Electronic device including housing having pattern and method for forming pattern

Abstract

According to an embodiment, an electronic device may include a housing. According to an embodiment, an electronic device may include a glass layer formed on a rear surface of a housing. According to an embodiment, an electronic device may include an uneven layer formed on a glass layer and including a plurality of grooves. According to an embodiment, a nanosecond laser beam is emitted to a portion of the plurality of grooves such that at least one pattern may be engraved on the concavo-convex layer. In accordance with an embodiment, the emitted nanosecond laser beam may be reflected and absorbed in a variety of ways at inner walls of a portion of the plurality of grooves. Other various embodiments as determined by the specification are possible.

Description

Technical Field

[0001] Various embodiments disclosed in this specification relate to an electronic device including a housing having a pattern formed therein, and a method for forming the pattern. Background Art

[0002] An electronic device such as a smart phone or a tablet computer may include a housing that forms an exterior. The housing may be mainly formed of a metal or plastic material.

[0003] The housing forming the appearance of the electronic device may be formed with various colors and designs. For example, the housing may include designs with various colors and various patterns. Since the housing includes various colors and various patterns, the electronic device can improve the usability of the user who uses the electronic device.

[0004] The housing of the electronic device may have a pattern or design formed in the surface to provide aesthetics to the user. For example, a pattern including the manufacturer's name of the electronic device may be formed in the back cover of the electronic device. Alternatively, various characters may be formed on the back cover of the electronic device. Summary of the invention

[0005] According to an embodiment, the electronic device may include a housing. According to an embodiment, the electronic device may include a glass layer formed on a rear surface of the housing. According to an embodiment, the electronic device may include a concave-convex layer formed on the glass layer and including a plurality of grooves. According to an embodiment, a nanosecond laser beam may be irradiated to some of the plurality of grooves, thereby engraving at least one pattern on the concave-convex layer. According to an embodiment, the irradiated nanosecond laser beam may be reflected and absorbed multiple times on inner walls of some of the plurality of grooves.

[0006] According to an embodiment, a method for forming a pattern on a housing of an electronic device may include preparing a glass layer formed on the housing. According to an embodiment, the method for forming a pattern on a housing of an electronic device may include forming a concave-convex layer including a plurality of grooves on the glass layer. According to an embodiment, the method for forming a pattern on a housing of an electronic device may include radiating a nanosecond laser beam to the plurality of grooves and forming at least one pattern on the concave-convex layer. According to an embodiment, at least one pattern may be formed by multiple reflections and multiple absorptions of the nanosecond laser beam on the inner wall of each of the partial grooves in the plurality of grooves. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a front perspective view of an electronic device according to an embodiment.

[0008] Figure 2 is a rear perspective view of an electronic device according to an embodiment.

[0009] Figure 3At least one pattern formed in the rear surface of the electronic device according to the embodiment is shown.

[0010] Figure 4a A plurality of grooves of the concavo-convex layer according to an embodiment are shown.

[0011] Figure 4b A plurality of grooves of the concavo-convex layer according to an embodiment are shown.

[0012] Figure 5 is a flowchart illustrating a process of forming at least one pattern according to an embodiment.

[0013] Figure 6 A concavo-convex layer according to an embodiment is shown.

[0014] Figure 7 The heat affected zone formed on the concave-convex layer according to the embodiment is shown.

[0015] Figure 8a A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0016] Figure 8b At least one pattern formed on the concave-convex layer according to an embodiment is shown.

[0017] Figure 9a A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0018] Figure 9b At least one pattern according to an embodiment is shown.

[0019] Fig.10 A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0020] Fig.11a A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0021] Fig.11b At least one pattern according to an embodiment is shown.

[0022] Fig.12 A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0023] Fig.13 is a block diagram of an electronic device in a network environment according to an embodiment.

[0024] Regarding the description of the drawings, the same or similar reference numerals may be used for the same or similar components. DETAILED DESCRIPTION

[0025] Various embodiments of the present disclosure are described below with reference to the accompanying drawings. However, these are not intended to limit the present disclosure to a specific embodiment form, but should be understood to include various modifications, equivalents and / or substitutions of the embodiments of the present disclosure.

[0026] According to an embodiment, a glass layer may be formed on the rear surface of the electronic device. In addition, various patterns may be engraved on the glass layer formed on the rear surface of the electronic device.

[0027] The various patterns formed on the glass layer may be formed by various methods, such as sandblasting, thermoforming, computer numerical control (CNC), and laser.

[0028] However, the processes of the sandblasting method, the thermoforming method, and the CNC method may require additional auxiliary materials and consumables. When the additional auxiliary materials and consumables are provided, a lot of time and cost may be required during this process.

[0029] Furthermore, the laser method may include a method using a nanosecond laser beam and a method using a picosecond or femtosecond laser beam.

[0030] Generally, in order to achieve a clear color sense on an electronic device, glass used on a rear surface of the electronic device may be used as glass having high light transmittance, low light reflectance, and low light absorption.

[0031] However, in the method using the nanosecond laser beam, when a pattern is engraved on glass having low light absorptivity and high light transmittance, the sharpness of the pattern may be reduced, and a lot of time may be required during the processing process.

[0032] Furthermore, in a method using a picosecond laser beam or a femtosecond laser beam, the sharpness of a pattern may be improved and the processing time may be reduced, but the processing cost may be increased, the practicality may be reduced, and commercialization may be difficult.

[0033] According to an embodiment, at least one pattern with improved sharpness may be engraved using a nanosecond laser beam.

[0034] According to an embodiment, since at least one pattern is formed using a nanosecond laser beam, the supply of auxiliary materials and consumables can be reduced. For example, since a nanosecond laser beam is used, the supply of consumables and auxiliary materials used in a CNC process and a sandblasting process can be reduced. Since the supply of additional consumables and auxiliary materials is reduced, an environmentally friendly pattern process can be implemented.

[0035] According to the embodiment, since at least one pattern is formed by a nanosecond laser beam, the process cost can be reduced compared with when at least one pattern is formed by a picosecond laser beam or a femtosecond laser beam. The process cost is reduced, thereby improving practicality and promoting commercialization.

[0036] According to an embodiment, a process using a concave-convex layer including a plurality of grooves when engraving at least one pattern using a nanosecond laser beam may have reduced man-hours compared to a process engraving at least one pattern on a layer not including a plurality of grooves. A process using a concave-convex layer including a plurality of grooves may improve visibility of at least one pattern compared to a process engraving at least one pattern on a layer not including a plurality of grooves.

[0037] According to the embodiment, a concavo-convex layer including a plurality of grooves may be formed, thereby forming at least one pattern with improved visibility even on glass having low reflectivity and low absorbency through multiple absorption and multiple reflection of a nanosecond laser beam.

[0038] Figure 1 is a front perspective view of the electronic device 100 according to an embodiment.

[0039] Reference Figure 1 , the electronic device 100 of the embodiment may include a housing 110, the housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side (or sidewall) 110C surrounding a space between the first surface 110A and the second surface 110B. In the embodiment, the housing 110 may refer to a structure forming a portion of the first surface 110A, the second surface 110B, and the side 110C. According to the embodiment, the housing 110 may include a front plate 111, a rear plate 112, and a bent portion 113.

[0040] According to an embodiment, the first surface 110A may be formed by a front plate 111 (e.g., a glass plate or a polymer plate including various coatings) that is at least partially substantially transparent. In an example, the front plate 111 may include a bent portion 113 at at least one side edge portion, which is seamlessly bent and extended from the first surface 110A toward the side surface 110C.

[0041] In an embodiment, the side surface 110C may be coupled to the front plate 111 and the rear plate 112 and may be formed by a side member (or a side frame structure or a side wall) including metal and / or polymer. In an example, the side surface 110C may include: a first side surface 1111, the first side surface 1111 is located on the right side of the electronic device 100 (for example, Figure 2 +x direction) and along the first direction (e.g., Figure 2 A second side surface 1112, the second side surface 1112 is parallel to the first side surface 1111 and extends along the first direction; a third side surface 1113, the third side surface 1113 is along a second direction perpendicular to the first direction (for example, Figure 1 +x direction), and one end of the first side surface 1111 (for example, Figure 1The +y direction end) is connected to one end of the second side surface 1112 (for example, Figure 1 and / or a fourth side surface 1114, the fourth side surface 1114 is parallel to the third side surface 1113 and connects the other end of the first side surface 1111 (for example, Figure 1 -y direction) is connected to the other end of the second side surface 1112 (for example, Figure 1 one end of the -y direction).

[0042] According to an embodiment, the electronic device 100 may include at least one of the display 120, the camera hole 103, the receiver hole 109, the connector hole 104, the microphone hole 108, or the speaker hole 105. In an example, the electronic device 100 may omit at least one component or additionally include other components. For example, the electronic device 100 may further include a sensor module not shown. The electronic device 100 may omit the key input device 117.

[0043] In an embodiment, a sensor such as a proximity sensor, an illumination sensor, an image sensor, or an iris sensor may be integrated into the display 120 within the area indicated by the front plate 111 , or arranged adjacent to the display 120 .

[0044] In an embodiment, the display 120 may be visually exposed through a significant portion of the front plate 111. In an example, the display 120 may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus. In an example, an edge of the display 120 may be formed substantially the same as an adjacent outer shape (e.g., a curved surface) of the front plate 111.

[0045] In an embodiment, the connector hole 104 can accommodate a connector for connecting to an external electronic device (e.g., Figure 1 The connector hole 104 may include a connector for sending and receiving power and / or data with the electronic device 100 (not shown), and / or a connector for sending and receiving audio signals with an external electronic device. For example, the connector hole 104 may include a USB connector or a headphone jack (not shown) (or a "headphone interface"). In an embodiment, the USB connector and the headphone jack may be implemented as one hole, and in another embodiment, the electronic device 100 may also send and receive power and / or data, or send and receive audio signals with an external device that does not have a separate connector hole.

[0046] A microphone for acquiring external sound may be arranged in the microphone hole 108, and a plurality of microphones may be arranged therein and detect the direction of the sound. In addition, a speaker may be arranged in the speaker hole 105 and radiate the sound to the outside. In another embodiment, the speaker hole 105 and the microphone hole 108 may be implemented as one hole, or a speaker (e.g., a piezoelectric speaker) may be included without a speaker hole. The speaker hole may include an external speaker hole and a receiver hole for calling.

[0047] Figure 2 is a rear perspective view of the electronic device 100 according to the embodiment.

[0048] In an embodiment, the second surface 110B may be formed by a substantially opaque rear plate 112. In an example, the rear plate 112 may be formed of, for example, coated glass or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials. In an example, the rear plate 112 may include a curved portion at at least one side edge portion, which is seamlessly curved and extended from the second surface 110B toward the front plate 111.

[0049] In an embodiment, the back plate 112 may be formed of a glass layer (eg, Figure 3 In an embodiment, the glass layer 310 may be formed on the rear panel 112 .

[0050] According to an embodiment, at least one pattern 210 may be engraved on the rear plate 112 formed of the glass layer 310 by the nanosecond laser beam 400. According to an embodiment, the nanosecond laser beam 400 may be irradiated onto the surface of the glass layer 310 formed on the rear plate 112, thereby engraving at least one pattern 210 on the glass layer 310. For example, the nanosecond laser beam 400 may be irradiated onto the concavo-convex layer 320 formed on the surface of the glass layer 310, thereby engraving at least one pattern 210.

[0051] In an embodiment, the key input device 117 may be arranged in the side surface 110C of the housing 110. In an embodiment, the electronic device 100 may not include some or all of the above-mentioned key input devices 117, and the key input device 117 not included may be implemented in other forms, such as soft keys, on the display 120. In an example, the key input device 117 may include at least a portion of a fingerprint sensor disposed on the second surface 110B of the housing 110.

[0052] According to an embodiment, the electronic device 100 may include a first optical sensor (eg, a sensor module and / or a camera module) 130 and a second optical sensor 106 .

[0053] In an embodiment, the first optical sensor 130 and the second optical sensor 106 may be disposed on the second surface 110B of the electronic device 100. The first optical sensor 130 may include a plurality of cameras. In an example, the second optical sensor 106 may include a flash. In an example, the first optical sensor 130 and the second optical sensor 106 may include one or more lenses, image sensors, and / or image processors. The second optical sensor 106 may include a light emitting diode or a xenon lamp. In an example, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 100.

[0054] In an embodiment, the electronic device 100 may include a sensor module not shown, and provide an electrical signal or data value corresponding to an internal operating state or an external environmental state. The electronic device 100 may further include a sensor module not shown, such as at least one of a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, or a humidity sensor.

[0055] Figure 3 At least one pattern formed on a rear surface of an electronic device according to an embodiment is shown.

[0056] According to an embodiment, Figure 3 At least one pattern 210 formed on the second surface 110B of the electronic device 100 is shown.

[0057] According to an embodiment, the electronic device 100 may include a glass layer 310 and a concavo-convex layer 320 .

[0058] According to an embodiment, the glass layer 310 may be formed on the rear surface or the second surface 110B of the electronic device 100. For example, the glass layer 310 may be formed on the rear plate 112 of the housing 110.

[0059] According to an embodiment, the concavo-convex layer 320 may be formed on the glass layer 310. For example, the concavo-convex layer 320 may be formed on a surface of the glass layer 310 exposed to the outside.

[0060] Referring to the embodiment Figure 3 , the concavo-convex layer 320 may be formed on a partial region of the glass layer 310. For example, the concavo-convex layer 320 may be formed in a region 311 of the glass layer 310 adjacent to a region where at least one pattern 210 is formed, but is not limited thereto. For example, the concavo-convex layer 320 may be completely formed on the glass layer 310.

[0061] According to an embodiment, a laser beam may be irradiated to a portion of the concavo-convex layer 320, thereby engraving at least one pattern 210 on the rear surface of the electronic device 100. The concavo-convex layer 320 may include a plurality of grooves 420. For example, a laser beam may be irradiated to the plurality of grooves 420 of the concavo-convex layer 320, thereby forming at least one pattern 210 on the rear surface of the electronic device 100.

[0062] For example, a nanosecond laser beam may be irradiated to a portion of the plurality of grooves 420 of the concavo-convex layer 320, thereby cutting the inner wall of the portion of the groove 430. When the inner wall of the portion of the groove 430 is cut, at least one pattern 210 may be engraved on the rear surface of the electronic device 100.

[0063] According to an embodiment, the concavo-convex layer 320 may include a first region 331 in which at least one pattern 210 is engraved and a second region 332 in which at least one pattern 210 is not engraved. For example, the first region 331 may include a region processed by a laser beam to engrave at least one pattern 210. For example, the second region 332 may include a region not processed by a laser beam.

[0064] Referring to the embodiment Figure 3 , the first region 331 may include a region processed by the laser beam so as to be dug deeper than the second region 332. For example, the first region 331 may include a region cut by the laser beam so as to form at least one pattern 210 therein.

[0065] Referring to the embodiment Figure 3 At least one pattern 210 formed on the concavo-convex layer 320 may be formed as a character-shaped pattern, but is not limited thereto. For example, an animal-shaped pattern and / or a fruit-shaped pattern may be formed on the glass layer 310 .

[0066] According to the embodiment, later on Figure 4a and Figure 4b An embodiment regarding at least one pattern 210 formed by cutting a portion of the inner wall of the groove 430 is described in detail in FIG.

[0067] Figure 4a A plurality of grooves of the concavo-convex layer according to an embodiment are shown.

[0068] According to an embodiment, the electronic device 100 may include a glass layer 310 and a concavo-convex layer 320 .

[0069] According to an embodiment, the glass layer 310 may be formed on the second surface 110B of the electronic device 100. According to an embodiment, Figure 4a The glass layer 310 may refer to Figure 2 and Figure 3 The glass layer 310 is provided.

[0070] According to an embodiment, the concavo-convex layer 320 may be formed on the glass layer 310. For example, the concavo-convex layer 320 may be formed on one surface of the glass layer 310 that is visually exposed to the outside.

[0071] According to an embodiment, the concavo-convex layer 320 may refer to Figure 3 The concave-convex layer 320 is provided.

[0072] According to an embodiment, the concavo-convex layer 320 may include a layer having an irregular surface. For example, the surface of the concavo-convex layer 320 may be irregularly formed by a plurality of grooves 420. For example, one surface of the concavo-convex layer 320 may face the glass layer 310. For example, the other surface of the concavo-convex layer 320 may be exposed to the outside and irregularly formed by a plurality of grooves 420.

[0073] According to an embodiment, the concavo-convex layer 320 may include a plurality of grooves 420 .

[0074] According to an embodiment, a plurality of grooves 420 may be formed in one surface of the concavo-convex layer 320. For example, the plurality of grooves 420 may be completely formed in the surface of the concavo-convex layer 320, but is not limited thereto. For example, a portion of the surface of the concavo-convex layer 320 may be formed to have the plurality of grooves 420, while another portion of the surface may be formed in a flat shape without the plurality of grooves 420 being formed.

[0075] According to the embodiment, referring to Figure 4a , the plurality of grooves 420 are shown as four grooves, but the number of the plurality of grooves 420 is not limited thereto. The plurality of grooves 420 may be completely formed in the surface of the concavo-convex layer 320 .

[0076] Referring to the embodiment Figure 4a , the plurality of grooves 420 may be formed as grooves having a predetermined width and a predetermined height. For example, the plurality of grooves 420 may include an area dug in with a predetermined width and a predetermined height. For example, the plurality of grooves 420 may include an inner space recessed toward the glass layer 310 with a first width W1 and a first height H1.

[0077] According to an embodiment, the first width W1 and the first height H1 of the plurality of grooves 420 may be formed to a length corresponding to the length of the wavelength of the nanosecond laser beam 400. For example, the length corresponding to the length of the wavelength of the nanosecond laser beam 400 may include a length substantially the same as the wavelength or a length greater than the wavelength.

[0078] According to an embodiment, the first width W1 and the first height H1 of the plurality of grooves 420 may have a length greater than the wavelength of the nanosecond laser beam 400. According to an embodiment, the first width W1 and the first height H1 of the plurality of grooves 420 may be formed to have substantially the same length as the wavelength of the nanosecond laser beam 400.

[0079] According to an embodiment, the wavelength of the nanosecond laser beam 400 may include a range of 350 nanometers (nm) to 1 millimeter (mm), but is not limited thereto. In another example, the wavelength of the nanosecond laser beam 400 may include a range of 350 nm to 10.60 micrometers (μm).

[0080] According to an embodiment, the first width W1 may include a length of 350 nm or more, but is not limited thereto. For example, the first width W1 may include a range of 350 nm to 1 mm. In another example, the first width W1 may include a range of 350 nm to 10.60 μm.

[0081] According to an embodiment, the first height H1 may include a length of 350 nm or longer, but is not limited thereto. For example, the first height H1 may include a range of 350 nm to 1 mm. For example, unlike the first width W1, the first height H1 may not be limited in height. As another example, the first height H1 may include a range of 350 nm to 10.60 μm.

[0082] According to an embodiment, since the plurality of grooves 420 are formed with a length corresponding to the length of the wavelength of the nanosecond laser beam 400 , the nanosecond laser beam 400 may be multiply reflected and multiply absorbed on the inner walls of the plurality of grooves 420 having a length greater than the wavelength.

[0083] According to an embodiment, a portion of the grooves 430 among the plurality of grooves 420 may be processed by a laser beam.

[0084] According to an embodiment, the partial groove 430 may be processed so that at least one pattern 210 may be engraved on the concavo-convex layer 320. For example, the partial groove 430 may be cut using a nanosecond laser beam 400. For example, the nanosecond laser beam 400 may be radiated toward the inner space of the partial groove 430 among the plurality of grooves 420. For example, the nanosecond laser beam 400 may be radiated toward the inner space of the partial groove 430, thereby cutting the inner wall of the partial groove 430. For example, the nanosecond laser beam 400 may be radiated toward the inner space of the partial groove 430, and may be absorbed and reflected multiple times on the inner wall of the partial groove 430.

[0085] According to an embodiment, the nanosecond laser beam 400 may be absorbed and reflected multiple times on the inner wall, so that the inner wall of a portion of the groove 430 may be cut, and at least one pattern 210 may be formed on the concavo-convex layer 320 .

[0086] According to an embodiment, the nanosecond laser beam 400 being reflected multiple times may include the nanosecond laser beam 400 being reflected multiple times from the inner wall of the partial groove 430. For example, the nanosecond laser beam 400 may be reflected multiple times from the inner wall of the partial groove 430.

[0087] According to an embodiment, the nanosecond laser beam 400 being absorbed multiple times may include the nanosecond laser beam 400 being absorbed multiple times from the inner wall of the partial groove 430. In the process that the nanosecond laser beam 400 is reflected multiple times from the inner wall of the partial groove 430, a portion of the nanosecond laser beam 400 may be absorbed multiple times by the inner wall of the partial groove 430. As a portion of the nanosecond laser beam 400 is absorbed multiple times by the inner wall of the partial groove 430, a portion of the inner wall of the partial groove 430 may be cut. For example, the nanosecond laser beam 400 may be absorbed by the inner wall of the partial groove 430, and the inner wall of the partial groove 430 may be cut.

[0088] According to an embodiment, Figure 4a The nanosecond laser beam 400 is shown to be reflected and absorbed four times on the inner wall of the partial groove 430 , but the number of reflections is not limited thereto. For example, the nanosecond laser beam 400 may be reflected and absorbed five or more times on the inner wall of the partial groove 430 .

[0089] According to an embodiment, the nanosecond laser beam 400 may be absorbed and reflected multiple times on the inner wall of the partial groove 430, so that the inner wall of each of the partial grooves 430 may be cut, and the boundary between the partial grooves 430 may collapse. For example, the inner wall between the respective partial grooves 430 may be cut, thereby combining the partial grooves 430 into one groove (e.g., Figure 4b A groove 440 is provided. Figure 4b An embodiment in which a partial groove 430 is formed into one groove 440 by cutting is described in detail.

[0090] According to an embodiment, since the plurality of grooves 420 are formed with the first width W1 and the first height H1, the nanosecond laser beam 400 may be absorbed and reflected multiple times on the inner wall of the partial groove 430. For example, since the first width W1 and the first height H1 are formed to be greater than the wavelength of the nanosecond laser beam 400, the nanosecond laser beam 400 may be reflected and absorbed multiple times on the inner wall of the partial groove 430.

[0091] According to an embodiment, when engraving at least one pattern 210 with the nanosecond laser beam 400, the at least one pattern 210 may be more clearly engraved on the concave-convex layer 320 having the plurality of grooves 420 formed therein, compared to the layer not having the plurality of grooves formed therein. For example, since the nanosecond laser beam 400 may be absorbed and reflected multiple times in the concave-convex layer 320, the at least one pattern 210 may be more clearly engraved on the concave-convex layer 320 having the plurality of grooves 420 formed therein, compared to the layer not having the plurality of grooves formed therein.

[0092] According to the embodiment, since the concavo-convex layer 320 includes the plurality of grooves 420 , at least one pattern 210 with improved sharpness may be formed even if the nanosecond laser beam 400 is used instead of the picosecond laser beam or the femtosecond laser beam.

[0093] According to an embodiment, compared with a process of engraving on a layer where a plurality of grooves are not formed, since the nanosecond laser beam 400 may be absorbed and reflected multiple times in the concavo-convex layer 320 , the process of engraving at least one pattern 210 may shorten the processing time.

[0094] According to the embodiment, since the concavo-convex layer 320 includes the plurality of grooves 420 , even if the nanosecond laser beam 400 is used instead of the picosecond laser beam or the femtosecond laser beam, the processing time for forming the at least one pattern 210 may be reduced.

[0095] According to an embodiment, auxiliary materials and consumables may not be required due to the use of the nanosecond laser beam 400. According to an embodiment, since auxiliary materials or consumables are not required, the at least one pattern 210 may be formed in an environmentally friendly method.

[0096] Figure 4b A plurality of grooves of the concavo-convex layer according to an embodiment are shown.

[0097] Reference Figure 4b , the nanosecond laser beam 400 may be irradiated to a portion of the grooves 430 among the plurality of grooves 420. For example, the nanosecond laser beam 400 may be irradiated to the inner space of a portion of the grooves 430 among the plurality of grooves 420, thereby being absorbed and reflected multiple times on the inner wall of the portion of the groove 430. For example, the nanosecond laser beam 400 may be absorbed and reflected multiple times on the inner wall of the portion of the groove 430, thereby forming at least one pattern 210 on the concavo-convex layer 320.

[0098] According to an embodiment, the partial groove 430 may include a first groove 431, a second groove 432, a third groove 433, and a fourth groove 434. According to an embodiment, the first groove 431, the second groove 432, the third groove 433, and the fourth groove 434 may refer to Figure 4a For example, the first groove 431, the second groove 432, the third groove 433 and the fourth groove 434 may have a first width W1 and a first height H1, but are not limited thereto. For example, the first groove 431, the second groove 432, the third groove 433 and the fourth groove 434 may have different widths and different heights.

[0099] Reference Figure 4b, showing that the first groove 431, the second groove 432, the third groove 433 and the fourth groove 434 are formed to be substantially the same as each other, but not limited thereto. For example, since the first groove 431, the second groove 432, the third groove 433 and the fourth groove 434 are formed in different shapes, the surface of the concavo-convex layer 320 may be irregularly formed.

[0100] According to an embodiment, when the nanosecond laser beam 400 is radiated to the first groove 431, the second groove 432, and the third groove 433, the first groove 431, the second groove 433, and the third groove 433 may be formed into one groove 440. For example, the wall between the first groove 431 and the second groove 432 may be cut by the nanosecond laser beam 400. For example, the wall between the second groove 432 and the third groove 433 may be cut by the nanosecond laser beam 400.

[0101] According to an embodiment, the walls between the first groove 431 , the second groove 432 , and the third groove 433 may be cut by the nanosecond laser beam 400 , whereby the first groove 431 , the second groove 432 , and the third groove 433 may be formed into one groove 440 .

[0102] According to the embodiment, since the first groove 431, the second groove 432, and the third groove 433 are formed as one groove 440, at least one pattern (eg, Figure 3 For example, at least one pattern 210 may be formed on the concavo-convex layer 320 by forming a portion of the concave-convex layer 320 of the concave-convex layer 320 into one concave-convex layer 440.

[0103] According to an embodiment, according to multiple absorption and reflection processes of the nanosecond laser beam 400 on the concave-convex layer 320 , at least one pattern 210 may be more clearly engraved on the concave-convex layer 320 having the plurality of grooves 420 formed thereon than on a layer not having the plurality of grooves formed thereon.

[0104] According to an embodiment, since the nanosecond laser beam 400 may be absorbed and reflected multiple times on the concavo-convex layer 320 , the process of engraving the at least one pattern 210 may have a shortened processing time compared to a process of engraving on a layer not formed with a plurality of grooves.

[0105] According to the embodiment, auxiliary materials and consumables may not be required due to the use of the nanosecond laser beam 400. According to the embodiment, since auxiliary materials and consumables are not required, the at least one pattern 210 may be formed in an environmentally friendly method.

[0106] Figure 5 is a flowchart illustrating a process of forming at least one pattern according to an embodiment.

[0107] According to an embodiment, Figure 5 The electronic device 100 is formed on the housing 110 Figure 3 At least one pattern (e.g., Figure 3 210).

[0108] According to an embodiment, step 501 may include an operation of preparing the glass layer 310 formed on the housing 110. For example, step 501 may include an operation of laminating the glass layer 310 on the housing 110. For example, step 501 may include a process of forming the glass layer 310 together in a process of forming the housing 110.

[0109] According to an embodiment, after at least one pattern 210 is engraved on the glass layer 310 through steps 503 and 505 described below, the glass layer 310 engraved with the at least one pattern 210 may be stacked on the housing 110 .

[0110] According to an embodiment, at least one pattern 210 may be engraved on the glass layer 310 stacked on the housing 110 through steps 503 and 505 to be described later.

[0111] According to an embodiment, step 503 may include an operation of forming a concavo-convex layer 320 including a plurality of grooves 420 on the glass layer 310 .

[0112] According to an embodiment, step 503 of forming the concavo-convex layer 320 may include a process of forming a plurality of grooves 420 on the concavo-convex layer 320 by a chemical etching process, a sandblasting process, or a dry etching process. For example, a plurality of grooves 420 may be formed on the concavo-convex layer 320 by an etching process of a chemical reaction of hydrofluoric acid, sulfuric acid, nitric acid, and / or ammonium bifluoride with a glass substrate (SiO2). For example, a plurality of grooves 420 may be formed on the concavo-convex layer 320 by a sandblasting process using fine particles. For example, a plurality of grooves 420 may be formed on the concavo-convex layer 320 by a dry etching process using plasma, but is not limited thereto. For example, a plurality of grooves 420 may be formed on the concavo-convex layer 320 by a wet etching process.

[0113] According to an embodiment, the concavo-convex layer 320 may refer to Figure 3 For example, the concavo-convex layer 320 may be formed entirely on the surface of the glass layer 310. For example, the concavo-convex layer 320 may be formed on a portion of the surface of the glass layer 310.

[0114] According to an embodiment, step 505 may include an operation of irradiating the nanosecond laser beam 400 to the plurality of grooves 420 and forming at least one pattern 210 on the concavo-convex layer 320 .

[0115] According to an embodiment, the nanosecond laser beam 400 may be irradiated to a portion of the grooves 430 among the plurality of grooves 420 to form at least one pattern 210. For example, the nanosecond laser beam 400 may be reflected and absorbed multiple times on the corresponding inner walls of the portion of the grooves 430 to form at least one pattern 210.

[0116] According to an embodiment, the embodiment of multiple reflection and multiple absorption of the nanosecond laser beam 400 on the corresponding inner wall of the partial groove 430 can be referred to. Figure 4a and Figure 4b For example, according to an embodiment, since the plurality of grooves 420 are formed with the first width W1 and the first height H1, the nanosecond laser beam 400 may be absorbed and reflected multiple times on the inner wall of the partial groove 430. For example, since the first width W1 and the first height H1 are formed to be larger than the wavelength of the nanosecond laser beam 400, the nanosecond laser beam 400 may be reflected and absorbed multiple times on the inner wall of the partial groove 430.

[0117] According to an embodiment, the method of forming at least one pattern 210 may further include laminating a colored layer (eg, Figure 8a According to the embodiment, reference will be made later on. Figure 8a An embodiment regarding a process of stacking the coloring layer 810 is described in detail.

[0118] According to an embodiment, the method of forming at least one pattern 210 may include a process of further stacking a second light-transmitting layer having a lower light transmittance than the glass layer 310 on the concave-convex layer 320 after step 505 of forming at least one pattern 210. Figure 9a An embodiment regarding a process of further stacking a first light-transmitting layer having a lower light transmittance than the glass layer 310 is described in detail.

[0119] According to an embodiment, the method of forming at least one pattern 210 may include a process of replacing the transparent glass layer 310 with an opaque or translucent glass layer in step 501 of forming the glass layer 310. Fig.10 Embodiments regarding opaque or translucent glass layers are described in detail in .

[0120] According to an embodiment, the method of forming at least one pattern 210 may further include a process of laminating a second light-transmitting layer disposed between the housing 110 and the glass layer 310 before step 501 of forming the glass layer 310. The second light-transmitting layer may have a light transmittance substantially the same as or higher than that of the glass layer 310. According to an embodiment, an embodiment of a process of laminating the second light-transmitting layer will be described in detail later in FIG. 11.

[0121] According to an embodiment, the method of forming at least one pattern 210 may further include a process of laminating a light absorbing layer 1210 disposed between the housing 110 and the glass layer 310 and having a lower reflectivity than the glass layer before step 501 of forming the glass layer 310. According to an embodiment, the method of forming at least one pattern 210 may further include a process of laminating a light absorbing layer 1210 disposed between the housing 110 and the glass layer 310 and having a lower reflectivity than the glass layer. Fig.12 An embodiment of a process for stacking a light absorbing layer 1210 having a lower reflectivity than a glass layer is described in detail in FIG.

[0122] Figure 6 A concavo-convex layer according to an embodiment is shown.

[0123] According to an embodiment, Figure 6 A cross section of the relief layer 320 is shown.

[0124] According to an embodiment, Figure 6 The nanosecond laser beam (eg, Figure 4a and Figure 4b The boundary between the region where the nanosecond laser beam 400 is irradiated and the region where the nanosecond laser beam 400 is not irradiated.

[0125] According to an embodiment, Figure 6 At least one pattern (eg, Figure 3 The difference between the area where at least one pattern 210 is formed and the area where at least one pattern is not formed.

[0126] According to an embodiment, the concavo-convex layer 320 may include a first region 331 in which the nanosecond laser beam 400 is irradiated and in which at least one pattern 210 is engraved, and a second region 332 in which the at least one pattern 210 is not engraved.

[0127] According to an embodiment, FIG. 610 shows a boundary between the first region 331 and the second region 332. According to an embodiment, the first region 331 and the second region 332 may refer to Figure 3 The first area 331 and the second area 332 are shown in FIG.

[0128] According to an embodiment, diagram 620 shows a 3D image of the first area 331 and the second area 332. According to an embodiment, diagram 620 may show a height difference between the first area 331 and the second area 332 on the 3D image.

[0129] Referring to FIG. 620 of the embodiment, the second region 332 of the concavo-convex layer 320 may be formed to have a greater height than the first region 331. For example, since the first region 331 is cut by the nanosecond laser beam 400, the first region 331 may be formed to have a smaller height than the second region 332. For example, according to the embodiment, since the first region 331 is cut by the nanosecond laser beam 400, on the glass layer 310, the first region 331 may be formed to have a smaller thickness than the second region 332.

[0130] According to an embodiment, the graph 630 is a graph comparing the surface illuminance values ​​of the first region 331 and the second region 332. For example, the graph 630 is a graph comparing the brightness of the first region 331 and the second region 332 of the concavo-convex layer 320.

[0131] The surface illumination value may include an average brightness value of the corresponding area measured by the illumination sensor. For example, the brightness of an area with a high surface illumination value may be greater than the brightness of an area with a low surface illumination value. For example, an area with a high surface illumination value may be more visible to a user than an area with a low surface illumination value.

[0132] According to an embodiment, the illuminance value of the first area 331 may be higher than that of the second area 332. For example, the illuminance value of the first area 331 may be 6.307 μm and the illuminance value of the second area 332 may be 0.872 μm, but the illuminance values ​​of the first area 331 and the second area 322 are not limited thereto.

[0133] According to an embodiment, at least one pattern 210 may be visible brighter than surrounding areas due to the brightness difference between the first area 331 and the second area 332. For example, since the first area 331 is brighter than the second area 332, the user may easily visually recognize the at least one pattern 210.

[0134] Figure 7 A heat-affected zone formed on the concavo-convex layer according to an embodiment is shown.

[0135] According to an embodiment, Figure 7 A heat affected zone 710 formed around at least one pattern 210 is shown.

[0136] According to an embodiment, the concavo-convex layer 320 may include a first region 331 in which the nanosecond laser beam 400 is irradiated and at least one pattern 210 is engraved, and a second region 332 in which the at least one pattern 210 is not engraved.

[0137] According to an embodiment, the first region 331 and the second region 332 may refer to Figure 3 and Figure 6 The first area 331 and the second area 332 in the embodiment.

[0138] According to an embodiment, when at least one pattern 210 is formed on the concavo-convex layer 320 by the nanosecond laser beam 400, the heat-affected zone 710 may be formed around the at least one pattern 210. For example, a portion of the grooves 430 among the plurality of grooves 420 of the concavo-convex layer 320 may be cut by the nanosecond laser beam 400, so that the heat-affected zone 710 may be formed around the portion of the grooves 430. For example, the heat-affected zone 710 may be formed around the first region 331 by the nanosecond laser beam 400.

[0139] According to an embodiment, in a process of machining the partial groove 430 using the nanosecond laser beam 400 , heat impact may occur around the partial groove 430 , so that a heat affected zone 710 may be formed around the partial groove 430 .

[0140] According to an embodiment, the heat-affected zone 710 in the second region 332 may be visible substantially the same as the region in the second region 322 other than the heat-affected zone 710. For example, a portion of the grooves affected by heat in the plurality of grooves 420 may be visible substantially the same as some other grooves not affected by heat. For example, a portion of the grooves corresponding to the heat-affected zone 710 may not be distinguishable from some other grooves in the second region 332 by naked eyes.

[0141] According to an embodiment, since some grooves corresponding to the heat-affected zone 710 cannot be distinguished from some other grooves in the second area 332 by the naked eye, a user of the electronic device 100 may not be able to identify the heat-affected zone 710 by the naked eye and may only identify at least one pattern 210 of the first area 331.

[0142] According to an embodiment, even if the heat affected zone 710 is formed around the at least one pattern 210 by the nanosecond laser beam 400, the user can distinguish the concave-convex layer 320 into a first area 331 in which the at least one pattern 210 is engraved and a second area 332 in which the at least one pattern 210 is not engraved.

[0143] Figure 8a A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0144] According to an embodiment, the electronic device 100 may include a glass layer 310 and a concavo-convex layer 320 stacked on the glass layer 310 and having at least one pattern 210 engraved thereon.

[0145] According to an embodiment, the glass layer 310 may be formed of transparent glass. According to an embodiment, since the glass layer 310 is formed of transparent glass, a user may recognize the housing 110 of the electronic device 100 through the glass layer 310 .

[0146] According to an embodiment, the electronic device 100 may further include a coloring layer 810 disposed between the housing 110 and the glass layer 310 .

[0147] According to an embodiment, the coloring layer 810 may include at least one color. According to an embodiment, as the coloring layer 810 is further formed, the user of the electronic device 100 may visually recognize the housing 110 including at least one color through the transparent glass layer 310 .

[0148] According to an embodiment, when at least one pattern 210 is formed on the concavo-convex layer 320, an afterimage of the at least one pattern 210 may be formed on the colored layer 810. For example, when light is incident on the concavo-convex layer 320, light transmission and light diffusion may occur due to the irregular surface of the concavo-convex layer 320 in which the plurality of grooves 420 are formed, and an afterimage 820 of the at least one pattern 210 may be formed on the colored layer 810.

[0149] According to an embodiment, Figure 8a It is shown that the colored layer 810 is formed under the glass layer 310, but is not limited thereto. For example, the colored layer 810 may be formed on the concavo-convex layer 320 on which the at least one pattern 210 is formed.

[0150] Figure 8b At least one pattern formed on the concavo-convex layer according to an embodiment is shown.

[0151] Reference Figure 8b , at least one pattern 210 may be formed on the concavo-convex layer 320. For example, at least one pattern 210 in the shape of a letter M may be formed on the concavo-convex layer 320, but is not limited thereto. For example, at least one pattern 210 in the form of a letter or a picture may be formed on the concavo-convex layer 320.

[0152] Figure 9a A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0153] According to an embodiment, Figure 8a different, Figure 9a The electronic device 100 may further include a first light-transmitting layer 910 disposed on the concavo-convex layer 320 .

[0154] According to an embodiment, the first light-transmitting layer 910 may be disposed on the concavo-convex layer 320 on which the at least one pattern 210 is engraved.

[0155] According to an embodiment, the first light-transmitting layer 910 may have lower light transmittance than the glass layer 310 .

[0156] According to an embodiment, only a portion of light incident through the first light-transmitting layer 910 may reach the colored layer 810 through the glass layer 310. For example, light incident through the first light-transmitting layer 910 may pass through the first light-transmitting layer 910. As the amount of transmitted light decreases when light passes through the first light-transmitting layer 910, the amount of transmitted light reaching the concavo-convex layer 320 and the amount of diffused light diffused on the concavo-convex layer 320 may decrease.

[0157] According to an embodiment, as the first light-transmitting layer 910 is further formed, Figure 9a At least one pattern 210 may be Figure 8a and Figure 8b For example, due to the formation of the first light-transmitting layer 910 having a lower light transmittance, the afterimage 920 of the at least one pattern 210 recognized by the user may be less clear than that of the first light-transmitting layer 910. Figure 8a and Figure 8b The afterimage of at least one pattern 210 is clear.

[0158] According to an embodiment, as the afterimage of the pattern weakens, the user of the electronic device 100 can compare Figure 8a and Figure 8b At least one pattern 210 is more clearly identified Figure 9a At least one pattern 210.

[0159] According to an embodiment, the first light-transmitting layer 910 may be implemented by deposition on the concavo-convex layer 320, but is not limited thereto. According to an embodiment, the first light-transmitting layer 910 may be implemented by a printing method, a painting method, a thin film attachment method, and / or an OCA method.

[0160] Figure 9b At least one pattern according to an embodiment is shown.

[0161] According to an embodiment, Figure 9b It may be a diagram comparing at least one pattern of an electronic device where the first light-transmitting layer 910 is not disposed with at least one pattern in an electronic device where the first light-transmitting layer 910 is disposed.

[0162] According to an embodiment, Figure 9b A first case 901 in which the first light-transmitting layer 910 is not disposed and a second case 902 in which the first light-transmitting layer 910 is disposed are shown.

[0163] According to an embodiment, the first case 901 may show at least one pattern 210 of the electronic device 100 without the first light-transmitting layer 910 disposed on the concavo-convex layer 320. For example, the first case 901 may show Figure 8a At least one pattern of the electronic device 100.

[0164] According to an embodiment, the second case 902 may show that at least one pattern 210 of the electronic device 100 is provided with a first light-transmitting layer 910 on the concavo-convex layer 320. For example, the second case 902 may show Figure 9a At least one pattern of the electronic device 100.

[0165] According to the embodiment, since the first light-transmitting layer 910 is further formed, the at least one pattern 210 of the second case 902 can be more clearly recognized than the at least one pattern 210 of the first case 901. For example, when the first light-transmitting layer 910 having a lower light transmittance is formed, Figure 8a Compared with the sharpness of the afterimage of the at least one pattern 210 recognized by the user, the sharpness of the afterimage 920 of the at least one pattern 210 recognized by the user may be reduced.

[0166] According to an embodiment, since the sharpness of the afterimage of the pattern is reduced, the user of the electronic device 100 can Figure 8a The at least one pattern 210 is more clearly visually identifiable Figure 9a At least one pattern 210. Fig.10 A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0167] According to an embodiment, different from including Figure 8a The transparent glass layer 310 of the electronic device 100 is formed by Fig.10 The electronic device 100 may include a glass layer 1010 including translucent glass or opaque glass.

[0168] According to an embodiment, when Figure 8a and Figure 9a The glass layer 310 formed of transparent glass corresponds to the first glass layer, including Fig.10 The glass layer 1010 including the translucent glass or the opaque glass may correspond to the second glass layer. The glass layer 1010 including the translucent glass or the opaque glass may be described as the second glass layer hereinafter.

[0169] According to an embodiment, the second glass layer 1010 may have lower light transmittance than the first glass layer 310 .

[0170] For example, when the light transmittance of the first glass layer 310 is 100%, the light transmittance of the second glass layer 1010 may be in the range of 0% to 90%. However, the light transmittance of the second glass layer 1010 is not limited to the range of 0% to 90%. For example, the second glass layer 1010 may have a light transmittance in the range of 90% to 100%.

[0171] According to the embodiment, even if the Figure 9a The first light-transmitting layer 910 can also make at least one pattern 210 clear due to the formation of the second glass layer 1010 .

[0172] According to the embodiment, even if the first light-transmitting layer 910 is omitted, the visibility of the at least one pattern 210 can be improved due to the formation of the second glass layer 1010 having low light transmittance. For example, due to the formation of the second glass layer 1010 having low light transmittance, only a portion of the light incident through the concavo-convex layer 320 can pass through the second glass layer 1010 to reach the colored layer 810. For example, when the light passes through the second glass layer 1010, the amount of the transmitted light incident through the concavo-convex layer 320 may be reduced.

[0173] According to the embodiment, since the second glass layer 1010 is formed, Fig.10 At least one pattern 210 may be Figure 8a and Figure 8b The at least one pattern 210 is more clearly formed.

[0174] According to the embodiment, due to the formation of the second glass layer 1010, the light transmittance may be reduced, and the sharpness of the afterimage 1020 of the at least one pattern 210 may be not as good as that of the second glass layer 1010. Figure 8a and Figure 8b The sharpness of the afterimage 1020 of at least one pattern 210 is clear. For example, due to the reduction in transmittance, the sharpness of the afterimage 1020 of at least one pattern 210 may be reduced, and the amount of reflection of the afterimage 1020 may be reduced.

[0175] According to an embodiment, as the sharpness of the afterimage 1020 is reduced, visibility of the at least one pattern 210 may be improved.

[0176] According to an embodiment, as the afterimage 1020 of the at least one pattern 210 weakens, the user of the electronic device 100 can timely compare Figure 8a and Figure 8b At least one pattern 210 is more clearly identified Fig.10 At least one pattern 210.

[0177] According to the embodiment, since the Figure 9a The first light-transmitting layer 910, Fig.10 The stacked structure of the concave-convex layer can be structurally Figure 9a The stacking structure is simple. For example, when the second glass layer 1010 is arranged, even if there is no Figure 9a The first light-transmitting layer 910 may also improve the sharpness of the at least one pattern 210 engraved by the nanosecond laser beam 400 .

[0178] According to the embodiment, even if the laser wavelength absorption rate of the second glass layer 1010 is low, at least one pattern 210 may be formed because the concavo-convex layer 320 includes the plurality of grooves 420. For example, even when the nanosecond laser beam 400 is not absorbed by the second glass layer 1010, the nanosecond laser beam 400 may be reflected and absorbed multiple times on the inner walls of the plurality of grooves 420, thereby forming at least one pattern 210.

[0179] Fig.11a A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0180] According to an embodiment, Figure 8a The electronic device 100 is different. Fig.11a The electronic device may omit the coloring layer 810 and further include a second light-transmitting layer 1110 that transmits light.

[0181] According to an embodiment, a second light-transmitting layer 1110 may be formed between the housing 110 and the glass layer 310 of the electronic device 100 .

[0182] According to an embodiment, the glass layer 310 may refer to Figure 8a and Figure 9a The glass layer 310 may include a transparent glass. For example, the glass layer 310 may include a glass having a light transmittance of 99% to 100%.

[0183] According to an embodiment, the second light-transmitting layer 1110 may be formed of glass having a light transmittance substantially the same as or higher than that of the glass layer 310. For example, light incident on the concave-convex layer 320 may be transmitted through the glass layer 310 and the second light-transmitting layer 1110. For example, light incident on the concave-convex layer 320 may pass through the glass layer 310 and be transmitted through the second light-transmitting layer 1110 as it is without being reflected again.

[0184] According to an embodiment, the second light-transmitting layer 1110 may be formed of a material having substantially the same light transmittance as the first glass layer 310 or having a higher light transmittance than the first glass layer 310 .

[0185] For example, an anti-reflection coating with high transmittance can be implemented by a low-reflection coating. For example, it can be implemented by an ink process, a paint process, an ultraviolet (UV) coating process, and / or an optically clear adhesive (OCA) with a higher transmittance than the first glass layer. For example, the second light-transmitting layer 1110 can be omitted, and an empty space can be formed between the first glass layer 310 and the housing 110.

[0186] According to the embodiment, since the colored layer 810 is omitted and the second light-transmitting layer 1110 having a transmittance substantially equal to or higher than that of the glass layer 310 is provided, the visibility of the at least one pattern 210 can be improved. For example, since the light incident on the concavo-convex layer 320 passes through the second light-transmitting layer 1110 as it is, an afterimage of the at least one pattern 210 is not formed on the second light-transmitting layer 1110.

[0187] According to an embodiment, when an afterimage of the at least one pattern 210 is not formed, visibility of the at least one pattern 210 may be improved.

[0188] Fig.11b At least one pattern according to an embodiment is shown.

[0189] According to an embodiment, Fig.11b It may be a diagram comparing at least one pattern of an electronic device where the second light-transmitting layer 1110 is not disposed and at least one pattern of an electronic device where the second light-transmitting layer 1110 is disposed.

[0190] According to an embodiment, Fig.11b A third case 1101 in which the second light-transmitting layer 1110 is not formed and a fourth case 1102 in which the second light-transmitting layer 1110 is formed are shown.

[0191] According to an embodiment, the third case 1101 may show at least one pattern 210 of the electronic device 100 in which the second light-transmitting layer 1110 is not formed. For example, the third case 1101 may show Figure 8a At least one pattern of the electronic device 100.

[0192] According to an embodiment, the fourth case 1102 may show at least one pattern 210 of the electronic device 100 including the second light-transmitting layer 1110 formed between the housing 110 and the glass layer 310. For example, the fourth case 1102 may show Fig.11a At least one pattern 210 of the electronic device 100 .

[0193] According to the embodiment, the visibility of the at least one pattern 210 can be improved due to the arrangement of the second light-transmitting layer 1110. For example, since the light incident on the concavo-convex layer 320 is transmitted through the second light-transmitting layer 1110 as it is, an afterimage of the at least one pattern 210 may not be formed on the second light-transmitting layer 1110.

[0194] According to an embodiment, since an afterimage of the at least one pattern 210 is not formed, the visibility of the at least one pattern 210 in the fourth case 1102 may be improved compared to the visibility of the at least one pattern in the third case 1101 .

[0195] Fig.12A stacked structure of a glass layer and a concavo-convex layer according to an embodiment is shown.

[0196] According to an embodiment, Figure 8a The electronic device 100 is different. Fig.12 The electronic device 100 may omit the coloring layer 810 and further include a light absorbing layer 1210 that reflects light.

[0197] According to an embodiment, the glass layer 310 may refer to Figure 3 and Figure 8a The glass layer 310 may include a transparent glass.

[0198] According to an embodiment, the light absorbing layer 1210 may be disposed between the glass layer 310 and the housing 110. According to an embodiment, the light absorbing layer 1210 may include a layer that absorbs light transmitted through the glass layer 310. For example, since the light transmitted through the glass layer 310 is absorbed by the light absorbing layer 1210, only a portion of the light may be reflected by the light absorbing layer 1210.

[0199] According to an embodiment, the light absorbing layer 1210 may be formed of a material having a lower reflectivity than the glass layer 310. For example, the light absorbing layer 1210 may be formed by an ink method, a painting method, a thin film coating method, and / or an optically clear adhesive (OCA) method.

[0200] According to an embodiment, the light absorbing layer 1210 may block a portion of the light transmitted through the glass layer 310 from being reflected. For example, light incident on the surface of the concavo-convex layer 320 may pass through the glass layer 310 and reach the light absorbing layer 1210. Only a portion of the light reaching the light absorbing layer 1210 may be reflected from the light absorbing layer 1210. As the amount of reflected light decreases, the sharpness of the afterimage 1220 of the at least one pattern 210 recognized by the user may decrease.

[0201] According to an embodiment, as the sharpness of the afterimage 1220 of the at least one pattern 210 decreases, the visibility of the at least one pattern 210 may be improved.

[0202] With the above Figures 8a to 12 All relevant embodiments can be based on the representative diagram Figure 4a , and the combination / combination of the various added features is feasible within the scope of not contradicting each other. For example, the first light-transmitting layer 910 can be disposed on the concave-convex layer 320, and Fig.11a The glass layer 310 may be disposed below the concavo-convex layer 320 .

[0203] As long as there is no obvious technical conflict caused by the combination, the above Figures 3 to 12 The embodiments of can be combined. For example, Figure 3 The features of the concave-convex layer 320 may include Figures 8a to 12 For example, regarding the concave-convex layer 320. Figure 4a The features of the concave-convex layer 320 of the plurality of grooves 420 may include Figures 8a to 12 In the concave-convex layer 320.

[0204] Fig.13 The electronic device 1301 in the network environment 1300 according to the embodiment (refer to Figure 1 100 is a block diagram of an electronic device 100).

[0205] Reference Fig.13 In the network environment 1300, the electronic device 1301 may communicate with the electronic device 1302 through the first network 1398 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 1304 or the server 1308 through the second network 1399 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1301 may communicate with the electronic device 1304 through the server 1308. According to an embodiment, the electronic device 1301 may include a processor 1320, a memory 1330, an input module 1350, a sound output module 1355, a display module 1360, an audio module 1370, a sensor module 1376, an interface 1377, a connection terminal 1378, a haptic module 1379, a camera module 1380, a power management module 1388, a battery 1389, a communication module 1390, a user identification module 1396, or an antenna module 1397. In some embodiments, at least one of these components (e.g., the connection terminal 1378) may be omitted, or one or more other components may be added in the electronic device 1301. In some embodiments, some of these components (e.g., the sensor module 1376, the camera module 1380, or the antenna module 1397) may be integrated into a single component (e.g., the display module 1360).

[0206] The processor 1320 may, for example, execute software (e.g., program 1340) and control at least one other component (e.g., hardware or software component) of the electronic device 1301 connected to the processor 1320, and may perform various data processing or operations. According to an embodiment, the processor 1320 may load commands or data received from other components (e.g., sensor module 1376 or communication module 1390) to the volatile memory 1332, process the commands or data stored in the volatile memory 1332 as at least part of the data processing or operation, and store the resultant data in the non-volatile memory 1334. According to an embodiment, the processor 1320 may include a main processor 1321 (e.g., a central processing unit or an application processor) or an auxiliary processor 1323 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that may operate independently or together therewith. For example, when the electronic device 1301 includes a main processor 1321 and an auxiliary processor 1323, the auxiliary processor 1323 may use less power than the main processor 1321 or be configured to be dedicated to a specific function. The auxiliary processor 1323 may be implemented separately from the main processor 1321 or as part of the main processor 1321.

[0207] For example, when the main processor 1321 is in an inactive (e.g., sleep) state, the auxiliary processor 1323 may replace the main processor 1321 to control at least some of the functions or states related to at least one of the components of the electronic device 1301 (e.g., display module 1360, sensor module 1376, or communication module 1390), or when the main processor 1321 is in an active (e.g., application running) state, the auxiliary processor 1323 may control at least some of the functions or states related to at least one of the components of the electronic device 1301 (e.g., display module 1360, sensor module 1376, or communication module 1390) together with the main processor 1321. According to an embodiment, the auxiliary processor 1323 (e.g., an image signal processor or a communication processor) may be implemented as some other function-related components (e.g., camera module 1380 or communication module 1390). According to an embodiment, the auxiliary processor 1323 (e.g., a neural processing device) may include a hardware structure specifically for processing an artificial intelligence model. The artificial intelligence model may be provided by machine learning. For example, such learning can be performed in the electronic device 1301 itself that runs the artificial intelligence model, or can be performed by a separate server (e.g., server 1308). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the above examples. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recursive neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), and a bidirectional recursive deep neural network. In addition to the hardware structure, the artificial intelligence model may also additionally or alternatively include a software structure.

[0208] The memory 1330 may store various data used by at least one component of the electronic device 1301 (e.g., the processor 1320 or the sensor module 1376). The data may include, for example, input data or output data of software (e.g., program 1340) and commands related thereto. The memory 1330 may include a volatile memory 1332 or a non-volatile memory 1334.

[0209] The program 1340 may be stored in the memory 1330 as software, and may include, for example, an operating system 1342 , middleware 1344 , or an application program 1346 .

[0210] The input module 1350 may receive commands or data to be used by components (e.g., the processor 1320) of the electronic device 1301 from outside (e.g., a user) of the electronic device 1301. The input module 1350 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0211] The sound output module 1355 can output sound signals to the outside of the electronic device 1301. The sound output module 1355 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or record playback. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0212] The display module 1360 can visually present information to the outside of the electronic device 1301 (e.g., a user). The display module 1360 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the corresponding device. According to an embodiment, the display module 1360 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the strength of the force provided by the touch.

[0213] The audio module 1370 can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to an embodiment, the audio module 1370 can obtain sound through the input module 1350, or output sound through the sound output module 1355 or an external electronic device (e.g., electronic device 1302) (e.g., a speaker or earphone) directly or wirelessly connected to the electronic device 1301.

[0214] The sensor module 1376 may detect an operating state (e.g., power or temperature) or an external environment state (e.g., a user state) of the electronic device 1301, and provide an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1376 may include, for example, a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0215] The interface 1377 may support one or more specified protocols that may be used to directly or wirelessly connect the electronic device 1301 to an external electronic device (e.g., the electronic device 1302). According to an embodiment, the interface 1377 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0216] The connection end 1378 may include a connector, and the electronic device 1301 may be physically connected to an external electronic device (e.g., the electronic device 1302) through the connector. According to an embodiment, the connection end 1378 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0217] The haptic module 1379 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that the user may sense through tactile or kinesthetic sense. According to an embodiment, the haptic module 1379 may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0218] The camera module 1380 may capture still images and moving images. According to an embodiment, the camera module 1380 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0219] The power management module 1388 may manage power supplied to the electronic device 1301. According to an embodiment, for example, the power management module 1388 may be implemented as at least a part of a power management integrated circuit (PMIC).

[0220] The battery 1389 may supply power to at least one component of the electronic device 1301. According to an embodiment, the battery 1389 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0221] The communication module 1390 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1301 and an external electronic device (e.g., electronic device 1302, electronic device 1304, or server 1308), and perform communication through the established communication channel. The communication module 1390 may include one or more communication processors that operate independently of the processor 1320 (e.g., an application processor) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 1390 may include a wireless communication module 1392 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1394 (e.g., a local area network (LAN) communication module or a power line communication module). Among these communication modules, the corresponding communication module can communicate with the external electronic device 1304 through a first network 1398 (for example, a short-range communication network such as Bluetooth, Wireless Fidelity (WiFi) Direct, or Infrared Data Association (IrDA)) or a second network 1399 (for example, a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (for example, a LAN or WAN)). These different types of communication modules can be integrated into one component (for example, a single chip) or implemented as multiple separate components (for example, multiple chips). The wireless communication module 1392 can confirm or authenticate the electronic device 1301 within the communication network (such as the first network 1398 or the second network 1399) by using the user information (for example, the International Mobile Subscriber Identifier (IMSI)) stored in the user identification module 1396.

[0222] The wireless communication module 1392 can support next-generation communication technologies above 5G networks and 4G networks, such as new radio (NR) access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communication (mMTC)), or ultra-reliable and low-latency communication (URLLC). For example, the wireless communication module 1392 can support high-frequency bands (e.g., millimeter wave mmWave bands) and achieve high data rates. The wireless communication module 1392 can support various technologies for ensuring performance in high-frequency bands, for example, technologies such as beamforming, massive multiple-input multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 1392 can support various requirements defined for the electronic device 1301, an external electronic device (e.g., electronic device 1304), or a network system (e.g., a second network 1399). According to an embodiment, the wireless communication module 1392 can support a peak data rate for implementing eMBB (e.g., 20 Gbps or higher), a loss coverage for implementing mMTC (e.g., 164 dB or lower), or a U-plane delay for implementing URLLC (e.g., 0.5 ms or lower for each downlink (DL) and uplink (UL), or 1 ms or lower for a round trip).

[0223] The antenna module 1397 may send a signal or power to the outside (e.g., an external electronic device), or receive a signal or power from the outside (e.g., an external electronic device, etc.). According to an embodiment, the antenna module 1397 may include an antenna including a radiator formed by a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to an embodiment, the antenna module 1397 may include a plurality of antennas (e.g., an array antenna). In this case, for example, the communication module 1390 may select at least one antenna suitable for a communication method used by a communication network (e.g., a first network 1398 or a second network 1399) from the plurality of antennas. A signal or power may be sent or received between the communication module 1390 and the external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 1397. According to various embodiments, the antenna module 1397 may form a millimeter wave antenna module. According to an embodiment, a millimeter wave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., a millimeter wave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of sending or receiving signals in the specified high frequency band.

[0224] At least some of the components may be connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and exchange signals (eg, commands or data) with each other.

[0225] According to an embodiment, commands or data may be sent or received between the electronic device 1301 and the external electronic device 1304 through the server 1308 connected to the second network 1399. Each of the external electronic devices 1302 or 1304 may include the same or different types of devices as the electronic device 1301. According to an embodiment, all or some operations performed by the electronic device 1301 may be performed by one or more of the external electronic devices 1302, 1304 or 1308. For example, when the electronic device 1301 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 1301 may request one or more external electronic devices to perform at least a part of the function or service, instead of performing the function or service by itself, or additionally performing the supplement of the function and service by itself. The one or more external electronic devices that receive the request may perform at least a part of the requested function or service or an additional function or service related to the request, and send the execution result to the electronic device 1301. The electronic device 1301 may present the result as at least a part of the response to the request as is or after additional processing. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 1301 can present ultra-low latency services by using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1304 may include an Internet of Things (IoT) device. The server 1308 may include an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 1304 or the server 1308 may be included in the second network 1399. The electronic device 1301 can be applied to smart services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and Internet of Things (IoT) related technologies.

[0226] The electronic devices of various embodiments disclosed in this specification may include various types of devices. The electronic devices may include, for example, portable communication devices (such as smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or household appliances. The electronic devices of the embodiments of this specification are not limited to the above devices.

[0227] The various embodiments of this specification and the terms used herein are not intended to limit the technical features described in this specification to specific embodiments, but should be understood to include various modifications, equivalents or substitutions of the corresponding embodiments. With respect to the description of the drawings, similar reference numerals may be used for similar or related components. Unless otherwise clearly indicated by the relevant context, the singular form of the noun corresponding to the term may include a single or multiple terms. In this specification, each phrase, such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one of the corresponding phrases listed together in the phrase, or any possible combination thereof. Terms such as "1st", "2nd", "first" or "second" may be used simply to distinguish a corresponding component from another corresponding component without limiting the corresponding component in other aspects (such as importance or order). When referring to some (e.g., a first) component being “coupled” or “connected” to another (e.g., a second) component, whether or not the term “functionally” or “communicatively” is used, this means that some components may be connected to another component directly (e.g., wired), wirelessly, or through a third component.

[0228] The term "module" used in various embodiments of this specification may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may include an integrated component or a minimum unit of a component or part thereof that performs one or more functions. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0229] Various embodiments of the present specification may be implemented as software (e.g., program 1340) that includes one or more instructions stored in a machine (e.g., electronic device 1301) readable storage medium (e.g., internal memory 1336 or external memory 1338). For example, a processor (e.g., processor 1320) of a machine (e.g., electronic device 1301) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to perform at least one function according to at least one instruction called. The one or more instructions may include code provided by a compiler or code executable by an interpreter. The machine-readable storage medium may be presented in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves). The term does not distinguish between a case where data is semi-permanently stored in a storage medium and a case where data is temporarily stored.

[0230] According to an embodiment, the methods of various embodiments disclosed in this specification may be included and presented in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded through an application store (e.g., Play Store TM ), directly between two user devices (e.g., smartphones) or distributed online (e.g., downloaded or uploaded). In online distribution, at least a part of the computer program product may be at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, an application store server, or a relay server, or may be temporarily provided.

[0231] According to various embodiments, each component (e.g., module or program) of the above-mentioned components may include a single or multiple entities, and some of the multiple entities may also be arranged separately in another component. According to various embodiments, one or more components in the above-mentioned corresponding components or operations may be omitted, or one or more other components or operations may be added. Additionally or alternatively, multiple components (e.g., modules or programs) may be integrated into one component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as the functions performed by the corresponding components among the multiple components before integration. According to various embodiments, the operations performed by modules, programs or other components may be performed sequentially, in parallel, iteratively or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0232] According to an embodiment, the electronic device may include a housing. According to an embodiment, the electronic device may include a glass layer formed on a rear surface of the housing. According to an embodiment, the electronic device may include a concave-convex layer formed on the glass layer and including a plurality of grooves. According to an embodiment, a nanosecond laser beam may be radiated to some of the plurality of grooves, thereby engraving at least one pattern on the concave-convex layer. According to an embodiment, the radiated nanosecond laser beam may be reflected and absorbed multiple times on inner walls of some of the plurality of grooves.

[0233] According to an embodiment, the nanosecond laser beam may include a wavelength in a range of 350 nanometers (nm) to 1 millimeter (mm). According to an embodiment, each of the partial grooves of the plurality of grooves may have a first width corresponding to the wavelength of the nanosecond laser and a first height corresponding to the wavelength of the nanosecond laser.

[0234] According to an embodiment, the first width may include a range of 350 nm to 1 mm. According to an embodiment, the first height may include a range of 350 nm to 1 mm.

[0235] According to an embodiment, the concavo-convex layer may include a first region and a second region, the first region being irradiated with a nanosecond laser beam and engraved with at least one pattern, and the second region being not engraved with the at least one pattern.

[0236] According to an embodiment, a first illuminance of the first area may be higher than a second illuminance of the second area.

[0237] According to an embodiment, the glass layer may be formed of transparent glass. According to an embodiment, the electronic device may further include a coloring layer disposed between the housing and the glass layer.

[0238] According to an embodiment, the glass layer may be formed of transparent glass. According to an embodiment, the electronic device may further include a coloring layer disposed on the concavo-convex layer.

[0239] According to an embodiment, the electronic device may further include a first light-transmitting layer disposed on the concavo-convex layer and having a lower light transmittance than the glass layer.

[0240] According to an embodiment, the glass layer may be formed of transparent glass. According to an embodiment, the electronic device may further include a light absorbing layer disposed between the housing and the glass layer and having a lower reflectivity than the glass layer.

[0241] According to an embodiment, the light transmittance of the glass layer may be in the range of 0% to 90%.

[0242] According to an embodiment, the glass layer may be formed of transparent glass. According to an embodiment, the electronic device may further include a second light-transmitting layer disposed between the housing and the glass layer and having substantially the same light transmittance as the glass layer.

[0243] According to an embodiment, the concavo-convex layer may include a heat affected zone formed around at least one pattern engraved by the nanosecond laser beam.

[0244] According to an embodiment, the concavo-convex layer may be formed through a chemical etching process, a sandblasting process, or a dry etching process using ion plasma.

[0245] According to an embodiment, a method for forming a pattern on a housing of an electronic device may include preparing a glass layer formed on the housing. According to an embodiment, the method for forming a pattern on a housing of an electronic device may include forming a concave-convex layer including a plurality of grooves on the glass layer. According to an embodiment, the method for forming a pattern on a housing of an electronic device may include radiating a nanosecond laser beam to the plurality of grooves and forming at least one pattern on the concave-convex layer. According to an embodiment, at least one pattern may be formed by a nanosecond laser beam that is reflected and absorbed multiple times on an inner wall of each of a portion of the grooves in the plurality of grooves.

[0246] According to an embodiment, the nanosecond laser beam may include a wavelength in a range of 350 nanometers (nm) to 1 millimeter (mm). According to an embodiment, each of the partial grooves in the plurality of grooves may have a first width corresponding to the wavelength of the nanosecond laser and a first height corresponding to the wavelength of the nanosecond laser.

[0247] According to an embodiment, the first width may include a range of 350 nm to 1 mm.

[0248] According to an embodiment, the concavo-convex layer may include a first region in which the nanosecond laser beam is irradiated and at least one pattern is engraved, and a second region in which the at least one pattern is not engraved.

[0249] According to an embodiment, a first illuminance of the first area may be higher than a second illuminance of the second area.

[0250] According to an embodiment, the method may further include disposing a colored layer before preparing the glass layer formed on the housing, wherein the colored layer is disposed between the housing and the glass layer.

[0251] According to an embodiment, the method may further include a method of arranging a first light-transmitting layer before preparing the glass layer formed on the housing, wherein the first light-transmitting layer is arranged between the housing and the glass layer.

[0252] According to an embodiment, the method may further include a method of further arranging a light absorbing layer before preparing the glass layer formed on the housing, the light absorbing layer being arranged between the housing and the glass layer and having a reflectivity lower than that of the glass layer.

[0253] According to an embodiment, the light transmittance of the glass layer may be in the range of 0% to 90%.

Claims

1. An electronic device, comprising: case; a glass layer formed on a rear surface of the housing; as well as a concavo-convex layer, the concavo-convex layer being formed on the glass layer and comprising a plurality of grooves, Part of the plurality of grooves is irradiated with a nanosecond laser beam, and at least one pattern is engraved on the concave-convex layer, and The irradiated nanosecond laser beam is reflected and absorbed multiple times on inner walls of the partial grooves among the plurality of grooves.

2. The electronic device according to claim 1, wherein: The nanosecond laser beam comprises a wavelength in the range of 350 nanometers (nm) to 1 millimeter (mm), and Each of the partial grooves of the plurality of grooves has a first width corresponding to a wavelength of the nanosecond laser and a first height corresponding to the wavelength of the nanosecond laser.

3. The electronic device according to claim 2, wherein: The first width includes a range of 350 nm to 1 mm, and The first height includes a range of 350 nm to 1 mm.

4. The electronic device according to claim 1, wherein: The concave-convex layer includes a first region and a second region, the first region is irradiated with the nanosecond laser beam and engraved with the at least one pattern, and the second region is not engraved with the at least one pattern, and A first illuminance of the first area is higher than a second illuminance of the second area.

5. The electronic device according to claim 1, wherein: The glass layer is formed of transparent glass, and The electronic device also includes a coloring layer disposed between the housing and the glass layer.

6. The electronic device according to claim 1, wherein: The glass layer is formed of transparent glass, and The electronic device further includes a coloring layer disposed on the concavo-convex layer.

7. The electronic device according to claim 1, further comprising a first light-transmitting layer, which is disposed on the concave-convex layer and has a lower light transmittance than the glass layer.

8. The electronic device according to claim 1, wherein: The glass layer is formed of transparent glass, and The electronic device further includes a light absorbing layer disposed between the housing and the glass layer and having a lower reflectivity than the glass layer.

9. The electronic device according to claim 1, wherein: The light transmittance of the glass layer is in the range of 0% to 90%.

10. The electronic device according to claim 1, wherein: The glass layer is formed of transparent glass, and The electronic device further includes a second light-transmitting layer disposed between the housing and the glass layer and having substantially the same light transmittance as the glass layer.

11. The electronic device according to claim 1, wherein: The concavo-convex layer includes a heat-affected zone formed around the at least one pattern engraved by the nanosecond laser beam.

12. The electronic device according to claim 1, wherein: The concavo-convex layer is formed by a chemical etching process, a sandblasting process, or a dry etching process using ion plasma.

13. A method for forming a pattern on a housing of an electronic device, the method comprising: preparing a glass layer formed on the shell; forming a concavo-convex layer including a plurality of concave grooves on the glass layer; as well as irradiating the plurality of grooves with a nanosecond laser beam and forming at least one pattern on the concave-convex layer, The at least one pattern is formed by the nanosecond laser beam being reflected and absorbed multiple times on the inner wall of each of some of the multiple grooves.

14. The method according to claim 13, wherein: The nanosecond laser beam comprises a wavelength in the range of 350 nanometers (nm) to 1 millimeter (mm), and Each of the partial grooves of the plurality of grooves has a first width corresponding to a wavelength of the nanosecond laser and a first height corresponding to the wavelength of the nanosecond laser.

15. The method according to claim 13, wherein: The concave-convex layer includes a first region and a second region, the first region is irradiated with the nanosecond laser beam and engraved with the at least one pattern, and the second region is not engraved with the at least one pattern, and A first illuminance of the first area is higher than a second illuminance of the second area.

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