Feeding and discharging device suitable for large-batch semi-slice silicon wafers

Abstract

A feeding and discharging device suitable for large-batch semi-slice silicon wafers comprises a tray and a transmission assembly used for driving the tray to horizontally move, and a vertical lifting assembly used for synchronously driving the tray and the transmission assembly to ascend and descend is arranged at the bottom of the transmission assembly; a plurality of silicon wafer carriers used for loading silicon wafers are placed on the tray, a carrying assembly used for carrying the silicon wafer carriers is arranged above the tray, and a feeding assembly used for conveying the silicon wafer carriers is arranged on one side of the tray; the silicon wafer carrier comprises a carrier frame and a carrier body placed in the carrier frame, clamping pieces arranged oppositely are formed on the two sides of the carrier frame, and clamping stations used for clamping silicon wafers are formed between the clamping pieces arranged oppositely and the carrier frame. Compared with the prior art, by arranging the silicon wafer carrier used for loading the silicon wafer, the silicon wafer and the silicon wafer carrier move synchronously in the carrying process of the silicon wafer, it is ensured that the silicon wafer is always in the vertical state, and therefore the top of the silicon wafer can be conveniently subjected to winding plating.

Description

Technical Field

[0001] The invention relates to the technical field of photovoltaic cell manufacturing, and in particular to a loading and unloading device suitable for large quantities of half-sliced ​​silicon wafers. Background Art

[0002] Currently, in the battery manufacturing field of the photovoltaic industry, silicon wafers are an important material for making integrated circuits. Silicon wafers required for photovoltaic power generation can be made by means of texturing and atomic layer coating. Photovoltaic panels made of silicon wafers have greatly helped the country's green power generation, energy transformation and carbon neutrality.

[0003] When the silicon wafer is produced, the resistance inside the silicon wafer is too large when the whole silicon wafer is used to generate electricity directly. Therefore, laser is used to cut the silicon wafer so that the whole wafer is evenly divided into two halves. However, when the laser is used to cut the silicon wafer, due to the problems of silicon wafer material and process, the cut surface of the silicon wafer will have a jagged crack surface, which will affect the efficiency of photovoltaic power generation by about 0.6%. Now, the crack surface is wrapped with oxide through the winding plating equipment, which can improve the power generation efficiency of the photovoltaic panel by about 0.4%. However, due to the large production capacity of the winding plating equipment during loading and unloading, it is difficult for the loading and unloading equipment to meet its production capacity.

[0004] Chinese announcement number CN117902318A discloses a silicon wafer limiting rack and a silicon wafer loading and unloading device. By arranging multiple silicon wafer loading spaces on a rack, the silicon wafer unit suction cups on the loading and unloading mechanism correspond one to one with the distribution positions of the silicon wafer loading spaces, and multiple silicon wafers can be loaded or unloaded at the same time, ensuring the processing efficiency of silicon wafer copper plating.

[0005] The loading and unloading device disclosed above loads multiple silicon wafers through a vertically arranged hanger, grabs the silicon wafers through the loading and unloading mechanism, and a vertically arranged unit suction cup is formed on the hanger for adsorbing the silicon wafers. Since the silicon wafers themselves have a certain gravity, the unit suction cups are difficult to immediately adsorb the silicon wafers at the moment the loading and unloading mechanism releases the silicon wafers, thereby affecting the installation accuracy of the silicon wafers on the hanger, thereby affecting the subsequent copper plating effect. At the same time, the multiple silicon wafers of the above-mentioned loading and unloading device are all located on the same vertical plane of the same hanger, which increases the difficulty of subsequent copper plating on the silicon wafers. Summary of the invention

[0006] The present invention aims to overcome the defects in the above-mentioned prior art and provide a loading and unloading device suitable for large quantities of half-sliced ​​silicon wafers, which has accurate positioning and is convenient for plating silicon wafers.

[0007] In order to achieve the above-mentioned invention objectives, the present invention adopts the following technical scheme: a loading and unloading device suitable for large quantities of half-sliced ​​silicon wafers, comprising a tray and a transmission component for driving the tray to move horizontally, and an upper and lower lifting component is provided at the bottom of the transmission component for synchronously driving the tray and the transmission component to rise and fall; a number of silicon wafer carriers for loading silicon wafers are placed on the tray, a transport component for transporting the silicon wafer carriers is provided above the tray, and a feeding component for transporting the silicon wafer carriers is provided on one side of the tray; the silicon wafer carrier comprises a carrier frame and a carrier body placed in the carrier frame, and oppositely arranged clamping members are formed on both sides of the carrier frame, and a clamping station for clamping silicon wafers is formed between the oppositely arranged clamping members and the carrier frame.

[0008] As a preferred solution of the present invention, a plurality of the silicon wafer carriers are placed in an array on a tray, and a plurality of positioning pins for positioning each silicon wafer carrier are provided on the tray, and a positioning hole matching with the positioning pins is formed at the bottom of the carrier frame.

[0009] As a preferred solution of the present invention, the up and down lifting assembly includes a lifting frame and vertical plates arranged on opposite sides of the lifting frame, the vertical plates are provided with lifting control components for synchronously lifting the two sides of the lifting frame, and the vertical plates are provided with guide strips for limiting and guiding the lifting direction of the lifting frame.

[0010] As a preferred solution of the present invention, the lifting control component includes a lifting block formed on the side of the lifting frame and a screw rod threadedly connected to the lifting block, and a driving motor for driving the screw rod to rotate is provided on the vertical plate.

[0011] As a preferred solution of the present invention, a plurality of positioning protrusions arranged in an array are formed on the lifting frame, and connection blocks for connecting the transmission components are installed on the positioning protrusions, and belt-passing gaps are formed between adjacent connection blocks.

[0012] As a preferred solution of the present invention, the transmission assembly includes a transmission frame and several conveyor belts installed on the transmission frame. The transmission frame is provided with a synchronous motor for driving the several conveyor belts to transmit synchronously. The several conveyor belts are all in contact with the bottom of the pallet, and the several conveyor belts are set corresponding to the belt passing gaps.

[0013] As a preferred solution of the present invention, the transport assembly includes a transverse track and a longitudinal track slidably connected to the transverse track, and a transport member is slidably connected to the longitudinal track.

[0014] As a preferred solution of the present invention, the transverse track is connected to the end of the longitudinal track, and the other end of the longitudinal track is provided with a support track arranged parallel to the transverse track, and the end of the longitudinal track is provided with a transverse movement motor for driving the longitudinal track to move.

[0015] As a preferred solution of the present invention, a longitudinal moving motor for driving the transport member to move is provided on the longitudinal track, the transport member includes a transport body and a clamping head installed at the bottom of the transport body, and a lifting cylinder for driving the clamping head to rise and fall is provided on the top of the transport body, and an adjusting cylinder for adjusting the opening and closing size of the clamping head is provided at the bottom of the transport body, and a matching hole for clamping with the clamping head is formed on the carrier frame.

[0016] As a preferred solution of the present invention, the feed assembly includes a feed track and a feed plate slidably connected to the feed track, a plurality of silicon wafer carriers arranged in an array are placed on the feed plate, and a rodless cylinder is provided in the middle of the feed plate for driving the feed plate to move.

[0017] Compared with the prior art, the present invention has the following beneficial effects: by providing a silicon wafer carrier for loading silicon wafers, the silicon wafer and the silicon wafer carrier move synchronously during the transportation of the silicon wafer, ensuring that the silicon wafer is always in a vertical state, thereby facilitating the winding plating operation on the top of the silicon wafer; at the same time, under the action of the silicon wafer carrier, the transportation component does not directly contact the silicon wafer during the transportation of the silicon wafer, reducing the external force effect on the silicon wafer, and ensuring the stable loading of the silicon wafer on the silicon wafer carrier; The upper and lower lifting components use a screw rod double-station synchronous motion mechanism, which effectively solves the problem of insufficient lifting force and can meet the needs of large-scale loading and unloading of silicon wafers; The transmission component transmits the pallets by means of multiple synchronously rotating conveyor belts, which solves the problem of insufficient belt friction when transmitting pallets and meets the transmission requirements for large quantities of silicon wafers. The silicon wafer carrier adopts a split structure, and the tray and silicon wafer carrier are positioned with locating pins, which makes the positioning of the silicon wafer carrier on the tray more accurate. At the same time, the split structure of the silicon wafer carrier allows the silicon wafer carrier to be flexibly and conveniently transferred between the transmission component and the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 is a schematic diagram of the structure of the feed assembly; Figure 3 It is a schematic diagram of the structure of the handling component; Figure 4 It is a schematic diagram of the structure of the transported parts; Figure 5 It is a schematic diagram of the structure of a silicon wafer carrier; Figure 6 It is a schematic diagram of the structure of the carrier frame; Figure 7 It is a schematic diagram of loading of a silicon wafer carrier; Figure 8 It is a schematic diagram of the structure of the upper and lower lifting components; Fig. 9 It is a schematic diagram of the structure of the pallet; Fig.10 It is a schematic diagram of the structure of the transmission component; Figure markings: tray 1, positioning pin 11, transmission component 2, transmission frame 21, conveyor belt 22, synchronous motor 23, silicon wafer carrier 3, carrier body 31, carrier frame 32, clamping part 33, clamping station 34, positioning hole 35, matching hole 36, upper and lower lifting component 4, lifting frame 41, vertical plate 42, lifting control part 43, lifting block 44, screw rod 45, drive motor 46, positioning protrusion 47, connecting block 48, guide strip 49, handling component 5, transverse rail 51, longitudinal rail 52, longitudinal moving motor 521, support rail 53, transverse moving motor 54, handling part 55, handling body 56, lifting cylinder 57, clamping head 58, adjusting cylinder 59, feeding component 6, feeding rail 61, feeding plate 62, rodless cylinder 63. DETAILED DESCRIPTION

[0019] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0020] like Figure 1-Figure 10 As shown, a loading and unloading device suitable for large quantities of half-sliced ​​silicon wafers includes a tray 1 and a transmission component 2 for driving the tray 1 to move horizontally, an upper and lower lifting component 4 for synchronously driving the tray 1 and the transmission component 2 to move up and down is provided at the bottom of the transmission component 2; a plurality of silicon wafer carriers 3 for loading silicon wafers are placed on the tray 1, a conveying component 5 for conveying the silicon wafer carriers 3 is provided above the tray 1, and a feeding component 6 for conveying the silicon wafer carriers 3 is provided on one side of the tray 1; the silicon wafer carrier 3 includes a carrier frame 32 and a carrier body 31 placed in the carrier frame 32, clamping members 33 arranged oppositely are formed on both sides of the carrier frame 32, and a clamping station 34 for clamping silicon wafers is formed between the clamping members 33 arranged oppositely and the carrier frame 32.

[0021] The clamping members 33 are used to clamp the side edges of the silicon wafer. Under the action of the clamping members 33, the two clamping members 33 clamp the two opposite side edges of the silicon wafer at the same time, thereby realizing the limitation of the horizontal freedom of the silicon wafer. At the same time, when the bottom of the silicon wafer is placed on the feeding component 6, the bottom of the silicon wafer abuts against the surface of the feeding component 6, thereby realizing the limitation of the height of the silicon wafer. When the silicon wafer carrier 3 is clamped by the conveying component 5, the bottom of the silicon wafer is in a suspended state. Under the action of the silicon wafer's own gravity, the silicon wafer may slide downward along the clamping members 33. However, when the conveying component 5 places the silicon wafer carrier 3 on the tray 1, the bottom of the silicon wafer abuts against the surface of the tray 1. Therefore, under the abutment action of the surface of the tray 1, the height of the silicon wafer can be further corrected, and under the support action of the surface of the tray 1, it can be ensured that the silicon wafers on all silicon wafer carriers 3 are at the same height.

[0022] The tray 1 is used to load a number of silicon wafer carriers 3 arranged in an array, and the silicon wafer carrier 3 is used to load silicon wafers, and one silicon wafer carrier 3 is loaded with one silicon wafer. Under the action of the silicon wafer carrier 3, the loading and transportation of the silicon wafers is realized. At the same time, under the action of the tray 1, the synchronous transportation of several silicon wafer carriers 3 on the tray 1 can be realized, and the synchronous transportation of multiple silicon wafers can be realized.

[0023] The carrier body 31 is a counterweight structure for supporting the carrier frame 32. Under the action of the carrier body 31, the stability of the carrier frame 32 is ensured. At the same time, since the silicon wafer is clamped on the clamping station 34 on one side of the carrier frame 32, the carrier body 31 is used to keep the center of gravity of the silicon wafer carrier 3 loaded with silicon wafers always in the middle of the silicon wafer carrier 3, ensuring the stability of the silicon wafer carrier 3 during the transportation process.

[0024] A plurality of silicon wafer carriers 3 are placed in an array on the tray 1 , and a plurality of positioning pins 11 for positioning each silicon wafer carrier 3 are provided on the tray 1 . A positioning hole 35 matching with the positioning pin 11 is formed at the bottom of the carrier frame 32 .

[0025] The number of silicon wafer carriers 3 is set according to actual needs and the size of the tray 1. The array-like silicon wafer carriers 3 placed on the tray 1 stabilize the overall force of the tray 1. At the same time, with the cooperation of the positioning pins 11 and the positioning holes 35, the silicon wafer carriers 3 are ensured to be always located at the relative position of the tray 1. During the movement of the tray 1, no collision between adjacent silicon wafer carriers 3 will occur, and the precise positioning placement of the silicon wafer carriers 3 on the tray 1 is also ensured.

[0026] The up and down lifting assembly 4 includes a lifting frame 41 and vertical plates 42 arranged on opposite sides of the lifting frame 41. The vertical plates 42 are provided with lifting control components 43 for synchronously lifting the two sides of the lifting frame 41, and the vertical plates 42 are provided with guide strips 49 for limiting and guiding the lifting direction of the lifting frame 41.

[0027] The vertical plate 42 is connected to the frame or the supporting frame. The vertical plate 42 supports the lifting frame 41 to ensure its suspended position. The lifting frame 41 is provided with a slider sleeved on the guide bar 49. The slider guides and limits the lifting angle of the lifting frame 41, thereby ensuring that the lifting frame 41 is always in a horizontal state during the lifting process.

[0028] The lifting control member 43 includes a lifting block 44 formed on the side of the lifting frame 41 and a screw rod 45 threadedly connected to the lifting block 44 . A driving motor 46 for driving the screw rod 45 to rotate is disposed on the vertical plate 42 .

[0029] A support seat for supporting both ends of the screw rod 45 is installed on the vertical plate 42, and a bearing sleeved on the screw rod 45 is provided in the support seat. The end of the screw rod 45 is connected to the output end of the driving motor 46. Under the action of the driving motor 46, the screw rod 45 is driven to rotate. At the same time, the lifting block 44 is always in contact with the vertical plate 42, so that during the rotation of the screw rod 45, the lifting block 44 is lifted and lowered along the inner wall of the vertical plate 42.

[0030] The lifting control components 43 on both sides of the lifting frame 41 are always in a synchronous operation state, so that the lifting blocks 44 on both sides of the lifting frame 41 can be lifted and lowered synchronously, so that the lifting frame 41 is always in a horizontal state during the lifting process. At the same time, under the action of the two lifting control components 43, the lifting force requirements of the pallet 1 and the transmission component 2 are effectively met.

[0031] A plurality of positioning protrusions 47 arranged in an array are formed on the lifting frame 41 , and connection blocks 48 for connecting the transmission component 2 are mounted on the positioning protrusions 47 , and belt-passing gaps are formed between adjacent connection blocks 48 .

[0032] The lifting frame 41 is composed of multiple connecting rods and support plates connected to both ends of the connecting rods. Positioning protrusions 47 are formed on the upper surface of the connecting rods, and several positioning protrusions 47 are arranged equidistantly along the length direction of the connecting rods. Several positioning protrusions 47 on the multiple connecting rods are arranged in an array, thereby forming a belt-passing gap of a linear structure.

[0033] The connecting block 48 is used to raise the installation position of the transmission component 2 so that there is a belt clearance between the bottom of the transmission component 2 and the lifting frame 41 .

[0034] The transmission assembly 2 includes a transmission frame 21 and a plurality of conveyor belts 22 installed on the transmission frame 21. The transmission frame 21 is provided with a synchronous motor 23 for driving the plurality of conveyor belts 22 for synchronous transmission. The plurality of conveyor belts 22 are in contact with the bottom of the tray 1, and the plurality of conveyor belts 22 are arranged corresponding to the belt gaps.

[0035] Several conveyor belts 22 are connected to the same connecting shaft, and the connecting shaft is connected to a synchronous motor 23. Under the action of the synchronous motor 23, the synchronous transmission of several conveyor belts 22 is synchronously driven, and the operation of each conveyor belt 22 is not affected by the action of the belt gap.

[0036] The transport assembly 5 includes a transverse rail 51 and a longitudinal rail 52 slidably connected to the transverse rail 51 , and a transport member 55 is slidably connected to the longitudinal rail 52 .

[0037] The transverse rail 51 and the longitudinal rail 52 are cross-set and vertically set. The transport member 55 can move along the length direction of the longitudinal rail 52, and the longitudinal rail 52 can move along the length direction of the transverse rail 51, thereby satisfying the horizontal and vertical movement of the transport member 55.

[0038] The transverse track 51 is connected to the end of the longitudinal track 52 , and the other end of the longitudinal track 52 is provided with a support track 53 arranged parallel to the transverse track 51 , and the end of the longitudinal track 52 is provided with a transverse moving motor 54 for driving the longitudinal track 52 to move.

[0039] The support rail 53 is used to connect with the end of the longitudinal rail 52 to guide and limit the lateral movement of the longitudinal rail 52. A gear is provided at the output end of the lateral movement motor 54, and the lateral rail 51 has a rack meshing with the gear. During the rotation of the gear, the longitudinal rail 52 is driven to move along the length direction of the rack, thereby satisfying the movement of the longitudinal rail 52 along the length direction of the lateral rail 51.

[0040] A longitudinal moving motor 521 is provided on the longitudinal rail 52 for driving the transport member 55 to move. The transport member 55 includes a transport body 56 and a clamping head 58 installed at the bottom of the transport body 56, and a lifting cylinder 57 is provided on the top of the transport body 56 for driving the clamping head 58 to rise and fall. An adjusting cylinder 59 is provided at the bottom of the transport body 56 for adjusting the opening and closing size of the clamping head 58, and a matching hole 36 is formed on the carrier frame 32 for clamping with the clamping head 58.

[0041] The output end of the longitudinal moving motor 521 can be connected to a screw threadedly connected to the transport body 56 , and the rotation of the screw drives the transport body 56 to move along the length direction of the longitudinal track 52 , thereby adjusting the moving position of the transport body 56 on the longitudinal track 52 .

[0042] The clamping head 58 can be raised and lowered under the action of the lifting cylinder 57, so that the clamping head 58 can be lowered to grab the silicon wafer carrier 3. The adjusting cylinder 59 is used to adjust the opening and closing size of the clamping head 58. At the same time, during the clamping process, it can also drive the opening and closing of the clamping head 58, so that the clamping head 58 is inserted into the matching hole 36, thereby clamping the carrier frame 32 by the clamping head 58.

[0043] The feed assembly 6 includes a feed track 61 and a feed plate 62 slidably connected to the feed track 61 , a plurality of arrayed silicon wafer carriers 3 are placed on the feed plate 62 , and a rodless cylinder 63 is provided in the middle of the feed plate 62 for driving the feed plate 62 to move.

[0044] The size of the feed plate 62 can be set according to actual needs. The feed plate 62 is driven by the rodless cylinder 63 to move along the length direction of the feed track 61, thereby driving the movement of several silicon wafer carriers 3.

[0045] During actual use, when the silicon wafer carriers 3 are loaded, the feeding assembly 6 moves several silicon wafer carriers 3 to the loading grabbing position, the transport assembly 5 grabs the silicon wafer carriers 3 and places them at the designated position of the tray 1 until the silicon wafer carriers 3 on the tray 1 are full, and the upper and lower lifting assemblies 4 move downward, synchronously driving the tray 1 and the transmission assembly 2 to move downward until the upper and lower lifting assemblies 4 lower the tray 1 to the working position, and the transmission assembly 2 drives the conveyor belt 22 to transport and move the tray to the next workstation, thereby realizing the loading of the silicon wafer carriers 3.

[0046] When the silicon wafer carrier 3 is unloading, the transmission component 2 drives the conveyor belt 22 to transport in reverse, moves the tray 1 to the end of the transmission component 2, and the upper and lower lifting components 4 move upward, synchronously driving the tray 1 and the transmission component 2 to move upward until the upper and lower lifting components 4 raise the tray 1 to the unloading position, and the handling component 5 grabs the silicon wafer carrier 3 and places it at the designated position of the feeding component 6, and the silicon wafer carrier 3 is transported outward through the feeding component 6.

[0047] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention; therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0048] Although this article uses more of the figure markings: tray 1, positioning pin 11, transmission component 2, transmission frame 21, conveyor belt 22, synchronous motor 23, silicon wafer carrier 3, carrier body 31, carrier frame 32, clamping member 33, clamping station 34, positioning hole 35, matching hole 36, upper and lower lifting component 4, lifting frame 41, vertical plate 42, lifting control member 43, lifting block 44, screw rod 45, drive motor 46, positioning protrusion 47, connecting block 48, guide strip 49, transport component 5, transverse rail 51, longitudinal rail 52, longitudinal moving motor 521, support rail 53, transverse moving motor 54, transport member 55, transport body 56, lifting cylinder 57, clamping head 58, adjusting cylinder 59, feeding component 6, feeding rail 61, feeding plate 62, rodless cylinder 63 and other terms, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; any additional limitations interpreted as them are contrary to the spirit of the present invention.

Claims

1. A loading and unloading device suitable for large quantities of half-sliced ​​silicon wafers, comprising a tray (1) and a transmission component (2) for driving the tray (1) to move horizontally, and an up-and-down lifting component (4) for synchronously driving the tray (1) and the transmission component (2) to move upward and downward; the device is characterized in that: A plurality of silicon wafer carriers (3) for loading silicon wafers are placed on the tray (1), a transport assembly (5) for transporting the silicon wafer carriers (3) is provided above the tray (1), and a feeding assembly (6) for transferring the silicon wafer carriers (3) is provided on one side of the tray (1); the silicon wafer carrier (3) comprises a carrier frame (32) and a carrier body (31) placed in the carrier frame (32), clamping members (33) arranged oppositely are formed on both sides of the carrier frame (32), and a clamping member (33) arranged oppositely is formed between the clamping members (33) and the carrier frame (32). A clamping station (34) is formed for clamping silicon wafers; during the transportation of the silicon wafer, the silicon wafer and the silicon wafer carrier (3) move synchronously, the silicon wafer is always in a vertical state, and the top of the silicon wafer is subjected to a wrapping operation. Under the action of the silicon wafer carrier (3), the transportation component (5) does not directly contact the silicon wafer during the transportation of the silicon wafer; when the silicon wafer carrier (3) is clamped by the transportation component (5), the bottom of the silicon wafer is in a suspended state; the silicon wafer carrier (3) is used to load silicon wafers, and one silicon wafer carrier (3) is loaded with one silicon wafer.

2. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: A plurality of the silicon wafer carriers (3) are placed in an array on a tray (1), and a plurality of positioning pins (11) for positioning each silicon wafer carrier (3) are provided on the tray (1), and a positioning hole (35) matching with the positioning pins (11) is formed at the bottom of the carrier frame (32).

3. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: The up-and-down lifting assembly (4) comprises a lifting frame (41) and vertical plates (42) arranged on opposite sides of the lifting frame (41); a lifting control member (43) for synchronously lifting the two sides of the lifting frame (41) is provided on the vertical plates (42); a guide bar (49) for limiting and guiding the lifting direction of the lifting frame (41) is provided on the vertical plates (42); and a driving motor (46) for driving the screw rod (45) to rotate is provided on the vertical plates (42).

4. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 3, characterized in that: The lifting control component (43) comprises a lifting block (44) formed on the side of the lifting frame (41) and a screw rod (45) threadedly connected to the lifting block (44).

5. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 3, characterized in that: The lifting frame (41) is provided with a plurality of positioning protrusions (47) arranged in an array, and connection blocks (48) for connecting the transmission assembly (2) are mounted on the positioning protrusions (47), with belt-passing gaps formed between adjacent connection blocks (48).

6. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 5, characterized in that: The transmission assembly (2) comprises a transmission frame (21) and a plurality of conveyor belts (22) mounted on the transmission frame (21); a synchronous motor (23) is provided on the transmission frame (21) for driving the plurality of conveyor belts (22) for synchronous transmission; the plurality of conveyor belts (22) are in contact with the bottom of the tray (1), and the plurality of conveyor belts (22) are arranged corresponding to the belt-passing gaps.

7. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: The transport assembly (5) comprises a transverse rail (51) and a longitudinal rail (52) slidably connected to the transverse rail (51), and a transport member (55) is slidably connected to the longitudinal rail (52).

8. The loading and unloading device for large batches of half-cut silicon wafers according to claim 7, characterized in that: The transverse track (51) is connected to the end of the longitudinal track (52), and the other end of the longitudinal track (52) is provided with a support track (53) arranged parallel to the transverse track (51), and the end of the longitudinal track (52) is provided with a transverse movement motor (54) for driving the longitudinal track (52) to move.

9. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 7, characterized in that: The longitudinal rail (52) is provided with a longitudinal moving motor (521) for driving the transport member (55) to move. The transport member (55) comprises a transport body (56) and a clamping head (58) mounted at the bottom of the transport body (56). A lifting cylinder (57) for driving the clamping head (58) to move up and down is provided at the top of the transport body (56). An adjusting cylinder (59) for adjusting the opening and closing size of the clamping head (58) is provided at the bottom of the transport body (56). A matching hole (36) for engaging with the clamping head (58) is formed on the carrier frame (32).

10. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: The feed assembly (6) comprises a feed track (61) and a feed plate (62) slidably connected to the feed track (61); a plurality of silicon wafer carriers (3) arranged in an array are placed on the feed plate (62); and a rodless cylinder (63) for driving the feed plate (62) to move is provided in the middle of the feed plate (62).

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