Self-adaptive temperature adjusting type shadow lamp and control method thereof

Abstract

The invention belongs to the technical field of non-portable lighting devices, and particularly relates to a self-adaptive temperature adjusting type light and shadow lamp and a control method thereof.The self-adaptive temperature adjusting type light and shadow lamp comprises a bulb base, an assembly cavity is formed in the bulb base, a mounting barrel is arranged in the assembly cavity, the assembly cavity is divided into an outer cavity and an inner cavity by the mounting barrel, and the outer cavity and the inner cavity are communicated with each other; a heat dissipation piece is arranged on the side wall of the inner cavity, and a heat conduction plate is arranged at the top of the mounting cylinder; the LED lamp panel is arranged on the mounting cylinder and located in the outer cavity; the heat conduction piece is arranged in the inner cavity; and the control module is configured to regulate and control the upward moving distance of the heat conduction piece according to temperature data obtained by the temperature sensor so as to stabilize the working temperature of the LED lamp panel. Preheating or heat dissipation of the LED lamp panel is achieved through different ascending distances of the heat conduction piece driven by the driver.

Description

Technical Field

[0001] The present invention belongs to the technical field of non-portable lighting devices, and specifically relates to a lighting device to be fixedly installed, and more particularly to an adaptive temperature-adjustable light and shadow lamp and a control method thereof. Background Art

[0002] A light and shadow lamp is a lamp that can project patterns or create light and shadow effects. It is widely used in art exhibitions, decorative design, stage performances, commercial exhibitions and other fields. This type of lamp not only provides lighting, but also can create unique visual effects through special light projection methods or designed patterns. Existing light and shadow lamps generally include at least a bulb base and a lampshade, and the bulb base is used to install an LED light board.

[0003] If the working temperature of the LED light board is not within the optimal working temperature range, it will affect the projection effect of the light and shadow lamp; in the related technology, a fixed heat conductive sheet is generally attached to the back of the LED light board to conduct away the heat source when the LED light board is working for heat dissipation.

[0004] However, in the above scheme, since the thermal conductive sheet is fixedly arranged, the thermal conductive sheet will dissipate heat regardless of the operating temperature of the LED light board; however, in low temperature scenarios or scenarios at the optimal operating temperature, the thermal conductive sheet is not needed for heat dissipation, and heat dissipation will affect the operation of the LED light board.

[0005] Therefore, how to solve the technical problem that the existing use of fixed heat conductive plates for real-time heat dissipation will affect the LED light board and make it more difficult to reach the optimal operating temperature is urgently needed to be solved by technical personnel in this field.

[0006] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0007] The embodiments of the present disclosure at least provide an adaptive temperature-adjustable light and shadow lamp and a control method thereof.

[0008] In a first aspect, an embodiment of the present disclosure provides an adaptive temperature-adjustable light and shadow lamp, characterized in that it includes: a bulb base, in which an assembly cavity is provided, a mounting tube is provided in the assembly cavity, the mounting tube divides the assembly cavity into an outer chamber and an inner chamber, the side wall of the inner chamber is provided with a heat sink, and the top of the mounting tube is a heat conducting plate; an LED light board, which is provided on the mounting tube and located in the outer chamber, and the back of the LED light board is in contact with the heat conducting plate; a heat conducting member, which is provided in the inner chamber; a temperature sensor, which is used to obtain temperature data of the outer chamber at the LED light board; a driver, which is connected to the heat conducting member; a control module, wherein the control module is configured to control the driver to adjust the upward movement distance of the heat conducting member during preheating, so that the heat conducting member is separated from the heat conducting member and extends into the outer chamber; the control module is also configured to control the driver to adjust the upward movement distance of the heat conducting member during heat dissipation, that is, to adjust the contact area between the heat conducting member and the heat conducting plate; wherein, during heat dissipation, the entire heat conducting surface of the heat dissipation member is in contact with the heat conducting member.

[0009] In an optional embodiment, a plurality of avoidance holes are formed on the heat conducting plate; the heat conducting member comprises: a bottom plate and a plurality of vertically arranged heat conducting strips, each of the heat conducting strips being arranged corresponding to a corresponding avoidance hole.

[0010] In an optional implementation, the driver adjusts the upward movement distance of the heat conducting element including: ; in, d is the upward movement distance of the heat-conducting part, in centimeters; d 预热 is the upward movement distance of the heat-conducting part during preheating, in centimeters; d max The maximum moving distance of the heat-conducting part during preheating, in centimeters; T The temperature data of the external chamber at the LED light board obtained by the temperature sensor, in degrees Celsius; T low The minimum set temperature for the LED light panel to control heat dissipation, in degrees Celsius; T high The maximum set temperature for regulating heat dissipation of the LED light panel, in degrees Celsius.

[0011] In a second aspect, the embodiments of the present disclosure also provide a control method for an adaptive temperature-adjustable light and shadow lamp, comprising: obtaining temperature data of an external chamber at an LED light board through a temperature sensor; and controlling a driver to adjust the upward movement distance of a heat conductor according to the received temperature data through a control module to stabilize the working temperature of the LED light board.

[0012] In an optional embodiment, the method of controlling the driver to adjust the upward movement distance of the heat conductor according to the received temperature data to stabilize the working temperature of the LED light board by the control module includes: ; in, d is the upward movement distance of the heat-conducting part, in centimeters; d 预热 is the upward movement distance of the heat-conducting part during preheating, in centimeters; d max The maximum moving distance of the heat-conducting part during preheating, in centimeters; T The temperature data of the external chamber at the LED light board obtained by the temperature sensor, in degrees Celsius; T low The minimum set temperature for the LED light panel to control heat dissipation, in degrees Celsius; T high The maximum set temperature for regulating heat dissipation of the LED light panel, in degrees Celsius.

[0013] In an optional embodiment, in the method of controlling the driver to adjust the upward movement distance of the heat conductor to stabilize the working temperature of the LED light board according to the received temperature data by the control module, when the acquired temperature data T<0 When the control module is configured to control the driver to drive the heat conducting element to move upward to d 预热 Height; the heat conducting part is moved up to d 预热 The height is enough to separate from the heat sink and extend into the outer cavity, so that the heat of the heat conducting plate is transferred into the outer cavity to preheat the LED lamp board.

[0014] In an optional embodiment, in the method of controlling the driver to adjust the upward movement distance of the heat conductor to stabilize the working temperature of the LED light board according to the received temperature data by the control module, when the acquired temperature data 0 <T<T low When the heat conducting element is at rest, the control module is configured to control the driver to drive the heat conducting element to be stationary; wherein, when the heat conducting element is at rest, the upper end of the heat conducting element is separated from the heat conducting plate to stop heat dissipation.

[0015] In an optional embodiment, in the method of controlling the driver to adjust the upward movement distance of the heat conductor to stabilize the working temperature of the LED light board according to the received temperature data by the control module, when the acquired temperature data T low <T< T highWhen the temperature is high, the control module is configured to control the driver to drive the heat conductor to move upward and contact the heat conductor plate to dissipate heat; wherein the upward movement distance of the heat conductor is adjusted in real time according to the acquired temperature data to change the contact area between the heat conductor and the heat conductor plate.

[0016] In an optional embodiment, in the method of controlling the driver to adjust the upward movement distance of the heat conductor to stabilize the working temperature of the LED light board according to the received temperature data by the control module, when the acquired temperature data T>T high When the control module is configured to control the driver to drive the heat conducting element to move upward to d max Height; where the heat conducting element is moved to d max Height and maintain d max At this height, the heat conductor dissipates heat at maximum power.

[0017] The beneficial effect of the present invention is that the adaptive temperature-adjustable light and shadow lamp and its control method are based on the temperature data obtained by the temperature sensor in different scenes. T The driver drives the heat-conducting member to rise to different distances, thereby achieving preheating or heat dissipation of the LED light board.

[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A three-dimensional diagram of an adaptive temperature-adjustable light and shadow lamp provided in an embodiment of the present disclosure; Figure 2 A schematic cross-sectional view of a bulb base provided in an embodiment of the present disclosure; Figure 3 A schematic diagram of the structure of a heat conducting member provided in an embodiment of the present disclosure; Figure 4 A schematic diagram of the structure of a mounting tube provided in an embodiment of the present disclosure; Figure 5 A schematic diagram of the position of a heat conducting member in a first application scenario provided by an embodiment of the present disclosure; Figure 6 A schematic diagram of the position of a heat conducting member in a second application scenario provided by an embodiment of the present disclosure; Figure 7 A schematic diagram of the position of a heat conducting member in a third application scenario provided by an embodiment of the present disclosure; Figure 8 A schematic diagram of the position of a heat conducting member in a fourth application scenario provided by an embodiment of the present disclosure; Fig. 9 This is the control principle block diagram of the control module.

[0022] In the figure: The bulb base 1, the assembly cavity 11, the outer cavity 111, the inner cavity 112, the mounting tube 12, the heat conducting plate 121, the avoidance hole 122, and the heat dissipation member 13; LED light board 2; Heat conducting member 3, bottom plate 31, heat conducting strip 32; Drive 4. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, in the drawings, the thickness of the components may be exaggerated or reduced in order to effectively describe the technical content.

[0025] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0026] like Figure 1 , Figure 2 As shown, at least one embodiment provides an adaptive temperature-adjustable light and shadow lamp, comprising: a bulb base 1, an LED light board 2, a heat conductor 3, a temperature sensor, a driver 4 and a control module.

[0027] like Figure 2 As shown, in some embodiments, an assembly cavity 11 is provided in the bulb base 1 , and an installation tube 12 is provided in the assembly cavity 11 . The installation tube 12 divides the assembly cavity 11 into an outer chamber 111 and an inner chamber 112 .

[0028] like Figure 2 As shown, in some embodiments, the LED light board 2 is set on the mounting tube 12 and is located in the outer chamber 111; since the LED light board 2 generates heat on the back side, the heat dissipated from the back side of the LED light board 2 will enter the inner chamber 112 during operation.

[0029] In some embodiments, a temperature sensor is disposed in the external chamber 111 to obtain and send temperature data of the external chamber 111 at the LED light board 2 .

[0030] like Figure 2 As shown, in some embodiments, the heat conductor 3 is disposed in the inner chamber 112 , and after receiving the heat emitted by the LED light board 2 through the upper end, the heat is transferred through the lower end, thereby achieving the heat dissipation effect on the LED light board 2 .

[0031] like Figure 2 , Fig. 9 As shown, in some embodiments, the control module is electrically connected to the driver 4 and the temperature sensor, the driver 4 is connected to the heat conductor 3, and the control module is configured to control the driver to adjust the upward movement distance of the heat conductor 3 according to the received temperature data.

[0032] In some embodiments, optionally, the driver 4 includes: a servo motor and a lead screw, the servo motor drives the lead screw to rotate, a lifting sleeve meshing with the lead screw is provided on the lead screw, and the lead screw drives the lifting sleeve to move up and down by rotating, thereby realizing the lifting and lowering of the heat conductor 3.

[0033] In this embodiment, the control module receives the temperature data sent by the temperature sensor, and calculates the data required for the heat conductor 3 to move up based on the temperature data, and then controls the driver 4 to drive the heat conductor 3 to move up a corresponding distance, thereby guiding the heat to stabilize the LED light board 2 within the optimal operating temperature range.

[0034] like Figure 2 As shown, in some embodiments, the side wall of the inner chamber 112 is provided with a heat sink 13, the top of the mounting tube 12 is a heat conducting plate 121, and the back of the LED light board 2 is in contact with the heat conducting plate 121, thereby absorbing the heat on the back of the LED light board 2.

[0035] In this embodiment, the heat sink 13 is annular and tightly attached to the side wall of the inner chamber 112, and is used to be in contact with the heat conductor 3 to conduct heat to dissipate heat; during the heat dissipation process, the entire heat conduction surface of the heat sink 13 is in contact with the heat conductor 3, so that during the adjustment process, there is only one variable, namely, the contact area between the heat conductive strip 32 and the heat conductive plate 121.

[0036] like Figure 3 As shown, in some embodiments, the heat conducting member 3 includes: a base plate 31 and a plurality of vertically arranged heat conducting strips 32; the base plate 31 is connected to the driving end of the driver 4, the upper end of the heat conducting strip 32 is used to fit with the heat conducting plate 121 to receive heat, and the lower end of the heat conducting strip 32 is used to fit with the heat sink 13 to transfer heat.

[0037] like Figure 4 As shown, in some embodiments, a plurality of avoidance holes 122 are provided on the heat conducting plate 121 of the mounting tube 12 ; and each heat conducting strip 32 is respectively provided corresponding to a corresponding avoidance hole 122 .

[0038] In this embodiment, the upper end of the heat conducting strip 32 is used to penetrate into the avoidance hole 122 , and receives the heat of the heat conducting plate 121 by being in contact with the inner wall of the avoidance hole 122 .

[0039] In some embodiments, the driver 4 adjusts the upward movement distance of the heat conducting member 3 by: ; in, d is the upward movement distance of the heat-conducting part, in centimeters; d 预热 is the upward movement distance of the heat-conducting part during preheating, in centimeters; d max The maximum moving distance of the heat-conducting part during preheating, in centimeters; T The temperature data of the external chamber at the LED light board obtained by the temperature sensor, in degrees Celsius; T low The minimum set temperature for the LED light panel to control heat dissipation, in degrees Celsius; T high The maximum set temperature for regulating heat dissipation of the LED light panel, in degrees Celsius.

[0040] In the first application scenario, Figure 5 As shown, the temperature data obtained by the temperature sensor T<0 , that is, the outside temperature is very low. When the light and shadow lamp is started at this time, the temperature of the light and shadow lamp will rise very slowly. If it is still cooled, it will be more difficult to reach the optimal working temperature. Therefore, in this embodiment, the control module controls the driver 4 to drive the heat conducting member 3 to move upward to d 预热The heat received by the heat conductive member 3 will no longer be transferred through the heat sink 13, but the heat energy will be transferred to the outer chamber 111 in the reverse direction to preheat the LED light board 2 in the outer chamber 111, thereby accelerating the LED light board 2 to reach the optimal working temperature.

[0041] In the second application scenario, Figure 6 As shown, the temperature data obtained by the temperature sensor 0 <T<T low , that is, the LED lamp board 2 is in the initial stage of operation or at the optimal working temperature, and there is no need to dissipate heat from the LED lamp board 2 at this time; therefore, in this embodiment, the control module controls the driver 4 not to drive the heat conductive member 3 to move upward, so that the heat conductive member 3 is separated from the heat conductive plate 121 and does not receive the heat from the heat conductive plate 121.

[0042] In the third application scenario, Figure 7 As shown, the temperature data obtained by the temperature sensor T exist T low <T<T high range, that is, the operating temperature of the LED lamp board 2 has exceeded the optimal operating temperature. At this time, the LED lamp board 2 needs to be cooled to make the temperature fall within the range of the optimal operating temperature; therefore, in this embodiment, the control module controls the driver 4 to drive the heat conductor 3 to move upward, so that the heat conductor 3 contacts the heat conducting plate 121, thereby receiving the heat of the heat conducting plate 121, and conducting the received heat away through the heat dissipation member 13; wherein, in the process of the heat conductor 3 moving upward, the heat dissipation member 13 is always fully in contact with the heat conductor 3, the contact area does not change, and only the contact area between the heat conductor 3 and the heat conducting plate 121 changes, thereby adjusting the heat dissipation efficiency.

[0043] In the fourth application scenario, Figure 8 As shown, when the temperature sensor obtains temperature data T>T high When the control module controls the driver 4 to drive the heat conducting member 3 to move upward to d max height, at this time, the heat conducting member 3 fits the entire transmission surface of the heat conducting plate 121, that is, the heat dissipation efficiency is maximum.

[0044] In some embodiments, optionally, d 预热 is 5 cm, d max is 3 cm, T low is 30 degrees Celsius, T high The operating temperature is 60 degrees Celsius, and the optimal working temperature is 20 degrees Celsius to 30 degrees Celsius.

[0045] when T When the temperature is -3 degrees Celsius, it meets the first application scenario, and the heat conductor 3 moves up 5 centimeters.

[0046] when T When the temperature is 10 degrees Celsius, it meets the second application scenario, and the heat conducting element 3 does not move up.

[0047] when T When the temperature is 25 degrees Celsius, the second application scenario is met, and the heat conducting element 3 does not move up.

[0048] when T When the temperature is 35 degrees Celsius, it meets the third application scenario. At this time, the upward movement distance of the heat conducting member 3 is d ( T )=5*((35-30) / (60-30))=0.50cm.

[0049] when T When the temperature is 50 degrees Celsius, it meets the third application scenario. At this time, the upward movement distance of the heat conducting member 3 is d ( T )=5*((50-30) / (60-30))=2.00cm.

[0050] when T When the temperature is 70 degrees Celsius, the fourth application scenario is met, and the heat conductor 3 moves up 3 centimeters.

[0051] At least one embodiment provides a control method for an adaptive temperature-adjustable light and shadow lamp, comprising: obtaining temperature data of the outer chamber 111 at the LED light board 2 through a temperature sensor; controlling the driver 4 to adjust the upward movement distance of the heat conductor 3 according to the received temperature data through a control module to stabilize the working temperature of the LED light board 2.

[0052] Regarding the specific structure and implementation process of the adaptive temperature-adjustable light and shadow lamp, please refer to the relevant discussion in the above embodiments, which will not be repeated here.

[0053] In some embodiments, the method of controlling the driver 4 to adjust the upward movement distance of the heat-conducting member 3 to stabilize the working temperature of the LED light board 2 by the control module according to the received temperature data includes: ; in, d is the upward movement distance of the heat-conducting part, in centimeters; d 预热 is the upward movement distance of the heat-conducting part during preheating, in centimeters; d max The maximum moving distance of the heat-conducting part during preheating, in centimeters; TThe temperature data of the external chamber at the LED light board obtained by the temperature sensor, in degrees Celsius; T low The minimum set temperature for the LED light panel to control heat dissipation, in degrees Celsius; T high The maximum set temperature for regulating heat dissipation of the LED light panel, in degrees Celsius.

[0054] In some embodiments, in a method for stabilizing the working temperature of the LED light board 2 by regulating the upward movement distance of the heat-conducting member 3 according to the received temperature data by the control module, when the acquired temperature data T<0 When the control module is configured to control the driver 4 to drive the heat conducting member 3 to move upward to d 预热 Height; wherein the heat conducting member 3 moves up to d 预热 The height is enough to separate from the heat sink 13 and extend into the outer chamber 111 , so as to transfer the heat of the heat conducting plate 121 into the outer chamber 111 to preheat the LED lamp board 2 .

[0055] In some embodiments, in a method in which the control module controls the driver 4 to adjust the upward movement distance of the heat-conducting member 3 to stabilize the working temperature of the LED light board 2 according to the received temperature data, when the acquired temperature data 0 <T<T low When the heat conducting member 3 is stationary, the control module is configured to control the driver 4 to drive the heat conducting member 3 to be stationary; wherein, when the heat conducting member 3 is stationary, the upper end of the heat conducting member 3 is separated from the heat conducting plate 121 to stop heat dissipation.

[0056] In some embodiments, in a method in which the control module controls the driver 4 to adjust the upward movement distance of the heat-conducting member 3 to stabilize the working temperature of the LED light board 2 according to the received temperature data, when the acquired temperature data T low <T<T high When the temperature is high, the control module is configured to control the driver 4 to drive the heat conductor 3 to move upward and contact with the heat conducting plate 121 to dissipate heat; wherein, the upward movement distance of the heat conductor 3 is adjusted in real time according to the acquired temperature data to change the contact area between the heat conductor 3 and the heat conducting plate 121.

[0057] In some embodiments, in a method in which the control module controls the driver 4 to adjust the upward movement distance of the heat-conducting member 3 to stabilize the working temperature of the LED light board 2 according to the received temperature data, when the acquired temperature data T>T high When the control module is configured to control the driver 4 to drive the heat conducting member 3 to move upward to d max Height; wherein, move to the heat conducting member 3 d max Height and maintaind max When at the highest height, the heat conducting element 3 dissipates heat at maximum power.

[0058] In summary, the present adaptive temperature-adjustable light and shadow lamp and its control method are based on the temperature data obtained by the temperature sensor in different scenes. T The control module controls the driver 4 to drive the heat-conducting member 3 to rise to different distances, thereby achieving preheating or heat dissipation of the LED lamp board 2.

[0059] Herein, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or a third component may be interposed between the first component and the second component.

[0060] In this article, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0061] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0062] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0063] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0064] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0065] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0066] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0067] In the above discussion, unless otherwise stated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0068] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An adaptive temperature-adjustable light and shadow lamp, characterized in that: include: A light bulb base (1) having an assembly cavity (11) formed therein, wherein an installation tube (12) is disposed in the assembly cavity (11), wherein the installation tube (12) divides the assembly cavity (11) into an outer chamber (111) and an inner chamber (112), wherein a heat sink (13) is disposed on a side wall of the inner chamber (112), and the top of the installation tube (12) is a heat conducting plate (121); An LED light board (2) is arranged on the mounting tube (12) and is located in the outer chamber (111), and the back surface of the LED light board (2) is in contact with the heat conducting plate (121); A heat conducting member (3) disposed in the inner chamber (112); A temperature sensor, used to obtain temperature data of the outer chamber (111) at the LED light board (2); The driver (4) is connected to the heat conducting member (3); a control module, the control module being configured to control the driver (4) to adjust the upward movement distance of the heat-conducting element (3) during preheating, so that the heat-conducting element (3) is separated from the heat-dissipating element (13) and extends into the outer chamber (111); The control module is further configured to control the driver (4) to adjust the upward movement distance of the heat conducting member (3) during heat dissipation, that is, to adjust the contact area between the heat conducting member (3) and the heat conducting plate (121); When dissipating heat, the entire heat-conducting surface of the heat sink (13) is in contact with the heat-conducting element (3).

2. The adaptive temperature-adjustable light and shadow lamp according to claim 1, characterized in that: The heat conducting plate (121) is provided with a plurality of avoidance holes (122); The heat conducting member (3) comprises: a bottom plate (31) and a plurality of vertically arranged heat conducting strips (32), each of the heat conducting strips (32) being arranged corresponding to a corresponding avoidance hole (122).

3. The adaptive temperature-adjustable light and shadow lamp according to claim 2, characterized in that: The driver (4) regulates the upward movement distance of the heat conducting member (3) including: ； in, d is the upward movement distance of the heat-conducting part, in centimeters; d 预热 is the upward movement distance of the heat-conducting part during preheating, in centimeters; d max The maximum moving distance of the heat-conducting part during preheating, in centimeters; T The temperature data of the external chamber at the LED light board obtained by the temperature sensor, in degrees Celsius; T low The minimum set temperature for the LED light panel to control heat dissipation, in degrees Celsius; T high The maximum set temperature for regulating heat dissipation of the LED light panel, in degrees Celsius.

4. A control method of the adaptive temperature-adjustable light and shadow lamp according to any one of claims 1 to 3, characterized in that: include: Acquiring temperature data of the outer chamber (111) at the LED light board (2) through a temperature sensor; The control module controls the driver (4) according to the received temperature data to adjust the upward movement distance of the heat conducting member (3) so as to stabilize the operating temperature of the LED light board (2).

5. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 4, characterized in that: The method of controlling the driver (4) to adjust the upward movement distance of the heat conducting member (3) to stabilize the working temperature of the LED light board (2) by a control module according to received temperature data comprises: ； in, d is the upward movement distance of the heat-conducting part, in centimeters; d 预热 is the upward movement distance of the heat-conducting part during preheating, in centimeters; d max The maximum moving distance of the heat-conducting part during preheating, in centimeters; T The temperature data of the external chamber at the LED light board obtained by the temperature sensor, in degrees Celsius; T low The minimum set temperature for the LED light panel to control heat dissipation, in degrees Celsius; T high The maximum set temperature for regulating heat dissipation of the LED light panel, in degrees Celsius.

6. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 5, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data T<0 When the control module is configured to control the driver (4) to drive the heat conducting element (3) to move upward to d 预热 high; The heat conducting member (3) is moved upward to d 预热 The height is such that the heat sink (13) is separated from the heat dissipation element (13) and extends into the outer chamber (111), so as to transfer the heat of the heat conduction plate (121) into the outer chamber (111) to preheat the LED light board (2).

7. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 5, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data 0 <T<T low When the control module is configured to control the driver (4) to drive the heat conducting element (3) to be stationary; When the heat conducting member (3) is stationary, the upper end of the heat conducting member (3) is separated from the heat conducting plate (121) to stop heat dissipation.

8. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 5, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data T low <T<T high When the heat dissipation is reduced, the control module is configured to control the driver (4) to drive the heat conducting member (3) to move upward and contact the heat conducting plate (121) to dissipate heat; The upward movement distance of the heat conducting member (3) is regulated in real time according to the acquired temperature data, so as to change the contact area between the heat conducting member (3) and the heat conducting plate (121).

9. The control method of the adaptive temperature-adjustable light and shadow lamp according to claim 5, characterized in that: In the method for controlling the driver (4) to adjust the upward movement distance of the heat-conducting member (3) by the control module according to the received temperature data to stabilize the working temperature of the LED light board (2), when the acquired temperature data T>T high When the control module is configured to control the driver (4) to drive the heat conducting element (3) to move upward to d max high; Wherein, the heat conducting member (3) is moved to d max Height and maintain d max When the height is high, the heat conducting element (3) dissipates heat at maximum power.

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