A nozzle heating eutectic machine

Abstract

The present application relates to the technical field of eutectic machines, and in particular to a nozzle heating eutectic machine, which includes a feeding mechanism, a transfer mechanism, a feeding mechanism, and a eutectic heating mechanism. Among them, the feeding mechanism is used to provide chips; the transfer mechanism includes a transfer module and a thermal adsorption module arranged on the transfer module. The transfer module is used to drive the thermal adsorption module to approach or move away from the feeding mechanism, and the thermal adsorption module is used to adsorb the chips on the feeding mechanism and preheat the chips; the feeding mechanism includes a feeding module and a preheating module. The preheating module is arranged on the feeding module. The feeding module is used to provide substrates, and the preheating module is used to preheat the substrates stored on the feeding module; the eutectic heating mechanism is arranged between the feeding module and the transfer module, and the eutectic heating module is used to heat and eutectify the substrates and chips. The present application has the effect of improving product quality.

Description

Technical Field

[0001] The present application relates to the technical field of eutectic machines, and in particular, to a nozzle heating eutectic machine. Background Art

[0002] Currently, in the fields of semiconductor packaging and optoelectronics, the eutectic technology is a key connection process. It forms a stable eutectic point by melting and bonding a chip with a PCB board or other substrate materials at a specific temperature to achieve electrical and mechanical connections. During the eutectic process of a blue film chip and a PCB board, the performance of the eutectic machine directly affects the quality of the eutectic area and the reliability of the product. In related technologies, the eutectic machine usually directly heats the PCB board by means of an electric heating plate or infrared radiation to achieve the eutectic soldering of the blue film chip and the PCB board.

[0003] Regarding the above related technologies: directly heating the PCB board by means of an electric heating plate or infrared radiation easily causes uneven heating of the eutectic area, thus easily leading to a reduction in product quality. Summary of the Invention

[0004] In order to improve product quality, the present application provides a nozzle heating eutectic machine.

[0005] The nozzle heating eutectic machine provided by the present application adopts the following technical solutions:

[0006] A nozzle heating eutectic machine includes:

[0007] A loading mechanism for providing chips;

[0008] A transfer mechanism including a transfer module and a thermal adsorption module provided on the transfer module. The transfer module is used to drive the thermal adsorption module to approach or move away from the loading mechanism, and the thermal adsorption module is used to adsorb the chips on the loading mechanism and preheat the chips;

[0009] A feeding mechanism including a feeding module and a preheating module. The preheating module is provided on the feeding module. The feeding module is used to provide a substrate, and the preheating module is used to preheat the substrate stored on the feeding module;

[0010] A eutectic heating mechanism is provided between the feeding module and the transfer module, and the eutectic heating mechanism is used to heat and eutectify the substrate and the chips.

[0011] By adopting the above technical solution, the chips provided by the loading mechanism are adsorbed and preheated by the thermal adsorption module of the transfer mechanism, ensuring that the chips will not be damaged due to sudden temperature changes during the transfer process. The preheating module preheats the substrate, making the substrate in a suitable temperature state before entering the eutectic heating mechanism, avoiding the influence of temperature mutation on the substrate, and thus improving the stability of the eutectic process and the product quality. The eutectic heating mechanism precisely heats the substrate and the chips, ensuring a uniform temperature distribution at the eutectic position and further enhancing the eutectic effect. In summary, this technical solution not only improves the production efficiency but also significantly enhances the quality and reliability of the product.

[0012] Optionally, the thermal adsorption module includes a vacuum suction nozzle and a heating sheet disposed inside the vacuum suction nozzle. The vacuum suction nozzle is disposed on the transfer module, and the heating sheet is used to heat the vacuum suction nozzle.

[0013] By adopting the above technical solution, the heating sheet disposed inside the vacuum suction nozzle can preheat the chip while adsorbing it. This can not only increase the initial temperature of the chip, reduce the subsequent heating time, but also ensure that the chip maintains a stable temperature throughout the transfer process, avoiding performance changes caused by temperature fluctuations. In addition, the preheating process reduces the temperature difference between the chip and the substrate, contributing to improving the temperature uniformity and stability during the eutectic process and further enhancing the product quality.

[0014] Optionally, the eutectic heating mechanism includes a carrier, a heating module, a translation module, and a clamping module. The carrier is disposed between the feeding module and the transfer module. The heating module and the translation module are respectively disposed on the carrier. The clamping module is slidably disposed on the carrier and is slidably connected to the heating module. The clamping module is connected to the translation module. When the substrate is clamped by the clamping module, the substrate can be in contact with the heating module.

[0015] By adopting the above technical solution, the setting of the carrier ensures the structural stability of the entire device, enabling the heating module and the translation module to work precisely in coordination. The translation module can drive the clamping module to move, and the clamping module can clamp the substrate, thus facilitating the transfer of the substrate closer to or away from the transfer module. On the one hand, it is convenient for the thermal adsorption module to transfer the chips onto the substrate, and on the other hand, it enables the substrate to always be in the optimal heating position during the eutectic process, enhancing the flexibility of the device to a certain extent. And when the substrate is clamped by the clamping module, the substrate is in close contact with the heating module, ensuring effective heat transfer and avoiding problems such as local overheating or uneven heating and cooling, thereby improving the quality and yield rate of the eutectic.

[0016] Optionally, the clamping module includes a moving seat, an upper clamping seat, a lower clamping seat, and a clamping driving component. The moving seat is slidably arranged on the carrier and connected to the translation module. A relief groove is formed in the moving seat, and the heating module is arranged through the relief groove.

[0017] The clamping driving component and the upper clamping seat are respectively arranged on the moving seat. The lower clamping seat is slidably arranged on the moving seat and is oppositely arranged with the upper clamping seat. The clamping driving component is connected to the lower clamping seat, and the clamping driving component is used to drive the lower clamping seat to approach or move away from the upper clamping seat.

[0018] By adopting the above technical solution, when it is necessary to convey the substrate between the upper clamping seat and the lower clamping seat, the clamping driving component drives the lower clamping seat to move away from the upper clamping seat, so as to facilitate the substrate to enter between the upper clamping seat and the lower clamping seat. At this time, the clamping driving component drives the lower clamping seat to approach the upper clamping seat, thereby facilitating clamping of the substrate and flexibly adjusting the clamping force, further ensuring stable clamping of the substrate under different thicknesses and sizes, effectively preventing the substrate from deforming or shifting due to high temperature, and improving the quality and consistency of the eutectic to a certain extent.

[0019] Optionally, the clamping driving component includes a clamping driving member and a first elastic member. The clamping driving member is arranged on the moving seat. One end of the first elastic member is connected to the clamping driving member, and the other end of the first elastic member is connected to the lower clamping seat.

[0020] By adopting the above technical solution, when it is necessary to clamp the substrate, the first elastic member can drive the lower clamping seat and the upper clamping seat to cooperate with each other to stably clamp the substrate, and ensure that the lower clamping seat always maintains a certain pressure during the clamping process, so that the substrate can always be in a stable state during the entire eutectic heating process, improving the quality and reliability of the eutectic. And when it is necessary to loosen the substrate, the clamping driving member pulls the lower clamping seat to move downward through the first elastic member, so that the lower clamping seat no longer presses the substrate against the upper clamping seat, thereby realizing unloading of the substrate.

[0021] Optionally, the eutectic heating mechanism includes a lifting module. The lifting module includes a lifting driving member and a cam. The lifting driving member is arranged on the carrier. The cam is rotatably connected to the carrier and connected to the lifting driving member. The cam abuts against the heating module, and the heating module is slidably arranged on the carrier.

[0022] By adopting the above technical solution, the lifting driving member can drive the cam to rotate, and the cam abuts against the heating module, so that the heating module can slide on the carrier. The advantage of this design is that the height of the heating module can be precisely adjusted by controlling the movement of the lifting driving member, so that the substrate can be brought into contact with or separated from the heating module, which is beneficial to precisely adjusting the distance between the substrate and the heating module, and further beneficial to improving the uniformity and consistency of eutectic heating.

[0023] Optionally, the heating module includes a heating table and a heating tube. The heating table is slidably arranged on the carrier. A boss is arranged on the heating table and is used for fitting with the substrate. The heating tube is embedded in the heating table and is used for heating the heating table.

[0024] By adopting the above technical solution, the heating tube is embedded in the heating table to uniformly heat the heating table, ensuring uniform temperature distribution on the surfaces of the heating table and the boss, so that when the substrate is in contact with the boss, uniform heat transfer can be obtained, avoiding local overheating or uneven heating and cooling, and improving the quality and reliability of eutectic. At the same time, the design of the boss on the heating table enables multiple chips to be eutectic with the substrate in sequence, effectively avoiding the un-eutectic part of the substrate from being heated for a long time, and further being beneficial to reducing the possibility of substrate damage.

[0025] Optionally, it includes a material shifting mechanism. The material shifting mechanism includes a Y-axis module and a material shifting module arranged on the Y-axis module. The Y-axis module is arranged beside the carrier. The material shifting module includes a mounting seat, a material shifting rod, a second elastic member and a monitoring member. One end of the mounting seat is connected to the Y-axis module, and a slot is opened at the other end of the mounting seat. One end of the material shifting rod is inserted into the slot and is rotatably connected to the mounting seat. The second elastic member is arranged between the material shifting rod and the inner wall of the slot. The monitoring member is arranged in the slot and is electrically connected to the Y-axis module. The monitoring member is used for monitoring the state of the second elastic member.

[0026] By adopting the above technical solution, the setting of the Y-axis module enables the material shifting rod to accurately move on a predetermined path to realize precise pushing of the substrate. And the design of the rotatable connection between the material shifting rod and the mounting seat enables the material shifting rod to rotate and apply pressure to the second elastic member when the resistance received by the material shifting rod reaches a certain value, so that the second elastic member is compressed. At this time, the monitoring member will immediately trigger a signal to make the Y-axis module stop driving the material shifting rod to move, thereby effectively preventing the substrate from being damaged. This design not only improves the reliability and stability of the equipment, but also significantly reduces the defective product rate in the production process.

[0027] Optionally, the feeding module includes a pusher assembly, a magazine, and a lifting platform. The pusher assembly is disposed on a side of the eutectic heating mechanism away from the transfer module. The magazine is disposed between the pusher assembly and the eutectic heating mechanism. The lifting platform is disposed inside the magazine. The substrate is placed on the lifting platform. The preheating module is disposed inside the magazine and is configured to heat the interior of the magazine.

[0028] By adopting the above technical solution, the setting of the lifting platform can ensure that the substrate is at an appropriate height, facilitating the pusher assembly to push the substrate out of the magazine and enabling the substrate to enter the eutectic heating mechanism. Moreover, the preheating module can preheat the substrate before it enters the eutectic heating mechanism, causing the temperature of the substrate to gradually increase and avoiding stress and damage caused by sudden temperature changes. At the same time, the heating temperature of the preheating module is lower than that of the eutectic heating mechanism, effectively reducing the thermal stress of the substrate in a high-temperature environment, improving the service life and reliability of the substrate. In addition, the preheating step can also ensure that the substrate is in a relatively stable temperature state when it enters the eutectic heating mechanism, further improving the stability and consistency of the eutectic process and reducing the defective rate.

[0029] Optionally, at least two magazines are provided. The number of the lifting platforms and the preheating modules is equal to and corresponds one-to-one with the number of the magazines. The feeding mechanism includes an X-axis module. The X-axis module is disposed between the pusher assembly and the eutectic heating mechanism. A plurality of the magazines are respectively disposed on the X-axis module.

[0030] By adopting the above technical solution, the dual setting of the magazines can effectively improve the working efficiency of the eutectic machine. Specifically, one magazine is used for feeding, and the other magazine is used for discharging. In this way, the preparation and recycling of materials can be carried out while the eutectic processing is in progress, avoiding the waiting time caused by a single magazine and improving the overall operation speed of the production line. In addition, each magazine is equipped with an independent lifting platform and a preheating module, ensuring that the substrate has been properly preheated before entering the eutectic heating platform, making the temperature curve of the substrate smoother and reducing the impact of temperature mutations on the substrate, further improving the eutectic quality and the yield rate. The setting of the X-axis module enables the magazines to move flexibly between the pusher assembly and the eutectic heating mechanism, ensuring the smooth operation of the entire process.

[0031] In summary, the present application includes at least one of the following beneficial technical effects:

[0032] 1. Through the mutual cooperation of the thermal adsorption module and the preheating module, the chip and the substrate can be appropriately preheated before entering the eutectic heating mechanism, so that the temperature curves of the chip and the substrate are smoother, effectively reducing the adverse effects of temperature mutations on the substrate, and thus being conducive to improving the stability of the eutectic process and the product quality;

[0033] 2. Through the mutual cooperation of the carrier, the heating module, the translation module and the clamping module, the clamping module can drive the substrate to approach or move away from the transfer module, so that on the one hand, it is convenient for the thermal adsorption module to transfer the chip onto the substrate, and on the other hand, the substrate can always be in the best heating position during the eutectic process;

[0034] 3. Through the mutual cooperation of the mounting seat, the lever, the second elastic member and the monitoring member, the lever can push the substrate to move along a predetermined path, and when the lever receives a resistance exceeding the set range, the monitoring member will immediately trigger a signal to stop the feeding action, thus effectively preventing the substrate from being damaged. Description of the Drawings

[0035] Figure 1 is the overall structural schematic diagram of a nozzle heating eutectic machine in an embodiment of the present application.

[0036] Figure 2 is the front view of a nozzle heating eutectic machine in an embodiment of the present application.

[0037] Figure 3 is along Figure 2 in the partial structural cross-sectional view of the thermal adsorption module along the A-A line in

[0038] Figure 4 is along Figure 2 in the partial structural cross-sectional view of the material box, the lifting platform and the preheating module along the B-B line in

[0039] Figure 5 is the structural schematic diagram of the eutectic heating mechanism in an embodiment of the present application.

[0040] Figure 6 is the structural schematic diagram of the eutectic heating mechanism from another perspective in an embodiment of the present application.

[0041] Figure 7 is along Figure 2 in the partial structural cross-sectional view of the feeding module along the B-B line in

[0042] Description of the Reference Numerals:

[0043] 1. Loading mechanism; 11. Buffer platform; 12. Rotary arm module; 13. Crystal ring module; 14. Ejector pin module; 15. Swing arm module; 16. Calibration module; 2. Transfer mechanism; 21. Transfer module; 22. Thermal adsorption module; 221. Vacuum suction nozzle; 222. Heating sheet; 3. Feeding mechanism; 31. Feeding module; 311. Pushing component; 3111. Pushing drive; 3112. Push rod; 312. Magazine; 3121. Limiting piece; 3122. Discharge port; 3123. Pushing port; 313. Lifting platform; 32. Preheating module; 33. X-axis module; 4. Eutectic heating mechanism; 41. Carrier; 42. Heating module; 421. Heating table; 422. Heating tube; 423. Boss; 43. Translation module; 44. Clamping module; 441. Moving seat; 4411. Relief groove; 442. Upper clamping seat; 443. Lower clamping seat; 444. Clamping drive assembly; 4441. Clamping drive; 4442. First elastic member; 445. Accommodation groove; 45. Lifting module; 451. Lifting drive; 452. Cam; 5. Machine frame; 51. Vision element; 6. Wafer blue film; 7. Pushing mechanism; 71. Y-axis module; 72. Pushing module; 721. Mounting seat; 7211. Slot; 722. Pushing rod; 723. Second elastic member; 724. Monitoring member. Detailed implementation mode

[0044] The following is further detailed description of this application in combination with the attached Figures 1-7 drawings.

[0045] An embodiment of this application discloses a nozzle heating eutectic machine.

[0046] It should be noted that in the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0047] Refer to Figure 1, A nozzle heating eutectic machine includes a feeding mechanism 1, a transfer mechanism 2, a feeding mechanism 3, a eutectic heating mechanism 4 and a frame 5. Among them, the feeding mechanism 1, the transfer mechanism 2, the feeding mechanism 3 and the eutectic heating mechanism 4 are respectively installed on the frame 5, and the transfer mechanism 2 is located between the feeding mechanism 1 and the eutectic heating mechanism 4, and the feeding mechanism 3 is located on the side of the eutectic heating mechanism 4 away from the transfer mechanism 2, so that the transfer mechanism 2 can transfer the chips provided by the feeding mechanism 1 to the eutectic heating mechanism 4, and the feeding mechanism 3 can provide substrates for the eutectic heating mechanism 4, so as to facilitate the eutectic heating mechanism 4 to perform eutectic heating on the substrates and chips.

[0048] Refer to Figure 1 , The feeding mechanism 1 includes a buffer platform 11, a rotating arm module 12, a crystal ring module 13, a thimble module 14, a swing arm module 15 and a calibration module 16. Among them, the buffer platform 11, the rotating arm module 12, the crystal ring module 13, the thimble module 14, the swing arm module 15 and the calibration module 16 are respectively installed on the frame 5, and the buffer platform 11, the rotating arm module 12 and the crystal ring module 13 are arranged close to each other.

[0049] The buffer platform 11 is used to store the wafer blue film 6. The buffer platform 11 has multiple layers, arranged vertically, and can move up and down as a whole, so as to facilitate the rotating arm module 12 to transfer the corresponding wafer blue film 6 from the buffer platform 11 to the crystal ring module 13, and further facilitate the crystal ring module 13 to locate the wafer blue film 6. And the thimble module 14 is located below the crystal ring module 13, and the thimble module 14 is used to lift the chips so that the chips are separated from the wafer blue film 6.

[0050] The swing arm module 15 is arranged between the crystal ring module 13 and the calibration module 16, and the swing arm module 15 is used to transfer the chips lifted by the thimble module 14 to the calibration module 16, so as to facilitate the calibration module 16 to calibrate the angle of the chips.

[0051] Three vision components 51 are sequentially installed on the frame 5, and the three vision components 51 are sequentially arranged in one-to-one correspondence with the crystal ring module 13, the calibration module 16 and the eutectic heating mechanism 4. In this embodiment, the vision component 51 is a detection camera to ensure the accurate positioning of the chips.

[0052] It should be noted that the specific structures and working principles of the buffer platform 11, the rotating arm module 12, the crystal ring module 13, the thimble module 14, the swing arm module 15, the calibration module 16 and the vision component 51 belong to conventional technical means for those skilled in the art, so no more details will be described in the embodiments of this application.

[0053] Refer to Figure 1, the transfer mechanism 2 includes a transfer module 21 and a thermal adsorption module 22 provided on the transfer module 21. Among them, the transfer module 21 is installed on the frame 5, and the transfer module 21 is arranged along the direction from the eutectic heating mechanism 4 to the calibration module 16. In this embodiment, the transfer module 21 adopts a linear motor or a ball screw structure, so as to facilitate driving the thermal adsorption module 22 to approach or move away from the calibration module 16 by using the transfer module 21.

[0054] Referring to Figure 2 and Figure 3 , the thermal adsorption module 22 includes a vacuum suction nozzle 221 and a heating sheet 222 installed inside the vacuum suction nozzle 221.

[0055] Referring to Figure 1 and Figure 3 , the vacuum suction nozzle 221 is installed on the transfer module 21 and is misaligned with the vision element 51, so that when the transfer module 21 drives the vacuum suction nozzle 221 to move, the vacuum suction nozzle 221 is not likely to interfere with the vision element 51. And the vacuum suction nozzle 221 is connected to an external vacuum pump through an internal pipeline to achieve vacuum adsorption, so as to facilitate transferring the chip from the calibration module 16 to the eutectic heating mechanism 4 by using the vacuum suction nozzle 221.

[0056] In this embodiment, the heating sheet 222 is made of a high-temperature resistant ceramic material and can work in a high-temperature environment for a long time. And the heating sheet 222 adopts the resistance heating effect to convert electrical energy into heat energy, so as to facilitate heating the vacuum suction nozzle 221 by using the heating sheet 222, and further preheating the chip while the vacuum suction nozzle 221 adsorbs the chip.

[0057] Referring to Figure 1 and Figure 4 , the feeding mechanism 3 includes a feeding module 31, a preheating module 32 and an X-axis module 33. Among them, the X-axis module 33 is installed on the frame 5 and is located on the side of the eutectic heating mechanism 4 away from the transfer module 21. The feeding module 31 is arranged on the X-axis module 33. The feeding module 31 is used to provide a substrate. The preheating module 32 is arranged on the feeding module 31 and is used to preheat the substrate to a certain temperature to avoid the influence of temperature mutation on the substrate.

[0058] The feeding module 31 includes a pushing component 311, a magazine 312 and a lifting platform 313. Among them, a plurality of magazines 312 are provided. The plurality of magazines 312 are respectively installed on the X-axis module 33. In this embodiment, two magazines 312 are provided, and the X-axis module 33 can be set as a ball screw structure to facilitate driving the magazine 312 to move by using the X-axis module 33.

[0059] Referring to Figure 4, the number of lifting platforms 313 and preheating modules 32 is equal to and corresponds one-to-one with the number of cassettes 312. Specifically, the lifting platform 313 is installed inside the cassette 312, the preheating module 32 is installed on the lifting platform 313, and the preheating module 32 is used to heat the inside of the cassette 312. In other embodiments, the preheating module 32 can also be directly installed inside the cassette 312 without being installed on the lifting platform 313.

[0060] The lifting platform 313 is used to support the substrate. A limiting piece 3121 is arranged inside the cassette 312. When the lifting platform 313 drives the substrate to move upward by a certain distance, the limiting piece 3121 can abut against the lifting platform 313 to limit the lifting platform 313. At this time, the lifting platform 313 drives the substrate to move to a specified position, which is conducive to avoiding the substrate being crushed.

[0061] The preheating module 32 includes a heating plate and heating wires embedded in the heating plate. Among them, the heating plate is installed on the lifting platform 313, and the heating wires are used to heat the heating plate, so that the heating plate can heat the lifting platform 313, so as to use the lifting platform 313 to heat the substrate, and then realize the preheating of the substrate. In other embodiments, the preheating module 32 can also be set in other heating forms, as long as it can realize the heating of the inside of the lifting platform 313 or the cassette 312.

[0062] Refer to Figure 1 and Figure 4 , an outlet 3122 is opened on one side of the cassette 312 close to the eutectic heating mechanism 4, and a pushing port 3123 is opened on the side of the cassette 312 far from the eutectic heating mechanism 4. The pushing port 3123 is arranged corresponding to the outlet 3122. When the lifting platform 313 abuts against the limiting piece 3121, the substrate on the lifting platform 313 is arranged close to the outlet 3122.

[0063] The pushing component 311 includes a pushing driving part 3111 and a push rod 3112. Among them, the pushing driving part 3111 is installed on the frame 5 and is located on the side of the X-axis module 33 far from the eutectic heating mechanism 4, and the push rod 3112 is fixedly connected to the pushing driving part 3111. In this embodiment, the pushing driving part 3111 can be set as a cylinder or a hydraulic cylinder, so as to facilitate using the pushing driving part 3111 to drive the push rod 3112 to move. In other embodiments, the pushing driving part 3111 can also adopt other pushing methods as long as it can drive the push rod 3112 to approach or move away from the pushing port 3123.

[0064] When it is necessary to convey the substrate to the eutectic heating mechanism 4, the pusher driving member 3111 drives the push rod 3112 to extend into the pusher opening 3123, so that the push rod 3112 pushes the substrate towards the discharge opening 3122, thereby pushing the substrate out of the cassette 312, and then enabling the substrate to fall onto the eutectic heating mechanism 4 to achieve the loading of the substrate.

[0065] Referring to Figure 1 and Figure 5 , the eutectic heating mechanism 4 includes a carrier 41, a heating module 42, a translation module 43, a clamping module 44 and a lifting module 45. Among them, the carrier 41 is fixed on the frame 5 and is located between the X-axis module 33 and the transfer module 21, and the heating module 42 and the translation module 43 are respectively arranged on the carrier 41.

[0066] The clamping module 44 includes a moving seat 441, an upper clamping seat 442, a lower clamping seat 443 and a clamping driving assembly 444. Among them, the moving seat 441 is slidably arranged on the carrier 41 and is connected to the translation module 43. In this embodiment, the translation module 43 is a structure driven by a motor and a transmission belt, so as to facilitate driving the moving seat 441 to move between the X-axis module 33 and the transfer module 21 by using the translation module 43.

[0067] The clamping driving assembly 444 and the upper clamping seat 442 are respectively installed on the moving seat 441, the lower clamping seat 443 is slidably arranged on the moving seat 441 and is arranged opposite to the upper clamping seat 442, and the lower clamping seat 443 is located below the upper clamping seat 442. In this embodiment, there are two upper clamping seats 442, the two upper clamping seats 442 are symmetrically arranged, and the number of the lower clamping seats 443 is equal to the number of the upper clamping seats 442 and corresponds to the upper clamping seats 442 one by one. An accommodation groove 445 is formed between the upper clamping seat 442 and the lower clamping seat 443.

[0068] Referring to Figure 6 , the number of the clamping driving assemblies 444 is equal to the number of the lower clamping seats 443 and is arranged in one-to-one correspondence. The clamping driving assembly 444 includes a clamping driving member 4441 and a first elastic member 4442, and the clamping driving member 4441 is installed on the moving seat 441. One end of the first elastic member 4442 is fixedly connected to the clamping driving member 4441, and the other end is fixedly connected to the lower clamping seat 443. In this embodiment, the clamping driving member 4441 is a cylinder, and the first elastic member 4442 is a spring.

[0069] Referring to Figure 1 and Figure 6, when the push rod 3112 pushes the substrate to move into the receiving groove 445, the clamping driving member 4441 drives the lower clamping seat 443 away from the upper clamping seat 442 through the first elastic member 4442, so as to facilitate the substrate to enter the receiving groove 445. And when the substrate enters the specified position in the receiving groove 445, the clamping driving member 4441 drives the lower clamping seat 443 to approach the upper clamping seat 442 through the first elastic member 4442, so as to facilitate clamping the substrate by the upper clamping seat 442 and the lower clamping seat 443, thereby realizing the fixation of the substrate.

[0070] Referring to Figure 5 and Figure 6 , a relief groove 4411 is formed in the moving seat 441, and the heating module 42 includes a heating table 421 and a heating tube 422. Among them, the heating table 421 is slidably arranged on the bearing frame 41, and one end of the heating table 421 passes through the relief groove 4411, so that the heating table 421 is not likely to interfere with the movement of the moving seat 441.

[0071] Referring to Figure 5 , the heating tube 422 is embedded in the heating table 421, and the heating tube 422 is used to heat the heating table 421. And a boss 423 is integrally formed on the heating table 421, and the heat generated by the heating tube 422 can be transmitted to the boss 423 through the heating table 421, so that the surface temperature distribution of the boss 423 is uniform. Thus, when the boss 423 contacts the substrate, the boss 423 can heat the substrate. In this embodiment, the design of the boss 423 effectively avoids the un-eutectic part of the substrate from being heated for a long time, and thus is beneficial to reducing the possibility of substrate damage.

[0072] Referring to Figure 5 and Figure 6 , the lifting module 45 includes a lifting driving member 451 and a cam 452. Among them, the lifting driving member 451 is installed on the bearing frame 41, the cam 452 is rotatably connected to the bearing frame 41 and connected to the lifting driving member 451, and the cam 452 abuts against the bottom of the heating table 421. In this embodiment, the lifting driving member 451 includes a motor and a transmission belt, and the transmission belt is respectively connected to the motor and the cam 452, so as to facilitate the motor to drive the cam 452 to rotate through the transmission belt, so that the cam 452 accurately pushes the heating table 421 to lift.

[0073] Referring to Figure 5 and Figure 6, when the chip needs to be eutectic with the substrate, the lifting drive 451 drives the cam 452 to rotate, and the cam 452 drives the heating table 421 to rise, so that the boss 423 is in contact with the substrate, facilitating heating of the substrate to achieve eutectic heating of the chip and the substrate. And when the eutectic of the substrate and the chip is completed, the lifting drive 451 drives the heating table 421 to descend through the cam 452, so that the substrate is no longer in contact with the boss 423, which helps to reduce the possibility of damage to the substrate caused by friction between the boss 423 and the substrate when the substrate moves.

[0074] In other embodiments, the lifting module 45 may not be provided, and the clamping module 44 can be lifted synchronously to control the contact or separation between the substrate and the boss 423.

[0075] The implementation principle of the nozzle heating eutectic machine according to the embodiment of the present application is as follows: when the chip needs to be eutectic with the substrate, first start the rotating arm module 12, the ejector pin module 14, the swing arm module 15 and the calibration module 16 in sequence. The rotating arm module 12 transfers the wafer blue film 6 from the buffer platform 11 to the crystal ring module 13. The ejector pin module 14 lifts the chip, and the swing arm module 15 transfers the chip from the ejector pin module 14 to the calibration module 16. After the calibration module 16 completes the calibration of the chip, the transfer module 21 drives the vacuum nozzle 221 to approach the calibration module 16, and the vacuum nozzle 221 picks up the chip from the calibration module 16. At this time, the heat generated by the heating sheet 222 is transferred to the chip to preheat the chip.

[0076] At the same time, the lifting platform 313 moves to a position where it abuts against the limiting piece 3121 to drive the substrate to a specified position. At this time, the preheating module 32 preheats the substrate. Then start the pushing drive 3111, and the pushing drive 3111 pushes the preheated substrate out of the material box 312 through the push rod 3112 so that the substrate enters the receiving groove 445. After the substrate completely enters the receiving groove 445, the clamping drive 4441 drives the lower clamping seat 443 to approach the upper clamping seat 442 through the first elastic member 4442 to fix the substrate.

[0077] Then, the translation module 43 works, and drives the substrate to move in the direction close to the transfer module 21 through the moving seat 441, the upper clamping seat 442 and the lower clamping seat 443, so that the vacuum nozzle 221 transfers the chip to the substrate. After the chip transfer is completed, the translation module 43 works in the reverse direction to drive the substrate to move to a position close to the boss 423. Finally, the lifting drive 451 drives the heating table 421 to rise through the cam 452, so that the boss 423 is in contact with the substrate, facilitating heating of the substrate, and then realizing eutectic heating of the chip and the substrate. Repeating the above steps can complete the eutectic of multiple chips and substrates in sequence.

[0078] In another preferred embodiment, the nozzle heating eutectic machine includes a stock feeding mechanism 7.

[0079] Referring to Figure 1 , the stock feeding mechanism 7 includes a Y-axis module 71 and a stock feeding module 72 arranged on the Y-axis module 71. Among them, the Y-axis module 71 is installed beside the carrier 41, the stock feeding module 72 is installed on the Y-axis module 71, and one end of the stock feeding module 72 can abut against the substrate. In this embodiment, the Y-axis module 71 adopts a structure of a motor driving a transmission belt, so as to drive the stock feeding module 72 to move by using the Y-axis module 71, so that the stock feeding module 72 accurately pokes the substrate to move.

[0080] Referring to Figure 1 and Figure 7 , the stock feeding module 72 includes a mounting base 721, a poking rod 722, a second elastic member 723 and a monitoring member 724. Among them, one end of the mounting base 721 is fixedly connected to the Y-axis module 71, and a slot 7211 is opened at the other end of the mounting base 721. One end of the poking rod 722 is inserted into the slot 7211 and rotatably connected to the mounting base 721.

[0081] There are two second elastic members 723, and the two second elastic members 723 are respectively arranged on both sides of the poking rod 722. The end of the second elastic member 723 away from the poking rod 722 is connected to the inner wall of the slot 7211. In this embodiment, the second elastic member 723 is a spring.

[0082] The monitoring member 724 is arranged in the slot 7211 and electrically connected to the Y-axis driving member. In this embodiment, the monitoring member 724 is an electromagnetic switch. When the Y-axis module 71 drives the poking rod 722 to move through the mounting base 721, the end of the poking rod 722 away from the mounting base 721 can abut against the substrate, so as to facilitate pushing the substrate to move by using the poking rod 722. And in this process, when the resistance received by the poking rod 722 reaches a certain value, the poking rod 722 can rotate and apply pressure to the second elastic member 723, so that the second elastic member 723 is compressed. At this time, the monitoring member 724 will immediately trigger a signal, so that the Y-axis module 71 stops driving the poking rod 722 to move, thereby effectively preventing the substrate from being damaged.

[0083] Referring to Figure 5 and Figure 7 , when a plurality of chips need to be eutectic with the substrate in sequence, first place the chips on the designated positions on the substrate in sequence, and make the substrate fit with the boss 423. After completing one eutectic operation, the clamping drive assembly 444 drives the lower clamping seat 443 away from the upper clamping seat 442 to loosen the substrate. At the same time, the lifting module 45 drives the heating table 421 to descend, so that the boss 423 is separated from the substrate. At this time, the Y-axis module 71 (referring to Figure 1) The mounting seat 721 drives the lever 722 to move. After the lever 722 moves the substrate to a specified distance, the lower clamping seat 443 and the upper clamping seat 442 clamp the substrate again, and the boss 423 is also attached to the substrate again, so as to facilitate heating the next position of the substrate to achieve eutectic formation of the next chip and the substrate. Repeat the above steps to sequentially complete eutectic formation of multiple chips and substrates.

[0084] In another preferred embodiment, the eutectic heating mechanism 4 further includes a housing (not shown in the figure). The housing is mounted on the carrier 41, so that a relatively closed chamber is formed between the housing and the carrier 41, which is beneficial to reduce the interference of external factors on the eutectic process on the one hand, and is beneficial to keep the heat in the chamber on the other hand, so as to heat the substrate more evenly. It should be noted that in this embodiment, a corresponding switch door is provided on the housing for the transportation of chips and substrates.

[0085] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A nozzle heating eutectic machine, characterized in that: include: A feeding mechanism (1), used for providing chips; The transfer mechanism (2) comprises a transfer module (21) and a heat adsorption module (22) arranged on the transfer module (21), wherein the transfer module (21) is used to drive the heat adsorption module (22) to approach or move away from the loading mechanism (1), and the heat adsorption module (22) is used to adsorb the chips on the loading mechanism (1) and preheat the chips; A feeding mechanism (3), comprising a feeding module (31) and a preheating module (32), wherein the preheating module (32) is arranged on the feeding module (31), the feeding module (31) is used to provide a substrate, and the preheating module (32) is used to preheat the entire substrate stored on the feeding module (31); A eutectic heating mechanism (4) is arranged between the feeding module (31) and the transfer module (21), and the eutectic heating mechanism (4) is used to heat the substrate and the chip to form a eutectic; The heat adsorption module (22) comprises a vacuum suction nozzle (221) and a heating plate (222) arranged in the vacuum suction nozzle (221); the vacuum suction nozzle (221) is arranged on the transfer module (21); when the transfer module (21) transfers the vacuum suction nozzle (221) and the vacuum suction nozzle (221) adsorbs a chip, the heating plate (222) is used to heat the chip adsorbed by the vacuum suction nozzle (221); The eutectic heating mechanism (4) comprises a carrier frame (41), a heating module (42), a translation module (43) and a clamping module (44); the carrier frame (41) is arranged between the feeding module (31) and the transfer module (21); the heating module (42) and the translation module (43) are respectively arranged on the carrier frame (41); the clamping module (44) is slidably arranged on the carrier frame (41) and is slidably connected to the heating module (42); the clamping module (44) is connected to the translation module (43); when a substrate is clamped by the clamping module (44), the substrate can be bonded to the heating module (42); The invention comprises a material shifting mechanism (7), wherein the material shifting mechanism (7) comprises a Y-axis module (71) and a material shifting module (72) arranged on the Y-axis module (71), wherein the Y-axis module (71) is arranged beside the support frame (41), and the material shifting module (72) comprises a mounting seat (721), a shifting rod (722), a second elastic member (723) and a monitoring member (724), wherein one end of the mounting seat (721) is connected to the Y-axis module (71), and the other end of the mounting seat (721) is connected to the Y-axis module (71). A slot (7211) is provided at one end, one end of the lever (722) is inserted into the slot (7211) and is rotatably connected to the mounting seat (721), the second elastic member (723) is arranged between the lever (722) and the inner wall of the slot (7211), the monitoring member (724) is arranged in the slot (7211) and is electrically connected to the Y-axis module (71), and the monitoring member (724) is used to monitor the state of the second elastic member (723).

2. The nozzle heating eutectic machine according to claim 1, characterized in that: The clamping module (44) comprises a moving seat (441), an upper clamping seat (442), a lower clamping seat (443) and a clamping drive assembly (444); the moving seat (441) is slidably arranged on the supporting frame (41) and connected to the translation module (43); a clearance groove (4411) is provided on the moving seat (441), and the heating module (42) is arranged through the clearance groove (4411); The clamping drive assembly (444) and the upper clamping seat (442) are respectively arranged on the movable seat (441), the lower clamping seat (443) is slidably arranged on the movable seat (441) and is arranged opposite to the upper clamping seat (442), the clamping drive assembly (444) is connected to the lower clamping seat (443), and the clamping drive assembly (444) is used to drive the lower clamping seat (443) to approach or move away from the upper clamping seat (442).

3. The nozzle heating eutectic machine according to claim 2, characterized in that: The clamping drive assembly (444) includes a clamping drive member (4441) and a first elastic member (4442), wherein the clamping drive member (4441) is arranged on the movable seat (441), one end of the first elastic member (4442) is connected to the clamping drive member (4441), and the other end of the first elastic member (4442) is connected to the lower clamping seat (443).

4. The nozzle heating eutectic machine according to claim 1, characterized in that: The eutectic heating mechanism (4) comprises a lifting module (45), the lifting module (45) comprising a lifting drive member (451) and a cam (452), the lifting drive member (451) being arranged on the carrier frame (41), the cam (452) being rotatably connected to the carrier frame (41) and connected to the lifting drive member (451), the cam (452) being in contact with the heating module (42), and the heating module (42) being slidably arranged on the carrier frame (41).

5. The nozzle heating eutectic machine according to claim 1, characterized in that: The heating module (42) comprises a heating platform (421) and a heating tube (422); the heating platform (421) is slidably arranged on the support frame (41); a boss (423) is arranged on the heating platform (421); the boss (423) is used to fit with a substrate; the heating tube (422) is embedded in the heating platform (421); and the heating tube (422) is used to heat the heating platform (421).

6. The nozzle heating eutectic machine according to claim 1, characterized in that: The feeding module (31) comprises a material pushing component (311), a material box (312) and a lifting platform (313); the material pushing component (311) is arranged on a side of the eutectic heating mechanism (4) away from the transfer module (21); the material box (312) is arranged between the material pushing component (311) and the eutectic heating mechanism (4); the lifting platform (313) is arranged in the material box (312); a substrate is placed on the lifting platform (313); the preheating module (32) is arranged in the material box (312); and the preheating module (32) is used to heat the interior of the material box (312).

7. The nozzle heating eutectic machine according to claim 6, characterized in that: At least two material boxes (312) are provided, the number of the lifting platforms (313) and the pre-heating modules (32) is equal to the number of the material boxes (312) and are arranged in one-to-one correspondence, the feeding mechanism (3) comprises an X-axis module (33), the X-axis module (33) is arranged between the pushing assembly (311) and the eutectic heating mechanism (4), and a plurality of the material boxes (312) are respectively arranged on the X-axis modules (33).

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