Preparation method of slotting-free polishing disc

Abstract

The invention discloses a preparation method of a slotting-free polishing disk, which comprises the following steps: placing an inert mold on a substrate with non-woven fabric on the surface, then pouring a polishing layer front material, placing, then taking out the inert mold, and then curing to obtain the slotting-free polishing disk. A finished product of a polishing disc adopted in the market is obtained in a grooving mode after a working layer is solidified, or a finished product is obtained in a polishing piece pasting mode, the former is used for a thin substrate, the latter is used for a thick substrate, and no polishing disc suitable for a substrate with the wide-range thickness exists in the prior art. The polishing layer front material can be cured at the room temperature, a polishing layer is obtained, particularly, after the polishing agent is cured at the room temperature, the polishing agent can be used for workpiece polishing without aftertreatment such as finishing and grooving, and the polishing agent is suitable for substrates with the wide-range thickness.

Description

Technical Field

[0001] The invention belongs to advanced material technology and relates to a polishing tool, in particular to a method for preparing a groove-free polishing disc, which solves the problem that existing polishing discs need to be grooved. Background Art

[0002] For products with very high precision requirements, polishing is required to ensure product quality. Therefore, it is particularly important to polish them through a flat polishing platform during the production process. For workpieces with high surface roughness requirements, they are processed multiple times using tools with different mesh sizes. The equipment used for polishing is single-sided or double-sided polishing equipment. The polishing disc is installed behind the polishing machine to process the workpiece.

[0003] CN119115786A discloses a rough polishing process applied to diamond substrates, wherein a preselected polishing pad is installed, and a multi-level grooving method is selected according to the required rough polishing accuracy, and rough polishing is performed layer by layer starting from the initial grinding to form a smooth and uniform grinding surface. CN118769032A discloses a polishing method for large-caliber potassium dihydrogen phosphate crystal elements, wherein the polishing disc is first turned into a micro-convex parabola by a displacement compensation turning method before polishing, and square grid grooves are opened on the surface of the polishing disc after turning. CN221984800U discloses a polishing disc with a new type of connection structure, and the upper surface of the polishing layer has spiral grooves. CN112207877B discloses a method for generating spiral grooves on the surface of an asphalt polishing disc in annular polishing, wherein a milling cutter is controlled by a machine tool to mill and generate spiral grooves on the surface of the asphalt polishing disc in a planned spiral path. CN201552490U discloses a polishing disc specifically for quartz wafers, and there are criss-cross grooves on the polishing pad.

[0004] The polishing discs currently used in the market are obtained by grooving after the working layer is solidified, or by pasting polishing sheets. The former is used for thin substrates, and the latter is used for thick substrates. The prior art does not have a polishing disc suitable for substrates with a wide range of thicknesses. Summary of the invention

[0005] The invention discloses a method for preparing a groove-free polishing disc, which solves the problem that existing polishing discs need to be grooved. Moreover, the method of the invention is applicable to substrates of different thicknesses, and polishing discs with good performance can be prepared from 0.2 mm to 25 mm.

[0006] The present invention adopts the following technical scheme.

[0007] A method for preparing a groove-free polishing disc comprises the following steps: placing an inert mold on a substrate with a non-woven fabric on the surface, pouring a polishing layer precursor, removing the inert mold after placement, and then curing to obtain a groove-free polishing disc.

[0008] In the present invention, the shape and size of the inert mold are designed according to the specifications of the polishing layer of the groove-free polishing disk, which is a conventional technology and does not affect the technical effect of the present invention understood by those skilled in the art; the inert mold refers to a mold that is not bonded to the polishing layer front material and is easy to demold. The specific materials and methods for preparing the inert mold are conventional technologies. For example, silicone materials can be selected and prepared by 3D printing, which does not affect the technical effect of the present invention understood by those skilled in the art.

[0009] In the present invention, when the inert mold is placed on the substrate with non-woven fabric on the surface, it can be placed directly or temporarily bonded, as long as it does not affect the subsequent removal of the mold, such as by using foam glue for temporary fixation.

[0010] In the present invention, the substrate with non-woven fabric on the surface includes the substrate and the non-woven fabric on the surface thereof; the non-woven fabric and the substrate are both conventional products that meet the conventional requirements of the polishing disc, for example, the substrate with non-woven fabric on the surface can be formed by using adhesive-backed non-woven fabric to stick to the substrate. The polishing disc of the present invention is independent of the substrate, and the penetration between the resin liquid and the adhesive-backed non-woven fabric completes the bonding of the binder to different substrates, thereby improving the processing effect; in addition, compared with a single resin or ceramic polishing disc, mixing polymeric particle abrasives into the resin binder can further improve the life, sharpness and surface quality of the polishing disc.

[0011] In the present invention, the pre-polishing layer material includes a resin binder, a pore-forming agent, and a polymeric particle abrasive; preferably, the pre-polishing layer material prepared by the present invention with the resin binder, the pore-forming agent, and the polymeric particle abrasive has leveling properties, and can be poured into a mold to fill the mold cavity; preferably, the inert mold is placed on a substrate with a non-woven fabric on the surface, and then the pre-polishing layer material is poured, wherein the pre-polishing layer material exceeds the upper surface of the inert mold by 0 to 0.2 mm, preferably 0.05 to 0.15 mm; after placement, the inert mold is removed, and then solidified to obtain a non-grooving polishing disc. The technical solution in which the pre-polishing layer material exceeds the upper surface of the inert mold is preferably conducive to the leveling of the abrasive layer.

[0012] In the present invention, removing the mold is a conventional technique, and the mold can be removed as long as the shape of the pre-polishing layer material is not affected. For example, the inert mold can be removed when the pre-polishing layer material is dry, and then the pre-polishing layer material is left to solidify. The present invention can solidify the pre-polishing layer material at room temperature to obtain the polishing layer. In particular, after the present invention is solidified at room temperature, no post-processing is required, such as no trimming or grooving is required, and the workpiece can be used for polishing.

[0013] Resin polishing discs are less sharp than ceramic polishing discs and are more prone to clogging, but they have a longer life and better processing surface. To ensure effective bonding between the substrate and the abrasive layer, ceramic polishing discs can currently only be used on thicker, non-deformable substrates. Polishing discs with thinner substrates generally use resins with lower hardness as binders, and the hardness of the resin binder should not be too high. However, in order to ensure cutting force and self-sharpening, the hardness of the resin needs to be increased as much as possible. After the two are balanced, the sharpness of the polishing disc cannot be further improved. Furthermore, the bonding of the abrasive layer used in the market currently has higher requirements on the properties of the substrate. For thinner substrates (which can be deformed by hand), such as metallographic polishing discs, diamond polishing pads are bonded to the substrate with ultraviolet curing resin, and the cost of irradiation equipment and consumables invested is relatively high. For thicker substrates, the bonding method of ordinary polishing discs will bond the agglomerates one by one, and the product preparation efficiency is low and the cost is higher. Moreover, the current technology uses pore-forming balls or heated volatilization-type pore-forming agents to make holes in polishing disks with ceramic or resin bonds. The holes made by the pore-forming balls will remain in the bond, affecting the processing quality. The heated volatilization-type pore-forming agents require a high temperature of about 700°C to volatilize, and the pore-forming conditions are high.

[0014] The present invention provides a method for manufacturing an integrally formed polishing disc which takes into account tool life, sharpness and self-dressing as well as the surface quality of a metal workpiece. The method mainly utilizes a new polishing layer pre-material to overcome the technical prejudice in the prior art that polishing discs need to be grooved. After the polishing layer pre-material is solidified, no groove is required to obtain a product that can directly polish and process the metal workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Mold diagram for inert materials.

[0016] Figure 2 Schematic diagram of material distribution.

[0017] Figure 3 This is a picture of the finished product.

[0018] Figure 4 This is a cross-sectional view of the finished product.

[0019] Figure 5 This is the result of conventionally processing stainless steel workpieces with the product of the present invention and existing products. DETAILED DESCRIPTION

[0020] In the present invention, the double-ring resin liquid penetrates into the non-woven fabric with a backing adhesive, and the bonding between the binder and different substrates is completed without dependence on the substrate. The present invention mixes a self-made pore into the double-ring resin binder, and its single particle is sun-shaped under a microscope. After the resin is fully stirred with the pore-forming agent, a porous structure can be naturally formed during the curing process. Polymeric particle abrasives are also mixed into the resin binder. Compared with the existing polishing discs, the service life, sharpness and surface quality of the polishing discs can be further improved.

[0021] The present invention prepares a new polishing layer pre-material, places an inert mold on a substrate with a non-woven fabric on the surface, then pours the polishing layer pre-material into it, takes out the inert mold after placing it, and then solidifies it to obtain a polishing disc without slotting; the technical prejudice of the prior art that polishing discs need to be slotted is overcome, and after the polishing layer pre-material is solidified, a product that can directly polish and process metal workpieces can be obtained without slotting.

[0022] The following is a detailed description of the technical progress of the present invention through specific experiments. The raw materials used are commercially available products, and the specific preparation operations and performance tests are all conventional technologies. Phenolic resin powder is a product for combining existing grinding wheels with abrasives, and it only needs to meet the conventional requirements of grinding wheels and abrasives; double-ring resin, Wanglin New Materials WL1901, diluent and curing agent are supporting products of the manufacturer, with a curing ratio of 100:3 and a solid content of 65%. Resin, curing agent and diluent constitute the resin binder. The non-woven fabric is Pengxu self-adhesive grade A environmentally friendly non-woven fabric, with a gram weight specification of 50g and self-adhesive backing. The mesh range of diamond is 300#~1000#, 500#~600# for experiments; the mesh range of iron powder is 2000#~3000#.

[0023] Preparation Example 1 A pore-forming agent is prepared, which is in powder form and is alloy powder particles with glass fibers attached to the surface; wherein the alloy powder includes nickel iron powder, white copper powder, etc.; the preparation method is to mix the alloy powder, glass fiber powder, and bonding system, solidify them into blocks, and then crush them to obtain the pore-forming agent, in which the alloy powder is 40-60% by mass, the glass fiber powder is 30-50% by mass, and the bonding system is the balance. Preferably, in terms of mass percentage, the alloy powder is 48-53%, the glass fiber powder is 37-43%, and the bonding system is the balance.

[0024] According to the mass percentage, the formula is: alloy powder-50%, adhesive-10%, glass fiber powder-40%; the alloy is white copper powder, the particle size is 4000#~5000#, the adhesive is Xingchen E-44 / 6101 epoxy resin system, the curing ratio is 4:1, and the particle size of the glass fiber powder is 1000#-2000#. The preparation method is: the alloy powder, adhesive, glass fiber powder, and adhesive curing agent are conventionally stirred evenly, poured into the colloid through a silicone mold, and then demolded to form a particle agglomerate, which is crushed by a crusher and then screened for use. The particle size distribution is 10μm~40μm, which is used in the following embodiments.

[0025] Preparation Example 2 A resin-bonded aggregate abrasive is prepared by mixing abrasive, metal powder, resin powder, and protein solution, granulating the mixture, and then solidifying the mixture to obtain a polymerized particle abrasive. Furthermore, the abrasive, metal powder, resin powder, and protein solution are mixed and granulated in water, and then filtered. The filter cake is then mixed with silicon dioxide, solidified, and then crushed and sieved to obtain a multi-blade phenolic resin polymerized particle abrasive.

[0026] In terms of mass percentage, the resin powder is 30-50%, the diamond powder is 10-30%, the metal powder is 5-15%, and the egg protein liquid is the balance. Preferably, in terms of mass percentage, the resin powder is 38-41%, the diamond powder is 17-22%, the metal powder is 8-11%, and the egg protein liquid is the balance.

[0027] A self-made resin-bonded aggregate multi-blade abrasive is prepared as follows: phenolic resin powder, iron powder, diamond powder, and egg protein liquid are mixed into a colloid, and then spray granulated by spraying, sprayed into 100°C water, condensed into a preliminary aggregate abrasive, filtered, and the filter cake is mixed with silicon dioxide particles (10-20μm), and finally baked at 200°C to form, sieved, and particles with a diameter of 55-65 microns are taken as aggregate particle abrasives for the following embodiments.

[0028] In terms of mass percentage, resin powder is 40%, diamond powder is 20%, iron powder is 10%, and egg protein liquid is 30%; in terms of volume percentage, silica particles account for 50% of the filter cake.

[0029] Embodiment 1 The present invention uses resin binder, pore-forming agent and polymerized particle abrasive to prepare the polishing layer pre-material, which has leveling property and can fill the mold cavity when poured into the mold.

[0030] In the present invention, the mass ratio of the resin binder, the pore-forming agent, and the polymer particle abrasive is (30-70): (1-3): (35-50).

[0031] Preferably, the mass ratio of the resin binder, the pore-forming agent, and the polymeric abrasive particles is (50-56): (1-3): (40-45).

[0032] The polishing disc of the present invention adopts a new preparation method, using a flexible double-ring resin liquid as a binder, a high-toughness non-woven fabric with a back adhesive as an intermediate layer between the processing layer and the substrate, and sticking one side with the back adhesive to the substrate, and using a high-precision 3D printed inert material on one side as a grid mold (made by conventional methods, see Figure 1 , is a soft silicone finished product, which is printed by FDM (fused deposition modeling) 3D printer. The printing consumables are: Youxian TPU95A-1.75 and other elastic wires; in actual production, technicians in this field can also use other methods to obtain inert molds) for slotting and height measurement. The mold is sprayed with foam glue on one side and then laid flat and bonded to the non-woven fabric. The non-woven fabric is porous and highly permeable. Pour the prepared mixed liquid (pre-polishing layer material) evenly into the mold, and complete the reliable bonding of the binder and the substrates with different properties through the penetration between the resin liquid and the flexible non-woven fabric with adhesive backing. Because the colloid is in a fluid state, it is self-leveled after controlling the flow rate. After waiting for solidification, the grid mold is finally removed to form, without the need for separate bonding, trimming, and slotting.

[0033] According to the mass percentage, the bicyclic resin binder is 54%, the polymerized particle abrasive is 44%, and the pore-forming powder is 2%. The mixture is conventionally mixed to obtain the pre-polishing layer material.

[0034] The product production method is as follows: 1. Spray foam glue on one side of an inert mold and place it flat on the surface of a non-woven fabric (thickness 0.2mm) bonded to the surface of a stainless steel plate (thickness 0.5mm); 2. Pour the prepared mixed liquid (pre-polishing material) evenly into the mold, with the height exceeding the mold by 0.1mm. Figure 2 It is a schematic diagram of material distribution; 3. After the surface of the polishing layer is dry, remove the mold manually and continue to solidify at room temperature before forming. No further post-processing such as shaping and grooving is required.

[0035] Figure 3 This is a real photo of the high-efficiency polishing disc mentioned above. Figure 4 Its cross-sectional view.

[0036] Embodiment 2 On the basis of Example 1, the resin binder-55%, the polymerized abrasive particles-43%, and the pore-forming agent-2% were conventionally mixed to obtain a polishing layer pre-material.

[0037] For the rest, refer to Example 1, after further curing at room temperature, a polishing disc can be obtained without further post-processing such as shaping and grooving.

[0038] Embodiment 3 Conventional processing of stainless steel workpieces on the production side is an existing method. Figure 5 ,Comparison between the product of Example 2 and the imported product on the left side of the customer (the product currently used in production), the scratch deviation of the imported product is 5.75μm, and the scratch deviation of the product of Example 2 is 2.53μm, and the processing uniformity is higher; the removal rate of the imported product is 0.114g / min, and the polishing disc of Example 2 is 0.134g / min, and the removal rate is higher than the imported one.

[0039] Comparative Example 1 On the basis of Example 2, existing hollow glass microspheres are used to replace the product of Preparation Example 1 as a pore-forming agent, and the rest is the same to obtain a polishing disk. Referring to the processing method of Example 3, the scratch deviation is 6.53 μm.

[0040] Embodiment 4 On the basis of Example 1, the stainless steel disc has a thickness of 5 mm, and the rest is referred to Example 1. After further curing at room temperature, it can be formed into a polishing disc without further post-processing such as shaping and grooving.

[0041] Embodiment 5 On the basis of Example 1, the stainless steel disc has a thickness of 18 mm and the non-woven fabric has a thickness of 0.3 mm. The rest is referred to Example 1. After further curing at room temperature, a polishing disc can be formed without further post-processing such as shaping and grooving.

[0042] In the present invention, the substrate and non-woven fabric are existing products. For example, the substrate is a metal substrate, and its thickness is any existing substrate, which only needs to meet the requirements of the polishing equipment, such as greater than 0.1mm, further greater than 0.2mm, such as 0.3mm to 30mm; the woven fabric is a conventional non-woven fabric, and its thickness is 0.05mm to 1mm, preferably 0.1 to 0.5mm, and further preferably 0.2 to 0.4mm, and its porosity is 50 to 200 / cm², preferably 80 to 150 / cm².

[0043] The present invention adopts a new type of physical pore-forming method. After the pore-forming agent is mixed with the binder double-ring resin, the pore-forming powder particles can be understood as a filler. Due to its surface properties, a large number of tiny pores can be naturally formed in the resin binder after the binder resin is stirred and attached to the pore-forming powder. After solidification, the pores are retained, which improves the chip removal and heat dissipation capabilities of the grinding wheel. It has low adhesion to the binder resin and is easy to detach. The self-sharpening of the polishing tool is improved. Because the surface property of its pore-forming agent is flexible, the particles have no effect on the surface quality of the processed workpiece after peeling. After screening and grading, it is used as a high-cutting force aggregate abrasive. After the resin aggregate abrasive is secondary matched with the resin binder, the cutting force of the polishing disc is increased, the damage to the workpiece surface is reduced, and the service life is increased. Compared with existing products, the present invention unexpectedly improves the polishing removal rate while significantly reducing the scratch deviation, and has good application capabilities.

Claims

1. A method for preparing a groove-free polishing disc, comprising the following steps: placing an inert mold on a substrate with a non-woven fabric on the surface, then pouring a polishing layer precursor, removing the inert mold after placement, and then curing to obtain a groove-free polishing disc.

2. The method for preparing a groove-free polishing disc according to claim 1, characterized in that: Direct placement is used when placing an inert mold on a substrate with a nonwoven surface.

3. The method for preparing a groove-free polishing disc according to claim 1, characterized in that: Temporary bonding is used when an inert mold is placed on a substrate with a nonwoven surface.

4. The method for preparing a groove-free polishing disc according to claim 1, characterized in that: The nonwoven fabric is adhered to the substrate to form a substrate with the nonwoven fabric on the surface.

5. The method for preparing a groove-free polishing disc according to claim 1, characterized in that: The polishing layer precursor includes a resin binder, a pore-forming agent, and polymeric particle abrasives.

6. The method for preparing a groove-free polishing disc according to claim 1, characterized in that: The inert mold is placed on a substrate with non-woven fabric on the surface, and then the pre-polishing layer material is poured in, wherein the pre-polishing layer material exceeds the upper surface of the inert mold by 0 to 0.2 mm.

7. The method for preparing a groove-free polishing disc according to claim 1, characterized in that: After curing, no post-treatment is required.

8. A groove-free polishing disc prepared by the method for preparing a groove-free polishing disc according to claim 1.

9. Use of the groove-free polishing disc according to claim 8 in polishing processing.

10. A method for polishing a workpiece, characterized in that: The method comprises the following steps: polishing a workpiece by using the groove-free polishing disc as described in claim 8 to achieve polishing of the workpiece.

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