Plasma-combined auxiliary liquid metal self-activation method and application thereof
By combining plasma-assisted liquid metal self-activation method, the challenges of liquid metal particles in the prior art in terms of resolution and activation are solved, and a high tensile, conductive and high resolution interconnect structure is achieved, which is suitable for the manufacturing of stretchable electronic devices.
Patent Information
- Application Number
- CN202411588780.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-29
- Filing Date
- 2024-11-08
- Publication Date
- 2025-03-18
AI Technical Summary
The prior art is difficult to develop interconnect structures that can withstand large strains while maintaining low resistance, and liquid metal particles have challenges in resolution and activation, making it difficult to achieve interconnect structures with high tensileability, conductivity and high resolution.
Using a plasma-assisted liquid metal self-activation method, a plasma treatment of the patterned liquid metal photoresist is carried out, hydrophilic groups are introduced, and an elastomeric solution is poured on a micro-scale liquid metal pattern, and the elastomeric film is peeled off to enhance the adhesion and cohesion of the liquid metal nanoparticles to achieve the activation of the conductive pathway.
The high-quality micro-scale liquid metal pattern is achieved while transforming it from an insulator to a high conductor, improving conductivity and resolution, and is suitable for the manufacturing of stretchable electronic devices.