Optical module

Abstract

The optical module comprises a circuit board and an optical transceiving component, the optical transceiving component comprises a transceiving tube body, one end, facing the circuit board, of the transceiving tube body is provided with a first notch, and the circuit board is clamped at the first notch. A receiving groove is formed in the upper surface of the receiving and transmitting tube body and comprises a first receiving groove part and a second receiving groove part, and the first receiving groove part is lower than the second receiving groove part. A transmitting groove is formed in the lower surface of the transmitting-receiving tube body and comprises a first transmitting groove part, a second transmitting groove part and a third transmitting groove part, and the heights of the second transmitting groove part, the third transmitting groove part and the first transmitting groove part are sequentially increased. According to the invention, the upper surface of the transmit-receive tube body is provided with the receiving groove, and the light receiving assembly is arranged in the receiving groove, so as to achieve the receiving of light signals. The lower surface of the transmit-receive tube body is provided with an emission groove, and the emission groove is internally provided with a light emission assembly, so as to achieve the emission of optical signals.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communications, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. In addition, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing. Summary of the invention

[0003] The present application provides an optical module to realize the transmission and reception of optical signals.

[0004] An optical module, comprising:

[0005] A circuit board is provided with a light receiving chipset;

[0006] The optical transceiver component comprises a transceiver tube body, a first notch is arranged at one end of the transceiver tube body facing the circuit board, and the circuit board is clamped at the first notch;

[0007] A receiving groove is arranged on the upper surface of the transceiver tube body, and the receiving groove includes a first receiving groove part and a second receiving groove part. A receiving substrate and a light receiving assembly are arranged in the first receiving groove part. The light receiving assembly includes a fiber collimator group, a wave splitter group, a light path offset plate group and a turning prism. A fiber collimator group, a wave splitter group and a light path offset plate group are arranged on the receiving substrate. The turning prism is located above the light receiving chip group. The optical fiber connected to the fiber collimator group is placed in the second receiving groove part. The height of the first receiving groove part is lower than that of the second receiving groove part.

[0008] A transmitting slot is provided on the lower surface of the transceiver tube body, and a light transmitting assembly is provided in the transmitting slot. The light transmitting assembly includes a laser chip group, a first lens group, a combiner group and a second lens group. The transmitting slot includes a first transmitting slot portion, a second transmitting slot portion and a third transmitting slot portion. The laser chip group and the first lens group are fixed to the first transmitting slot portion, the combiner group is fixed to the second transmitting slot portion, and the second lens group is fixed to the third transmitting slot portion. The heights of the second transmitting slot portion, the third transmitting slot portion and the first transmitting slot portion increase sequentially.

[0009] An optical module, comprising:

[0010] A circuit board is provided with a light receiving chipset;

[0011] The optical transceiver component comprises a transceiver housing tube body, a first notch is arranged at one end of the transceiver housing body facing the circuit board, and the circuit board is clamped at the first notch;

[0012] A receiving groove is arranged on the upper surface of the transceiver tube body, and the receiving groove includes a first receiving groove part and a second receiving groove part. A receiving substrate and a light receiving assembly are arranged in the first receiving groove part. The light receiving assembly includes a fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism. The receiving substrate is provided with a fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism. The turning prism is located above the light receiving chip group. The optical fiber connected to the fiber collimator group is placed in the second receiving groove part. The height of the first receiving groove part is lower than that of the second receiving groove part. The end of the first receiving groove part extends out of the end of the side wall of the transceiver tube body, and the end of the first receiving groove part is used to fix the turning prism.

[0013] A transmitting slot is provided on the lower surface of the transceiver tube body, and a light transmitting assembly is provided in the transmitting slot. The light transmitting assembly includes a laser chip group, a first lens group, a combiner group and a second lens group. The transmitting slot includes a first transmitting slot portion, a second transmitting slot portion and a third transmitting slot portion. The laser chip group and the first lens group are fixed to the first transmitting slot portion, the combiner group is fixed to the second transmitting slot portion, and the second lens group is fixed to the third transmitting slot portion. The heights of the second transmitting slot portion, the third transmitting slot portion and the first transmitting slot portion increase sequentially.

[0014] Beneficial effects: The present application provides an optical module, including a circuit board and an optical transceiver component, the circuit board is provided with an optical receiving chip group, the optical transceiver component includes a transceiver tube body, and the end of the transceiver tube body facing the circuit board is provided with a first notch, and the circuit board is clamped at the first notch. A receiving groove is provided on the upper surface of the transceiver tube body, and the receiving groove includes a first receiving groove part and a second receiving groove part. A receiving substrate and an optical receiving assembly are provided in the first receiving groove part, and the optical receiving assembly includes an optical fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism to realize the reception of optical signals. An optical fiber collimator group, a wave splitter group and an optical path offset plate group are provided on the receiving substrate, and the turning prism is located above the optical receiving chip group, and the optical fiber connected to the optical fiber collimator group is placed in the second receiving groove part, and the second receiving groove part is far away from the circuit board relative to the first receiving groove part, and the height of the first receiving groove part is lower than the height of the second receiving groove part to protect the optical fiber connected to the optical fiber collimator group. The lower surface of the transceiver tube body is provided with a transmitting slot, and a light transmitting assembly is provided in the transmitting slot. The light transmitting assembly includes a laser chip group, a first lens group, a combiner group and a second lens group to realize the transmission of optical signals. Among them, the transmitting slot includes a first transmitting slot part, a second transmitting slot part and a third transmitting slot part, the laser chip group and the first lens group are fixed to the first transmitting slot part, the combiner group is fixed to the second transmitting slot part, and the second lens group is fixed to the third transmitting slot part. The heights of the second transmitting slot part, the third transmitting slot part and the first transmitting slot part are successively increased so that the central axes of the laser chip group, the first lens group, the combiner group and the second lens group coincide with each other, thereby improving the coupling efficiency. In the present application, a receiving slot is provided on the upper surface of the transceiver tube body, and a light receiving assembly is provided in the receiving slot to realize the reception of optical signals; a transmitting slot is provided on the lower surface of the transceiver tube body, and a light transmitting assembly is provided in the transmitting slot to realize the transmission of optical signals; the heights of the second transmitting slot part of the transmitting slot, the third transmitting slot part of the transmitting slot and the first transmitting slot part of the transmitting slot are successively increased to improve the coupling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments;

[0017] Figure 2 A partial structural diagram of a host computer provided according to some embodiments;

[0018] Figure 3 A structural diagram of an optical module provided according to some embodiments;

[0019] Figure 4 is an exploded view of an optical module provided according to some embodiments;

[0020] Figure 5 An assembly diagram of an optical transceiver component and a circuit board provided in another perspective according to some embodiments;

[0021] Figure 6 A first exploded view of an optical transceiver component and a circuit board provided in accordance with some embodiments at another viewing angle;

[0022] Figure 7 A second exploded view of the optical transceiver component and the circuit board provided in another viewing angle according to some embodiments;

[0023] Figure 8 A first exploded view of an optical transceiver component and a circuit board according to some embodiments;

[0024] Fig. 9 A second exploded view of an optical transceiver component and a circuit board according to some embodiments;

[0025] Fig.10 An exploded view of an optical transceiver component provided in accordance with some embodiments at another viewing angle;

[0026] Fig.11 An exploded view of an optical transmission assembly and a transceiver tube body provided according to some embodiments;

[0027] Fig.12 A cross-sectional view of an optical transceiver component and a circuit board provided in accordance with some embodiments at another viewing angle;

[0028] Fig.13 A light path diagram of a light emitting assembly according to some embodiments;

[0029] Fig.14 A structural diagram of a first transceiver tube body provided according to some embodiments;

[0030] Fig.15 is a structural diagram of a second emission cover plate provided according to some embodiments;

[0031] Fig.16 An assembly diagram of a first transceiver tube body and a second transmitting cover plate provided according to some embodiments;

[0032] Fig.17 is a structural diagram of a second emission cover plate provided in another viewing angle according to some embodiments;

[0033] Fig.18An assembly diagram of a first transceiver tube body and a second transmitting cover plate provided in another viewing angle according to some embodiments;

[0034] Fig.19 A structural diagram of another second emission cover plate provided according to some embodiments;

[0035] Fig. 20 A structural diagram of a second transceiver tube body provided according to some embodiments;

[0036] Fig.21 An assembly diagram of a second transceiver tube body and another second transmitting cover plate provided according to some embodiments;

[0037] Fig. 22 is an exploded view of a light receiving component provided according to some embodiments;

[0038] Fig.23 An exploded view of an optical receiving assembly and a transceiver tube body provided according to some embodiments;

[0039] Fig.24 is a cross-sectional view of an optical transceiver component provided according to some embodiments;

[0040] Fig.25 A schematic diagram of an optical path offset sheet provided according to some embodiments;

[0041] Fig.26 An assembly diagram of a bending prism and a fourth lens group according to some embodiments;

[0042] Fig. 27 A light path diagram of a light receiving component provided according to some embodiments;

[0043] Fig.28 A light path diagram of a light receiving assembly provided in accordance with some embodiments at another viewing angle;

[0044] Fig.29 An assembly diagram of a light receiving component and a receiving substrate according to some embodiments;

[0045] Fig.30 is a structural diagram of another receiving substrate provided according to some embodiments;

[0046] Fig.31 An assembly diagram of a light receiving component and another receiving substrate according to some embodiments;

[0047] Fig.32 An assembly diagram of an optical receiving assembly and a first transceiver tube body according to some embodiments;

[0048] Fig.33A structural diagram of a first transceiver tube body provided in some embodiments at another viewing angle;

[0049] Fig.34 is a structural diagram of a second receiving cover plate provided according to some embodiments;

[0050] Fig.35 An assembly diagram of a first transceiver tube body and a second receiving cover plate provided according to some embodiments;

[0051] Fig.36 is a structural diagram of a second receiving cover plate provided in another viewing angle according to some embodiments;

[0052] Fig.37 An assembly diagram of the transceiver tube body and the second receiving cover plate from another perspective according to some embodiments;

[0053] Fig.38 is a structural diagram of a second transceiver tube body provided in some embodiments at another viewing angle;

[0054] Fig.39 A structural diagram of a position limiting fixture provided according to some embodiments;

[0055] Fig.40 An assembly diagram of an optical receiving component and a second transceiver tube body provided according to some embodiments. DETAILED DESCRIPTION

[0056] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0057] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; the terms "parallel", "perpendicular", "same", "equal", "consistent", "flush" and other descriptions are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0058] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0059] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0060] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0061] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0062] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0063] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0064] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0065] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0066] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0067] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0068] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, and an optical transceiver component 900 .

[0069] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0070] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0071] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0072] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101 so that the optical fiber 101 is connected to the optical transceiver component 900 in the optical module 200.

[0073] The upper housing 201 and the lower housing 202 are combined to facilitate the installation of the circuit board 300, the optical transceiver component 900, etc. into the housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300 and the optical transceiver component 900, etc., it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automated production.

[0074] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0075] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0076] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0077] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting amplifier), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0078] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0079] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where the number of pins is large. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0080] like Figure 4As shown, an optical fiber connector group 800 is disposed in the housing, and the optical fiber connector group 800 is connected to the optical transceiver component 900. In some embodiments, the optical fiber connector group 800 includes a plurality of first optical fiber connectors and a plurality of second optical fiber connectors, the first optical fiber connectors and the second optical fiber connectors are stacked up and down, the first optical fiber connector is an optical fiber connector connected to the optical transmitting component of the optical transceiver component 900, the second optical fiber connector is an optical fiber connector connected to the optical receiving component of the optical transceiver component 900, the first optical fiber connector is connected to the optical transmitting component of the optical transceiver component 900 through an optical fiber, and the second optical fiber connector is connected to the optical receiving component of the optical transceiver component 900 through an optical fiber.

[0081] In some embodiments, an electrical chip is disposed on the upper surface of the circuit board 300, and the electrical chip has a transimpedance amplification function, and the spacing between two adjacent first electrical connection points of the electrical chip is equal. For example, the electrical chip is a DSP chip, and a TIA chip is integrated in the DSP chip. The first electrical connection points of the DSP chip are regularly arranged, and then the spacing between two adjacent first electrical connection points of the DSP chip is equal, wherein the first electrical connection point of the DSP chip corresponds to the TIA chip in the DSP.

[0082] In order to ensure the high-frequency performance of the optical module, the first electrical connection point of the electrical chip is required to have the shortest wire bonding distance with the first pad of the optical receiving chip group. That is, the spacing between the first pads of two adjacent optical receiving chips of the optical receiving chip group is required to be equal. The spacing between the two adjacent light outlets of a single splitter is equal, and is equal to the spacing between the first pads of two adjacent optical receiving chips. However, when at least two splitters form a splitter group, the spacing between the two adjacent light outlets between the two adjacent splitters is greater than the spacing between the two adjacent light outlets of a single splitter, so that the spacing between the light paths emitted by the two adjacent light outlets between the two adjacent splitters is greater than the spacing between the light paths emitted by the two adjacent light outlets of a single splitter, that is, the spacing between the light paths emitted by the two adjacent light outlets between the two adjacent splitters is greater than the spacing between the first pads of two adjacent optical receiving chips of the optical receiving chip group. In order to solve this problem, in some embodiments, an optical path offset sheet group is provided behind the splitter group, and the spacing between the light paths emitted by the two adjacent light outlets between the two adjacent splitters is shortened by the optical path offset sheet group. Among them, the two adjacent light output ports between two adjacent wave splitters refer to the light output port of the first wave splitter of the two adjacent wave splitters that is closest to the second wave splitter and the light output port of the second wave splitter of the two adjacent wave splitters that is closest to the first wave splitter, that is, the light output port of the first wave splitter of the two adjacent wave splitters that is closest to the second wave splitter and the light output port of the second wave splitter of the two adjacent wave splitters that is closest to the first wave splitter, and the first electrical connection point of the electrical chip is wired to the first pad of the optical receiving chip group.

[0083] Figure 5 The figure is an assembly diagram of an optical transceiver component and a circuit board provided in accordance with some embodiments from another perspective. Figure 6 This is a first exploded view of the optical transceiver component and the circuit board provided in accordance with some embodiments at another viewing angle. Figure 7 FIG. 2 is a second exploded view of the optical transceiver component and the circuit board provided in accordance with some embodiments at another viewing angle. Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, a first notch 911 is provided at the first end of the optical transceiver component 900, that is, a first notch 911 is provided at one end of the optical transceiver component 900 close to the circuit board 300, and the circuit board 300 is snapped into the first notch 911 to achieve a fixed connection between the optical transceiver component 900 and the circuit board 300.

[0084] In some embodiments, the optical transceiver component 900 includes a transceiver tube body 901, a transmitting cover assembly 904, and a receiving cover assembly 905. The transmitting cover assembly 904 covers the lower surface of the transceiver tube body 901 and the lower surface of the circuit board 300 to form a transmitting cavity; the receiving cover assembly 905 covers the upper surface of the transceiver tube body 901 and the upper surface of the circuit board 300 to form a receiving cavity. An transmitting slot 912 is provided in the transmitting cavity, that is, the lower surface of the transceiver tube body 901 (the side of the transceiver tube body 901 facing the transmitting cover assembly 904) is provided with a transmitting slot 912, and the optical transmitting assembly 902 is provided in the transmitting slot 912 to realize the transmission of optical signals.

[0085] Figure 8 This is a first exploded view of an optical transceiver component and a circuit board according to some embodiments. Fig. 9 FIG. 2 is a second exploded view of an optical transceiver component and a circuit board according to some embodiments. Figure 8 and Fig. 9 As shown, in some embodiments, a receiving groove 913 is provided in the receiving cavity, that is, the upper surface of the transceiver tube body 901 (the side of the transceiver tube body 901 facing the receiving cover assembly 905) is provided with a receiving groove 913, and a part of the light receiving assembly 903 is provided in the receiving groove 913 to realize light signal reception.

[0086] like Figure 8 As shown, in some embodiments, a light receiving chipset 937 is disposed on the upper surface of the circuit board 300, and the light receiving chipset 937 converts the received optical signal into an electrical signal. The light receiving chipset 937 includes a plurality of light receiving chips arranged in parallel, and the first pad spacing of two adjacent light receiving chips is equal. For example, the light receiving chipset 937 includes eight light receiving chips arranged in parallel, and the first pad spacing of two adjacent light receiving chips is equal, and is d2.

[0087] like Figure 8As shown, a DSP chip 302 is also provided on the upper surface of the circuit board 300, and the DSP chip 302 is respectively connected with the optical transmitting component 902 and the optical receiving component 903 by wire bonding. The host computer transmits the electrical signal to the DSP chip 302 through the gold finger, and the DSP chip 302 processes the electrical signal. The laser driving chip sends a driving current according to the processed electrical signal, and the optical transmitting component 902 receives the driving current and then emits an optical signal. The optical receiving component 903 converts the received optical signal into an electrical signal, and the DSP chip 302 processes the electrical signal, and the processed electrical signal is transmitted to the host computer through the gold finger.

[0088] In some embodiments, a TIA chip is integrated in the DSP chip 302, and the power supply circuit for the TIA chip can also supply power to other devices in the DSP chip 302, thereby reducing the power supply circuit inside the DSP chip 302 and effectively reducing power consumption.

[0089] The DSP chip 302 is integrated with a TIA chip, and the first electrical connection points of the DSP chip 302 are arranged regularly, so the spacing between the two adjacent first electrical connection points of the DSP chip 302 is equal. In order to ensure the high-frequency performance of the optical module, the first electrical connection point of the DSP chip 302 is required to have the shortest wire bonding distance with the first pad of the optical receiving chipset 937. That is, the spacing between the first pads of the two adjacent optical receiving chips of the optical receiving chipset 937 is required to be equal, so as to shorten the wire bonding distance between the first electrical connection point of the DSP chip 302 and the first pad of the optical receiving chipset 937, reduce the loss of high-frequency signals on the wire bonding, and thus ensure the high-frequency performance of the optical module. For example, the spacing between the two adjacent first electrical connection points of the DSP chip 302 is d1, and the spacing between the first pads of the two adjacent optical receiving chips of the optical receiving chipset 937 is d1. However, since the spacing between the first pads of the optical receiving chips can only be d2 at present, it is required that the spacing between the first pads of any two adjacent optical receiving chips of the optical receiving chipset 937 is d2.

[0090] In some embodiments, the DSP chip 302 is a flip chip, that is, the DSP chip 302 is connected to the circuit board 300 through solder balls. For example, a solder ball layer is provided on the lower surface of the DSP chip 302, and the solder ball layer includes multiple solder balls, one of which is a first solder ball corresponding to the TIA chip, and a second solder pad is provided on the upper surface of the circuit board 300, and the second solder pad is connected to other solder balls in the solder ball layer except the first solder ball.

[0091] Since the DSP chip 302 is integrated with the TIA chip, the connection between the optical receiving chipset 937 and the TIA chip becomes the connection between the optical receiving chipset 937 and the first solder balls of the DSP chip 302, and the distance between two adjacent first electrical connection points of the DSP chip 302 is the distance between two adjacent first solder balls of the DSP chip 302. For example, the distance between two adjacent first solder balls of the DSP chip 302 is d1.

[0092] Fig.10 The figure is an exploded view of an optical transceiver component provided according to some embodiments from another perspective. Fig.11 The figure is an exploded view of an optical transmission assembly and a transceiver tube body provided according to some embodiments. Fig.12 FIG. 1 is a cross-sectional view of an optical transceiver component and a circuit board provided in accordance with some embodiments at another viewing angle. Fig.10 , Fig.11 and Fig.12 As shown, in some embodiments, the optical transmission component 902 includes a laser chip group 921, a first lens group 922, a combiner group 923, a second lens group 924 and a transmission fiber optic adapter group 700, the first lens group 922 is located between the laser chip group 921 and the combiner group 923, and the second lens group 924 is located between the combiner group 923 and the transmission fiber optic adapter group 700.

[0093] In some embodiments, the laser chipset 921 includes a plurality of laser chips arranged in parallel. For example, the laser chipset 921 includes eight laser chips arranged in parallel, and the laser chips are 100G EML chips. One 100G EML chip transmits one 100G optical signal according to the driving current, so that the first laser chipset 4001 transmits eight 100G optical signals of different wavelengths, that is, the first laser chipset 4001 transmits 800G optical signals.

[0094] In some embodiments, the first lens group 922 includes a plurality of collimating lenses arranged in parallel. For example, the first lens group 922 includes eight collimating lenses arranged in parallel, and the collimating lenses are arranged corresponding to the laser chips. The eight 100G optical signals of different wavelengths emitted by the laser chip group 921 are collimated by the first lens group 922.

[0095] In some embodiments, the combiner group 923 includes a plurality of combiners arranged in parallel. For example, the combiner group 923 includes two combiners arranged in parallel, and one combiner is arranged corresponding to four laser chips and four collimating lenses. The eight 100G collimated optical signals are combined into two 400G optical signals by the combiner group 923.

[0096] In some embodiments, the second lens group 924 includes a plurality of focusing lenses arranged in parallel. For example, the second lens group 924 includes two focusing lenses arranged in parallel.

[0097] In some embodiments, the transmitting fiber adapter group 700 includes a plurality of transmitting fiber adapters arranged in parallel. For example, the transmitting fiber adapter group 700 includes two transmitting fiber adapters arranged in parallel, and the combiner, the focusing lens and the transmitting fiber adapter are arranged correspondingly. The second lens group 924 focuses the two 400G optical signals to the transmitting fiber adapter group 700 respectively.

[0098] like Fig.11 As shown, in some embodiments, the light emitting slot 912 includes a first emitting slot portion 9121, a second emitting slot portion 9122 and a third emitting slot portion 9123, the second emitting slot portion 9122 is located between the first emitting slot portion 9121 and the third emitting slot portion 9123, the first emitting slot portion 9121 is closer to the circuit board 300 than other emitting slot portions, the third emitting slot portion 9123 is farther away from the circuit board 300 than other emitting slot portions, the laser chip group 921 and the first lens group 922 are both placed in the first emitting slot portion 9121, the combiner group 923 is placed in the second emitting slot portion 9122, and the second lens group 924 is placed in the third emitting slot portion 9123.

[0099] In some embodiments, the laser chips of the laser chipset 921 are all packaged in a chip on carrier (Chip On Carrier, COC), which can also be called a chip on a ceramic substrate. Therefore, the side profiles of each laser chip of the laser chipset 921 are relatively regular, such as the side profiles of each laser chip of the laser chipset 921 are rectangular.

[0100] In order to control the temperature of the laser chipset 921 so as to stabilize the optical signal emitted by the laser chipset 921, in some embodiments, a semiconductor cooler (TEC) is provided in the first emission slot 9121, an emission substrate is provided on the TEC, and the laser chipset 921 and the first lens group 922 are placed on the emission substrate. The TEC is located below the laser chipset 921 to adjust the temperature of the laser chipset 921.

[0101] In some embodiments, the combiner group 923 is bonded to the second launch slot 9122. In order to facilitate the control of the glue between the combiner group 923 and the second launch slot 9122, a circular glue dispensing groove is provided on the upper surface of the second launch slot 9122. Dispensing glue in the circular glue dispensing groove is not only convenient for controlling the glue amount, but also for controlling the glue stress.

[0102] In order to improve the coupling efficiency, in some embodiments, the height of the first emitting slot portion 9121 is greater than that of the second emitting slot portion 9122. The height of the first emitting slot portion 9121 is less than that of the second emitting slot portion 9122, so that the central axis of the first lens group 922 disposed in the first emitting slot portion 9121 coincides with the light entrance of the combiner group 923 disposed in the second emitting slot portion 9122, thereby allowing the combiner group 923 to receive as much light signal collimated by the first lens group 922 as possible, thereby improving the coupling efficiency.

[0103] In order to improve the coupling efficiency, in some embodiments, the height of the second emission slot portion 9122 is less than the height of the third emission slot portion 9123. The height of the second emission slot portion 9122 is greater than the height of the third emission slot portion 9123, so that the light outlet of the combiner group 923 disposed in the second emission slot portion 9122 coincides with the central axis of the second lens group 924 disposed in the third emission slot portion 9123, thereby allowing the second lens group 924 to receive as much light signal emitted by the combiner group 923 as possible, thereby improving the coupling efficiency.

[0104] In order to improve the coupling efficiency, in some embodiments, the height of the third emitting slot portion 9123 is less than the height of the first emitting slot portion 9121. The height of the third emitting slot portion 9123 is greater than the height of the first emitting slot portion 9121, so that the height of the central axis of the first lens group 922 of the first emitting slot portion 9121, the light entrance of the combiner group 923 disposed in the second emitting slot portion 9122, and the central axis of the second lens group 924 disposed in the third emitting slot portion 9123 coincide, thereby allowing the second lens group 924 to receive as much optical signal emitted by the laser chip group 921 as possible, thereby improving the coupling efficiency.

[0105] like Fig.11 As shown, in some embodiments, the second transmitting slot portion 9122 is provided with a carrier 916 along the length direction of the transceiver tube body 901, and the carrier 916 is located between two combiners to carry the combiner group 923. That is, two opposite sides of the carrier 916 respectively carry a combiner. For example, one side of the carrier 916 carries one combiner of the combiner group 923, and the other side of the carrier 916 carries another combiner of the combiner group 923, wherein one side of the carrier 916 and the other side of the carrier 916 are arranged opposite to each other. The arrangement of the carrier 916 not only facilitates the identification of the mounting position of the combiner group 923, but also facilitates the mounting of the combiner group 923, so as to improve the mounting accuracy of the combiner group 923, prevent the combiner group 923 from deviating from the preset position, and improve the coupling efficiency. Wherein, the length direction of the transceiver tube body 901 is the AB direction in the transceiver tube body 901.

[0106] like Fig.11As shown, in some embodiments, the second end of the transceiver tube body 901 is provided with a placement hole 914, and the placement hole 914 is used to place the transmitting optical fiber adapter. The placement hole 914 is arranged corresponding to the focusing lens of the second lens group 924, so that the transmitting optical fiber adapter receives the optical signal coupled by the focusing lens of the second lens group 924.

[0107] like Fig.11 As shown, in some embodiments, two oppositely disposed side walls of the transceiver tube body 901 are recessed in a direction away from the circuit board 300 to form a first notch 911, and the first notch 911 includes a bottom surface 9111, a first side surface 9112, and a second side surface, the first side surface 9112 and the second side surface are disposed opposite to each other, and the first side surface 9112, the bottom surface 9111, and the second side surface form a U-shaped groove to facilitate the insertion of the circuit board 300. The circuit board 300 is inserted into the first notch 911 of the transceiver tube body 901, the upper surface of the circuit board 300 is in contact with the first side surface 9112, and the lower surface of the circuit board 300 is in contact with the second side surface, so that the circuit board 300 is fixedly connected to the transceiver tube body 901.

[0108] The first notch 911 divides the end face of the first end of the transceiver tube body 901 into a first end face 9113 and a second end face 9114. The first end face 9113 is connected to the second side face, and the first end face 9113 is located below the first notch 911. The second end face 9114 is connected to the first side face 9112, and the second end face 9114 is located above the first notch 911. A support member 918 protruding outward is provided on the second end face 9114. The side of the support member 918 facing the circuit board 300 is flush with the first side face 9112, and the side of the support member 918 facing the circuit board 300 and the first side face 9112 of the first notch 911 are respectively connected to the upper surface of the circuit board 300.

[0109] like Fig.11 As shown, in some embodiments, the lower surface of the transceiver tube body 901 is provided with a first clamping surface 915, and the first clamping surface 915 is formed by the side walls of the transceiver tube body 901 being recessed in the direction of the transmitting slot 912, and the first clamping surface 915 and the side walls of the transceiver tube body 901 form a first limiting notch. For example, the first clamping surface 915 and the side walls of the transceiver tube body 901 extending from the first clamping surface 915 form a first limiting notch.

[0110] In some embodiments, the launch cover assembly 904 is an integrally formed structure, but the integrally formed structure is not convenient for processing and assembly. In order to avoid these problems, the transmitting cover assembly 904 includes a first transmitting cover 941 and a second transmitting cover 942. The first end of the first transmitting cover 941 is covered on the first clamping surface 915 on the lower surface of the transmitting and receiving tube body 901, and the side of the first transmitting cover 941 is clamped on the inner surface of the side wall of the transmitting and receiving tube body 901, so that the first transmitting cover 941 is clamped in the first limiting notch; the second end of the first transmitting cover 941 is covered on the first end of the second transmitting cover 942, and the second transmitting cover 942 has a second notch. The first end surface of the side wall below the first notch 911 in the transmitting and receiving tube body 901 and the inner surface of the side wall below the first notch 911 in the transmitting and receiving tube body 901 are clamped in the second notch, and the second end of the second transmitting cover 942 is covered on the lower surface of the circuit board 300, so that the transmitting cover assembly 904 is covered on the transmitting and receiving tube body 901 and the circuit board 300. The first end of the side wall below the first notch 911 in the transceiver tube body 901 refers to an end of the side wall above the first notch 911 in the transceiver tube body 901 away from the storage hole 914 .

[0111] In order to seal the first transmitting cover plate 941 with the transceiver tube body 901, in some embodiments, the shape of the first transmitting cover plate 941 matches the shape of the first clamping surface 915. For example, the shape of the first transmitting cover plate 941 is the same as the shape of the first clamping surface 915.

[0112] In order to avoid the electronic components on the circuit board 300, in some embodiments, the end of the second transmitting cover plate 942 does not stop at the end of the side wall of the transceiver tube body 901, but extends from the end of the side wall of the transceiver tube body 901. The side of the second transmitting cover plate 942 facing the circuit board 300 is recessed inward to form a first avoidance groove. The depth of the first avoidance groove corresponds to the size of the corresponding electronic component on the circuit board 300, so as to avoid the electronic components on the circuit board 300.

[0113] like Fig.11 As shown, in some embodiments, a repair opening 917 is provided on one side wall of the transceiver tube body 901, and the height of the repair opening 917 is lower than the height of the first clamping surface 915. The repair opening 917 is used as a reserved prying point to facilitate repair of the optical transceiver component 900.

[0114] Fig.13 FIG. 1 is a light path diagram of a light emitting component according to some embodiments. Fig.13As shown, in some embodiments, the laser chip group 921 transmits eight 100G optical signals, which are collimated by the first lens group 922. The collimated eight 100G optical signals are incident on the combiner group 923. The combiner group 923 combines the eight 100G optical signals after changing their positions into two 400G optical signals. The two 400G optical signals are focused and coupled to the transmitting optical fiber adapter group 700 by the second lens group 924.

[0115] In order to fix the circuit board 300 at the first notch 911 , in some embodiments, the first side surface 9112 of the first notch 911 and the side of the support member 918 facing the circuit board 300 are both provided with glue grooves, and glue is placed in the glue grooves to fix the circuit board 300 at the first notch 911 .

[0116] Fig.14 FIG. 1 is a structural diagram of a first transceiver tube body provided according to some embodiments. Fig.14 As shown, in order to fix the circuit board 300 at the first notch 911, in some embodiments, the first side surface 9112 of the first notch 911 of the transceiver tube body 901a is provided with a first glue groove 9115, and the side of the support member 918 facing the circuit board 300 is provided with a second glue groove 9182, and glue is injected into the first glue groove 9115 and the second glue groove 9182. After the circuit board 300 is inserted into the first notch 911, the glue in the first glue groove 9115 and the second glue groove 9182 adheres the circuit board 300 and the first notch 911, so as to achieve a fixed connection between the circuit board 300 and the first notch 911.

[0117] In order to avoid electronic components on the circuit board 300 , in some embodiments, avoidance recesses 9181 are provided on both sides of the support member 918 . The height of the avoidance recesses 9181 is lower than the height of the support member 918 to avoid the electronic components on the circuit board 300 .

[0118] Fig.15 A structural diagram of a second emission cover plate provided according to some embodiments. Fig.16 FIG. 1 is an assembly diagram of a first transceiver tube body and a second transmitting cover plate according to some embodiments. Fig.15 and Fig.16As shown, in some embodiments, the first surface of the second launch cover plate 942a near one end of the transceiver tube body 901 is recessed to form a support recess 9421, and the support recess 9421 makes the first surface of the second launch cover plate 942a step-shaped, and the second surface of the second end of the first launch cover plate 941 is placed on the support recess 9421 to support the first launch cover plate 941, so that the first launch cover plate 941 is sealed and connected with the second launch cover plate 942a. The support recess 9421 is not only used to support the first launch cover plate 941, but also used to define the position of the first launch cover plate 941, so as to facilitate the mounting of the first launch cover plate 941 and improve the mounting accuracy of the first launch cover plate 941. Among them, the first surface of the second launch cover plate 942a is the side away from the transceiver tube body 901a, and the second surface of the first launch cover plate 941 is the side close to the transceiver tube body 901a.

[0119] like Fig.15 and Fig.16 As shown, in some embodiments, second notches 9423 are provided on both sides of the second transmitting cover plate 942a, and the first side surface of the second notch 9423 and the second side surface of the second notch 9423 form an L-shaped notch, and the first side surface of the L-shaped notch is connected to the first end surface 9113 of the transceiver tube body 901, and the second side surface of the L-shaped notch is connected to the inner surface of the side wall below the first notch 911 in the transceiver tube body 901, so as to realize a sealed connection between the transceiver tube body 901a and the second transmitting cover plate 942a.

[0120] like Fig.14 and Fig.16 As shown, in some embodiments, the end of the first clamping surface 915 close to the circuit board 300 continues to be recessed to form a second clamping surface 9151, and the second clamping surface 9151 and the side wall of the transceiver tube body 901a form a second limiting gap. The first end of the second transmitting cover plate 942a is covered on the second clamping surface 9151, and the side surface of the second transmitting cover plate 942 is correspondingly arranged with the side wall of the transceiver tube body 901a, so that the second transmitting cover plate 942a is clamped at the second limiting gap.

[0121] Fig.17 The present invention is a structural diagram of a second emission cover plate provided in accordance with some embodiments at another viewing angle. Fig.18 FIG. 1 is an assembly diagram of a first transceiver tube body and a second transmitting cover plate provided in accordance with some embodiments from another perspective. Fig.17 and Fig.18As shown, in some embodiments, the second surface of the second launch cover plate 942a at one end away from the first launch cover plate 941 protrudes outward to form a support protrusion 9422, and the support protrusion 9422 is in contact with the lower surface of the circuit board 300. The support protrusion 9422 allows only a portion of the lower surface of the second launch cover plate 942a to be in contact with the lower surface of the circuit board 300 to avoid electronic components on the circuit board 300.

[0122] like Fig.17 and Fig.18 As shown, in some embodiments, both sides of the second surface of the second launch cover plate 942a close to one end of the first launch cover plate 941 protrude outward to form a first supporting boss 9425, and the first supporting boss 9425 is in contact and connected with the second clamping surface 9151.

[0123] like Fig.17 and Fig.18 As shown, in some embodiments, the depth of the first avoidance groove 9424 is high at both ends and low in the middle, that is, the shape of the first avoidance groove 9424 is U-shaped to avoid electronic components on the circuit board 300.

[0124] like Fig.17 As shown, in some embodiments, a second surface of the second emitting cover plate 942a close to one end of the first emitting cover plate 941 is provided with an avoidance surface 9426, and the avoidance surface 9426 has a first preset angle to prevent collision with the laser chip of the laser chip group 921 when assembling the optical module.

[0125] Fig.19 A structural diagram of another second emission cover plate provided according to some embodiments. Fig. 20 This is a structural diagram of a second transceiver tube body provided according to some embodiments. Fig.21 The present invention is an assembly diagram of a second transceiver tube body and another second transmitting cover plate provided according to some embodiments. Fig.19 Figure a is a structural diagram of another second emission cover plate. Fig.19 Figure b is a structural diagram of another second emission cover plate at another viewing angle. Fig.21 Figure a is an assembly diagram of the second transceiver tube body and another second transmitting cover plate. Fig.21 Figure b is an assembly diagram of the second transceiver tube body and another second transmitting cover plate from another perspective. Fig.19 , Fig. 20 and Fig.21As shown, in some embodiments, the second launch cover plate 942b is provided with a second notch 9423, and the second notch 9423 of the second launch cover plate 942b and the second notch 9423 of the second launch cover plate 942a are connected to the transceiver tube body 901 in the same manner, which will not be described in detail herein. However, the second launch cover plate 942b is only connected to the transceiver tube body 901b through the second notch 9423 to achieve a sealed connection between the second launch cover plate 942b and the transceiver tube body 901b. That is, the first end of the second launch cover plate 942b is suspended, and the first end of the second launch cover plate 942b is no longer covered on the second clamping surface 9151.

[0126] like Fig.19 , Fig. 20 and Fig.21 As shown, the second emission cover plate 942b is provided with a support recess 9421, and the length of the support recess 9421 of the second emission cover plate 942b is shorter than that of the support recess 9421 of the second emission cover plate 942a, so that the second emission cover plate 942b is away from the top of the laser chip group 921, thereby reducing the collision of the second emission cover plate 942b with the wire bonding between the laser chip group 921 and the DSP chip 302 on the circuit board 300.

[0127] like Fig.19 , Fig. 20 and Fig.21 As shown, the second launch cover plate 942b is provided with a support protrusion 9422, which extends from the first end of the second launch cover plate 942b to the second end of the second launch cover plate 942b, so that only a partial area of ​​the second surface of the second launch cover plate 942b is in contact with the lower surface of the circuit board 300 to avoid the electronic components on the circuit board 300.

[0128] like Fig.19 , Fig. 20 and Fig.21 As shown, the second emitting cover plate 942 b is provided with a first avoidance groove 9424 , and the depth of the first avoidance groove 9424 decreases successively, that is, the shape of the first avoidance groove 9424 is stepped to avoid the electronic components on the circuit board 300 .

[0129] like Fig. 20As shown, on the side facing the transmitting cover assembly 904, the difference between the transceiver tube body 901b and the transceiver tube body 901a is that there is no avoidance recess on both sides of the support member 918, and a first side surface 9112 of the first notch 911 and a side of the support member 918 facing the circuit board 300 are both provided with a plurality of third glue placement grooves 9116. The plurality of third glue placement grooves 9116 surround the first side surface 9112 of the first notch 911 and a side of the support member 918 facing the circuit board 300 into a grid-like structure, and glue is placed in the third glue placement grooves 9116 in the grid-like structure, and each grid in the grid-like structure is also coated with glue. A plurality of third glue grooves 9116 surround the first side surface 9112 of the first notch 911 and the side of the support member 918 facing the circuit board 300 to form a grid-like structure, which not only ensures the amount of glue between the circuit board 300 and the transceiver tube body 901, but also increases the contact area between the circuit board 300 and the transceiver tube body 901b, thereby increasing the adhesion between the circuit board 300 and the transceiver tube body 901b.

[0130] On the side facing the transmitting cover assembly 904 , the transceiver tube body 901 b has the same structure as the transceiver tube body 901 a except for the above structure, which will not be described again.

[0131] Fig. 22 FIG. 1 is an exploded view of a light receiving component according to some embodiments. Fig.23 An exploded view of an optical receiving assembly and a transceiver tube body provided according to some embodiments. Fig.24 FIG. 4 is a cross-sectional view of an optical transceiver component provided according to some embodiments. Fig. 22 , Fig.23 and Fig.24 As shown, in some embodiments, the optical receiving component 903 includes a fiber collimator group, a wave splitter group 933, a turning prism 935, a fourth lens group 936 and an optical receiving chip group 937. The wave splitter group 933 is located between the fiber collimator group and the turning prism 935. The fiber collimator group is used to collimate the two received optical signals. The wave splitter group 933 divides the collimated two optical signals into eight optical signals. The collimated eight optical signals are reflected by the turning prism 935. The fourth lens group 936 converges the collimated eight optical signals. The optical receiving chip group 937 converts the received eight optical signals into electrical signals.

[0132] In some embodiments, the fiber collimator group includes a plurality of fiber collimators. For example, the fiber collimator group includes two fiber collimators arranged in parallel, one fiber collimator collimates the received 400G optical signal. The two fiber collimators collimate the received 400G optical signals respectively.

[0133] In some embodiments, the fiber collimator is an integrated fiber collimator.

[0134] In some embodiments, the fiber collimator is a combined fiber collimator formed by combining a fiber array and a collimating lens.

[0135] In some embodiments, the optical fiber collimator is a combined optical fiber collimator formed by combining an optical fiber adapter and a collimating lens. An optical fiber adapter receives a 400G optical signal, and a collimating lens collimates the 400G optical signal received by the optical fiber adapter.

[0136] Since the fiber collimator can be a standard fiber collimator or a structure formed by a fiber adapter and a collimating lens, the fiber collimator group can be two integrated fiber collimators arranged in parallel, two combined fiber collimators arranged in parallel, or one integrated fiber collimator and one combined fiber collimator arranged in parallel.

[0137] like Fig. 22 As shown, the fiber collimator group includes a dual fiber array 931 and a third lens group 932. The dual fiber array 931 refers to two parallel optical fibers installed on a substrate at a specified interval. The third lens group 932 includes two parallel third lenses. The third lens is a collimating lens. A collimating lens collimates the 400G optical signal transmitted by an optical fiber.

[0138] In some embodiments, the splitter group 933 includes a plurality of splitters arranged in parallel. For example, the splitter group 933 includes two splitters arranged in parallel, and one splitter splits the collimated 400G optical signal into four 100G optical signals of different wavelengths.

[0139] The splitter can be a z-block splitter or an awg (array waveguide grating) splitter. However, compared with the awg splitter, the z-block splitter has the advantages of low insertion loss, wide spectral bandwidth, low channel crosstalk, low temperature sensitivity, etc. Therefore, the splitter in the embodiment of the present application is a z-block splitter.

[0140] In some embodiments, bonding of multiple parallel wave splitters can not only reduce the space occupied by the wave splitter group 933 in the width direction of the transceiver tube body 901, thereby reducing the width of the transceiver tube body 901; it can also shorten the distance between all the light outlets of the wave splitter group 933 and the central axis of the wave splitter group 933, thereby shortening the distance between two adjacent light outlets at the connection of the two wave splitters. The width direction of the transceiver tube body 901 refers to the CD direction of the transceiver tube body 901.

[0141] In some embodiments, the incident surface of the wave splitter and the emitting surface of the wave splitter are arranged parallel to each other, so that the multi-path optical signals split by the wave splitter are output in parallel and collimated with equal intervals.

[0142] In some embodiments, the turning prism 935 includes an incident surface, a turning surface and an exit surface. The incident surface of the turning prism 935 faces the splitter group 933, and the exit surface of the turning prism 935 faces the light receiving chip group 937. The turning surface of the turning prism 935 is located behind the incident surface of the turning prism 935 and above the exit surface of the turning prism 935. The inclination angle of the turning surface of the turning prism 935 is a second preset angle so that the optical signal incident on the turning surface of the turning prism 935 can be emitted vertically.

[0143] In some embodiments, the second preset angle is less than 45° to reduce the light signal from returning along the original path. For example, the second preset angle is 39° to 43°.

[0144] In some embodiments, the fourth lens group 936 includes a plurality of focusing lenses arranged in parallel. For example, the fourth lens group 936 includes eight focusing lenses arranged in parallel.

[0145] A DSP chip is provided on the upper surface of the circuit board 300, and a TIA (transimpedance amplifier chip) is integrated in the DSP chip. The first electrical connection points in the DSP chip 302 are arranged regularly, so the spacing between the two adjacent first electrical connection points of the DSP chip 302 is equal. In order to ensure the high-frequency performance of the optical module, the first electrical connection point of the DSP chip 302 is required to have the shortest wire bonding distance with the first pad of the optical receiving chipset 937. That is, the spacing between the first pads of the two adjacent optical receiving chips of the optical receiving chipset 937 is required to be equal and the second fixed value. However, since the spacing between the first pads of the two adjacent optical receiving chips in the optical receiving chipset 937 can only be the first fixed value for the time being, the spacing between the first pads of the two adjacent optical receiving chips in the optical receiving chipset 937 is required to be the first fixed value. The spacing between the two adjacent light outlets of a single splitter is equal, and is equal to the spacing between the first pads of the two adjacent optical receiving chips. However, when two wave splitters form a wave splitter group, the distance between two adjacent light outlets between the two wave splitters is greater than the distance between two adjacent light outlets of a single wave splitter, so that the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters is greater than the distance between the light paths emitted from two adjacent light outlets of a single wave splitter, that is, the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters is greater than the distance between the first pads of two adjacent light receiving chips of the light receiving chip group. In order to solve this problem, in some embodiments, the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters can be shortened by adjusting the wave splitter. However, this requires re-customizing a new wave splitter to achieve this, which greatly increases the production cost.

[0146] In order to solve this problem, in some embodiments, the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters is shortened by the light path offset plate group 934. For example, the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters is shortened by the light path offset plate group 934, so that the distance between two adjacent light paths in all light paths after the offset is equal and is a first constant. That is, the light path offset plate group 934 is arranged behind the wave splitter group 933, and the light path offset plate group 934 is located between the wave splitter group 933 and the turning prism 935. The light path is offset after being refracted by the light path offset plate group 934, and the distance between two adjacent light paths in all light paths after the offset is equal. The offset multi-path optical signals are reflected by the turning prism 935 and then emitted vertically.

[0147] In some embodiments, the central axis of the optical path offset sheet group 934 coincides with the central axis of the splitter group 933, so that all light paths after being split by the splitter group 933 can be received by the optical path offset sheet group 934 and are all offset by the optical path offset sheet group 934, thereby improving the coupling efficiency.

[0148] In some embodiments, the optical path shifting sheet group 934 includes at least one optical path shifting sheet. For example, the optical path shifting sheet group 934 includes one optical path shifting sheet, and one optical path shifting sheet shifts eight 100G optical signals of different wavelengths toward the central axis direction of the optical path shifting sheet group 934. The optical path shifting sheet group 934 includes at least two optical path shifting sheets arranged in parallel, one optical path shifting sheet is arranged corresponding to one splitter, and one optical path shifting sheet shifts four 100G optical signals of different wavelengths toward the central axis direction of the optical path shifting sheet group 934. Preferably, the optical path shifting sheet group 934 includes two optical path shifting sheets arranged in parallel, and one optical path shifting sheet is arranged corresponding to one splitter.

[0149] In some embodiments, the incident surface of the optical path offset plate is parallel to the exit surface of the splitter, so that the optical signals incident on the optical path offset plate are equidistant and parallel to each other, avoiding interference between two adjacent optical signals incident on the optical path offset plate.

[0150] In some embodiments, the incident surface and the exit surface of the optical path offset piece group 934 are parallel to each other, so that the light signal incident to the incident surface of the optical path offset piece group 934 and the light signal exiting to the exit surface of the optical path offset piece group 934 are parallel to each other, without changing the direction of the light path, and only shortening the distance between the light path and the central axis of the optical path offset piece group 934.

[0151] In some embodiments, at least two parallel optical path offset plates are bonded together, which can not only reduce the space occupied by the optical path offset plate group 934 in the width direction of the transceiver tube body 901, so as to reduce the width dimension of the transceiver tube body 901; it can also shorten the distance between each optical signal after demultiplexing by the demultiplexer group 933 and the central axis of the optical path offset plate group 934, thereby shortening the distance between two adjacent optical paths at the connection of the two optical path offset plates, so as to match the optical receiving chip group 937.

[0152] Fig.25 FIG. 1 is a schematic diagram of an optical path offset sheet according to some embodiments. Fig.25 As shown, the light path is shifted after being refracted by the light path shifting plate, and the light path shift amount d is in a preset relationship with the refractive index n2 of the light path shifting plate, the thickness h of the light path shifting plate, and the incident angle α1 of the light path. The preset relationship is: Wherein, d is the optical path offset, h is the thickness of the optical path offset plate, α1 is the incident angle, n2 is the refractive index of the optical path offset plate, and n1 is the refractive index of air.

[0153] In some embodiments, the optical module includes a circuit board and an optical transceiver component, and the optical transceiver component is connected to the circuit board. An electrical chip and an optical receiving chipset are provided on the circuit board, and the electrical chip is connected to the optical receiving chipset, and the spacing between two adjacent first electrical connection points of the electrical chip is equal. In order to ensure the high-frequency performance of the optical module, it is required that the spacing between the first pads of two adjacent optical receiving chips of the optical receiving chipset connected to the first electrical connection point of the electrical chip is equal. The optical receiving component includes an optical receiving assembly, and the optical receiving assembly includes a wave splitter group, a turning prism and an optical receiving chipset, and the turning prism is located above the optical receiving chipset. The optical receiving chipset includes a plurality of optical receiving chips arranged in parallel, and the spacing between the first pads of two adjacent optical receiving chips is equal. The wave splitter group includes at least two wave splitters, the spacing between two adjacent light outlets of a single wave splitter is equal to the spacing between the first pads of two adjacent light receiving chips, and the spacing between two adjacent light outlets between two adjacent wave splitters is greater than the spacing between two adjacent light outlets of a single wave splitter, that is, the spacing between two adjacent light outlets between two adjacent wave splitters is greater than the spacing between the first pads of two adjacent light receiving chips, resulting in that the multi-path optical signals after being beamed by the wave splitter group cannot be fully coupled to the corresponding light receiving chip, thereby reducing the coupling efficiency. In order to avoid this problem, an optical path offset plate group is set after the wave splitter group, and the optical path offset plate group is located between the wave splitter group and the turning prism. The optical path offset plate group is used to shorten the spacing between the optical paths emitted from the adjacent two light outlets between the two adjacent wave splitters, so that the spacing between two adjacent optical paths in all the offset optical paths is equal to the spacing between the first pads of two adjacent light receiving chips in the optical receiving chip group, thereby making the offset optical path coupled to the corresponding light receiving chip as much as possible after being reflected by the turning prism, thereby improving the coupling efficiency. Among them, the two adjacent light outlets between two adjacent wave splitters refer to a light outlet of the first wave splitter of the two adjacent wave splitters that is closest to the second wave splitter and a light outlet of the second wave splitter of the two adjacent wave splitters that is closest to the first wave splitter. In some embodiments, the spacing of the light paths emitted from the two adjacent light outlets between the two adjacent wave splitters is shortened by an optical path offset sheet group, so that the spacing of the two adjacent light paths after the offset is equal to the spacing of the first pads of the two adjacent light receiving chips of the light receiving chip group, thereby improving the coupling efficiency.

[0154] Fig.26 An assembly diagram of a turning prism and a fourth lens according to some embodiments. Fig. 27 A light path diagram of a light receiving component provided according to some embodiments. Fig.28 FIG. 1 is a light path diagram of a light receiving assembly provided in some embodiments at another viewing angle. Fig.26 , Fig. 27 and Fig.28As shown, in some embodiments, the fourth lens group 936 is located between the turning prism 935 and the optical path offset sheet group 934, and the fourth lens group 936 converges the offset optical signal onto the turning prism 935. The fourth lens group 936 can be mounted on the side of the turning prism 935 facing the optical path offset sheet group 934; or it can be placed on the receiving groove 913 without contacting the turning prism 935.

[0155] In some embodiments, the fourth lens group 936 is located between the turning prism 935 and the light receiving chip group 937. The fourth lens group 936 converges the reflected light signal to the light receiving chip group 937 to achieve the reception of the light signal. The fourth lens group 936 can be mounted on the side of the turning prism 935 facing the light receiving chip group 937; or it can be placed on the circuit board 300 through a support frame and not in contact with the turning prism 935.

[0156] like Fig.26 As shown, the fourth lens group 936 is mounted on the side of the turning prism 935 facing the light receiving chip group 937. Compared with placing the fourth lens group 936 between the turning prism 935 and the optical path offset plate group 934, the fourth lens group 936 is mounted on the side of the turning prism 935 facing the light receiving chip group 937, and the collimated light is converged after reflection, which reduces the optical path loss and improves the coupling efficiency. Compared with fixing the fourth lens group 936 on the circuit board 300 through a support frame and not contacting the turning prism 935, the fourth lens group 936 is mounted on the side of the turning prism 935 facing the light receiving chip group 937, shortening the distance between the turning prism 935 and the light receiving chip group 937, thereby reducing the height dimension of the transceiver tube body 901.

[0157] The distance between the upper surface of the circuit board 300 and the upper shell 201 is a certain value, and the distance between the transceiver tube body 901 and the receiving cover assembly 905 is a variable value, but the variable value is within a preset range. When the fourth lens group 936 is mounted on the side of the turning prism 935 facing the light receiving chip group 937, the focal length of the fourth lens group 936 is greater than the vertical distance between the fourth lens group 936 and the upper surface of the circuit board 300. The light spot after the optical signal is converged by the fourth lens group 936 falls below the upper surface of the circuit board 300, and the coupling efficiency is low.

[0158] In order to improve the coupling efficiency, Figure 8 and Fig.28As shown, in some embodiments, a placement groove 301 is provided on the upper surface of the circuit board 300, a placement substrate 311 is provided in the placement groove 301, a light receiving chip group 937 is placed on the placement substrate 311, and a vertical distance between the fourth lens group 936 and the light receiving chip group 937 is the focal length of the fourth lens group 936, so that the light spot after the fourth lens group 936 converges falls exactly on the light receiving chip group 937, thereby improving the coupling efficiency.

[0159] The DSP chip 302 is connected to the solder pad on the circuit board 300 through the second solder ball, and the optical receiving chip group 937 is placed on the placement substrate 311, shortening the wiring distance between the first solder ball of the DSP chip 302 and the optical receiving chip, reducing the loss of high-frequency signals, and improving the high-frequency performance of the optical module.

[0160] like Fig. 27 and Fig.28 As shown, in some embodiments, the 800G optical signal is collimated by the third lens group 932, the collimated 800G optical signal is divided into eight 100G optical signals by the splitter group 933, the eight 100G optical signals are offset by the optical path offset plate group 934, the offset eight 100G optical signals are reflected by the turning prism 935, the reflected eight 100G optical signals are converged to the optical receiving chip group 937 by the fourth lens group 936, and the optical receiving chip group 937 converts the eight 100G optical signals into eight 100G electrical signals.

[0161] Fig.29 FIG. 1 is an assembly diagram of a light receiving component and a receiving substrate according to some embodiments. Fig.24 and 29 As shown, in some embodiments, the central axes of the dual fiber array 701, the third lens group 932 and the splitter group 933 coincide, and the dual fiber array 701, the third lens group 932, the splitter group 933, the optical path offset plate group 934 and the turning prism 935 are all fixed on the receiving substrate 906, and the receiving substrate 906 is fixed in the receiving groove 913 and extends out of the end of the receiving groove 913.

[0162] In some embodiments, the central axes of the dual fiber array 701 , the third lens group 932 and the wave splitter group 933 coincide with each other, and the dual fiber array 701 , the third lens group 932 and the wave splitter group 933 are directly fixed in the receiving slot 913 .

[0163] The central axes of the dual fiber array 701, the third lens group 932, and the wave splitter group 933 do not overlap. If the dual fiber array 701, the third lens group 932, and the wave splitter group 933 are placed in the same plane, the coupling efficiency is low. In order to solve this problem, in some embodiments, a plurality of supporting bosses with successively increasing heights are provided at the positions of the receiving slot 913 corresponding to the dual fiber array 701, the third lens group 932, and the wave splitter group 933, so that the central axes of the dual fiber array 701, the third lens group 932, and the central axis of the light inlet of the wave splitter group 933 overlap, thereby improving the coupling efficiency.

[0164] Fig.30 A structural diagram of another receiving substrate provided according to some embodiments. Fig.31 The present invention is an assembly diagram of an optical receiving component and another receiving substrate according to some embodiments. Fig.32 FIG. 1 is an assembly diagram of an optical receiving assembly and a first transceiver tube body according to some embodiments. Fig.30 , Fig.31 and Fig.32 As shown, in order to solve this problem, in some embodiments, a receiving substrate 906 is provided on the receiving slot 913, and a dual fiber array 701, a third lens group 932, a splitter group 933 and an optical path offset plate group 934 are provided on the receiving substrate 906, a turning prism 935 is provided on the receiving slot 913, and the receiving substrate 906 is provided with a supporting surface with successively increasing heights, so that the central axis of the dual fiber array 701, the central axis of the third lens group 932 and the central axis of the light entrance of the splitter group 933 coincide with each other, thereby improving the coupling efficiency. For example, the upper surface of the receiving substrate 906 is provided with a first supporting surface 961, a second supporting surface 962 and a third supporting surface 963, and the heights of the first supporting surface 961, the second supporting surface 962 and the third supporting surface 963 are increased in sequence. The dual optical fiber array 701 is placed on the first supporting surface 961, the third lens group 932 is placed on the second supporting surface 962, and the splitter group 933 and the optical path offset plate group 934 are placed on the third supporting surface 963, so that the central axes of the dual optical fiber array 701 and the third lens group 932 and the central axis of the light entrance port of the splitter group 933 cannot overlap, thereby improving the coupling efficiency.

[0165] like Fig.32As shown, in some embodiments, the receiving slot 913 includes a first receiving slot portion 9131 and a second receiving slot portion 9132, the receiving substrate 906 is placed on the first receiving slot portion 9131, the dual optical fiber array 701, the third lens group 932, the splitter group 933 and the optical path offset plate group 934 are placed on the receiving substrate 906, the end of the first receiving slot portion 9131 extends out of the end of the side wall of the transceiver tube body 901, the turning prism 935 is not placed on the receiving substrate 906, the turning prism 935 is placed on the end of the first receiving slot portion 9131 of the receiving slot 913, the optical fiber connected to the dual optical fiber array 701 is placed on the second receiving slot portion 9132, and the height of the second receiving slot portion 9132 is higher than the first receiving slot portion 9131, so that the central axis of the optical fiber connected to the dual optical fiber array 701 coincides with the central axis of the dual optical fiber array 701 to avoid damaging the optical fiber connected to the dual optical fiber array 701. Among them, the end of the first receiving groove 9131 refers to the end of the first receiving groove 9131 away from the second receiving groove 9132, and the end of the side wall of the transceiver tube body 901 refers to the end of the side wall of the transceiver tube body 901 away from the second receiving groove 9132.

[0166] like Fig.32 As shown, in some embodiments, the upper surface of the transceiver tube body 901 is provided with a third clamping surface 919, the third clamping surface 919 is formed by the side wall of the transceiver tube body 901 being recessed inwardly, and the third clamping surface 919 and the side wall of the transceiver tube body 901 form a third limiting gap. For example, the third clamping surface 919 and the side wall of the transceiver tube body 901 extending from the third clamping surface 919 form a third limiting gap.

[0167] like Fig.32 As shown, in some embodiments, a fourth clamping surface 9191 is provided at one end of the transceiver tube body 901 close to the circuit board 300, the fourth clamping surface 9191 faces the circuit board 300, and the fourth clamping surface 9191, the bottom surface of the receiving slot 913, and the side wall of the transceiver tube body 901 form a fourth limiting gap. For example, the fourth clamping surface 9191, the bottom surface of the receiving slot 913, and the side wall of the transceiver tube body 901 extending out of the bottom surface of the receiving slot 913 form a fourth limiting gap.

[0168] In some embodiments, a side wall of the transceiver tube body 901 is provided with a limiting surface, and the limiting surface is used to limit the position of the receiving substrate 906 .

[0169] Fig.33 This is a structural diagram of the first transceiver tube body provided according to some embodiments from another perspective. Fig.34 It is a structural diagram of a second receiving cover plate provided according to some embodiments. Fig.35 FIG. 1 is an assembly diagram of a first transceiver tube body and a second receiving cover plate according to some embodiments. Fig.33 , Fig.34 and Fig.35 As shown, the side wall of the transceiver tube body 901a has a third limiting surface 9194, and the third limiting surface 9194 is located between two parallel surfaces of the side wall of the transceiver tube body 901a. The receiving substrate 906 is connected to the third limiting surface 9194, and the third limiting surface 9194 is a bending surface. The two third limiting surfaces 9194 are symmetrically arranged along the transceiver tube body 901a. The two third limiting surfaces 9194 gradually reduce the distance between the side walls of the transceiver tube body 901a from close to the circuit board 300 to away from the circuit board 300 along the length direction of the transceiver tube body 901a, so as to limit the position of the receiving substrate 906 in the receiving groove 913, so as to facilitate the mounting of the receiving substrate 906.

[0170] like Fig.34 and Fig.35 As shown, in some embodiments, the receiving cover assembly 905 is an integrally formed structure. However, the integrally formed structure is not convenient for processing and is not easy to assemble. In order to solve this problem, in some embodiments, the receiving cover assembly 905 includes a first receiving cover 951 and a second receiving cover 952, the upper surface of the first end of the first receiving cover 951 covers the third clamping surface 919, and the side wall of the first end of the first receiving cover 951 is clamped to the inner surface of the side wall of the transceiver tube body 901, so that the first receiving cover 951 is clamped to the third limiting notch; the lower surface of the second end of the first receiving cover 951 covers the first end of the second receiving cover 952, so that the first receiving cover 951 is sealed and connected with the second receiving cover plate 952; the lower surface of the first end of the second receiving cover plate 952 covers the bottom surface of the receiving groove 913, the first end surface of the second receiving cover plate 952 is clamped on the fourth clamping surface 9191, and the side surface of the second receiving cover plate 952 is clamped on the side wall of the transceiver tube body 901, so that the second receiving cover plate 952 is clamped on the fourth limiting notch; the lower surface of the second end of the second receiving cover plate 952 is clamped on the upper surface of the circuit board 300, so that the second receiving cover plate 952 is connected to the circuit board 300.

[0171] The second end of the second receiving cover plate 952 does not stop at the end of the side wall of the transceiver tube body 901, but extends out of the end of the side wall of the transceiver tube body 901 so that the optical receiving component 903 is placed in the receiving cavity formed by the receiving cover plate component 905, the transceiver tube body 901 and the circuit board 300.

[0172] In order to seal the first receiving cover plate 951 with the transceiver tube body 901, in some embodiments, the shape of the first receiving cover plate 951 matches the shape of the third clamping surface 919. For example, the shape of the first receiving cover plate 951 is the same as the shape of the third clamping surface 919.

[0173] In some embodiments, one end of the second receiving cover plate 952 is clamped on the receiving groove 913 of the transceiver tube body 901, and the other end of the second receiving cover plate 952 is clamped on the upper surface of the circuit board 300 to achieve a sealed connection between the second receiving cover plate 952 and the transceiver tube body 901 and the circuit board 300.

[0174] Since the height of the receiving slot 913 is greater than the height of the upper surface of the circuit board 300, in order to fix the second receiving cover plate 952 to the receiving slot 913 and the circuit board 300, in some embodiments, the second receiving cover plate 952 is bent, one end of the second receiving cover plate 952 is parallel to the circuit board 300, and the other end of the second receiving cover plate 952 is perpendicular to the circuit board 300. The second receiving cover plate 952 is bent so that the first end of the second receiving cover plate 952 is fixed to the receiving slot 913, and the second end of the second receiving cover plate 952 is fixed to the circuit board 300.

[0175] In order to seal the second receiving cover plate 952 with the transceiver tube body 901 and the circuit board 300, in some embodiments, a clamping notch 9524 is provided on the lower surface of the second receiving cover plate 952. One side surface surrounding the clamping notch 9524 is in contact with the end surface of the receiving groove 913, so that the second receiving cover plate 952 is clamped on the receiving groove 913 of the transceiver tube body 901, thereby sealing the second receiving cover plate 952 with the transceiver tube body 901 and the circuit board 300.

[0176] In some embodiments, the two side surfaces surrounding the snap-fitting notch 9524 are respectively contacted and connected with the end surface of the receiving groove 913 and the bottom surface of the receiving groove 913, so that the second receiving cover plate 952 is snapped onto the receiving groove 913 of the transceiver tube body 901, thereby sealingly connecting the second receiving cover plate 952 to the transceiver tube body 901 and the circuit board 300.

[0177] In order to achieve a sealed connection between the first receiving cover plate 951 and the second receiving cover plate 952, in some embodiments, the upper surface of the second receiving cover plate 952 has a fourth supporting surface 9527, and the fourth supporting surface 9527 is arranged parallel to the first receiving cover plate 951. The second end of the first receiving cover plate 951 is placed on the fourth supporting surface 9527 to achieve a sealed connection between the first receiving cover plate 951 and the second receiving cover plate 952.

[0178] In some embodiments, the second receiving cover plate 952 includes a support arm 9521 and a clamping arm 9522, the clamping arm 9522 is close to the first receiving cover plate 951, and the support arm 9521 is away from the first receiving cover plate 951, the clamping arm 9522 has a clamping notch 9524, and the thickness of the clamping arm 9522 is smaller than the thickness of the support arm 9521, so that the clamping arm 9522 is clamped on the receiving groove 913, and the support arm 9521 is fixed to the upper surface of the circuit board 300.

[0179] If there is not enough safety distance between the turning prism 935 and the second receiving cover plate 952, the performance of the turning prism 935 may be affected. In order to reserve enough safety distance for the turning prism 935, in some embodiments, the second receiving cover plate 952 is provided with a first avoidance notch 9523, and the first avoidance notch 9523 exposes the top surface of the turning prism 935, so that there is enough safety distance between the top surface of the turning prism 935 and the first receiving cover plate 951.

[0180] In order to further avoid the turning prism 935, in some embodiments, the second receiving cover plate 952 is provided with a second avoidance groove 9528. The second avoidance groove 9528 is located at the bottom of the first avoidance notch 9523, and the second avoidance groove 9528 is arranged corresponding to the turning surface of the turning prism 935. The minimum vertical distance between the second avoidance groove 9528 and the turning prism 935 is greater than the preset distance, so as to avoid the turning surface of the turning prism 935, thereby avoiding the wear of the turning prism 935. For example, the second avoidance groove 9528 and the turning surface of the turning prism 935 have the same inclination angle, and the vertical distance between the second avoidance groove 9528 and the turning surface of the turning prism 935 is greater than the preset distance, so as to avoid the turning prism 935, thereby avoiding the wear of the turning prism 935.

[0181] The second receiving cover plate 952 includes a support arm 9521 and two clamping arms 9522. The two clamping arms 9522 are respectively connected to the two ends of the support arm 9521 so that the top view of the second receiving cover plate 952 is U-shaped. The two clamping arms 9522 and the support arm 9521 form a first avoidance opening 9523. The lower surface of the support arm 9521 is recessed inward to form a second avoidance groove 9528.

[0182] like Fig.35 As shown, the bottom surface of the clamping arm 9522 is in contact with the bottom surface of the first receiving groove portion 9131, a side wall of the clamping arm 9522 is in contact with a side of the fourth limiting notch, and the end face of the clamping arm 9522 is in contact with the fourth clamping face 9191, so as to realize a sealed connection between the clamping arm 9522 and the fourth limiting notch.

[0183] Fig.36 It is a structural diagram of a second receiving cover plate provided in accordance with some embodiments at another viewing angle. Fig.37 FIG. 1 is an assembly diagram of the first transceiver tube body and the second receiving cover plate provided in some embodiments from another perspective. Fig.36 and Fig.37As shown, in some embodiments, the lower surface of the second end of the second receiving cover plate 952 is provided with a second avoidance notch 9526 and a second supporting boss 9525, the second avoidance notch 9526 is located between the two second supporting bosses 9525, the second supporting boss 9525 is in contact with and connected to the upper surface of the circuit board 300, there is a gap between the second avoidance notch 9526 and the upper surface of the circuit board 300, and the second avoidance notch 9526 is used to avoid electronic components on the circuit board 300. That is, the vertical distance between the second avoidance notch 9526 and the upper surface of the circuit board 300 is greater than the vertical distance between the second supporting boss 9525 and the upper surface of the circuit board 300, so that the second avoidance notch 9526 avoids the electronic components on the circuit board 300.

[0184] Fig.38 This is a structural diagram of a second transceiver tube body provided in accordance with some embodiments from another perspective. Fig.39 It is a structural diagram of a limiting fixing member provided according to some embodiments. Fig.40 FIG. 1 is an assembly diagram of an optical receiving assembly and a second transceiver tube body according to some embodiments. Fig.38 , Fig.39 and Fig.40 As shown, in some embodiments, the receiving slot 913 of the transceiver tube body 901b includes a first receiving slot portion 9131, a second receiving slot portion 9132, and a third receiving slot portion 9134. The third receiving slot portion 9134, the first receiving slot portion 9131, and the second receiving slot portion 9132 are sequentially arranged along the length direction of the transceiver tube body 901. The second receiving slot portion 9132 is used to place the optical fiber connected to the dual optical fiber array 701. The first receiving slot portion 9131 is used to place the receiving substrate 906b. The second receiving substrate 906b is not used to place the turning prism 935. The third receiving slot portion 9134 is used to place the turning prism 935. The height of the third receiving slot portion 9134, the first receiving slot portion 9131, and the second receiving slot portion 9132 is The degree increases successively, which can not only make the central axis of the optical fiber connected to the dual optical fiber array 701 coincide with the central axis of the dual optical fiber array 701 to avoid damaging the optical fiber connected to the dual optical fiber array 701; it can also make the exit surface of the optical path offset piece group 934 located between the bottom end of the turning surface 9351 of the turning prism 935 and the top end of the turning surface 9351 of the turning prism 935, and the photosensitive surface of the optical receiving chip group 937 located between the projection area at the top end of the turning surface 9351 of the turning prism 935 and the projection area at the bottom end of the turning surface 9351, so that the optical signals offset by the optical path offset piece group 934 are all reflected by the turning prism 935 and then all received by the optical receiving chip group 937, thereby improving the coupling efficiency.

[0185] When the receiving groove 913 only includes the first receiving groove portion 9131 and the second receiving groove portion 9132, when the end of the first receiving groove portion 9131 extends out of the end of the side wall of the transceiver tube body 901, the end of the first receiving groove portion 9131 and the support member 918 can be one structural member; or they can be two structural members.

[0186] When the receiving slot 913 includes the first receiving slot portion 9131 , the second receiving slot portion 9132 and the third receiving slot portion 9134 , the third receiving slot portion 9134 and the supporting member 918 may be one structural member; or may be two structural members.

[0187] In order to prevent the glue from overflowing onto the receiving substrate 906b, in some embodiments, an overflow glue groove 9133 is provided in the first receiving groove portion 9131. The overflow glue groove 9133 is located at the edge of the first receiving groove portion 9131. The height of the overflow glue groove 9133 is lower than the height of the first receiving groove portion 9131, so that the glue after bonding can enter the overflow glue groove 9133 to prevent the glue from overflowing onto the receiving substrate 906b.

[0188] In order to achieve the limiting fixation of the receiving substrate 906b, in some embodiments, the transceiver tube body 901b is provided with a first limiting surface 9192 and a second limiting surface 9193, both of which face the circuit board 300, the first limiting surface 9192 is located on one side wall of the transceiver tube body 901, and the second limiting surface 9193 is located on the other side wall of the transceiver tube body 901, the first limiting surface 9192 is closer to the circuit board 300 than the second limiting surface 9193, the first limiting surface 9192, the receiving substrate 906b stops at the first limiting surface 9192, so as to limit the position of the receiving substrate 906b in the receiving groove 913; the overflow glue groove 9133 stops at the second limiting surface 9193, so as to increase the area of ​​the overflow glue groove 9133, increase the capacity of the overflow glue groove 9133 to accommodate glue, and further prevent the glue from overflowing onto the receiving substrate 906b.

[0189] In order to further define the position of the receiving substrate 906b in the receiving groove 913, in some embodiments, the width dimension of the first receiving groove 913 matches the width dimension of the receiving substrate 906b. For example, the width dimension of the first receiving groove 913 is greater than or equal to the width dimension of the receiving substrate 906b. Preferably, the width dimension of the first receiving groove 913 is equal to the width dimension of the receiving substrate 906b.

[0190] In order to fix the dual optical fiber array 701, as Fig.39 and Fig.40As shown, in some embodiments, a fixing member 907 is disposed above the dual optical fiber array 701, and the fixing member 907 stops at the first limiting surface 9192. The fixing member 907 is provided with a fixing groove 971, and the fixing groove 971 is engaged with the dual optical fiber array 701 to fix the dual optical fiber array 701.

[0191] In some embodiments, the upper surface of the optical path offset sheet group 934 is lower than the top of the turning surface 9351 of the turning prism 935, and the lower surface of the optical path offset sheet group 934 is higher than the bottom of the turning surface 9351 of the turning prism 935, that is, the exit surface of the optical path offset sheet group 934 is located between the bottom of the turning surface 9351 of the turning prism 935 and the top of the turning surface 9351 of the turning prism 935, so that all the light paths emitted by the optical path offset sheet group 934 enter the turning prism 935 and are reflected by the turning prism 935; the photosensitive surfaces of the optical receiving chipset group 937 are all located directly below the turning surface 9351 of the turning prism 935, that is, the photosensitive surfaces of the optical receiving chipset group 937 are located between the projection area of ​​the top of the turning surface 9351 of the turning prism 935 and the projection area of ​​the lower end of the turning surface 9351, so that all the light signals of the converged light after reflection by the turning prism 935 are received by the photosensitive surface of the optical receiving chipset group 937. Therefore, the turning prism 935 can be fixed on the receiving substrate 906, such as Fig.29 The turning prism 935 can also be fixed to the end of the first receiving groove portion 9131 of the receiving groove 913, as shown Fig.32 The turning prism 935 can also be fixed on the third receiving groove portion 9134 of the receiving groove 913, as shown Fig.40 shown.

[0192] In some embodiments, the optical transceiver component includes a transceiver tube body, and a first notch is provided at one end of the transceiver tube body facing the circuit board, and the circuit board is clamped at the first notch. A receiving groove is provided on the upper surface of the transceiver tube body, and the receiving groove includes a first receiving groove part and a second receiving groove part. A receiving substrate and an optical receiving component are provided in the first receiving groove part. The optical receiving component includes an optical fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism to achieve the reception of optical signals. An optical fiber collimator group, a wave splitter group and an optical path offset plate group are provided on the receiving substrate. The turning prism is located above the optical receiving chip group. The optical fiber connected to the optical fiber collimator group is placed in the second receiving groove part. The second receiving groove part is relatively far away from the circuit board relative to the first receiving groove part. The height of the first receiving groove part is lower than the height of the second receiving groove part to protect the optical fiber connected to the optical fiber collimator group. A transmitting groove is provided on the lower surface of the transceiver tube body. A light transmitting component is provided in the transmitting groove. The light transmitting component includes a laser chip group, a first lens group, a combiner group and a second lens group to achieve the transmission of optical signals. Among them, the transmitting slot includes a first transmitting slot part, a second transmitting slot part and a third transmitting slot part, the laser chip group and the first lens group are fixed to the first transmitting slot part, the combiner group is fixed to the second transmitting slot part, and the second lens group is fixed to the third transmitting slot part. The heights of the second transmitting slot part, the third transmitting slot part and the first transmitting slot part are successively increased so that the central axes of the laser chip group, the first lens group, the combiner group and the second lens group coincide with each other, thereby improving the coupling efficiency. In the present application, a receiving slot is provided on the upper surface of the transceiver tube body, and a light receiving component is provided in the receiving slot to realize the reception of optical signals; a transmitting slot is provided on the lower surface of the transceiver tube body, and a light transmitting component is provided in the transmitting slot to realize the transmission of optical signals; the heights of the second transmitting slot part of the transmitting slot, the third transmitting slot part of the transmitting slot and the first transmitting slot part of the transmitting slot are successively increased to improve the coupling efficiency.

[0193] In some embodiments, the optical transceiver component further includes a transmitting cover assembly and a receiving cover assembly, and a first notch is provided at one end of the transceiver tube body facing the circuit board, and the circuit board is clamped at the first notch. The transmitting cover assembly covers the lower surface of the transceiver tube body, and the receiving cover assembly covers the upper surface of the transceiver tube body. A receiving groove and a third clamping surface are provided on one side of the transceiver tube body facing the receiving cover assembly, and the third clamping surface and the side wall of the transceiver tube body form a third limiting notch; a fourth clamping surface is provided at one end of the transceiver tube body facing the circuit board, and the fourth clamping surface and the side wall of the transceiver tube body and the receiving groove form a fourth limiting notch; the receiving cover assembly includes a first receiving cover and a second receiving cover, the first end of the first receiving cover is clamped at the third limiting notch, the second end of the first receiving cover is covered on the first end of the second receiving cover, the first end of the second receiving cover is clamped at the fourth limiting notch, and the second end of the second receiving cover is clamped on the upper surface of the circuit board to achieve a fixed connection between the receiving cover assembly and the transceiver tube body and the circuit board. A transmitting groove and a first clamping surface are provided on one side of the transceiver tube body facing the transmitting cover assembly, and the first clamping surface and the side wall of the transceiver tube body form a first limiting notch; the transmitting cover assembly includes a first transmitting cover and a second transmitting cover, the first end of the first transmitting cover is clamped in the first limiting notch, the second end of the first transmitting cover is covered on the first end of the second transmitting cover, and the second end of the second transmitting cover is clamped in the lower surface of the circuit board; a second notch is provided on one side of the first end of the second transmitting cover, and the second notch is clamped in the terminal end face of the transceiver tube body and the terminal side wall of the transceiver tube body to achieve a fixed connection between the transmitting cover assembly and the transceiver tube body and the circuit board. In some embodiments, the transceiver tube body is provided with a first limiting notch and a second notch to fix the transmitting cover assembly with the transceiver tube body and the circuit board; the transceiver tube body is provided with a third limiting notch and a fourth limiting notch to fix the receiving cover assembly with the transceiver tube body and the circuit board.

[0194] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that: include: A circuit board is provided with a light receiving chipset; The optical transceiver component comprises a transceiver tube body, wherein a first notch is provided at one end of the transceiver tube body facing the circuit board, and the circuit board is clamped at the first notch; The upper surface of the transceiver tube body is provided with a receiving groove, the receiving groove includes a first receiving groove part and a second receiving groove part, a receiving substrate and a light receiving assembly are arranged in the first receiving groove part, the light receiving assembly includes a fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism, the receiving substrate is provided with a fiber collimator group, a wave splitter group and an optical path offset plate group, the turning prism is located above the light receiving chip group, the optical fiber connected to the fiber collimator group is placed in the second receiving groove part, and the height of the first receiving groove part is lower than the height of the second receiving groove part; A transmitting slot is provided on the lower surface of the transceiver tube body, and a light transmitting assembly is provided in the transmitting slot. The light transmitting assembly includes a laser chip group, a first lens group, a combiner group and a second lens group. The transmitting slot includes a first transmitting slot portion, a second transmitting slot portion and a third transmitting slot portion. The laser chip group and the first lens group are fixed to the first transmitting slot portion, the combiner group is fixed to the second transmitting slot portion, and the second lens group is fixed to the third transmitting slot portion. The heights of the second transmitting slot portion, the third transmitting slot portion and the first transmitting slot portion are increased in sequence.

2. The optical module according to claim 1, characterized in that: The end of the first receiving groove portion extends out of the end of the side wall of the transceiver tube body, and the end of the first receiving groove portion is used to fix the turning prism. A fourth lens group is arranged on the side of the turning prism facing the light receiving chip group. A placement groove is arranged on the circuit board, and a placement substrate is arranged in the placement groove. The light receiving chip group is placed on the placement substrate, and the light receiving chip group is located at the focus of the fourth lens group.

3. The optical module according to claim 1, characterized in that: The end of the first receiving groove portion extends out of the end of the side wall of the transceiver tube body to form a third receiving groove portion, and the height of the third receiving groove portion is lower than the height of the first receiving groove portion. The third receiving groove portion is used to fix the turning prism, and a fourth lens group is arranged on the side of the turning prism facing the light receiving chip group. A placement groove is arranged on the circuit board, and a placement substrate is arranged in the placement groove. The light receiving chip group is placed on the placement substrate, and the light receiving chip group is located at the focus of the fourth lens group.

4. The optical module according to claim 1, characterized in that: The first notch includes a bottom surface, a first side surface and a second side surface. The first side surface and the second side surface are arranged opposite to each other. The first side surface is in contact with and connected to the upper surface of the circuit board. A glue placement groove is arranged on the first side surface, and the glue placement groove is used for placing glue.

5. The optical module according to claim 1, characterized in that: The receiving substrate is provided with a first supporting surface, a second supporting surface and a third supporting surface, the first supporting surface is provided with a dual optical fiber array of the optical fiber collimator group, the second supporting surface is provided with a third lens group of the optical fiber collimator group, the third supporting surface is provided with a wave splitter group and the optical path offset plate group, the heights of the first supporting surface, the second supporting surface and the third supporting surface are increased in sequence, wherein the third lens group is located between the dual optical fiber array and the wave splitter group.

6. The optical module according to claim 1, characterized in that: A limiting surface is provided on the upper surface of the transceiver tube body, and the limiting surface is used to limit the position of the receiving substrate; The limiting surface includes a first limiting surface and a second limiting surface, the first limiting surface is located on one side wall of the transceiver tube body, the second limiting surface is located on the other side wall of the transceiver tube body, the first limiting surface and the second limiting surface are both facing the circuit board, the first limiting surface is closer to the circuit board than the second limiting surface, and the receiving substrate stops at the first limiting surface; Alternatively, the limiting surface includes two third limiting surfaces, the third limiting surfaces are located on a side wall of the transceiver tube body, and the distance between the two third limiting surfaces gradually decreases along the length direction of the transceiver tube body.

7. The optical module according to claim 1, characterized in that: The transceiver tube body is provided with a bearing member along the length direction of the transceiver tube body, and the bearing member is located on the second transmitting slot portion.

8. An optical module, characterized in that: include: A circuit board is provided with a light receiving chipset; The optical transceiver component comprises a transceiver shell body, wherein a first notch is provided at one end of the transceiver shell body facing the circuit board, and the circuit board is clamped at the first notch; The upper surface of the transceiver tube body is provided with a receiving groove, the receiving groove includes a first receiving groove part and a second receiving groove part, a receiving substrate and a light receiving assembly are arranged in the first receiving groove part, the light receiving assembly includes a fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism, the receiving substrate is provided with a fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism, the turning prism is located above the light receiving chip group, the optical fiber connected to the fiber collimator group is placed in the second receiving groove part, the height of the first receiving groove part is lower than the height of the second receiving groove part, the end of the first receiving groove part extends out of the end of the side wall of the transceiver tube body, and the end of the first receiving groove part is used to fix the turning prism; A transmitting slot is provided on the lower surface of the transceiver tube body, and a light transmitting assembly is provided in the transmitting slot. The light transmitting assembly includes a laser chip group, a first lens group, a combiner group and a second lens group. The transmitting slot includes a first transmitting slot portion, a second transmitting slot portion and a third transmitting slot portion. The laser chip group and the first lens group are fixed to the first transmitting slot portion, the combiner group is fixed to the second transmitting slot portion, and the second lens group is fixed to the third transmitting slot portion. The heights of the second transmitting slot portion, the third transmitting slot portion and the first transmitting slot portion are increased in sequence.

9. The optical module according to claim 8, characterized in that: A fourth lens group is arranged on a side of the turning prism facing the light receiving chip group, a placement groove is arranged on the circuit board, a placement substrate is arranged in the placement groove, and the light receiving chip group is placed on the placement substrate.

10. The optical module according to claim 9, characterized in that: The first notch includes a bottom surface, a first side surface and a second side surface. The first side surface and the second side surface are arranged opposite to each other. The first side surface is in contact with the upper surface of the circuit board. The first side surface is provided with a glue placement groove for placing glue.

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