A pretreatment device for flexible circuit board production

Abstract

The present invention relates to the field of flexible circuit board production, and particularly to a pretreatment device for flexible circuit board production. The current flexible circuit board pretreatment device is likely to cause uneven thickness of the glue on the flexible circuit board, and dust is likely to adhere to the surface of the flexible circuit board, resulting in insufficient pretreatment effect of the flexible circuit board. A pretreatment device for flexible circuit board production includes a support frame, etc.; an installation frame is fixedly connected to the support frame, and two electric push rods are fixedly connected to the installation frame, and the two electric push rods are symmetrically arranged. When the staff starts the two electric push rods simultaneously, the two friction plates flatten and limit the flexible PCB board, and then the glue sprayer coats the surface of the flexible PCB board, and the soft brush evenly brushes the glue on the surface of the flexible PCB board. In this way, the flexible PCB board can be flattened and limited, and the glue on the flexible PCB board can be evenly brushed by the soft brush, so that the glue brushing effect of the flexible PCB board can be better.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuit board production, and particularly to a pretreatment device for flexible circuit board production. Background Art

[0002] A flexible circuit board is a printed circuit board made of a flexible substrate. Compared with traditional rigid printed circuit boards, FPCs have the advantages of being bendable, light in weight, and small in size, and thus are widely used in modern electronic products. In the manufacturing process of flexible circuit boards, pretreatment is an important step, which directly affects the quality of subsequent processes and the reliability of the finished products.

[0003] In current flexible circuit board pretreatment devices, most are manual application of three-proof glue on flexible circuit boards. However, manual glue application easily results in uneven thickness of the glue on the flexible circuit board, and it is also easy to have glue dripping. Moreover, it is inconvenient to pre-clean the flexible circuit board during the glue application process, and dust is likely to adhere to the surface of the flexible circuit board, resulting in insufficient pretreatment effect of the flexible circuit board. Summary of the Invention

[0004] Aiming at the above-mentioned disadvantages or deficiencies in the prior art, the present invention provides a pretreatment device for flexible circuit board production, which can evenly distribute the glue on the surface of the flexible circuit board, and can also pre-clean the flexible circuit board to prevent the occurrence of glue dripping on the flexible circuit board by residual glue, making the pretreatment effect of the flexible circuit board better.

[0005] A pretreatment device for flexible circuit board production includes a support frame, on which an installation frame is fixedly connected. Two electric push rods are fixedly connected to the installation frame, and the two electric push rods are symmetrically arranged. A frame body is slidably connected to the installation frame. A flexible PCB board is placed on the installation frame. A glue spraying mechanism is arranged on the frame body for spraying glue on the flexible PCB board. A flattening and fixing mechanism is arranged on the frame body. A glue leveling mechanism is arranged on the frame body, and the glue leveling mechanism is connected to the glue spraying mechanism.

[0006] As a further preferred solution, the glue spraying mechanism includes a servo motor, which is fixedly connected to the top of the frame body. A placement frame is fixedly connected to the top of the frame body. A lead screw is rotatably connected to the placement frame. A movable plate is slidably connected to the placement frame. A nut is fixedly connected to the top of the movable plate, and the nut is threadedly connected to the lead screw. A glue sprayer is fixedly connected to the bottom of the movable plate, and a glue supply pipe is fixedly connected to the glue sprayer, and the glue supply pipe is communicated with the glue sprayer.

[0007] As a further preferred solution, the flattening and fixing mechanism includes a first fixing frame. Two first fixing frames are fixedly connected to the frame body. The two first fixing frames are symmetrically arranged. Two swing rods are rotatably connected to each of the two first fixing frames. The two swing rods are symmetrically arranged. The two swing rods on the same first fixing frame are symmetrically arranged. A first torsion spring is connected between the first fixing frame and the two swing rods in the same group. The ends of the two swing rods in the same group away from the first fixing frame are rotatably connected to a friction plate. A second torsion spring is connected between the friction plate and the two swing rods in the same group.

[0008] As a further preferred solution, the glue leveling mechanism includes a second fixing frame. The second fixing frame is fixedly connected to the movable plate. A soft brush is slidably connected to the bottom end of the second fixing frame. A guide rod is fixedly connected to the soft brush. A guide groove plate is fixedly connected to the frame body. A guide inclined groove is formed in the guide groove plate. The top end of the guide rod is located in the guide inclined groove on the guide groove plate.

[0009] As a further preferred solution, a dust cleaning mechanism is further included. The dust cleaning mechanism is arranged on the placement rack. The dust cleaning mechanism includes a rotating rod. One end of the lead screw is fixedly connected to the rotating rod. A one-word groove frame is slidably connected to the movable plate. A guide straight groove is formed in the one-word groove frame. The end of the rotating rod away from the placement rack is located in the guide straight groove on the one-word groove frame. A ring frame is slidably connected to the one-word groove frame. The ring frame is slidably connected to the movable plate. Two air pumps are fixedly connected to the movable plate. The two air pumps are symmetrically arranged. A hose is fixedly connected to each of the two air pumps. The ring frame is fixedly connected to the two hoses.

[0010] As a further preferred solution, a residual glue cleaning mechanism is further included. The residual glue cleaning mechanism is arranged on the placement rack. The residual glue cleaning mechanism includes a residual glue collection rack. The residual glue collection rack is fixedly connected to the placement rack. A collection groove is formed in the residual glue collection rack. A shaft rod is rotatably connected to the collection groove in the residual glue collection rack. Two return springs are connected between the shaft rod and the residual glue collection rack. The two return springs are symmetrically arranged. A rotating frame is fixedly connected to the shaft rod. A push plate is fixedly connected to the rotating frame.

[0011] The present invention has the following advantages: First, the staff will place the flexible PCB board on the mounting rack and simultaneously start two electric push rods. The soft brush will contact the surface of the flexible PCB board, and the two friction plates will flatten and limit the flexible PCB board. Then, the glue sprayer will apply glue to the surface of the flexible PCB board, and the soft brush will brush the glue on the surface of the flexible PCB board evenly. In this way, the flexible PCB board can be flattened and limited, and the glue on the flexible PCB board can be brushed evenly by the soft brush, so that the glue brushing effect of the flexible PCB board is better.

[0012] When the nut drives the movable plate to move horizontally, the air pump will pump the outside air through the hose and spray it onto the surface of the flexible PCB board, which can blow away the dust on the surface of the flexible PCB board to achieve the purpose of pre-cleaning the surface of the flexible PCB board. Then, the push plate will scrape off the residual glue at the bottom of the glue sprayer. Next, the rotating frame will support and bend the bottom of the soft brush, so that the soft brush is separated from the surface of the flexible PCB board, thus avoiding the situation of glue dripping from the residual glue on the soft brush onto the flexible PCB board. When the nut drives the movable plate to move horizontally in the reverse direction and reset, the air pump blows air through the two hoses to promote the solidification of the glue on the flexible PCB board. In this way, the dust on the surface of the flexible PCB board can be pre-cleaned, the solidification of the glue on the flexible PCB board can be promoted to a certain extent, the residual glue at the bottom of the glue sprayer can be cleaned, and the situation of glue dripping from the residual glue on the soft brush onto the flexible PCB board can be prevented, so that the pre-treatment effect of the flexible PCB board is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a three-dimensional structural schematic diagram of the present invention.

[0014] Figure 2 is a three-dimensional structural schematic diagram of the guide groove plate of the present invention.

[0015] Figure 3 For the present invention Figure 2 is an enlarged three-dimensional structural schematic diagram of A in the present invention.

[0016] Figure 4 is a partial three-dimensional structural schematic diagram of the present invention.

[0017] Figure 5 is a first three-dimensional structural schematic diagram of the flattening and fixing mechanism of the present invention.

[0018] Figure 6 is a three-dimensional structural schematic diagram of the glue spraying mechanism of the present invention.

[0019] Figure 7 is a partial three-dimensional structural schematic diagram of the glue spreading mechanism and the dust cleaning mechanism of the present invention.

[0020] Figure 8 is a second three-dimensional structural schematic diagram of the flattening and fixing mechanism of the present invention.

[0021] Figure 9 This is a three-dimensional structural schematic diagram of the guide groove plate of the present invention.

[0022] Figure 10 This is a three-dimensional structural schematic diagram of the residual glue cleaning mechanism of the present invention.

[0023] Figure 11 This is a three-dimensional structural schematic diagram of the shaft rod, rotating frame and push plate of the present invention.

[0024] Figure 12 This is a disassembled three-dimensional structural schematic diagram of the support frame, mounting frame and frame body of the present invention.

[0025] Figure 13 This is a partial three-dimensional structural schematic diagram of the glue spraying mechanism, glue leveling mechanism and dust cleaning mechanism of the present invention.

[0026] Wherein: 1 - support frame, 2 - mounting frame, 3 - electric push rod, 4 - frame body, 41 - flexible PCB board, 51 - servo motor, 52 - placement rack, 53 - lead screw, 54 - movable plate, 55 - nut, 56 - glue sprayer, 57 - glue supply pipe, 61 - first fixed frame, 62 - swing rod, 63 - first torsion spring, 64 - friction plate, 65 - second torsion spring, 71 - second fixed frame, 72 - soft brush, 73 - guide rod, 74 - guide groove plate, 81 - rotating rod, 82 - slotted frame, 83 - ring frame, 84 - air pump, 85 - hose, 91 - residual glue collection rack, 92 - shaft rod, 93 - return spring, 94 - rotating frame, 95 - push plate. Detailed implementation manners

[0027] The standard parts used in the present invention can all be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, welding, and pasting that are mature in the prior art, and will not be elaborated here.

[0028] Embodiment 1

[0029] A pretreatment device for flexible circuit board production, as Figures 1-13 shown, includes a support frame 1. The mounting frame 2 is bolted to the support frame 1. Two electric push rods 3 are bolted to the mounting frame 2. The two electric push rods 3 are symmetrically arranged. The frame body 4 is slidably connected to the mounting frame 2. A flexible PCB board 41 is placed on the mounting frame 2. A glue spraying mechanism is arranged on the frame body 4. The glue spraying mechanism is used for spraying glue on the flexible PCB board 41. A flattening and fixing mechanism is arranged on the frame body 4. A glue leveling mechanism is arranged on the frame body 4. The glue leveling mechanism is connected to the glue spraying mechanism.

[0030] The glue spraying mechanism includes a servo motor 51. The servo motor 51 is connected to the top of the frame 4 by bolts. A placement rack 52 is welded to the top of the frame 4. A lead screw 53 is rotatably connected to the placement rack 52. A movable plate 54 is slidably connected to the placement rack 52. A nut 55 is connected to the top of the movable plate 54 by bolts. The nut 55 is threadedly connected to the lead screw 53. A glue sprayer 56 is connected to the bottom of the movable plate 54 by bolts. A glue supply pipe 57 is connected to the glue sprayer 56 by a flange. The glue supply pipe 57 is communicated with the glue sprayer 56.

[0031] The flattening and fixing mechanism includes a first fixing frame 61. Two first fixing frames 61 are connected to the frame 4 by bolts. The two first fixing frames 61 are symmetrically arranged. Two swing rods 62 are rotatably connected to the two first fixing frames 61. The two swing rods 62 are symmetrically arranged. The two swing rods 62 on the same first fixing frame 61 are symmetrically arranged. A torsion spring one 63 is connected between the first fixing frame 61 and the two swing rods 62 in the same group by a hook. The ends of the two swing rods 62 in the same group away from the first fixing frame 61 are rotatably connected to a friction plate 64. A torsion spring two 65 is connected between the friction plate 64 and the two swing rods 62 in the same group by a hook.

[0032] The glue leveling mechanism includes a second fixing frame 71. The second fixing frame 71 is welded to the movable plate 54. A soft brush 72 is slidably connected to the bottom end of the second fixing frame 71. A guide rod 73 is welded to the soft brush 72. A guide groove plate 74 is welded to the frame 4. A guide inclined groove is formed in the guide groove plate 74. The top end of the guide rod 73 is located in the guide inclined groove on the guide groove plate 74.

[0033] At first, the staff passes glue into the glue sprayer 56 through the glue supply pipe 57. First, the staff places the flexible PCB board 41 on the mounting rack 2 and simultaneously starts two electric push rods 3. The telescopic rods of the two electric push rods 3 contract and jointly drive the frame body 4 to move downward. The downward movement of the frame body 4 drives the servo motor 51, the placement rack 52, the lead screw 53, the movable plate 54, the nut 55, the glue sprayer 56, the glue supply pipe 57, the first fixing frame 61, the swing rod 62, the first torsion spring 63, the friction plate 64, and the second torsion spring 65 all move downward. The soft brush 72 will contact the surface of the flexible PCB board 41. Both ends of the flexible PCB board 41 will respectively contact the two friction plates 64. Then, the two first fixing frames 61 will squeeze the two friction plates 64 to move away from each other through two groups of swing rods 62. The first torsion spring 63 and the second torsion spring 65 will both be twisted, so as to flatten and limit the flexible PCB board 41. Then, the servo motor 51 will drive the lead screw 53 to rotate. The rotation of the lead screw 53 will drive the nut 55 to move horizontally. The horizontal movement of the nut 55 will drive the movable plate 54, the second fixing frame 71, the glue sprayer 56, etc. to move horizontally. The glue sprayer 56 will apply glue to the surface of the flexible PCB board 41. During the horizontal movement of the guide rod 73, it will reciprocate under the action of the guide groove plate 74. The reciprocating movement of the guide rod 73 will drive the soft brush 72 to reciprocate in the direction of approaching or departing from the guide groove plate 74. The soft brush 72 will brush the glue on the surface of the flexible PCB board 41 evenly. In this way, the flexible PCB board 41 can be flattened and limited, and the glue on the flexible PCB board 41 can be brushed evenly by the soft brush 72, so that the glue brushing effect of the flexible PCB board 41 can be better.

[0034] When the glue brushing of the flexible PCB board 41 is completed, when the two electric push rods 3 jointly drive the frame body 4 to move upward, the frame body 4 will drive the servo motor 51, the placement rack 52, the lead screw 53, the movable plate 54, the nut 55, the glue sprayer 56, the glue supply pipe 57, the first fixing frame 61, the swing rod 62, the first torsion spring 63, the friction plate 64, and the second torsion spring 65 all move upward to reset. The flexible PCB board 41 will be disengaged from contact with the two friction plates 64. The first torsion spring 63 and the second torsion spring 65 will reset. The reset of the first torsion spring 63 and the second torsion spring 65 will drive the two friction plates 64 to move closer to each other through two groups of swing rods 62 to reset. The soft brush 72 will be disengaged from contact with the flexible PCB board 41. The servo motor 51 will drive the nut 55 to move horizontally in the reverse direction to reset. The reset of the nut 55 will drive the movable plate 54, the second fixing frame 71, the glue sprayer 56, etc. to move horizontally in the reverse direction to reset.

[0035] Embodiment 2

[0036] On the basis of Embodiment 1, as Figures 3-13As shown in the figure, it further includes a dust cleaning mechanism. The dust cleaning mechanism is arranged on the placement rack 52. The dust cleaning mechanism includes a rotating rod 81. One end of the lead screw 53 is welded with the rotating rod 81. A one-word groove rack 82 is slidably connected to the movable plate 54. A guiding straight groove is formed on the one-word groove rack 82. One end of the rotating rod 81 away from the placement rack 52 is located in the guiding straight groove on the one-word groove rack 82. A ring rack 83 is slidably connected to the one-word groove rack 82. The ring rack 83 is slidably connected to the movable plate 54. Two air pumps 84 are bolted to the movable plate 54. The two air pumps 84 are symmetrically arranged. Hoses 85 are flange-connected to both of the two air pumps 84. The ring rack 83 is fixedly connected to the two hoses 85.

[0037] It further includes a residual glue cleaning mechanism. The residual glue cleaning mechanism is arranged on the placement rack 52. The residual glue cleaning mechanism includes a residual glue collection rack 91. The residual glue collection rack 91 is bolted to the placement rack 52. A collection groove is formed on the residual glue collection rack 91. A shaft rod 92 is rotatably connected to the collection groove on the residual glue collection rack 91. Two return springs 93 are connected between the shaft rod 92 and the residual glue collection rack 91 by hooks. The two return springs 93 are symmetrically arranged. A rotating frame 94 is bolted to the shaft rod 92. A push plate 95 is bolted to the rotating frame 94.

[0038] When the nut 55 drives the movable plate 54 to move horizontally, the movable plate 54 will drive the glue sprayer 56, the ring frame 83, the two air pumps 84 and the two hoses 85 to move horizontally. When the servo motor 51 drives the lead screw 53 to rotate, the lead screw 53 will drive the rotating rod 81 to rotate. The rotation of the rotating roller will push the one-slot frame 82 to move reciprocally. The reciprocal movement of the one-slot frame 82 will drive the bottom ends of the two hoses 85 to move reciprocally. The air pump 84 will pump the outside air and spray it onto the surface of the flexible PCB board 41 through the hose 85, which can blow away the dust on the surface of the flexible PCB board 41, achieving the purpose of pre-cleaning the surface of the flexible PCB board 41. When the glue sprayer 56 moves close to the residual glue collection rack 91 after brushing the glue, the bottom of the glue sprayer 56 will contact the push plate 95, and the push plate 95 will scrape off the residual glue at the bottom of the glue sprayer 56. Then, the soft brush 72 will contact the rotating frame 94. The movement of the glue sprayer 56 will push the push plate 95 and the rotating frame 94 to swing. The return spring 93 will be twisted, and the rotating frame 94 will support and bend the bottom of the soft brush 72, so that the soft brush 72 is separated from the contact with the flexible PCB board 41, thereby avoiding the situation that the residual glue on the soft brush 72 drips glue on the flexible PCB board 41. When the nut 55 drives the movable plate 54 to move horizontally in the reverse direction and reset, the movable plate 54 will drive the glue sprayer 56, the ring frame 83, the two air pumps 84 and the two hoses 85 to move horizontally in the reverse direction and reset. The air blown by the air pump 84 through the two hoses 85 will promote the solidification of the glue on the flexible PCB board 41. Thus, it can pre-clean the dust on the surface of the flexible PCB board 41, promote the solidification of the glue on the flexible PCB board 41 to a certain extent, clean the residual glue at the bottom of the glue sprayer 56, and prevent the situation that the residual glue on the soft brush 72 drips glue on the flexible PCB board 41, so as to make the pretreatment effect of the flexible PCB board 41 better.

[0039] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A pretreatment device for the production of flexible circuit boards, characterized in that: The invention comprises a support frame (1), a mounting frame (2) being fixedly connected to the support frame (1), two electric push rods (3) being fixedly connected to the mounting frame (2), the two electric push rods (3) being symmetrically arranged, a frame body (4) being slidably connected to the mounting frame (2), a flexible PCB board (41) being placed on the mounting frame (2), a glue spraying mechanism being arranged on the frame body (4), the glue spraying mechanism being used for spraying glue on the flexible PCB board (41), a stretching and fixing mechanism being arranged on the frame body (4), a glue spreading mechanism being arranged on the frame body (4), the glue spreading mechanism being connected to the glue spraying mechanism; the stretching and fixing mechanism comprises a fixing frame 1 (61), the frame body (4) being fixedly connected to the fixing frame 2 (61), Two fixed frames (61) are fixedly connected, the two fixed frames (61) are symmetrically arranged, the two fixed frames (61) are both rotatably connected to a swing rod (62), the two swing rods (62) are symmetrically arranged, the two swing rods (62) located on the same fixed frame (61) are symmetrically arranged, a torsion spring (63) is connected between the fixed frame (61) and the two swing rods (62) in the same group, a friction plate (64) is rotatably connected between the ends of the two swing rods (62) in the same group away from the fixed frame (61), and a torsion spring (65) is connected between the friction plate (64) and the two swing rods (62) in the same group.

2. A pretreatment device for producing a flexible circuit board according to claim 1, characterized in that: The glue spraying mechanism comprises a servo motor (51), the servo motor (51) is fixedly connected to the top of the frame (4), a placement frame (52) is fixedly connected to the top of the frame (4), a screw rod (53) is rotatably connected to the placement frame (52), a movable plate (54) is slidably connected to the placement frame (52), a nut (55) is fixedly connected to the top of the movable plate (54), the nut (55) is connected to the screw rod (53) by a thread, a glue sprayer (56) is fixedly connected to the bottom of the movable plate (54), a glue supply hose (57) is fixedly connected to the glue sprayer (56), and the glue supply hose (57) is communicated with the glue sprayer (56).

3. A pretreatment device for producing a flexible circuit board according to claim 2, characterized in that: The glue spreading mechanism comprises a second fixing frame (71), the second fixing frame (71) is fixedly connected to the movable plate (54), a soft brush (72) is slidably connected to the bottom end of the second fixing frame (71), a guide rod (73) is fixedly connected to the soft brush (72), a guide groove plate (74) is fixedly connected to the frame body (4), a guide inclined groove is formed on the guide groove plate (74), and the top end of the guide rod (73) is located in the guide inclined groove on the guide groove plate (74).

4. A pretreatment device for producing a flexible circuit board according to claim 2, characterized in that: The utility model also comprises a cleaning mechanism, which is arranged on the placement frame (52), and comprises a rotating rod (81), one end of the screw rod (53) is fixedly connected to the rotating rod (81), a slotted frame (82) is slidably connected to the movable plate (54), a guide straight groove is provided on the slotted frame (82), one end of the rotating rod (81) away from the placement frame (52) is located in the guide straight groove on the slotted frame (82), a ring frame (83) is slidably connected to the slotted frame (82), the ring frame (83) is slidably connected to the movable plate (54), two air pumps (84) are fixedly connected to the movable plate (54), the two air pumps (84) are symmetrically arranged, the two air pumps (84) are fixedly connected to hoses (85), and the ring frame (83) is fixedly connected to the two hoses (85).

5. A pretreatment device for producing a flexible circuit board according to claim 2, characterized in that: The invention also comprises a residual glue cleaning mechanism, which is arranged on the placement frame (52), and comprises a residual glue collecting frame (91). The placement frame (52) is fixedly connected to the residual glue collecting frame (91), and the residual glue collecting frame (91) is provided with a collecting groove. A shaft rod (92) is rotatably connected in the collecting groove on the residual glue collecting frame (91), and two return springs (93) are connected between the shaft rod (92) and the residual glue collecting frame (91), and the two return springs (93) are symmetrically arranged. A rotating frame (94) is fixedly connected to the shaft rod (92), and a push plate (95) is fixedly connected to the rotating frame (94).

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