Heating disc device for reducing oxidation of parts and thin film deposition equipment of heating disc device

Abstract

The invention discloses a heating disc device for reducing part oxidation and thin film deposition equipment thereof.The heating disc device for reducing part oxidation comprises a heating disc, a heating rod, a radio frequency rod and a sealing cover plate, the heating disc comprises a heating disc body and a supporting handle connected to the center of the bottom of the heating disc body, and a mounting cavity is formed in the supporting handle; the heating rod and the radio frequency rod are embedded in the mounting cavity, and the sealing cover plate is connected to an opening of the mounting cavity, so that a sealed vacuum cavity is formed in the mounting cavity. According to the heating disc device for reducing part oxidation and the thin film deposition equipment thereof, the mounting cavity of the supporting handle embedded with the heating rod and the radio frequency rod is designed to be of a sealable structure, the mounting cavity is vacuumized during working, and therefore the existing design that inert gas is introduced to reduce oxidation of the heating rod and the radio frequency rod is replaced, the safety is higher, and the service life of the heating disc device is prolonged. And meanwhile, local cold points of the heating disc cannot be caused, and the heating effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film deposition equipment, and in particular to a heating disk device for reducing component oxidation and a thin film deposition equipment thereof. Background Art

[0002] The surface temperature of the heating plate in the high-temperature carbon process can be higher than 650 degrees Celsius, while the temperature of the heating connecting rod and the RF connecting rod can be higher than 400 degrees Celsius. At this high temperature, the oxidation rate of the heating rod and the RF rod will be greatly accelerated, eventually leading to the denaturation and damage of the RF material. The current common solution is to introduce an inert gas, such as pure nitrogen, into the heating plate handle to try to prevent the oxidation reaction from occurring, but this solution still has the following disadvantages: the introduction of nitrogen cannot completely exclude oxygen, and the heating plate will still be oxidized; nitrogen will come into contact with the center of the lower part of the heating plate when it is introduced into the heating plate handle, and through thermal convection, the heat at the corresponding position of the heating plate will be conducted away, resulting in a cold spot, which affects the temperature uniformity of the heating plate; in order to protect the RF connecting rod as much as possible, a larger nitrogen flow rate is required, but a larger nitrogen flow rate has the risk of leakage and suffocation. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a heating disk device and a thin film deposition device thereof for reducing component oxidation, so as to solve the technical problem that the heating rod and the radio frequency rod are easily oxidized due to the existing heating disk structural design.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] In the first aspect, an embodiment of the present invention provides a heating plate device for reducing oxidation of components, comprising: a heating plate, a heating rod, a radio frequency rod and a sealing cover plate, the heating plate comprising: a heating plate and a support handle connected to the bottom center of the heating plate, an installation cavity is provided in the support handle, the heating rod and the radio frequency rod are embedded in the installation cavity, and the sealing cover plate is connected to the opening of the installation cavity, so that a sealed vacuum cavity is formed in the installation cavity.

[0006] Wherein, the heating plate device for reducing component oxidation further comprises a vacuum module, and the vacuum module is used to vacuum the sealed installation cavity.

[0007] Among them, the lower end of the support handle is connected to a water cooling plate, and a flange is also provided at the bottom of the water cooling plate. The flange is provided with a accommodating cavity connected to the installation cavity, the lower ends of the heating rod and the radio frequency rod extend into the accommodating cavity, and the lower ends of the heating rod and the radio frequency rod are fixedly inserted into the flange.

[0008] Wherein, the sealing cover plate is sealingly connected to the bottom side wall of the accommodating cavity, so that the installation cavity and the accommodating cavity form a communicating sealed cavity.

[0009] A base is further provided at the bottom of the flange, an exhaust channel is provided in the base, the exhaust channel is connected to the accommodating cavity, and an outer port of the exhaust channel extends to the surface of the base.

[0010] Wherein, sealing rings are provided at the connection between the support handle and the water cooling plate, and at the connection between the water cooling plate and the flange plate.

[0011] Wherein, the upper ends of the heating rod and the radio frequency rod are both in contact with the heating plate.

[0012] Wherein, a temperature sensor unit is also provided in the installation cavity.

[0013] Wherein, the heating plate device for reducing component oxidation also includes an AC filter unit connected to the radio frequency rod.

[0014] In a second aspect, an embodiment of the present invention provides a thin film deposition device, wherein the thin film deposition device comprises a heating disk device for reducing component oxidation as described in any one of the above.

[0015] The heating plate device for reducing component oxidation and the thin film deposition equipment thereof of the present invention design the installation cavity of the support handle in which the heating rod and the radio frequency rod are embedded as a sealable structure, and evacuate the installation cavity during operation, thereby replacing the existing design of introducing inert gas to reduce the oxidation of the heating rod and the radio frequency rod. The device has higher safety and better effect of reducing component oxidation, and at the same time will not cause local cold spots on the heating plate, thereby having a better heating effect on the wafer.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 to Figure 2 Schematic diagram of the structure from different viewing angles of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0018] Figure 3 An exploded view of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the structure of a heating plate portion of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0020] Figure 5This is a schematic structural diagram of an AC filter unit and a base portion of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of a water cooling disk portion of a heating disk device for reducing component oxidation according to an embodiment of the present invention.

[0022] Figure 7 Schematic diagram of the internal component structure of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0023] Figure 8 It is a partial structural diagram of the internal components and AC filter unit of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0024] Fig. 9 A front view of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0025] Fig.10 for Fig. 9 DD section view is shown.

[0026] Fig.11 for Fig.10 The enlarged structural schematic diagram of local A is shown.

[0027] Description of reference numerals:

[0028] A heating plate device 100 for reducing component oxidation, a heating plate 1, a heating plate 11, a support handle 12, a mounting cavity 121, an AC filter unit 2, a water cooling plate 3, a flange 4, a accommodating cavity 41, a base 5, an air flow channel 51, a pipe hole 52, a sealing cover plate 6, a heating rod 7, a temperature sensor unit 8, a radio frequency rod 9, a vacuum hole 101, and an exhaust channel 102. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0036] The temperature of the heating plate surface in the high-temperature carbon process can be higher than 650 degrees Celsius, while the temperature of the heating connecting rod and the RF connecting rod can be higher than 400 degrees Celsius. At this high temperature, the oxidation rate of the heating rod and the RF rod will be greatly accelerated, eventually leading to the denaturation and damage of the RF material. The current common solution is to introduce an inert gas, such as pure nitrogen, into the inside of the heating plate handle to try to prevent the occurrence of oxidation reactions, but this solution still has the following disadvantages: the introduction of nitrogen cannot completely exclude oxygen, and the heating plate will still be oxidized; nitrogen passing into the heating plate handle will contact the lower center position of the heating plate, and through thermal convection, the heat at the corresponding position of the heating plate will be conducted away, resulting in cold spots and affecting the uniformity of the temperature of the heating plate; in order to protect the RF connecting rod as much as possible, a larger nitrogen flow rate is required, but a larger nitrogen flow rate has the risk of suffocation. In order to solve the above problems, the present embodiment discloses a heating plate device 100 for reducing the oxidation of components.

[0037] See also Figures 1 to 11 In this embodiment, a heating plate device 100 for reducing component oxidation is disclosed in this embodiment, which is used in a thin film deposition device for a semiconductor process. The heating plate device is used to support and heat a wafer to complete surface thin film deposition for a specific process.

[0038] The heating plate device 100 for reducing component oxidation includes: a heating plate 1, a heating rod 7, a radio frequency rod 9 and a sealing cover plate 6. The heating plate 1 includes: a heating plate 11 and a support handle 12 connected to the bottom center of the heating plate 11, an installation cavity 121 is provided in the support handle 12, the heating rod 7 and the radio frequency rod 9 are embedded in the installation cavity 121, and the sealing cover plate 6 is connected to the opening of the installation cavity 121, so that a sealed vacuum cavity is formed in the installation cavity 121.

[0039] In existing heating plate devices, flowing inert gas is generally introduced into the space where the heating rod and the radio frequency rod are located, which are embedded in the support handle. The inert gas is used to isolate the heating rod and the radio frequency rod from oxygen, thereby slowing down the oxidation rate of components such as the heating rod and the radio frequency rod. Since the inert gas is used to isolate oxygen, it cannot completely isolate oxygen. The heating rod and the radio frequency rod are still likely to come into contact with oxygen, which further accelerates their oxidation rate during the high-temperature operation of the heating plate. At the same time, the inert gas is used to drive away oxygen, and the temperature change of the inert gas itself will also take away the heat from the heating plate, resulting in local cold spots on the heating plate, which ultimately makes the temperature of the heating plate uneven, and the corresponding heating of the wafer will also be uneven, resulting in a decrease in the quality of thin film deposition. In the present embodiment, the cavity inside the support handle 12 or the cavity connected thereto is covered with a sealing cover plate 6, so that the space where the heating rod 7 and the RF rod 9 are located can be evacuated. When the thin film deposition process is started, the interior is kept in a vacuum state. On the one hand, the possibility of oxygen contacting the heating rod or the RF rod can be isolated. On the other hand, the heat flow in the vacuum state is greatly weakened. For the heating plate, there will be no local cold spot phenomenon caused by heat energy loss, so that the surface temperature of the heating plate is more uniform and more stable.

[0040] The heating plate device 100 for reducing component oxidation further includes a vacuum module (not shown in the figure), which is used to vacuum the sealed installation cavity 121. The vacuum module includes a vacuum pump and other exhaust equipment.

[0041] Please refer again Figure 1 and Fig.11 The lower end of the support handle 12 is connected to a water cooling plate 3, and a flange 4 is also provided at the bottom of the water cooling plate 3. The flange 4 is provided with a accommodating cavity 41 which is connected to the mounting cavity 12. The lower ends of the heating rod 7 and the radio frequency rod 9 extend into the accommodating cavity 41, and the lower ends of the heating rod 7 and the radio frequency rod 9 are fixedly inserted into the flange 4.

[0042] The water cooling plate 3 is provided with an annular liquid cooling cavity for circulating coolant to cool the inner parts. The water cooling plate 3 is provided with a mounting groove, and the upper tubular portion of the flange 4 is inserted into the mounting groove of the water cooling plate 3. The lower end of the support handle 12 can be directly connected to the water cooling plate 3, or a docking seat can be added at the docking point between the two.

[0043] The flange 4 is also provided with an external connection hole, which is connected to the accommodating cavity 41, and the sealing cover plate 6 is sealed and connected to the external connection hole. The external connection hole here refers to a connecting hole that is also provided at the bottom of the accommodating cavity 41 of the flange 4 and is connected to the outside, that is, the accommodating cavity 41 is a through hole opened in the flange 4 and passing through from top to bottom, and the sealing cover plate 6 covers the lower end opening of the through hole, so that the accommodating cavity 41 and the installation cavity 121 form a connected sealed cavity.

[0044] Please refer again Figure 2 and Figure 5 The bottom of the flange 4 is also provided with a base 5, and a ventilation channel 51 is provided in the base 5. The ventilation channel 51 is connected to the accommodating cavity 41, and the outer end of the ventilation channel 51 extends to the surface of the base 5. The base 5 is also provided with a tube hole 52 for passing the wires of the radio frequency rod 9 and the heating rod 7.

[0045] Please refer again Fig.10 and Fig.11 The connection between the support handle 12 and the water cooling plate 3, and the connection between the water cooling plate 3 and the flange plate 4 are both provided with sealing rings. After the heating plate 1, the water cooling plate 3 and the flange plate 4 are assembled, the corresponding cavities are connected, and the butt joints of the adjacent components are sealed with sealing rings, so that the sealed cavities embedded in the heating rod 7 and the RF rod 9 are in a closed state, thereby improving their sealing performance.

[0046] Furthermore, the upper ends of the heating rod 7 and the RF rod 9 are both in contact with the heating plate 11, and the lower ends are fixedly connected to the flange 4. In this embodiment, the heating rod 7 is provided in plurality, and the plurality of heating rods 7 and RF rods 9 are distributed along the length direction of the sealed cavity, and the diameters of the heating rods 7 and RF rods 9 are maximized as much as possible to improve their heat dissipation efficiency.

[0047] like Figure 6 and Fig.10 As shown, a temperature sensor unit 8 is also provided in the installation cavity 121. The temperature probe of the temperature sensor unit 8 abuts against the heating plate 11, and the signal line connected to the temperature probe passes through the installation cavity 121 and the accommodating cavity 41, and finally leads out from the base 5.

[0048] like Figure 1 As shown, the heating plate device 100 for reducing component oxidation also includes an AC filter unit 2 connected to the RF rod 9. The AC filter unit 2 is connected to the base 5, and the AC filter unit 2 is also externally connected to a power matcher for inputting the current of the RF power supply into the RF rod 9 at the required power. The RF rod 9 is used as the lower electrode of the process chamber, and an electric field is formed between the spray plate (the spray plate serves as the upper electrode) corresponding to the heating plate 1 to ionize the special gas.

[0049] Specifically, the sealing cover plate 6 is further provided with a vacuum hole 101, and the base 5 is further provided with an air extraction channel 102 which is aligned and connected to the vacuum extraction hole 101, and the outer end of the air extraction channel 102 is externally connected to a vacuum extraction unit such as a vacuum pump. The sealing cover plate 6 can be an independent plate assembled in the accommodating cavity 41 of the flange 4, or can be a structure integrally formed with the flange 4.

[0050] In this embodiment, the heating plate 11 of the heating plate 1 is a disc structure, and the support handle 12 integrally formed with the heating plate 11 at the bottom is a tubular structure, and the internal tubular cavity is used to set the heating rod 7, the radio frequency rod 9 and the temperature sensor unit 8, etc. The lower end of the support handle 12 is fixedly connected to a docking seat by screws, and the lower end outer side of the docking seat is also connected to the water cooling plate 3, and the tubular portion of the flange 4 is sleeved inside the lower end of the water cooling plate 3, and the lower end edge of the water cooling plate 3 is also connected to the sealing cover plate 6 by screws, and the flange 4 is also externally connected to other mechanisms, such as a rotating drive mechanism or a lifting mechanism that drives the overall rotation. Among them, the heating plate 1, the water cooling plate 3, the flange 4 and the base 5 are roughly coaxially arranged in the vertical direction.

[0051] An embodiment of the present invention provides a thin film deposition device, comprising a heating plate device 100 for reducing component oxidation as described above. The heating plate 1 of the heating plate device 100 for reducing component oxidation extends into a process chamber for heating and carrying a wafer.

[0052] The heating plate device for reducing component oxidation and the thin film deposition equipment thereof of the present embodiment designs the installation cavity of the support handle in which the heating rod and the radio frequency rod are embedded as a sealable structure, and evacuates the installation cavity during operation, thereby replacing the existing design of introducing inert gas to reduce the oxidation of the heating rod and the radio frequency rod. The device has higher safety and better effect in reducing component oxidation, and at the same time will not cause local cold spots on the heating plate. The device has better heating effect, and when used in thin film deposition equipment, the deposition quality is higher.

[0053] The above examples are only used to further illustrate the technical content of the present invention, so that readers can understand it more easily, but they do not mean that the implementation of the present invention is limited to this. Any technical extension or re-creation made according to the present invention is protected by the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A heating plate device for reducing component oxidation, characterized in that: include: A heating plate, a heating rod, a radio frequency rod and a sealing cover plate, wherein the heating plate comprises: a heating plate and a support handle connected to the bottom center of the heating plate, an installation cavity is provided in the support handle, the heating rod and the radio frequency rod are embedded in the installation cavity, and the sealing cover plate is sealed and covered on the installation cavity, so that a sealed vacuum cavity is formed in the installation cavity.

2. The heating plate device for reducing component oxidation according to claim 1, characterized in that: The heating plate device for reducing component oxidation further comprises a vacuum module, and the vacuum module is used to vacuum the sealed installation cavity.

3. The heating plate device for reducing component oxidation according to claim 2, characterized in that: The lower end of the support handle is connected to a water cooling plate, and a flange is also provided at the bottom of the water cooling plate. A accommodating cavity connected to the mounting cavity is provided in the flange, and the lower ends of the heating rod and the radio frequency rod extend into the accommodating cavity, and the lower ends of the heating rod and the radio frequency rod are fixedly inserted into the flange.

4. The heating plate device for reducing component oxidation according to claim 3, characterized in that: The sealing cover plate is sealingly connected to the bottom side wall of the accommodating cavity, so that the installation cavity and the accommodating cavity form a communicating sealed cavity.

5. The heating plate device for reducing component oxidation according to claim 3, characterized in that: A base is also provided at the bottom of the flange, and an air extraction channel is provided in the base. The air extraction channel is connected to the accommodating cavity, and an outer port of the air extraction channel extends to the surface of the base.

6. The heating plate device for reducing component oxidation according to claim 5, characterized in that: A sealing ring is provided at the connection between the support handle and the water cooling plate, and at the connection between the water cooling plate and the flange.

7. The heating plate device for reducing component oxidation according to any one of claims 1 to 6, characterized in that: The upper ends of the heating rod and the radio frequency rod are both in contact with the heating plate.

8. The heating plate device for reducing component oxidation according to claim 7, characterized in that: A temperature sensor unit is also arranged in the installation cavity.

9. The heating plate device for reducing component oxidation according to claim 7, characterized in that: The heating plate device for reducing component oxidation also includes an AC filter unit connected to the radio frequency rod.

10. A thin film deposition device, characterized in that: The thin film deposition apparatus comprises the heating plate device for reducing component oxidation according to any one of claims 1 to 9.

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