Computer data acquisition device with water-cooling heat dissipation mechanism

Abstract

The invention discloses a computer data acquisition device with a water-cooling heat dissipation mechanism, which structurally comprises a main body, a handrail, a photovoltaic panel, a box door and four pulleys, the handrail is arranged at the front end of the top of the main body, the photovoltaic panel is fixedly mounted on the top end face of the main body, the box door is rotatably connected with the side end face of the main body, and the four pulleys are fixedly mounted on the top end face of the main body. The pulleys are mounted on the bottom end surface of the main body; the water pump is used for conveying water to the heat absorption structure through the water inlet pipe, the water absorbing heat is conveyed to the heat dissipation water tank through the water inlet hole through the water outlet pipe, then the heat is transmitted to the wavy contact piece through the heat conduction plate, the heat dissipation speed is increased, and the fan works to dissipate heat of the contact piece; water in the heat dissipation water tank can be rapidly cooled, so that the heat absorption structure can keep heat absorption of the mainboard in the data processor, and the mainboard can work at a low temperature.

Description

Technical Field

[0001] The invention relates to the technical field of computer data acquisition, in particular to a computer data acquisition device with a water cooling mechanism. Background Art

[0002] Data acquisition refers to the automatic collection of non-electrical or electrical signals from analog and digital units under test such as sensors and other devices under test, and sending them to the host computer for analysis and processing. The data acquisition system is a flexible, user-defined measurement system that combines measurement software and hardware products based on computers or other special test platforms. When the data acquisition device is collecting data outdoors, it is necessary to move the data acquisition device outdoors to quickly collect and process the collected data.

[0003] Based on the above, the inventors have found that the existing computer data acquisition device with a water-cooling heat dissipation mechanism has the following main deficiencies. For example, the existing computer data acquisition device is prone to heat up when used outdoors. Coupled with the exposure to the sun, the acquisition device will be in a high-temperature working state, which affects the speed of the acquisition device for data acquisition and processing. In addition, the heat dissipation device in the acquisition device is cooled by a fan, and the heat dissipation speed of the fan is slow, making it difficult to lower the temperature of the mainboard in the acquisition device. Therefore, a computer data acquisition device with a water-cooling heat dissipation mechanism is needed to cool the auxiliary data acquisition device. Summary of the invention

[0004] In view of the above problems, the present invention provides a computer data collection device with a water cooling mechanism.

[0005] In order to achieve the above-mentioned purpose, the present invention is implemented through the following technical solutions: a computer data acquisition device with a water-cooling heat dissipation mechanism, the structure of which includes a main body, a handrail, a photovoltaic panel, a box door, and a pulley. The top front end of the main body is provided with a handrail, the photovoltaic panel is fixedly installed on the top end face of the main body, the box door is rotatably connected with the side end face of the main body, and the pulley is provided with four pulleys, and the pulley is installed on the bottom end face of the main body; the main body includes a data processor, a water-cooling heat dissipation mechanism, a power supply, and a control module, the data processor is installed at the inner bottom end of the main body, the water-cooling heat dissipation mechanism is arranged at the inner front end of the main body, the power supply is arranged at the inner top end of the main body, and the control module is located at the inner top end of the main body; The water-cooling heat dissipation mechanism is provided with a water tank, a heat dissipation structure, a water pump, a water inlet pipe, a heat absorption structure, and a water outlet pipe. The water tank is fixedly installed at the inner bottom end of the main body, the heat dissipation structure is arranged at the front end of the water tank, the water pump is connected to the rear end of the water tank, the water inlet pipe is connected to the water pump, the heat absorption structure is installed inside the data processor, and the heat absorption structure is connected to the inside of the water tank through the water outlet pipe; The heat dissipation structure is provided with a heat dissipation water tank, a heat conduction plate, a support seat, and a fan. The heat dissipation water tank is located inside the water tank, the heat conduction plate is connected to the heat dissipation water tank, the support seat is mounted on the end surface of the water tank, and four fans are provided, and the fans are installed inside the support seat; The heat conducting plate is provided with a water inlet hole, a water outlet hole, and a contact sheet. The water inlet hole is arranged at the upper left corner of the heat conducting plate, the water outlet hole is located at the lower left corner of the heat conducting plate, and seven contact sheets are arranged on the end surface of the heat conducting plate. The heat conducting plate and the contact sheet are both made of copper, and the contact sheet is in a wavy shape; The heat is absorbed by installing a heat-absorbing structure on the main board inside the data processor, and then water is filled in the water tank, and then the water is pumped to the heat-absorbing structure through the water inlet pipe. The heat in the heat-absorbing structure is absorbed by the large specific heat capacity of water, and the water that absorbs the heat is transported to the heat dissipation tank through the water inlet hole through the water outlet pipe. The heat conduction plate can absorb the temperature of the water in the heat dissipation tank, and then transfer the heat to the wave-shaped contact sheet through the heat conduction plate to accelerate the heat dissipation speed, so that the four fans can work to dissipate the heat from the contact sheet, so that the water in the heat dissipation tank can be cooled quickly.

[0006] Furthermore, the heat absorbing structure includes a mounting seat and a heat absorbing plate, and the mounting seat is connected to the heat absorbing plate by a clamping device; the mounting seat and the heat absorbing plate are combined to allow water to flow on the end surface of the heat absorbing plate to absorb heat.

[0007] Furthermore, the rear end of the mounting seat is connected to the water inlet pipe and the water outlet pipe.

[0008] Furthermore, fixing plates are provided on both side ends of the mounting seat, and the fixing plates can fix the mounting seat to the mainboard in the data processor.

[0009] Furthermore, the heat absorbing plate is provided with a heat conducting plate, a groove, and a convex piece. There are seven heat conducting plates, and the heat conducting plates are arranged vertically on the end surface of the heat absorbing plate. There are four grooves, and the grooves are symmetrically arranged on the upper end surface of the heat conducting plate. There are more than eight convex pieces, and the convex pieces are arranged on the end surfaces of the grooves. By making seven heat conducting plates contact with the water flow at the same time, and by arranging the convex pieces through the grooves on the end surfaces of the heat conducting plates, the contact area with the water flow can be increased, thereby improving the heat absorption effect of the water flow on the heat absorbing plate.

[0010] Furthermore, the heat absorbing plate is made of copper. Beneficial Effects

[0011] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention uses a water pump to transport water to the heat absorbing structure through the water inlet pipe, and transports the water that absorbs heat to the heat dissipation tank through the water inlet hole through the water outlet pipe, and then transfers the heat to the wave-shaped contact piece through the heat conduction plate to accelerate the heat dissipation speed, so that the fan works to dissipate the heat of the contact piece, so that the water in the heat dissipation tank can be quickly cooled, so that the heat absorbing structure can maintain the heat absorption of the mainboard in the data processor, so that the mainboard can maintain a low temperature to work.

[0012] 2. The present invention utilizes seven heat conducting plates to contact with the water flow at the same time, and then utilizes the grooves on the end faces of the heat conducting plates to set convex plates to increase the contact area with the water flow, thereby improving the heat absorption effect of the water flow on the heat absorbing plate, so that the heat absorbed by the heat conducting plates for the data processor can be quickly taken away by the water flow, allowing the motherboard to maintain a lower temperature to work. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The present invention is a schematic structural diagram of a main view acquisition device for computer data with a water cooling and heat dissipation mechanism.

[0014] Figure 2 It is a schematic diagram of the side cross-sectional structure of the main body of the present invention.

[0015] Figure 3 It is a schematic diagram of the cross-sectional structure of the water-cooling heat dissipation mechanism of the present invention from top view.

[0016] Figure 4 It is a schematic diagram of a top cross-sectional structure of the heat dissipation structure of the present invention.

[0017] Figure 5 It is a structural schematic diagram of the present invention.

[0018] Figure 6 It is a schematic diagram of the side cross-sectional structure of the heat conducting plate of the present invention.

[0019] Figure 7 It is a schematic diagram of the front cross-sectional structure of the heat absorbing plate of the present invention.

[0020] In the figure: main body 1, handrail 2, photovoltaic panel 3, box door 4, pulley 5, data processor 11, water cooling heat dissipation mechanism 12, power supply 13, control module 14, water tank 121, heat dissipation structure 122, water pump 123, water inlet pipe 124, heat absorption structure 125, water outlet pipe 126, heat dissipation water tank 1221, heat conduction plate 1222, support seat 1223, fan 1224, water inlet hole 61, water outlet hole 62, contact sheet 63, mounting seat 1251, heat absorption plate 1252, fixing plate 1253, heat conduction sheet 71, groove 72, protrusion 73. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0022] Example 1: Please refer to Figure 1-Figure 5 , the specific embodiments of the present invention are as follows: Its structure includes a main body 1, a handrail 2, a photovoltaic panel 3, a door 4, and a pulley 5. The handrail 2 is provided at the top front end of the main body 1, the photovoltaic panel 3 is fixedly installed on the top end surface of the main body 1, the door 4 is rotatably connected to the side end surface of the main body 1, and four pulleys 5 are provided, and the pulleys 5 are installed on the bottom end surface of the main body 1; the main body 1 includes a data processor 11, a water-cooling heat dissipation mechanism 12, a power supply 13, and a control module 14. The data processor 11 is installed at the inner bottom end of the main body 1, the water-cooling heat dissipation mechanism 12 is arranged at the inner front end of the main body 1, the power supply 13 is arranged at the inner top end of the main body 1, and the control module 14 is located at the inner top end of the main body 1; The water-cooling heat dissipation mechanism 12 is provided with a water tank 121, a heat dissipation structure 122, a water pump 123, a water inlet pipe 124, a heat absorption structure 125, and a water outlet pipe 126. The water tank 121 is fixedly installed at the inner bottom end of the main body 1, the heat dissipation structure 122 is arranged at the front end of the water tank 121, the water pump 123 is connected to the rear end of the water tank 121, the water inlet pipe 124 is connected to the water pump 123, the heat absorption structure 125 is installed inside the data processor 11, and the heat absorption structure 125 is connected to the inside of the water tank 121 through the water outlet pipe 126; The heat dissipation structure 122 is provided with a heat dissipation water tank 1221, a heat conducting plate 1222, a support seat 1223, and a fan 1224. The heat dissipation water tank 1221 is located inside the water tank 121, the heat conducting plate 1222 is connected to the heat dissipation water tank 1221, the support seat 1223 is mounted on the end surface of the water tank 121, and four fans 1224 are provided, and the fans 1224 are installed inside the support seat 1223; The heat conducting plate 1222 is provided with a water inlet hole 61, a water outlet hole 62, and a contact sheet 63. The water inlet hole 61 is provided at the upper left corner of the heat conducting plate 1221, the water outlet hole 62 is located at the lower left corner of the heat conducting plate 1222, and seven contact sheets 63 are provided, and the contact sheets 63 are provided on the end surface of the heat conducting plate 1222; The heat conducting plate 1222 and the contact sheet 63 are both made of copper, and the contact sheet 63 is wavy in shape; The heat absorbing structure 125 is installed on the mainboard inside the data processor 11 to absorb heat, and then water is filled in the water tank 121, and then the water is transported to the heat absorbing structure 125 through the water inlet pipe 124 by the water pump 123. The heat in the heat absorbing structure 125 is absorbed by the large specific heat capacity of water, and the water that absorbs heat is transported to the heat dissipation water tank 1221 through the water inlet hole 61 through the water outlet pipe 126, and the heat conducting plate 1222 can absorb the temperature of the water in the heat dissipation water tank 1221, and then the heat is transferred to the wave-shaped contact sheet 63 through the heat conducting plate 1222 to accelerate the heat dissipation speed.

[0023] Based on the above embodiment, the specific working principle is as follows: the heat absorbing structure 125 is installed on the mainboard inside the data processor 11 to absorb heat, and then water is filled in the water tank 121, and then the water is transported to the heat absorbing structure 125 through the water inlet pipe 124 by the water pump 123. The heat in the heat absorbing structure 125 is absorbed by the large specific heat capacity of water, and the water that absorbs heat is transported to the heat sink 1221 through the water inlet hole 61 through the water outlet pipe 126, and the heat conducting plate 1222 can absorb the temperature of the water in the heat sink 1221, and then the heat is transferred to the heat sink 1221 through the heat conducting plate 1222. The heat is transferred to the wave-shaped contact sheet 63 to speed up the heat dissipation, so that the four fans 1224 can work to dissipate the heat from the contact sheet 63, and the water in the heat dissipation tank 1221 can be quickly cooled down, so that the heat absorption structure 125 can keep absorbing heat from the main board in the data processor 11, so that the main board can maintain a low temperature to work, and the data processor 11 can quickly process the collected data; the main body 1 is equipped with a pulley 5 and can be pushed and moved by the handrail 2 for easy use outdoors, and the photovoltaic panel 3 can convert solar energy into electrical energy and store it in the power supply 13 for power supply.

[0024] Example 2: Please refer to Figure 6-Figure 7 , the specific embodiments of the present invention are as follows: The heat absorption structure 125 includes a mounting seat 1251 and a heat absorption plate 1252, wherein the mounting seat 1251 is connected to the heat absorption plate 1252 by a clamping mechanism; the mounting seat 1251 and the heat absorption plate 1252 are combined to allow water to flow on the end surface of the heat absorption plate 1252 to absorb heat.

[0025] The rear end of the mounting seat 1251 is connected to the water inlet pipe 124 and the water outlet pipe 126 .

[0026] The two side ends of the mounting seat 1251 are provided with fixing plates 1253 , and the fixing plates 1253 can fix the mounting seat 1251 to the mainboard of the data processor 11 .

[0027] The heat absorbing plate 1252 is provided with a heat conducting sheet 71, a groove 72, and a convex piece 73. The heat conducting sheets 71 are provided with seven and are arranged vertically on the end surface of the heat absorbing plate 1252. The grooves 72 are provided with four and are symmetrically arranged on the upper end surface of the heat conducting sheet 71. The convex pieces 73 are provided with more than eight and are arranged on the end surfaces of the grooves 72. The contact area with the water flow can be increased by the seven heat conducting sheets 71 being in contact with the water flow at the same time and the convex piece 73 being arranged on the groove 72 on the end surface of the heat conducting sheet 71.

[0028] The heat absorbing plate 1252 is made of copper.

[0029] Based on the above embodiment, the specific working principle is as follows: the mounting base 1251 is combined with the heat absorbing plate 1252 to allow the water flow to flow on the end surface of the heat absorbing plate 1252 to absorb heat, and then seven heat conductive plates 71 are used to contact the water flow at the same time, and then the groove 72 on the end surface of the heat conductive plate 71 is used to set the protrusion 73 to increase the contact area with the water flow, thereby improving the heat absorption effect of the water flow on the heat absorbing plate 1252, so that the heat absorbed by the heat conductive plate 71 for the data processor 11 can be quickly taken away by the water flow, so that the mainboard can maintain a low temperature to work, and the data processor 11 can quickly process the collected data.

[0030] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0031] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and range of equivalent elements of the claims are included in the present invention. Any reference sign in the claims should not be regarded as limiting the claims involved.

Claims

1. A computer data acquisition device with a water cooling mechanism, comprising a main body (1), a handrail (2), a photovoltaic panel (3), a door (4), and a pulley (5), wherein the main body (1) is provided with a handrail (2) at the top front end, the photovoltaic panel (3) is fixedly mounted on the top end surface of the main body (1), the door (4) is rotatably connected to the side end surface of the main body (1), and four pulleys (5) are provided, and the pulleys (5) are mounted on the bottom end surface of the main body (1); the characteristics are as follows: The main body (1) comprises a data processor (11), a water cooling and heat dissipation mechanism (12), a power supply (13), and a control module (14); the data processor (11) is mounted at the bottom end of the main body (1); the water cooling and heat dissipation mechanism (12) is arranged at the front end of the main body (1); the power supply (13) is arranged at the top end of the main body (1); and the control module (14) is located at the top end of the main body (1); The water-cooling heat dissipation mechanism (12) is provided with a water tank (121), a heat dissipation structure (122), a water pump (123), a water inlet pipe (124), a heat absorption structure (125), and a water outlet pipe (126); the water tank (121) is fixedly mounted on the bottom end of the interior of the main body (1); the heat dissipation structure (122) is arranged at the front end of the water tank (121); the water pump (123) is connected to the rear end of the water tank (121); the water inlet pipe (124) is connected to the water pump (123); the heat absorption structure (125) is mounted inside the data processor (11); and the heat absorption structure (125) is connected to the interior of the water tank (121) via the water outlet pipe (126); The heat dissipation structure (122) is provided with a heat dissipation water trough (1221), a heat conduction plate (1222), a support seat (1223), and a fan (1224); the heat dissipation water trough (1221) is located inside the water tank (121); the heat conduction plate (1222) is connected to the heat dissipation water trough (1221); the support seat (1223) is mounted on the end surface of the water tank (121); four fans (1224) are provided, and the fans (1224) are mounted inside the support seat (1223); The heat conducting plate (1222) is provided with a water inlet hole (61), a water outlet hole (62), and a contact sheet (63); the water inlet hole (61) is arranged at the upper left corner of the heat conducting plate (1221); the water outlet hole (62) is located at the lower left corner of the heat conducting plate (1222); seven contact sheets (63) are provided, and the contact sheets (63) are arranged on the end surface of the heat conducting plate (1222); The heat conducting plate (1222) and the contact sheet (63) are both made of copper, and the contact sheet (63) is in a wave shape.

2. The computer data acquisition device with a water cooling mechanism according to claim 1, characterized in that: The heat absorbing structure (125) comprises a mounting seat (1251) and a heat absorbing plate (1252), and the mounting seat (1251) and the heat absorbing plate (1252) are connected by a clamping arrangement.

3. The computer data acquisition device with a water cooling mechanism according to claim 2, characterized in that: The rear end of the mounting seat (1251) is connected to the water inlet pipe (124) and the water outlet pipe (126).

4. The computer data acquisition device with a water cooling mechanism according to claim 2, characterized in that: Fixed plates (1253) are provided at both side ends of the mounting seat (1251), and the fixed plates (1253) are capable of fixing the mounting seat (1251) on a mainboard in the data processor (11).

5. The computer data acquisition device with a water cooling mechanism according to claim 2, characterized in that: The heat absorbing plate (1252) is provided with a heat conducting plate (71), a groove (72), and a convex plate (73); seven heat conducting plates (71) are provided, and the heat conducting plates (71) are arranged vertically on the end surface of the heat absorbing plate (1252); four grooves (72) are provided, and the grooves (72) are symmetrically arranged on the upper end surface of the heat conducting plate (71); and more than eight convex plates (73) are provided, and the convex plates (73) are arranged on the end surface of the grooves (72).

6. The computer data acquisition device with a water cooling mechanism according to claim 2, characterized in that: The heat absorbing plate (1252) is made of copper.

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