System bias test device and method

Abstract

The invention provides a system bias test device and method. The device comprises a PCB, a sliding block and an outer structural member. The sliding block and the PCB are arranged in the outer structural member; a golden finger is arranged on the PCB; the golden finger is used for being matched with a connector of communication equipment to carry out a pulling deviation test; the sliding block is fixed on the PCB and is used for driving the PCB to move in the outer structural member so as to change the insertion length of the golden finger, and the moving distance of the PCB is used for representing the insertion length. According to the invention, the pulling deviation test can be carried out according to the severity degree of the golden finger stub active pulling deviation problem, so that the pulling deviation test process is controllable and observable, and the test efficiency and accuracy can be greatly improved.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a system pull-off test device and method. Background Art

[0002] Nowadays, most communication devices require expansion connectors or port media (such as optical modules, DACs, PCIE daughter cards, DDR memory sticks, etc.). Generally, these connectors or port media can be designed according to custom specifications, and then the connectors can be directly inserted into the device for use or testing. However, different connectors have different interface connectors, and different devices have their own chip solutions and technical design capabilities. There are differences in the matching degree of different connectors, connectors and chip processors, which may lead to signal integrity problems and equipment performance that cannot meet the design goals, especially for high-speed signals. The different lengths of the gold finger stubs on the connector PCB board may affect the signal. Therefore, in the R&D design and system testing stages, it is necessary to perform pull-off tests on the four parts of the connector, the connector external tooling, the connector and the chip solution used.

[0003] The length of the gold finger is related to the signal rate. The higher the signal rate, the more precise the design requirements for the gold finger length need to be, to avoid impedance discontinuity caused by the excessive length of the gold finger, resulting in signal reflection of the transmission line and signal integrity problems. At present, the technical solution adopted by the relevant technology for the design problem of the gold finger length in high-speed signals is to traverse and design gold fingers of different lengths, and then test them one by one, which will lead to high testing costs, especially for high-density multi-port devices, which require a huge amount of traversal, and the portability and observability are not ideal, which seriously reduces the efficiency of product design and testing. Summary of the invention

[0004] One of the purposes of the present invention is to provide a system pull-off test device and method, which are used to achieve controllability and observability of the product pull-off test process and improve test efficiency. The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a system pull-off test device, comprising: a PCB board, a slider and an external structure; the slider and the PCB board are arranged in the external structure; a gold finger is arranged on the PCB board; the gold finger is used to cooperate with a connector of a communication device to perform a pull-off test; the slider is fixed on the PCB board, and is used to drive the PCB board to move in the external structure to change the insertion length of the gold finger, and the movement distance of the PCB board is used to characterize the insertion length.

[0006] In an optional embodiment, a fixing hole is provided on the PCB board, and the slider has a structure that is locked in place through the fixing hole, so that the slider is locked on the PCB board.

[0007] In an optional embodiment, the outer structure is provided with a guide groove structure for guiding the movement of the slider.

[0008] In an optional embodiment, the guide groove structure is ratchet-shaped.

[0009] In an optional embodiment, the slider is made of insulating material and has a concave-convex surface.

[0010] In an optional embodiment, the external structure is provided with an observation slot; the observation slot is used to display the moving distance; the observation slot has a distance silk screen for identifying the insertion length; the maximum scale value of the distance silk screen is close to one end of the gold finger.

[0011] In an optional implementation, the PCB board corresponds to a plug-in device; the plug-in device includes: SFP, QSFP, QSFPDD, OSFP, CFP.

[0012] In an optional implementation, the system pull-bias test device is used to perform a pull-bias test on the chip of the communication device and the connector.

[0013] In a second aspect, the present invention provides a system pull-off test method, which is applied to a communication device; the communication device has at least one connector; the method comprises: determining a test object and preset test conditions corresponding to the test object; responding to the movement operation of a gold finger on a PCB board in a system pull-off test device at the connector to obtain measurement data; wherein the system pull-off test device is as described in the first aspect; determining whether the measurement data meets the preset test conditions; if not, returning to the step of responding to the movement operation of a gold finger on a PCB board in a system pull-off test device at the connector to obtain measurement data, otherwise, outputting test result feedback information to indicate that the test is complete.

[0014] In an optional embodiment, when the object under test is a chip, the measurement data is a signal amplitude, and the preset test condition is: the signal amplitude is greater than or equal to the maximum signal limit value of the chip, or the signal amplitude is less than or equal to the minimum signal limit value of the chip.

[0015] The present invention provides a system pull-off test device and method, the device includes a PCB board, a slider and an external structure; the slider and the PCB board are arranged in the external structure; a gold finger is arranged on the PCB board; the gold finger is used to cooperate with the connector of the communication device to perform a pull-off test; the slider is fixed on the PCB board, and is used to drive the PCB board to move in the external structure to change the insertion length of the gold finger, and the movement distance of the PCB board is used to characterize the insertion length. The test device drives the PCB board to move in the external structure through a slider, and the movement of the slider drives the PCB board to move back and forth in the external structure, thereby simulating different depths of the gold finger inserted into the connector. The tester only needs to control the movement distance of the slider to conveniently control the insertion depth of the "gold finger" in the connector. At the same time, the insertion length of the gold finger in each test can be accurately quantified by the movement distance of the PCB board. In this way, the test process is completely controllable and observable, and the test efficiency and accuracy can be greatly improved. The test results are also more reliable and standard, which is conducive to evaluating the performance of the connector and the PCB board under different insertion lengths. The test device can not only be used to test general connector products, but also to test the upper and lower limit capabilities of imported purchased interface modules, connectors and integrated circuits. Compared with traditional manual testing, this test device can effectively improve test efficiency and result accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 Provides a product diagram of existing accessible optical modules;

[0018] Figure 2 This is a schematic diagram of the gold finger length of a 10G optical module connector;

[0019] Figure 3 The required value of the gold finger length of the 10G optical module connector is shown;

[0020] Figure 4 A schematic diagram of the length of the gold fingers of a connector PCB is shown;

[0021] Figure 5 A schematic structural diagram of a system pull-off test device provided by an embodiment of the present invention;

[0022] Figure 6A schematic diagram of the back side of a first structure of a system deflection test device provided by an embodiment of the present invention;

[0023] Figure 7 A schematic diagram of the back side of a second structure of the system deflection test device provided by an embodiment of the present invention;

[0024] Figure 8 A schematic diagram of the back side of a third structure of the system deflection test device provided by an embodiment of the present invention;

[0025] Fig. 9 A side schematic diagram of a fourth structure of the system deflection test device provided by an embodiment of the present invention;

[0026] Fig.10 A schematic flow chart of a system pull-off test method provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0030] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0032] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0033] First, the relevant terms involved in the embodiments of the present invention are explained.

[0034] High-low bias test: Tests the changes in performance parameter values ​​of equipment in normal and abnormal states to detect potential defects in the equipment.

[0035] Golden finger: It is the hardware of communication equipment, such as between memory stick and memory slot, graphics card and graphics card slot, etc. All signals are transmitted through golden fingers. Golden fingers are composed of many golden conductive contacts. Because their surface is gold-plated and the conductive contacts are arranged like fingers, they are called golden fingers.

[0036] Stub: In the process of designing PCB wiring, the extra wiring wire ends are usually called short stubs or stubs (also called stub wires). Such wire ends are generally not allowed to appear. Extra wire ends will produce antenna radiation effect, and in severe cases will cause signal reflection, and finally signal integrity problems will occur. The stub in the embodiment of the present invention is a gold finger stub in one of the PCB designs.

[0037] SFP (Small Form Factor Pluggable): A small hot-pluggable optical transceiver package, which is a packaging form of optical module.

[0038] QSFP (Quad Small Form Factor Pluggable): A four-channel small hot-pluggable optical transceiver integrated package, which is a packaging form of optical module.

[0039] QSFP-DD (Quad Small Form Factor Pluggable-Double Density): Double-density four-channel small hot-pluggable optical transceiver integrated package, which is a packaging form of optical module.

[0040] OSFP (Octal Small Form Factor Pluggable): An eight-channel small hot-pluggable optical transceiver integrated package, which is a packaging form of optical module.

[0041] CFP (C Form Factor Pluggable): 100G rate hot-pluggable optical transceiver integrated package. CFP2 means double-density 100G rate hot-pluggable optical transceiver integrated package, and CFP8 means eight-density 100G rate hot-pluggable optical transceiver integrated package. It is a packaging form of optical module.

[0042] See also Figure 1 , Figure 1 Provides a product diagram of existing accessible optical modules. Figure 1 The diagram shows the external pluggable optical module connectors QSFP-DD, QSFP, CFP8, connector external tooling, connector and chip schematics, where the connector is packaged in the connector external tooling and is not marked in the figure. For the gold finger stub problem of high-speed signals, Figure 1 The manufacturers of the various devices shown are all developed and produced according to their own protocols, without the scalability to match and be compatible with multiple upstream devices, exposing or avoiding such design risks. Moreover, the length of the gold finger is usually not strictly defined in the protocol. For example, see Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the gold finger length of a 10G optical module connector. Figure 3 The required value of the gold finger length of the 10G optical module connector is shown. It can be seen that the signal length requirement at the gold finger of the 10G optical module connector protocol SFF-8083 is A09. Figure 3 As shown in the figure, the signal length requirement at the gold finger of the 10G optical module connector protocol SFF-8083 only requires a minimum value, and there is no clear range.

[0043] Well, for ultra-high-speed signals with data transmission rates of up to 25Gbps and above, the use of multiple outsourced components from different manufacturers will, to a certain extent, bring matching problems and design difficulties. In addition, the physical connection level, such as optoelectronic connection components, connection strips, and external cables, may also have certain design or manufacturing deficiencies, thereby introducing additional interference, bringing certain impacts on signal transmission, and further affecting the signal integrity of chips or related devices.

[0044] For example, see Figure 4 , Figure 4 The figure shows a schematic diagram of the length of the gold finger of a connector PCB. The stub length of the gold finger is generally as small as possible on the basis of being able to be used in contact. Figure 4 The situation shown in (b) is significantly better than Figure 4 In case (a), Figure 4 In the case of (a), there are great problems in the actual use of the connector, and in the worst case, it may not work at all.

[0045] In order to solve the above problems, the technical solutions adopted by the relevant technology are as follows:

[0046] 1) Currently, equipment manufacturers design, manufacture and test different lengths of gold fingers one by one, but the verification cost, portability and observability are not ideal. In particular, the amount of verification required for high-density multi-port equipment is quite huge.

[0047] 2) Currently, equipment manufacturers collaborate to design connectors, connectors and chip processors to solve the above technical problems. However, the coordination difficulty and cost of developing higher-end and high-speed products will increase rapidly, and there will be barriers to design technology that cannot be independently controlled.

[0048] That is to say, for the gold finger length matching problem in ultra-high-speed signal design, the cost of using a purely customized solution is usually high. In addition, the portability and observability of such customized designs are also poor, which seriously reduces the efficiency and accuracy of product design and testing.

[0049] In view of some deficiencies of the prior art in high-speed signal testing, an embodiment of the present invention provides a system pull-bias test device, which is suitable for various electronic systems that use externally purchased interface components, connectors or chips for high-speed signal transmission. It can quickly and accurately test the pull-bias parameters of these external components and return to their upper and lower limit working ranges. The test results can be displayed in real time to help R&D personnel quickly evaluate the matching degree and tolerance range of external devices. At the same time, the results can also be recorded and filed to provide a basis for later equipment selection and system optimization. In general, this test device achieves consistent testing of various high-speed peripherals through universal design, greatly improving product development and testing efficiency. It can provide important guarantees for the research and development of high-end high-speed technical equipment.

[0050] A system deflection testing device provided by an embodiment of the present invention is first introduced below.

[0051] See also Figure 5 , Figure 5 A schematic diagram of the structure of a system pull-off test device provided by an embodiment of the present invention, wherein: Figure 5 (a) is a front view. Figure 5 (b) is a side schematic diagram.

[0052] The system pull-off test device 500 includes: a PCB board 501, a slider 502 and an external structure 503; the slider 502 and the PCB board 501 are arranged in the external structure 503; a gold finger is arranged on the PCB board; the gold finger is used to cooperate with the connector of the communication equipment to perform a pull-off test; the slider 502 is fixed to the PCB board 501, and is used to drive the PCB board 501 to move in the external structure 503 to change the insertion length of the gold finger; the movement distance of the PCB board 501 is used to characterize the insertion length.

[0053] The system pull-off test device provided by the embodiment of the present invention drives the PCB board to move in the external structure through a slider, and the movement of the slider drives the PCB board to move back and forth in the external structure, thereby simulating the different depths of the gold finger inserted into the connector. The tester only needs to control the moving distance of the slider to easily control the insertion depth of the gold finger in the connector. At the same time, the insertion length of the gold finger in each test can be accurately quantified by the moving distance of the PCB board. In this way, the test process is completely controllable and observable, and the test efficiency and accuracy can be greatly improved. The test results are also more reliable and standard, which is conducive to evaluating the performance of the connector and the PCB board at different insertion lengths. The test device can not only be used to test general connector products, but also can be used to test the upper and lower limit capabilities of imported purchased interface modules, connectors and integrated circuits. Compared with traditional manual testing, the test device can effectively improve the test efficiency and the accuracy of the results.

[0054] In an optional implementation manner, in order to achieve reliable and efficient movement of the PCB board in the external structure by the slider, the embodiment of the present invention is Figure 5 The structure adopts an optimized design: a fixing hole is provided on the PCB board, and the slider has a structure that is locked in place through the fixing hole, so that the slider is locked on the PCB board.

[0055] See also Figure 6 , Figure 6 The back side schematic diagram of the first structure of the system deflection test device provided by the embodiment of the present invention. The number of the fixing holes 5011 is preferably selected to be multiple, such as two, and the position of the fixing holes 5011 on the PCB board 501 can be aligned with the structural position of the fixing hole clamping position of the slider 502, so that the slider 502 is clamped on the PCB board 501. During the test, by inserting the clamping structure of the slider 502 into the fixing hole on the PCB board 501, it can ensure that the slider 502 reliably drives the PCB board 501 to move left and right during the movement process without the risk of displacement.

[0056] In an optional implementation, in order to ensure that the moving path of the slider during the test is accurate and controllable, the embodiment of the present invention adopts an optimized design for the external structure: the external structure is provided with a guide groove structure for guiding the movement of the slider. Figure 7 , Figure 7 The back schematic diagram of the second structure of the system pulling deviation test device provided in the embodiment of the present invention shows that the volume of the slider 502 is smaller than the size of the guide groove structure 5032. During the moving test, the slider 502 is limited to linear movement within the range of the guide groove structure 5032 and cannot derail to the left or right.

[0057] In an optional embodiment, the guide groove structure may be ratchet-shaped, which can increase the positioning stability of the slider in the guide groove structure. When the slider moves, the slider and the guide groove engage with each other to effectively prevent the slider from moving left and right, thereby increasing the smoothness of movement.

[0058] In an optional implementation, in order to ensure that the slider can efficiently and accurately drive the PCB board during the mobile test, the embodiment of the present invention adopts the following optimized design: the slider is made of insulating material and has a concave and convex surface, which can avoid affecting the accuracy of the test results due to the use of conductive materials. Figure 7 Based on this, another structural diagram is given, see Figure 8 , Figure 8 The back schematic diagram of the third structure of the system deflection test device provided by the embodiment of the present invention shows that the surface of the slider 502 has a certain fine concave-convex structure, which can increase the relative friction between the slider and the PCB board 501 to a certain extent. The high friction surface is conducive to the slider and the PCB board 501 being able to fit tightly together during the slider 502 movement test process, eliminating possible slippage. When the slider 502 drives the PCB board 501 to move, the high friction matching structure can ensure that the PCB board 501 can accurately and smoothly move with the slider 502 throughout the entire moving path, greatly improving the stability and reliability of the driving process, and will not cause distortion of test data due to separation between materials.

[0059] In an optional embodiment, in order to quantify the insertion length of the gold finger, the external structure is provided with an observation slot; the observation slot is used to display the insertion length; the observation slot has a distance silk screen for marking the insertion length; the maximum scale value of the distance silk screen is close to one end of the gold finger.

[0060] like Fig. 9 As shown, Fig. 9A side schematic diagram of the fourth structure of the system deflection test device provided in an embodiment of the present invention, wherein the observation slot 5031 has a scale value for identifying the insertion length; the observation slot 5031 has a distance silk screen 5033 for identifying the moving distance, and the observation distance silk screen 5033 has a maximum scale value and a minimum scale value within a limited length range, and the maximum scale value is close to one end of the gold finger. The moving distance of the PCB board 501 is displayed through the observation slot, and the current moving position of the PCB board 501, i.e., the insertion length, can be directly read, thereby realizing visualization of different insertion lengths and facilitating testers to observe test results.

[0061] This test system adopts a visual design. During the test, the current insertion length of the PCB board can be directly observed, and the strength of the chip receiving signal can also be directly seen. By moving the PCB board to simulate the insertion length of the gold finger at different depths, the system will display the working status of the chip in real time. If the chip receives a poor signal at a certain insertion length, the tester will immediately find the abnormality. In addition, the device is designed with an observation slot, which can directly observe the performance differences of different models of chips at the same insertion length. If a certain model of chip is significantly affected by the pull-out, the observation slot will show significantly different situations. In this way, chip models with poor performance can be quickly excluded, avoiding large-scale purchases and use of products that may have quality problems. Moreover, the design cost of the system pull-out test device is basically negligible, and the verification usage is not large. The structural parts are fixed, and the adjustment process does not require plugging and unplugging, and the degree of wear and tear is low.

[0062] In the above-mentioned system pull-off test device provided by the embodiment of the present invention, the PCB board corresponds to a connector; the connector includes but is not limited to: SFP, QSFP, QSF-PDD, OSFP, CFP.

[0063] By using the system pull-bias test device provided above, it is possible to implement pull-bias testing on the chips and / or connectors of communication equipment. During the use of this device, it is possible to visually confirm whether the signal quality is good under different insertion lengths of the gold finger. If there are large differences between different devices, it will be intuitively detected that the observation slots of the external structural parts are obviously different, and devices with obvious differences can be screened out, thereby avoiding the risks of large-scale purchase and batch use of poorly matched products and improving efficiency. At the same time, due to the sliding design of the PCB board, there is no need for a large amount of design, manufacturing and manual plug-in and unplug traversal, and it can be used to quickly evaluate the consistency performance of high-density device ports.

[0064] The following provides a system pull-out test method in conjunction with the system pull-out test device provided in an embodiment of the present invention. Fig.10 , Fig.10 A schematic flow chart of a system pull-off test method provided in an embodiment of the present invention, the method can be applied to a communication device, the communication device has at least one connector, and the method may include:

[0065] S901: Determine a tested object and preset test conditions corresponding to the tested object.

[0066] In an embodiment of the present invention, the communication device may be a high-density multi-port device having at least two connectors, and the tested object may be a chip and a connector. When there are multiple connectors, each connector may be inserted into a system pull-bias test device.

[0067] In the specific implementation process, when the object under test is a chip, the system pull-off test device can be inserted into a fixed connector to fix the system environment of the communication device except the chip. When the object under test is a connector, the chip of the communication device and its related parameter information can be fixed. When the communication device confirms that the chip and its related parameter information are fixed, it can be determined that the object under test is a connector, otherwise it can be determined that the object under test is a connector.

[0068] Specifically, when the object to be tested is a chip, insert the corresponding system deviation test device of any type of connector (such as SFP, QSFP, QSF-PDD, OSFP, CFP and other devices that use gold fingers to plug and unplug). Without unplugging the device, replace chips of different specifications, and use the signal quality of the chip receiving end as feedback to continuously adjust the insertion length of the gold finger. Use preset test conditions to determine whether the deviation has reached the chip's limit value.

[0069] When the object to be tested is a connector, a system pull-off test device corresponding to a simulated connector of different schemes and models can be inserted into each different type of connector to be tested. Without the need to pull out the device, the slider under each device can be slid to observe the current PCB position. Combined with the feedback information from the chip, the insertion length of the gold finger can be continuously adjusted. The preset test conditions are used to determine whether the consistency test is completed, that is, whether the lengths of the gold fingers matched by each connector are consistent.

[0070] S902, responding to the movement operation of the gold finger on the PCB board at the connector in the system pull-out test device to obtain measurement data.

[0071] It is understandable that during the pull-off test, the external structure and the communication device can be perpendicular and matched with the connector of the communication device to ensure that the PCB board can be inserted into the connector in the forward direction. After the PCB board is normally inserted into the connector, it can be recognized by the communication device. It only needs to slide the slider to traverse different gold finger lengths, and there is no need for repeated hot plugging. After each sliding of the slider, the communication device can respond to the movement of the gold finger and obtain measurement data, and then determine whether the test is completed based on the measurement data, that is, execute step S903.

[0072] S903, determining whether the measurement data meets the preset test conditions;

[0073] S904, if not, return to the step of responding to the movement operation of the gold finger on the PCB board at the connector in the system pull-out test device to obtain measurement data; otherwise, output the test result feedback information to indicate that the test is completed.

[0074] In an embodiment of the present invention, the movement operation of the gold finger at the connector can be achieved by sliding the slider, and the current marked length value of the observation slot can be observed. Combined with the signal eye diagram of the chip receiving end, or compared with the length performance of other ports, it can be confirmed whether the consistency and compatibility of the current design meet the standards, and it can be unplugged after all tests are completed.

[0075] For example, for a chip, the measurement data may be the signal amplitude, and the preset test conditions may be: the signal amplitude is greater than or equal to the maximum signal limit value of the chip, or the signal amplitude is less than or equal to the minimum signal limit value of the chip, that is, when the signal amplitude exceeds the limit value range of the chip, it can be considered that the pull-off test of the chip is completed.

[0076] The above-mentioned system pull-off test method can be applied to all pressure verifications involving outsourced connectors, outsourced connectors and outsourced chips. It provides an effective reference for design matching, outsourced selection and batch purchase, avoids batch cost risks, avoids market risks, and is also extremely valuable for high-speed high-end equipment product quality control and location analysis of certain problematic components.

[0077] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A system pull-off test device, characterized in that: include: PCB board, slider and external structure; the slider and the PCB board are arranged in the external structure; The PCB board is provided with a gold finger; the gold finger is used to cooperate with the connector of the communication equipment to perform a pull-off test; the slider is fixed on the PCB board, and is used to drive the PCB board to move in the external structure to change the insertion length of the gold finger, and the movement distance of the PCB board is used to characterize the insertion length.

2. The system pull-off test device according to claim 1, characterized in that: The PCB board is provided with a fixing hole, and the slider has a structure that is locked in place through the fixing hole so that the slider is locked in the PCB board.

3. The system pull-off test device according to claim 1, characterized in that: The outer structure is provided with a guide groove structure for guiding the movement of the slider.

4. The system pull-off test device according to claim 3, characterized in that: The guide groove structure is ratchet-shaped.

5. The system pull-off test device according to claim 1, characterized in that: The sliding block is made of insulating material and has a concave-convex surface.

6. The system pull-off test device according to claim 1, characterized in that: The outer structure is provided with an observation slot; the observation slot is used to display the moving distance; the observation slot has a distance silk screen for marking the moving distance; the maximum scale value of the distance silk screen is close to one end of the gold finger.

7. The system pull-off test device according to claim 1, characterized in that: The PCB board corresponds to a plug-in device; the plug-in device includes: SFP, QSFP, QSFPDD, OSFP, CFP.

8. The system deflection test device according to any one of claims 1 to 7, characterized in that: The system pull-bias test device is used to perform pull-bias tests on the chip of the communication device and the connector.

9. A system pull-off test method, characterized in that: Applied to communication equipment; The communication device has at least one connector; the method comprises: Determine a tested object and preset test conditions corresponding to the tested object; Responding to the movement operation of the gold finger on the PCB board at the connector in the system pull-out test device, obtaining measurement data; wherein the system pull-out test device is as described in any one of claims 1-8; Determining whether the measurement data meets the preset test conditions; If not, return to the step of responding to the movement operation of the gold finger on the PCB board at the connector in the system pull-out test device to obtain measurement data; otherwise, output the test result feedback information to indicate that the test is completed.

10. The system pull-off test method according to claim 9, characterized in that: When the tested object is a chip, the measured data is a signal amplitude, and the preset test condition is: the signal amplitude is greater than or equal to the maximum signal limit value of the chip, or the signal amplitude is less than or equal to the minimum signal limit value of the chip.

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