Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment, and belongs to the field of circuit boards. The circuit board assembly comprises a circuit board body which is provided with an electronic component; the shielding cover is arranged on the circuit board body, the electronic element is contained in the shielding cover, an opening is formed in the shielding cover, a connecting groove is formed in the outer surface of the shielding cover, and a connecting piece is arranged in the connecting groove; and the shielding piece is arranged on the outer surface of the shielding cover and fixedly connected with the connecting piece, and the shielding piece covers the opening.

Description

Technical Field

[0001] The present application belongs to the field of circuit boards, and specifically relates to a circuit board assembly and an electronic device. Background Art

[0002] With the development of science and technology, electronic devices have become tools for people's daily use. They can take pictures, watch videos, communicate remotely, etc. Usually, electronic devices are provided with circuit board assemblies, and electronic components are provided on the circuit board assemblies. The electronic components are covered by shielding assemblies to prevent the shielding assemblies from affecting the antenna and other components of the electronic device. However, in the related art, the shielding assemblies are prone to failure over time, causing the electronic components to affect the antenna of the electronic device, affecting the communication of the electronic device. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a circuit board assembly and an electronic device, which at least solves the problem that the shielding assembly is prone to failure, causing the electronic components to affect the antenna of the electronic device and affect the communication of the electronic device.

[0004] In a first aspect, an embodiment of the present application provides a circuit board assembly, the circuit board assembly comprising:

[0005] A circuit board body, on which electronic components are arranged;

[0006] A shielding cover, wherein the shielding cover is arranged on the circuit board body, and the electronic component is accommodated in the shielding cover, the shielding cover is provided with an opening, and the outer surface of the shielding cover is provided with a connecting groove, and a connecting piece is provided in the connecting groove;

[0007] A shielding member is disposed on the outer surface of the shielding cover and is fixedly connected to the connecting member, and the shielding member covers the opening.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, characterized in that the electronic device includes a housing and the circuit board assembly described in the first aspect above;

[0009] The circuit board assembly is disposed in the housing.

[0010] In the embodiment of the present application, since the electronic components are arranged on the circuit board body, the shielding cover is arranged on the circuit board body, and the electronic components are accommodated in the shielding cover, the shielding cover can shield the electronic components. Since the shielding cover is provided with an opening, and the shielding member covers the opening, the combination of the shielding member and the shielding cover can ensure that the electronic components can be well shielded, thereby preventing the electronic components from affecting the antenna of the electronic device. Since the outer surface of the shielding cover is provided with a connecting groove, a connecting member is arranged in the connecting groove, and the shielding member is arranged on the outer surface of the shielding cover and fixedly connected to the connecting member, the shielding member and the shielding cover can be fixedly connected by relying on the connecting member, thereby preventing the shielding member and the shielding cover from being separated over time, or the shielding member from covering the opening less, resulting in the problem of the electronic components affecting the antenna of the electronic device. That is, in the embodiment of the present application, a connecting groove is provided on the outer surface of the shielding cover, and a connecting member is provided in the connecting groove, so that the shielding member and the connecting member can be fixedly connected, and the opening on the shielding cover is covered, thereby ensuring that the shielding member is fixedly connected to the shielding cover through the connecting member, and avoiding the possibility that the shielding member and the shielding cover may be separated over time, resulting in the opening on the shielding cover being affected, and further causing the electronic components to affect the antenna of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 An isometric view showing a circuit board assembly provided in an embodiment of the present application;

[0012] Figure 2 A schematic diagram showing that a conductive adhesive is disposed on a shielding member provided in an embodiment of the present application, and the shielding member is separated from a shielding cover;

[0013] Figure 3 A schematic diagram showing that a conductive adhesive is disposed on a shielding member provided in an embodiment of the present application, and the shielding member is connected to a shielding cover;

[0014] Figure 4 A schematic diagram showing that a fixing assembly is arranged on a shielding member provided in an embodiment of the present application, and the shielding member is separated from the shielding cover;

[0015] Figure 5 A schematic diagram showing that a fixing component is arranged on a shielding member provided in an embodiment of the present application, and the shielding member is connected to a shielding cover;

[0016] Figure 6 A schematic diagram showing a shielding member provided in an embodiment of the present application having a folded edge and being separated from a shielding cover;

[0017] Figure 7 A schematic diagram showing a shielding member provided in an embodiment of the present application having a folded edge and connected to a shielding cover.

[0018] Reference numerals:

[0019] 10: circuit board body; 101: electronic component; 20: shielding cover; 21: top wall; 22: side wall; 201: opening; 202: connecting groove; 30: shielding member; 31: shielding body; 32: folded edge; 301: conductive adhesive; 302: avoidance groove; 40: connecting member; 50: fixing component; 51: substrate; 52: adhesive layer. DETAILED DESCRIPTION

[0020] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0021] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] like Figures 1 to 7 As shown, a circuit board assembly provided in an embodiment of the present application includes: a circuit board body 10, on which an electronic component 101 is arranged; a shielding cover 20, which is arranged on the circuit board body 10, and the electronic component 101 is accommodated in the shielding cover 20, an opening 201 is arranged on the shielding cover 20, and a connecting groove 202 is arranged on the outer surface of the shielding cover 20, in which a connecting member 40 is arranged; a shielding member 30, which is arranged on the outer surface of the shielding cover 20 and fixedly connected to the connecting member 40, and the shielding member 30 covers the opening 201.

[0024] In the embodiment of the present application, since the electronic component 101 is arranged on the circuit board body 10, the shielding cover 20 is arranged on the circuit board body 10, and the electronic component 101 is accommodated in the shielding cover 20, the shielding cover 20 can shield the electronic component 101. Since the shielding cover 20 is provided with an opening 201, and the shielding member 30 covers the opening 201, the combination of the shielding member 30 and the shielding cover 20 can ensure that the electronic component 101 can be well shielded, and avoid the electronic component 101 from affecting the antenna of the electronic device. Since the outer surface of the shielding cover 20 is provided with a connecting groove 202, and the connecting member 40 is arranged in the connecting groove 202, the shielding member 30 is arranged on the outer surface of the shielding cover 20, and is fixedly connected with the connecting member 40, the shielding member 30 and the shielding cover 20 can be fixedly connected by relying on the connecting member 40, so as to avoid the shielding member 30 and the shielding cover 20 being separated over time, or the shielding member 30 covering the opening 201 is reduced, resulting in the problem that the electronic component 101 affects the antenna of the electronic device. That is, in the embodiment of the present application, a connecting groove 202 is provided on the outer surface of the shielding cover 20, and a connecting member 40 is provided in the connecting groove 202, so that the shielding member 30 can be fixedly connected to the connecting member 40, and the opening 201 on the shielding cover 20 is covered, thereby ensuring that the shielding member 30 is fixedly connected to the shielding cover 20 through the connecting member 40, and avoiding the shielding member 30 and the shielding cover 20 to be separated over time, resulting in the shielding of the opening 201 on the shielding cover 20 being affected, thereby causing the electronic component 101 to affect the antenna of the electronic device.

[0025] In the related art, a circuit board assembly generally includes a circuit board body 10, an electronic component 101 and a shielding cover 20 are arranged on the circuit board body 10, the shielding cover 20 is fixedly connected to the circuit board body 10, and the shielding cover 20 covers the electronic component 101, and an opening 201 is arranged on the shield, and the shielding material is bonded to the surface of the shielding cover 20 through a conductive adhesive 301, and the shielding material covers the opening 201, so that the shielding material and the shielding cover 20 can form a Faraday cage to achieve electromagnetic shielding and prevent the electronic component 101 from affecting the antenna of the electronic device. However, during the operation of the electronic device, the frequency of the electronic component 101 may be high, so that the temperature of the electronic component 101 increases, or when the electronic device is in a high temperature and high humidity environment, or in a hot and cold shock environment, the conductive adhesive 301 will be due to the aging of the adhesive surface, thermal expansion and contraction, etc., the shielding material is prone to warping, and the adhesive surface of the conductive adhesive 301 is misaligned, thereby causing electromagnetic leakage, causing interference to the antenna of the electronic device, and affecting the communication of the electronic device.

[0026] In the embodiment of the present application, a connecting groove 202 is provided on the outer surface of the shielding cover 20, and a connecting member 40 is provided in the connecting groove 202. Therefore, when the shielding member 30 is provided on the outer surface of the shielding cover 20, the shielding member 30 can be fixedly connected with the connecting member 40. Thus, the connecting member 40 can fix the shielding member 30 with the shielding cover 20, and the shielding member 30 covers the opening 201 on the shielding cover 20. Thus, the shielding member 30 and the shielding cover 20 can better electromagnetically shield the electronic component 101, thereby avoiding the shielding member 30 and the shielding cover 20 from being easily separated, resulting in electromagnetic leakage, and further causing the electronic component 101 to interfere with the antenna of the electronic device.

[0027] It should be noted that in the embodiment of the present application, the electronic component 101 may be a system on chip (SOC), and of course, the electronic component 101 may also be a dynamic random access memory. The specific type of the electronic component 101 is not limited in the embodiment of the present application.

[0028] In addition, in the embodiment of the present application, the shielding cover 20 can be fixedly connected to the circuit board body 10 , for example, the shielding cover 20 and the circuit board body 10 are welded.

[0029] In addition, in the embodiment of the present application, the electronic component 101 can be welded to the circuit board body 10 , that is, the electronic component 101 can be welded to the pad on the circuit board body 10 , so that the electronic component 101 is fixed on the circuit board body 10 .

[0030] In addition, in the embodiment of the present application, the connector 40 can be low-temperature solder paste, conductive silver paste, etc. Of course, the connector 40 can also be other devices with connection functions, for example, the connector 40 is a screw. The specific type of the connector 40 is not limited in the embodiment of the present application.

[0031] Among them, when the connecting part 40 is a low-temperature solder paste, the low-temperature solder paste can be set in the connecting groove 202 in advance. After the shielding part 30 is placed on the outer surface of the shielding cover 20, the low-temperature solder paste can be melted through a furnace process. The melted low-temperature solder paste will fill the connecting groove 202 and contact the shielding part 30. After the low-temperature solder paste solidifies, the low-temperature solder paste can fix the shielding part 30 and the shielding cover 20 to avoid the shielding part 30 and the shielding cover 20 being easily separated, resulting in the electronic component 101 possibly affecting the antenna of the electronic device.

[0032] When the connector 40 is a conductive silver paste, the conductive silver paste can be pre-set in the connecting groove 202. After the shielding component 30 is placed on the outer surface of the shielding cover 20, the conductive silver paste not only fills the connection, but also contacts the shielding component 30, so that the conductive silver paste can solidify. The conductive silver paste can then fix the shielding component 30 and the shielding cover 20, thereby avoiding the problem that the shielding component 30 and the shielding cover 20 are easily separated, resulting in the electronic component 101 possibly affecting the antenna of the electronic device.

[0033] In addition, in some embodiments, a surface of the shielding member 30 facing the shielding cover 20 may be provided with a conductive adhesive 301 , and the shielding member 30 and the shielding cover 20 are bonded together by the conductive adhesive 301 .

[0034] Since the surface of the shielding member 30 facing the shielding cover 20 can be provided with conductive glue 301, after the shielding member 30 is provided on the shielding cover 20, the shielding member 30 can first be bonded to the shielding cover 20 through the conductive glue 301, so as to initially position the shielding member 30, and avoid the shielding member 30 from shaking relative to the shielding cover 20, which may cause the subsequent connector 40 to be difficult to fix the shielding member 30 to the shielding cover 20. That is, by providing the conductive glue 301, when the shielding member 30 needs to be fixedly connected to the shielding cover 20, the conductive glue 301 can be used to initially position the shielding member 30, so as to facilitate the connector 40 to fix the shielding member 30 to the shielding cover 20, and further ensure that the shielding member 30 and the shielding cover 20 are not easily separated, and avoid the problem that the electronic component 101 affects the antenna of the electronic device.

[0035] It should be noted that the shielding member 30 may be a conductive copper foil, and of course, the shielding member 30 may also be made of other metal materials, for example, the shielding member 30 is a silver foil. The specific material of the shielding member 30 is not limited in the present embodiment.

[0036] In addition, in the embodiment of the present application, in order to avoid the circuit board assembly occupying a large space in the electronic device, the thickness of the conductive adhesive 301 can be set to avoid the conductive adhesive 301 being too thick, which will increase the size of the circuit board assembly, and then cause the circuit board assembly to occupy a large space in the electronic device, thereby reducing the space utilization rate inside the electronic device. Among them, the thickness of the conductive adhesive 301 can be set according to actual needs, for example, the thickness of the conductive adhesive 301 is 0.5 mm, and for another example, the thickness of the conductive adhesive 301 is 0.3 mm. The specific thickness of the conductive adhesive 301 is not limited in the embodiment of the present application, and it is only necessary that the conductive adhesive 301 can bond the shielding member 30 and the shielding cover 20.

[0037] In addition, in some embodiments, a avoidance groove 302 may be provided on the conductive adhesive 301 , the avoidance groove 302 is opposite to the connection groove 202 , and the connection member 40 extends into the avoidance groove 302 and is connected to the shielding member 30 .

[0038] Since the conductive adhesive 301 is provided with the avoidance groove 302, and the avoidance groove 302 is opposite to the connection groove 202, the connection member 40 can be extended into the avoidance groove 302, so that the connection member 40 directly contacts the shielding member 30, so that the shielding member 30 is more firmly connected to the shielding cover 20. That is, by providing the avoidance groove 302 on the conductive adhesive 301, it can be ensured that the shielding member 30 is firmly connected to the shielding cover 20, and the shielding member 30 and the shielding cover 20 are prevented from being easily separated, resulting in the problem that the electronic component 101 affects the antenna of the electronic device.

[0039] For example, when the connector 40 is low-temperature solder paste, after the low-temperature solder paste is placed in the connection groove 202, once the shielding member 30 is placed on the outer surface of the shielding cover 20, the avoidance groove 302 can be opposite to the connection groove 202, so that when the circuit board assembly is passed through the furnace, the low-temperature solder paste melts and fills the connection groove 202, and the melted low-temperature solder paste also enters the avoidance groove 302, so that the melted low-temperature solder paste can directly contact the shielding member 30, and after the low-temperature solder paste solidifies, the low-temperature solder paste can firmly connect the shielding member 30 with the shielding cover 20. If the avoidance groove 302 is not provided on the conductive adhesive 301, the low-temperature solder paste will contact the conductive adhesive 301, affecting the firmness of the solidified low-temperature solder paste connecting the shielding member 30 with the shielding cover 20.

[0040] It should be noted that the shape of the avoidance groove 302 can be the same as the shape of the connecting groove 202. For example, if the connecting groove 202 is square in shape, then the avoidance groove 302 is square in shape. For another example, if the connecting groove 202 is circular in shape, then the avoidance groove 302 is circular in shape.

[0041] In addition, in some embodiments, the melting point of the connector 40 is lower than the melting point of the conductive adhesive 301. The connector 40 may be low-temperature solder paste or conductive silver paste.

[0042] When the melting point of the connector 40 is lower than the melting point of the conductive adhesive 301, once the connector 40 is placed in the connection groove 202 and the shielding member 30 is placed on the outer surface of the shielding cover 20, when the circuit board assembly is put through the furnace, the connector 40 will melt, but the conductive adhesive 301 will not melt, thereby preventing the conductive adhesive 301 from melting, causing the conductive adhesive 301 to mix with the melted connector 40, and after the connector 40 solidifies, affecting the firmness of the connector 40 in fixing the shielding cover 20 with the shielding member 30. That is, by setting the melting point of the connector 40 lower than the melting point of the conductive adhesive 301, it can be ensured that the shielding member 30 and the shielding cover 20 are connected more firmly through the connector 40, thereby preventing the shielding member 30 and the shielding cover 20 from being easily separated, causing the problem of the electronic component 101 affecting the antenna of the electronic device.

[0043] When the connecting member 40 is low temperature solder paste, the melting point of the low temperature solder paste is lower than the melting point of the conductive adhesive 301 .

[0044] In addition, in some embodiments, a surface of the shielding member 30 facing away from the shielding cover 20 may be provided with a fixing assembly 50 , which covers at least a portion of the surface of the shielding member 30 facing away from the shielding cover 20 , and is connected to the shielding cover 20 .

[0045] Since the surface of the shielding member 30 facing away from the shielding cover 20 can be provided with a fixing component 50, and the fixing component 50 covers at least a portion of the surface of the shielding member 30 facing away from the shielding cover 20, after the shielding member 30 is provided on the surface of the shielding cover 20, it can be connected to the shielding cover 20 through the portion of the fixing component 50 extending outside the shielding member 30, so that the portion of the fixing component 50 can initially position the shielding member 30, thereby preventing the shielding member 30 from shaking relative to the shielding cover 20, which would subsequently be detrimental to the problem of the connector 40 fixing the shielding member 30 and the shielding cover 20.

[0046] It should be noted that the fixing component 50 can cover the entire surface of the shielding member 30 away from the shielding cover 20, and the area of ​​the fixing component 50 is larger than the area of ​​the shielding member 30, so that when the shielding member 30 needs to be connected to the shielding cover 20, the fixing component 50 extending outside the shielding member 30 can be used to initially position the shielding member 30 and initially fix the shielding member 30, so that it is convenient for the subsequent connector 40 to fix the shielding member 30 to the shielding cover 20, thereby avoiding the problem that the shielding member 30 and the shielding cover 20 are easily separated, resulting in the electronic component 101 affecting the antenna of the electronic device. Of course, the fixing component 50 can cover part of the surface of the shielding member 30 away from the shielding cover 20, but part of the fixing component 50 extends outside the shielding member 30, and the shielding member 30 can be initially positioned by the fixing component 50 extending outside the shielding member 30.

[0047] It should be noted that the portion of the fixing assembly 50 extending outside the shielding member 30 can be bent, so that the portion of the fixing assembly 50 can be connected to the shielding cover 20 .

[0048] In addition, in some embodiments, the fixing component 50 may include a substrate 51 and an adhesive layer 52, the substrate 51 and the adhesive layer 52 are stacked, and the area of ​​the adhesive layer 52 is larger than the area of ​​the shielding component 30, the area of ​​the substrate 51 is larger than the area of ​​the shielding component 30, and the area of ​​the substrate 51 is equal to the area of ​​the adhesive layer 52, part of the adhesive layer 52 is bonded to the shielding component 30, and another part of the adhesive layer 52 is bonded to the shielding cover 20.

[0049] Since the substrate 51 and the adhesive layer 52 are stacked, and the area of ​​the adhesive layer 52 is larger than the area of ​​the shielding part 30, the area of ​​the substrate 51 is larger than the area of ​​the shielding part 30, and the area of ​​the substrate 51 is equal to the area of ​​the adhesive layer 52, therefore, after the shielding part 30 is placed on the outer surface of the shielding cover 20, the adhesive layer 52 extending outside the shielding part 30 can be bonded to the shielding cover 20, and the adhesive layer 52 bonds the shielding part 30 to the substrate 51, so that the substrate 51 extending outside the shielding part 30 is connected to the shielding cover 20 through the adhesive layer 52, which is equivalent to the fixed connection between the part of the substrate 51 and the shielding cover 20, and the shielding part 30 is initially positioned, that is, the shielding part 30 is initially fixed to avoid the shielding part 30 from shaking relative to the shielding cover 20, which is not conducive to the subsequent fixed connection between the connecting part 40 and the shielding cover 20. That is, by setting a substrate 51 and an adhesive layer 52, and the substrate 51 and the adhesive layer 52 are stacked, and the area of ​​the adhesive layer 52 is larger than the area of ​​the shielding part 30, the area of ​​the substrate 51 is larger than the area of ​​the shielding part 30, and the area of ​​the substrate 51 is equal to the area of ​​the adhesive layer 52, so that when it is necessary to connect the shielding part 30 with the shielding cover 20, the substrate 51 and the shielding cover 20 can be bonded by the adhesive layer 52 extending outside the shielding part 30, so as to initially position the shielding part 30, and initially fix the shielding part 30, so as to facilitate the subsequent connection part 40 to fix the shielding part 30 with the shielding cover 20, thereby avoiding the shielding part 30 and the shielding cover 20 being easily separated, resulting in the problem of the electronic component 101 affecting the antenna of the electronic device.

[0050] For example, when the connector 40 is low-temperature solder paste, after the low-temperature solder paste is placed in the connecting groove 202, when the shielding component 30 is placed on the outer surface of the shielding cover 20, the adhesive layer 52 extending outside the shielding component 30 can be bonded to the shielding cover 20, thereby bonding the substrate 51 extending outside the shielding component 30 to the shielding cover 20. The substrate 51 can initially fix the shielding component 30, so that when the circuit board assembly is passed through the furnace, the shielding component 30 is not easy to shake relative to the shielding cover 20, which can facilitate the contact between the shielding component 30 and the low-temperature solder paste after it melts, and then the shielding component 30 and the shielding cover 20 are firmly connected after the low-temperature solder paste solidifies.

[0051] It should be noted that the substrate 51 may be a PET substrate. Of course, the material of the substrate 51 may also be other materials. For example, the material of the substrate 51 is a PP substrate. The specific material of the substrate 51 is not limited in the embodiment of the present application.

[0052] In addition, in some embodiments, the melting point of the connector 40 is lower than the melting point of the adhesive layer 52, and the melting point of the connector 40 is lower than the melting point of the substrate 51. The connector 40 may be low-temperature solder paste or conductive silver paste.

[0053] When the melting point of the connector 40 is lower than the melting point of the adhesive layer 52, and the melting point of the connector 40 is lower than the melting point of the substrate 51, at this time, once the connector 40 is placed in the connection groove 202, and the shielding member 30 is placed on the outer surface of the shielding cover 20, when the circuit board assembly is passed through the furnace, the connector 40 will melt, but the adhesive layer 52 and the substrate 51 will not melt, thereby preventing the adhesive layer 52 and the substrate 51 from melting, causing the adhesive layer 52 to mix with the melted connector 40, and after the connector 40 solidifies, affecting the firmness of the connector 40 to fix the shielding cover 20 and the shielding member 30. That is, by setting the melting point of the connector 40 to be lower than the melting point of the adhesive layer 52, and the melting point of the connector 40 to be lower than the melting point of the substrate 51, it can be ensured that the shielding member 30 and the shielding cover 20 are connected more firmly through the connector 40, thereby preventing the shielding member 30 and the shielding cover 20 from being easily separated, causing the problem of the electronic component 101 affecting the antenna of the electronic device.

[0054] When the connector 40 is low temperature solder paste, the melting point of the low temperature solder paste is lower than the melting point of the adhesive layer 52 , and the melting point of the low temperature solder paste is lower than the melting point of the substrate 51 .

[0055] In addition, in some embodiments, the shielding member 30 may include a shielding body 31 and a folded edge 32 that are interconnected, and the folded edge 32 is arranged around the shielding body 31, and the shielding cover 20 includes a top wall 21 and a side wall 22 that are interconnected, the side wall 22 is arranged around the top wall 21, and the side wall 22 is connected to the circuit board body, the top wall 21, the side wall 22 and the circuit board body enclose a shielding space, and the electronic component 101 is located in the shielding space; the shielding body 31 is opposite to the top wall 21, and the shielding body 31 is in contact with the top wall 21, the folded edge 32 is in contact with the side wall 22, at least one of the top wall 21 and the side wall 22 is provided with a connecting groove 202, and an opening 201 is provided on the top wall 21.

[0056] Since the shielding body 31 is positioned opposite to the top wall 21, and the shielding body 31 is in contact with the top wall 21, the folded edge 32 is in contact with the side wall 22, and at least one of the top wall 21 and the side wall 22 is provided with a connecting groove 202, once the shielding component 30 needs to be connected to the shielding cover 20, the connecting member 40 in the connecting groove 202 can fix the top wall 21 and the shielding body 31, and / or the connecting member 40 in the connecting groove 202 can fix the side wall 22 and the folded edge 32, ensuring that the shielding component 30 is firmly connected to the shielding cover 20.

[0057] It should be noted that, the connecting groove 202 can be set only on the top wall 21. In this case, it is equivalent to that the shielding body 31 and the top wall 21 are fixedly connected through the connecting piece 40 in the connecting groove 202 on the top wall 21; the connecting groove 202 can also be set only on the side wall 22. In this case, it is equivalent to that the folded edge 32 and the side wall 22 are fixedly connected through the connecting piece 40 in the connecting groove 202 on the side wall 22; of course, the connecting groove 202 can also be set on both the top wall 21 and the side wall 22. In this case, the shielding body and the top wall 21 are fixedly connected through the connecting piece 40 in the connecting groove 202 on the top wall 21, and the folded edge 32 and the side wall 22 are fixedly connected through the connecting piece 40 in the connecting groove 202 on the side wall 22, so that the shielding member 30 is more firmly connected to the shielding cover 20.

[0058] In addition, in some embodiments, the connection groove 202 is arranged around the opening 201. Through such an arrangement, after the shielding member 30 is arranged on the shielding cover 20, once the connecting member 40 in the connection groove 202 connects the shielding cover 20 with the shielding member 30, the connection groove 202 is arranged around the opening 201, which can ensure that the shielding member 30 is firmly connected to the shielding cover 20 in the circumferential direction of the opening 201, and the shielding member 30 can better shield the opening 201, which is equivalent to the shielding member 30 can completely shield the opening 201 in the circumferential direction of the opening 201, avoiding the problem of electromagnetic leakage in the circumferential direction of the opening 201.

[0059] It should be noted that the shape of the opening 201 can be set according to actual needs. For example, the shape of the opening 201 is circular, another example, the shape of the opening 201 is square, and another example, the shape of the opening 201 is pentagonal. The specific shape of the opening 201 is not limited in the embodiment of the present application.

[0060] In addition, in the embodiment of the present application, the shielding member 30 and the shielding cover 20 can be welded, that is, the shielding member 30 and the shielding cover 20 are connected by a welding process.

[0061] In the embodiment of the present application, since the electronic component 101 is arranged on the circuit board body 10, the shielding cover 20 is arranged on the circuit board body 10, and the electronic component 101 is accommodated in the shielding cover 20, the shielding cover 20 can shield the electronic component 101. Since the shielding cover 20 is provided with an opening 201, and the shielding member 30 covers the opening 201, the combination of the shielding member 30 and the shielding cover 20 can ensure that the electronic component 101 can be well shielded, and avoid the electronic component 101 from affecting the antenna of the electronic device. Since the outer surface of the shielding cover 20 is provided with a connecting groove 202, and the connecting member 40 is arranged in the connecting groove 202, the shielding member 30 is arranged on the outer surface of the shielding cover 20, and is fixedly connected with the connecting member 40, the shielding member 30 and the shielding cover 20 can be fixedly connected by relying on the connecting member 40, so as to avoid the shielding member 30 and the shielding cover 20 being separated over time, or the shielding member 30 covering the opening 201 is reduced, resulting in the problem that the electronic component 101 affects the antenna of the electronic device. That is, in the embodiment of the present application, a connecting groove 202 is provided on the outer surface of the shielding cover 20, and a connecting member 40 is provided in the connecting groove 202, so that the shielding member 30 can be fixedly connected to the connecting member 40, and the opening 201 on the shielding cover 20 is covered, thereby ensuring that the shielding member 30 is fixedly connected to the shielding cover 20 through the connecting member 40, and avoiding the shielding member 30 and the shielding cover 20 to be separated over time, resulting in the shielding of the opening 201 on the shielding cover 20 being affected, thereby causing the electronic component 101 to affect the antenna of the electronic device.

[0062] An embodiment of the present application provides an electronic device, which includes a housing and a circuit board assembly in any one of the above embodiments; the circuit board assembly is disposed in the housing.

[0063] In the embodiment of the present application, since the electronic component 101 is arranged on the circuit board body 10, the shielding cover 20 is arranged on the circuit board body 10, and the electronic component 101 is accommodated in the shielding cover 20, the shielding cover 20 can shield the electronic component 101. Since the shielding cover 20 is provided with an opening 201, and the shielding member 30 covers the opening 201, the combination of the shielding member 30 and the shielding cover 20 can ensure that the electronic component 101 can be well shielded, and avoid the electronic component 101 from affecting the antenna of the electronic device. Since the outer surface of the shielding cover 20 is provided with a connecting groove 202, and the connecting member 40 is arranged in the connecting groove 202, the shielding member 30 is arranged on the outer surface of the shielding cover 20, and is fixedly connected with the connecting member 40, the shielding member 30 and the shielding cover 20 can be fixedly connected by relying on the connecting member 40, so as to avoid the shielding member 30 and the shielding cover 20 being separated over time, or the shielding member 30 covering the opening 201 is reduced, resulting in the problem that the electronic component 101 affects the antenna of the electronic device. That is, in the embodiment of the present application, a connecting groove 202 is provided on the outer surface of the shielding cover 20, and a connecting member 40 is provided in the connecting groove 202, so that the shielding member 30 can be fixedly connected to the connecting member 40, and the opening 201 on the shielding cover 20 is covered, ensuring that the shielding member 30 is fixedly connected to the shielding cover 20 through the connecting member 40, avoiding the shielding member 30 and the shielding cover 20 from being separated over time, resulting in the opening 201 on the shielding cover 20 being affected, and further causing the electronic component 101 to affect the antenna of the electronic device, thereby effectively improving the communication performance of the electronic device.

[0064] In addition, in the embodiment of the present application, the electronic device may further include a heat conductor, which abuts against the shielding member 30 and is connected to a heat sink in the electronic device, so that the heat generated by the electronic component 101 can be transferred to the shielding member 30, and then transferred to the heat conductor, and then transferred to the heat sink through the heat conductor, so as to avoid the problem that the electronic component 101 is overheated during operation and the performance of the electronic component 101 is affected. The heat conductor may be a thermally conductive adhesive, and of course, the heat conductor may also be other components with a heat-conducting function, for example, the heat conductor is a metal component. The specific type of the heat conductor is not limited in the embodiment of the present application.

[0065] It should be noted that in the embodiments of the present application, electronic devices include but are not limited to controllers, smart devices, terminal products and other devices, wherein smart devices are, for example, smart phones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices and other devices, and terminal products include personal computers, tablet computers and other products. Among them, when the smart device is a smart phone, the smart phone can be a foldable phone, and of course, the smart phone can also be a non-foldable phone, which is not limited in the embodiments of the present application.

[0066] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0067] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: A circuit board body, on which electronic components are arranged; A shielding cover, wherein the shielding cover is arranged on the circuit board body, the electronic component is accommodated in the shielding cover, an opening is arranged on the shielding cover, and a connecting groove is arranged on the outer surface of the shielding cover, and a connecting piece is arranged in the connecting groove; A shielding member is disposed on the outer surface of the shielding cover and is fixedly connected to the connecting member, and the shielding member covers the opening.

2. The circuit board assembly according to claim 1, characterized in that: A conductive adhesive is provided on a surface of the shielding member facing the shielding cover, and the shielding member and the shielding cover are bonded together by the conductive adhesive.

3. The circuit board assembly according to claim 2, characterized in that: The conductive adhesive is provided with an avoidance groove, the avoidance groove is opposite to the connection groove, and the connection member extends into the avoidance groove and is connected to the shielding member.

4. The circuit board assembly according to claim 2, characterized in that: The melting point of the connecting member is lower than the melting point of the conductive adhesive.

5. The circuit board assembly according to claim 1, characterized in that: A fixing component is disposed on the surface of the shielding member facing away from the shielding cover. The fixing component covers at least a portion of the surface of the shielding member facing away from the shielding cover, and the fixing component is connected to the shielding cover.

6. The circuit board assembly according to claim 5, characterized in that: The fixing component includes a substrate and an adhesive layer, the substrate and the adhesive layer are stacked, and the area of ​​the adhesive layer is larger than the area of ​​the shielding component, the area of ​​the substrate is larger than the area of ​​the shielding component, and the area of ​​the substrate is equal to the area of ​​the adhesive layer, part of the adhesive layer is bonded to the shielding component, and another part of the adhesive layer is bonded to the shielding cover.

7. The circuit board assembly according to claim 6, characterized in that: The melting point of the connecting member is lower than the melting point of the adhesive layer, and the melting point of the connecting member is lower than the melting point of the substrate.

8. The circuit board assembly according to claim 1, wherein: The shielding member comprises a shielding body and a folded edge connected to each other, and the folded edge is arranged around the shielding body, the shielding cover comprises a top wall and a side wall connected to each other, the side wall is arranged around the top wall, and the side wall is connected to the circuit board body, the top wall, the side wall and the circuit board body enclose a shielding space, and the electronic component is located in the shielding space; The shielding body is opposite to the top wall, and the shielding body contacts the top wall, the folded edge contacts the side wall, at least one of the top wall and the side wall is provided with the connecting groove, and the top wall is provided with the opening.

9. The circuit board assembly according to any one of claims 1 to 8, characterized in that: The connecting groove is arranged around the opening.

10. An electronic device, characterized in that: The electronic device comprises a housing and a circuit board assembly as claimed in any one of claims 1 to 9; The circuit board assembly is disposed in the housing.

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