger signal, the first trigger signal being a signal for controlling the glass to move in a corresponding length in a circumferential direction at a preset end point position; and according to the first trigger signal, controlling the laser processing point to rise by a preset distance value.

[0007] Optionally, before the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, the step also includes: controlling the cutting laser to stop emitting light according to the first trigger signal.

[0008] Optionally, after the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, the step also includes: obtaining a second trigger signal, the second trigger signal being a signal for controlling the glass to move to a preset initial position when it makes a circumferential motion of a corresponding length; and controlling the cutting laser to emit light again according to the second trigger signal.

[0009] Optionally, the step of controlling the glass to make circumferential motion of corresponding lengths at the multiple height positions of the laser processing point so as to form microcracks on the circumferential side of the glass includes: controlling the glass to make circumferential motion at the Nth height position along a first trajectory; controlling the glass to make circumferential motion at the N+1th height position along a second trajectory, wherein the length of the second trajectory is less than the length of the first trajectory.

[0010] Optionally, after the step of controlling the glass to perform circumferential motion at the N+1th height position along the second trajectory, the step also includes: controlling the glass to perform circumferential motion at the N+2th height position along the third trajectory, wherein the spacing value between the first trajectory and the second trajectory is equal to the spacing value between the second trajectory and the third trajectory.

[0011] Optionally, the step of splitting the glass along the path direction of the microcracks so that the glass has chamfers includes: setting a heating path according to the path direction; controlling a heating laser to emit light along the heating path so that after the microcracks expand due to heat and then contract due to cooling, the glass splits have chamfers.

[0012] The present invention also proposes a laser processing system, which applies the glass laser chamfering method as described above, and includes a two-dimensional translation module, a cutting laser and a splitting assembly, wherein the two-dimensional translation module has a translation platform, and the translation platform is used to place the glass to drive the glass to move in a circumferential direction; the cutting laser and the two-dimensional translation module are spaced apart in the vertical direction, and the cutting laser includes a focusing mirror, and the light emitting focus of the focusing mirror is used to focus the glass, and the height position of the light emitting focus is adjustable to the glass to cooperate with the translation platform to guide the glass to form microcracks; the splitting assembly is spaced apart from the two-dimensional translation module and the cutting laser, and is used to split the glass along the path direction of the microcracks so that the glass forms the chamfer.

[0013] Optionally, the cutting laser further comprises a lifting shaft, and the lifting shaft is used to drive the focusing mirror to move up and down to adjust the height position of the light output focal point on the glass.

[0014] Optionally, the crack assembly includes a heating laser and a heating platform, the heating laser and the heating platform are arranged at an interval, the heating platform is used to place the glass, and the heating laser is used to perform laser heating on the microcracks so that the microcracks expand due to heat; after the microcracks shrink, the glass cracks are formed with the chamfer.

[0015] In the technical solution of the present invention, the glass is placed on the platform of the cutting laser, and the laser processing point of the cutting laser is controlled to be located at multiple height positions above the glass in sequence; the glass is controlled to make circumferential movements of corresponding lengths at the multiple height positions, so that microcracks are formed on the circumferential side of the glass; the glass is cracked along the path direction of the microcracks, so that chamfers are formed on the circumferential side of the glass.

[0016] Compared with the method of cutting and chamfering glass by using a laser galvanometer in conjunction with a lifting platform, the scanning range of the laser galvanometer is limited and therefore it is impossible to chamfer glass with a larger diameter. The solution of the present invention controls the glass to move in a circumferential direction so that the cutting laser can perform laser tracing on the periphery of the glass. Therefore, it is not limited by the scanning range of the laser galvanometer and can chamfer glass with a larger diameter. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the process of an embodiment of glass laser chamfering of the present invention; Figure 2 It is a structural schematic diagram of an embodiment of a laser processing system of the present invention; Figure 3 FIG. 1 is a schematic diagram of an outline of an embodiment of glass chamfering processing according to the present invention.

[0019] Description of Figure Numbers:

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] Due to the rapid development and surging demand in the current electronic consumer, automotive and other markets, more display screens use glass as display screens or touch screens. Glass chamfering can not only make the display screen smooth, beautiful and safe, but also achieve higher precision. Therefore, the market for glass chamfering machines is becoming increasingly huge.

[0026] Common chamfering treatment methods mainly include mechanical polishing and chemical etching. The process of mechanical polishing will generate dust, which will cause secondary pollution of the glass, and will also cause the glass edge to crack, resulting in low product yield; coolant cooling is also required during the process. The process of chemical etching requires toxic and volatile hydrofluoric acid, so the production conditions are required to be high, and the waste liquid will pollute the environment. In contrast, due to the high efficiency, good stability and easy maintenance of laser processing, laser chamfering is now more and more widely used.

[0027] In the related technology of glass laser chamfering, the glass is placed on a lifting platform and lifted, and the periphery of the glass is scanned by a laser galvanometer, so that the glass has different scanning widths at different lifting heights, so that microcracks are initially formed on the glass. Then, the glass is cracked along the path of the microcracks using a cracking device, so that the periphery of the glass is chamfered. However, due to the limited scanning width of the laser galvanometer, it is impossible to chamfer glass with a larger diameter.

[0028] In view of the above problems, the present invention proposes a glass laser chamfering method, which aims to chamfer and mark micro-cracks on glass 6 by platform movement, so that glass 6 with a larger diameter can be chamfered.

[0029] Reference Figures 1 to 3 , Figure 2 The present invention is a flow chart of an embodiment of a glass laser chamfering method, wherein the glass laser chamfering method comprises the following steps: Step S10 , controlling the laser processing point of the cutting laser 3 to be located at a plurality of height positions above the glass 6 in sequence.

[0030] Step S20 , controlling the glass 6 to perform circumferential motion of corresponding lengths at the plurality of height positions of the laser processing point, so that microcracks are formed on the circumferential side of the glass 6 .

[0031] Before the laser cutting process, the glass 6 is placed on the translation platform 15 of the cutting laser 3. In addition to the glass 6, other transparent and brittle materials can also be used. Therefore, other transparent and brittle materials involved in the glass 6 chamfering method of the present invention also fall within the protection scope of this application. The platform is a laser cutting platform for placing the glass 6, and the platform can realize the movement of the glass 6 along the X-axis and Y-axis directions. An adsorption component can be set on the platform, and the adsorption component is used to realize the adsorption and fixation of the glass 6.

[0032] Among them, the beam used by the cutting laser 3 for processing chamfers is a Gaussian beam focused by an objective lens, and the focused spot is 1-2um. The laser processing point is the processing point where the laser irradiates the glass 6, and ideally it can be defaulted to the laser focus. One of the advantages of a laser cutter is that the energy density of the beam is high, so the focal spot diameter will be as small as possible to produce a very small slit. Because the smaller the focal depth of the focusing lens, the smaller the diameter of the focal spot. For high-quality, high-precision cutting, the effective focal depth is also related to the lens diameter and the material being cut, so it is very important to control the position of the focus and the surface of the material being cut.

[0033] In one implementation of adjusting the height position of the laser processing point, the height position of the focus lens can be adjusted, or the cutting laser 3 can be raised and lowered as a whole to change the height position of the light output point of the cutting laser 3 .

[0034] In this embodiment, when the laser processing point falls at a specific height position above the glass 6, the glass 6 makes a circumferential motion of a corresponding length, thereby achieving the scribing of the periphery of the glass 6. Similarly, by changing the height position of the laser processing point and correspondingly changing the length of the circumferential motion of the glass 6, the glass 6 can be chamfered and scribed, so that the glass 6 is initially formed with micro cracks.

[0035] It is worth noting that the present embodiment does not limit the movement process of the chamfering processing trajectory. Any processing method that uses the present glass laser chamfering method to perform peripheral laser cutting on the glass 6 to form a chamfer falls within the protection scope of the present application.

[0036] Step S30, the glass 6 is cracked along the path direction of the microcracks, so that the peripheral side of the glass 6 is chamfered.

[0037] The micro cracks of the glass 6 may be heated, so that the glass 6 is cracked along the path of the micro cracks due to thermal expansion and contraction, thereby forming a chamfer.

[0038] In the technical solution of the present invention, the glass 6 is placed on a platform; the laser processing point of the cutting laser 3 is controlled to be located at multiple height positions above the glass 6 in sequence; the glass 6 is controlled to make circumferential movements of corresponding lengths at the multiple height positions, so that microcracks are formed on the circumferential side of the glass 6; the glass 6 is cracked along the path direction of the microcracks, so that chamfers are formed on the circumferential side of the glass 6.

[0039] During the laser chamfering of the glass 6 , there is no direct contact between the processing tool and the glass 6 , no dust generated by mechanical chamfering, and no edge cracking of the glass 6 caused by mutual friction and contact. The product yield is high, and natural cooling can be used for cooling during the processing, without the need for coolant cooling.

[0040] Compared with the method of cutting and chamfering the glass 6 by using a laser galvanometer in conjunction with a lifting platform, the scanning format of the laser galvanometer is limited and thus it is impossible to chamfer a glass 6 with a larger diameter. The solution of the present invention controls the glass 6 to make a circumferential motion so that the cutting laser 3 performs laser tracing on the periphery of the glass 6, so it is not limited by the scanning format of the laser galvanometer and can chamfer a glass 6 with a larger diameter.

[0041] Compared with the laser scanning galvanometer, the laser processing spot is larger, which is easy to cause edge collapse of glass 6 when laser chamfering and marking glass 6. The laser processing spot of the cutting laser 3 of the present invention is smaller, which is conducive to focusing processing of glass 6 and avoiding edge collapse of glass 6 due to the larger processing spot.

[0042] In one embodiment of the glass laser chamfering method of the present invention, the step of controlling the laser processing point of the cutting laser 3 to be located at multiple height positions above the glass 6 in sequence includes: controlling the laser processing point to be located at the initial processing position of the glass 6; obtaining a first trigger signal, the first trigger signal being a signal for controlling the glass 6 to move in a circumferential direction of a corresponding length at a preset end point position; and according to the first trigger signal, controlling the laser processing point to rise by a preset distance value.

[0043] The initial processing position is the initial processing position of the laser processing point on the glass 6, which is generally located slightly above the bottom surface of the glass 6 to achieve chamfering and marking of the glass 6 from bottom to top. The laser processing point is raised by a preset distance value on the basis of the initial processing position, and the circumference of the circumferential movement of the glass 6 is reduced by a preset length value. By positioning the laser processing point at the starting point of the interpolation motion, it is beneficial to achieve step-by-step processing of the chamfer of the glass 6.

[0044] In one embodiment of determining whether the glass 6 has completed a preset number of circumferential movements, the glass 6 is moved by a linear motor, the driving stroke value of the linear motor is monitored, and then the movement stroke of the glass 6 is determined, thereby determining whether the glass 6 has completed the circumferential movement. Correspondingly, by planning the processing trajectory on the processing layer of the translation platform 15, the preset end point position can be considered as the final position when the linear motor drives the glass 6 to complete the circumferential movement of the corresponding length through the translation platform 15.

[0045] The preset number of times of controlling the glass to make a circumferential motion of a corresponding length may be once, that is, to ensure that the laser processing point scans the glass 6 chamfer for at least one circle, or the glass 6 may be controlled to make a plurality of circumferential motions along the corresponding circumference.

[0046] The preset distance value is the height value of each rise of the laser processing point. The specific process of obtaining the preset distance value is: according to the thickness value of the glass 6 and the chamfer angle value, determine the length value of the chamfered right-angle side; divide the length value of the right-angle side by the spacing value of two adjacent lines of the glass 6 doing circumferential motion to obtain the number of scanning circles; finally, divide the thickness value of the glass 6 by the number of scanning circles to obtain the size of the preset distance value.

[0047] In this embodiment, after the laser processing point performs circumferential scanning processing on the glass 6 for a preset number of times, it is correspondingly raised by a preset distance value, thereby realizing circle-by-circle processing of the glass 6 along the height direction.

[0048] In one embodiment of the glass laser chamfering method of the present invention, before the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, the step also includes: controlling the cutting laser 3 to stop emitting light according to the first trigger signal.

[0049] In this embodiment, during the process of the laser processing point rising, the cutting laser 3 is controlled to stop emitting light, thereby avoiding long-term light emission at a single position of the glass 6, thereby avoiding affecting the chamfering and scribing quality of the glass 6.

[0050] In one embodiment of the glass laser chamfering method of the present invention, after the step of controlling the laser processing point to rise by a preset distance value according to the first trigger signal, it also includes: obtaining a second trigger signal, the second trigger signal being a signal for controlling the glass 6 to move to a preset initial position when the glass 6 makes a circumferential motion of a corresponding length; and controlling the cutting laser 3 to emit light again according to the second trigger signal.

[0051] Among them, by planning the processing trajectory on the processing layer of the translation platform 15, the preset initial position can be considered as the initial position when the linear motor drives the glass 6 to make a circumferential motion of a corresponding length through the translation platform 15. Optionally, if the translation platform 15 moves first and then the cutting laser 3 emits light, there may be several processing points that are not processed in the processed trajectory of the corresponding circumferential length of the glass 6, so a compensation length can be set to allow the glass 6 to run a few more points before stopping the circumferential motion.

[0052] In one embodiment of determining the height change value of the laser processing point, a linear motor is used to drive the glass 6 to move up and down, and the driving stroke value of the linear motor is monitored to determine the height change value of the laser processing point.

[0053] In this embodiment, when it is detected that the glass 6 is in a preset initial position when making a circumferential motion of a corresponding length, and after the laser processing point moves to the next position at a preset distance value, the cutting laser 3 is controlled to emit light again to perform chamfering cutting processing on the glass 6. Therefore, the light emission signal of the cutting laser 3 in this solution is given according to the movement of the translation platform 15. When the translation platform 15 moves according to the trajectory of the processing layer, the cutting laser 3 will emit light, and the translation platform 15 will turn off the light after completing the circumferential motion of the corresponding length according to the trajectory of the processing layer, which is conducive to ensuring the movement coordination of the cutting laser 3 and the translation platform 15, so as to achieve high-efficiency chamfering of the glass 6.

[0054] In one embodiment of the glass laser chamfering method of the present invention, the step of controlling the glass 6 to make circumferential motion of corresponding lengths at the plurality of height positions of the laser processing point so that microcracks are formed on the circumferential side of the glass 6 includes: controlling the glass 6 to make circumferential motion at the Nth height position along a first trajectory; controlling the glass 6 to make circumferential motion at the N+1th height position along a second trajectory, wherein the length of the second trajectory is less than the length of the first trajectory.

[0055] In this embodiment, when the laser processing points are successively lifted upward and located at different processing positions, the glass 6 is controlled to move in a circumferential direction with a decreasing length value so as to perform chamfering and scribing of the glass 6 .

[0056] In one embodiment of the glass laser chamfering method of the present invention, after the step of controlling the glass 6 to perform circumferential motion at the N+1th height position along the second trajectory, it also includes: controlling the glass 6 to perform circumferential motion at the N+2th height position along the third trajectory, wherein the spacing value between the first trajectory and the second trajectory is equal to the spacing value between the second trajectory and the third trajectory.

[0057] The spacing value is the length between two adjacent lines of the glass 6 each time it makes a circumferential motion, and is related to the diameter of the laser spot.

[0058] In this embodiment, after the laser processing point moves to the next position at a preset distance value and emits light again, the glass 6 is correspondingly controlled to reduce the circumference of the circumferential movement of the glass 6 at an equal spacing value, so that the uniform laser chamfering of the glass 6 can be achieved.

[0059] It is worth noting that, referring to Figure 3 During the circumferential movement of the glass 6, by setting the length value between two adjacent lines and the corresponding calculation of the height value of each elevation of the laser processing point, the glass 6 can be chamfered at any angle.

[0060] In one embodiment of the glass laser chamfering method of the present invention, the step of splitting the glass 6 along the path direction of the microcracks so that the glass 6 has a chamfer includes: setting a heating path according to the path direction; controlling the heating laser to emit light along the heating path so that after the microcracks expand due to heat and then contract due to cooling, the glass 6 is split to form a chamfer.

[0061] The heating laser is a laser used to heat the workpiece with light. For example, the heating laser can be a CO2 laser, utilizing the high absorption efficiency of the glass 6 material in the far-infrared band.

[0062] In this embodiment, compared with other heating methods, by emitting light along the heating path by the heating laser and then heating the microcracks of the glass 6, it is possible to better achieve precise heating of the microcracks and avoid edge collapse of the glass 6, thereby affecting the molding quality of the chamfer.

[0063] Reference Figure 2 The present invention further proposes a laser processing system 10, which applies the glass laser chamfering method as described above. The laser processing system 10 includes a two-dimensional translation module 1, a cutting laser 3 and a splitting assembly. The two-dimensional translation module 1 has a translation platform 15, and the translation platform 15 is used to place the glass 6 to drive the glass 6 to move circumferentially; the cutting laser 3 is spaced apart from the two-dimensional translation module 1 in the vertical direction, and the cutting laser 3 includes a focusing mirror 35, and the light-emitting focus of the focusing mirror 35 is used to focus the glass 6. The height position of the light-emitting focus is adjustable to the glass 6 to cooperate with the translation platform 15 to guide the glass 6 to form microcracks; the splitting assembly is spaced apart from the two-dimensional translation module 1 and the cutting laser 3, and is used to split the glass 6 along the path direction of the microcracks so that the glass 6 forms the chamfer.

[0064] The laser processing system 10 further includes a frame 5, and the two-dimensional translation module 1 includes a first linear module 11 and a second linear module 13. The first linear module 11 is arranged on the frame 5, and the second linear module 13 is arranged at the moving end of the first linear module 11. The moving end of the second linear module 13 is provided with a translation platform 15, and the translation platform 15 is provided with a glass 6, thereby driving the glass 6 to perform circumferential movement in a two-dimensional direction. In order not to affect the blocking of the laser processing of the glass 6 by the fixture, an adsorption component can be provided on the translation platform 15 to adsorb and fix the glass 6, thereby ensuring that the laser of the glass 6 performs cutting processing on the peripheral side of the glass 6.

[0065] The cutting laser 3 includes a laser generator 31, a light guide assembly 33 and a focusing lens 35. The laser generated by the laser generator 31 is guided by the light guide assembly 33, and then focused by the focusing lens 35 to generate a light output focus, and the light output focus is positioned on the glass 6 of the translation platform 15 for processing. In one embodiment in which the height position of the light output focus on the glass 6 is adjustable, a lifting platform is provided on the frame 5, and the cutting laser 3 is driven to move up and down by the lifting platform, thereby changing the height position of the light output focus.

[0066] The splitting assembly is used to split the glass 6. For example, the splitting assembly can use a laser to perform heating splitting or a splitting machine to perform mechanical splitting.

[0067] Reference Figure 2 In one embodiment of the present invention, the cutting laser 3 further includes a lifting shaft 37, and the lifting shaft 37 is used to drive the focusing mirror 35 to move up and down to adjust the height position of the light output focus on the glass 6.

[0068] In this embodiment, the objective lens is driven to rise and fall by the lifting shaft 37 to adjust the light emitting focus, so that the light emitting focus can be quickly adjusted.

[0069] Reference Figure 2 In one embodiment of the present invention, the laser heating component includes a heating laser and a heating platform, the heating laser and the heating platform are arranged at an interval, the heating platform is used to place the glass 6, and the heating laser is used to perform laser heating on the microcracks so that the microcracks expand due to heat; after the microcracks shrink, the glass 6 fragments are formed with the chamfer.

[0070] The heating laser is a laser used to heat the workpiece with light. For example, the heating laser can be a CO2 laser, utilizing the high absorption efficiency of the glass 6 material in the far-infrared band.

[0071] In this embodiment, compared with other heating methods, by emitting light along the heating path by the heating laser and then heating the microcracks of the glass 6, it is possible to better achieve precise heating of the microcracks and avoid edge collapse of the glass 6, thereby affecting the molding quality of the chamfer.

[0072] In summary, the laser processing system 10 of the present invention can implement glass laser chamfering work. The promotion and application of the glass laser chamfering method and the laser processing system 10 have positive significance for improving the processing quality of glass chamfering and reducing its production cost.

[0073] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A glass laser chamfering method, characterized in that: The glass laser chamfering method comprises the following steps: Controlling the laser processing points of the cutting laser to be located at a plurality of height positions above the glass in sequence; Controlling the glass to make circumferential motion of corresponding lengths at the plurality of height positions of the laser processing point, so that micro cracks are formed on the circumferential side of the glass; The glass is cracked along the path direction of the microcracks so that the peripheral side of the glass is chamfered.

2. The glass laser chamfering method according to claim 1, characterized in that: The step of controlling the laser processing points of the cutting laser to be located at a plurality of height positions above the glass in sequence comprises: Controlling the laser processing point to be located at the initial processing position of the glass; Acquire a first trigger signal, where the first trigger signal is a signal for controlling the preset end point position of the glass when the glass performs a circumferential motion of a corresponding length; According to the first trigger signal, the laser processing point is controlled to be raised by a preset distance value.

3. The glass laser chamfering method according to claim 2, characterized in that: Before the step of controlling the laser processing point to be raised by a preset distance value according to the first trigger signal, the step further includes: According to the first trigger signal, the cutting laser is controlled to stop emitting light.

4. The glass laser chamfering method according to claim 3, characterized in that: After the step of controlling the laser processing point to be raised by a preset distance value according to the first trigger signal, the step further includes: Acquire a second trigger signal, where the second trigger signal is a signal for controlling the glass to move in a corresponding length in a circumferential direction at a preset initial position; According to the second trigger signal, the cutting laser is controlled to emit light again.

5. The glass laser chamfering method according to any one of claims 1 to 4, characterized in that: The step of controlling the glass to make circumferential motion of corresponding lengths at the plurality of height positions of the laser processing point so as to form micro cracks on the circumferential side of the glass comprises: Controlling the glass to perform circumferential motion at the Nth height position along a first trajectory; The glass is controlled to perform circumferential motion at the N+1th height position along a second trajectory, wherein the length of the second trajectory is less than the length of the first trajectory.

6. The glass laser chamfering method according to claim 5, characterized in that: After the step of controlling the glass to perform circumferential motion at the N+1th height position along the second trajectory, the method further includes: The glass is controlled to perform circumferential motion at the N+2 th height position along a third track, wherein a spacing value between the first track and the second track is equal to a spacing value between the second track and the third track.

7. The glass laser chamfering method according to any one of claims 1 to 4, characterized in that: The step of cracking the glass along the path direction of the microcracks so that the glass has chamfers comprises: According to the path direction, setting a heating path; The heating laser is controlled to emit light along the heating path, so that after the micro cracks are heated to expand and then cooled to shrink, the glass cracks are chamfered.

8. A laser processing system, characterized in that: The laser processing system applies the glass laser chamfering method according to any one of claims 1 to 7, and the laser processing system comprises: A two-dimensional translation module, wherein the two-dimensional translation module has a translation platform, and the translation platform is used to place the glass to drive the glass to move in a circumferential direction; A cutting laser, wherein the cutting laser and the two-dimensional translation module are spaced apart in the vertical direction, the cutting laser comprises a focusing mirror, the light-emitting focus of the focusing mirror is used to focus the glass, and the height position of the light-emitting focus at the glass is adjustable to cooperate with the translation platform to guide the glass to form microcracks; and A splitting assembly is arranged at intervals with the two-dimensional translation module and the cutting laser, and is used to split the glass along the path direction of the microcracks so that the glass is formed with the chamfer.

9. The laser processing system according to claim 8, characterized in that: The cutting laser also includes a lifting shaft, and the lifting shaft is used to drive the focusing mirror to move up and down to adjust the height position of the light output focus on the glass.

10. The laser processing system according to claim 8, characterized in that: The crack assembly includes a heating laser and a heating platform, wherein the heating laser and the heating platform are spaced apart, the heating platform is used to place the glass, and the heating laser is used to perform laser heating on the microcracks so that the microcracks expand due to heat; after the microcracks shrink due to cold, the glass cracks are formed with the chamfers.

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