An automated control etching system and method for printed circuit boards

Abstract

This invention discloses an automated control etching system and method for printed circuit boards (PCBs), relating to the field of PCB technology, comprising the following steps: Step 1: The operator places the PCB to be etched into the etching tank and inputs the target etching parameters through a human-machine interface; Step 2: A multi-dimensional sensor module continuously monitors key parameters within the etching tank, and the data is transmitted to a central controller; Step 3: Based on the data provided by the sensors, the central controller calculates the real-time etching rate using a nonlinear dynamics model; Step 4: When the real-time etching rate deviates from the target rate, the system activates an adaptive control algorithm for adjustment; Step 5: When the system detects that the set etching depth or width has reached the target value, the etching process automatically stops and key data is recorded; Step 6: Based on stored historical data analysis, the system provides optimal etching parameters and adjustment strategies for different types of PCBs, and displays the data in real-time through the human-machine interface module.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and specifically to an automated control etching system and method for printed circuit boards. Background Technology

[0002] With the continuous development of electronic products, printed circuit boards (PCBs), as core electronic components, are facing increasingly complex production processes in modern PCB manufacturing due to customized demands and fierce market competition. However, etching is one of the crucial processes determining the quality of PCB patterns, and traditional etching processes have the following drawbacks:

[0003] 1. The system etching process relies on manual monitoring and adjustment, which not only makes it difficult to ensure consistent etching accuracy each time, but also makes it susceptible to quality deviations due to environmental and human factors, leading to increased costs.

[0004] 2. Existing automated etching equipment often only adjusts a single parameter, neglecting the control effect of multi-parameter coupling.

[0005] Therefore, in order to address the above issues, there is an urgent need for an automated control etching system for printed circuit boards to improve data processing efficiency, protect data privacy, and achieve more flexible system integration. Summary of the Invention

[0006] The purpose of this invention is to provide an automated control etching system and method for printed circuit boards to solve the problems mentioned in the background art.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0008] An automated control etching system for printed circuit boards includes an etching tank, a multi-dimensional sensor module, a control module, an intelligent actuator module, and a human-machine interface module.

[0009] The etching tank is used to hold the etching solution and the printed circuit board to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control devices.

[0010] The multi-dimensional sensor module integrates a temperature sensor, a concentration sensor, and a flow rate sensor to monitor the temperature, concentration, and flow rate of the etching solution in real time.

[0011] The control module includes a central controller, which processes sensor data in real time based on an adaptive control algorithm and calculates the required etch rate.

[0012] The adaptive feedback adjustment module: adjusts itself by comparing the detected etching rate with the set target rate;

[0013] The cyclic control and dynamic optimization continuously collect data, optimize and adjust the data to form a closed-loop system, and the controller will also automatically correct the parameter model to ensure that the etching rate is always in the optimal range.

[0014] The intelligent termination and process recording module: Based on the loop control and dynamic optimization module, the intelligent termination and process recording module automatically determines the process completion time according to the monitoring data of etching depth and width. After the etching process reaches the set target parameters, the system will automatically stop the actuator, end the etching, and record and store the data.

[0015] The human-machine interface module is based on data from the intelligent termination and process recording module and transmits this data to the human-machine interface module in real time. The human-machine interface module provides an intuitive interface that displays the etching process, key parameters, and adjustment status in real time, making it convenient for operators to monitor and record.

[0016] A further improvement of the technical solution of the present invention is as follows: The etching tank is used to hold the etching solution and the printed circuit board to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control devices. This stage includes initial setting and parameter loading. In the initial setting, the operator places the printed circuit board (PCB) in the etching tank according to the etching requirements and inputs the initial process parameters through the human-machine interface. In the parameter loading, the system initializes the concentration, temperature and flow rate of the etching solution and preloads the etching rate target.

[0017] A further improvement of the technical solution of the present invention is as follows: The multi-dimensional sensor module: The system starts the multi-dimensional sensor to perform preliminary calibration. This module collects the temperature, concentration and flow rate data of the etching solution in the etching tank every second and records the time t. The information is then transmitted to the central controller in the control module for preliminary analysis.

[0018] A further improvement of the technical solution of the present invention is that: the control module includes a central controller, which calculates the etching rate based on the following nonlinear etching rate model:

[0019]

[0020] Where is the rate constant, set according to the etching material and liquid environment; is the concentration sensitivity index; represents the reaction activation energy; represents the gas constant; represents the real-time temperature; represents the real-time concentration, and the calculated real-time rate data is transmitted to the adaptive feedback adjustment module through the central controller in the control module.

[0021] A further improvement of the technical solution of the present invention is that: the adaptive feedback adjustment module compares the data transmitted by the control module; if the current etching rate deviates from the target rate, adaptive adjustment is initiated, as detailed below:

[0022] When the temperature is below a certain level, the system calculates the temperature increment to increase the etching rate.

[0023]

[0024] If this is exceeded, the system will reduce the temperature or concentration to slow down the etching rate, thereby preventing over-etching.

[0025] A further improvement of the technical solution of the present invention is that the cyclic control and dynamic optimization module: the system automatically adjusts itself based on the data comparison results of the adaptive feedback adjustment module and the deviation between the etching rate and the target rate. It continuously collects data, calculates the rate and executes the adjustment to form a real-time closed-loop control. The central controller will also automatically correct the parameter model to adapt it to different process conditions. The cyclic process runs continuously to ensure that the etching rate is always in the optimal range.

[0026] A further improvement of the technical solution of the present invention is that the intelligent termination and process recording module includes an intelligent termination unit and a process recording unit. The intelligent termination unit system automatically determines the process completion time based on the monitoring data of etching depth and width. When the etching process reaches the set target parameters, the system will automatically stop the actuator and end the etching.

[0027] A further improvement of the technical solution of the present invention is that the data recording unit stores all process data, including the real-time etching rate, temperature adjustment and concentration change curves, so as to facilitate future optimization and quality control.

[0028] A further improvement of the technical solution of the present invention is that the human-machine interface module provides an intuitive interface that displays the etching process, key parameters and adjustment status in real time, making it convenient for operators to monitor and record.

[0029] A further improvement of the technical solution of the present invention lies in: an automated control etching method for printed circuit boards, used to implement the automated control etching system for printed circuit boards as described in any one of claims 1-9, comprising the following steps:

[0030] Step 1: When the system starts, the operator puts the PCB board to be etched into the etching tank and inputs the target etching parameters through the human-machine interface;

[0031] Step 2: Once the system is started, the multi-dimensional sensor module will continuously monitor the key parameters in the etching tank. This data will be transmitted to the central controller for real-time analysis and processing.

[0032] Step 3: Based on the data provided by the sensor, the central controller will use the following nonlinear dynamic model to calculate the real-time etching rate. Through the formula, the system can calculate the real-time etching rate and compare it with the target rate.

[0033] Step 4: When the real-time etching rate deviates from the target rate, the system starts an adaptive control algorithm to adjust it. This algorithm calculates the required adjustment value based on the deviation of the etching rate. The adjustment process is cyclical. The system will collect data, calculate and adjust in each cycle to ensure that the etching rate is always kept within the target range.

[0034] Step 5: When the system detects that the set etching depth or width has reached the target value, the etching process will automatically stop. The key data of the entire etching process will be stored and recorded by the system for use by the operator or for subsequent process optimization.

[0035] Step Six: The system can also analyze the stored historical data and provide the best etching parameters and adjustment strategies for different types of PCBs, and display the data in real time through the human-computer interaction interface module.

[0036] Due to the adoption of the above technical solution, the technical progress achieved by this invention compared to the prior art is as follows:

[0037] 1. This invention provides an innovative automated control etching system and method for printed circuit boards. The system of this invention uses an adaptive algorithm to dynamically adjust the etching rate under different environmental conditions to ensure precise control of the etching process.

[0038] 2. The automated control etching system and method for printed circuit boards provided by the present invention, through a closed-loop control system, can keep the etching rate within the target range at all times, avoiding over-etching or insufficient etching.

[0039] 3. The present invention provides an automated control etching system and method for printed circuit boards. This system automatically stores data for each etching process, including parameter changes and adjustment processes, to accumulate data support for further process optimization. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0041] Figure 1 This is a flowchart of an automated control etching system and method for printed circuit boards according to the present invention; Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Examples, such as Figure 1 An automated control etching system for printed circuit boards includes an etching tank, a multi-dimensional sensor module, a control module, an intelligent actuator module, and a human-machine interface module.

[0044] Etching tank: Used to hold etching solution and printed circuit boards to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control equipment.

[0045] Multi-dimensional sensor module: integrates temperature sensor, concentration sensor and flow rate sensor for real-time monitoring of the temperature, concentration and flow rate of the etching solution;

[0046] Control module: including a central controller, which is based on an adaptive control algorithm, processes sensor data in real time, and calculates the required etch rate adjustment;

[0047] Adaptive feedback adjustment module: It automatically adjusts itself by comparing the detected etching rate with the set target rate;

[0048] Loop control and dynamic optimization: Continuously collect data, optimize and adjust the data to form a closed-loop system. The controller will also automatically correct the parameter model to ensure that the etching rate is always in the optimal range.

[0049] Intelligent Termination and Process Recording Module: Based on the loop control and dynamic optimization module, the intelligent termination and process recording module automatically determines the process completion time according to the monitoring data of etching depth and width. After the etching process reaches the set target parameters, the system will automatically stop the actuator, end the etching, and record and store the data.

[0050] Human-Machine Interface Module: Based on the data from the intelligent termination and process recording module, this data is transmitted to the human-machine interface module in real time. The human-machine interface module provides an intuitive interface that displays the etching process, key parameters, and adjustment status in real time, facilitating operator monitoring and recording.

[0051] Specifically, the etching tank is used to hold the etching solution and the printed circuit board to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control equipment. This stage includes initial setup and parameter loading. In the initial setup, the operator places the printed circuit board (PCB) in the etching tank according to the etching requirements and inputs the initial process parameters through the human-machine interface. Parameter loading: The system initializes the concentration, temperature and flow rate of the etching solution and preloads the etching rate target.

[0052] The operator places the PCB board into the etching tank and sets the target parameters of the etching process through the human-machine interface, including the target etching depth, etching time, initial temperature, initial concentration and flow rate. When the system starts, all sensors are initialized to detect and store the initial state of the etching solution.

[0053] Specifically, the multi-dimensional sensor module: The system starts the multi-dimensional sensor to perform preliminary calibration. This module collects the temperature, concentration, and flow rate data of the etching solution in the etching tank every second and records the time t. The information is then transmitted to the central controller in the control module for preliminary analysis.

[0054] Specifically, the control module includes a central controller, which calculates the etching rate based on the following nonlinear etching rate model:

[0055]

[0056] Where is the rate constant, set according to the etching material and liquid environment; is the concentration sensitivity index; represents the reaction activation energy; represents the gas constant; represents the real-time temperature; represents the real-time concentration, and the calculated real-time rate data is transmitted to the adaptive feedback adjustment module through the central controller in the control module.

[0057] The multi-dimensional sensor module starts up, collecting temperature, concentration, and flow rate data every second and transmitting the data to the central controller. The controller calculates the etching rate according to a nonlinear formula. The system calculates the etching rate at each moment using this formula and compares it with the target etching rate. If there is a deviation, it proceeds to the next step.

[0058] Specifically, the adaptive feedback adjustment module compares the data transmitted from the control module. If the current etching rate deviates from the target rate, adaptive adjustment is initiated. The specific analysis is as follows:

[0059] When the temperature is below a certain level, the system calculates the temperature increment and concentration to increase the etching rate.

[0060]

[0061] If this is exceeded, the system will reduce the temperature or concentration to slow down the etching rate, thereby preventing over-etching.

[0062] When the etching rate deviates from the target value, the central controller calculates the adjustment value through an adaptive algorithm. If the etching rate is lower than the target, the system calculates the temperature and concentration that need to be increased, and controls the equipment to heat, stir or replenish the etching solution through the controller module. If the etching rate exceeds the target, the temperature or concentration is reduced to reduce the reactivity of the etching solution. This adjustment process forms a closed-loop feedback until the etching rate stabilizes near the target value.

[0063] Specifically, the cyclic control and dynamic optimization module: The system automatically adjusts itself based on the data comparison results from the adaptive feedback adjustment module and the deviation between the etching rate and the target rate. It continuously collects data, calculates the rate, and executes adjustments to form a real-time closed-loop control. The central controller also automatically corrects the parameter model to adapt it to different process conditions. The cyclic process runs continuously to ensure that the etching rate is always within the optimal range.

[0064] When the system detects that etching is complete, the intelligent actuator automatically stops the operation in the etching tank. The system stores the temperature, concentration, and flow rate data and adjustment history of the entire etching process in the process data recording module for subsequent process analysis and optimization.

[0065] Specifically, the intelligent termination and process recording module includes an intelligent termination unit and a process recording unit. The intelligent termination unit system automatically determines the process completion time based on the monitoring data of etching depth and width. When the etching process reaches the set target parameters, the system will automatically stop the actuator and end the etching.

[0066] Specifically, the data recording unit stores all process data, including real-time etching rate, temperature adjustment, and concentration variation curves, for future optimization and quality control.

[0067] The data logging module analyzes the data from each etching process, identifies key factors affecting the etching rate, and provides recommended optimal etching parameters for different types of PCBs. This optimization information can be used to adjust the etching parameter library, thereby enabling intelligent improvements in subsequent processes and enhancing the efficiency and consistency of the etching process.

[0068] Specifically, the human-machine interface module provides an intuitive interface that displays the etching process, key parameters, and adjustment status in real time, facilitating operator monitoring and recording.

[0069] Specifically, an automated control etching method for printed circuit boards, used to implement the automated control etching system for printed circuit boards according to any one of claims 1-9, includes the following steps:

[0070] Step 1: When the system starts, the operator puts the PCB board to be etched into the etching tank and inputs the target etching parameters through the human-machine interface;

[0071] Step 2: Once the system is started, the multi-dimensional sensor module will continuously monitor the key parameters in the etching tank. This data will be transmitted to the central controller for real-time analysis and processing.

[0072] Step 3: Based on the data provided by the sensor, the central controller will use the following nonlinear dynamic model to calculate the real-time etching rate. Through the formula, the system can calculate the real-time etching rate and compare it with the target rate.

[0073] Step 4: When the real-time etching rate deviates from the target rate, the system starts an adaptive control algorithm to adjust it. This algorithm calculates the required adjustment value based on the deviation of the etching rate. The adjustment process is cyclical. The system will collect data, calculate and adjust in each cycle to ensure that the etching rate is always kept within the target range.

[0074] Step 5: When the system detects that the set etching depth or width has reached the target value, the etching process will automatically stop. The key data of the entire etching process will be stored and recorded by the system for use by the operator or for subsequent process optimization.

[0075] Step Six: The system can also analyze the stored historical data and provide the best etching parameters and adjustment strategies for different types of PCBs, and display the data in real time through the human-computer interaction interface module.

[0076] Working Principle: This intelligent etching control system achieves precise control of the etching process through closed-loop feedback. A multi-dimensional sensor module monitors key parameters of the etching solution in real time, including temperature, concentration, and flow rate. The central controller uses the sensor data to calculate the current etching rate and compares it with the preset target etching rate. When the actual etching rate deviates from the target value, the central controller's adaptive algorithm is activated, calculating the necessary temperature and concentration adjustments. Then, the control module precisely adjusts the temperature, replenishes the etching solution, and agitates the solution to restore the etching rate to the target range. Throughout the process, the system forms a dynamic closed-loop control within the etching tank, maintaining the stability of the etching process and ultimately achieving high-quality etching results. By combining real-time data acquisition, dynamic adjustment, closed-loop control, and adaptive algorithms, the system ensures high precision and consistency in the printed circuit board etching process, significantly improving production efficiency, reducing manual intervention, and making the etching quality more stable and reliable.

[0077] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An automated control etching system for printed circuit boards, characterized in that: It includes an etching tank, a multi-dimensional sensor module, a control module, an adaptive feedback adjustment module, a loop control and dynamic optimization module, an intelligent termination and process recording module, and a human-machine interface module. The etching tank is used to hold the etching solution and the printed circuit board to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control devices. The multi-dimensional sensor module integrates a temperature sensor, a concentration sensor, and a flow rate sensor to monitor the temperature, concentration, and flow rate of the etching solution in real time. The control module includes a central controller, which processes sensor data in real time based on an adaptive control algorithm and calculates the required etch rate. The adaptive feedback adjustment module: adjusts itself by comparing the detected etching rate with the set target rate; The cyclic control and dynamic optimization continuously collect data, optimize and adjust the data to form a closed-loop system, and the controller will also automatically correct the parameter model to ensure that the etching rate is always in the optimal range. The intelligent termination and process recording module: Based on the loop control and dynamic optimization module, the intelligent termination and process recording module automatically determines the process completion time according to the monitoring data of etching depth and width. After the etching process reaches the set target parameters, the system will automatically stop the actuator, end the etching, and record and store the data. The human-machine interface module is based on data from the intelligent termination and process recording module and transmits this data to the human-machine interface module in real time. The human-machine interface module provides an intuitive interface that displays the etching process, key parameters, and adjustment status in real time, making it convenient for operators to monitor and record.

2. The automated control etching system for printed circuit boards according to claim 1, characterized in that: The etching tank is used to hold the etching solution and the printed circuit board to be processed. The tank is equipped with temperature control, concentration adjustment, and flow rate control devices. The system startup phase includes initial setup and parameter loading. During initial setup, the operator places the printed circuit board in the etching tank according to the etching requirements and inputs the initial process parameters through the human-machine interface. Parameter loading involves initializing the concentration of the etching solution. ,temperature and flow rate and preload etch rate target .

3. The automated control etching system for printed circuit boards according to claim 2, characterized in that: The multi-dimensional sensor module: The system activates the multi-dimensional sensor for initial calibration. This module collects the temperature of the etching solution in the etching tank every second. ,concentration Flow rate The data is collected and the time t is recorded. The information is then transmitted to the central controller within the control module for preliminary analysis.

4. The automated control etching system for printed circuit boards according to claim 2, characterized in that: The control module includes a central controller, which calculates the etching rate based on a nonlinear etching rate model.

5. The automated control etching system for printed circuit boards according to claim 1, characterized in that: The adaptive feedback adjustment module compares the data transmitted by the control module.

6. The automated control etching system for printed circuit boards according to claim 1, characterized in that: The cyclic control and dynamic optimization module: The system automatically adjusts itself based on the data comparison results from the adaptive feedback adjustment module and the deviation between the etching rate and the target rate. It continuously collects data, calculates the rate, and executes adjustments to form a real-time closed-loop control. The central controller also automatically corrects the parameter model to adapt it to different process conditions. The cyclic process runs continuously to ensure that the etching rate is always within the optimal range.

7. The automated control etching system for printed circuit boards according to claim 1, characterized in that: The intelligent termination and process recording module includes an intelligent termination unit and a process recording unit. The intelligent termination unit system automatically determines the process completion time based on the monitoring data of etching depth and width. When the etching process reaches the set target parameters, the system will automatically stop the actuator and end the etching.

8. The automated control etching system for printed circuit boards according to claim 7, characterized in that: It also includes a data recording unit that stores all process data, including real-time etching rate, temperature and concentration variation curves, for future optimization and quality control.

9. The automated control etching system for printed circuit boards according to claim 1, characterized in that: The human-machine interface module provides an intuitive interface that displays the etching process, key parameters, and adjustment status in real time, facilitating operator monitoring and recording.

10. An automated control etching method for printed circuit boards, used to implement the automated control etching system for printed circuit boards according to any one of claims 1-9, comprising the following steps: Step 1: When the system starts, the operator puts the PCB board to be etched into the etching tank and inputs the target etching parameters through the human-machine interface; Step 2: Once the system is started, the multi-dimensional sensor module will continuously monitor the key parameters in the etching tank. This data will be transmitted to the central controller for real-time analysis and processing. Step 3: Based on the data provided by the sensor, the central controller will use the following nonlinear dynamic model to calculate the real-time etching rate. Through the formula, the system can calculate the real-time etching rate and compare it with the target rate. Step 4: When the real-time etching rate deviates from the target rate, the system starts an adaptive control algorithm to adjust it. This algorithm calculates the required adjustment value based on the deviation of the etching rate. The adjustment process is cyclical. The system will collect data, calculate and adjust in each cycle to ensure that the etching rate is always kept within the target range. Step 5: When the system detects that the set etching depth or width has reached the target value, the etching process will automatically stop. The key data of the entire etching process will be stored and recorded by the system for use by the operator or for subsequent process optimization. Step Six: The system can also analyze the stored historical data and provide the best etching parameters and adjustment strategies for different types of PCBs, and display the data in real time through the human-computer interaction interface module.

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