Semiconductor wafer positioning device

Abstract

The present invention belongs to the field of semiconductor processing technology, and discloses a semiconductor wafer positioning device, including a shell, an outer ring is fixedly installed at the top of the shell, a plurality of guide grooves are equidistantly provided on the circumference of the upper surface of the outer ring, a sliding block is slidably sleeved in the middle of the plurality of guide grooves, and a plurality of adjustment mechanisms are equidistantly provided on the circumference of the outer curved surface of the shell. The driving mechanism fills air between the inner cavity connecting seat and the fixed plate of the shell to push the adsorption mechanism to move upward, and a plurality of pressure valves whose maximum air pressure is equal to the weight of the adsorption mechanism are used to achieve that when the wafer is separated from the clamping positioning device and contacts the carrier sleeve, the plurality of closed pressure valves are opened, and the wafer slowly pushes the adsorption mechanism downward under the action of gravity, thereby solving the problem that in the existing wafer positioning and clamping device, when the wafer is directly placed on the upper surface of the workbench, the wafer has a hard contact with the workbench, causing the wafer to deform and shift the center.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a positioning device for a semiconductor wafer. Background Art

[0002] A semiconductor wafer positioning device is an important device used to accurately position the wafer during the semiconductor manufacturing process. In each link of semiconductor manufacturing, such as photolithography, etching, coating, etc., the wafer needs to be accurately placed in the specified position to ensure the consistency and quality of the process.

[0003] When the existing semiconductor wafer positioning device positions the semiconductor wafer, when the clamping positioning device supporting the bottom of the wafer places the wafer on the surface of a workbench larger than the wafer, in order to avoid the bottom of the clamping positioning device from colliding with the workbench, the clamping positioning device usually releases the wafer in advance above the wafer, causing the wafer to fall down and collide with the workbench, thereby causing slight displacement and deformation. In addition, the existing suction cup clamping positioning device places the wafer on the workbench by adsorbing the processed upper surface of the wafer, which easily causes damage to the processed surface of the wafer, resulting in scratches on the surface, thereby affecting the yield of the semiconductor wafer. In addition, when the existing wafer clamping positioning device places the wafer on the workbench surface, the clamping positioning device applies a downward force to the edge of the wafer, while the workbench applies an upward reaction force to the middle of the wafer, causing the wafer to bend and deform. The existing wafer positioning device only positions the wafer through the clamping positioning device, but cannot determine whether the wafer position is accurate after the wafer is placed on the workbench, which further affects the positioning accuracy and production quality of the wafer. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor wafer positioning device to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor wafer positioning device, comprising a shell, an outer ring is fixedly installed on the top of the shell, a plurality of guide grooves are equidistantly provided on the circumference of the upper surface of the outer ring, a sliding block is slidably sleeved in the middle of the plurality of guide grooves, a plurality of adjustment mechanisms are equidistantly provided on the circumference of the outer curved surface of the shell, the adjustment mechanism comprises two guide plates, the two guide plates are symmetrically fixedly installed on the outer curved surface of the shell, a first driving member is fixedly installed on the bottom ends of the two guide plates, a threaded rod is fixedly installed on the output end of the first driving member, a threaded block is threadedly connected to the middle of the threaded rod, and the threaded block is slidably sleeved in the middle of the two guide plates, An elastic part is fixedly installed on the top of the threaded block, and a push block is fixedly installed on the top of the elastic part. The push block is slidably sleeved in the middle of two guide plates, and a movable seat is fixedly installed in the front of the guide plate. A bent rod is movably sleeved in the middle of the movable seat, and the bent rod is movably sleeved with the bottom of an adjacent sliding block. A limiting rod is fixedly installed on one side of the threaded block, and a limiting block is fixedly installed on the top of the limiting rod. A resistor is fixedly installed on the other side of the threaded block, and a contact is fixedly installed on the other side of the push block. The resistor is slidably sleeved with the contact, and a base is fixedly sleeved on the bottom of the inner curved surface of the shell, a driving mechanism is provided on the upper part of the base, and an adsorption mechanism is provided on the upper part of the inner cavity of the shell.

[0006] Preferably, the driving mechanism includes a second driving member, which is fixedly mounted on the middle part of the upper surface of the base, a cross shaft is fixedly mounted on the output end of the second driving member, a cross sleeve is slidably sleeved on the outer side surface of the cross shaft, a fixed plate is fixedly sleeved on the bottom of the inner cavity of the shell, the cross sleeve is movably sleeved on the middle part of the fixed plate, a sliding sleeve is fixedly mounted on the upper surface of the fixed plate, a plurality of pressure valves are fixedly sleeved equidistantly on the middle circumference of the fixed plate, an air pump is fixedly mounted on one side of the upper surface of the second driving member, a conduit is fixedly mounted on the output end of the air pump, and the top of the conduit is fixedly sleeved on the fixed plate.

[0007] Preferably, the adsorption mechanism includes a connecting seat, the connecting seat is fixedly mounted on the top of a cross sleeve, the cross sleeve is slidably sleeved with the inner curved surface of the outer shell, a carrier sleeve is fixedly mounted on the upper surface of the connecting seat, the connecting seat is slidably sleeved with the inner curved surface of the outer shell, a plurality of suction holes are equidistantly provided on the circumference of the upper surface of the carrier sleeve, a telescopic rod is fixedly mounted on the middle of the upper surface of the connecting seat, an elastic seat is fixedly mounted on the telescopic end of the telescopic rod, an elastic member is fixedly mounted on the top of the elastic seat, a piston is fixedly mounted on the top of the elastic member, and the piston is slidably sleeved with the inner cavity of the carrier sleeve.

[0008] Preferably, the contact surface between the guide groove and the sliding block is a smooth surface, and the contact point and the bottom end of the resistor are connected in series with the first driving member in the same circuit.

[0009] Preferably, the upper surface of the sliding sleeve is a smooth surface, the gas flow direction of the pressure valve is downward, and the air pressure that can be withstood by the closed multiple pressure valves is equal to the weight of the adsorption mechanism.

[0010] Preferably, the object carrier is slidably sleeved with the inner curved surface of the outer shell, the contact surface between the connecting seat and the outer shell is a smooth surface, and the upper surface of the object carrier is provided with a rough and uniform wear-resistant coating.

[0011] The beneficial effects of the present invention are as follows:

[0012] 1. The driving mechanism of the present invention fills air between the connecting seat and the fixing plate in the inner cavity of the shell to push the adsorption mechanism to move upward, and multiple pressure valves that bear an air pressure equal to the weight of the adsorption mechanism are used to achieve that when the wafer is separated from the clamping and positioning device and contacts the carrier sleeve, the multiple closed pressure valves are opened, and the wafer slowly pushes the adsorption mechanism to move downward under the action of gravity, thereby overcoming the problem that when the existing clamping and positioning device supporting the bottom of the wafer is placed on the surface of a workbench whose size is larger than the wafer, in order to avoid the bottom of the clamping and positioning device from colliding with the workbench, the clamping and positioning device releases the wafer above the wafer in advance, causing the wafer to fall downward and collide with the workbench, resulting in slight displacement and deformation of the wafer.

[0013] 2. At the same time, the problem of the existing suction cup clamping and positioning device causing damage to the wafer processing surface by adsorbing the upper surface of the wafer to place the wafer on the workbench is avoided. By providing a downward-moving carrier sleeve, the reverse supporting force of the carrier sleeve on the middle of the wafer is reduced at the moment when the clamping and positioning device drives the wafer to contact the upper surface of the carrier sleeve. This overcomes the problem that when the existing wafer clamping and positioning device places the wafer on the workbench surface, the clamping and positioning device applies a downward force to the edge of the wafer, and the workbench wafer applies an upward reaction force to the middle of the wafer, causing the wafer to bend.

[0014] 3. The present invention starts the driving mechanism, which drives the adsorption mechanism to rotate, and the adsorption mechanism drives the adsorbed wafer to rotate. When the center of the wafer overlaps with the center line of the carrier sleeve, the wafer located on the upper surface of the carrier sleeve does not slide to one side. When the center of the wafer deviates from the center line direction of the carrier sleeve, the wafer located on the upper surface of the carrier sleeve deviates under the action of centrifugal force, thereby realizing the inspection of the wafer position placed on the carrier sleeve by the clamping and positioning device, overcoming the problem that the existing wafer positioning device only positions the wafer by the clamping and positioning device, but cannot judge whether the wafer position is accurate after the wafer is placed on the workbench. In addition, by increasing the rotation speed of the second driving member, increasing the centrifugal force of the wafer on the upper surface of the carrier sleeve and reducing the suction force of the adsorption mechanism on the wafer, the wafer is more easily centrifugally deviated, and the wafer position detection accuracy is adjusted. Otherwise, the detection accuracy is reduced, so that the wafer positioning accuracy matches the actual processing accuracy of different processes, thereby improving production efficiency. At the same time, the deviated wafer is adjusted by multiple positioning mechanisms to realize the repositioning of the wafer with center deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall appearance structure of the present invention;

[0016] Figure 2 It is a schematic diagram of the structure of the positioning mechanism of the present invention;

[0017] Figure 3 It is a schematic diagram of the structure of the adsorption mechanism of the present invention;

[0018] Figure 4 This is a schematic diagram of the outer ring structure of the present invention;

[0019] Figure 5 Schematic diagram of the resistor structure of the present invention.

[0020] In the figure: 1. shell; 101. base; 2. outer ring; 201. guide groove; 202. sliding block; 3. adjustment mechanism; 301. guide plate; 302. first driving member; 303. threaded rod; 304. threaded block; 305. elastic member; 306. push block; 307. movable seat; 308. curved rod; 309. limit rod; 310. limit block; 311. resistor; 312. contact; 4. driving mechanism; 401. second driving member; 402. cross shaft; 403. cross sleeve; 404. fixed plate; 405. sliding sleeve; 406. pressure valve; 407. air pump; 408. catheter; 5. adsorption mechanism; 501. connecting seat; 502. carrying sleeve; 503. telescopic rod; 504. elastic seat; 505. elastic member; 506. piston. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] like Figures 1 to 5As shown, an embodiment of the present invention provides a semiconductor wafer positioning device, comprising a housing 1, an outer ring 2 is fixedly mounted on the top of the housing 1, a plurality of guide grooves 201 are equidistantly arranged on the upper surface of the outer ring 2, a sliding block 202 is slidably sleeved in the middle of the plurality of guide grooves 201, and the contact surface between the guide groove 201 and the sliding block 202 is a smooth surface, so as to reduce the friction resistance between the upper surface of the sliding block 202 and the guide groove 201 when the sliding block 202 moves away from the object carrier 502 and pushes the push block 306 to move downward through the curved rod 308 and the movable seat 307, thereby reducing the hard collision force when the wafer collides with the sliding block 202, avoiding deformation of the wafer, and reducing the friction resistance between the push block 306 and the upper surface of the sliding block 202. When the sliding block 202 is pulled by the movable seat 307 and the curved rod 308 to move away from the object carrier 502, the friction resistance between the bottom surface of the sliding block 202 and the guide groove 201 reduces the load when the first driving member 302 pulls the sliding block 202 to move away from the object carrier 502 and resets. A plurality of adjustment mechanisms 3 are equidistantly arranged on the outer curved surface circumference of the housing 1. The adjustment mechanism 3 includes two guide plates 301, which are symmetrically fixedly mounted on the outer curved surface of the housing 1. The first driving member 302 is fixedly mounted on the bottom ends of the two guide plates 301. The output end of the first driving member 302 is fixedly mounted with a threaded rod 303. The middle part of the threaded rod 303 is threadedly connected with a threaded block 304. The threaded block 304 slides The threaded block 304 is movably sleeved in the middle of the two guide plates 301, an elastic member 305 is fixedly installed on the top of the threaded block 304, a push block 306 is fixedly installed on the top of the elastic member 305, and the push block 306 is slidably sleeved in the middle of the two guide plates 301. A movable seat 307 is fixedly installed in front of the guide plate 301, and a bent rod 308 is movably sleeved in the middle of the movable seat 307. The bent rod 308 is movably sleeved with the bottom of the adjacent sliding block 202. A limiting rod 309 is fixedly installed on one side of the threaded block 304, and a limiting block 310 is fixedly installed on the top of the limiting rod 309. By setting the limiting rod 309 and the limiting block 310, the maximum distance between the push block 306 and the threaded block 304 is limited to avoid the elastic member 305 being compressed. Excessive rebound causes the sliding block 202 to push the wafer toward the center line of the carrier sleeve 502 and move too much, causing the center of the wafer to deviate to the other side of the center line of the carrier sleeve 502. A resistor 311 is fixedly installed on the other side of the threaded block 304, and a contact 312 is fixedly installed on the other side of the push block 306. The resistor 311 and the contact 312 are slidably sleeved, and the bottom ends of the contact 312 and the resistor 311 are connected in series with the first driving member 302 in the same circuit, so as to adjust the rotation speed of the first driving member 302 according to the change of the resistance between the contact 312 and the resistor 311. The bottom of the inner curved surface of the outer shell 1 is fixedly sleeved with a base 101, and a driving mechanism 4 is provided on the upper part of the base 101, and an adsorption mechanism 5 is provided on the upper part of the inner cavity of the outer shell 1.

[0023] like Figure 3As shown, the driving mechanism 4 includes a second driving member 401, which is fixedly mounted on the middle part of the upper surface of the base 101, and a cross shaft 402 is fixedly mounted on the output end of the second driving member 401, and a cross sleeve 403 is slidably sleeved on the outer side of the cross shaft 402, and a fixed plate 404 is fixedly sleeved on the bottom of the inner cavity of the shell 1, and the cross sleeve 403 is movably sleeved on the middle part of the fixed plate 404, and a sliding sleeve 405 is fixedly mounted on the upper surface of the fixed plate 404, and the upper surface of the sliding sleeve 405 is a smooth surface, so as to reduce the friction resistance between the connecting seat 501 and the sliding sleeve 405 when the sliding sleeve 405 supports the rotating adsorption mechanism 5, thereby reducing the load of the second driving member 401, and a plurality of pressure valves 406 are fixedly sleeved equidistantly on the middle circumference of the fixed plate 404, and the gas flow direction of the pressure valve 406 is downward, The air pressure that the multiple pressure valves 406 can withstand is equal to the weight of the adsorption mechanism 5, so that when the air pump 407 inflates air between the inner cavity fixing plate 404 of the shell 1 and the connecting seat 501 through the conduit 408, the air between the inner cavity fixing plate 404 of the shell 1 and the connecting seat 501 pushes the adsorption mechanism 5 to move upward. When a wafer is placed on the top of the adsorption mechanism 5, the weight of the wafer pushes the adsorption mechanism 5 to move downward, so that the closed pressure valve 406 valve is opened, thereby reducing the moment when the clamping and positioning device drives the wafer to contact the upper surface of the carrier sleeve 502, and the reaction force of the carrier sleeve 502 on the middle part of the wafer, thereby avoiding bending and deformation of the wafer. An air pump 407 is fixedly installed on one side of the upper surface of the second driving member 401, and a conduit 408 is fixedly installed on the output end of the air pump 407. The top of the conduit 408 is fixedly connected with the fixing plate 404.

[0024] like Figures 1 to 3As shown, the adsorption mechanism 5 includes a connecting seat 501, which is fixedly mounted on the top of the cross sleeve 403, and the cross sleeve 403 is slidably sleeved with the inner curved surface of the shell 1. A carrier sleeve 502 is fixedly mounted on the upper surface of the connecting seat 501, and the connecting seat 501 is slidably sleeved with the inner curved surface of the shell 1. A plurality of groups of suction holes are equidistantly arranged on the circumference of the upper surface of the carrier sleeve 502, and the carrier sleeve 502 is slidably sleeved with the inner curved surface of the shell 1. The contact surface between the connecting seat 501 and the shell 1 is a smooth surface, thereby improving the air tightness between the carrier sleeve 502 and the shell 1, and preventing the air between the inner cavity fixing plate 404 of the shell 1 and the connecting seat 501 from passing through the carrier sleeve 502 and the shell 1, the upper surface of the carrier cover 502 is provided with a rough and uniform wear-resistant coating, so as to prevent the bottom surface of the wafer from sliding along the upper surface of the carrier cover 502 for a long time, and the friction between the carrier cover 502 and the wafer is reduced, resulting in the subsequent inability of the carrier cover 502 to drive the wafer to rotate, causing the device to fail to work effectively, a telescopic rod 503 is fixedly installed in the middle of the upper surface of the connecting seat 501, and an elastic seat 504 is fixedly installed at the telescopic end of the telescopic rod 503, and an elastic member 505 is fixedly installed on the top of the elastic member 504, and a piston 506 is fixedly installed on the top of the elastic member 505, and the piston 506 is slidably sleeved with the inner cavity of the carrier cover 502.

[0025] Working principle:

[0026] When the present invention is used, the air pump 407 is started, and the air pump 407 inhales air. The air absorbed by the air pump 407 flows into the space between the inner cavity fixing plate 404 of the housing 1 and the connecting seat 501 through the conduit 408. The air flowing into the space between the inner cavity fixing plate 404 of the housing 1 and the connecting seat 501 pushes the connecting seat 501 to move upward, and the connecting seat 501 pushes the object carrier 502 to move upward and extend out of the upper surface of the outer ring 2. At the same time, the object carrier 502 drives the cross sleeve 403 to slide upward along the middle of the fixing plate 404 and the side of the cross shaft 402 until the object carrier 50 2 until two-thirds of the wafer is extended. At this time, the air pump 407 is powered off, and then the external wafer clamping and positioning device drives the wafer to move downward from the top of the carrier 502. When the bottom surface of the wafer contacts the upper surface of the carrier 502, the clamping and positioning device quickly moves downward and opens to separate from the wafer. At this time, the air pressure that can be borne by the multiple pressure valves 406 is equal to the weight of the adsorption mechanism 5. Therefore, when the wafer is separated from the clamping and positioning device and contacts the carrier 502, the multiple closed pressure valves 406 open, and the wafer is slowly pushed under the action of gravity. The suction mechanism 5 moves downward until the carrier sleeve 502 drives the wafer to contact the top surface of the outer ring 2. At this time, the connecting seat 501 contacts the sliding sleeve 405, and the suction mechanism 5 stops moving downward, thereby overcoming the problem that when the clamping and positioning device of the existing wafer bottom is placed on the surface of a workbench larger than the wafer, in order to avoid the bottom of the clamping and positioning device from colliding with the workbench, the clamping and positioning device releases the wafer above the wafer in advance, causing the wafer to fall downward and collide with the workbench, resulting in slight displacement and deformation of the wafer. At the same time, the problem of damaging the processed surface of the wafer by adsorbing the processed upper surface of the wafer and placing it on the workbench is avoided. By setting the downwardly movable carrier 502, the reaction force of the carrier 502 on the middle of the wafer is reduced when the clamping and positioning device drives the wafer to contact the upper surface of the carrier 502, thereby overcoming the problem that when the existing wafer clamping and positioning device places the wafer on the workbench surface, the clamping and positioning device applies a downward force to the edge of the wafer, and the workbench wafer applies an upward reaction force to the middle of the wafer, resulting in the bending change of the wafer.

[0027] In addition, when the wafer placed on the upper surface of the carrier 502 and moving downward contacts the upper surface of the outer ring 2 and stops moving, the telescopic rod 503 is started, and the telescopic end of the telescopic rod 503 drives the elastic seat 504 to move downward, the elastic seat 504 drives the elastic member 505 to move downward, and the elastic member 505 drives the piston 506 to move downward. At this time, a negative pressure state is formed between the wafer placed on the upper surface of the carrier 502 and the upper part of the piston 506 in the inner cavity of the carrier 502, and the atmospheric pressure presses the wafer and the upper surface of the carrier 502. The surfaces are closely fitted, and as the telescopic end of the telescopic rod 503 moves downward, the stretching length of the elastic member 505 increases, and the friction resistance between the wafer and the carrier sleeve 502 continues to increase. Then the second driving member 401 is started, and the output end of the second driving member 401 drives the cross shaft 402 to rotate, the cross shaft 402 drives the cross sleeve 403 to rotate, the cross sleeve 403 drives the connecting seat 501 to rotate, the connecting seat 501 drives the carrier sleeve 502 to rotate, and the carrier sleeve 502 drives the wafer to rotate. At this time, when the center of the wafer is aligned with the carrier sleeve 502, When the center lines of the sample sleeve 502 overlap, the wafer on the upper surface of the sample sleeve 502 does not slide to one side. When the center of the wafer deviates from the center line direction of the sample sleeve 502, the wafer on the upper surface of the sample sleeve 502 deviates under the action of centrifugal force, thereby realizing the inspection of the wafer position placed on the sample sleeve 502 by the clamping and positioning device, overcoming the problem that the existing wafer positioning device only positions the wafer by the clamping and positioning device, but cannot judge whether the wafer position is accurate after the wafer is placed on the workbench. In addition, the present invention can increase the centrifugal force of the wafer on the upper surface of the sample sleeve 502 by increasing the rotation speed of the second driving member 401, and reduce the downward moving distance of the telescopic end of the telescopic rod 503, reduce the telescopic length of the elastic member 505, reduce the friction resistance between the wafer and the sample sleeve 502, make the wafer easier to deviate centrifugally, adjust the wafer position detection accuracy, and vice versa reduce the detection accuracy, so that the wafer positioning accuracy matches the actual processing accuracy of different processes, and improve production efficiency;

[0028] In addition, when the center of the wafer of the present invention deviates from the center line of the carrier sleeve 502, the rotating wafer deviates under the action of centrifugal force. At this time, the deviated wafer contacts the sliding block 202, and the wafer pushes the sliding block 202 to move away from the side of the carrier sleeve 502. The sliding block 202 pushes the push block 306 to move downward through the curved rod 308 and the movable seat 307. The push block 306 squeezes the telescopic rod 503 to shrink. At this time, the distance between the push block 306 and the threaded block 304 is reduced. When the center of the wafer deviates from the center line of the carrier sleeve 502, the greater the squeezing force on the sliding block 202 on one side, the greater the shrinkage of the telescopic rod 503, and the smaller the distance between the push block 306 and the threaded block 304. At this time, the contact 312 is electrically connected to the contact point 312. The smaller the distance to the bottom of the resistor 311, the smaller the resistance between the contact 312 and the resistor 311, the faster the output end of the first driving member 302 rotates, the faster the output end of the first driving member 302 rotates, the greater the distance that the output end of the first driving member 302 pushes the threaded block 304 upward through the threaded rod 303, and the greater the distance that the threaded block 304 pushes the sliding block 202 to move toward the carrier sleeve 502 through the elastic member 305, the push block 306, the movable seat 307 and the curved rod 308, thereby realizing that the sliding block 202 pushes the center of the wafer toward the center line of the carrier sleeve 502 according to the deviation angle and amplitude of the wafer center until the wafer stops deviating, thereby realizing the repositioning of the wafer with center deviation.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer positioning device, comprising a housing (1), characterized in that: An outer ring (2) is fixedly mounted on the top of the housing (1); a plurality of guide grooves (201) are equidistantly formed on the upper surface of the outer ring (2); a sliding block (202) is slidably sleeved in the middle of each of the plurality of guide grooves (201); a plurality of positioning mechanisms (3) are equidistantly formed on the outer curved surface of the housing (1); the positioning mechanism (3) comprises two guide plates (301); the two guide plates (301) are symmetrically fixedly mounted on the outer curved surface of the housing (1); a first driving member (302) is fixedly mounted on the bottom ends of the two guide plates (301); a threaded rod (303) is fixedly mounted on the output end of the first driving member (302); the middle portion of the threaded rod (303) is threadedly connected to the outer curved surface. A threaded block (304) is provided, the threaded block (304) is slidably sleeved in the middle of the two guide plates (301), an elastic member (305) is fixedly installed on the top of the threaded block (304), a push block (306) is fixedly installed on the top of the elastic member (305), the push block (306) is slidably sleeved in the middle of the two guide plates (301), a movable seat (307) is fixedly installed in front of the guide plate (301), a bent rod (308) is movably sleeved in the middle of the movable seat (307), the bent rod (308) is movably sleeved with the bottom of the adjacent sliding block (202), a limiting rod (309) is fixedly installed on one side of the threaded block (304), and the limiting rod (309) A limit block (310) is fixedly mounted on the top of the threaded block (304), a resistor (311) is fixedly mounted on the other side of the threaded block (304), a contact (312) is fixedly mounted on the other side of the push block (306), the resistor (311) and the contact (312) are slidably sleeved, a base (101) is fixedly sleeved on the bottom of the inner curved surface of the housing (1), a driving mechanism (4) is provided on the upper part of the base (101), and an adsorption mechanism (5) is provided on the upper part of the inner cavity of the housing (1); the driving mechanism (4) comprises a second driving member (401), the second driving member (401) is fixedly mounted on the middle part of the upper surface of the base (101), and the output end of the second driving member (401) is fixedly mounted on the output end of the second driving member (401). A cross shaft (402) is provided, a cross sleeve (403) is slidably sleeved on the outer side surface of the cross shaft (402), a fixed plate (404) is fixedly sleeved on the bottom of the inner cavity of the housing (1), the cross sleeve (403) is movably sleeved on the middle part of the fixed plate (404), a sliding sleeve (405) is fixedly installed on the upper surface of the fixed plate (404), a plurality of pressure valves (406) are fixedly sleeved at equal intervals on the middle part of the fixed plate (404), an air pump (407) is fixedly installed on one side of the upper surface of the second driving member (401), a conduit (408) is fixedly installed on the output end of the air pump (407), and the top of the conduit (408) is fixedly sleeved on the fixed plate (404);The upper surface of the sliding sleeve (405) is a smooth surface, the gas flow direction of the pressure valve (406) is downward, and the gas pressure that the multiple pressure valves (406) can withstand is equal to the weight of the adsorption mechanism (5). ; 2. A semiconductor wafer positioning device according to claim 1, characterized in that: The adsorption mechanism (5) comprises a connecting seat (501), the connecting seat (501) being fixedly mounted on the top end of a cross sleeve (403), the cross sleeve (403) being slidably sleeved with the inner curved surface of the outer shell (1), a carrier sleeve (502) being fixedly mounted on the upper surface of the connecting seat (501), the connecting seat (501) being slidably sleeved with the inner curved surface of the outer shell (1), a plurality of groups of suction holes being equidistantly arranged on the upper surface of the carrier sleeve (502), a telescopic rod (503) being fixedly mounted on the middle part of the upper surface of the connecting seat (501), an elastic seat (504) being fixedly mounted on the telescopic end of the telescopic rod (503), an elastic member (505) being fixedly mounted on the top end of the elastic member (505), a piston (506) being fixedly mounted on the top end of the elastic member (505), and the piston (506) being slidably sleeved with the inner cavity of the carrier sleeve (502).

3. A semiconductor wafer positioning device according to claim 1, characterized in that: The contact surface between the guide groove (201) and the sliding block (202) is a smooth surface, and the bottom end of the contact point (312) and the resistor (311) are connected in series with the first driving member (302) in the same circuit.

4. A semiconductor wafer positioning device according to claim 2, characterized in that: The object carrier sleeve (502) is slidably sleeved with the inner curved surface of the outer shell (1); the contact surface between the connecting seat (501) and the outer shell (1) is a smooth surface; and the upper surface of the object carrier sleeve (502) is provided with a rough and uniform wear-resistant coating.

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