Monocrystalline silicon slicing device for chip production

Abstract

The invention relates to the field of chip production, in particular to a monocrystalline silicon slicing device for chip production. The machine comprises a rack, a feeding and discharging mechanism, a supporting table, a pressing mechanism and a fret saw mechanism. The feeding and discharging mechanism comprises two feeding and discharging assemblies horizontally and symmetrically arranged on the rack. The supporting table is horizontally arranged on the rack; the downward pressing mechanism comprises a pressing table horizontally arranged above the supporting table and a second hydraulic cylinder which is arranged on the rack and drives the pressing table to ascend and descend, and the supporting table and the pressing table are used for clamping the silicon single crystal rod raw materials; the wire saw mechanism comprises a plurality of inverted triangular saw wires which are horizontally arranged side by side, a power mechanism for driving the saw wires to operate, and a third hydraulic cylinder which is arranged on the rack and drives the power mechanism to ascend and descend so as to cut the monocrystalline silicon rod raw material into a plurality of monocrystalline silicon wafers. According to the invention, a plurality of monocrystalline silicon wafers with uniform quality can be cut at one time, and the cutting efficiency is high.

Description

Technical Field

[0001] The invention relates to the field of chip production, and in particular to a single crystal silicon slicing device for chip production. Background Art

[0002] The upstream of the MCU chip industry chain is semiconductor materials and semiconductor equipment, mainly including silicon wafers, photoresists, photomasks, electronic special gases, targets, single crystal furnaces, etc. The midstream is the MCU manufacturing process, mainly including chip design, single crystal silicon wafer manufacturing, wafer manufacturing and chip packaging and testing. In the manufacturing of single crystal silicon wafers, single crystal silicon rods need to be cut into single crystal silicon wafers.

[0003] Chinese patent publication number CN116512451A discloses a single crystal silicon slicing device for chip production, including a support slide plate, a sliding support plate, a fixed mounting frame, a servo motor, a fixed support seat, etc.; the top of the support slide plate is slidably connected to the sliding support plate, the sliding support plate is fixedly mounted with a fixed mounting frame, the fixed mounting frame is provided with a servo motor, and the top of the support slide plate is fixedly mounted with a fixed support seat. When the single crystal silicon wafer has not been completely cut off, the support limit plate can offset the gravity on the single crystal silicon wafer, and the single crystal silicon wafer will not have a slight deflection under the action of gravity, and a single crystal silicon wafer with a smooth surface can be cut out.

[0004] However, the above technical solution has the following shortcomings:

[0005] Only one single crystal silicon wafer can be cut out in one cutting process, the cutting efficiency is low, and the quality of single crystal silicon wafers cut out in multiple times is not uniform. Summary of the invention

[0006] The purpose of the present invention is to address the problems existing in the background technology and to propose a single crystal silicon slicing device for chip production which can cut out multiple single crystal silicon wafers of uniform quality at one time and has high slicing efficiency.

[0007] The technical solution of the present invention is a single crystal silicon slicing device for chip production, comprising a frame, a loading and unloading mechanism, a support, a pressing mechanism and a wire saw mechanism; the loading and unloading mechanism comprises two sets of loading and unloading components horizontally and symmetrically arranged on the frame; the support is horizontally arranged on the frame; the pressing mechanism comprises a pressing platform horizontally arranged above the support and a second hydraulic cylinder arranged on the frame and driving the pressing platform to rise and fall, the support and the pressing platform are used to clamp the single crystal silicon rod raw material; the wire saw mechanism comprises a plurality of inverted triangle saw wires horizontally arranged side by side, a power mechanism for driving the saw wires to operate, and a third hydraulic cylinder arranged on the frame and driving the power mechanism to rise and fall to cut the single crystal silicon rod raw material into a plurality of single crystal silicon wafers.

[0008] Preferably, the loading and unloading assembly includes a slide rail horizontally arranged on the frame, a sliding table slidably arranged on the slide rail, a screw rod rotatably arranged on the slide rail and threadedly connected to the sliding table, a motor arranged on the slide rail and driving the screw rod to rotate, a lifting mechanism vertically arranged on the top of the sliding table, a first lifting frame arranged on the top of the lifting mechanism, a first hydraulic cylinder horizontally arranged on the first lifting frame, a clamping table arranged at the moving end of the first hydraulic cylinder and a first sliding rod horizontally arranged on the clamping table, and the first sliding rod is slidably arranged on the first lifting frame.

[0009] Preferably, the side of the clamping platform has a first arc-shaped clamping groove for clamping the single crystal silicon rod raw material, the bottom of the first clamping groove has a second arc-shaped clamping groove for clamping the single crystal silicon wafer, and the radii of the first clamping groove and the second clamping groove are equal.

[0010] Preferably, the top surface of the support platform has an arc-shaped placement groove, the bottom of the placement groove has a plurality of first wire-accommodating grooves for multiple saw wires to pass through respectively, and the bottom surface of the pressing platform has an arc-shaped clamping groove, the bottom of the clamping groove has a plurality of second wire-accommodating grooves for multiple saw wires to pass through respectively, and the radii of the clamping groove and the placement groove are equal.

[0011] Preferably, the power mechanism includes a U-shaped second lifting frame, two first wire rollers symmetrically rotatably arranged on the upper part of the second lifting frame, a second wire roller rotatably arranged in the middle and lower area of ​​the two first wire rollers, and a first motor arranged on the second lifting frame and driving one of the first wire rollers to rotate, the outer periphery of the first wire roller has multiple circles of first annular grooves for the saw wire to be embedded in, the outer periphery of the second wire roller has multiple circles of second annular grooves for the saw wire to be embedded in, the top end of the third hydraulic cylinder is connected to the second lifting frame, and the bottom of the second lifting frame is vertically provided with a second sliding rod slidably connected to the frame.

[0012] Preferably, a guide rod is vertically arranged on the second lifting frame, a top plate is connected to the top of the guide rod, a tensioning frame is slidably arranged on the guide rod, the second line roller is rotatably arranged on the tensioning frame, and a spring sleeved on the outer peripheral side of the guide rod is connected between the tensioning frame and the top plate.

[0013] Preferably, a first wire roller is connected to a toggle column rotatably arranged on the second lifting frame through a belt transmission mechanism, and the toggle column has an arc-shaped pushing surface for intermittently toggling the saw wire.

[0014] Preferably, a chip box is provided on the frame, and the top ends of both sides of the chip box have chip feed openings corresponding to those located below the edges of both sides of the support platform, and the bottom end of the chip box is detachably connected to a bottom plate that can seal the bottom opening of the chip box, and the chip box has multiple exhaust ports distributed side by side on both sides in the horizontal direction, and filters and mounting cylinders are respectively provided on both sides of the exhaust ports, and a bracket is provided inside the mounting cylinder, and a mounting shaft is rotatably provided on the bracket, and a second bevel gear and a fan blade structure are coaxially provided on the mounting shaft, and a second motor is provided on the chip box, and the second motor is driven by a rotating shaft, which passes through the mounting cylinder and is rotatably connected to the mounting cylinder, and a plurality of first bevel gears that are respectively meshed with the plurality of second bevel gears are provided on the rotating shaft.

[0015] Preferably, the bottom of the first wire-accommodating groove is an inverted V-shaped surface.

[0016] Preferably, an inverted V-shaped baffle is provided inside the chip collecting box, and chip falling channels are formed between both ends of the baffle and the inner wall of the chip collecting box.

[0017] Compared with the prior art, the present invention has the following beneficial technical effects:

[0018] The present invention can cut out multiple monocrystalline silicon wafers of uniform quality at one time, and has high slicing efficiency. The power mechanism drives multiple saw wires to operate simultaneously, and the third hydraulic cylinder drives the power mechanism to rise, and multiple saw wires rise simultaneously, which can cut the cylindrical monocrystalline silicon rod raw material into multiple monocrystalline silicon wafers during the movement, effectively improving the efficiency of monocrystalline silicon slicing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0020] Figure 2 It is a schematic diagram of the movement principle structure of the clamping table;

[0021] Figure 3 A schematic diagram of a local structure for driving the saw wire to move;

[0022] Figure 4 A cross-sectional view of a local structure for collecting debris through a chip collecting box;

[0023] Figure 5 for Figure 4 A magnified view of the structure at center A;

[0024] Figure 6 It is a structural cross-sectional view of the press table.

[0025] Figure numerals: 1, frame; 2, slide rail; 3, sliding table; 4, lifting mechanism; 5, first lifting frame; 6, first hydraulic cylinder; 7, clamping table; 701, first clamping groove; 702, second clamping groove; 8, first sliding rod; 9, support table; 901, placement groove; 902, first wire accommodating groove; 10, pressing table; 101, pressing groove; 102, second wire accommodating groove; 11, second hydraulic cylinder; 12, third hydraulic cylinder; 13, second lifting frame; 14, first wire roller; 15, first Second wire roller; 16, saw wire; 17, tensioning frame; 18, guide rod; 181, top plate; 19, spring; 20, first motor; 21, toggle column; 22, second sliding rod; 23, chip box; 231, chip inlet; 232, air outlet; 24, bottom plate; 25, filter; 26, mounting cylinder; 27, second motor; 28, rotating shaft; 29, first bevel gear; 30, second bevel gear; 31, mounting shaft; 32, fan blade structure; 33, bracket; 34, baffle. DETAILED DESCRIPTION

[0026] Embodiment 1

[0027] like Figure 1-Figure 6 As shown, a single crystal silicon slicing device for chip production proposed in this embodiment includes a frame 1, a loading and unloading mechanism, a support table 9, a pressing mechanism and a wire saw mechanism.

[0028] The loading and unloading mechanism includes two groups of loading and unloading components horizontally and symmetrically arranged on the frame 1. The loading and unloading components include a slide rail 2 horizontally arranged on the frame 1, a sliding table 3 slidably arranged on the slide rail 2, a screw rod rotatably arranged on the slide rail 2 and threadedly connected to the sliding table 3, a motor arranged on the slide rail 2 and driving the screw rod to rotate, a lifting mechanism 4 vertically arranged on the top of the sliding table 3, a first lifting frame 5 arranged on the top of the lifting mechanism 4, a first hydraulic cylinder 6 horizontally arranged on the first lifting frame 5, a clamping table 7 arranged at the moving end of the first hydraulic cylinder 6, and a first sliding rod 8 horizontally arranged on the clamping table 7, and the first sliding rod 8 is slidably arranged on the first lifting frame 5. The lifting mechanism 4 adopts a hydraulic cylinder or a cylinder that can drive the clamping table 7 to move horizontally.

[0029] During loading, the two clamping platforms 7 first clamp the single crystal silicon rod raw material from both sides, and then the motor drives the screw to rotate, and the screw drives the sliding platform 3 to move, so that the two clamping platforms 7 move to both sides of the support platform 9. Then, the lifting mechanism 4 lowers the first lifting frame 5, and the two clamping platforms 7 put the clamped single crystal silicon rod raw material onto the support platform 9. The first hydraulic cylinder 6 drives the clamping platform 7 to move outward, and the clamping platform 7 moves away from the single crystal silicon rod raw material.

[0030] After the single crystal silicon rod raw material is cut into multiple single crystal silicon wafers by the wire saw mechanism, the single crystal silicon wafer is unloaded. First, the two clamping tables 7 move toward each other to clamp the single crystal silicon wafer, then the pressing mechanism is moved upward, and then the lifting mechanism 4 drives the first lifting frame 5 to move upward, and the clamping table 7 drives the single crystal silicon wafer to move upward. Then, the motor is started to horizontally move the single crystal silicon wafer out from between the support table 9 and the pressing mechanism, and finally the clamped single crystal silicon wafer is removed.

[0031] like Figure 2 As shown, the side of the clamping table 7 has a first arc-shaped clamping groove 701 for clamping the single crystal silicon rod raw material, and the radius of the first clamping groove 701 is equal to the radius of the cylindrical single crystal silicon rod raw material. The bottom of the first clamping groove 701 has a second arc-shaped clamping groove 702 for clamping the single crystal silicon wafer, and the radius of the first clamping groove 701 and the second clamping groove 702 are equal. When the clamping table 7 is used for loading the single crystal silicon rod raw material, the two clamping tables 7 clamp the single crystal silicon rod raw material through the first clamping groove 701, and can clamp it firmly. When the clamping table 7 is used for unloading the single crystal silicon wafer, the single crystal silicon wafer extends into the inner side of the second clamping groove 702 and is clamped, so that it is firmly clamped and the single crystal silicon wafer will not fall.

[0032] The support platform 9 is horizontally arranged on the frame 1, and is used to support the single crystal silicon rod raw materials transferred by the loading and unloading mechanism.

[0033] like Figure 1 As shown, the pressing mechanism includes a pressing platform 10 horizontally arranged above the support platform 9 and a second hydraulic cylinder 11 arranged on the frame 1 and driving the pressing platform 10 to move up and down. After the single crystal silicon rod raw material is placed on the support platform 9, the second hydraulic cylinder 11 drives the pressing platform 10 to move down, and the pressing platform 10 presses the single crystal silicon rod raw material on the support platform 9. After the single crystal silicon rod raw material is cut into multiple single crystal silicon wafers, the single crystal silicon wafers are first clamped by the clamping platform 7, and then the pressing platform 10 is driven to move up by the second hydraulic cylinder 11, and the first lifting frame 5 is driven to move up by the lifting mechanism 4. The upward movement distance of the first lifting frame 5 is less than the upward movement distance of the pressing platform 10.

[0034] The wire saw mechanism includes a plurality of inverted triangular saw wires 16 arranged horizontally side by side, a power mechanism for driving the saw wires 16, and a third hydraulic cylinder 12 arranged on the frame 1 and driving the power mechanism to rise and fall so as to cut the single crystal silicon rod raw material into a plurality of single crystal silicon wafers. The plurality of saw wires 16 can cut the single crystal silicon rod raw material during operation to cut out a plurality of single crystal silicon wafers. The thickness of a single single crystal silicon wafer is the spacing between two adjacent saw wires 16.

[0035] The top surface of the support 9 has an arc-shaped placement groove 901, so that the cylindrical single crystal silicon rod raw material can be stably placed. The bottom of the placement groove 901 has a plurality of first wire-accommodating grooves 902 for multiple saw wires 16 to pass through. The bottom surface of the press table 10 has an arc-shaped clamping groove 101, so that the cylindrical single crystal silicon rod raw material can be stably clamped. The bottom of the clamping groove 101 has a plurality of second wire-accommodating grooves 102 for multiple saw wires 16 to pass through. The radius of the clamping groove 101 and the placement groove 901 are equal, and are both equal to the radius of the single crystal silicon rod raw material. The saw wire 16 is located on the inner side of the first wire-accommodating groove 902 in the initial state. When the saw wire 16 moves up, it can completely penetrate the single crystal silicon rod raw material and enter the inner side of the second wire-accommodating groove 102 to cut out a complete single crystal silicon wafer. Then, the saw wire 16 moves down to the inner side of the first wire-accommodating groove 902 to prepare for the next cutting process.

[0036] This embodiment can cut out multiple single crystal silicon wafers of uniform quality at one time, and the slicing efficiency is high. The power mechanism drives multiple saw wires 16 to operate simultaneously, and the third hydraulic cylinder 12 drives the power mechanism to rise, and then multiple saw wires 16 rise simultaneously, and can cut the cylindrical single crystal silicon rod raw material into multiple single crystal silicon wafers during the movement, effectively improving the efficiency of single crystal silicon slicing. After slicing, the two clamping tables 7 can also be used to stably clamp the single crystal silicon wafer for unloading, and the single crystal silicon wafer will not fall during the unloading process.

[0037] Embodiment 2

[0038] like Figure 1-Figure 6 As shown, the present embodiment proposes a single crystal silicon slicing device for chip production. Compared with the first embodiment, in the present embodiment, the power mechanism includes a U-shaped second lifting frame 13, two first wire rollers 14 symmetrically rotatably arranged on the upper part of the second lifting frame 13, a second wire roller 15 rotatably arranged in the middle and lower area of ​​the two first wire rollers 14, and a first motor 20 arranged on the second lifting frame 13 and driving one of the first wire rollers 14 to rotate. The outer peripheral surface of the first wire roller 14 has a plurality of circles of first annular grooves for the saw wire 16 to be embedded, and the outer peripheral surface of the second wire roller 15 has a plurality of circles of second annular grooves for the saw wire 16 to be embedded, the top end of the third hydraulic cylinder 12 is connected to the second lifting frame 13, and the bottom of the second lifting frame 13 is vertically provided with a second sliding rod 22 slidably connected to the frame 1.

[0039] In this embodiment, the first motor 20 can drive a first wire roller 14 to rotate, and the first wire roller 14 drives another first wire roller 14 and a second wire roller 15 to rotate through the saw wire 16. The saw wire 16 moves in the first annular groove and the second annular groove and is not easy to fall off or misplace.

[0040] Embodiment 3

[0041] like Figure 1-Figure 6As shown, the present embodiment proposes a single crystal silicon slicing device for chip production. Compared with the second embodiment, in the present embodiment, a guide rod 18 is vertically arranged on the second lifting frame 13. A plurality of guide rods 18 can be arranged side by side. A top plate 181 is connected to the top of the guide rod 18. A tensioning frame 17 is slidably arranged on the guide rod 18. The second wire roller 15 is rotatably arranged on the tensioning frame 17. A spring 19 sleeved on the outer peripheral side of the guide rod 18 is connected between the tensioning frame 17 and the top plate 181. A first wire roller 14 is connected to a toggle column 21 rotatably arranged on the second lifting frame 13 through a belt transmission mechanism. The toggle column 21 has an arc-shaped pushing surface for intermittently toggling the saw wire 16, thereby intermittently pushing the saw wire 16 to vibrate, shaking off the cutting debris attached to the saw wire 16, and preventing the subsequent saw wire 16 from affecting the slitting processing quality of the single crystal silicon rod raw material.

[0042] Furthermore, the arc-shaped pushing surface has a plurality of arc-shaped grooves distributed side by side, and the plurality of arc-shaped grooves correspond to pressing the plurality of saw wires 16, so that the saw wires 16 are not prone to shaking back and forth, thereby ensuring that the saw wires 16 can cut out single crystal silicon wafers with more uniform thickness.

[0043] Embodiment 4

[0044] like Figure 1-Figure 6 As shown, the present embodiment proposes a single crystal silicon slicing device for chip production. Compared with the first embodiment, in the present embodiment, a chip box 23 is provided on the frame 1. The tops of both sides of the chip box 23 have chip inlets 231 corresponding to the lower edges of the support platform 9. The bottom of the chip box 23 is detachably connected with a bottom plate 24 that can block the bottom opening of the chip box 23. When the chip box 23 is used to collect debris, the bottom plate 24 is blocked at the chip box 23 and can be fixed by a snap connection or a bolt connection. When it is necessary to clean the debris, the bottom plate 24 is removed to clean out the debris inside the chip box 23.

[0045] Both sides of the chip collecting box 23 in the horizontal direction are provided with multiple exhaust ports 232 distributed side by side, and filter screens 25 and mounting cylinders 26 are respectively arranged on both sides of the exhaust ports 232. A bracket 33 is arranged inside the mounting cylinder 26, and a mounting shaft 31 is rotatably arranged on the bracket 33. A second bevel gear 30 and a fan blade structure 32 are coaxially arranged on the mounting shaft 31. A second motor 27 is arranged on the chip collecting box 23, and the second motor 27 is driven and connected to a rotating shaft 28. The rotating shaft 28 passes through the mounting cylinder 26 and is rotatably connected to the mounting cylinder 26. The rotating shaft 28 is provided with multiple first bevel gears 29 which are respectively meshed and connected with the multiple second bevel gears 30. The second motor 27 can drive the rotating shaft 28 to rotate, the rotating shaft 28 drives the plurality of first bevel gears 29 to rotate, the first bevel gears 29 drive the corresponding second bevel gears 30 to rotate, the second bevel gears 30 drive the installation shaft 31 to rotate, the installation shaft 31 drives the fan blade structure 32 to rotate, the fan blade structure 32 blows air obliquely downward to create negative air pressure inside the chip box 23, so that the debris generated when the saw wire 16 cuts the single crystal silicon rod raw material is easier to fall into the inside of the chip box 23 from the chip inlet 231. The filter 25 can prevent the debris from entering the installation tube 26 from the exhaust port 232, and the debris entering the inside of the chip box 23 will gradually accumulate at the bottom.

[0046] like Figure 4 As shown, the bottom of the first wire receiving groove 902 is an inverted V-shaped surface, and the cutting debris is easier to slide off. An inverted V-shaped baffle 34 is provided inside the chip collecting box 23, and both ends of the baffle 34 form a chip falling channel with the inner wall of the chip collecting box 23. The chips enter the bottom of the inner side of the chip collecting box 23 from the chip falling channel and are not easy to spread upward from the chip inlet 231.

[0047] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A single crystal silicon slicing device for chip production, characterized in that: include: Rack (1); A loading and unloading mechanism, comprising two groups of loading and unloading components horizontally and symmetrically arranged on a frame (1); A support platform (9) is horizontally arranged on the frame (1); A pressing mechanism comprises a pressing platform (10) horizontally arranged above a supporting platform (9) and a second hydraulic cylinder (11) arranged on the frame (1) and driving the pressing platform (10) to move up and down, wherein the supporting platform (9) and the pressing platform (10) are used to clamp the single crystal silicon rod raw material; A wire saw mechanism comprises a plurality of inverted triangular saw wires (16) arranged horizontally side by side, a power mechanism for driving the saw wires (16) to operate, and a third hydraulic cylinder (12) arranged on a frame (1) and driving the power mechanism to rise and fall so as to cut a single crystal silicon rod raw material into a plurality of single crystal silicon slices.

2. A single crystal silicon slicing device for chip production according to claim 1, characterized in that: The loading and unloading assembly comprises a slide rail (2) horizontally arranged on a frame (1), a sliding table (3) slidably arranged on the slide rail (2), a screw rod rotatably arranged on the slide rail (2) and threadedly connected to the sliding table (3), a motor arranged on the slide rail (2) and driving the screw rod to rotate, a lifting mechanism (4) vertically arranged on the top of the sliding table (3), a first lifting frame (5) arranged at the top of the lifting mechanism (4), a first hydraulic cylinder (6) horizontally arranged on the first lifting frame (5), a clamping table (7) arranged at the moving end of the first hydraulic cylinder (6) and a first sliding rod (8) horizontally arranged on the clamping table (7), wherein the first sliding rod (8) is slidably arranged on the first lifting frame (5).

3. A single crystal silicon slicing device for chip production according to claim 2, characterized in that: The side surface of the clamping platform (7) is provided with a first arc-shaped clamping groove (701) for clamping a single crystal silicon rod raw material, the bottom of the first clamping groove (701) is provided with a second arc-shaped clamping groove (702) for clamping a single crystal silicon wafer, and the radii of the first clamping groove (701) and the second clamping groove (702) are equal.

4. The single crystal silicon slicing device for chip production according to claim 1, characterized in that: The top surface of the support platform (9) has an arc-shaped placement groove (901), the bottom of the placement groove (901) has a plurality of first wire accommodating grooves (902) for a plurality of saw wires (16) to pass through respectively, the bottom surface of the pressing platform (10) has an arc-shaped pressing groove (101), the bottom of the pressing groove (101) has a plurality of second wire accommodating grooves (102) for a plurality of saw wires (16) to pass through respectively, and the radius of the pressing groove (101) and the placement groove (901) are equal.

5. The single crystal silicon slicing device for chip production according to claim 4, characterized in that: The power mechanism comprises a U-shaped second lifting frame (13), two first wire rollers (14) symmetrically rotatably arranged on the upper part of the second lifting frame (13), a second wire roller (15) rotatably arranged in the middle and lower area of ​​the two first wire rollers (14), and a first motor (20) arranged on the second lifting frame (13) and driving one of the first wire rollers (14) to rotate, the first wire roller (14) having a plurality of circles of first annular grooves for inserting saw wires (16) on the outer circumference, the second wire roller (15) having a plurality of circles of second annular grooves for inserting saw wires (16) on the outer circumference, the top end of the third hydraulic cylinder (12) is connected to the second lifting frame (13), and the bottom of the second lifting frame (13) is vertically provided with a second sliding rod (22) slidably connected to the frame (1).

6. The single crystal silicon slicing device for chip production according to claim 5, characterized in that: A guide rod (18) is vertically arranged on the second lifting frame (13), a top plate (181) is connected to the top of the guide rod (18), a tensioning frame (17) is slidably arranged on the guide rod (18), the second line roller (15) is rotatably arranged on the tensioning frame (17), and a spring (19) sleeved on the outer peripheral side of the guide rod (18) is connected between the tensioning frame (17) and the top plate (181).

7. A single crystal silicon slicing device for chip production according to claim 6, characterized in that: A first wire roller (14) is connected to a toggle post (21) rotatably arranged on a second lifting frame (13) through a belt transmission mechanism, and the toggle post (21) has an arc-shaped pushing surface for intermittently toggling the saw wire (16).

8. The single crystal silicon slicing device for chip production according to claim 4, characterized in that: A chip collecting box (23) is arranged on the frame (1), and the tops of both sides of the chip collecting box (23) are provided with chip inlet openings (231) corresponding to the lower edges of both sides of the support platform (9), and the bottom of the chip collecting box (23) is detachably connected with a bottom plate (24) capable of blocking the bottom opening of the chip collecting box (23), and the two sides of the chip collecting box (23) in the horizontal direction are provided with a plurality of exhaust ports (232) distributed side by side, and the two sides of the exhaust ports (232) are respectively provided with filter screens (25) and mounting cylinders (26), and the mounting cylinders (26) are provided with support cylinders (26) inside. A bracket (33) is rotatably provided with a mounting shaft (31) on the bracket (33), a second bevel gear (30) and a fan blade structure (32) are coaxially provided on the mounting shaft (31), a second motor (27) is provided on the chip collecting box (23), the second motor (27) is drivingly connected with a rotating shaft (28), the rotating shaft (28) passes through the mounting tube (26) and is rotatably connected with the mounting tube (26), and a plurality of first bevel gears (29) are provided on the rotating shaft (28) and are respectively meshed and connected with the plurality of second bevel gears (30).

9. The single crystal silicon slicing device for chip production according to claim 8, characterized in that: The bottom of the first wire-accommodating groove (902) is an inverted V-shaped surface.

10. The single crystal silicon slicing device for chip production according to claim 8, characterized in that: An inverted V-shaped baffle plate (34) is arranged inside the chip collecting box (23), and chip falling channels are formed between both ends of the baffle plate (34) and the inner wall of the chip collecting box (23).

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