Display module and vehicle-mounted display device

Abstract

The invention discloses a display module and a vehicle-mounted display device. According to one embodiment, the display module comprises a backlight module, a display panel and a cover plate, and a backlight source of the backlight module and a driving chip of the display panel are both arranged on the first side edge of a frame area; the backlight module comprises a back plate, a middle frame and a backlight assembly, the back plate comprises a main plate and a side plate, and the middle frame comprises a middle frame main body, a frame side body and a frame retaining wall which are arranged in clamping grooves of the main plate and the side plate; a backlight source of the backlight assembly is arranged in an accommodating space formed by the main board and the frame side body, and a driving chip is arranged in an accommodating space formed by the frame retaining wall and the frame side body; the display module further comprises a first heat dissipation adhesive tape arranged on the side, close to the cover plate, of the driving chip, a second heat dissipation adhesive tape arranged on the side, away from the cover plate, of the driving chip and a heat insulation structure arranged on the side, close to the second heat dissipation adhesive tape, of the frame side body, and the first heat dissipation adhesive tape and the second heat dissipation adhesive tape extend to the frame retaining wall. According to the embodiment of the invention, the heat dissipation performance of the display module is effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a vehicle-mounted display device. Background Art

[0002] With the rapid development of display technology, display screens are used in more and more application scenarios. For example, in vehicle-mounted application scenarios, the market demand focuses on touch-sensitive LCD screens with narrow borders and high brightness. However, in actual applications, display devices have heat dissipation problems. Summary of the invention

[0003] In order to solve at least one of the above problems, the first embodiment of the present invention provides a display module, comprising a backlight module, a display panel, and a cover plate arranged on the light-emitting side of the display panel, wherein the display module comprises a display area and a frame area surrounding the display area, and a backlight source of the backlight module and a driving chip of the display panel are both arranged on a first side of the frame area;

[0004] The backlight module includes a back plate, a middle frame and a backlight assembly, the back plate includes a main board, a side plate connected to the edge of the main board, and a first side area corresponding to the frame area: the main board and the side plate form a slot, the middle frame includes a frame body arranged in the slot, a frame side body extending along the main board toward the display area, and a frame retaining wall extending along the side plate toward the cover plate, and the backlight assembly includes the backlight source;

[0005] The backlight assembly is arranged in the accommodation space formed by the main board and the frame side body, and the driving chip is arranged in the accommodation space formed by the frame retaining wall and the frame side body;

[0006] The display module also includes a first heat dissipation tape arranged on the side of the driving chip close to the cover plate, a second heat dissipation tape arranged on the side of the driving chip away from the cover plate, and a heat insulation structure arranged on the side of the frame body close to the second heat dissipation tape, and the first heat dissipation tape and the second heat dissipation tape extend to the frame retaining wall.

[0007] For example, in the display module provided in some embodiments of the present application, the display module further includes a flexible circuit board connected to the driving chip, one side of the flexible circuit board sequentially crosses the frame retaining wall and the side panel and extends to the main board, the display panel includes an array substrate and a color film substrate stacked, the driving chip is arranged on the array substrate and located on a side of the color film substrate close to the frame retaining wall,

[0008] One end of the first heat dissipation tape is attached to the edge of the color film substrate close to the frame retaining wall, covers the side of the driver chip away from the frame side body, covers the side of the flexible circuit board close to the cover plate and extends to the side plate;

[0009] The second heat dissipation tape is attached to a side of the array substrate close to the frame side body, covers a side of the flexible circuit board away from the cover plate and extends to the side plate, and the orthographic projection of the driving chip on the cover plate falls into the orthographic projection of the second heat dissipation tape on the cover plate.

[0010] For example, in the display module provided in some embodiments of the present application, the first heat dissipation tape is a heat-spreading single-sided tape, comprising a heat-conducting adhesive layer, a heat-spreading layer, a substrate and a heat radiation layer sequentially stacked on the driving chip;

[0011] The second heat dissipation tape comprises a heat conductive adhesive layer, a heat conductive layer, a base material and a heat radiation layer which are sequentially stacked and arranged on a side of the array substrate away from the cover plate.

[0012] For example, in the display module provided in some embodiments of the present application, the heat insulation structure is heat insulation foam.

[0013] The orthographic projection of the driving chip on the cover plate falls into the orthographic projection of the thermal insulation foam on the cover plate;

[0014] The orthographic projection of the backlight source on the cover plate falls into the orthographic projection of the thermal insulation foam on the cover plate.

[0015] For example, in the display module provided in some embodiments of the present application, the thermal insulation foam includes a thermal conductive adhesive layer, a thermal insulation closed-cell foam layer, a heat-dissipating layer, a substrate and a black resin layer which are sequentially stacked on the frame side body.

[0016] For example, in the display module provided in some embodiments of the present application, the backlight assembly includes a backlight source, an optical film layer and a light guide plate, the backlight source is arranged on the side of the side plate facing the display area, and the optical film layer and the light guide plate are stacked and arranged on the side of the backlight source close to the display area;

[0017] The side plate includes a first groove, the backlight source is arranged in the first groove, and an escape space of a preset size is included between the backlight source, the optical film layer and the light guide plate.

[0018] For example, in the display module provided in some embodiments of the present application, the frame area further includes a second side edge arranged opposite to the first side edge, and a third side edge and a fourth side edge arranged opposite to the first side edge.

[0019] Corresponding to at least one area among the second side, the third side and the fourth side: the middle frame of the backlight module includes a frame support side portion in contact with the side of the back plate, and a frame support portion extending along the bottom edge of the back plate toward the display area, and the backlight assembly includes an optical film layer and a light guide plate stacked in a receiving space formed by the back plate and the frame support portion;

[0020] The side edge of the back plate includes a second groove, and the second groove and the optical film layer and the light guide plate include the avoidance space;

[0021] The backlight module further includes a bonding portion arranged between the frame support side portion and the side edge of the back plate.

[0022] For example, in the display module provided in some embodiments of the present application, the frame support side portion includes a flange extending toward the side of the back plate away from the display area.

[0023] For example, in the display module provided in some embodiments of the present application, at least one hanging ear is provided at one end of the frame support portion close to the cover plate, and the side of the back plate includes a fixing slot corresponding to the hanging ear one by one.

[0024] For example, in the display module provided in some embodiments of the present application, an ink layer located in the frame area is provided on a side of the cover plate close to the backlight module.

[0025] A cover plate supporting portion for supporting the cover plate is provided on the surface of the back plate close to the cover plate, and the cover plate supporting portion includes a soft supporting structure in contact with the ink layer, and the orthographic projection of the soft supporting structure on the cover plate falls into the orthographic projection of the ink layer on the cover plate.

[0026] For example, in the display module provided in some embodiments of the present application, a third groove and a first flat surface are provided on the surface of the back plate close to the cover plate, the soft supporting structure is arranged in the third groove, the thickness of the soft supporting structure in the direction perpendicular to the cover plate is thicker than the depth of the third groove by a preset first distance, and hot melt adhesive with a thickness of the first distance is laid between the first flat surface and the cover plate.

[0027] For example, in the display module provided in some embodiments of the present application, the surface of the back plate close to the cover plate is a second flat surface, and the soft supporting structure includes a plurality of soft supporting substructures arranged on the second flat surface.

[0028] For example, in the display module provided in some embodiments of the present application, the surface of the back plate close to the cover plate includes a first boss, the soft supporting structure is arranged on the first boss, and the orthographic projection of the soft supporting structure on the cover plate covers the orthographic projection of the first boss on the cover plate.

[0029] A second embodiment of the present invention provides a vehicle-mounted display device, comprising the display module as described in the first embodiment.

[0030] For example, in some embodiments of the present application, the vehicle-mounted display device further includes a support structure for carrying the display module.

[0031] The support structure includes at least one first clamping structure, the side panel of the display module includes a second clamping structure arranged in a one-to-one correspondence with the first clamping structure, and the vehicle-mounted display device also includes a heat dissipation structure arranged between the first clamping structure and the second clamping structure.

[0032] The beneficial effects of the present invention are as follows:

[0033] In view of the current existing problems, the present invention develops a display module and a vehicle-mounted display device. In view of the problem of excessively high surface temperature of the display product caused by arranging the driver chip and the backlight source on the same side of the display module frame area in a narrow frame design, the display module of the present application effectively alleviates the heat dissipation problem of the display module by adopting a first heat dissipation tape, a second heat dissipation tape and a heat insulation structure that are arranged in combination. Specifically, the heat generated by the driver chip during operation is conducted to the back plate of the backlight module to quickly dissipate the heat by using a first heat dissipation tape arranged on the side of the driver chip close to the cover plate and a second heat dissipation tape arranged on the side of the driver chip away from the cover plate. At the same time, the heat generated by the driver chip and the backlight source is effectively isolated by using a heat insulation structure arranged between the driver chip and the backlight source, which can improve the heat dissipation performance of the display module and reduce the problem of excessively high surface temperature of the display product, thereby compensating for the problems existing in the prior art and having practical application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A schematic top view of a display module according to an embodiment of the present invention is shown;

[0036] Figure 2A schematic diagram showing the structure of a first side region of a display module according to an embodiment of the present invention;

[0037] Figure 3 A schematic diagram showing the structure of the first heat dissipation tape according to an embodiment of the present invention is shown;

[0038] Figure 4 A schematic diagram showing the structure of the second heat dissipation tape according to an embodiment of the present invention is shown;

[0039] Figure 5 A schematic structural diagram showing a heat insulation structure according to an embodiment of the present invention;

[0040] Figure 6 A schematic structural diagram showing a first side region of a display module according to another embodiment of the present invention;

[0041] Figure 7 A schematic diagram showing the structure of the second / third / fourth side area of ​​the display module according to an embodiment of the present invention;

[0042] Figure 8a-8c A schematic diagram showing a soft supporting structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0044] It should be noted that the terms “on…”, “formed on…” and “disposed on…” described herein may indicate that one layer is directly formed or disposed on another layer, or may indicate that one layer is indirectly formed or disposed on another layer, i.e., there are other layers between the two layers. In this article, unless otherwise specified, the term “located on the same layer” used means that two layers, parts, components, elements or parts can be formed by the same patterning process, and the two layers, parts, components, elements or parts are generally formed of the same material. In this article, unless otherwise specified, the expression “patterning process” generally includes steps such as coating, exposure, development, etching and stripping of photoresist. The expression “one-time patterning process” means a process of forming patterned layers, parts, components, etc. using a mask.

[0045] To meet the narrow border requirements of display products, such as Figure 1As shown, it is a planar schematic diagram of the display module 100 of the present application, including a display area 102 and a frame area 101 surrounding the display area, the frame area 101 includes a first side 1011 and a second side 1012 arranged oppositely, and a third side 1013 and a fourth side 1014 arranged oppositely, wherein the second side 1012, the third side 1013 and the fourth side 1014 are designed as narrow frames, and the driver chip 23 and the backlight source 16 of the display module are concentrated on the first side 1011. However, since the driver chip and the backlight source are arranged on the same side wide edge, the temperature of the side is accumulated and superimposed and radiated upward to the surface of the cover plate, and if the heat is not dissipated in time, it is easy to cause the surface temperature of the cover plate to be too high; at the same time, according to the structure of three sides as narrow frames and one side as wide frame, the side of the wide frame is usually fixed, and the other three sides are suspended to form a central control with three sides suspended and a ceiling screen with the wide side as the rotation axis, and embedded in the whole machine, there are problems of difficult heat dissipation of the product and excessive heat on the surface of the product.

[0046] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a display module, including a backlight module, a display panel 20, and a cover plate 30 arranged on the light emitting side of the display panel 20, the display module includes a display area 102 and a frame area 101 surrounding the display area 102, the backlight source 16 of the backlight module and the driving chip 23 of the display panel 20 are both arranged on the first side 1011 of the frame area 101;

[0047] The backlight module includes a back plate, a middle frame and a backlight assembly. The back plate includes a main board 11 and a side plate 12 connected to the edge of the main board 11, corresponding to the first side area of ​​the frame area 101: the main board 11 and the side plate 12 form a card slot, the middle frame includes a frame body 13 arranged in the card slot, a frame side body 14 extending along the main board 11 toward the display area 102, and a frame retaining wall 15 extending along the side plate 12 toward the cover plate 30, and the backlight assembly includes the backlight source 16;

[0048] The backlight assembly is disposed in the accommodation space formed by the main board 11 and the frame side body 14, and the driving chip 23 is disposed in the accommodation space formed by the frame retaining wall 15 and the frame side body 14;

[0049] The display module also includes a first heat dissipation tape 41 arranged on the side of the driving chip 23 close to the cover plate 30, a second heat dissipation tape 42 on the side of the driving chip 30 away from the cover plate 30, and a heat insulation structure 43 arranged on the side of the frame side body 14 close to the second heat dissipation tape 42, and the first heat dissipation tape 41 and the second heat dissipation tape 42 extend to the frame retaining wall 15.

[0050] In this embodiment, in order to address the situation where the driver chip and the backlight source are arranged on the same side of the wide edge, which causes overheating of the display product surface, based on the existing structure of the display module, while trying not to change the existing structure, that is, by utilizing the back panel and the middle frame structure, by setting specified materials at specified positions for heat conduction and insulation, the heat generated by the driver chip closer to the cover plate can be effectively and quickly conducted away, and the heat generated by the backlight source can be isolated from the heat generated by the driver chip, thereby preventing the heat generated by the backlight source from affecting the surface temperature of the display product, thereby improving the user experience of the display product at a relatively low cost.

[0051] Specifically, this embodiment combines a heat dissipation tape and a heat insulation structure, that is, a first heat dissipation tape is respectively arranged on the side of the driver chip close to the cover plate, and a second heat dissipation tape is arranged on the side of the driver chip away from the cover plate. The heat generated by the driver chip during operation is conducted to the middle frame of the backlight module for rapid heat dissipation. At the same time, the heat insulation structure is arranged between the driver chip and the backlight source to effectively isolate the heat generated by the two, thereby effectively improving the heat dissipation performance of the display module, which has practical application value.

[0052] In an optional embodiment, if Figure 2 As shown, the display module also includes a flexible circuit board 28 connected to the driving chip 23, one side of the flexible circuit board 28 sequentially crosses the frame retaining wall 15 and the side plate 12 and extends to the main board 11, the display panel 26 includes a stacked array substrate 21 and a color film substrate 22, the driving chip 23 is arranged on the array substrate 21, and is located on a side of the color film substrate 22 close to the frame retaining wall 101.

[0053] One end of the first heat dissipation tape 41 is attached to the edge of the color filter substrate 22 close to the frame retaining wall 15, covers the side of the driver chip 23 away from the frame side body 14, covers the side of the flexible circuit board 28 close to the cover plate 30 and extends to the side plate 12;

[0054] The second heat dissipation tape 42 is attached to a side of the array substrate 21 close to the frame side body 14 , covers a side of the flexible circuit board 28 away from the cover plate 30 and extends to the side plate 12 , and the orthographic projection of the driving chip 23 on the cover plate 30 falls into the orthographic projection of the second heat dissipation tape 42 on the cover plate 30 .

[0055] In this embodiment, a flexible circuit board connected to the driver chip is used, and the extension directions of the first heat dissipation tape 41 and the second heat dissipation tape 42 are further set on the basis of the previous embodiment, so as to quickly conduct the heat generated by the driver chip to the back plate of the backlight module, thereby achieving rapid heat dissipation.

[0056] Specifically, Figure 2As shown, according to the structural setting of the display panel 20 and the backlight module, a first heat dissipation tape 41 is provided on the side of the driver chip close to the cover plate, that is, above the driver chip, to guide the heat dissipated by the driver chip out. Figure 3 As shown, the first heat dissipation tape 41 of this embodiment is a heat-averaging single-sided tape, including a heat-conducting adhesive layer 411, a heat-averaging layer 412, a substrate 413 and a heat radiation layer 414 stacked in sequence on the driver chip, and the orthographic projection of the first heat dissipation tape 41 on the cover plate 30 covers the orthographic projection of the driver chip 23 on the cover plate 30. In this embodiment, the heat generated by the driver chip is evenly and quickly dispersed and conducted along the single-sided tape by the first heat dissipation tape 41, for example, the heat generated by the driver chip is quickly dispersed along the heat-averaging layer of the tape, so that the first heat dissipation tape 41 disposed above the driver chip 23 and covering the driver chip 23 disperses the heat generated by the driver chip to reduce the surface temperature of the driver chip, and quickly conducts it along the flexible circuit board to the back plate of the backlight module, and the back plate is a die-casting structure, which is conducive to heat conduction and heat dissipation.

[0057] At the same time, on the side of the driver chip 23 away from the cover plate 30, that is, on the surface of the array substrate 21 away from the cover plate 30, that is, below the driver chip, a second heat dissipation tape 42 is provided to conduct away the heat dissipated by the driver chip. Figure 4 As shown, the second heat dissipation tape 42 includes a heat conductive adhesive layer 421, a heat conductive layer 422, a substrate 423 and a heat radiation layer 434 which are sequentially stacked on the array substrate 21, and the orthographic projection of the second heat dissipation tape 42 on the cover plate 30 covers the orthographic projection of the driver chip 23 on the cover plate 30. In this embodiment, the heat generated by the driver chip is quickly conducted to the frame retaining wall and the back plate by the second heat dissipation tape 42, so as to be uniformly and quickly conducted out. That is, the heat generated by the driver chip is conducted out by the second heat dissipation tape 42 which is arranged on the side of the array substrate below the driver chip 23 away from the cover plate to reduce the surface temperature of the driver chip.

[0058] It is worth noting that this embodiment is only used to illustrate the specific implementation method of the present application. The present application does not specifically limit the tape shape and area of ​​the first heat dissipation tape and the second heat dissipation tape. The larger the area of ​​the tape, the more obvious the heat dissipation effect. Technical personnel in this field should select appropriate tape shape and area according to actual application requirements, which will not be repeated here.

[0059] In an optional embodiment, the thermal insulation structure is thermal insulation foam, the orthographic projection of the driver chip on the cover plate falls into the orthographic projection of the thermal insulation foam on the cover plate; the orthographic projection of the backlight source on the cover plate falls into the orthographic projection of the thermal insulation foam on the cover plate.

[0060] In this embodiment, heat insulation foam is arranged between the driver chip and the backlight source to isolate the heat of the two. Furthermore, considering the problem of heat generation on the surface of the display product, the heat dissipation problem of the driver chip and the heat dissipation problem of the backlight source, in the limited space between the driver chip and the backlight source, on the basis of using the first heat dissipation tape and the second heat dissipation tape to quickly extract the heat generated by the driver chip, and on the basis of extracting the heat of the backlight source from the mainboard and the frame side body, heat insulation foam is arranged in the space between the frame side body and the frame retaining wall of the middle frame and the array substrate to block the heat transfer between the driver chip and the backlight source, and ensure that the isolation range of the heat insulation foam covers the driver chip and the backlight source to achieve a better heat insulation effect, that is, on the orthographic projection of the cover plate, the orthographic projection of the driver chip and the backlight source are both in the orthographic projection of the heat insulation foam. Therefore, on the basis of the existing structure of the display module, the characteristics of the existing structure are utilized, and the specified material is arranged at the specified position for heat conduction and heat insulation, which effectively reduces the surface temperature of the display product and improves the user experience of the display product at a relatively low cost.

[0061] Specifically, Figure 5 As shown, the heat insulating foam 43 includes a heat conductive adhesive layer 431, a heat insulating closed-cell foam layer 432, a heat balancing layer 433, a substrate 434 and a black resin layer 435 which are sequentially stacked on the frame side. The heat generated by the backlight source and the heat generated by the driver chip are blocked from the middle by the stacked multiple film layers, preventing the heat generated by the backlight source from continuing to propagate upward, thereby reducing the surface temperature of the display product. Figure 1 As shown, in this embodiment, the size of the heat insulating foam 43 is set according to the shape of the display module itself, and the position, shape and length of the backlight source 16 to achieve heat isolation between the driver chip and the backlight source, such as Figure 2 As shown, while the heat insulating foam 43 is provided, a supporting foam 19 is provided at a position of the heat insulating foam close to the display area, so as to realize the supporting function on the basis of realizing the heat insulating function.

[0062] Considering the width of the first side, in an optional embodiment, as Figure 6 As shown, the backlight assembly includes a backlight source 16, an optical film layer 17 and a light guide plate 18, the backlight source 16 is arranged on the side of the side panel 12 facing the display area 102, and the optical film layer 17 and the light guide plate 18 are stacked and arranged on the side of the backlight source 16 close to the display area 102; the side panel 12 includes a first groove 44, the backlight source 16 is arranged in the first groove 44, and an avoidance space of a preset size is included between the backlight source 16, the optical film layer 17 and the light guide plate 18.

[0063] In this embodiment, the first groove 44 is provided at the position where the backlight source 16 is installed on the main board 11 of the backlight module, so that the backlight source is set inward, and the frame width of the first side is effectively shortened while ensuring the avoidance space between the backlight source 16, the optical film layer 17 and the light guide plate 18. That is, by making a groove on the side of the main board for partial avoidance to form the avoidance space between the backlight source and the optical film layer and the light guide plate of the backlight module, on the one hand, the requirements of the lamination amount and expansion space of the optical film material are met, and on the other hand, the reliability requirements of the narrow frame design of the display module are met.

[0064] Considering the further narrow frame design of the display module, in an optional embodiment, as Figure 1 and Figure 7 As shown, the frame area 101 further includes a second side edge 1012 disposed opposite to the first side edge 1011, and a third side edge 1013 and a fourth side edge 1014 disposed opposite to each other.

[0065] Corresponding to at least one area among the second side 1012, the third side 1013 and the fourth side 1014: the middle frame of the backlight module includes a frame support side portion 51 in contact with the side of the back plate 10, and a frame support portion 52 extending along the bottom edge of the back plate 10 toward the display area 102, and the backlight assembly includes an optical film layer 17 and a light guide plate 18 stacked in a receiving space formed by the back plate 10 and the frame support portion 52;

[0066] The side of the back plate 10 includes a second groove 45 , and the second groove 45 and the optical film layer 17 and the light guide plate 18 include the avoidance space; the backlight module also includes a bonding portion 46 arranged between the frame support side portion 51 and the side of the back plate 10 .

[0067] In this embodiment, a groove is made inside the back plate to make a partial avoidance to form an avoidance space with the optical film layer and the light guide plate of the backlight module, which not only meets the needs of the optical film material lamination and expansion space, but also meets the reliability requirements of the narrow frame design of the display module. Considering the support problem of the middle frame, in order to avoid the collapse, deformation and abnormal sound of the middle frame, double-sided tape is set between the side of the back plate and the frame support side of the middle frame to achieve the fixation and support of the middle frame.

[0068] To further improve the supporting performance of the middle frame, in an optional embodiment, the frame supporting side portion includes a flange extending toward a side of the back plate away from the display area.

[0069] In this embodiment, considering that the back plate is a die-casting and the middle frame is a sheet metal structure, the frame support side of the middle frame adopts a flanging process to increase the physical support points of the frame support side on the side of the back plate. On the one hand, the support and fixing function of the middle frame is improved, and on the other hand, the pressure is dispersed to reduce the possibility of deformation and cracking of the middle frame, thereby improving the product yield and stability of the display module and improving the user experience.

[0070] To further improve the supporting performance of the middle frame, in another optional embodiment, at least one hanging ear is provided at one end of the frame supporting portion close to the cover plate, and the side of the back plate includes a fixing slot corresponding to the hanging ear one by one.

[0071] In this embodiment, a pair of clip structures are provided on the sides of the frame support portion and the back plate. For example, a U-shaped hanging ear structure is provided on the frame support portion, and a card slot corresponding to the U-shaped hanging ear structure is provided on the side of the back plate. Through the cooperation of the U-shaped hanging ear and the card slot, the horizontal displacement of the middle frame is limited, thereby improving the supporting and fixing function of the middle frame, effectively improving the product yield and stability of the display module, and improving the user experience.

[0072] To further improve the stability of the display module, in an optional embodiment, Figure 2 , Figure 6 and Figure 7 As shown, the cover plate 30 is provided with an ink layer 31 located in the frame area 101 on one side close to the backlight module.

[0073] A cover plate support portion 47 for supporting the cover plate 30 is provided on the surface of the back plate close to the cover plate 30 , and the cover plate support portion 47 includes a soft support structure in contact with the ink layer 31 , and the orthographic projection of the soft support structure on the cover plate 30 falls into the orthographic projection of the ink layer 31 on the cover plate 30 .

[0074] In the prior art, a glue dispensing process is used to form a glue dispensing boss on the surface of the back plate close to the cover plate to support the cover plate. The glue dispensing boss is uneven, causing the cover plate to be compressed and causing light leakage, or the glue dispensing boss damages the ink layer of the cover plate. In this embodiment, a soft supporting structure is set between the cover plate ink layer and the back plate, such as a soft silicone structure, to change the hard-hard-hard structure of the cover plate-glue dispensing boss-back plate in the prior art to the hard-soft-hard structure of the cover plate-soft silicone structure-back plate in this embodiment, thereby effectively eliminating the light leakage phenomenon, improving the back plate production yield, and thus improving the display effect of the display module.

[0075] In an optional embodiment, if Figure 8aAs shown, the surface of the back plate 10 close to the cover plate 30 is provided with a third groove 105 and a first flat surface 106, the soft supporting structure 47 is arranged in the third groove 105, and the thickness of the soft supporting structure 47 in the direction perpendicular to the cover plate 30 is thicker than the depth of the third groove 105 by a preset first distance, and a hot melt adhesive 48 with a thickness of the first distance is laid between the first flat surface 106 and the cover plate 30.

[0076] In this embodiment, a groove is provided on the surface of the back plate close to the cover plate, and a soft supporting structure is provided inside the groove. The first distance is the distance between the back plate and the cover plate. When the cover plate is subjected to external force and is squeezed, the cover plate is supported by a soft supporting structure deeper than the third groove. At the same time, hot melt adhesive is provided on the flat surface outside the groove, which effectively avoids direct contact between the back plate and the cover plate, thereby eliminating light leakage. In this embodiment, a hard-soft-hard structure of cover plate-soft supporting structure-back plate is realized by the soft supporting structure and hot melt adhesive provided in the third groove, thereby effectively improving the production yield of the back plate and the display effect of the display module.

[0077] In an optional embodiment, if Figure 8b As shown, the surface of the back plate 10 close to the cover plate 30 is a second flat surface 107 , and the soft supporting structure 47 includes a plurality of soft supporting substructures arranged on the second flat surface 107 .

[0078] In this embodiment, a soft supporting structure is provided on the surface of the back plate close to the cover plate, and hot melt adhesive is provided in the space between the cover plate and the back plate except the soft supporting structure. When the cover plate is subjected to external force and is squeezed, the cover plate is supported by the soft supporting structure and the hot melt adhesive, thereby effectively avoiding direct contact between the back plate and the cover plate, thereby eliminating light leakage. This embodiment realizes a hard-soft-hard structure of cover plate-soft supporting structure-back plate through the soft supporting structure and the hot melt adhesive, thereby effectively improving the production yield of the back plate and the display effect of the display module.

[0079] In an optional embodiment, if Figure 8c As shown, the surface of the back plate 10 close to the cover plate 30 includes a first boss 109 , and the soft support structure 47 is arranged on the first boss 109 . The orthographic projection of the soft support structure 47 on the cover plate 30 covers the orthographic projection of the first boss 109 on the cover plate 30 .

[0080] In this embodiment, a first boss 109 and a soft supporting structure 47 are provided on the surface of the back plate 10 close to the cover plate 30, and hot melt adhesive is provided on the third flat surface 108 of the cover plate 30 except the first boss 109 and in the space of the cover plate. When the cover plate is subjected to external force and is squeezed, the cover plate is supported by the soft supporting structure and the hot melt adhesive, thereby effectively avoiding direct contact between the back plate and the cover plate, thereby eliminating light leakage. In this embodiment, a hard-soft-hard structure of cover plate-soft supporting structure-back plate is realized through the soft supporting structure and the hot melt adhesive, thereby effectively improving the production yield of the back plate and the display effect of the display module.

[0081] Based on the display module of the above embodiment, one embodiment of the present invention further provides a vehicle-mounted display device, comprising the display module of the above embodiment.

[0082] The vehicle-mounted display device of the present embodiment aims to solve the problem of excessively high surface temperature of the display product caused by arranging the driver chip and the backlight source on the same side of the display module frame area in a narrow frame design. The heat dissipation problem of the display module is effectively alleviated by adopting a first heat dissipation tape, a second heat dissipation tape and a heat insulation structure that are arranged in combination. Specifically, the heat generated by the driver chip during operation is conducted to the back plate of the backlight module to quickly dissipate the heat by using a first heat dissipation tape arranged on the side of the driver chip close to the cover plate and a second heat dissipation tape arranged on the side of the driver chip away from the cover plate. At the same time, the heat generated by the driver chip and the backlight source is effectively isolated by using a heat insulation structure arranged between the driver chip and the backlight source. This can improve the heat dissipation performance of the display module and reduce the problem of excessively high surface temperature of the vehicle-mounted display device.

[0083] In an optional embodiment, the vehicle-mounted display device also includes a supporting structure for supporting the display module, the supporting structure includes at least one first clip-on structure, the side panel of the display module includes a second clip-on structure arranged in a one-to-one correspondence with the first clip-on structure, and the vehicle-mounted display device also includes a heat dissipation structure arranged between the first clip-on structure and the second clip-on structure.

[0084] In this embodiment, the back panel structure of the existing display module and the supporting structure of the vehicle-mounted display device are utilized, and paired clip structures are arranged between the back panel structure and the supporting structure. For example, if a groove is arranged on the back panel structure, a corresponding boss is arranged on the supporting structure, or if a boss is arranged on the back panel structure, a corresponding groove is arranged on the supporting structure, or if a groove and a boss are arranged on the back panel structure, a corresponding boss and a groove are arranged on the supporting structure. At the same time, a heat dissipation structure is arranged between the paired clip structures, for example, heat dissipation materials such as heat dissipation foam are arranged, so that the heat generated by the driving chip and the backlight source in the display module is further conducted to the supporting structure of the vehicle-mounted display device, thereby further improving the heat dissipation function and improving the problem of excessive surface temperature of the vehicle-mounted display device.

[0085] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A display module, characterized in that: It comprises a backlight module, a display panel, and a cover plate arranged on the light-emitting side of the display panel, wherein the display module comprises a display area and a frame area surrounding the display area, and a backlight source of the backlight module and a driving chip of the display panel are both arranged on a first side of the frame area; The backlight module includes a back plate, a middle frame and a backlight assembly, the back plate includes a main board, a side plate connected to the edge of the main board, and corresponds to the first side area of ​​the frame area: the main board and the side plate form a card slot, the middle frame includes a frame body arranged in the card slot, a frame side body extending along the main board toward the display area, and a frame retaining wall extending along the side plate toward the cover plate, and the backlight assembly includes the backlight source; The backlight assembly is arranged in the accommodation space formed by the main board and the frame side body, and the driving chip is arranged in the accommodation space formed by the frame retaining wall and the frame side body; The display module also includes a first heat dissipation tape arranged on the side of the driving chip close to the cover plate, a second heat dissipation tape arranged on the side of the driving chip away from the cover plate, and a heat insulation structure arranged on the side of the frame body close to the second heat dissipation tape, and the first heat dissipation tape and the second heat dissipation tape extend to the frame retaining wall.

2. The display module according to claim 1, characterized in that: The display module further includes a flexible circuit board connected to the driving chip, one side of the flexible circuit board sequentially spans the frame retaining wall and the side plate and extends to the main board, the display panel includes a stacked array substrate and a color film substrate, the driving chip is arranged on the array substrate and located on a side of the color film substrate close to the frame retaining wall, One end of the first heat dissipation tape is attached to the edge of the color film substrate close to the frame retaining wall, covers the side of the driver chip away from the frame side body, covers the side of the flexible circuit board close to the cover plate and extends to the side plate; The second heat dissipation tape is attached to a side of the array substrate close to the frame side body, covers a side of the flexible circuit board away from the cover plate and extends to the side plate, and the orthographic projection of the driving chip on the cover plate falls into the orthographic projection of the second heat dissipation tape on the cover plate.

3. The display module according to claim 2, characterized in that: The first heat dissipation tape is a heat-dissipating single-sided tape, comprising a heat-conducting adhesive layer, a heat-dissipating layer, a substrate and a heat-radiating layer stacked in sequence on the driver chip; The second heat dissipation tape comprises a heat conductive adhesive layer, a heat conductive layer, a base material and a heat radiation layer which are sequentially stacked and arranged on a side of the array substrate away from the cover plate.

4. The display module according to claim 1, characterized in that: The thermal insulation structure is thermal insulation foam. The orthographic projection of the driving chip on the cover plate falls into the orthographic projection of the thermal insulation foam on the cover plate; The orthographic projection of the backlight source on the cover plate falls into the orthographic projection of the thermal insulation foam on the cover plate.

5. The display module according to claim 4, characterized in that: The heat-insulating foam comprises a heat-conducting adhesive layer, a heat-insulating closed-cell foaming layer, a heat-dissipating layer, a substrate and a black resin layer which are sequentially stacked on the frame side body.

6. The display module according to any one of claims 1 to 5, characterized in that: The backlight assembly comprises a backlight source, an optical film layer and a light guide plate, wherein the backlight source is arranged on the side of the side plate facing the display area, and the optical film layer and the light guide plate are stacked and arranged on the side of the backlight source close to the display area; The side plate comprises a first groove, the backlight source is arranged in the first groove, and an escape space of a preset size is included between the backlight source, the optical film layer and the light guide plate.

7. The display module according to claim 6, characterized in that: The frame area further includes a second side edge disposed opposite to the first side edge, and a third side edge and a fourth side edge disposed opposite to the first side edge. Corresponding to at least one area among the second side, the third side and the fourth side: the middle frame of the backlight module includes a frame support side portion in contact with the side of the back plate, and a frame support portion extending along the bottom edge of the back plate toward the display area, and the backlight assembly includes an optical film layer and a light guide plate stacked in a receiving space formed by the back plate and the frame support portion; The side edge of the back plate includes a second groove, and the second groove and the optical film layer and the light guide plate include the avoidance space; The backlight module further includes a bonding portion arranged between the frame support side portion and the side edge of the back plate.

8. The display module according to claim 7, characterized in that: The frame support side portion includes a flange extending toward a side of the back plate away from the display area; or At least one hanging ear is arranged at one end of the frame support portion close to the cover plate, and the side edge of the back plate includes a fixing card slot corresponding to the hanging ear one by one.

9. The display module according to any one of claims 1 to 5, characterized in that: The cover plate is provided with an ink layer located in the frame area on one side close to the backlight module. A cover plate supporting portion for supporting the cover plate is provided on the surface of the back plate close to the cover plate, and the cover plate supporting portion includes a soft supporting structure in contact with the ink layer, and the orthographic projection of the soft supporting structure on the cover plate falls into the orthographic projection of the ink layer on the cover plate.

10. The display module according to claim 9, characterized in that: A third groove and a first flat surface are provided on the surface of the back plate close to the cover plate, the soft support structure is provided in the third groove, the thickness of the soft support structure in a direction perpendicular to the cover plate is thicker than the depth of the third groove by a preset first distance, and hot melt adhesive with a thickness of the first distance is laid between the first flat surface and the cover plate; or The surface of the back plate close to the cover plate is a second flat surface, and the soft support structure includes a plurality of soft support substructures arranged on the second flat surface; or The surface of the back plate close to the cover plate comprises a first boss, the soft support structure is arranged on the first boss, and the orthographic projection of the soft support structure on the cover plate covers the orthographic projection of the first boss on the cover plate.

11. A vehicle-mounted display device, characterized in that: Comprising the display module as described in any one of claims 1-10.

12. The vehicle-mounted display device according to claim 11, characterized in that: It also includes a supporting structure for carrying the display module. The support structure includes at least one first clamping structure, the side panel of the display module includes a second clamping structure arranged in a one-to-one correspondence with the first clamping structure, and the vehicle-mounted display device also includes a heat dissipation structure arranged between the first clamping structure and the second clamping structure.

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