Light-emitting module and light-emitting device

Abstract

The invention provides a light-emitting module and a light-emitting device. The light-emitting module comprises a substrate, a conductive column, an internal bonding pad, a light-emitting element and an external bonding pad. The conductive columns are arranged in the through holes of the substrate. The conductive column comprises a first part, a second part and a third part. The first portion includes a first metal. The second part and the third part are respectively connected to two ends of the first part. The second portion and the third portion include an alloy. The alloy includes a second metal and a third metal, and the second metal and the third metal are different from the first metal. The internal pad is connected to the second portion of the conductive pillar. The light-emitting element is electrically connected with the internal bonding pad. The external pad is connected to the third portion of the conductive pillar. The conductive columns have high electron mobility, so that the resistivity can be reduced more effectively, and the performance of the light-emitting device and the light-emitting module thereof is further improved.

Description

Technical Field

[0001] The invention relates to a light emitting module and a light emitting device. Background Art

[0002] Copper pillar bumps are used in flip chip packages to connect light-emitting chips and ceramic substrates. Compared with tin-lead bumps, copper pillar bumps have better performance and lower overall packaging costs. However, in the prior art, the tin plating layer is on the copper plating layer, and the process below the copper plating layer is more complicated and requires higher costs. In view of this, it is necessary to improve the bump structure. Summary of the invention

[0003] The present invention is directed to a light-emitting module with good performance and low cost.

[0004] The present invention is directed to a light emitting device with good performance and low cost.

[0005] According to an embodiment of the present invention, a light-emitting module includes a substrate, at least one conductive column, an internal pad, a light-emitting element and an external pad. The substrate has a first surface, a second surface and at least one through hole, wherein the first surface is opposite to the second surface, and the at least one through hole passes through the first surface and the second surface. At least one conductive column is arranged in the at least one through hole. Each conductive column includes a first part, a second part and a third part. The first part includes a first metal. The second part and the third part are respectively connected to the two ends of the first part. The second part and the third part include an alloy. The alloy includes a second metal and a third metal, and the second metal and the third metal are different from the first metal. The internal pad is arranged on the first surface of the substrate and is connected to the second part of each conductive column. The light-emitting element is arranged on the internal pad and is electrically connected to the internal pad, wherein the internal pad is located between the light-emitting element and the first surface of the substrate. The external pad is arranged on the second surface of the substrate and is connected to the third part of each conductive column.

[0006] According to an embodiment of the present invention, a light emitting device comprises the above-mentioned light emitting module and an optical component. The light emitting element of the light emitting module is used to emit an illumination beam, and the optical component is disposed on a transmission path of the illumination beam.

[0007] In the light emitting device and the light emitting module according to the embodiment of the present invention, the first metal is copper, and the second metal and the third metal are tin-silver alloy.

[0008] In the light-emitting device and the light-emitting module according to the embodiments of the present invention, the light-emitting element includes at least one light-emitting chip and a fluorescent layer covering the at least one light-emitting chip.

[0009] In the light-emitting device and the light-emitting module according to the embodiments of the present invention, the light-emitting element further includes a packaging layer disposed on the fluorescent layer, wherein the fluorescent layer is located between the packaging layer and the light-emitting chip.

[0010] In the light-emitting device and the light-emitting module according to the embodiments of the present invention, the light-emitting element includes at least one light-emitting chip and a reflective layer disposed around the at least one light-emitting chip.

[0011] In a light-emitting device and a light-emitting module according to an embodiment of the present invention, a light-emitting element includes at least one light-emitting chip, each of the at least one light-emitting chip includes a first-type semiconductor layer, a second-type semiconductor layer, an active layer arranged between the first-type semiconductor layer and the second-type semiconductor layer, a first electrode electrically connected to the first-type semiconductor layer, and a second electrode electrically connected to the second-type semiconductor layer, at least one conductive column is a plurality of conductive columns, at least one through hole is a plurality of through holes, the plurality of conductive columns are respectively arranged in the plurality of through holes of the substrate, the plurality of conductive columns are arranged into a plurality of conductive column rows, the internal solder pad includes a first internal sub-solder pad and a second internal sub-solder pad that are structurally separated from each other, the first electrode and the second electrode of each light-emitting chip are respectively electrically connected to the first internal sub-solder pad and the second internal sub-solder pad, and the first internal sub-solder pad and the second internal sub-solder pad are respectively electrically connected to the plurality of conductive column rows.

[0012] In the light emitting device and the light emitting module according to the embodiment of the present invention, the external pad includes a first external sub-pad and a second external sub-pad which are structurally separated from each other, and the first external sub-pad and the second external sub-pad are respectively electrically connected to a plurality of conductive column rows. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional exploded schematic diagram of a light emitting module according to an embodiment of the present invention;

[0014] Figure 2 is a schematic top view of a substrate and a conductive column of a light emitting module according to an embodiment of the present invention;

[0015] Figure 3 It is a bottom view schematically showing a substrate and a conductive column of a light emitting module according to an embodiment of the present invention;

[0016] Figure 4 is a cross-sectional schematic diagram of a light emitting module according to an embodiment of the present invention;

[0017] Figure 5 is an enlarged schematic diagram of a conductive column of a light emitting module according to an embodiment of the present invention;

[0018] Figure 6 is a cross-sectional schematic diagram of a light emitting element according to an embodiment of the present invention;

[0019] Figure 7 is a cross-sectional schematic diagram of a light-emitting chip of a light-emitting element according to an embodiment of the present invention;

[0020] Figure 8 FIG. 4 is a cross-sectional schematic diagram of a light emitting device according to an embodiment of the present invention.

[0021] Description of Reference Numerals

[0022] 10: Light emitting module;

[0023] 20: optical components;

[0024] 21: Main part;

[0025] 22: support part;

[0026] 100: substrate;

[0027] 100a: first surface;

[0028] 100b: second surface;

[0029] 100c: through hole;

[0030] 100s: step structure;

[0031] 110: a first sub-substrate;

[0032] 112: first sub-hole;

[0033] 122: Second sub-hole;

[0034] 120: second sub-substrate;

[0035] 200: conductive column;

[0036] 210: Part 1;

[0037] 220: Part 2;

[0038] 230: Part III;

[0039] 300: internal pad;

[0040] 310: first internal sub-pad;

[0041] 320: second internal sub-pad;

[0042] 400: external pad;

[0043] 410: first external sub-pad;

[0044] 420: second external sub-pad;

[0045] 500: light emitting element;

[0046] 510: light-emitting chip;

[0047] 510a: light emitting surface;

[0048] 511: first type semiconductor layer;

[0049] 512: second type semiconductor layer;

[0050] 513: Active layer;

[0051] 514: a first electrode;

[0052] 515: second electrode;

[0053] 516: buffer layer;

[0054] 517: Growth substrate;

[0055] 518: reflector;

[0056] 520: fluorescent layer;

[0057] 530: encapsulation layer;

[0058] 540: reflective layer;

[0059] C: cavity;

[0060] C200-1, C200-2: Conductive column row. DETAILED DESCRIPTION

[0061] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0062] Figure 1 FIG. 1 is a three-dimensional exploded schematic diagram of a light emitting module according to an embodiment of the present invention. Figure 2 FIG. 1 is a schematic top view of a substrate and a conductive column of a light emitting module according to an embodiment of the present invention. Figure 3 FIG. 1 is a bottom view of a substrate and a conductive column of a light emitting module according to an embodiment of the present invention. Figure 4 FIG. 4 is a cross-sectional schematic diagram of a light emitting module according to an embodiment of the present invention.

[0063] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The light emitting module 10 includes a substrate 100. The substrate 100 has a first surface 100a, a second surface 100b and at least one through hole 100c. The first surface 100a is opposite to the second surface 100b. The at least one through hole 100c penetrates the first surface 100a and the second surface 100b.

[0064] In some embodiments, the substrate 100 may have a plurality of through holes 100c, wherein each through hole 100c penetrates the first surface 100a and the second surface 100b of the substrate 100. For example, in some embodiments, the substrate 100 may include a first sub-substrate 110 and a second sub-substrate 120, wherein the second sub-substrate 110 is stacked on the first sub-substrate 120, the first sub-substrate 110 has a plurality of first sub-through holes 112, the second sub-substrate 120 has a plurality of second sub-through holes 122, and each first sub-through hole 112 is connected to a corresponding second sub-through hole 122 to form a through hole 100c. In short, in some embodiments, the substrate 100 may be a combined substrate selectively. However, the present invention is not limited thereto, and in other embodiments, the substrate 100 may also be a single substrate. In some embodiments, the material of the substrate 100 is an insulating material. For example, the material of the substrate 100 may be ceramic, but the present invention is not limited thereto.

[0065] The light emitting module 10 further includes at least one conductive column 200 disposed in at least one through hole 100c of the substrate 100. For example, in some embodiments, the light emitting module 10 may include a plurality of conductive columns 200, respectively disposed in a plurality of through holes 100c of the substrate 100. Furthermore, in some embodiments, the plurality of conductive columns 200 may be arranged into a plurality of conductive column rows C200-1 and C200-2, but the present invention is not limited thereto.

[0066] Figure 5 FIG. 1 is an enlarged schematic diagram of a conductive column of a light emitting module according to an embodiment of the present invention. Figure 1 , Figure 4 and Figure 5 , each conductive column 200 includes a first portion 210, a second portion 220 and a third portion 230, wherein the second portion 220 and the third portion 230 are respectively connected to the two ends of the first portion 210. It is worth noting that the first portion 210 includes a first metal, the second portion 220 and the third portion 230 include an alloy, the alloy includes a second metal and a third metal, and the second metal and the third metal are different from the first metal. As a result, the conductive column 200 can have a high electron mobility, can more effectively reduce the resistivity, and thus improve the performance of the light-emitting module 100. For example, in some embodiments, the first metal can be copper (Cu), and the alloy can be tin-silver alloy (SnAg), but the present invention is not limited thereto.

[0067] Please refer to Figure 1 , Figure 4 and Figure 5, the light emitting module 100 further includes an internal pad 300 and an external pad 400. The internal pad 300 is disposed on the first surface 100a of the substrate 100 and is connected to the second portion 220 of each conductive column 200. The external pad 400 is disposed on the second surface 100b of the substrate 100 and is connected to the third portion 230 of each conductive column 200. The substrate 100 is located between the internal pad 300 and the external pad 400. In some embodiments, the internal pad 300 and the external pad 400 are substantially in the form of a thin sheet, and the conductive columns 200 distributed in a dotted manner are in contact with the internal pad 300 and the external pad 400, so that the thin internal pad 300 and the external pad 400 can be prevented from being deformed.

[0068] Please refer to Figure 1 , Figure 4 and Figure 5 In some embodiments, the inner pad 300 may include a first inner sub-pad 310 and a second inner sub-pad 320 that are separated from each other in structure, the first inner sub-pad 310 is electrically connected to a plurality of conductive pillars 200 of one conductive pillar row C200-1, and the second inner sub-pad 320 is electrically connected to a plurality of conductive pillars 200 of another conductive pillar row C200-2. In some embodiments, the outer pad 400 may include a first outer sub-pad 410 and a second outer sub-pad 420 that are separated from each other in structure, the first outer sub-pad 410 is electrically connected to a plurality of conductive pillars 200 of one conductive pillar row C200-1, and the second outer sub-pad 420 is electrically connected to a plurality of conductive pillars 200 of another conductive pillar row C200-2.

[0069] Please refer to Figure 1 and Figure 4 The light emitting module 10 further includes a light emitting element 500 disposed on the internal pad 300. The internal pad 300 is located between the light emitting element 500 and the first surface 100a of the substrate 100. The light emitting element 500 is electrically connected to the internal pad 300. An external power source (not shown) can supply power to the light emitting element 500 through the external pad 400, the conductive pillar 200 and the internal pad 300.

[0070] Figure 6 FIG. 4 is a cross-sectional schematic diagram of a light emitting element according to an embodiment of the present invention. Figure 7 FIG. 1 is a cross-sectional view of a light-emitting chip of a light-emitting element according to an embodiment of the present invention. Figure 4 , Figure 6 and Figure 7, the light emitting element 500 includes at least one light emitting chip 510, each light emitting chip 510 includes a first type semiconductor layer 511, a second type semiconductor layer 512, an active layer 513 disposed between the first type semiconductor layer 511 and the second type semiconductor layer 512, a first electrode 514 electrically connected to the first type semiconductor layer 511, and a second electrode 515 electrically connected to the second type semiconductor layer 512, and the first electrode 514 and the second electrode 515 of the light emitting chip 500 are electrically connected to the first internal sub-pad 310 and the second internal sub-pad 320, respectively. In some embodiments, the first type semiconductor layer 511 may be an N-type semiconductor layer (e.g., N-GaN), the second type semiconductor layer 512 may be a P-type semiconductor layer (e.g., P-GaN), and the active layer 513 may be a multiple quantum well structure, but the present invention is not limited thereto. In some embodiments, the light-emitting chip 510 may further selectively include a buffer layer 516, a growth substrate 517 and a reflector 518. The buffer layer 516 is disposed between the growth substrate 517 and the first-type semiconductor layer 511. The growth substrate 517 may selectively have a plurality of optical microstructures (not shown) to enhance the light extraction efficiency of the light-emitting chip 510. The active layer 513 may be disposed between the reflector 518 and the light-emitting surface 510a of the light-emitting chip 510 to reflect the illumination light beam L emitted by the active layer 513 toward the light-emitting surface 510a of the light-emitting chip 510.

[0071] Please refer to Figure 6 In some embodiments, the light-emitting element 500 may further selectively include a fluorescent layer 520 in addition to the light-emitting chip 510. The fluorescent layer 520 covers the light-emitting surface 510a of the light-emitting chip 510. In some embodiments, the light-emitting element 500 may further selectively include an encapsulation layer 530 disposed on the fluorescent layer 520. The fluorescent layer 520 is located between the encapsulation layer 530 and the light-emitting chip 510. In some embodiments, the material of the encapsulation layer 530 is, for example, silicone, but the present invention is not limited thereto. In some embodiments, the light-emitting element 500 may further selectively include a reflective layer 540 disposed around the light-emitting chip 510 to guide the illumination light beam that is not transmitted to the upper part of the light-emitting surface 510a to be emitted above the light-emitting surface 510a.

[0072] Figure 8 FIG. 1 is a cross-sectional diagram of a light emitting device according to an embodiment of the present invention. Figure 4 and Figure 8, the light emitting device 1 includes the aforementioned light emitting module 10 and the optical component 20. The light emitting element 500 of the light emitting module 10 is used to emit the illumination light beam L, and the optical component 20 is disposed on the transmission path of the illumination light beam L. For example, in some embodiments, the optical component 20 may include a three-dimensional quartz lens to adjust the light shape of the illumination light beam L, but the present invention is not limited thereto. In some embodiments, the light emitting element 500 of the light emitting module 10 may be disposed in a cavity C surrounded by the optical component 20 and the light emitting module 10. In some embodiments, the area of ​​the first sub-substrate 110 of the light-emitting module 10 may be larger than the area of ​​the second sub-substrate 120 of the light-emitting module 10, and the second sub-substrate 120 with a smaller area is stacked on the first sub-substrate 110 with a larger area to form a step structure 100s. The optical component 20 may include a main portion 21 arranged directly above the light-emitting module 10 and a support portion 22 connected to the periphery of the main portion 21 and extending toward the substrate 100 of the light-emitting module 10, wherein the support portion 22 of the optical component 20 may be arranged on the step structure 100s of the substrate 100 to enclose a cavity C together with the substrate 100, but the present invention is not limited to this.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A light emitting module, characterized in that: include: A substrate having a first surface, a second surface and at least one through hole, wherein the first surface is opposite to the second surface, and the at least one through hole penetrates the first surface and the second surface; At least one conductive column is disposed in the at least one through hole, wherein each of the at least one conductive column comprises: Part I, including the First Metal; and A second portion and a third portion are connected to two ends of the first portion, respectively, wherein the second portion and the third portion include an alloy, the alloy includes a second metal and a third metal, and the second metal and the third metal are different from the first metal; an internal pad disposed on the first surface of the substrate and connected to the second portion of each of the conductive pillars; a light emitting element disposed on the internal pad and electrically connected to the internal pad, wherein the internal pad is located between the light emitting element and the first surface of the substrate; and The external pad is disposed on the second surface of the substrate and connected to the third portion of each of the conductive pillars.

2. The light emitting module according to claim 1, characterized in that: The first metal is copper, and the second metal and the third metal are tin-silver alloy.

3. The light emitting module according to claim 1, characterized in that: The light-emitting element includes at least one light-emitting chip and a fluorescent layer covering the at least one light-emitting chip.

4. The light emitting module according to claim 3, characterized in that: The light emitting element further comprises: The packaging layer is disposed on the fluorescent layer, wherein the fluorescent layer is located between the packaging layer and the at least one light-emitting chip.

5. The light emitting module according to claim 1, characterized in that: The light-emitting element includes at least one light-emitting chip and a reflective layer arranged around the at least one light-emitting chip.

6. The light emitting module according to claim 1, characterized in that: The light-emitting element includes at least one light-emitting chip, each of the at least one light-emitting chip includes a first-type semiconductor layer, a second-type semiconductor layer, an active layer arranged between the first-type semiconductor layer and the second-type semiconductor layer, a first electrode electrically connected to the first-type semiconductor layer, and a second electrode electrically connected to the second-type semiconductor layer. The at least one conductive column is a plurality of conductive columns, the at least one through hole is a plurality of through holes, the plurality of conductive columns are respectively arranged in the plurality of through holes of the substrate, the plurality of conductive columns are arranged into a plurality of conductive column rows, the internal solder pad includes a first internal sub-pad and a second internal sub-pad that are structurally separated from each other, the first electrode and the second electrode of each of the light-emitting chips are respectively electrically connected to the first internal sub-pad and the second internal sub-pad, and the first internal sub-pad and the second internal sub-pad are respectively electrically connected to the plurality of conductive column rows.

7. The light emitting module according to claim 6, characterized in that: The external pad includes a first external sub-pad and a second external sub-pad that are structurally separated from each other, and the first external sub-pad and the second external sub-pad are electrically connected to the plurality of conductive column rows, respectively.

8. A light emitting device, characterized in that: include: Lighting module, comprising: A substrate having a first surface, a second surface and at least one through hole, wherein the first surface is opposite to the second surface, and the at least one through hole penetrates the first surface and the second surface; At least one conductive column is disposed in the at least one through hole, wherein each of the at least one conductive column comprises: Part I, including the First Metal; and A second portion and a third portion are connected to two ends of the first portion, respectively, wherein the second portion and the third portion include an alloy, the alloy includes a second metal and a third metal, and the second metal and the third metal are different from the first metal; an internal pad disposed on the first surface of the substrate and connected to the second portion of each of the conductive pillars; a light emitting element disposed on the internal pad and electrically connected to the internal pad, wherein the internal pad is located between the light emitting element and the first surface of the substrate; and an external pad disposed on the second surface of the substrate and connected to the third portion of each of the conductive pillars; and An optical component, wherein the light-emitting element of the light-emitting module is used to emit an illumination light beam, and the optical component is disposed on a transmission path of the illumination light beam.

9. The light emitting device according to claim 8, characterized in that: The first metal is copper, and the second metal and the third metal are tin and silver.

10. The light emitting device according to claim 8, characterized in that: The light-emitting element includes at least one light-emitting chip and a fluorescent layer covering the at least one light-emitting chip.

11. The light emitting device according to claim 10, characterized in that: The light emitting element further comprises: The packaging layer is disposed on the fluorescent layer, wherein the fluorescent layer is located between the packaging layer and the at least one light-emitting chip.

12. The light emitting device according to claim 8, characterized in that: The light-emitting element includes at least one light-emitting chip and a reflective layer arranged around the at least one light-emitting chip.

13. The light emitting device according to claim 8, characterized in that: The light-emitting element includes at least one light-emitting chip, each of the at least one light-emitting chip includes a first-type semiconductor layer, a second-type semiconductor layer, an active layer arranged between the first-type semiconductor layer and the second-type semiconductor layer, a first electrode electrically connected to the first-type semiconductor layer, and a second electrode electrically connected to the second-type semiconductor layer. The at least one conductive column is a plurality of conductive columns, the at least one through hole is a plurality of through holes, the plurality of conductive columns are respectively arranged in the plurality of through holes of the substrate, the plurality of conductive columns are arranged into a plurality of conductive column rows, the internal solder pad includes a first internal sub-pad and a second internal sub-pad that are structurally separated from each other, the first electrode and the second electrode of each of the light-emitting chips are respectively electrically connected to the first internal sub-pad and the second internal sub-pad, and the first internal sub-pad and the second internal sub-pad are respectively electrically connected to the plurality of conductive column rows.

14. The light emitting device according to claim 13, characterized in that: The external pad includes a first external sub-pad and a second external sub-pad that are structurally separated from each other, and the first external sub-pad and the second external sub-pad are electrically connected to the plurality of conductive column rows, respectively.

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