A power device chip packaging device and process

Abstract

The present invention belongs to the field of semiconductor packaging chip technology, especially a power device chip packaging device and process, which includes a horizontally arranged processing table and a control console fixed on the processing table, and also includes: a pushing mechanism, including two guide rails symmetrically arranged on the horizontal plane at the top of the processing table, the tops of the two guide rails are provided with L-shaped seats, the bottom of the processing table is symmetrically fixed with two support frames, and the two support frames are H-shaped; a lifting mechanism, arranged on the L-shaped seat, used for lifting and lowering drive during processing; a recessed frame, fixedly installed on the front side of the processing table, a rotating bracket is provided above the top of the recessed frame, and a collection box is fixedly installed at one end of the top of the rotating bracket. The present invention has a simple structure, and before the product is packaged on the chip, the cleanliness of the wafer is guaranteed, and the situation that the product quality is affected by dust is avoided, which is convenient for people to use.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging chip technology, and in particular to a chip packaging device and process for a power device. Background Art

[0002] Power electronics technology plays a very important role in the industrial field. Among them, the power rate device of power electronics, the insulated gate bipolar transistor, is widely used in modern industrial fields (power transmission, inverter, electric vehicles, etc.). Power devices are functional devices that package semiconductor chips on substrates according to certain application circuits, and need to maintain electrical insulation between semiconductor chips and between semiconductor chips and substrates, and need to complete certain basic circuit connections inside the power devices. Therefore, power devices need to be packaged using DBC boards (Direct Bonding Copper, ceramic copper clad boards) to meet the electrical insulation function of power devices.

[0003] At present, the soldering process of power devices requires pasting two or more chips of different sizes on a product. However, before pasting, since the product is exposed to the air, it is inevitable to avoid dust contamination. If the chips are pasted without being treated, it will affect the quality of the product. Summary of the invention

[0004] The purpose of the present invention is to overcome the defects of the prior art and provide a wafer packaging device and process for power devices, which ensures the cleanliness of the wafer before the product is packaged, avoids the situation where dust affects the product quality, and is convenient for people to use.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A power device chip packaging device includes a horizontally arranged processing table and a control console fixed on the processing table, and further includes:

[0007] The pushing mechanism comprises two guide rails symmetrically arranged on the horizontal plane at the top of the processing table, the tops of the two guide rails are provided with L-shaped seats, and the bottom of the processing table is symmetrically fixed with two support frames, both of which are arranged in an H shape;

[0008] The lifting mechanism is installed on the L-shaped seat and is used for lifting and lowering drive during processing;

[0009] A recessed frame is fixedly mounted on the front side of the processing table, a rotating bracket is provided above the top of the recessed frame, and a collection box is fixedly mounted on one end of the top of the rotating bracket;

[0010] The cleaning mechanism is arranged on the collecting box, a cleaning motor is fixedly installed on the vertical surface of one side of the collecting box, and a cleaning brush plate and a dust suction plate located below the collecting box for dusting the products. The cleaning mechanism includes a rotating rod rotatably connected to the collecting box, a cleaning motor is fixedly installed on one side of the collecting box, the output shaft of the cleaning motor is fixedly connected to the rotating rod, a first bevel gear is fixedly connected to the outer wall of the rotating rod, a transmission rod is rotatably connected to the bottom of the collecting box, the top of the transmission rod is fixedly connected to the second bevel gear, the second bevel gear is meshed with the first bevel gear, and the bottom end of the transmission rod is fixedly connected to the cleaning brush plate. One end of the rotating rod is fixedly connected to a disc, and a plurality of fan blades are fixedly connected to the outer periphery of the disc. Two vertical rods are fixedly installed on the bottom of the collecting box, and the bottom ends of the two vertical rods are fixedly connected to the dust suction plate above the cleaning brush plate, a dust suction pipe is connected between the dust suction plate and the collecting box, a protective net is obliquely arranged in the collecting box, and a box door is provided on one side of the collecting box.

[0011] Furthermore, the pushing mechanism also includes pushing screws rotatably connected to the two guide rails, and pushing blocks are threadedly connected to the two pushing screws. Corresponding limiting grooves are provided on the inner walls on both sides of the two guide rails. Limiting plates are fixedly connected to both sides of the two pushing blocks, and four limiting plates are respectively slidably connected to the four limiting grooves. The four limiting plates can utilize the sliding between the four limiting grooves to horizontally limit the pushing blocks.

[0012] Furthermore, the two pushing blocks are respectively fixedly connected to the bottom of the two L-shaped seats, and two pushing motors are symmetrically fixedly installed on the rear side of the processing table, and the output shafts of the two pushing motors are respectively fixedly connected to the two pushing screws.

[0013] Furthermore, the lifting mechanism includes two No. 1 electric push rods respectively fixedly mounted on two L-shaped seats, the bottom ends of the two No. 1 electric push rods are fixedly connected to a bracket, one side of the two brackets is fixedly connected to a limiting plate 2, one side of the two L-shaped seats is vertically provided with two limiting grooves 2, one end of the two limiting plates 2 slides in the two limiting grooves 2 respectively, and the two limiting plates 2 can limit the vertical sliding of the bracket by sliding between the two limiting grooves 2.

[0014] Furthermore, a No. 2 electric push rod is fixedly provided on one side of the two brackets, one end of the two No. 2 electric push rods is fixedly connected to an extension seat, a hanging tube is fixedly provided at one end of the bottom of the two extension seats, a shooting camera is provided at the bottom of the two hanging tubes and two suction pumps are provided on one side of the two extension seats, and a suction nozzle is provided at the bottom of the two suction pumps, which facilitates the careful suction and fixation of the chip.

[0015] Furthermore, a rotating motor is fixedly installed at the bottom of the recessed frame, a rotating shaft is rotatably connected to the top of the recessed frame, the rotating shaft is fixedly connected to the output shaft of the rotating motor, and the top of the rotating shaft is fixedly connected to the rotating bracket. When the rotating shaft rotates, it can drive the rotating bracket to complete a ninety-degree rotation.

[0016] Furthermore, the processing table is provided with a feeding trough and a placement seat fixedly installed between the processing table and the recessed frame, and a wafer is arranged on the placement seat.

[0017] A power device chip packaging process, using the power device chip packaging device described above, includes the following steps:

[0018] S1: Before processing, prepare the raw materials to be produced;

[0019] S2: Using the control console to start the rotating motor, the output shaft of the rotating motor drives the rotating shaft to rotate, and then drives the rotating bracket fixed on the top of the rotating shaft to rotate ninety degrees so that the cleaning brush plate is located on the wafer and contacts it;

[0020] S3: Then start the cleaning motor through the control console, so that the output shaft of the cleaning motor drives the rotating rod to rotate, the rotating rod drives the first bevel gear to rotate, the first bevel gear uses the meshing between the first bevel gear and the second bevel gear to transmit the transmission rod, and the transmission rod drives the cleaning brush plate to rotate to clean the dust on the wafer, thereby ensuring the cleanliness of the wafer before packaging and avoiding the quality of the packaged product affected by dust;

[0021] S4: At the same time, the rotating rod drives the disc to rotate, and then the multiple fan blades rotate. By using the effect of negative pressure, the dust is sucked into the dust suction pipe through the dust suction plate connected to the dust suction pipe and transported to the collection box. The dust-proof net arranged obliquely in the collection box can block the dust to prevent the dust from contaminating the parts inside the collection box. When the dust in the collection box needs to be processed, the box door can be directly opened to take out the dust in the collection box for processing, which also avoids the situation that the dust is scattered and pollutes the working environment when the cleaning brush plate cleans the wafer;

[0022] S5: Use the console to control the No. 2 electric push rod to push the extension seat sliding at the bottom of the bracket to move toward the feeding trough until the suction nozzle is located above the feeding trough, and then drive the No. 1 electric push rod to push the bracket downward, so that the suction nozzle and the small chip in the feeding trough are attached to each other, and at the same time, the suction pump generates suction force to fix the small chip through the suction nozzle;

[0023] S6: Use the console to start one of the push motors, and the output shaft of the push motor drives the push screw to rotate, and the push screw drives the push block, and the two limit plates limit the push block, so that the push block can move horizontally stably, and then drive the L-shaped seat to move and drive the hanging tube to move above the wafer. At the same time, the camera can take pictures of the wafer and upload them to the console for analysis, and give the loading order as an odd order. Then the No. 1 electric push rod pushes the bracket to move downward, so that the small chip at the bottom of the nozzle is encapsulated at the specified position of the wafer, and the suction pump releases the suction force, so that the small chip is separated from the nozzle, thereby achieving the effect of wafer loading and encapsulation;

[0024] S7: When the large chip in the feed trough needs to be packaged on a wafer, the steps of S5 and S6 can be repeated according to an even number packaging sequence to complete the packaging.

[0025] Compared with the prior art, the advantages of the present invention are:

[0026] 1. In this solution, the transmission rod drives the cleaning brush plate to rotate to clean the dust on the wafer, thereby ensuring the cleanliness of the wafer before packaging;

[0027] 2. In this solution, the rotating rod drives the disc to rotate, which in turn causes the multiple blades to rotate. By using the negative pressure, the dust is sucked into the dust collection pipe and transported to the collection box through the dust collection plate connected to the dust collection pipe, thereby avoiding the dust from floating and polluting the working environment when the cleaning brush plate cleans the wafer;

[0028] 3. This solution can paste one large and one small chip. Compared with the traditional two identical chips, the current process operation has some IGBT transistors with high product value. One product needs to be equipped with an IGBT chip and a fast recovery diode chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic structural diagram of a power device upper chip packaging device proposed by the present invention;

[0031] Figure 2 A power device upper chip packaging device proposed by the present invention Figure 1 Schematic diagram of the structure of part A in FIG.

[0032] Figure 3 A power device upper chip packaging device proposed by the present invention Figure 1 Schematic diagram of the structure of part B;

[0033] Figure 4 A power device upper chip packaging device proposed by the present invention Figure 1 Schematic diagram of the structure of part C in;

[0034] Figure 5 A bottom-up stereoscopic structural schematic diagram of a power device upper chip packaging device proposed by the present invention;

[0035] Figure 6 A power device upper chip packaging device proposed by the present invention Figure 5 Schematic diagram of the structure of part D in FIG.

[0036] Figure 7 A schematic diagram of the three-dimensional structure of a rotating rod, a disc, a fan blade, etc. of a power device upper chip packaging device proposed by the present invention;

[0037] Figure 8 A schematic diagram of DA1 soldering and DA1 chip attachment in a power device on-chip packaging process proposed by the present invention;

[0038] Fig. 9 A schematic side view of DA1 soldering and DA1 chip attachment in a power device on-chip packaging process proposed by the present invention;

[0039] Fig.10 A schematic diagram of DA2 soldering and DA2 chip enlargement in a power device on-chip packaging process proposed by the present invention;

[0040] Fig.11 The figure is a side view schematic diagram of DA2 soldering and DA2 chip enlargement in a power device on-chip packaging process proposed by the present invention.

[0041] The corresponding relationship of the numbers in the accompanying drawings is as follows:

[0042] 1. Processing table; 2. Control console; 3. Guide rail; 301. Pushing screw; 302. Pushing block; 303. Limiting plate 1; 304. Limiting slot 1; 305. Pushing motor; 4. L-shaped seat; 401. Limiting slot 2; 402. Limiting plate 2; 403. Electric push rod No. 1; 5. Support seat; 501. Electric push rod No. 2; 502. Extension seat; 6. Suspension tube; 601. Shooting camera; 602. Suction nozzle; 7. Feed trough; 701. Placement seat; 702. Wafer; 8. Recessed frame; 801. Rotating motor; 802. Rotating bracket; 9. Collecting box; 901. Cleaning motor; 902. Rotating rod; 903. Disc; 904. Fan blade; 905. First bevel gear; 906. Transmission rod; 907. Second bevel gear; 908. Cleaning brush plate; 909. Dust pipe; 910. Dust plate; 10. Support frame. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Reference Figure 1-Figure 11 A power device upper chip packaging device includes a horizontally arranged processing table 1 and a control console 2 fixedly arranged on the processing table 1, and also includes:

[0045] The pushing mechanism includes two guide rails 3 symmetrically arranged on the horizontal plane at the top of the processing table 1, and the tops of the two guide rails 3 are each provided with an L-shaped seat 4. Two support frames 10 are symmetrically fixedly installed at the bottom of the processing table 1, and the two support frames 10 are both arranged in an H shape;

[0046] The recessed frame 8 is fixedly installed on the front side of the processing table 1. A rotating bracket 802 is provided above the top of the recessed frame 8. A collecting box 9 is fixedly installed at one end of the top of the rotating bracket 802. A cleaning mechanism is arranged on the collecting box 9. A cleaning motor 901 and a cleaning brush plate 908 and a dust collecting plate 910 for dust removal of the product are fixedly installed on the vertical surface of one side of the collecting box 9. The cleaning mechanism includes a rotating rod 902 rotatably connected to the collecting box 9. A cleaning motor 901 is fixedly installed on one side of the collecting box 9. The output shaft of the cleaning motor 901 is fixedly connected to the rotating rod 902. A first bevel gear 905 is fixedly connected to the outer wall of the rotating rod 902. A transmission rod 906 is rotatably connected to the bottom of the collecting box 9. A second bevel gear 907 is fixedly connected to the top of the transmission rod 906. The second bevel gear 907 is meshed with the first bevel gear 905. The bottom end of the transmission rod 906 is fixedly connected to the cleaning brush plate 908, and one end of the rotating rod 902 is fixedly connected to a disc 903, and the outer periphery of the disc 903 is fixedly connected to a plurality of fan blades 904. Two vertical rods are fixedly installed at the bottom of the collecting box 9, and the bottom ends of the two vertical rods are fixedly connected to a dust suction plate 910 located above the cleaning brush plate 908. A dust suction pipe 909 is connected between the dust suction plate 910 and the collecting box 9. A protective net is obliquely arranged in the collecting box 9, and a box door is arranged on one side of the collecting box 9. The rotating rod 902 drives the disc 903 to rotate, and then the plurality of fan blades 904 rotate. By utilizing the effect of negative pressure, the dust suction plate 910 connected to the dust suction pipe 909 sucks the floating dust into the dust suction pipe 909 and transports it to the collecting box 9, thereby avoiding the situation where dust is scattered and pollutes the working environment when the cleaning brush plate 908 cleans the wafer 702.

[0047] In this embodiment, the pushing mechanism also includes a pushing screw 301 which is rotatably connected to the two guide rails 3, and the two pushing screws 301 are threadedly connected with a pushing block 302. The inner walls of both sides of the two guide rails 3 are provided with corresponding limiting grooves 304. Both sides of the two pushing blocks 302 are fixedly connected with limiting plates 303. The four limiting plates 303 are respectively slidably connected to the four limiting grooves 304. The four limiting plates 303 can slide with the four limiting grooves 304 to push the pushing blocks 302. For horizontal limiting, the two pushing blocks 302 are fixedly connected to the bottom of the two L-shaped seats 4 respectively, and two pushing motors 305 are symmetrically fixedly installed on the rear side of the processing table 1. The output shafts of the two pushing motors 305 are fixedly connected to the two pushing screws 301 respectively. The pushing screws 301 drive the pushing blocks 302, and use the two limiting plates 303 to limit the pushing blocks 302, so that the pushing blocks 302 can move horizontally stably, thereby driving the L-shaped seat 4 to move and drive the hanging barrel 6 to move above the wafer 702.

[0048] In this embodiment, the lifting mechanism is arranged on the L-shaped seat 4 and is used for lifting drive during processing. The lifting mechanism includes two No. 1 electric push rods 403 respectively fixedly installed on the two L-shaped seats 4, and the bottom ends of the two No. 1 electric push rods 403 are fixedly connected to the bracket 5, and one side of the two brackets 5 is fixedly connected to the limiting plate 2 402. One side of the two L-shaped seats 4 is vertically provided with two limiting grooves 2 401, and one end of the two limiting plates 2 402 slides in the two limiting grooves 2 401 respectively. The two limiting plates 2 402 can limit the vertical sliding of the bracket 5 by sliding between the two limiting grooves 2 401.

[0049] In this embodiment, a No. 2 electric push rod 501 is fixedly provided on one side of the two brackets 5, and one end of the two No. 2 electric push rods 501 is fixedly connected to an extension seat 502, and a hanging tube 6 is fixedly provided at one end of the bottom of the two extension seats 502. The bottom of the two hanging tubes 6 is provided with a shooting camera 601 and two suction pumps provided on one side of the two extension seats 502. The bottom of the two suction pumps is provided with a suction nozzle 602, which is convenient for sucking and fixing the chip. A rotating motor 801 is fixedly installed at the bottom of the recess 8, and a rotating shaft is rotatably connected to the top of the recess 8. The rotating shaft is fixedly connected to the output shaft of the rotating motor 801, and the top of the rotating shaft is fixedly connected to the rotating bracket 802. When the rotating shaft rotates, it can drive the rotating bracket 802 to complete a ninety-degree rotation. A feeding trough 7 and a placement seat 701 fixedly installed between the processing table 1 and the recess 8 are provided on the processing table 1, and a wafer 702 is provided on the placement seat 701.

[0050] A power device chip packaging process, using the power device chip packaging device, includes the following steps:

[0051] S1: Before processing, prepare the raw materials and machines to be produced, and heat the machine rails to meet the required process conditions DA1 heating temperature 1 2 3 4 5 6 7 8;

[0052] Deviation ±5℃ 300 330 330 330 330 350 360 340;

[0053] DA2 heating temperature 1 2 3 4 5 6 7 8;

[0054] Deviation ±5℃ 300 330 330 330 330 340 350 340;

[0055] The temperature of the welding area of ​​DA2 is lower than that of DA1 to prevent the displacement of the first chip during DA2. N2 and H2 mixed gas: the mixed gas ratio is N2:H2=90%:10% (10-15L / Min-0.2MPa). Tinning in frame operation: the tinning track is a repeated Z-shape. The advantages of tinning are that the tin layer is relatively thin and the uniformity of soldering is better.

[0056] S2: Using the control console 2 to start the rotating motor 801, the output shaft of the rotating motor 801 drives the rotating shaft to rotate, and then drives the rotating bracket 802 fixed to the top of the rotating shaft to rotate 90 degrees so that the cleaning brush plate 908 is located on the wafer 702 and contacts it;

[0057] S3: The cleaning motor 901 is started through the control console 2, so that the output shaft of the cleaning motor 901 drives the rotating rod 902 to rotate, and the rotating rod 902 drives the first bevel gear 905 to rotate. The first bevel gear 905 drives the transmission rod 906 by meshing with the second bevel gear 907, and the transmission rod 906 drives the cleaning brush plate 908 to rotate to clean the dust on the wafer 702, thereby ensuring the cleanliness of the wafer 702 before packaging, and also avoiding the dust from affecting the quality of the packaged product;

[0058] S4: At the same time, the rotating rod 902 drives the disc 903 to rotate, and then the multiple fan blades 904 rotate. Using the effect of negative pressure, the dust is sucked into the dust suction pipe 909 through the dust suction plate 910 connected to the dust suction pipe 909 and transported to the collection box 9. The dust-proof net arranged obliquely in the collection box 9 can block the dust to prevent the dust from contaminating the parts inside the collection box 9. When the dust in the collection box 9 needs to be processed, the box door can be directly opened to take out the dust in the collection box 9 for processing, which also avoids the situation where dust is scattered and pollutes the working environment when the cleaning brush plate 908 cleans the wafer 702;

[0059] S5: Use the console 2 to control the second electric push rod 501 to push the extension seat 502 sliding at the bottom of the bracket 5 to move toward the feeding trough 7 until the suction nozzle 602 is located above the feeding trough 7, and then drive the first electric push rod 403 to push the bracket 5 downward, so that the suction nozzle 602 is in contact with the small chip in the feeding trough 7, and at the same time, the suction pump generates suction to fix the small chip through the suction nozzle 602;

[0060] S6: Use the control console 2 to start one of the push motors 305, and the output shaft of the push motor 305 drives the push screw 301 to rotate, and the push screw 301 drives the push block 302, and the two limit plates 303 are used to limit the push block 302, so that the push block 302 can move horizontally stably, and then drive the L-shaped seat 4 to move and drive the hanging tube 6 to move above the wafer 702. At the same time, the shooting camera 601 can take pictures of the wafer 702 and upload them to the control console 2 for analysis, and give the loading order as an odd order, and then the No. 1 electric push rod 403 pushes the bracket 5 to move downward, so that the small chip at the bottom of the suction nozzle 602 is encapsulated at the specified position of the wafer 702, and the suction pump releases the suction force, so that the small chip is separated from the suction nozzle 602, thereby achieving the effect of wafer loading and encapsulation;

[0061] S7: When the large chip in the feed trough 7 needs to be packaged on the wafer 702, the packaging can be completed by repeating steps S5 and S6 in an even-numbered packaging sequence. The method adopted is to use a tin-writing mode on the lead frame base island, spread solder on the base island, and first operate DA1 using a small-size chip; in operation DA2, replace the wafer ring, operate a large-size chip, first spread tin and then attach the chip, and operate more chips in sequence.

[0062] like Figure 8 , Fig. 9 , Fig.10 and Fig.11 As shown, in operation DA1, the first small chip is pasted until the whole batch of operations is completed. After the DA1 products are completed, continue to operate DA2 to write tin and paste the second large chip. If the operation is large-sized and thin chips, it is necessary to replace multiple ejectors and use UV film with less viscosity to facilitate suction by the nozzle and reduce the risk of broken chips and broken edges.

[0063] All structures in this application can be selected in terms of material and length according to actual usage. The accompanying drawings are all schematic structural diagrams, and the specific actual dimensions can be appropriately adjusted.

[0064] Parts not involved in the present invention are the same as the prior art or can be implemented by the prior art. Although the embodiments of the present invention have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power device upper chip packaging device, comprising: A horizontally arranged processing table (1) and a control console (2) fixedly arranged on the processing table (1), characterized in that they also include: The pushing mechanism comprises two guide rails (3) symmetrically arranged on a horizontal plane at the top of the processing table (1), the tops of the two guide rails (3) are each provided with an L-shaped seat (4), and the bottom of the processing table (1) is symmetrically fixed with two support frames (10), and the two support frames (10) are both arranged in an H shape; A lifting mechanism is arranged on the L-shaped seat (4) and is used for lifting and lowering drive during processing; A recessed frame (8) is fixedly mounted on the front side of the processing table (1); a rotating bracket (802) is provided above the top of the recessed frame (8); a collecting box (9) is fixedly mounted on one end of the top of the rotating bracket (802); A cleaning mechanism is provided on a collection box (9); a cleaning motor (901) and a cleaning brush plate (908) and a dust collecting plate (910) are fixedly mounted on a vertical surface on one side of the collection box (9); the cleaning mechanism comprises a rotating rod (902) rotatably connected to the collection box (9); a cleaning motor (901) is fixedly mounted on one side of the collection box (9); an output shaft of the cleaning motor (901) is fixedly connected to the rotating rod (902); a first bevel gear (905) is fixedly connected to the outer wall of the rotating rod (902); a transmission rod (906) is rotatably connected to the bottom of the collection box (9); a second bevel gear (905) is fixedly connected to the top of the transmission rod (906); The second bevel gear (907) is meshed with the first bevel gear (905), the bottom end of the transmission rod (906) is fixedly connected to the cleaning brush plate (908), one end of the rotating rod (902) is fixedly connected to a disk (903), the outer periphery of the disk (903) is fixedly connected to a plurality of fan blades (904), two vertical rods are fixedly installed at the bottom of the collection box (9), the bottom ends of the two vertical rods are fixedly connected to a dust suction plate (910) located above the cleaning brush plate (908), a dust suction pipe (909) is connected between the dust suction plate (910) and the collection box (9), a protective net is obliquely arranged in the collection box (9), and a box door is provided on one side of the collection box (9).

2. The power device chip packaging device according to claim 1, characterized in that: The pushing mechanism further comprises pushing screws (301) respectively rotatably connected to the two guide rails (3); the two pushing screws (301) are both threadedly connected to pushing blocks (302); corresponding limiting grooves (304) are respectively provided on the inner walls on both sides of the two guide rails (3); limiting plates (303) are fixedly connected to the two sides of the two pushing blocks (302); and the four limiting plates (303) are respectively slidably connected to the four limiting grooves (304).

3. The power device chip packaging device according to claim 2, characterized in that: The two pushing blocks (302) are respectively fixedly connected to the bottoms of the two L-shaped seats (4); two pushing motors (305) are symmetrically fixedly installed on the rear side of the processing table (1); and the output shafts of the two pushing motors (305) are respectively fixedly connected to the two pushing screws (301).

4. The power device chip packaging device according to claim 1, characterized in that: The lifting mechanism comprises two No. 1 electric push rods (403) respectively fixedly mounted on two L-shaped seats (4); the bottom ends of the two No. 1 electric push rods (403) are fixedly connected to a bracket (5); one side of the two brackets (5) is fixedly connected to a second limiting plate (402); one side of the two L-shaped seats (4) is vertically provided with two second limiting grooves (401); one end of the two second limiting plates (402) slides in the two second limiting grooves (401) respectively.

5. The power device chip packaging device according to claim 4, characterized in that: A No. 2 electric push rod (501) is fixedly provided on one side of the two brackets (5), one end of the two No. 2 electric push rods (501) is fixedly connected to an extension seat (502), a hanging tube (6) is fixedly provided at one end of the bottom of the two extension seats (502), a shooting camera (601) is provided at the bottom of the two hanging tubes (6), and two suction pumps are provided on one side of the two extension seats (502), and a suction nozzle (602) is provided at the bottom of the two suction pumps.

6. The power device chip packaging device according to claim 1, characterized in that: A rotating motor (801) is fixedly mounted on the bottom of the recessed frame (8), a rotating shaft is rotatably connected to the top of the recessed frame (8), the rotating shaft is fixedly connected to the output shaft of the rotating motor (801), and the top end of the rotating shaft is fixedly connected to the rotating bracket (802).

7. The power device chip packaging device according to claim 1, characterized in that: The processing table (1) is provided with a feeding trough (7) and a placement seat (701) fixedly installed between the processing table (1) and the recessed frame (8), and a wafer (702) is provided on the placement seat (701).

8. A power device on-chip packaging process, characterized in that: The power device upper chip packaging device according to any one of claims 1 to 7 comprises the following steps: S1: Before processing, prepare the raw materials to be produced; S2: Using the control console (2), the rotating motor (801) is started, and the output shaft of the rotating motor (801) drives the rotating shaft to rotate, which in turn drives the rotating bracket (802) fixed to the top of the rotating shaft to rotate ninety degrees so that the cleaning brush plate (908) is located on the wafer (702) and contacts it; S3: The cleaning motor (901) is started through the control console (2), so that the output shaft of the cleaning motor (901) drives the rotating rod (902) to rotate, the rotating rod (902) drives the first bevel gear (905) to rotate, the first bevel gear (905) drives the transmission rod (906) by meshing with the second bevel gear (907), and the transmission rod (906) drives the cleaning brush plate (908) to rotate to clean the dust on the wafer (702), thereby ensuring the cleanliness of the wafer (702) before packaging and avoiding the quality of the packaged product affected by dust; S4: At the same time, the rotating rod (902) drives the disc (903) to rotate, and then the plurality of fan blades (904) rotate. By using the effect of negative pressure, the dust is sucked into the dust suction pipe (909) and transported to the collection box (9) through the dust suction plate (910) connected to the dust suction pipe (909). The dust-proof net arranged obliquely in the collection box (9) can block the dust and prevent the dust from contaminating the parts inside the collection box (9). When the dust in the collection box (9) needs to be processed, the box door can be directly opened to take out the dust in the collection box (9) for processing, and the situation that the dust is scattered and pollutes the working environment when the cleaning brush plate (908) cleans the wafer (702) is also avoided; S5: Using the control console (2), the second electric push rod (501) is controlled to push the extension seat (502) sliding on the bottom of the support seat (5) to move toward the feeding trough (7) until the suction nozzle (602) is located above the feeding trough (7), and then the first electric push rod (403) is driven to push the support seat (5) downward, so that the suction nozzle (602) and the small chip in the feeding trough (7) are attached to each other, and at the same time, the suction pump generates suction force to fix the small chip through the suction nozzle (602); S6: Using the control console (2) to start one of the push motors (305), the output shaft of the push motor (305) drives the push screw (301) to rotate, and the push screw (301) drives the push block (302), and the two limit plates (303) are used to limit the push block (302), so that the push block (302) can move horizontally stably, and then drive the L-shaped seat (4) to move and drive the hanging tube (6) to move above the wafer (702), and at the same time, the camera (601) can take a picture of the wafer (702) and upload it to the control console (2) for analysis, and give the loading order as an odd order, and then the No. 1 electric push rod (403) drives the bracket (5) to move downward, so that the small chip at the bottom of the suction nozzle (602) is packaged at the specified position of the wafer (702), and the suction pump releases the suction force, so that the small chip and the suction nozzle (602) are separated, thereby achieving the effect of wafer loading and packaging; S7: When the large chip in the feed trough (7) needs to be packaged on the wafer (702), the steps S5 and S6 can be repeated according to the even-numbered packaging sequence to complete the packaging.

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