Power supply link detection and sampling sub-circuit, power signal detection circuit and system

Abstract

The invention discloses a power supply link detection and sampling sub-circuit, a power signal detection circuit and a power signal detection system, and relates to the technical field of server board-level power supply design, a fuse device and a first temperature-sensitive device are arranged in a superposed manner, and the layout space required by the fuse device and the first temperature-sensitive device is reduced; the current detection of the power supply link is realized by using the conduction resistor of the safety device, and a power sampling resistor does not need to be connected in series, so that the occupation of a layout space can be further reduced, the layout space of a circuit board can be further optimized, the through-current loss of the power supply link can be reduced, and the low-loss detection of the power supply link can be realized. Therefore, the problems of how to optimize the layout space of the circuit board and reduce the loss of the power supply link and the like in related technologies can be solved, and the technical effects of optimizing the layout space of the circuit board, reducing the through-current loss of the power supply link and the like are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of server board-level power supply design, and in particular to a power supply link detection and sampling subcircuit, a power signal detection circuit and a system. Background Art

[0002] For servers, especially large servers, fuses and temperature-sensitive devices are usually installed on the circuit boards inside the servers to protect the power supply safety. At the same time, the power supply link of the circuit boards inside the servers needs to be detected to obtain power supply status information, such as current, and the power supply of the circuit boards is adjusted according to the current and other information of the power supply link to optimize the energy efficiency of the server.

[0003] In the related art, a power sampling resistor is usually connected in series after the fuse device on the power supply link to obtain the power supply status information through the power sampling resistor. However, a large number of fuse devices, temperature-sensitive devices and power sampling resistors are usually required on the circuit board, which not only requires a lot of space to meet the design requirements of the circuit board, but also a large number of power sampling resistors will cause higher power supply link losses. Summary of the invention

[0004] The present invention provides a power supply link detection and sampling subcircuit, a power signal detection circuit and a system, so as to at least solve the problems of the related art such as how to optimize the layout space of the circuit board and reduce the loss of the power supply link.

[0005] The present invention provides a power supply link detection subcircuit, comprising: a fuse device and a first temperature-sensitive device superimposed on a circuit board, wherein the first temperature-sensitive device detects the temperature of the fuse device, and the temperature of the fuse device is used to correct the on-resistance of the fuse device. When the power supply link of the circuit board is connected in series with the on-resistance, the ratio of the voltage to the resistance across the on-resistance is the current of the power supply link.

[0006] The present invention also provides a power supply link sampling subcircuit, comprising: a combination switch and a sampling component, wherein the combination switch is respectively connected to multiple sampling points and sampling components on the above-mentioned power supply link detection subcircuit, the combination switch controls access to different sampling points, and the sampling component samples the temperature of the fuse device and the voltage and current of the power supply link.

[0007] The present invention also provides a power signal detection circuit, comprising: the above-mentioned power supply link detection subcircuit; the above-mentioned power supply link sampling subcircuit, which collects the temperature of the fuse device in the power supply link detection subcircuit, and collects the voltage and current of the power supply link based on the power supply link detection subcircuit; a control subcircuit, which corrects the on-resistance of the fuse device according to the temperature of the fuse device, and generates a power signal according to the voltage and current of the power supply link.

[0008] The present invention also provides a power supply system, comprising the above-mentioned power signal detection circuit.

[0009] The present invention also provides an electronic device, comprising the above power supply system.

[0010] The present invention also provides a current detection method, which performs current detection based on the above-mentioned power supply link detection subcircuit, wherein the method includes the following steps: obtaining the temperature of the fuse device; correcting the on-resistance of the fuse device according to the temperature of the fuse device, so that the corrected on-resistance of the fuse device is in linear proportion to the temperature of the fuse device; controlling the fuse device to be in an on state, so that the power supply link of the circuit board is connected in series with the on-resistance, and determining the current of the power supply link according to the voltage and resistance value at both ends of the on-resistance; and realizing current detection of the power supply link of the circuit board by using the on-resistance of the fuse device.

[0011] The present invention also provides a data sampling method, which samples the data of the power supply link based on the above-mentioned power supply link sampling subcircuit, wherein the method includes the following steps: controlling the combination switch of the power supply link sampling subcircuit to connect to different sampling points respectively, wherein the combination switch forms different detection channels when connected to different sampling points; using the sampling component of the power supply link sampling subcircuit to sample multiple data including the temperature of the circuit board, the temperature of the fuse device, and the voltage and current of the power supply link under different detection channels.

[0012] The present invention also provides a power signal detection method, which detects the power signal of the power supply link based on the above-mentioned power signal detection circuit, wherein the method includes the following steps: controlling the power signal detection circuit to switch multiple detection channels, wherein the multiple detection channels are used to detect the temperature of the circuit board, the temperature of the fuse device, and the voltage and current of the power supply link; correcting the on-resistance of the fuse device according to the temperature of the fuse device, so that the corrected on-resistance of the fuse device is linearly proportional to the temperature of the fuse device; correcting the current of the power supply link according to the temperature of the circuit board; and generating a power signal according to the voltage and the corrected current of the power supply link.

[0013] The present invention also provides a computer-readable storage medium on which a computer program or instruction is stored. When the computer program or instruction is executed, the above-mentioned current detection method, or data sampling method, or power signal detection method is implemented.

[0014] The present invention also provides a computer program product, including a computer program or instructions, which, when executed, implements the above-mentioned current detection method, or data sampling method, or power signal detection method.

[0015] Through the present invention, since the fuse device and the first temperature-sensitive device are arranged in a superimposed manner, the layout space required for the fuse device and the first temperature-sensitive device is reduced; the on-resistance of the fuse device is used to realize the current detection of the power supply link, and there is no need to connect a power sampling resistor in series, which can not only further reduce the occupation of the layout space and further optimize the layout space of the circuit board, but also reduce the current loss of the power supply link, and realize low-loss detection of the power supply link; in addition, the on-resistance is corrected based on the temperature of the fuse device to improve the temperature drift linearity of the on-resistance, and effectively improve the detection accuracy. Therefore, it is possible to solve the problems of how to optimize the layout space of the circuit board and reduce the loss of the power supply link in the related technology, and achieve the technical effects of optimizing the layout space of the circuit board, reducing the current loss of the power supply link, and effectively improving the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a block diagram of a power signal detection circuit in the related art; Figure 2 is a circuit diagram of a power signal detection circuit in the related art; Figure 3 is a block diagram of a power supply link detection subcircuit in an embodiment of the present invention; Figure 4 A layout diagram of a fuse device and a first temperature-sensitive device in one embodiment of the present invention; Figure 5 is a block diagram of a power signal detection circuit in one embodiment of the present invention; Figure 6 is a temperature drift curve diagram of the on-resistance of a semiconductor device in one embodiment of the present invention; Figure 7 is a circuit diagram of a power signal detection circuit in one embodiment of the present invention; Figure 8 is a block diagram of a power supply link sampling subcircuit in an embodiment of the present invention; Fig. 9 is a block diagram of a power signal detection circuit in an embodiment of the present invention; Fig.10 is a schematic flow chart of a current detection method in an embodiment of the present invention; Fig.11 is a flow chart of a data sampling method in an embodiment of the present invention; Fig.12Schematic diagram of a power signal detection method in an embodiment of the present invention; Fig.13 The figure is a flow chart of a power signal detection method in one embodiment of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the present invention.

[0019] It should be noted that, in the description of the present invention, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present invention are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0020] For the server, the related technology adopts Figure 1 The structure shown realizes the detection of the power supply link to obtain information such as voltage, current, and power. Figure 1 As shown, the power signal detection circuit includes eFuse (electrical insurance), power sampling resistor, device temperature detection circuit, voltage detection circuit, current detection circuit, substrate temperature detection circuit and management system. The management system includes integrated control devices such as MCU (Microcontroller Unit), CPLD (Complex Programmable Logic Device), BMC (Baseboard Management Controller), etc. Specifically: The eFuse is connected in series with the power sampling resistor to realize the protection, timing control and sampling of the power supply link. The device temperature detection circuit detects the device temperature of the eFuse, the voltage detection circuit monitors the supply voltage of the power supply link, the current detection circuit monitors the supply current of the power supply link, and the substrate temperature detection circuit detects the circuit board temperature. The management system triggers protection according to the device temperature monitored by the temperature detection circuit, triggers compensation of the supply current according to the circuit board temperature, and realizes power signal detection according to the supply voltage and supply current.

[0021] However, in the related technology, there are usually a large number of eFuses and power detection-related circuits on the server circuit board, which requires a lot of space to meet the design. However, the server board-level design space is limited, which is very contradictory for the design. It is difficult to strike a balance between achieving complete and comprehensive power supply monitoring management and improving power level business density.

[0022] Furthermore, if Figure 2 As shown, the eFuse is composed of MOSFET, eFuse control, TVS D11, Schottky diode D12, input capacitor C11 and output capacitor C12; the sampling resistor unit is composed of power sampling resistors R10, C13, and C14; the device temperature detection circuit is composed of analog integrated device OPA (Operational Amplifier, analog integrated device) U21A and resistors R21-R23, and thermistor RT20; the voltage detection circuit is composed of OPA U11A, resistor R11 and resistor R12; the current detection circuit is composed of OPA U11B and resistors R13-R16, and the substrate temperature detection circuit is composed of OPA U21B, resistors R24-R26, and thermistor RT30; the management system is composed of digital integrated circuits with ADC interfaces such as MCU / CPLD. Among them, Figure 2 The numbers 1-8 represent the pin numbers of the corresponding devices.

[0023] eFuse uses MOSFET and controller (i.e. Figure 2 Even the eFuse with integrated MOSFET occupies a large area in the board-level power supply design. In addition, power management generally adopts the series connection of power sampling resistors in the power supply link to achieve high-precision current sampling, which causes the eFuse and power detection circuit to occupy a larger area, making the server motherboard design difficult. At the same time, the series connection of power sampling resistors in the power supply link is accompanied by unnecessary power loss.

[0024] also, Figure 2 As shown, the sampling detection circuit occupies 4 OPAs, resulting in a large number of sampling detection circuits in the overall motherboard design, which are generally located near the eFuse and power detection circuits. However, the management system is relatively centralized, resulting in a long distance between the OPA and the ADC of the management system, which inevitably introduces interference during the transmission of the analog signal after OPA sampling, affecting the sampling accuracy.

[0025] In order to solve the problems existing in the related technology, the embodiments of the present invention propose a power supply link detection and sampling sub-circuit, a power signal detection circuit and a system, which can effectively reduce the area occupied by circuit devices and alleviate the pressure of mainboard layout and wiring; it can also accurately detect the power supply status of the power supply link and reduce the loss of the power supply link, thereby making the communication equipment using this technology, such as servers, switches, etc., more in line with the design trend of green and energy-saving.

[0026] The following will describe the power supply link detection and sampling subcircuit, the power signal detection circuit and the system with reference to the accompanying drawings. Specifically, Figure 3 A schematic diagram of the structure of a power supply link detection subcircuit provided in an embodiment of the present invention.

[0027] like Figure 3 As shown, the power supply link detection subcircuit 10 includes: a circuit board 101 , a fuse device 102 and a first temperature-sensitive device 103 .

[0028] Among them, a fuse device 102 and a first temperature-sensitive device 103 are superimposed on the circuit board 101, wherein the first temperature-sensitive device 103 detects the temperature of the fuse device 102, and the temperature of the fuse device 102 is used to correct the on-resistance of the fuse device 102. When the power supply link of the circuit board 101 is connected in series with the on-resistance, the ratio of the voltage to the resistance across the on-resistance is the current of the power supply link.

[0029] The circuit board 101 refers to the mainboard of an electronic device, such as a server and a client. For example, the server is the mainboard of the server. The fuse device 102 may be an eFuse, which may be an eFuse with an integrated MOSFET or an eFuse composed of a controller and a MOSFET discrete device. The eFuse is a non-volatile memory device based on electron injection and thermal effects, which is used to protect circuits, store information, and realize multiple functions. It generates heat through short current pulses to blow the fuse and form a permanent open circuit, thereby realizing circuit protection or information storage. It is a programmable electronic fuse that can be used in integrated circuits and electronic systems. The types of programming may include one-time programming and programmable.

[0030] The first temperature-sensitive device 103 can be a temperature-sensitive resistor NTC (Negative Temperature Coefficient, thermistor) or PTC (Positive Temperature Coefficient, a material or element with a positive temperature coefficient), a thermistor or a transistor, etc., which can be used for temperature compensation or a combination thereof. NTC thermistor is a semiconductor resistor element with a negative temperature coefficient, and its resistance value will significantly decrease with the increase of temperature. PTC is a semiconductor material with a positive temperature coefficient, usually based on barium titanate and doped with other metal oxides (such as niobium, bismuth, antimony, etc.). When the temperature exceeds a certain critical value (Curie temperature), its resistance value will rise sharply, showing a clear step characteristic.

[0031] It should be noted that the on-resistance can be expressed as RDSon, which refers to the resistance value between the two ends of an electronic component when it is on. It is a parameter that measures the degree of resistance to current when the component is on, and is usually used to describe the performance of switching devices such as diodes, transistors, MOSFETs, relays, etc. Taking the application in MOSFET as an example, the on-resistance is the resistance value between the drain and the source. When the MOSFET is fully turned on, the smaller the resistance value, the lower the conduction loss of the MOSFET (Metal-Oxide-SemiconductorField-EffectTransistor). MOSFETs with low on-resistance are suitable for high current applications such as power management, motor drive, etc.

[0032] It can be understood that the embodiment of the present invention arranges the fuse device 102 and the first temperature-sensitive device 103 in a superimposed manner, thereby reducing the layout space required for the fuse device 102 and the first temperature-sensitive device 103 to optimize the layout space of the circuit board 101; the on-resistance of the fuse device 102 is used to realize current detection of the power supply link, without the need to connect a power sampling resistor in series, which can not only further reduce the occupation of the layout space and further optimize the layout space of the circuit board 101, but also reduce the current loss of the power supply link, and realize low-loss detection of the power supply link; in addition, the on-resistance is corrected based on the temperature of the fuse device 102 to improve the temperature drift linearity of the on-resistance, thereby effectively improving the detection accuracy.

[0033] In some embodiments, the fuse device 102 and the first temperature-sensitive device 103 are disposed on the same side of the circuit board, or the fuse device 102 and the first temperature-sensitive device 103 are disposed on two sides of the circuit board, respectively.

[0034] It can be understood that, in the embodiment of the present invention, the fuse device 102 and the first temperature-sensitive device 103 can be arranged on the same side of the circuit board, or the fuse device 102 and the first temperature-sensitive device 103 can be arranged on both sides of the circuit board respectively. Specifically, the fuse device 102 is placed on the top surface of the circuit board 101, and the first temperature-sensitive device 103 is placed on the bottom surface of the circuit board 101, and needs to be arranged below the fuse device 102. The first temperature-sensitive device 103 is used to sense the influence of the junction temperature change of the fuse device 102 on the on-resistance of the fuse device 102, which can provide a basis for fine-tuning the on-resistance.

[0035] As an example, Figure 4 As shown, the fuse device 102 and the first temperature-sensitive device 103 are respectively arranged on both sides of the circuit board. The first temperature-sensitive device 103 can be arranged directly below the fuse device 102, so that the first temperature-sensitive device 103 can sense more area of ​​the fuse device 102, so as to fully sense the influence of the junction temperature change of the fuse device 102 on the on-resistance of the fuse device 102, thereby improving the accuracy of temperature perception.

[0036] In some embodiments, Figure 5 As shown, the fuse device 102 and the first temperature-sensitive device 103 are connected in parallel, and the parallel-connected fuse device 102 and the first temperature-sensitive device 103 are connected to the input port and the output port of the power supply link. Figure 1 A power sampling resistor is provided in the embodiment of the present invention. The on-resistance is used to realize current detection, so there is no need to provide a power sampling resistor. Figure 5 In the structure shown, no power sampling resistor is provided, thereby reducing the space occupied by the power sampling resistor when laid flat on the circuit board 101 and reducing the current loss caused by the power sampling resistor.

[0037] In some embodiments, the fuse device 102 may include a semiconductor device and a controller, wherein one end of the first temperature-sensitive device 103 is connected to the drain of the semiconductor device, and the other end of the first temperature-sensitive device 103 is connected to the source of the semiconductor device.

[0038] Among them, semiconductor devices include transistors and MOSFETs. In the embodiment of the present invention, MOSFET is taken as an example. The basic structure of MOSFET includes three main terminals: gate, source and drain, and its working principle is based on the control of the conductive channel by the gate voltage.

[0039] It can be understood that the fuse device 102 of the embodiment of the present invention includes a semiconductor device and a controller, and the two ends of the first temperature-sensitive device 103 are respectively connected to the drain and source of the semiconductor device in the fuse device 102 to form a parallel relationship.

[0040] In some embodiments, the corrected on-resistance of the fuse device 102 is linearly proportional to the temperature of the fuse device 102 .

[0041] It should be noted that the on-resistance usually has a positive temperature coefficient, that is, as the temperature rises, the on-resistance will increase. However, the temperature drift phenomenon of the on-resistance usually exists. The main reasons are: Reduced carrier mobility: When the temperature rises, the atomic vibration in the semiconductor lattice intensifies, resulting in increased scattering of electrons and holes, thereby reducing the mobility of carriers. Increased channel resistance: Due to the reduction in carrier mobility, the resistance in the channel will increase significantly, resulting in an increase in on-resistance.

[0042] When the on-resistance has a temperature drift phenomenon, the temperature drift curve between the on-resistance and the temperature is nonlinear, which results in the inability to accurately compensate the detected current through the linear compensation algorithm during current detection, thereby reducing the accuracy of current detection. Therefore, the embodiment of the present invention aims to present a linear proportional relationship between the on-resistance and the temperature, and compensates for the temperature drift of the on-resistance of the fuse device 102, so that the corrected on-resistance of the fuse device 102 presents a linear proportional relationship with the temperature of the fuse device 102, so as to improve the accuracy of current detection.

[0043] like Figure 6 As shown, the solid line is the temperature drift curve, and the dotted line is the linear straight line. Comparison of the two shows that the temperature drift curve of the on-resistance is nonlinear. In order to reduce the difficulty of designing a linear compensation algorithm, the embodiment of the present invention can use a first temperature-sensitive device 103 connected to the source and drain of the semiconductor device, and connected in parallel with the on-resistance, and use the temperature of the first temperature-sensitive device 103 to correct the resistance value of the on-resistance, so that the on-resistance and the temperature are in linear proportional relationship.

[0044] Therefore, the embodiment of the present invention uses the impedance of the on-resistance to perform current sampling, and connects the first temperature-sensitive device 103 with a large resistance in parallel with it, corrects the linearity of the on-resistance to simplify the linear compensation algorithm, and realizes high-precision current sampling of the power supply link, thereby eliminating the need to connect a power sampling resistor in series. This can not only further reduce the layout space occupied and further optimize the layout space of the circuit board 101, but also reduce the current loss of the power supply link, and realize low-loss detection of the power supply link, thereby effectively simplifying the circuit structure, effectively reducing the difficulty of designing the linear compensation algorithm, and realizing high-precision current compensation through the linear compensation algorithm, thereby improving the accuracy of current detection.

[0045] In some embodiments, a first capacitor and a first diode are connected in parallel to an input port of the power supply link, and a second capacitor and a second diode are connected in parallel to an output port of the power supply link.

[0046] Among them, the first capacitor is an input capacitor, the second capacitor is an output capacitor, the first capacitor and the second capacitor are preferably ceramic capacitors or a series-parallel combination of ceramic capacitors, including but not limited to ceramic capacitors, tantalum capacitors, electrolytic capacitors and other capacitive devices or their combination forms; the second diode is a Schottky diode.

[0047] Specifically, Figure 7 The numbers 1-5 in the table represent the pin numbers. Figure 7 As shown, pin 1 of the semiconductor device U0 is the drain, pin 2 is the source, and pin 3 is the gate, the first capacitor C1 and the first diode D1 are connected in parallel, the second capacitor C2 and the second diode D2 are connected in parallel, pin 1 of the first capacitor C1 and the first diode D1 are respectively connected to pin 1 of the semiconductor device U0, pin 1 of the second capacitor C2 and the second diode D2 are respectively connected to pin 2 of the semiconductor device U0, and pin 2 of the first capacitor C1, the first diode D1, the second capacitor C2, and the second diode D2 are respectively grounded.

[0048] According to the power supply link detection sub-circuit proposed in the embodiment of the present invention, the fuse device and the first temperature-sensitive device are arranged in a superimposed manner to reduce the layout space required for the fuse device and the first temperature-sensitive device, so as to optimize the layout space of the circuit board; the on-resistance of the fuse device is used to realize the current detection of the power supply link, and there is no need to connect a power sampling resistor in series, which can not only further reduce the occupation of the layout space and further optimize the layout space of the circuit board, but also reduce the current loss of the power supply link, and realize low-loss detection of the power supply link; in addition, based on the influence of the junction temperature change sensed by the first temperature-sensitive device on the on-resistance, the temperature drift curve between the on-resistance and the temperature is corrected, so that the on-resistance and the temperature show a linear proportional relationship, thereby improving the accuracy of current sampling and realizing high-precision sampling.

[0049] Next, the power supply link sampling sub-circuit proposed according to the embodiment of the present invention is described with reference to the accompanying drawings.

[0050] Figure 8 4 is a schematic diagram of the structure of a power supply link sampling subcircuit according to an embodiment of the present invention.

[0051] like Figure 8 As shown, the power supply link sampling subcircuit 20 includes: a combination switch 201 and a sampling component 202 .

[0052] The combination switch 201 is respectively connected to the multiple sampling points and the sampling component 202 on the power supply link detection subcircuit 10, the combination switch 201 controls the access to different sampling points, and the sampling component 202 samples the temperature of the fuse 102 and the voltage and current of the power supply link.

[0053] In some embodiments, the power link sampling subcircuit 20 may include a combination switch 201 and a sampling component 202, wherein the combination switch 201 is respectively connected to multiple sampling points of the power link detection subcircuit 10 and the sampling component 202, and the combination switch 201 controls the sampling component to access different sampling points to achieve sampling of the temperature of the fuse device 102 and the voltage and current of the power link.

[0054] It can be understood that the power supply link sampling subcircuit 20 of the embodiment of the present invention controls the on / off of the sampling component 202 and multiple sampling points of the power supply link detection subcircuit 10 through the combination switch 201, thereby realizing separate sampling of different sampling points and separate sampling of the temperature of the fuse device 102 and the voltage and current of the power supply link.

[0055] In some embodiments, Figure 7 As shown, the multiple sampling points include first to third sampling points, the first sampling point is set between one end of the first temperature-sensitive device 103 and the drain of the semiconductor device, the second sampling point is set between one end of the first temperature-sensitive device 103 and the source of the semiconductor device, and the third sampling point is set on the ground line of the power supply link detection sub-circuit 10.

[0056] In some embodiments, Figure 7 As shown, the combined switch includes a first switch S1 and a second switch S2, the second end b of the first switch S1 is connected to the first sampling point, the second end b of the second switch S2 is connected to the second sampling point, and the first end a of the second switch S2 is connected to the third sampling point.

[0057] Among them, both the first switch and the second switch can be single-pole double-throw electronic switches, which are controlled by the control subcircuit; when the first switch is opened to the second end b and the second switch is opened to the first end a, the voltage of the power supply link can be sampled; when the first switch and the second switch are opened to the second end b at the same time, the current of the power supply link can be detected; when the first switch and the second switch are opened to the first end a at the same time, the temperature of the fuse device 102 can be detected.

[0058] It should be noted that the first switch and the second switch are single-pole double-throw electronic switches, and the combination of the two is a controllable gating switch, which is controlled by a periodic or cyclic control signal from the control subcircuit.

[0059] It can be understood that the embodiment of the present invention can use the control subcircuit to control the first switch and the second switch through the above-mentioned connection method, thereby controlling the on and off of multiple sampling points of the sampling component and the power supply link detection subcircuit 10, so as to achieve sampling of the temperature of the fuse device 102 and the voltage and current of the power supply link.

[0060] In the embodiment of the present invention, Figure 7As shown, the sampling component 202 includes first to fourth resistors, third to fifth capacitors and an analog integrated device. The first end of the analog integrated device U1 is connected to the control subcircuit through the digital interface circuit, one end of the third capacitor C3 is grounded, one end of the first resistor R1 is connected to the third end of the second switch S2, the other end of the first resistor R1 is respectively connected to the other end of the third capacitor C3, one end of the fourth capacitor C4, one end of the third resistor R3 and the second end of the analog integrated device U1, the other end of the third resistor R3 is connected to the first end of the analog integrated device U1, one end of the second resistor R2 is connected to the third end of the first switch S1, the other end of the second resistor R2 is respectively connected to the other end of the fourth capacitor C4, one end of the fifth capacitor C5, one end of the fourth resistor R4 and the third end of the analog integrated device U1, the other end of the fifth capacitor C5 is grounded, the fourth resistor R4 and the fourth end of the analog integrated device U1 are grounded, and the fifth end of the analog integrated device U1 is connected to the reference voltage Vcc.

[0061] Among them, analog integrated devices refer to miniaturized electronic devices that integrate multiple analog electronic components and circuits on the same chip, which are used to process continuously changing analog signals, such as operational amplifiers. Taking operational amplifiers as an example, operational amplifiers are used in various electronic circuits such as signal processing, amplification, filtering, and comparison. They are differential amplifiers with high gain, high input impedance and low output impedance.

[0062] It should be noted that Figure 7 The numbers 1-5 in the figure represent pin numbers. One end of the first resistor R1 is pin 1 of the first resistor R1, and the other end of the first resistor R1 is pin 2 of the first resistor R1. The second to fourth resistors R2-R4 are the same, one end is pin 1 of the resistor, and the other end is pin 2 of the resistor; the first end of the analog integrated device U1 is pin 1 of the analog integrated device U1, the second end of the analog integrated device U1 is pin 2 of the analog integrated device U1, the third end of the analog integrated device U1 is pin 3 of the analog integrated device U1, and the fourth end of the analog integrated device U1 is pin 4 of the analog integrated device U1. The analog integrated device includes but is not limited to being composed of discrete devices or integrated chips; one end of the third capacitor C3 is pin 1 of the third capacitor C3, and the other end of the third capacitor C3 is pin 2 of the third capacitor C3. The fourth capacitor C4 and the fifth capacitor C5 are the same, one end is pin 1 of the capacitor, and the other end is pin 2 of the capacitor; the third ends of the first switch S1 and the second switch S2 are their respective c pins.

[0063] Therefore, compared with Figure 2As for the related technologies shown, the embodiments of the present invention integrate the current, voltage and temperature detection circuits together into a single-channel detection circuit to realize the power supply monitoring and management of the whole machine, thereby effectively reducing the number of analog integrated devices occupied, reducing the structural complexity of the circuit board, and further optimizing the space of the circuit board; the single-channel detection circuit is a sampling component, and the sampling component uses an integrated manner to realize multiple sampling functions, and transmits them to the control subcircuit through a digital interface to realize the power supply monitoring and management of the whole machine. Therefore, the sampling function of the present invention is concentrated, and data transmission can be realized through a signal channel, which simplifies the circuit structure and improves the sampling accuracy.

[0064] As an example, the first to fourth resistors can be high-precision resistors, which are resistor elements that can provide extremely high precision and stability, with extremely small resistance error, usually in the range of 0.01% to 1%. Such resistors ensure that their resistance is close to the nominal value through strict control of materials and manufacturing processes, and have low temperature coefficients, low noise, and excellent long-term stability. The first resistor has the same resistance value as the second resistor, and the third resistor has the same resistance value as the fourth resistor.

[0065] The first resistor and the second resistor are input resistors. Input resistor refers to the equivalent resistance seen from the input end of an amplifier circuit or analog integrated circuit. It is an indicator of the circuit's ability to draw current from a signal source. The larger the input resistance, the smaller the current the circuit draws from the signal source, and the less the signal source voltage attenuation, resulting in higher signal transmission efficiency. The third resistor is a negative feedback resistor. A negative feedback resistor is a resistor element used to introduce negative feedback in an electronic circuit. By feeding back a portion of the circuit's output signal to the input end in the opposite phase, the negative feedback resistor can significantly improve the performance of the amplifier circuit. The fourth resistor is a matching resistor. A matching resistor is an electronic component used to optimize signal transmission and circuit performance. By adjusting the impedance in the circuit, the impedance between the signal source and the load is optimally matched, thereby reducing signal reflection, attenuation, and distortion.

[0066] As an example, the third capacitor and the fifth capacitor are common-mode capacitors for filtering common-mode noise, and the fourth capacitor can be a differential-mode capacitor for filtering differential-mode noise. The third capacitor and the fifth capacitor have the same capacitance and are symmetrically arranged and wired near the corresponding pins of the analog integrated device in the circuit board 101. The fourth capacitor is placed near the corresponding pins of the analog integrated device in the circuit board 101 and between the third capacitor and the fifth capacitor. The analog integrated device is differentially input, and the analog integrated device outputs the voltage form of the processed input signal.

[0067] Common-mode capacitors are capacitors used to improve the performance of common-mode interference in circuits. They are usually connected across the primary and secondary sides of the module. Their main function is to bypass the common-mode noise to the ground, thereby reducing the interference of noise on other electrical appliances. The working principle of common-mode capacitors is to use the low impedance characteristics of capacitors to high-frequency signals to short-circuit high-frequency common-mode interference signals to the ground, while having almost no effect on low-frequency signals or DC signals. This characteristic makes it particularly important in electromagnetic compatibility design, which can effectively suppress common-mode interference and improve the system's anti-interference ability.

[0068] Differential mode capacitors are capacitor components used to suppress differential mode interference. Differential mode interference refers to high-frequency noise that exists between power lines or signal lines, and is characterized by current flowing between two wires in opposite directions. The main function of differential mode capacitors is to provide a low-impedance path for differential mode interference signals, thereby bypassing high-frequency noise to the other end of the power line and reducing its interference with the circuit.

[0069] In the embodiment of the present invention, the power link sampling subcircuit 20 also samples the temperature of the circuit board 101 .

[0070] It is understandable that the embodiments of the present invention can compensate for the detected current by designing a linear compensation algorithm, the input of which is the temperature of the circuit board and the current of the power supply link, and the accuracy of current detection can be improved by correction. The linear compensation algorithm is a method for correcting the nonlinear characteristics of a measurement or control system through a mathematical model or hardware circuit to improve the accuracy and stability of the system. The embodiments of the present invention can pre-establish a linear compensation relationship between the circuit board temperature and the current, and implement current correction through the linear compensation relationship of the linear compensation algorithm, thereby achieving high-precision current detection.

[0071] In an embodiment of the present invention, the power link sampling subcircuit 20 also includes a fifth resistor and a second temperature-sensitive device, wherein one end of the fifth resistor is connected to the reference voltage, the other end of the fifth resistor and one end of the second temperature-sensitive device are connected to the first end of the first switch, and the other end of the second temperature-sensitive device is grounded.

[0072] Among them, the fifth resistor is a high-precision resistor; the second temperature-sensitive device includes but is not limited to PTC, NTC and other devices that can be used for temperature sensing sampling, and needs to have good linearity within the detected temperature range and be easy to compensate by a simple algorithm, which is not specifically limited here; the second temperature-sensitive device is used to monitor the temperature of the circuit board 101 near the semiconductor device in the fuse device 102, and the control subcircuit can perform simple algorithm compensation by monitoring the temperature to compensate for the deviation of the on-resistance of the fuse device 102 caused by the temperature change of the circuit board 101, thereby improving the accuracy of the power supply link current detection.

[0073] It can be understood that the embodiment of the present invention can sample the temperature of the circuit board 101 through the fifth resistor and the second temperature-sensitive device, and use the temperature to compensate for the on-resistance drift of the fuse device 102 caused by the temperature change, so that the corrected on-resistance is linearly proportional to the temperature of the fuse device 102, and the control subcircuit corrects the current of the power supply link according to the temperature of the circuit board 101, thereby improving the accuracy of the power supply link current detection.

[0074] According to the power supply link sampling sub-circuit proposed in the embodiment of the present invention, the current, voltage and temperature detection circuits are integrated together to form a single-channel detection circuit. The sampling function is concentrated, and data transmission can be achieved through a signal channel, which effectively reduces the number of analog integrated devices occupied and reduces the structural complexity of the circuit board. In this way, multiple sampling functions are realized in an integrated manner, the circuit structure is simplified, and the transmission of sampled data is realized by using a digital interface circuit, which improves the anti-interference ability of data transmission and further improves the accuracy of data sampling.

[0075] The embodiment of the present invention can combine the power supply link detection subcircuit with the power supply link sampling subcircuit, and use the on-resistance of the fuse device to realize the current detection of the power supply link, without the need for a series power sampling resistor, and integrate multiple sampling functions at the same time, reduce the number of analog integrated devices occupied, thereby reducing the layout space occupied by abandoning the series power sampling resistor and multiple analog integrated devices, and further optimize the layout space of the circuit board; in addition, the correction of the linearity of the on-resistance and the use of the digital interface circuit can effectively improve the sampling accuracy. Therefore, the embodiment of the present invention can combine the power supply link detection subcircuit with the power supply link sampling subcircuit, improve the layout rationality of the circuit board and reduce the complexity of the circuit structure, reduce the number of devices in the circuit, and reduce the cost and the loss of the power supply link, and realize high-precision data sampling with low link loss self-compensation.

[0076] Fig. 9 is a schematic diagram of the structure of a power signal detection circuit 30 according to an embodiment of the present invention.

[0077] like Fig. 9 As shown, the power signal detection circuit 30 includes: a power supply link detection subcircuit 10 , a power supply link sampling subcircuit 20 and a control subcircuit 301 .

[0078] Among them, the temperature of the fuse device 102 in the power supply link detection subcircuit 10 is collected based on the power supply link sampling subcircuit 20, and the voltage and current of the power supply link are collected based on the power supply link detection subcircuit 10; the control subcircuit 301 corrects the on-resistance of the fuse device according to the temperature of the fuse device, and generates a power signal according to the voltage and current of the power supply link.

[0079] Specifically, the control subcircuit 301 is a programmable device, including but not limited to MCU, CPLD, BMC, etc., which can receive and process system signal information such as voltage, current, temperature, etc., and restore the power supply current of each power supply link through a linear compensation algorithm. The software program it carries analyzes and processes the acquired voltage, current and other information for system monitoring and control management.

[0080] It can be understood that the embodiment of the present invention is based on the power supply link detection subcircuit 10 provided in the above embodiment to realize the current detection of the power supply link. Since the on-resistance of the fuse device can be used to realize the current detection of the power supply link, there is no need to connect a power sampling resistor in series, which can not only reduce the occupation of the layout space and optimize the layout space of the circuit board, but also reduce the current loss of the power supply link, and realize low-loss detection of the power supply link. At the same time, the on-resistance of the fuse device is corrected by temperature to improve the temperature drift linearity of the on-resistance. When the on-resistance and the crystallization temperature of the semiconductor device in the fuse device show a linear proportional relationship, the design difficulty of the linear compensation algorithm can be reduced, and the accuracy of current compensation can be improved to realize high-precision current detection. Therefore, the embodiment of the present invention can further realize high-precision detection of power signals on the basis of high-precision current detection, and effectively improve the detection accuracy of power signals of the power supply link.

[0081] In the embodiment of the present invention, the power supply link sampling subcircuit 20 samples the temperature of the circuit board, and the control subcircuit 301 corrects the current of the power supply link according to the temperature of the circuit board.

[0082] Specifically, the embodiment of the present invention can sample the temperature of the circuit board through the power supply link sampling sub-circuit 20, and use the temperature to compensate and correct the on-resistance drift of the fuse device caused by the temperature change, so that the corrected on-resistance and the temperature of the fuse device are in a linear proportional relationship. The control sub-circuit 301 corrects the current of the power supply link according to the temperature of the circuit board, thereby improving the accuracy of the power supply link current detection.

[0083] In some embodiments, Figure 5 As shown, the power link sampling subcircuit 20 is connected to the control subcircuit 301 through a digital interface circuit. Specifically, the power link detection subcircuit 10 is connected to the power link sampling subcircuit 20, and the power link sampling subcircuit 20 is connected to the control subcircuit 301 through a digital interface circuit. The control subcircuit 301 can be designed as a management system in actual application, and the management system can include integrated control devices such as MCU, CPLD and BMC.

[0084] It should be noted that the digital interface circuit is the physical channel between the analog integrated device U1 and the control sub-circuit, complies with communication bus protocols including but not limited to I2C, PMBus, CAN, etc., has the functions of quantizing analog signals, processing them into digital signals and storing them, and can transmit the processed digital signals to the control sub-circuit through a predetermined communication protocol interface.

[0085] Therefore, the sampling function of the present invention is concentrated, data transmission can be achieved through a signal channel, and the analog signal obtained by sampling is converted into a digital signal through a digital interface before transmission, which enhances the anti-interference ability during signal transmission and improves the sampling accuracy.

[0086] According to the power signal detection circuit proposed in the embodiment of the present invention, the temperature of the fuse device in the power supply link detection subcircuit is collected through the power supply link sampling subcircuit, and the voltage and current of the power supply link are collected based on the power supply link detection subcircuit; then, the control subcircuit is used to correct the on-resistance of the fuse device according to the temperature of the fuse device, and the on-resistance of the fuse device is used to realize the current detection of the power supply link of the circuit board, and the power signal is generated according to the voltage and current of the power supply link, so as to realize low link loss current detection, effectively reduce the board area occupied by the fuse device and the power sampling circuit, realize the restoration of the power supply link current information through linear algorithm compensation, obtain high-precision current signal, and also obtain the power supply link voltage and each power link hot spot temperature signal.

[0087] The embodiment of the present invention further provides a power supply system, including the above-mentioned power signal detection circuit. It should be noted that the power supply system of the embodiment of the present invention can be a power supply system that requires low-loss and high-precision power management, and the power signal detection circuit in the above-mentioned embodiment can be applied to achieve high-precision power detection. At the same time, the structure of the power signal detection circuit is more concise, so it can also effectively reduce the circuit structure of the power supply system and reduce the device cost of the power supply system.

[0088] The embodiment of the present invention also provides an electronic device, including the above-mentioned power supply system. It should be noted that the electronic device may include storage devices and communication devices, such as servers and switches, so the power supply system of the embodiment of the present invention can be arranged on a device that requires low-loss and high-precision power management. Since the structural complexity of the power signal detection circuit is low, low-cost and high-precision power signal detection can be achieved. Therefore, the electronic device using the power supply device of the above embodiment also has corresponding advantages.

[0089] The embodiment of the present invention further provides a current detection method, which performs current detection based on the power supply link detection subcircuit 10. Fig.10 As shown, the method comprises the following steps: In step S401, the temperature of the fuse device is obtained.

[0090] In step S402 , the on-resistance of the fuse device is corrected according to the temperature of the fuse device, so that the corrected on-resistance of the fuse device is in linear proportion to the temperature of the fuse device.

[0091] It can be understood that the embodiment of the present invention can compensate for the nonlinear temperature drift of the on-resistance in the fuse device through the temperature sampled by the first temperature-sensitive device, improve the linearity of the on-resistance temperature drift, lay the foundation for its linear compensation, and effectively reduce the difficulty of designing the linear compensation algorithm. Then, high-precision current compensation is achieved through the linear compensation algorithm, thereby improving the accuracy of current detection and achieving high-precision current detection.

[0092] In step S403, the fuse device is controlled to be in a conducting state, so that the power supply link of the circuit board is connected in series with the conduction resistor, and the current of the power supply link is determined according to the voltage and resistance value across the conduction resistor.

[0093] It can be understood that the embodiment of the present invention determines the current of the power supply link through the corrected on-resistance value and the voltage across the on-resistance. The method is simple, and the current value obtained through correction has higher accuracy.

[0094] In step S404, the current detection of the power supply link of the circuit board is implemented by using the on-resistance of the fuse device.

[0095] It can be understood that the embodiment of the present invention corrects the on-resistance of the fuse device to ensure the accuracy of current measurement, executes a linear compensation algorithm, adjusts the on-resistance of the fuse device according to the temperature information provided by the temperature-sensitive device, and finally calculates the accurate power supply link current.

[0096] It should be noted that the above explanation of the power supply link detection sub-circuit embodiment is also applicable to the current detection method of the power supply link of this embodiment, and will not be repeated here.

[0097] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method.

[0098] According to the current detection method of the power supply link proposed in the embodiment of the present invention, the temperature of the fuse device is first obtained, the on-resistance of the fuse device is corrected according to the temperature of the fuse device, and the current of the power supply link is determined by the corrected on-resistance value and the voltage across the on-resistance, so as to realize the current detection of the power supply link of the circuit board. The method is simple, and the current value obtained according to the correction has higher accuracy. Through this method, the board area is reduced, the current loss is reduced, and the accuracy of detecting the power supply status of the power supply link is improved.

[0099] The embodiment of the present invention further provides a data sampling method, which samples the data of the power supply link based on the power supply link sampling subcircuit 20 mentioned above. Fig.11 As shown, the method comprises the following steps: In step S501, the combination switches of the power supply link sampling subcircuit 20 are controlled to be connected to different sampling points respectively, wherein the combination switches constitute different detection channels when connected to different sampling points.

[0100] The detection channels include a detection channel for the voltage of the power supply link, a detection channel for the current of the power supply link, and a detection channel for the temperature of the fuse device.

[0101] In step S502, the sampling components of the power link sampling subcircuit 20 are used to sample multiple data including the temperature of the circuit board, the temperature of the fuse, and the voltage and current of the power link under different detection channels.

[0102] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method.

[0103] According to the data sampling method proposed in the embodiment of the present invention, the embodiment of the present invention controls the combination switch of the power supply link sampling subcircuit 20 to access different sampling points respectively, switches the detection channel of the power supply link voltage, the detection channel of the power supply link current and the detection channel of the fuse device temperature, and then uses the sampling component of the power supply link sampling subcircuit 20 to sample multiple data of the temperature of the circuit board, the temperature of the fuse device, and the voltage and current of the power supply link under different detection channels, so as to realize data sampling.

[0104] The embodiment of the present invention further provides a power signal detection method, which is based on the power signal detection circuit 30 sampling the data of the power supply link, such as Fig.12 As shown, the method comprises the following steps: In step S601 , the power supply link sampling subcircuit 20 is controlled to switch a plurality of detection channels, wherein the plurality of detection channels are used to detect the temperature of the circuit board, the temperature of the fuse device, and the voltage and current of the power supply link.

[0105] Among them, the embodiment of the present invention controls the power supply link sampling subcircuit 20 to switch multiple detection channels through the control subcircuit of the power signal detection circuit 30, so as to detect the temperature of the circuit board, the temperature of the fuse device, and the voltage and current of the power supply link.

[0106] In step S602 , the on-resistance of the fuse device is corrected according to the temperature of the fuse device, so that the corrected on-resistance of the fuse device is in linear proportion to the temperature of the fuse device.

[0107] It can be understood that in order to prevent the on-resistance of the fuse device from changing with the temperature and affecting the accuracy of measuring current, the embodiment of the present invention corrects the on-resistance of the fuse device according to the temperature of the fuse device, and uses the on-resistance of the fuse device to realize current detection of the power supply link of the circuit board.

[0108] In step S603, the current of the power supply link is corrected according to the temperature of the circuit board.

[0109] It is understandable that changes in the temperature of the circuit board will also cause changes in the on-resistance of the fuse device, affecting the accuracy of the measured current. Therefore, if the current detection channel is used to detect the temperature of the circuit board, the current of the power supply link is corrected according to the temperature of the circuit board to ensure that a high-precision current signal is obtained.

[0110] In some embodiments, before correcting the current of the power supply link according to the temperature of the circuit board, it also includes: testing the circuit board while maintaining a linear proportional relationship between the on-resistance of the fuse device and the temperature of the fuse device, and obtaining test data of the circuit board; performing data cleaning on the test data, identifying temperature data and current data in the cleaned data, and generating a corresponding relationship curve between the temperature and current of the power supply link according to the temperature data and the current data; determining a linear compensation relationship of a linear compensation algorithm according to the corresponding relationship curve, and correcting the current of the power supply link through the linear compensation relationship of the linear compensation algorithm and the temperature of the circuit board.

[0111] It can be understood that, based on the above-mentioned multiple embodiments, the embodiment of the present invention can adopt a first temperature-sensitive device connected to the source and drain of the semiconductor device, connected in parallel with the on-resistance, and use the temperature of the first temperature-sensitive device to correct the resistance value of the on-resistance, so that the on-resistance and temperature are in a linear proportional relationship. While maintaining the on-resistance of the fuse device and the temperature of the fuse device in a linear proportional relationship, in order to improve the accuracy of current detection, the embodiment of the present invention designs a linear compensation algorithm, and calibrates the linear compensation relationship of the linear compensation algorithm through multiple tests. During the calibration process, the test data is pre-processed by data cleaning, and the wrong, repeated, inconsistent or incomplete data is removed through data cleaning, thereby improving the quality of the data. Multiple tests ensure the reliability of the calibration results, thereby completing the design of the linear compensation algorithm. In actual use, the linear compensation algorithm is used to accurately compensate the current.

[0112] Therefore, the embodiment of the present invention can improve the current detection accuracy of the power supply link through the combination of linear correction of the on-resistance and the linear compensation algorithm. When the on-resistance is in linear proportion to the temperature of the fuse device, the design difficulty of the linear compensation algorithm is reduced. The linear compensation relationship of the linear compensation algorithm can be accurately determined through test calibration, thereby improving the accuracy of current compensation.

[0113] In step S604, a power signal is generated according to the voltage of the power supply link and the corrected current.

[0114] It can be understood that the embodiment of the present invention can obtain the voltage of the power supply link and the current of the power supply link with high precision through the above method, and the control subcircuit can generate a power signal through these precise signals and report it for dynamic power distribution management of the whole machine power supply.

[0115] It should be noted that the above explanation of the embodiment of the power signal detection circuit is also applicable to the power signal detection method of this embodiment, which will not be described in detail here.

[0116] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method.

[0117] According to the power signal detection method proposed in the embodiment of the present invention, multiple channels for detecting the temperature of the fuse device, the voltage and current of the power supply link are switched, the on-resistance of the fuse device is corrected according to the temperature of the fuse device, and at the same time, the current of the power supply link is corrected according to the temperature of the circuit board. The on-resistance of the fuse device is used to realize the current detection of the power supply link of the circuit board, and finally a power signal is generated according to the voltage and current of the power supply link. Through this method, the current loss is reduced and the accuracy of detecting the power supply status of the power supply link is improved.

[0118] The power signal detection method will be further described below. Fig.13 As shown, the process includes the following steps: Step S701, the circuit on the circuit board is powered on, each functional unit is stably powered, the initialization in the control subcircuit is completed, and various detection mechanisms are used to determine whether the power supply system is working normally. If it is working normally, step S702 is executed; Step S702, the control subcircuit controls the first switch S1 and the second switch S2 to open in direction a or b, and obtains a voltage signal, a current signal, and a temperature signal of the power supply link; Step S703, the acquired voltage signal, current signal, and temperature signal are linearly amplified and converted by the analog integrated device U1, and the detected voltage signal Vs is output; Step S704, the voltage signal Vs is digitized by the digital interface circuit to form a digital signal that complies with a predetermined communication protocol and is stored at a predetermined address; Step S705, the digital signal is called by the control sub-circuit according to a predetermined communication protocol, that is, the digital signal is transmitted to the MCU / CPLD of the control sub-circuit; Step S706, the control subcircuit compensates VIin through Vin and VTb according to the linear compensation algorithm verified by the experiment to obtain accurate Iin data, that is, to achieve high-precision power supply link current sampling; Step S707, the control subcircuit monitors each power supply trunk and branch through Vin, VTb, Iin, etc., and predicts the power supply power Pin according to the business volume; Step S708: The control subcircuit reports the monitoring information and the prediction information to the upper-level management unit for dynamic power distribution management of the whole machine power supply.

[0119] In summary, the embodiments of the present invention realize low link loss current detection and synchronously realize self-compensation of the on-resistance linearity of semiconductor devices, effectively reducing the board area occupied by fuse devices and power sampling circuits, alleviating the design pressure of motherboard layout and wiring, and reducing the current loss of the system power supply link; at the same time, the power supply link current information is restored through linear algorithm compensation to obtain high-precision current signals, and the power supply link voltage and each power link hotspot temperature signal are also obtained, laying the foundation for the power supply management of the whole machine.

[0120] An embodiment of the present invention further provides a computer-readable storage medium having a computer program or instruction stored thereon. When the computer program or instruction is executed, the above-mentioned current detection method, or data sampling method, or power signal detection method is implemented.

[0121] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0122] An embodiment of the present invention further provides a computer program product, including a computer program or instructions, which, when executed, implements the above-mentioned current detection method, or data sampling method, or power signal detection method.

[0123] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0124] The above is a detailed introduction to a power supply link detection subcircuit, a power signal detection circuit and a power supply system provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A power supply link detection subcircuit, characterized in that: include: A fuse device and a first temperature-sensitive device are stacked on the circuit board, wherein: The first temperature-sensitive device detects the temperature of the fuse device, and the temperature of the fuse device is used to correct the on-resistance of the fuse device. When the power supply link of the circuit board is connected in series with the on-resistance, the ratio of the voltage to the resistance across the on-resistance is the current of the power supply link.

2. The power supply link detection subcircuit according to claim 1, characterized in that: The corrected on-resistance of the fuse device is linearly proportional to the temperature of the fuse device.

3. The power supply link detection subcircuit according to claim 1, characterized in that: The fuse device and the first temperature-sensitive device are connected in parallel, and the parallel-connected fuse device and the first temperature-sensitive device are connected to an input port and an output port of the power supply link.

4. The power supply link detection subcircuit according to claim 1, characterized in that: The fuse device includes a semiconductor device and a controller, wherein one end of the first temperature-sensitive device is connected to the drain of the semiconductor device, and the other end of the first temperature-sensitive device is connected to the source of the semiconductor device.

5. The power supply link detection subcircuit according to claim 1, characterized in that: The input port of the power supply link is connected in parallel with a first capacitor and a first diode, and the output port of the power supply link is connected in parallel with a second capacitor and a second diode.

6. A power supply link sampling subcircuit, characterized in that: include: A combination switch and a sampling component, wherein the combination switch is respectively connected to a plurality of sampling points on the power supply link detection subcircuit according to any one of claims 1 to 5 and the sampling component, the combination switch controls access to different sampling points, and the sampling component samples the temperature of the fuse device and the voltage and current of the power supply link.

7. The power supply link sampling subcircuit according to claim 6, characterized in that: The multiple sampling points include first to third sampling points, the first sampling point is set between one end of the first temperature-sensitive device and the drain of the semiconductor device, the second sampling point is set between one end of the first temperature-sensitive device and the source of the semiconductor device, and the third sampling point is set on the ground line of the power supply link detection sub-circuit.

8. The power supply link sampling subcircuit according to claim 7, characterized in that: The combined switch includes a first switch and a second switch, wherein the second end of the first switch is connected to the first sampling point, the second end of the second switch is connected to the second sampling point, and the first end of the second switch is connected to the third sampling point.

9. The power supply link sampling subcircuit according to claim 8, characterized in that: The sampling component includes first to fourth resistors, third to fifth capacitors and an analog integrated device, wherein a first end of the analog integrated device is connected to a digital interface circuit, one end of the third capacitor is grounded, one end of the first resistor is connected to a third end of a second switch, the other end of the first resistor is respectively connected to the other end of the third capacitor, one end of the fourth capacitor, one end of the third resistor and a second end of the analog integrated device, the other end of the third resistor is connected to a first end of the analog integrated device, one end of the second resistor is connected to a third end of the first switch, the other end of the second resistor is respectively connected to the other end of the fourth capacitor, one end of the fifth capacitor, one end of the fourth resistor and a third end of the analog integrated device, the other end of the fifth capacitor is grounded, the fourth resistor and a fourth end of the analog integrated device are grounded, and the fifth end of the analog integrated device is connected to a reference voltage.

10. The power supply link sampling subcircuit according to claim 8, characterized in that: The power supply link sampling subcircuit samples the temperature of the circuit board.

11. The power supply link sampling subcircuit according to claim 10, characterized in that: The power supply link sampling subcircuit includes a fifth resistor and a second temperature-sensitive device, wherein one end of the fifth resistor is connected to a reference voltage, the other end of the fifth resistor and one end of the second temperature-sensitive device are connected to a first end of a first switch, and the other end of the second temperature-sensitive device is grounded.

12. A power signal detection circuit, characterized in that: include: The power supply link detection subcircuit according to any one of claims 1 to 5; The power supply link sampling subcircuit according to any one of claims 6 to 11 collects the temperature of the fuse device in the power supply link detection subcircuit, and collects the voltage and current of the power supply link based on the power supply link detection subcircuit; The control subcircuit corrects the on-resistance of the fuse device according to the temperature of the fuse device, and generates a power signal according to the voltage and current of the power supply link.

13. The power signal detection circuit according to claim 12, characterized in that: The power supply link sampling subcircuit samples the temperature of the circuit board, and the control subcircuit corrects the current of the power supply link according to the temperature of the circuit board.

14. The power signal detection circuit according to claim 12, characterized in that: The power supply link sampling subcircuit is connected to the control subcircuit via a digital interface circuit.

15. A power supply system, characterized in that: The invention comprises the power signal detection circuit as described in any one of claims 12 to 14.

16. An electronic device, characterized in that: Includes the power supply system as claimed in claim 15.

17. A current detection method, characterized in that: The method performs current detection based on the power supply link detection subcircuit according to any one of claims 1 to 5, wherein the method comprises the following steps: Get the temperature of the fuse device; Correcting the on-resistance of the fuse device according to the temperature of the fuse device, so that the corrected on-resistance of the fuse device is in linear proportion to the temperature of the fuse device; Controlling the fuse device to be in a conducting state so that the power supply link of the circuit board is connected in series with the conduction resistor, and determining the current of the power supply link according to the voltage and resistance value at both ends of the conduction resistor; The on-resistance of the fuse device is used to implement current detection of the power supply link of the circuit board.

18. A data sampling method, characterized in that: The method is based on the power supply link sampling subcircuit according to any one of claims 6 to 11 to sample the data of the power supply link, wherein the method comprises the following steps: Controlling the combination switch of the power supply link sampling subcircuit to access different sampling points respectively, wherein the combination switch forms different detection channels when connected to different sampling points; The sampling component of the power supply link sampling subcircuit is used to sample multiple data including the temperature of the circuit board, the temperature of the fuse device, and the voltage and current of the power supply link under different detection channels.

19. A power signal detection method, characterized in that: The method detects the power signal of the power supply link based on the power signal detection circuit according to any one of claims 12 to 14, wherein the method comprises the following steps: Controlling the power supply link sampling subcircuit to switch a plurality of detection channels, wherein the plurality of detection channels are used to detect the temperature of the circuit board, the temperature of the fuse device, and the voltage and current of the power supply link; Correcting the on-resistance of the fuse device according to the temperature of the fuse device, so that the corrected on-resistance of the fuse device is in linear proportion to the temperature of the fuse device; Correcting the current of the power supply link according to the temperature of the circuit board; A power signal is generated according to the voltage of the power supply link and the corrected current.

20. A computer-readable storage medium having a computer program or instruction stored thereon, characterized in that: When the computer program or instruction is executed, the current detection method according to claim 17, or the data sampling method according to claim 18, or the power signal detection method according to claim 19 is implemented.

21. A computer program product comprising a computer program or instructions, characterized in that When the computer program or instruction is executed, the current detection method according to claim 17, or the data sampling method according to claim 18, or the power signal detection method according to claim 19 is implemented.

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