Liners and semiconductor processing chambers

Abstract

The present invention provides a liner, comprising a liner body and at least one grounding structure disposed on the liner body. The grounding structure comprises a grounding body, a connecting portion, and a grounding portion. The grounding body is strip-shaped and spaced apart from the lower end of the liner body. The grounding body is provided with a connecting portion at at least one end thereof in its extension direction, the connecting portion being connected to and electrically connected to the lower end of the liner body. The grounding portion and the connecting portion are spaced apart along the extension direction of the grounding body. During use, the grounding portion is fixedly connected to and electrically connected to a grounding member. The present invention also provides a semiconductor processing chamber.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a liner and a semiconductor processing chamber. Background Art

[0002] With the advancement of semiconductor processing technology, a variety of semiconductor processing equipment has been widely used in semiconductor manufacturing. Plasma etching or deposition, as a key step in the semiconductor manufacturing process, has become ubiquitous in major semiconductor production lines. The working principle of plasma etching or deposition is to introduce a process gas into a vacuum chamber and dissociate, excite, or ionize it through electrical or optical excitation. The ionized free radicals or ions diffuse freely or are accelerated by a field to the wafer surface, where they interact with the wafer material, causing the corresponding etching and deposition.

[0003] To ensure a smooth airflow and protect the inner walls of semiconductor processing chambers from direct plasma bombardment, liners are typically installed on the sidewalls. These liners limit and shield the distribution of plasma and are crucial to process parameters. The grounding performance of the liner directly impacts the stability of the RF circuit, which in turn plays a decisive role in plasma stability.

[0004] The liner in the prior art usually has problems such as poor contact at the lower end and discontinuous RF circuit due to the use of a split liner. This not only causes instability and discontinuity of the RF circuit, but also requires a high maintenance frequency. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a liner and a semiconductor processing chamber, which can solve the problems in the prior art such as poor contact at the lower end of the liner and discontinuity of the RF circuit due to the use of a split liner.

[0006] To achieve the purpose of the present invention, a liner is provided, comprising a liner body and at least one grounding structure provided on the liner body, wherein the grounding structure comprises a grounding body, a connecting portion, and a grounding portion, wherein the grounding body is strip-shaped and spaced apart from the lower end of the liner body, and the connecting portion is provided at least at one end of the grounding body in its extension direction, and the connecting portion is connected to the lower end of the liner body and is electrically conductive;

[0007] The grounding portion and the connecting portion are spaced apart along the extending direction of the grounding body; the grounding portion is used to be fixedly connected to the grounding piece and electrically conductive when in use.

[0008] In some embodiments, the grounding body is provided with the connecting portion at both ends in its extending direction; and the grounding portion is located between the two ends of the grounding body.

[0009] In some embodiments, the grounding body is provided with the connecting portion at one end in the extending direction thereof, and the grounding body is provided with the grounding portion at the other end in the extending direction thereof.

[0010] In some embodiments, the connecting portion is integrally connected to the lining body or is hinged; and / or,

[0011] The connecting portion is integrally connected to the grounding body or is hinged.

[0012] In some embodiments, an extending direction of the grounding body is parallel to a circumferential direction of the lining body.

[0013] In some embodiments, a flange base is provided at the lower end of the lining body, the flange base is annular and protrudes toward the axis of the lining body relative to the inner circumference of the lining body;

[0014] The flange base has a boss formed on one inner circumference side, the grounding body is spaced apart from the lower surface of the boss, is located on the inner side of the inner circumference of the flange base, and is spaced apart from the inner circumference of the flange base; the connecting portion is connected to the lower surface of the boss and is electrically conductive.

[0015] In some embodiments, the connecting portion is a first protrusion formed on the lower surface of the boss, and at least one end of the grounding body is integrally connected to a side surface of the first protrusion.

[0016] In some embodiments, the grounding portion is a second protrusion formed on the lower surface of the grounding body, and the lower surface of the second protrusion is used to electrically contact the grounding member.

[0017] In some embodiments, the grounding body and the second protrusion are correspondingly provided with through holes penetrating in the vertical direction;

[0018] The grounding structure further includes a fastener, which is used to penetrate the through hole when in use and fix the grounding body and the second protrusion to the grounding member.

[0019] In some embodiments, the liner further comprises a conductive ring, which is disposed below the liner body and is used to be fixedly connected to the grounding member and electrically conductive when in use;

[0020] The conductive ring is used to support the second protrusion, and a threaded hole is provided on the upper surface of the conductive ring. The threaded hole is provided corresponding to the through hole, and the fastener is threadedly connected to the threaded hole.

[0021] In some embodiments, at least one electromagnetic coil is disposed between the upper surface of the conductive ring and the lower surface of the second protrusion.

[0022] In some embodiments, the grounding structure is multiple and spaced apart along the circumference of the liner body.

[0023] As another technical solution, the present invention further provides a semiconductor processing chamber, comprising a chamber body and a chuck disposed in the chamber body, the chuck being used to carry a wafer; and further comprising the above-mentioned liner provided by the present invention, the liner body being disposed around the inner side of the chamber body, and the upper end of the liner body being connected to the chamber body and electrically conductive;

[0024] The chuck is provided with the grounding member.

[0025] The present invention has the following beneficial effects:

[0026] The lining provided by the present invention has an lining body that adopts an integral structure without a disconnected surface in the middle, thereby ensuring that there is no potential difference between the upper and lower ends of the lining body during use, thereby ensuring that the voltage on the lining body is evenly distributed, thereby avoiding the problem of discontinuity in the RF loop. On this basis, at least one grounding structure is provided on the lining body, in which the grounding body is in a strip shape and is spaced apart from the lower end of the lining body, and the grounding body is provided with a connecting portion at at least one end in its extension direction, which is connected to the lower end of the lining body; the grounding portion and the connecting portion are spaced apart along the extension direction of the grounding body; the grounding portion is used to be fixedly connected to the grounding piece when in use, and is electrically conductive. The lining body can be electrically conductive with the grounding piece through the connecting portion, the grounding body and the grounding portion in sequence, thereby achieving grounding of the lining body. Moreover, by making the grounding body in a strip shape, and the grounding part and the connecting part are spaced apart along the extension direction of the grounding body, when the lining body expands due to heat or contracts due to cold, the connecting part will expand and contract along the axial direction of the lining body with the lining body, while the grounding part is fixed due to its fixed connection with the grounding piece. In this case, the strip-shaped grounding body can produce elastic deformation to release the deformation internal stress brought by the lining body, avoiding its damage due to frequent deformation, and at the same time ensuring that the connecting part remains connected to the lining body, and the grounding part remains connected to the grounding piece, thereby ensuring that the lining is always fully grounded during the temperature alternation process, improving the connection reliability and safety, ensuring the grounding performance of the lining, and having a longer service life, and is less likely to have poor contact, thereby reducing the frequency of lining maintenance.

[0027] The semiconductor processing chamber provided by the present invention, by adopting the above-mentioned lining provided by the present invention, can not only avoid the problem of discontinuity of the RF circuit, but also avoid its damage due to frequent deformation. At the same time, it ensures that the lining is always fully grounded during the temperature alternation process, improves the connection reliability and safety, ensures the grounding performance of the lining, and has a longer service life, is less likely to have poor contact, and can thereby reduce the frequency of lining maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a diagram of the lining structure of related art 1;

[0029] Figure 2 A structural diagram of a flexible connector according to related art 1;

[0030] Figure 3 A partial structural diagram of a liner according to related art 2 installed in a semiconductor processing chamber;

[0031] Figure 4 A schematic cross-sectional view of a semiconductor processing chamber provided by an embodiment of the present invention;

[0032] Figure 5 A partial structural diagram of a lining provided by an embodiment of the present invention at one viewing angle;

[0033] Figure 6 A partial cross-sectional view of a liner provided in an embodiment of the present invention;

[0034] Figure 7 A partial structural diagram of the lining provided by an embodiment of the present invention from another perspective;

[0035] Figure 8 A partial cross-sectional view of the liner at the grounding structure provided by an embodiment of the present invention;

[0036] Figure 9 A schematic diagram of a grounding structure used in an embodiment of the present invention;

[0037] Figure 10 A schematic diagram of another grounding structure used in an embodiment of the present invention;

[0038] Figure 11 A structural diagram of a conductive ring used in an embodiment of the present invention;

[0039] Figure 12 for Figure 11 Magnified view of region I in the middle. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solution of the present invention, the liner and semiconductor processing chamber provided by the present invention are described in detail below with reference to the accompanying drawings.

[0041] In the related art 1, in order to realize the grounding of the lower end of the liner, as shown in FIG. Figure 1 As shown, a plurality of flexible connectors 02 are provided at the lower end of the liner 01, and the plurality of flexible connectors 02 are evenly distributed along the circumference of the liner 01, as shown in FIG. Figure 2 As shown, each flexible connector 02 includes an upper connector 021, a lower connector 022, and a curved structure 023 connected therebetween, wherein the upper contact surface 021a of the upper connector 021 is connected to the lower end of the liner and is in electrical contact; the side contact surface 022a of the lower connector 022 is connected to the side of the grounding member (e.g., the interface plate of the chuck) and is in electrical contact. The upper connector 021 and the lower connector 022 are electrically connected through the curved structure 023, which includes two curved metal sheets arranged opposite to each other in the horizontal direction, with the middle portion of each metal sheet protruding in a direction away from the other metal sheet relative to the upper and lower edge portions. The flexible connector 02 can achieve a flexible connection between the liner 01 and the grounding member 02. However, when the curved structure 023 is energized, eddy currents will be generated due to bending, thereby generating an induced magnetic field, affecting the stability of the lower electrode loop. Moreover, if the metal sheet is exposed to a high temperature environment (for example, around 120°C) for a long time, it is easy to age and lose its elasticity, which not only affects the service life of the flexible connector 02, but also easily leads to poor contact, resulting in a high frequency of lining maintenance and difficult to troubleshoot problems.

[0042] In the related art 2, in order to realize the grounding of both the upper and lower ends of the lining, as shown in FIG. Figure 3 As shown, the liner 04 includes an upper liner 041 and a lower liner 042. The upper end 041a of the upper liner 041 is connected to the chamber wall 06 and is electrically conductive. The lower end 042b of the lower liner 042 is connected to the grounding member (e.g., the interface plate 051 of the chuck 05) and is electrically conductive. A disconnected opening is formed between the lower end 041b of the upper liner 041 and the upper end 042a of the lower liner 042. Although it is possible to ground both the upper and lower ends of the liner 04, the second related art uses a split liner, which results in a discontinuous RF circuit, thereby affecting the stability of the RF circuit and, in turn, the stability of the plasma.

[0043] In order to solve the problem of the above-mentioned related technology 2, in this embodiment, the lining body adopts an integral structure with no disconnected surface in the middle, so as to ensure that there is no potential difference between the upper and lower ends of the lining body during use, so that the voltage on the lining body can be evenly distributed, thereby avoiding the problem of discontinuity of the RF circuit.

[0044] To solve the problem of the above-mentioned related technology, please refer to Figure 4An embodiment of the present invention provides a liner 200, comprising a liner body 210 and at least one grounding structure 220 disposed on the liner body 210. The grounding structure 220 is configured to ground the lower end of the liner body 210. In some embodiments, to improve the uniformity of voltage distribution within the liner body 210, a plurality of grounding structures 220 are provided, spaced apart along the circumference of the liner body 210.

[0045] Specifically, the liner body 210 is annular and, when in use, is positioned inside the sidewalls of the chamber body 101 of the semiconductor processing chamber 100. It serves to limit and shield the distribution of plasma, protecting the inner walls of the chamber body 101 of the semiconductor processing chamber 100 from direct plasma bombardment. In this embodiment, the liner body 210 utilizes a monolithic structure with no intermediate discontinuities. This ensures that there is no potential difference between the upper and lower ends of the liner body 210 during use, thereby ensuring a uniform voltage distribution across the liner body 210 and avoiding issues with discontinuous RF circuits.

[0046] In some embodiments, to ensure that there is no potential difference between the upper and lower ends of the liner body 210, during use, the upper end of the liner body 210 is grounded, for example, via the sidewall of the chamber body 101 of the semiconductor processing chamber 100, while the lower end of the liner body 210 is grounded via at least one grounding structure 220. The upper end of the liner body 210 is connected to the sidewall of the chamber body 101 of the semiconductor processing chamber 100, and the electrical connection is achieved, for example, by providing an annular flange 211 protruding from the outer circumference of the liner body 210 at the upper end of the liner body 210. The annular flange 211 overlaps the upper end surface of the sidewall of the chamber body 101 during use, and the annular flange 211 is fixedly connected to the sidewall of the chamber body 101 via fasteners (not shown). The sidewall of the semiconductor processing chamber 100 is grounded, thereby achieving grounding of the upper end of the liner body 210. Furthermore, in some embodiments, a receiving groove (not shown) is provided on the lower surface of the annular flange 211 or the upper end surface of the side wall of the chamber body 101. A dielectric coil (not shown) is installed in the receiving groove. The dielectric coil is used to strengthen the electrical contact between the lower surface of the annular flange 211 and the upper end surface of the side wall of the chamber body 101. The dielectric coil includes, for example, an elastic spiral tube. In addition, a sealing ring (not shown) is provided between the lower surface of the annular flange 211 and the upper end surface of the side wall of the chamber body 101 to seal the gap therebetween to achieve the sealing of the semiconductor processing chamber 100. When the interior of the chamber body 101 switches between the atmospheric state and the vacuum state, the sealing ring will deform. This deformation will directly act on the liner body 210 and be absorbed by the liner body 210.

[0047] It should be noted that, in actual applications, according to specific needs, the upper end of the lining body 210 may not be provided with a structure for connecting to the side wall of the chamber body 101 of the semiconductor processing chamber 100, that is, the upper end of the lining body 210 is grounded through other components when in use, or is not grounded, and the embodiment of the present invention has no limitation on this.

[0048] Please also refer to Figures 5 to 8 The grounding structure 220 includes a grounding body 221, a connecting portion 222, and a grounding portion 223, wherein the grounding body 221 is strip-shaped and is spaced apart from the lower end of the lining body 210. In some embodiments, the strip-shaped grounding body 221 can extend in a straight line direction, which is, for example, parallel to the tangent direction of the circumference of the lining body 210; or Figures 5 to 8 As shown, it can also extend along an arc direction, which is, for example, parallel to the circumferential direction of the lining body 210. The straight line direction and the arc direction can be parallel to the horizontal plane, or form a certain angle with the horizontal plane.

[0049] It should be noted that the strip-shaped grounding body 221 means that the dimension of the grounding body 221 in the extension direction is significantly larger than the cross-sectional dimension of the grounding body 221 perpendicular to the extension direction. In some embodiments, the cross-sectional shape of the grounding body 221 perpendicular to the extension direction includes a rectangle or a square, and the dimension of the strip-shaped grounding body 221 in the extension direction is significantly larger than the side length of the rectangle or square. Alternatively, the cross-sectional shape of the grounding body 221 perpendicular to the extension direction may also include a circle or an ellipse, and the dimension of the strip-shaped grounding body 221 in the extension direction is significantly larger than the diameter of the circle or the major and minor axes of the ellipse. In a specific example, the cross-sectional shape of the grounding body 221 perpendicular to the extension direction is a rectangle, and the width of the rectangle is parallel to the axial direction of the lining body 210. This facilitates the grounding body 221 to more easily undergo elastic deformation in the axial direction of the lining body 210.

[0050] The grounding body 221 is provided with a connecting portion 222 at least at one end thereof in its extending direction, and the connecting portion 222 is connected to the lower end of the lining body 210 and is electrically conductive. In an embodiment in which the grounding structure 220 is provided with multiple Figure 5 and Figure 6 As shown, the adjacent ends of each two adjacent grounding structures 220 may share a connecting portion 222 . In other words, the connecting portions 222 provided at the adjacent ends of each two adjacent grounding structures 220 are connected as one body.

[0051] The grounding portion 223 and the connecting portion 222 are spaced apart along the extending direction of the grounding body 221; the grounding portion 223 is used to connect with the grounding member 102 (eg Figure 4The grounding plate 102 of the chuck shown is fixedly connected and electrically conductive. In this way, the lining body 210 can be electrically conductive with the grounding member 102 through the connecting portion 222, the grounding body 221 and the grounding portion 223 in sequence, thereby achieving grounding of the lining body 210. Moreover, by making the grounding body 221 strip-shaped, and the grounding portion 223 and the connecting portion 222 spaced apart along the extension direction of the grounding body 221, when the lining body 210 expands due to heat or contracts due to cold, the connecting portion 222 will expand and contract along the axial direction of the lining body 210 along with the lining body 210, while the grounding portion 223 is fixed due to its fixed connection with the grounding piece 102. In this case, the strip-shaped grounding body 221 can produce elastic deformation to release the deformation internal stress brought by the lining body 210, avoiding its frequent deformation and damage, while ensuring that the connecting portion 222 remains connected to the lining body 210, and the grounding portion 223 remains connected to the grounding piece 102, thereby ensuring that the lining 200 is always fully grounded during the temperature alternation process, improving the connection reliability and safety, and ensuring the grounding performance of the lining 200.

[0052] Compared to the first prior art, the strip-shaped grounding body 221 employed in this embodiment of the present invention does not generate eddy currents when energized, thereby preventing the stability of the lower electrode circuit. Furthermore, while ensuring elastic deformation, the strip-shaped grounding body 221 is thicker than sheet metal and is less susceptible to aging in high-temperature environments, resulting in a longer service life and less prone to poor contact, thereby reducing the maintenance frequency of the liner 200.

[0053] The liner 200 provided in this embodiment of the present invention adopts a monolithic structure with no intermediate discontinuities. This ensures that there is no potential difference between the upper and lower ends of the liner body 210 during use, resulting in a uniform voltage distribution across the liner body 210 and avoiding issues with discontinuities in the RF circuit. Furthermore, this ensures that the liner 200 remains fully grounded during temperature fluctuations, improving connection reliability and safety, ensuring the grounding performance of the liner 200, and extending its service life. This reduces the risk of poor contact and reduces the need for maintenance.

[0054] In some embodiments, the grounding body 221 is provided with connecting portions 222 at both ends of the grounding body 221 in its extension direction; the grounding portion 223 is located between the two ends of the grounding body 221. In this way, the strip-shaped grounding body 221 and the connecting portions 222 at both ends constitute a suspended bridge structure as a whole. Figure 9 As shown, when the lining body 210 is in the initial state, the two ends of the grounding body 221 respectively connected to the two connecting parts 222 and the position connected to the grounding part 223 (for example, the middle position) are located at the same height position in the horizontal direction, that is, each position of the grounding body 221 in its extension direction is located at the same height position in the horizontal direction.

[0055] When the lining body 210 is heated and expanded (i.e. in a thermal expansion state), Figure 9 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will expand and deform downward, driving the connecting parts 222 at both ends of the grounding body 221 to move downward. At the same time, the grounding part 223 is fixed due to its fixed connection with the grounding piece 102, and the position where the grounding body 221 is connected to the grounding part 223 remains unchanged. At this time, the two ends of the grounding body 221 move downward relative to the position where they are connected to the grounding part 223, so that the grounding body 221 will produce an elastic deformation of bending upward relative to the two ends at the position where it is connected to the grounding part 223, so as to release the deformation internal stress brought by the lining body 210.

[0056] When the lining body 210 is cold-shrinked (i.e., in a cold-shrink state), Figure 9 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will shrink and deform upward, driving the connecting parts 222 at both ends of the grounding body 221 to move upward. At the same time, the grounding part 223 is fixed due to its fixed connection with the grounding piece 102, and the position where the grounding body 221 is connected to the grounding part 223 remains unchanged. At this time, the two ends of the grounding body 221 move upward relative to the position where they are connected to the grounding part 223, so that the grounding body 221 will produce an elastic deformation of bending downward relative to the two ends at the position where it is connected to the grounding part 223, so as to release the deformation internal stress brought by the lining body 210.

[0057] Furthermore, in some embodiments, the grounding portion 223 is located in the middle position between the two ends of the grounding body 221, that is, the distance between the grounding portion 223 and the two ends of the grounding body 221 is the same, so that the grounding body 221 can form a symmetrical structure, ensuring that the grounding body 221 is evenly stressed, thereby further improving the service life of the grounding body 221.

[0058] In other embodiments, the grounding body 221 is provided with a connecting portion 222 at one end thereof in the extending direction, and a grounding portion 223 at the other end thereof in the extending direction. In this way, the end of the grounding body 221 connected to the grounding portion 223 is a stationary end, and the other end connected to the connecting portion 222 is a moving end. Figure 10 As shown, when the lining body 210 is in the initial state, the movable end of the grounding body 221 connected to the connecting part 222 and the stationary end connected to the grounding part 223 are located at the same height position in the horizontal direction, that is, each position of the grounding body 221 in its extension direction is located at the same height position in the horizontal direction.

[0059] When the lining body 210 is heated and expanded (i.e. in a thermal expansion state), Figure 10 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will expand and deform downward, driving the connecting portion 222 to move downward. At the same time, the grounding portion 223 is fixed due to its fixed connection with the grounding piece 102, and the moving end of the grounding body 221 connected to the connecting portion 222 moves downward, and the stationary end of the grounding body 221 connected to the grounding portion 223 maintains its original position, so that the stationary end of the grounding body 221 connected to the grounding portion 223 will produce an elastic deformation of bending upward relative to the moving end to release the deformation internal stress brought by the lining body 210.

[0060] When the lining body 210 is cold-shrinked (i.e., in a cold-shrink state), Figure 10 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will shrink and deform upward, driving the connecting part 222 to move upward. At the same time, the grounding part 223 is fixed due to its fixed connection with the grounding piece 102, and the movable end of the grounding body 221 connected to the connecting part 222 moves upward, and the stationary end of the grounding body 221 connected to the grounding part 223 maintains its original position, so that the stationary end of the grounding body 221 connected to the grounding part 223 will produce an elastic deformation of bending downward relative to the movable end to release the deformation internal stress brought by the lining body 210.

[0061] From the above, it can be seen that when the lining body 210 expands due to heat or contracts due to cold, the strip-shaped grounding body 221 can produce elastic deformation to release the deformation internal stress brought by the lining body 210, avoiding its frequent deformation and damage, while ensuring that the connecting part 222 remains connected to the lining body 210, and the grounding part 223 remains connected to the grounding part 102, thereby ensuring that the lining 200 is always fully grounded during the temperature alternation process, improving the connection reliability and safety, and ensuring the grounding performance of the lining 200.

[0062] The connection portion 222 can be connected to the lining body 210 in a variety of ways. In some embodiments, the connection portion 222 is integrally connected to the lining body 210, that is, the connection portion 222 is a part of the lining body 210. This not only improves the stability and reliability of the connection between the connection portion 222 and the lining body 210, but also makes processing more convenient. In other embodiments, the connection portion 222 is hinged to the lining body 210. In this way, when the lining body 210 expands due to heat or contracts due to cold, the connection portion 222 can move with the lining body 210 while being able to rotate relative to the lining body 210, thereby further improving the stability and reliability of the connection between the connection portion 222 and the lining body 210.

[0063] There are many ways to connect the connecting portion 222 to the grounding body 221. In some embodiments, the connecting portion 222 and the grounding body 221 are connected as one piece. This not only improves the stability and reliability of the connection between the connecting portion 222 and the grounding body 221, but also makes processing more convenient. Preferably, the connecting portion 222 and the grounding body 221 are connected as one piece, and the connecting portion 222 and the lining body 210 are connected as one piece. In this way, the connecting portion 222 and the grounding body 221 are both part of the lining body 210, which makes processing more convenient. In other embodiments, the connecting portion 222 and the grounding body 221 are hinged. In this way, when the lining body 210 expands due to heat or contracts due to cold, the connecting portion 222 can rotate relative to the grounding body 221 while moving with the lining body 210, thereby further improving the stability and reliability of the connection between the connecting portion 222 and the lining body 210.

[0064] In some embodiments, in order to further improve the connection stability and reliability between the grounding structure 220 and the lining body 210, a flange base 230 is provided at the lower end of the lining body 210. The flange base 230 is annular and protrudes toward the axis of the lining body 210 relative to the inner circumference of the lining body 210; the flange base 230 is formed with a boss 231 on one side of the inner circumference, and the grounding body 221 is spaced apart from the lower surface of the boss 231 and is located on the inner side of the inner circumference of the flange base 230 and is spaced apart from the inner circumference of the flange base 230; Figures 6 to 8 As shown, there is a first gap A between the grounding body 221 and the boss 231, and a second gap B between the grounding body 221 and the inner circumference of the flange base 230. The first gap A and the second gap B are used to provide space for the elastic deformation of the grounding body 221, and at the same time make the grounding body 221 in an independent suspended bridge state to prevent other components from hindering the elastic deformation of the grounding body 221.

[0065] The connecting portion 222 is connected to the lower surface of the boss 231 and is electrically conductive. The flange base 230 provides a mounting base for at least one grounding structure 220. The boss 231 is used to connect to the connecting portion 222. The boss 231 increases the radial dimension of the lower end of the liner body 210, thereby facilitating the processing and installation of the grounding structure 220. It can also increase the strength of the lower end of the liner body 210, further improving the stability and reliability of the connection between the liner body 210 and the grounding structure 220. Furthermore, in some embodiments, the flange base 230, the boss 231, and the liner body 210 are all integrally formed.

[0066] In some embodiments, the connecting portion 222 is a first protrusion formed on the lower surface of the boss 231, and at least one end of the grounding body 221 along its extension direction is integrally connected to the side surface of the first protrusion. In other words, the connecting portion 222 and the boss 231 are integrally formed, and the grounding body 221 and the first protrusion are integrally formed. This not only improves the stability and reliability of the connection between the connecting portion 222 and the grounding body 221, but also facilitates processing, thereby simplifying the structure and reducing costs.

[0067] In some embodiments, the grounding portion 223 is a second protrusion formed on the lower surface of the grounding body 221. The lower surface of the second protrusion is configured to electrically contact the grounding member 102. Specifically, the grounding portion 223 and the grounding body 221 are integrally formed. This not only improves the stability and reliability of the connection between the grounding portion 223 and the grounding body 221, but also facilitates processing, thereby simplifying the structure and reducing costs. Furthermore, in some embodiments, the lower surface of the second protrusion is nickel-plated to form a conductive layer that enhances electrical conductivity.

[0068] In a specific example, the flange base 230, the boss 231, the lining body 210, the first protrusion (i.e., the connecting portion 222) and the second protrusion (i.e., the grounding portion 223) are all integrally formed. In this way, the above-mentioned grounding structure 220 and the lining body 210 are an integral component, and the lower end of the lining 200 can be grounded without the need to set up other components, thereby improving the grounding stability and reliability of the lining 200. Moreover, the processing is convenient, and the specific processing method is, for example: before processing, the flange base 230 is a ring body protruding relative to the inner circumference of the lining body 210, and a feed edge 231b is set on the upper surface of the ring body, and the depth of the feed edge 231b in the vertical direction is less than the thickness of the flange base 230 in the vertical direction (for example, about 10 mm), and one end of the feed edge 231b in the radial direction of the flange base 230 is located on the inner circumference of the flange base 230, and the depth of the feed edge 231b in the radial direction of the flange base 230 is less than the width of the flange base 230 in its radial direction; then, a tool with a rectangular cross-section of 2mm×5mm is used to cut off the flange base 230 through the feed edge 231b and rotate 20° along the circumference of the flange base 230. The grooves formed after cutting constitute the above-mentioned first interval A and second interval B. Next, a milling cutter with a preset profile is used to remove a predetermined thickness (e.g., 4 mm) from the lower surface of the flange base 230. The remaining portion of the lower surface of the flange base 230 forms the second protrusion (i.e., the grounding portion 223). The portion of the flange base 230 located below the first interval A and inside the second interval B is the grounding body 221. The portion of the flange base 230 located above the first interval A and the second interval B is the boss 231. The portion of the flange base 230 located between two adjacent first intervals A is the connecting portion 222.

[0069] In some embodiments, as Figure 6 As shown, the grounding body 221 and the second protrusion (ie, the grounding portion 223) are correspondingly provided with a through hole 223a penetrating in the vertical direction; Figure 7 and Figure 8 As shown, the grounding structure 220 further includes a fastener 240, which is used to penetrate the through hole 223a when in use and securely connect the grounding body 221 and the second protrusion (i.e., the grounding portion 223) to the grounding member 102. The fastener 240 can secure the grounding body 221, the second protrusion (i.e., the grounding portion 223), and the grounding member 102 together. The fastener 240 is, for example, a fastening screw.

[0070] Furthermore, in some embodiments, Figure 7 and Figure 8 As shown, in order to facilitate the connection between the grounding structure 220 and the grounding member 102, the liner 200 also includes a conductive ring 250, which is arranged below the liner body 210. In an embodiment in which a flange base 230 is provided, in order to meet the deformation of the grounding body 221, the lower surface of the flange base 230 (i.e., the lower surface of the connecting portion 222) and the upper surface of the conductive ring 250 are spaced apart, and the spacing is, for example, about 4 mm.

[0071] The conductive ring 250 is used to be fixedly connected to the grounding member 102 and electrically conductive when in use; the grounding member 102 is, for example, a chuck for carrying a wafer disposed in the semiconductor processing chamber 100. Figure 11 and Figure 12 As shown, the conductive ring 250 is used to support the second protrusion (i.e., the grounding portion 223), and the upper surface of the conductive ring 250 is provided with a threaded hole 252. The threaded hole 252 is arranged corresponding to the through hole 223a, and the fastener 240 is threadedly connected to the threaded hole 252. The fastener 240 can fix the grounding body 221, the second protrusion (i.e., the grounding portion 223), and the conductive ring 250 together. Because the conductive ring 250 is fixed to the grounding member 102, the grounding body 221 and the second protrusion (i.e., the grounding portion 223) can be fixedly connected to the grounding member 102 through the conductive ring 250. The grounding member 102 is, for example, an interface plate of a chuck. In this case, the conductive ring 250 is provided at the edge area of ​​the upper surface of the interface plate. However, the embodiments of the present invention are not limited to this. In actual applications, the conductive ring 250 can also be applied to the case where the grounding member 102 is arranged in other components in the semiconductor processing chamber 100, or the conductive ring 250 can be omitted, and the second protrusion (i.e., the grounding portion 223) can be directly electrically contacted with the grounding member 102.

[0072] In some embodiments, in order to enhance the contact effect between the upper surface of the conductive ring 250 and the lower surface of the second protrusion (ie, the grounding portion 223), as shown in FIG. Figure 11 and Figure 12 As shown, at least one induction coil 251 is provided between the upper surface of the conductive ring 250 and the lower surface of the second protrusion (ie, the grounding portion 223 ). Specifically, for example, at least one induction coil 251 is provided on the upper surface of the conductive ring 250 .

[0073] In some embodiments, to improve the uniformity of voltage distribution in the liner body 210, a plurality of grounding structures 220 are provided, and the grounding structures 220 are spaced apart along the circumference of the liner body 210. In an embodiment where the liner 200 includes a conductive ring 250, the conductive ring 250 is used to support the second protrusions (i.e., the grounding portions 223) of the plurality of grounding structures 220, thereby facilitating the connection between the plurality of grounding structures 220 and the grounding member 102.

[0074] As another technical solution, Figure 1 As shown, an embodiment of the present invention further provides a semiconductor processing chamber 100, comprising a chamber body 101 and a chuck (not shown in the figure) arranged in the chamber body 101, the chuck being used to carry a wafer; and further comprising the above-mentioned lining 200 provided in an embodiment of the present invention, the lining body 210 being arranged around the inner side of the chamber body 101, and the upper end of the lining body 210 being connected to the chamber body 101 and electrically conductive; the chuck is provided with a grounding piece 102.

[0075] The grounding member 102 is, for example, an interface plate of a chuck.

[0076] The semiconductor processing chamber 100 provided by the embodiment of the present invention, by adopting the above-mentioned liner 200 provided by the embodiment of the present invention, can not only avoid the problem of discontinuity of the RF circuit, but also avoid its damage due to frequent deformation. At the same time, it ensures that the liner 200 is always fully grounded during the temperature alternation process, improves the connection reliability and safety, ensures the grounding performance of the liner 200, and has a longer service life, is less likely to have poor contact, and can thereby reduce the maintenance frequency of the liner 200.

[0077] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A lining, characterized in that: The invention comprises a lining body and at least one grounding structure provided on the lining body, wherein the grounding structure comprises a grounding body, a connecting portion and a grounding portion, wherein the grounding body is strip-shaped and spaced apart from the lower end of the lining body, and the connecting portion is provided at least at one end of the grounding body in its extension direction, and the connecting portion is connected to the lower end of the lining body and is electrically conductive; The grounding portion and the connecting portion are spaced apart along the extending direction of the grounding body; the grounding portion is used to be fixedly connected to the grounding member and electrically conductive when in use; The extending direction of the grounding body is parallel to the circumferential direction of the lining body.

2. The lining according to claim 1, characterized in that The connecting portion is provided at both ends of the grounding body in its extending direction; and the grounding portion is located between the two ends of the grounding body.

3. The liner according to claim 1, characterized in that The grounding body is provided with the connection portion at one end thereof in the extending direction, and the grounding portion is provided at the other end thereof in the extending direction.

4. The liner according to claim 1, characterized in that The connecting portion is integrally connected to the lining body or is hinged; and / or, The connecting portion is integrally connected to the grounding body or is hinged.

5. The liner according to any one of claims 1 to 4, characterized in that: A flange base is provided at the lower end of the lining body, the flange base is annular and protrudes toward the axis of the lining body relative to the inner circumference of the lining body; The flange base has a boss formed on one inner circumference side, the grounding body is spaced apart from the lower surface of the boss, is located on the inner side of the inner circumference of the flange base, and is spaced apart from the inner circumference of the flange base; the connecting portion is connected to the lower surface of the boss and is electrically conductive.

6. The liner according to claim 5, characterized in that The connecting portion is a first protrusion formed on the lower surface of the boss, and at least one end of the grounding body is integrally connected to a side surface of the first protrusion.

7. The liner according to claim 1, characterized in that The grounding portion is a second protrusion formed on the lower surface of the grounding body, and the lower surface of the second protrusion is used to electrically contact with the grounding piece.

8. The liner according to claim 7, characterized in that The grounding body and the second protrusion are correspondingly provided with through holes penetrating in the vertical direction; The grounding structure further includes a fastener, which is used to penetrate the through hole when in use and fix the grounding body and the second protrusion to the grounding member.

9. The liner according to claim 8, characterized in that The lining further comprises a conductive ring, which is arranged below the lining body and is used to be fixedly connected to the grounding member and electrically conductive when in use; The conductive ring is used to support the second protrusion, and a threaded hole is provided on the upper surface of the conductive ring. The threaded hole is provided corresponding to the through hole, and the fastener is threadedly connected to the threaded hole.

10. The liner according to claim 9, characterized in that At least one electromagnetic coil is provided between the upper surface of the conductive ring and the lower surface of the second protrusion.

11. The liner according to any one of claims 1 to 4, characterized in that: There are multiple grounding structures, which are distributed at intervals along the circumference of the lining body.

12. A semiconductor processing chamber, comprising a chamber body and a chuck disposed in the chamber body, wherein the chuck is used to carry a wafer; characterized in that: Also comprising the liner according to any one of claims 1 to 11, wherein the liner body is disposed around the inner side of the chamber body, and the upper end of the liner body is connected to the chamber body and electrically conductive; The chuck is provided with the grounding member.

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