Automatic splitting and pelletizing device

Abstract

The present invention discloses an automatic chipping and pelletizing device, comprising a pelletizing connection seat, a pelletizing swing block installed in the pelletizing connection seat via a swing shaft, a swing seat plate connected to the lower portion of the pelletizing swing block, and a pelletizing movable block on the swing seat plate; a pelletizing reset spring is provided between the movable block and the pelletizing connection seat, and a push cylinder is used to connect or separate the movable pressing block from the pelletizing swing block; a ceramic substrate enters a limited pressing groove from a conveyor and reaches a pelletizing station groove, is fixed in the limited pressing groove via a pelletizing clamping swing arm, and the swing seat plate is struck by a swing cylinder and drives the pelletizing swing block to swing downward, so that the ceramic substrate is split along the scratch portion to form a resistor. The pelletizing swing block cooperates with the pelletizing connection seat, and the pelletizing is split in a breaking manner, which has a compact structure and a small movement amplitude, thereby overcoming the defect that double-roller splitting occupies a large space, and at the same time overcomes the defect that the punching method easily breaks the ceramic substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of resistor production and manufacturing, and in particular to an automatic chip splitting and particle disassembling device. Background Art

[0002] Chip resistors, also known as surface mount resistors, are a new generation of leadless or short-lead miniature electronic components suitable for surface mount technology (SMT). The soldering surfaces of their lead terminals are on the same plane. Chip resistors come in various types, including thick-film chip resistors, thin-film chip resistors, and metal plate chip resistors. Chip resistors serve various functions in circuits, such as voltage division, current shunting, impedance matching, and filtering. A chip resistor typically consists of a substrate, a resistive film, a protective film, and electrodes. The substrate material is typically 96% alumina ceramic. This ceramic not only offers excellent electrical insulation but also excellent thermal conductivity and mechanical strength at high temperatures. The resistive film, protective film, and electrodes are typically printed and sintered onto the substrate. The substrate is then split into individual resistor chips, which are then soldered to leads or packaged to form the chip resistor. Therefore, substrate splitting is a critical process.

[0003] Existing chip splitting machines usually use double rollers to extrude the chips, but the larger the size of the resistor, the larger the roller diameter is required, which takes up a lot of table space and makes it difficult to arrange and install other mechanisms. In addition, since the substrate is made of a hard and brittle material such as ceramic, chipping by punching is prone to cracking and incomplete cross-sections. The use of manual clamping followed by semi-automatic breaking and knocking to split the chips has low production efficiency, and the scattered resistor chips are not conducive to the positioning and transfer of subsequent processes. Summary of the Invention

[0004] The present invention provides an automatic splitting and granulating device, which can automatically split and granulate a substrate on which a resistor film, a protective film and an electrode are formed, and can accurately position the substrate, thereby achieving high production efficiency.

[0005] In order to solve the above technical problems, the technical solutions of the present invention are as follows:

[0006] The lifting of the ...

[0007] Specifically, the limiting and pressing groove is provided on the upper side of the grain-stripping connecting seat, and grain-stripping limiting blocks are respectively provided on both sides of the limiting and pressing groove. A swing installation station groove is provided below the limiting and pressing groove, and the grain-stripping swing block is installed in the swing installation station groove through the swing shaft.

[0008] Specifically, along the conveying direction of the ceramic substrate, one side of the disassembling station slot of the disassembling swing block corresponds to the limiting and pressing slot, and the other side is provided with a disassembling stopper. A chip discharge slot is formed between the disassembling stoppers. The chip discharge slot is located at the front end of the ceramic substrate. As the ceramic substrate is conveyed, debris generated by disassembling falls through the chip discharge slot into the bottom of the device.

[0009] Furthermore, a movable mounting groove is provided between the grain-stripping swing block and the swing seat plate, the spring accommodating movable part of the grain-stripping movable block cooperates with the movable mounting groove, and a grain-stripping reset spring station is provided in the spring accommodating movable part for installing the grain-stripping reset spring.

[0010] Furthermore, the pushing block cylinder is set at the rear end of the swing seat plate through the pushing block cylinder mounting block, and the pushing block cylinder extends to push the grain-splitting movable block to combine with the grain-splitting swing block. After the pushing block cylinder contracts, the grain-splitting reset spring separates the grain-splitting movable block from the grain-splitting swing block.

[0011] Specifically, the particle demolition movable block is provided with a particle demolition positioning platform corresponding to the particle demolition work station slot, and the movable pressure block is provided on the upper part of the particle demolition positioning platform. When the particle demolition movable block is combined with the particle demolition swing block, the movable pressure block limits the front end of the ceramic substrate between the particle demolition work station slot and the particle demolition positioning platform.

[0012] Optionally, the pelletizing positioning platform is respectively provided with a pelletizing position sensor corresponding to the pelletizing station slot.

[0013] Furthermore, along the conveying direction of the ceramic substrate, an extension portion is provided between the grain demolition station groove and the side of the grain demolition stop block. When the grain demolition movable block is combined with the grain demolition swing block, the movable pressure block restricts the front end of the ceramic substrate between the grain demolition station groove and the grain demolition positioning platform, and a gap is formed between the front end of the ceramic substrate and the grain demolition stop block.

[0014] Furthermore, the oscillating cylinder is fixed to the lower side of the grain-stripping connecting seat through a oscillating cylinder mounting seat, and a oscillating action arm is extended from the lower side of the oscillating seat plate. The oscillating cylinder hits the oscillating action arm to drive the grain-stripping oscillating block to swing downward, so that the grain-stripping station groove of the grain-stripping oscillating block is separated from the limiting pressing groove of the grain-stripping connecting seat and the ceramic substrate is cracked along the scratch portion at the separation position.

[0015] Furthermore, one end of the grain-cutting and compacting swing arm is hinged on the swing arm mounting block, and the swing arm mounting block is fixed on the compacting support. A compacting cylinder is provided on the upper side of the grain-cutting and compacting swing arm, and the compacting cylinder is fixed to the compacting support through a compacting cylinder mounting block. A compacting return spring station is provided between the compacting cylinder mounting block and the grain-cutting and compacting swing arm for installing a compacting return spring.

[0016] Beneficial effects of the technical solution of the present invention:

[0017] The automatic chipping and granulation device of the embodiment of the present invention cooperates with the chipping swing block and the chipping connecting seat, and adopts the breaking form to perform chipping. It has a compact structure and a small movement amplitude, which overcomes the defect that the double-roller chipping occupies a large space, and at the same time overcomes the defect that the chipping in the punching method easily breaks the ceramic substrate; through the combination or separation between the chipping movable block, the movable pressure block and the chipping swing block, the ceramic substrate can be fixed during chipping and the resistor can be positioned in the chipping station slot after the chipping is completed and reset, thereby facilitating subsequent automatic unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 The three-dimensional structure of the automatic fragmentation and granulation device according to the embodiment of the present invention Figure 1 ;

[0020] Figure 2 The three-dimensional structure of the automatic fragmentation and granulation device according to the embodiment of the present invention Figure 2 ;

[0021] Figure 3 The three-dimensional decomposition structure of the automatic fragmentation and granulation device according to the embodiment of the present invention Figure 1 ;

[0022] Figure 4 The three-dimensional decomposition structure of the automatic fragmentation and granulation device according to the embodiment of the present invention Figure 2 ;

[0023] Figure 5 The three-dimensional structure diagram of the automatic chip splitting and granulation device according to the embodiment of the present invention is partially omitted;

[0024] Figure 6 This is a partially omitted cross-sectional structural diagram of the automatic chip splitting and granulation device according to an embodiment of the present invention;

[0025] Figure 7 Schematic diagram of the ceramic substrate splitting action according to an embodiment of the present invention.

[0026] In the figure, 10-automatic splitting and disassembling device, 11-disassembling connecting seat, 1101-limiting and pressing groove, 1102-swinging installation position groove;

[0027] 12-particle disassembly swing block, 121-particle disassembly station slot, 122-particle disassembly stopper, 123-movable mounting slot, 124-swinging block, 125-chip removal slot;

[0028] 13-swing seat plate, 131-swing action arm, 14-swing shaft, 15-granulation movable block, 151-spring accommodating movable part, 152-granulation positioning platform;

[0029] 16- movable pressing block, 17- pushing cylinder, 18- pushing cylinder mounting block, 19- grain removal return spring station, 110- swing cylinder, 111- swing cylinder mounting seat, 112- grain removal limit block, 113- swing adjustment screw, 114- grain removal in-place sensor;

[0030] 115-Compression support, 116-Pellet stripping and compression swing arm, 117-Swing arm mounting block, 118-Swing arm limit screw, 119-Compression cylinder, 1110-Compression cylinder mounting block, 1111-Compression return spring station;

[0031] 20-transmission device, 21-transmission seat plate, 22-conveyor belt assembly, 23-transmission limit baffle;

[0032] 30-ceramic substrate, 31-resistance sheet, 32-scratched portion. DETAILED DESCRIPTION

[0033] The following is a further description of specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is intended to facilitate understanding of the present invention and does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0034] Example 1

[0035] like Figure 1-4 As shown, the embodiment of the present invention provides an automatic fragmentation and grain disassembling device 10, comprising: a grain disassembling connecting seat 11, a grain disassembling swing block 12 installed in the grain disassembling connecting seat 11 through a swing shaft 14, a swing seat plate 13 is connected to the lower side of the grain disassembling swing block 12, and a grain disassembling movable block 15 is provided on the swing seat plate 13; a limited pressing groove 1101 is provided on the grain disassembling connecting seat 11, a grain disassembling station groove 121 corresponding to the limited pressing groove 1101 is provided on the grain disassembling swing block 12, and a movable pressing block 16 is provided on the grain disassembling movable block 15 corresponding to the grain disassembling station groove 121. A disassembling return spring (not shown) is provided between the disassembling movable block 15 and the disassembling connecting seat 11, and the movable pressing block 16 is engaged with or separated from the disassembling station slot 121 through a pushing cylinder 17; the ceramic substrate 30 enters the limiting pressing groove 1101 from the conveying device 20 and reaches the disassembling station slot 121, and is fixed in the limiting pressing groove 1101 through a disassembling pressing swing arm 116, and the swing seat plate 13 is struck by a swing cylinder 110 and drives the disassembling swing block 12 to swing downward, and the ceramic substrate 30 cracks along the scratch portion to form a resistor.

[0036] When using, Figure 7 As shown, a ceramic substrate 30 is pre-printed with a resistor film, a protective film, and an electrode, and a scratch portion 32 is processed and set on the ceramic substrate 30 according to the specifications of the resistor sheet; it enters the limiting and pressing groove 1101 of the grain disassembling connection seat 11 through the conveying device 20, and the front end of the ceramic substrate 30 reaches the grain disassembling station groove 121 on the grain disassembling swing block 12, and the ceramic substrate 30 is pressed in the limiting and pressing groove 1101. As the grain disassembling swing block 12 swings downward, the ceramic substrate 30 is cracked along the scratch portion 32 to form resistor sheets 31, which is similar to the action of breaking open a thin sheet, with a small movement amplitude and a compact structure.

[0037] Specifically, the limiting and pressing groove 1101 is set on the upper side of the grain-cutting connecting seat 11, and the grain-cutting limiting blocks 112 are respectively set on both sides of the limiting and pressing groove 1101. A swinging installation position groove 1102 is set below the limiting and pressing groove 1101, and the grain-cutting swinging block 12 is installed in the swinging installation position groove 1102 through the swinging shaft 14.

[0038] Specifically, along the conveying direction of the ceramic substrate 30, one side of the disassembling station slot 121 of the disassembling swing block 12 corresponds to the limiting and pressing slot 1101, and the other side is provided with a disassembling stopper 122. A chip discharge slot 125 is formed between the disassembling stoppers 122. The chip discharge slot 125 is located at the front end of the ceramic substrate 30. As the ceramic substrate 30 is conveyed, debris generated by disassembling falls from the chip discharge slot 125 into the bottom of the device.

[0039] Optionally, the disassembling swing block 12 is provided with swing blocks 124 at both ends perpendicular to the conveying direction of the ceramic substrate 30. The swing blocks 124 are used to avoid interference with the disassembling connecting seat 11 when the disassembling swing block 12 swings downward.

[0040] like Figure 5-6 As shown, a movable mounting groove 123 is provided between the grain-stripping swing block 12 and the swing seat plate 13, and the spring accommodating movable part 151 of the grain-stripping movable block 15 cooperates with the movable mounting groove 123, and a grain-stripping reset spring station 19 is provided in the spring accommodating movable part 151 for installing the grain-stripping reset spring.

[0041] like Figure 3 、 4 As shown, the rear end of the swing seat plate 13 is provided with the pushing block cylinder 17 through the pushing block cylinder mounting block 18, and the pushing block cylinder 17 extends to push the grain-splitting movable block 15 to combine with the grain-splitting swing block 12, and after the pushing block cylinder 17 contracts, the grain-splitting return spring separates the grain-splitting movable block 15 from the grain-splitting swing block 12.

[0042] Specifically, the grain-detaching movable block 15 is provided with a grain-detaching positioning platform 152 corresponding to the grain-detaching work station slot 121, and the movable pressing block 16 is arranged on the upper part of the grain-detaching positioning platform 152. When the grain-detaching movable block 15 is combined with the grain-detaching swing block 12, the movable pressing block 16 covers the front end of the scratched part of the ceramic substrate 30 and confines it within the grain-detaching work station slot 121.

[0043] Optionally, the dismantling positioning platform 152 is respectively provided with a dismantling position sensor 114 corresponding to the dismantling station slot 121. The dismantling position sensor 114 is a proximity switch or a sensing optical fiber.

[0044] like Figure 3-5 As shown, along the conveying direction of the ceramic substrate 30, there is an extension portion between the grain demolition station groove 121 and the side of the grain demolition stop block 122. When the grain demolition movable block 15 is combined with the grain demolition swing block 12, the movable pressing block 16 covers the front end of the scratched part of the ceramic substrate 30 and confines it within the grain demolition station groove 121, and a gap is formed between the front end of the ceramic substrate 30 and the grain demolition stop block 122.

[0045] like Figure 3 、 4 As shown, the swing cylinder 110 is fixed to the lower side of the grain-cutting connecting seat 11 through a swing cylinder mounting seat 111, and a swing action arm 131 is extended from the lower side of the swing seat plate 13. The swing cylinder 110 hits the swing action arm 131, driving the grain-cutting swing block 12 to swing, so that the grain-cutting station groove 121 of the grain-cutting swing block 12 swings downward and separates from the limiting pressing groove 1101 of the grain-cutting connecting seat 11 and causes the ceramic substrate 30 to crack along the scratch portion at the grain-cutting position.

[0046] When in use, the swing cylinder 110 hits the swing arm 131 to drive the grain-cutting swing block 12 to swing, and at the same time squeezes the grain-cutting return spring. When the swing cylinder 110 contracts, the grain-cutting return spring reconnects the grain-cutting station slot 121 of the grain-cutting swing block 12 with the limiting and pressing slot 1101 of the grain-cutting connecting seat 11.

[0047] Optionally, the grain-splitting connecting seat 11 is provided with a swing adjustment screw 113 corresponding to the grain-splitting swing block 12 or the swing seat plate 13 in the swing installation station slot 1102, which is used to adjust the swing amplitude; the bottom of the swing seat plate 13 cooperates with the upper end of the swing cylinder mounting seat 111 to form the maximum swing amplitude of the grain-splitting swing block 12.

[0048] like Figure 1-4 As shown, one end of the pelletizing and compacting swing arm 116 is hinged to the swing arm mounting block 117, and the swing arm mounting block 117 is fixed to the compacting support 115. A compacting cylinder 119 is provided on the upper side of the pelletizing and compacting swing arm 116. The compacting cylinder 119 is fixed to the compacting support 115 through a compacting cylinder mounting block 1110. A compacting return spring station 1111 is provided between the compacting cylinder mounting block 1110 and the pelletizing and compacting swing arm 116 for installing a compacting return spring (not shown).

[0049] Initially, under the action of the compression reset spring, the pelletizing compression swing arm moves away from the limit compression groove of the pelletizing connecting seat. During pelletizing, the compression cylinder drives the pelletizing compression swing arm to swing downward and press the ceramic substrate to be fixed in the limit compression groove.

[0050] Optionally, the pressing support can be fixed to the table panel, the granulation connection seat or the end of the conveying device.

[0051] like Figure 1 、 2 As shown, the conveying device 20 generally includes a conveying seat plate 21, a conveying belt assembly 22 arranged on the conveying seat plate 21, and conveying limit baffles 23 arranged on both sides of the conveying direction of the conveying belt assembly 22. The end of the conveying belt assembly 22 corresponds to the granulation connection seat 11.

[0052] Initially, under the action of the grain-disassembling reset spring, the grain-disassembling station slot of the grain-disassembling swing block is connected and combined with the limiting pressing slot of the grain-disassembling connecting seat, the pushing cylinder is in a contracted state, and under the action of the grain-disassembling reset spring, the grain-disassembling movable block and the grain-disassembling swing block are in a separated state, and the movable pressing block deviates from the grain-disassembling station slot and is exposed directly above the grain-disassembling station slot.

[0053] First, the push cylinder extends and compresses the grain dismantling return spring, the grain dismantling movable block is combined with the grain dismantling swing block, and the movable pressing block covers the top of the grain dismantling station slot.

[0054] Secondly, when the ceramic substrate reaches the degranulating station slot, the movable pressing block blocks the front end of the ceramic substrate, and the front end of the ceramic substrate is restricted in the degranulating station slot. A gap is formed between the front end of the ceramic substrate and the degranulating block. After sensing that the front end of the ceramic substrate is in place, the clamping cylinder drives the degranulating clamping swing arm to fix the ceramic substrate in the limited clamping slot, triggering the swinging cylinder to hit the swinging action arm of the swinging seat plate, so that the swinging seat plate, the degranulating swing block, and the degranulating movable block swing downward along the swing axis at the same time, and the ceramic substrate cracks along the scratch part at the connection position of the degranulating station slot and the limited clamping slot to form a resistor.

[0055] Then, under the action of the grain-destroying reset spring, the grain-destroying station slot of the grain-destroying swing block and the limiting pressing slot of the grain-destroying connecting seat are restored to communication, the pushing cylinder contracts, and the grain-destroying movable block is separated from the grain-destroying swing block under the action of the grain-destroying reset spring again. The movable pressing block deviates from the grain-destroying station slot, exposing the resistor piece on the grain-destroying station slot, which is convenient for subsequent unloading and transfer of the resistor piece.

[0056] Finally, after the resistor is unloaded, the pressing cylinder is reset and the next splitting and degranulating operation is carried out. Due to the gap between the front end of the ceramic substrate and the degranulating block, the split resistor will not be stuck in the degranulating station slot, and the chip removal slot facilitates the falling of debris.

[0057] The automatic chipping and granulation device of the embodiment of the present invention cooperates with the chipping swing block and the chipping connecting seat, and adopts the breaking form to perform chipping. It has a compact structure and a small movement amplitude, which overcomes the defect that the double-roller chipping occupies a large space, and at the same time overcomes the defect that the chipping in the punching method easily breaks the ceramic substrate; through the combination or separation between the chipping movable block, the movable pressure block and the chipping swing block, the ceramic substrate can be fixed during chipping and the resistor can be positioned in the chipping station slot after the chipping is completed and reset, thereby facilitating subsequent automatic unloading.

[0058] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An automatic splitting and granulating device, characterized in that: The cam is provided with a movable block for demolding, and the movable block is connected to the movable block by a movable support. Initially, under the action of the grain-demolition return spring, the grain-demolition station slot is connected and combined with the limiting and pressing slot, and the movable pressing block deviates from the grain-demolition station slot and is exposed just above the grain-demolition station slot; Then, the pushing cylinder extends out and compresses the dismantling return spring, the dismantling movable block is combined with the dismantling swing block, and the movable pressing block covers the top of the dismantling station slot; Secondly, when the ceramic substrate reaches the degranulating station slot, the movable pressing block blocks the front end of the ceramic substrate, and the front end of the ceramic substrate is restricted in the degranulating station slot; after sensing that the front end of the ceramic substrate is in place, the degranulating pressing swing arm fixes the ceramic substrate in the limited pressing slot, triggering the swing cylinder to hit the swing action arm of the swing seat plate and squeeze the degranulating return spring, so that the swing seat plate, the degranulating swing block, and the degranulating movable block swing downward along the swing axis at the same time, and the ceramic substrate is split along the scratch part at the connecting position of the degranulating station slot and the limited pressing slot to form a resistor; then after the swing cylinder contracts instantly, the degranulating return spring re-connects the degranulating station slot with the limited pressing slot; Finally, the push block cylinder contracts so that the pelletizing movable block is separated from the pelletizing swing block under the action of the pelletizing reset spring again, and the movable pressing block deviates from the pelletizing station slot, exposing the resistor piece on the pelletizing station slot.

2. The automatic fragmentation and granulation device according to claim 1, characterized in that: Granulation limiting blocks are respectively provided on both sides of the limiting and pressing groove, a swing installation station groove is provided below the limiting and pressing groove, and the granulation swing block is installed in the swing installation station groove through the swing shaft.

3. The automatic fragmentation and granulation device according to claim 1, characterized in that: Along the conveying direction of the ceramic substrate, one side of the particle disassembling station groove of the particle disassembling swing block corresponds to the limiting and pressing groove, and two particle disassembling blocks are symmetrically arranged on the other side, forming a chip removal groove between the particle disassembling blocks.

4. The automatic fragmentation and granulation device according to claim 1, characterized in that: A movable mounting groove is provided between the grain-stripping swing block and the swing seat plate, the spring accommodating movable part of the grain-stripping movable block cooperates with the movable mounting groove, and a grain-stripping reset spring station is provided in the spring accommodating movable part for installing the grain-stripping reset spring.

5. The automatic fragmentation and granulation device according to claim 1, characterized in that: The pushing block cylinder is set at the rear end of the swing seat plate through the pushing block cylinder mounting block. The pushing block cylinder extends to push the pelletizing movable block to combine with the pelletizing swing block. After the pushing block cylinder contracts, the pelletizing return spring separates the pelletizing movable block from the pelletizing swing block.

6. The automatic fragmentation and granulation device according to claim 3, characterized in that: The particle demolition movable block is provided with a particle demolition positioning platform corresponding to the particle demolition work station slot, and the movable pressing block is provided on the upper part of the particle demolition positioning platform. When the particle demolition movable block is combined with the particle demolition swing block, the movable pressing block limits the front end of the ceramic substrate between the particle demolition work station slot and the particle demolition positioning platform.

7. The automatic fragmentation and granulation device according to claim 6, characterized in that: The degranulating positioning platform is provided with a degranulating position sensor corresponding to the degranulating station slot.

8. The automatic fragmentation and granulation device according to claim 6, characterized in that: Along the conveying direction of the ceramic substrate, there is an extension portion between the particle demolition station groove and the side of the particle demolition stop block. When the particle demolition movable block is combined with the particle demolition swing block, the movable pressure block limits the front end of the ceramic substrate between the particle demolition station groove and the particle demolition positioning platform, and a gap is formed between the front end of the ceramic substrate and the particle demolition stop block.

9. The automatic fragmentation and granulation device according to claim 1, characterized in that: The oscillating cylinder is fixed to the lower side of the grain-stripping connecting seat through a oscillating cylinder mounting seat, and a oscillating action arm is extended from the lower side of the oscillating seat plate. The oscillating cylinder hits the oscillating action arm to drive the grain-stripping oscillating block to swing downward, so that the grain-stripping station groove of the grain-stripping oscillating block is separated from the limiting pressing groove of the grain-stripping connecting seat and the ceramic substrate is cracked along the scratch portion at the separation position.

10. The automatic fragmentation and granulation device according to claim 1, characterized in that: One end of the grain-demolition compacting swing arm is hinged on the swing arm mounting block, and the swing arm mounting block is fixed on the compacting support. A compacting cylinder is provided on the upper side of the grain-demolition compacting swing arm, and the compacting cylinder is fixed to the compacting support through a compacting cylinder mounting block. A compacting return spring station is provided between the compacting cylinder mounting block and the grain-demolition compacting swing arm for installing a compacting return spring.

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