Middle frame assembly and electronic equipment comprising same

Abstract

The invention discloses a middle frame assembly and an electronic device comprising the same, the middle frame assembly comprises an inner frame and an outer frame arranged on the periphery of the inner frame, the inner frame comprises a first metal material, the outer frame comprises a second metal material, and the density of the first metal material is lower than that of the second metal material. According to the electronic equipment, the weight of the middle frame assembly can be reduced, and then the weight of the electronic equipment can be reduced, so that the portability is improved, and the appearance of high-grade gloss and hand feeling of the electronic equipment is kept.

Description

Middle frame assembly and electronic device including the same

[0001] This application claims priority to the Chinese invention patent application filed with the State Intellectual Property Office on August 24, 2022, with application number 202211021156.9 and invention name “A middle frame assembly and an electronic device comprising the same”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to a middle frame assembly and an electronic device including the same, and more particularly, to a middle frame assembly with reduced weight and an electronic device including the same. Background Art

[0003] With the popularity of portable electronic devices, the weight of electronic devices has a significant impact on their portability. For example, mobile phones are currently the most frequently used portable electronic devices by consumers. The weight of mobile phones is a key factor affecting their portability. Reducing the weight of mobile phones has always been the direction of continuous iteration of mobile phone products. How to further reduce the weight of electronic devices such as mobile phones has become a key difficulty in opening up the consumer market. The weight of the middle frame assembly accounts for 20% to 30% of the total weight of electronic devices such as mobile phones. Therefore, reducing the weight of the middle frame assembly has a very significant benefit in reducing the weight of the entire electronic device.

[0004] The following two weight reduction solutions are commonly used for midframe components:

[0005] 1. Reduce the volume of structural parts:

[0006] The middle frame assembly is made directly from aluminum alloy, and the interior of the aluminum alloy is filled with a plastic layer to achieve antenna clearance. To reduce weight, the middle frame assembly is partially thinned by removing the plastic. However, this solution affects the strength of the structural components, further affecting the strength of the entire device, and the weight reduction effect is limited.

[0007] 2. Replace with lower density materials:

[0008] The midframe assembly is manufactured using die-cast parts made of lightweight alloys such as magnesium or zinc alloys, replacing aluminum alloy die-cast parts. Plastic is then wrapped around the exterior and interior of the die-cast parts to create antenna clearance. The plastic wrapping around the midframe assembly is then sprayed with paint to create a finished appearance. However, current lightweight alloys such as magnesium and zinc cannot achieve the same premium metallic finish as aluminum alloy profiles, making this process unsuitable for high-end electronic devices such as flagship phones.

[0009] Summary of the Invention

[0010] Therefore, an object of the present disclosure is to provide a middle frame assembly that can reduce weight while maintaining a high-end gloss and feel in appearance.

[0011] Another object of the present disclosure is an electronic device comprising the above-mentioned middle frame assembly.

[0012] Other features and advantages of the present disclosure will be described in the following text, and in part will be apparent from the following text. These and other advantages of the present disclosure will be realized by the structures specifically pointed out in the description, claims and drawings.

[0013] To achieve the above objectives, according to one embodiment of the present disclosure, a middle frame assembly is disclosed, comprising an inner frame and an outer frame disposed around the inner frame. The inner frame is comprised of a first metal material, and the outer frame is comprised of a second metal material, wherein the density of the first metal material is lower than that of the second metal material. This reduces the weight of the middle frame assembly, ensures its electrical conductivity, improves its mechanical strength, and enables better heat dissipation.

[0014] In some embodiments, the density of the first metal material is lower than or equal to 70% of the density of the second metal material, thereby further effectively reducing the weight of the middle frame assembly.

[0015] In some embodiments, the first metal material of the inner frame includes one or more selected from magnesium alloy, zinc alloy, and copper alloy. Magnesium alloy, zinc alloy, and copper alloy are commonly used lightweight metals, which can effectively reduce the weight of the middle frame assembly while ensuring sufficient mechanical strength and heat dissipation of the middle frame assembly. They can also ensure good electrical conductivity, allowing them to be used as antennas, etc. In particular, the use of magnesium alloy further effectively reduces the weight of the middle frame assembly while ensuring sufficient strength of the inner frame.

[0016] In some embodiments, the second metal material of the outer frame comprises one or more selected from aluminum alloy, stainless steel, and titanium alloy. Aluminum alloy, stainless steel, and titanium alloy have relatively high density and strength, and their appearance can exhibit a high-end gloss and feel after surface treatment. When aluminum alloy is used, its density is lower than that of stainless steel and titanium alloy, and it is inexpensive. Therefore, it can not only ensure the appearance of a high-end gloss and feel, but also reduce the weight of the middle frame assembly and reduce production costs. When stainless steel is used, the mechanical strength of the middle frame assembly can be improved compared to aluminum alloy, and the appearance can achieve a more advanced gloss and feel. When titanium alloy is used, the weight of the middle frame assembly can be reduced compared to stainless steel, while the mechanical strength of the middle frame assembly can be improved.

[0017] In some embodiments, the second metal material is disposed on the outer surface of the outer frame. Therefore, the second metal material is exposed on the outer surface of the electronic device, which can give the middle frame assembly and the electronic device a high-end appearance with a high gloss and feel.

[0018] In some embodiments, one or both of the inner frame and the outer frame are single-layer frames. The simple single-layer structure of the inner frame and the outer frame can reduce the weight of the middle frame assembly, make it more reliable, facilitate production, and make it easier to install the middle frame assembly in the electronic device.

[0019] In some embodiments, one or both of the inner frame and the outer frame are laminated frames having a multi-layer structure. Thus, the inner frame or outer frame adopts a separate multi-layer structure, which can be applied to a variety of electronic device structures, meet different design requirements, and increase the flexibility of installing the middle frame assembly into the electronic device.

[0020] In some embodiments, an adhesive layer is provided between the inner frame and the outer frame. Through this structure, the inner frame and the outer frame can be reliably joined.

[0021] In some embodiments, the portion with a height difference between the inner frame and the outer frame is configured as a slope, and the adhesive layer is disposed on the slope. This structure allows for a transition between the portions with a height difference between the inner frame and the outer frame, and allows the adhesive layer to smoothly and reliably fill the gap at the portion with a height difference due to its inherent fluidity.

[0022] In some embodiments, the inner frame and the outer frame are fastened by a fastening member. Through this structure, the inner frame and the outer frame can be firmly fixed.

[0023] In some embodiments, the fastening member is a locking screw, and at least one of the inner frame and the outer frame is provided with a through hole, through which the fastening member passes to fix the inner frame and the outer frame. With this structure, the inner frame and the outer frame can be firmly fixed.

[0024] In some embodiments, one of the inner frame and the outer frame is provided with the through hole, and the other of the inner frame and the outer frame is provided with a threaded hole, and the fastening member passes through the through hole and is fastened into the threaded hole. With this structure, a secure fixation can be achieved with fewer parts and the process is simple.

[0025] In some embodiments, a conductive member electrically connecting the outer frame and the inner frame is provided between the outer frame and the inner frame. The conductive member can stably electrically connect the outer frame and the inner frame, thereby achieving a stable electrical connection.

[0026] In some embodiments, the conductive member is a spring, which includes a spring base and a spring probe extending from the spring base, the spring base contacts one of the inner frame and the outer frame, and the spring probe contacts the other of the inner frame and the outer frame.

[0027] In some embodiments, the spring clip base is welded to one of the inner frame and the outer frame, and the spring clip probe abuts against the other of the inner frame and the outer frame.

[0028] In some embodiments, the conductive component is a gasket, which includes a gasket body and a gasket elastic arm extending from the gasket body, a gasket bulge is provided on at least one of the upper surface and the lower surface of the gasket body, and the gasket bulge is provided on at least one of the upper surface and the lower surface of the gasket elastic arm, and the gasket is clamped between the inner frame and the outer frame by a fastening component, the gasket body and the gasket elastic arm surround the fastening component, and the gasket bulge abuts against at least one of the inner frame and the outer frame.

[0029] In some embodiments, the gasket bulge is arranged on the upper surface and lower surface of the gasket body and the gasket elastic arm, and respectively abuts the inner frame and the outer frame, and the gasket bulge is arranged at different positions on the upper surface of the gasket body and the gasket elastic arm and on the lower surface of the gasket body and the gasket elastic arm, respectively; or the gasket bulge is only arranged on the upper surface of the gasket body and the gasket elastic arm, and the lower surface of the gasket body where the gasket bulge is not arranged is welded to the inner frame or the outer frame; or the gasket bulge is only arranged on the lower surface of the gasket body and the gasket elastic arm, and the upper surface of the gasket body where the gasket bulge is not arranged is welded to the inner frame or the outer frame.

[0030] In some embodiments, the conductive member is a connecting piece, which includes a first arm, a second arm opposite to the first arm with a gap therebetween, and a connecting portion connecting the first arm and the second arm, the first arm and the second arm extend from the connecting portion respectively, the first arm is connected to the inner frame, and the second arm is connected to the outer frame.

[0031] In some embodiments, the inner frame has a recessed portion or a protruding portion in a region connected to the connecting piece, and the outer frame has a protruding portion or a recessed portion that fits into the recessed portion or the protruding portion.

[0032] According to one embodiment of the present disclosure, an electronic device includes the middle frame assembly described above, thereby reducing the weight of the middle frame assembly and further reducing the weight of the electronic device, thereby improving portability.

[0033] According to one embodiment of the present disclosure, an electronic device includes the middle frame assembly described above; a structural member of the electronic device; and a fastening member, through which the inner frame and the outer frame are coupled to the structural member. By utilizing the structural member of the electronic device itself, the inner frame, the outer frame, and the structural member can be more securely fastened together by the fastening member. Moreover, since the structural member of the electronic device itself is used to secure the inner frame and the outer frame, and the structural member itself often already has mounting holes, unnecessary steps are avoided, the processing can be simplified, and costs can be saved.

[0034] In some embodiments, one of the inner frame and the outer frame and the structural member have through-holes, and the other of the inner frame and the outer frame has threaded holes, through which the fastening member passes and is fastened. By utilizing the structural members of the electronic device itself, the fastening member can more securely fasten the inner frame, outer frame, and structural member.

[0035] In some embodiments, the structural member has a threaded hole, and both the inner frame and the outer frame have through holes, through which the fastening member passes and is fastened into the threaded hole. By utilizing the structural member of the electronic device itself, the fastening member can more securely fasten the inner frame, outer frame, and structural member.

[0036] In some embodiments, one of the inner frame and the outer frame has a recessed portion, and the other has a protrusion that engages with the recessed portion. At least one of the inner frame and the outer frame is fastened to the structural member via the fastening member, and one of the recessed portion and the protrusion is sandwiched between the structural member and the other of the recessed portion and the protrusion.

[0037] In some embodiments, the structural member includes a plurality of stacked structural members, and the inner frame and the outer frame are fastened to the plurality of structural members by the fastening member.

[0038] In some embodiments, the structural member is a bracket structural member, a rotating shaft structural member, or a PCB board. Since the structural member fastened to the mid-frame component can be a structural member of any electronic device, such as a bracket structural member, a rotating shaft structural member, or a PCB board, various fastening methods are available depending on the structural member and the fastening location, thereby increasing the flexibility of fastening the mid-frame assembly to the structural member.

[0039] According to one embodiment of the present disclosure as described above, a middle frame assembly and an electronic device including the same can be provided that can reduce weight while maintaining a high-quality gloss and feel in appearance. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0041] FIG1 is a schematic diagram of a mobile phone according to an embodiment of the present disclosure;

[0042] FIG2 is an exploded view of a mobile phone according to an embodiment of the present disclosure;

[0043] FIG3 is an exploded plan view of a middle frame assembly according to an embodiment of the present disclosure;

[0044] FIG4 is a schematic diagram of an assembled middle frame assembly according to an embodiment of the present disclosure;

[0045] 5A and 5B are schematic diagrams of an adhesive layer of a middle frame assembly according to an embodiment of the present disclosure, wherein FIG5A shows an exploded state of the inner frame, the outer frame, and the adhesive layer, and FIG5B shows an assembled state of the inner frame, the outer frame, and the adhesive layer;

[0046] 6A and 6B are cross-sectional views taken along line AA' of FIG. 5B , FIG. 6A shows a state where no adhesive layer is provided, and FIG. 6B shows a state where an adhesive layer is provided;

[0047] FIG7 is a schematic diagram of the installation of the fastening member of the middle frame assembly according to an embodiment of the present disclosure;

[0048] FIG8 is a plan view of an example of a fastening member of a middle frame assembly according to an embodiment of the present disclosure;

[0049] FIG9A is a cross-sectional view taken along line BB' of FIG8;

[0050] FIG9B is a cross-sectional view taken along line CC' of FIG8;

[0051] FIG9C is a cross-sectional view taken along line DD' of FIG8;

[0052] FIG9D is a schematic diagram of another connection method of the fastening member according to an embodiment of the present disclosure;

[0053] FIG9E is a schematic diagram of another connection method of the fastening member according to an embodiment of the present disclosure;

[0054] FIG10 is a schematic diagram of a spring sheet according to an embodiment of the present disclosure;

[0055] FIG11 is a schematic diagram of an embodiment of the present disclosure when the spring is installed between the inner frame and the outer frame;

[0056] FIG12 is a schematic diagram of a gasket according to an embodiment of the present disclosure;

[0057] FIG13 is a schematic diagram of an embodiment of the present disclosure when a gasket is installed between an inner frame and an outer frame;

[0058] FIG14 is a schematic diagram of a connecting piece according to an embodiment of the present disclosure;

[0059] FIG. 15 is a schematic diagram of an embodiment of the present disclosure when a connecting piece is installed between an inner frame and an outer frame. DETAILED DESCRIPTION

[0060] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0061] The terms used in the following embodiments are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. As used in the specification and appended claims of the present disclosure, the singular expressions "a," "an," "said," "above," "the," and "this" are intended to include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the embodiments of the present disclosure, "one or more" means one, two, or more than two.

[0062] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present disclosure. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0063] In the embodiments of the present disclosure, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present disclosure should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0064] In the present disclosure, when describing a positional relationship, if the positional relationship between two components is described as "on...", "above...", "under...", etc., one or more other components may be arranged between the two components, unless a more restrictive term, such as "immediately adjacent", is used.

[0065] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used solely to distinguish one element from another. For example, a first element may be labeled as a second element, and similarly, a second element may be labeled as a first element without departing from the scope of this disclosure.

[0066] As will be fully understood by those skilled in the art, the features of the various embodiments of the present disclosure may be combined or combined with each other in part or in whole, and may be associated in various ways. The embodiments of the present disclosure may be implemented independently of each other or in combination.

[0067] The present disclosure is further described below with reference to the accompanying drawings and specific embodiments.

[0068] According to some embodiments of the present disclosure, a middle frame assembly is provided, which is installed on an electronic device. The electronic device can be any device with communication and storage functions, such as a smartphone, a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a tablet computer, a personal digital assistant (PDA), a laptop computer, a digital camera, an e-book reader, a portable multimedia player, a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, a wearable device, a 5G terminal device, etc., and the present disclosure is not limited to this.

[0069] In order to better understand the present disclosure, first refer to Figures 1 and 2, and take mobile phone 100 as an example to illustrate the electronic device of the embodiment of the present disclosure. However, the present disclosure is not limited thereto, and the middle frame assembly of the present disclosure can be applied to any of the above-mentioned electronic devices.

[0070] FIG1 is a schematic diagram of a mobile phone 100 according to an embodiment of the present disclosure, and FIG2 is an exploded view of the mobile phone 100 according to an embodiment of the present disclosure.

[0071] In FIG. 1 and FIG. 2 , a mobile phone 100 may include a display screen 10 , a middle frame assembly 20 , and a back cover 30 , wherein the middle frame assembly 20 is located between the display screen 10 and the back cover 30 .

[0072] Display screen 10 constitutes the display surface of mobile phone 100 and is used to display images, text, videos, and other information, and to provide information interaction. Display screen 10 may be, but is not limited to, a light-emitting diode (LED) display, a liquid crystal display, or the like. Display screen 10 may be a flexible screen with bending properties, i.e., a foldable screen, or a rigid display screen.

[0073] The back cover 30 forms the rear housing of the phone 100. It protects the electronic components within the phone 100 from water and dust, while also ensuring the phone's neat appearance. The back cover 30 can be made of conductive materials such as metal, or non-conductive materials such as glass or plastic. When made of conductive materials such as metal, the back cover 30 can serve as a reference ground for the electronic components or radio frequency devices within the phone 100.

[0074] A receiving cavity for receiving electronic components such as a printed circuit board and a battery may be formed between the back cover 30 and the middle frame assembly 20 .

[0075] The printed circuit board (PCB) is a key component of the mobile phone 100. It houses various components that make up the circuit system of the mobile phone 100, such as circuits, processors, chips, capacitors, resistors, inductors, interfaces, and plug-ins. Optionally, the PCB may include an integrated circuit chip, a power management unit chip, or a radio frequency chip. Furthermore, the PCB also typically houses various processors, including, but not limited to, a central processing unit (CPU), various application processors, a graphics processor, or an image signal processor.

[0076] The battery is located in the battery compartment of the accommodating cavity. The battery is an energy storage tool that provides power to the mobile terminal. The battery can be a lithium battery, nickel-hydrogen battery or sodium-ion battery.

[0077] Furthermore, the structures illustrated in the embodiments of this application do not constitute a specific limitation on the mobile phone 100. The mobile phone 100 may include more or fewer components than those shown in Figures 1 and 2, or may combine or separate certain components, or arrange the components in a different manner. For example, the mobile phone 100 may also include cameras, including front and rear cameras, and a flash.

[0078] The mobile phone according to the embodiment of the present disclosure may be a foldable mobile phone or a straight-screen mobile phone, without particular limitation.

[0079] Next, the middle frame assembly 20 according to the embodiment of the present disclosure will be described in detail with reference to FIG. 2 to FIG. 15 .

[0080] Figure 3 is an exploded plan view of a middle frame assembly 20 according to an embodiment of the present disclosure. Figure 4 is a schematic diagram of the assembled middle frame assembly 20 according to an embodiment of the present disclosure. Referring to Figures 2-4 , the present disclosure provides a middle frame assembly 20 comprising an inner frame 1 and an outer frame 2 disposed around the periphery of the inner frame 1. Alternatively, the inner frame 1 may also be referred to as an inner panel.

[0081] The inner frame 1 includes a first metal material, and the outer frame 2 includes a second metal material. The inner frame 1 and the outer frame 2 use metal materials respectively, thereby ensuring the conductivity of the middle frame assembly 20, improving the mechanical strength of the middle frame assembly 3 and better dissipating heat.

[0082] Among them, the density of the first metal material of the inner frame 1 is lower than the density of the second metal material of the outer frame 2, that is, the first metal material of the inner frame 1 is a lightweight metal, such as a lightweight alloy, and the second metal material of the outer frame 2 is a metal with a relatively large density, such as an alloy, thereby reducing the weight of the middle frame assembly 20, and further reducing the weight of the electronic device, thereby improving portability.

[0083] In some embodiments, the volume occupied by the inner frame 1 is greater than the volume occupied by the outer frame 2. The inner frame 1 uses a first metal material with a density lower than the density of the second metal material of the outer frame 1, which can greatly reduce the weight of the middle frame assembly 20, and thus greatly reduce the weight of the electronic device, greatly improving the portability.

[0084] In some embodiments, the outer frame 2 may be shaped like a substantially rectangular frame. Accordingly, the inner frame 1 may be shaped like a substantially rectangular plate, but the shape is not limited thereto. The shapes of the inner frame 1 and the outer frame 2 may be arbitrarily set according to design requirements.

[0085] In some embodiments, the density of the first metal material of the inner frame 1 is less than or equal to 70% of the density of the second metal material of the outer frame 2, thereby effectively reducing the weight of the middle frame assembly. If the density of the first metal material of the inner frame 1 is greater than 70% of the density of the second metal material of the outer frame 2, the density difference between the first metal material of the inner frame 1 and the second metal material of the outer frame 2 is not large, and the weight of the middle frame assembly cannot be effectively reduced. Therefore, it is meaningless to provide the inner frame 1 and the outer frame 2 with two different metal layers.

[0086] In some embodiments, the first metal material of the inner frame 1 can include one or more selected from magnesium alloys, zinc alloys, and copper alloys. Magnesium alloys, zinc alloys, and copper alloys are commonly used lightweight metals, which can effectively reduce the weight of the middle frame assembly while ensuring sufficient mechanical strength and heat dissipation. They can also ensure good electrical conductivity, allowing them to be used as antennas, etc. In particular, the use of magnesium alloys further effectively reduces the weight of the middle frame assembly while ensuring sufficient strength of the inner frame. However, the material of the first metal material of the inner frame 1 is not limited to the above materials; any lightweight alloy with a lower density than the second metal material of the outer frame 2 can be used.

[0087] For example, the magnesium alloy may be AZ91D or AM60B.

[0088] AZ91D magnesium alloy contains 8.5%-9.5% Al, 0.17%-0.4% Mn, 0.025%-0.004% Fe, 0.05%-0.05% Si, 0.45%-0.90% Zn, 0.001%-0.001% Ni, and the balance Mg. Its density is approximately 1.82g / cm³.

[0089] AM60B magnesium alloy contains 5.6%-6.4% Al, 0.26%-0.50% Mn, 0.008% Cu, 0.004% Fe, 0.05% Si, 0.20% Zn, 0.001% Ni, and Mg as the remainder. Its density is approximately 1.8 g / cm³.

[0090] However, the above-mentioned AZ91D or AM60B is merely an example of magnesium alloy and is not limited thereto. As long as the magnesium alloy used as the first metal material of the inner frame 1 is a lightweight alloy, its composition is not particularly limited.

[0091] Alternatively, the zinc alloy and copper alloy can be composed of various compositions, as long as they are lightweight alloys with a lower density than the second metal material of the outer frame 2. Furthermore, to enhance the strength of the middle frame assembly 20 and impart a premium gloss and feel, in some embodiments, the second metal material of the outer frame 2 may comprise one or more selected from aluminum alloy, stainless steel, and titanium alloy. Aluminum alloy, stainless steel, and titanium alloy have higher density and strength, thereby ensuring the strength of the middle frame assembly 20. Furthermore, after surface treatment, aluminum alloy, stainless steel, and titanium alloy can exhibit a premium gloss and feel, thereby imparting a high-quality gloss and feel to the middle frame assembly 20, and ultimately, the mobile phone 100. Aluminum alloy, with its lower density and lower price compared to stainless steel and titanium alloy, can ensure a premium gloss and feel while reducing the weight and manufacturing costs of the middle frame assembly. Stainless steel, compared to aluminum alloy, can enhance the mechanical strength of the middle frame assembly and achieve a more premium gloss and feel. When titanium alloy is used, compared with stainless steel, the weight of the middle frame assembly can be reduced while the mechanical strength of the middle frame assembly can be improved.

[0092] As shown in Figures 3, 4, 5A, and 5B, the second metal material of the outer frame 2 can be provided on the outer surface 40 of the outer frame 2. Therefore, the second metal material is exposed on the outer surface 40 of the electronic device, which can give the middle frame assembly and the electronic device a high-end appearance with a high gloss and feel.

[0093] In some embodiments, one or both of the inner frame 1 and the outer frame 2 may be single-layer frames. Using single-layer frames for one or both of the inner and outer frames can reduce the weight of the middle frame assembly, make its structure more reliable, facilitate production, and make it easier to install the middle frame assembly in an electronic device.

[0094] Alternatively, in some embodiments, one or both of the inner frame 1 and the outer frame 2 may be laminated frames having a multi-layer structure. In this way, the inner or outer frame can adopt a separate multi-layer structure, which can be applied to a variety of electronic device structures, meet different design requirements, and increase the flexibility of installing the middle frame assembly into the electronic device.

[0095] In some embodiments, the inner frame 1 and outer frame 2 can be formed separately, rather than integrally forming the inner frame 1 and outer frame 2 through methods such as injection molding. If the inner frame 1 and outer frame 2 are integrally formed through methods such as injection molding, the shapes of the inner frame 1 and outer frame 2 are not completely regular, which may result in a gap between the inner frame 1 and outer frame 2, making it difficult to completely seal the inner frame 1 and outer frame 2, which may cause corrosion of the internal components of the mobile phone 100. By forming the inner frame 1 and outer frame separately, it is easier to seal the inner frame 1 and outer frame separately, thus avoiding the problem of incomplete sealing caused by integral molding.

[0096] Figures 5A and 5B are schematic diagrams of the adhesive layer of the middle frame assembly according to an embodiment of the present disclosure. Figure 5A shows the inner frame, outer frame, and adhesive layer in an exploded state, while Figure 5B shows the inner frame, outer frame, and adhesive layer in an assembled state. To ensure reliable bonding between the inner frame 1 and the outer frame 2, an adhesive layer 4 is provided between the inner frame 1 and the outer frame 2.

[0097] Figures 6A and 6B are cross-sectional views taken along line AA' of Figure 5B. Figure 6A shows the state without the adhesive layer, and Figure 6B shows the state with the adhesive layer. When the inner frame 1 and the outer frame 2 are joined together, a gap 13 may exist between the inner frame 1 and the outer frame 2. The adhesive layer 4 is applied to the junction of the inner frame 1 and the outer frame 2 to seal the inner frame 1 and the outer frame 2. Preferably, the adhesive layer 4 closes all gaps between the inner frame 1 and the outer frame 2, thereby tightly sealing the inner frame 1 and the outer frame 2.

[0098] For example, the adhesive layer may be applied by dispensing, but is not limited thereto. The adhesive layer may also be applied by other methods.

[0099] Furthermore, since the shapes of the inner frame 1 and the outer frame 2 may not be completely regular, there may be a height difference at the junction of the inner frame 1 and the outer frame 2, and the junction of the inner frame 1 and the outer frame 2 often has a stepped shape. However, this stepped shape may prevent the adhesive layer from being smoothly and completely applied.

[0100] Therefore, as shown in FIG6A , the portion 8 with a height difference between the inner frame 1 and the outer frame 2 can be configured as a slope, replacing the conventional step shape, so that the portion with a height difference between the inner frame 1 and the outer frame 2 can transition. Referring to FIG6B , an adhesive layer 4 is provided between the inner frame 1 and the outer frame 2. When the adhesive layer 4 is applied, for example, by dispensing, compared to a conventional step shape, the adhesive layer 4 can be smoothly and reliably filled into the sloped portion 8 by virtue of its own fluidity, ensuring that the adhesive layer 4 can be filled into the gap where the height difference between the inner frame 1 and the outer frame 2 occurs. In addition, the adhesive layer 4 also fills the gap 13 in other areas between the inner frame 1 and the outer frame 2.

[0101] Therefore, the adhesive layer 4 can completely seal the gap 13 , thereby sealing the middle frame assembly 20 and preventing corrosion of the internal components of the mobile phone 100 .

[0102] Preferably, as shown in FIG. 6A and FIG. 6B , the slope at the portion 8 may be a slope having a smooth curve shape, but is not limited thereto.

[0103] FIG7 is a schematic diagram illustrating the installation of the fastening member 5 of the middle frame assembly 20 according to an embodiment of the present disclosure. In some embodiments, as shown in FIG7 , in order to firmly fix the inner frame 1 and the outer frame 2 to ensure the bonding strength between the inner frame 1 and the outer frame 2, the inner frame 1 and the outer frame 2 may be further fastened by the fastening member 5.

[0104] For example, the fastening member 5 can be a locking screw, a screw, a rivet, etc., but is not limited thereto. In the following embodiments of FIG8 to FIG9D , a locking screw is used as an example for description.

[0105] In some embodiments, fastening members 5 are arranged at regular intervals along the edges of the middle frame assembly 20. This structure ensures sufficient bonding strength between the inner and outer frames. For example, fastening members 5 are arranged at the corners and center of the middle frame assembly 20. The number of fastening members 5 can be greater than or equal to six, but is not limited thereto.

[0106] The inner frame 1 and outer frame 2 can be joined together using the fastening member 5 in various ways. Figure 8 is a plan view of an example of a fastening member of the middle frame assembly according to an embodiment of the present disclosure. In Figure 8, the fastening member 5 includes eight locking screws 5-1 to 5-8. Locking screws 5-1, 5-3, 5-4, and 5-8 directly lock the inner frame 1 and outer frame 2, locking screw 5-2 locks the inner and outer frames 1 and 2 to the bracket structure, and locking screws 5-5, 5-6, and 5-7 lock the inner and outer frames 1 and 2 to the shaft structure.

[0107] 9A is a cross-sectional view taken along line BB' of FIG. 8 ; FIG. 9B is a cross-sectional view taken along line CC' of FIG. 8 ; and FIG. 9C is a cross-sectional view taken along line DD' of FIG. 8 .

[0108] As shown in FIG. 9A to FIG. 9C , at least one of the inner frame 1 and the outer frame 2 may be provided with a through hole 11 , and locking screws 5 - 1 , 5 - 2 , and 5 - 6 pass through the through hole 11 to fix the inner frame 1 and the outer frame 2 .

[0109] Specifically, in Figure 9A, the inner frame 1 is provided with a through hole 11, and the outer frame 2 is provided with a threaded hole 12. The locking screw 5-1 passes through the through hole 11 from the inner frame 1 and is fixed to the threaded hole 12, that is, fixed to the outer frame 2, and the nut of the locking screw 5-1 is pressed on the upper surface of the inner frame 1.

[0110] Similarly, the outer frame 2 may be provided with a through hole 11, and the inner frame 1 may be provided with a threaded hole 12. The locking screw 5-1 passes through the through hole 11 from the outer frame 2 and is fixed to the inner frame 1. The nut of the locking screw 5-1 is pressed on the upper surface of the outer frame 2 (not shown).

[0111] In FIG. 9A , the inner frame 1 and the outer frame 2 are fastened by locking screws 5 - 1 without using any other structural members, thereby using fewer components for firm fixation and simplifying the process.

[0112] In Figures 9B and 9C, the locking screws 5-2 and 5-6 can respectively fix the inner frame 1 and the outer frame 2 to the bracket structure 6-1 and the rotating shaft structure 6-2 combined with the middle frame assembly 20. In Figures 9B and 9C, in addition to the inner frame 1 and the outer frame 2, the bracket structure 6-1 and the rotating shaft structure 6-2 of the electronic device itself are also utilized, so that the inner frame 1, the outer frame 2, and the structures 6-1 and 6-2 can be more firmly fastened by the locking screws 5-2 and 5-6 respectively. The bracket structure 6-1 and the rotating shaft structure 6-2 are not part of the inner frame 1 or the outer frame 2, but are components of the electronic device itself. In addition, in the bracket structure 6-1 and the rotating shaft structure 6-2 of the electronic device itself, in order to facilitate connection, the bracket structure 6-1 and the rotating shaft structure 6-2 themselves often already have mounting holes, thereby avoiding the addition of unnecessary parts, simplifying the processing technology, and saving costs.

[0113] The structural member coupled to the middle frame assembly 20 can be a single layer of structural members, or can be a stack of multiple structural members. The structural members can include, but are not limited to, the bracket structural member 6-1 shown in FIG9B , the rotating shaft structural member 6-2 shown in FIG9C , and a PCB board, and can also be other structural members. Since the structural members fastened to the middle frame assembly can be structural members of various electronic devices, such as bracket structural members, rotating shaft structural members, and PCB boards, various fastening methods are available depending on the structural members and fastening locations, increasing the flexibility of fastening the middle frame assembly to the structural members, saving space, and making the structure compact.

[0114] In FIG. 9B , the support structure 6 - 1 and the inner frame 1 are provided with through holes 11 , the outer frame 2 is provided with threaded holes 12 , and the locking screws 5 - 2 pass through the through holes 11 and are fixed to the outer frame 2 .

[0115] Since the locking screw 5 - 2 can not only fix the support structure 6 - 1 on the middle frame assembly 20 , but also fix the inner frame 1 and the outer frame 2 , it is possible to avoid adding unnecessary parts, simplify the processing technology, and save costs.

[0116] The bracket structure 6 - 1 may be, for example, a fingerprint bracket for fixing a fingerprint module, a mainboard bracket for supporting a mainboard, etc., but is not limited thereto.

[0117] 8 and 9C , the embodiment of the present disclosure discloses an example of combining a midframe assembly 20 with a hinge structure 6-2, which is applied to a foldable screen mobile phone, where the hinge structure 6-2 is used to achieve folding of the foldable screen mobile phone. However, the embodiments of the present disclosure can also be applied to non-foldable screen mobile phones or other electronic devices.

[0118] In Figure 9C, the inner frame 1 and the outer frame 2 are provided with through-holes 11. The shaft structure 6-2 below the outer frame 2 has mounting holes (used as threaded holes) 12, through which locking screws 5-6 are secured to the structure 6-2. Since these locking screws 5-6 both secure the shaft structure 6-2 to the middle frame assembly 20 and secure the inner frame 1 to the outer frame 2, unnecessary parts can be avoided, the manufacturing process can be simplified, and costs can be saved. Similarly, the structure above the inner frame 1 has threaded holes, and the locking screws 5-6 can also be secured to the structure above the inner frame 1 (not shown) through the through-holes 11.

[0119] The connection method of the fastening member disclosed in the present invention is not limited to the embodiments of Figures 8, 9A-9C above, but can also be other connection methods. For example, Figure 9D is a schematic diagram of another connection method of the fastening member of the embodiment of the present invention; Figure 9E is a schematic diagram of yet another connection method of the fastening member of the embodiment of the present invention, but is not limited to this.

[0120] In Figures 9D to 9E, locking screws 5 can secure the inner frame 1 and outer frame 2 together to the structural member coupled to the middle frame assembly 20. In Figures 9D to 9E, in addition to the inner frame 1 and outer frame 2, the structural members of the electronic device itself are also utilized, so that the inner frame 1, outer frame 2, and structural members can be more securely fastened by locking screws 5. Structural member 6 is not part of the inner frame 1 or outer frame 2, but is a component of the electronic device itself. In addition, in the structural members of the electronic device itself, in order to facilitate connection, the structural members themselves often already have mounting holes, thereby avoiding the addition of unnecessary steps, simplifying the processing technology, and saving costs.

[0121] In the present disclosure, the inner frame 1 and the outer frame 2 may be fitted together in a concave-convex manner, as shown in FIG. 9D and FIG. 9E , but the present invention is not limited thereto.

[0122] In Figure 9D , similar to Figure 9B , structural member 6 is used as a shaft structural member as an example, but the present invention is not limited thereto. Through holes 11 are formed in the inner frame 1 and the outer frame 2, and threaded holes 12 are formed in the structural member 6. In Figure 9D , the inner frame 1 has a recess 111, and the outer frame 2 has a protrusion 112 that engages with the recess 111.

[0123] Specifically, the inner frame 1 has a through hole 11, and the structural member 6 has a threaded hole 12. The fastening member 5 passes through the through hole 11 and is fastened to the threaded hole 12. Thus, the inner frame 1 is fastened to the structural member 6 via the fastening member 5. The fastening force exerted by the fastening member 5 causes the protrusion 112 of the outer frame 2 to be sandwiched between the structural member 6 and the recess 121 of the inner frame 1. Although FIG9D illustrates an embodiment in which the protrusion 112 of the outer frame 2 is sandwiched between the structural member 6 and the recess 121 of the inner frame 1, this is not limiting. Alternatively, the inner frame 1 may have a protrusion, and the outer frame 2 may have a recess that engages with the protrusion of the inner frame 1, with the protrusion of the inner frame 1 being sandwiched between the structural member 6 and the recess of the outer frame 2. Alternatively, although not shown in the drawings, the recess of one of the inner frame 1 and the outer frame 2 may be sandwiched between the structural member 6 and the protrusion of the other of the inner frame 1 and the outer frame 2.

[0124] Due to the use of the concave-convex interlocking structure of the inner frame and the outer frame, it is easy to accurately align the inner frame and the outer frame when fastening them, and it can effectively avoid the inner frame or the outer frame from being misaligned when fastening the fastening member, and it can also fasten the inner frame and the outer frame together more firmly.

[0125] As shown in FIG. 9D , the size of the threaded hole 12 of the outer frame 2 is larger than the size of the through hole 11 of the inner frame 1 , thereby making it easy to fit the outer frame and the inner frame together. However, the embodiment is not limited thereto.

[0126] In Figure 9D , it can be seen that the inner frame 1 is closer to the locking screw 5 than the protrusion 112 of the outer frame 2. The sides of the inner and outer frames 1 and 2 closer to the locking screw 5 are referred to as the inner and outer sides of the inner and outer frames 1 and 2, respectively, while the sides of the inner and outer frames 1 and 2 farther from the locking screw 5 are referred to as the outer and inner sides of the inner and outer frames 1 and 2. In other words, the locking screw 5 does not contact the protrusion 112 of the outer frame 2.

[0127] In the example shown in FIG. 9D , the inner frame 1 is closer to the locking screw 5 than the protrusion 112 of the outer frame 2 , which is consistent with the outer frame 2 being arranged on the outer periphery of the inner frame 1 as shown in FIG. 3 of the present application.

[0128] Similarly, the inner frame 1 may be further away from the locking screw 5 than the outer frame 2 . In this case, the through hole 11 of the inner frame 1 is larger than the threaded hole 12 of the outer frame 2 (not shown).

[0129] In Figure 9E, similar to Figure 9A, the inner frame 1 is provided with a through hole 11, and the outer frame 2 is provided with a threaded hole 12. The locking screw 5 passes through the through hole 11 from the inner frame 1 and is fixed to the threaded hole 12, that is, fixed to the outer frame 2, and the nut of the locking screw 5 is pressed on the upper surface of the inner frame 1.

[0130] Unlike Figure 9A , Figure 9E shows two layers of structural components disposed on the upper sides of the inner frame 1 and outer frame 2. This example uses structural component 6 as a bracket structure and structural component 7 as a PCB board, but is not limited thereto. In Figure 9E , the first structural component 7 located on the upper side of the inner frame 1, the second structural component 6 located above the first structural component 7, and the inner frame 1 all have through-holes 11, and the outer frame 2 has threaded holes 12.

[0131] 9E , the outer frame 2 has a recess 121, and the inner frame 1 has a projection 122 that fits into the recess 121. The outer frame 2 extends into the through hole 12 of the inner frame 1.

[0132] Specifically, the outer frame 2 is provided with a threaded hole 12, the inner frame 1 and the structural members 6 and 7 are provided with a through hole 11, and the fastening member 5 is fastened to the threaded hole 12 through the through hole 11, so that the outer frame 2 is fastened to the structural members 6 and 7 through the fastening member 5. Through the fastening force applied by the fastening member 5, the protrusion 122 is clamped between the structural members 6 and 7 and the recess 121.

[0133] Due to the use of the concave-convex interlocking structure of the inner frame and the outer frame, it is easy to accurately align the inner frame and the outer frame when fastening them, and it can effectively avoid the inner frame or the outer frame from being misaligned when fastening the fastening member, and it can also fasten the inner frame and the outer frame together more firmly.

[0134] The locking screw 5 passes through the through hole 11 and is fixed to the threaded hole 12 , ie, fixed to the outer frame 2 . Thus, the through hole 11 of the inner frame 1 is larger than that of the outer frame 2 , but the embodiment is not limited thereto.

[0135] In Figure 9E , it can be seen that the outer frame 2 is closer to the locking screw 5 than the protrusion 122 of the inner frame 1. The sides of the inner and outer frames 1 and 2 closer to the locking screw 5 are referred to as the inner and outer sides of the inner and outer frames 1 and 2, respectively, while the sides of the inner and outer frames 1 and 2 farther from the locking screw 5 are referred to as the outer and inner sides of the inner and outer frames 1 and 2. In other words, the locking screw 5 does not contact the inner frame 1, but only contacts the outer frame 2.

[0136] In FIG9E , the outer frame 2 is closer to the locking screw 5 than the protrusion 122 of the inner frame 1. This is consistent with FIG3 of the present application showing the outer frame 2 being positioned on the periphery of the inner frame 1. That is, the outer frame 2 is entirely positioned on the periphery of the inner frame 1. However, in some areas, the inner frame 1 and the outer frame 2 may be interlocked in a concave and convex manner, so that part of the outer frame 2 may be located inside the inner frame 1.

[0137] Although FIG9E shows two layers of structural members, namely, the first structural member 7 and the second structural member 6 , the present disclosure is not limited thereto, and the structural member combined with the middle frame assembly 20 may also be a single layer of structural members or a three-layer or higher layer structural member (not shown).

[0138] Alternatively, the structural member combined with the middle frame assembly 20 may also be a structural member located at the lower side of the outer frame 1 (not shown), or the structural member combined with the middle frame assembly 20 may also be a structural member on the upper side of the inner frame 1 and the lower side of the outer frame 2 respectively.

[0139] Similarly, the outer frame 2 can be positioned further away from the locking screw 5 than the inner frame 1. In this case, the through hole 11 of the outer frame 2 is larger than the through hole 11 of the inner frame 1 (not shown). In this case, the locking screw 5 does not contact the inner frame 1 at the periphery of the through hole 11, but only contacts the outer frame 2.

[0140] As shown in FIG. 9A to FIG. 9E , the diameter of the through hole 11 may be larger than the diameter of the threaded hole 12 , so that the locking screw can pass through the through hole more easily.

[0141] In the same electronic device, it is not limited to using only one of the fastening members shown in Figures 9A to 9E above. Instead, any one or more of the fastening members shown in Figures 9A to 9E above may be combined depending on the specific circumstances of the electronic device. For example, when one or more locations of an electronic device where fastening member 5 is required do not have structural components, fastening member 5 can be used to securely fasten inner frame 1 and outer frame 2. When one or more locations of an electronic device where fastening member 5 is required do have structural components, fastening member 5 can be used to securely fasten inner frame 1, outer frame 2, and the structural components.

[0142] In some embodiments, one or both of the inner frame 1 and the outer frame 2 may further include a plastic layer to achieve an antenna clearance effect.

[0143] For example, the inner frame 1 may further include a first plastic layer (not shown), and the first metal material and the first plastic layer may be combined by in-mold injection molding. The outer frame 2 may further include a second plastic layer (not shown), and the second metal material and the second plastic layer may be combined by nano-injection molding.

[0144] Because the inner frame's first metal material and first plastic layer are bonded together using in-mold injection molding, the first plastic layer and first metal material are reliably bonded, ensuring bond stability and durability. Furthermore, the outer frame's second metal material and second plastic layer are bonded together using nano-injection molding. This nano-level bonding between the metal and plastic significantly enhances bond strength and mechanical properties. Furthermore, since the molding process can be completed in a single injection molding step, it eliminates the need for two or more machining steps, simplifying the process, shortening the production cycle, and improving productivity. Furthermore, the use of nano-injection molding allows for both the metallic appearance and texture, improving aesthetics while also making the structural components more rigid.

[0145] One or both of the first plastic layer and the second plastic layer are made of a plastic material, such as polycarbonate (PC), acrylonitrile butadiene styrene (ABS), glass fiber reinforced polycarbonate (PC+GF), ABS reinforced polycarbonate (ABS+PC), or a carbon fiber reinforced resin composite material.

[0146] The first and second plastic layers can form a closed annular structure or a semi-closed annular structure. For example, the first and second plastic layers can form a semi-frame structure, located within the clearance area of ​​the antenna radiator. The first plastic layer can be located on one or both of the inner and outer sides of the inner frame 1, and the second plastic layer can be located on one or both of the inner and outer sides of the outer frame 2, without limitation.

[0147] Furthermore, in mobile phone 100, unstable metal-to-metal contact can interfere with antenna performance. Metal contact between the inner frame 1 and the outer frame 2 is an example of such unstable contact. Therefore, the outer frame 2 and the inner frame 1 can be electrically connected to each other via a conductive member to ensure a stable electrical connection between the inner frame 1 and the outer frame 2, thereby achieving a stable electrical connection. Examples of conductive members include, but are not limited to, the springs shown in Figures 10-11, the gaskets shown in Figures 12-13, and the connecting pieces shown in Figures 14-15. As long as a stable electrical connection between the inner frame 1 and the outer frame 2 is ensured, any suitable method will suffice.

[0148] The material of the conductive member is, for example, a metal such as copper (Cu), but is not limited thereto, and any material may be used as long as it can conduct electricity.

[0149] FIG10 is a schematic diagram of the spring piece 21 according to an embodiment of the present disclosure, and FIG11 is a schematic diagram of the spring piece 21 according to an embodiment of the present disclosure when installed between the inner frame and the outer frame.

[0150] As shown in Figure 10 , the conductive member is a spring clip 21, which is made of a conductive elastic material. The spring clip 21 includes a spring clip base 212 and a spring clip probe 211 extending from the spring clip base 212. As shown in Figure 11 , the spring clip 21 is fixed between the inner frame 1 and the outer frame 2, with the spring clip base 212 contacting the inner frame 1 and the spring clip probe 211 contacting the outer frame 2. Alternatively, although not shown in the figures, the spring clip base 212 may contact the outer frame 2, in which case the spring clip probe 211 contacts the inner frame 1.

[0151] Preferably, as shown in FIG11 , the spring base 212 of the spring clip 21 can be welded to the inner frame 1, and the spring probe 211 of the spring clip 21 abuts against the outer frame 2. Due to the elasticity of the spring clip 21, a stable electrical connection is ensured between the inner frame 1 and the outer frame 2. Alternatively, although not shown in the drawings, the spring base 212 of the spring clip 21 can also be welded to the outer frame 2, and the spring probe 211 of the spring clip 21 abuts against the inner frame 1, thereby also ensuring a stable electrical connection between the inner frame 1 and the outer frame 2.

[0152] As described above with reference to Figures 5A and 5B , the adhesive layer 4 closes the gap between the inner frame 1 and the outer frame 2. In this embodiment, the adhesive layer 4 is disposed between the inner frame 1 and the outer frame 2 at locations other than the spring clip 21. This ensures both electrical connection and a tight seal between the two frames. Specifically, the adhesive layer 4 is not applied to the locations where the spring clip 21 is disposed. Similar to the spring clip 21 in Figures 10-11 , when the gasket 22 and the connecting piece 23 described below are disposed between the inner frame 1 and the outer frame 2, the adhesive layer 4 is also not applied to the locations where they are disposed.

[0153] FIG. 12 is a schematic diagram of a gasket 22 according to an embodiment of the present disclosure, and FIG. 13 is a schematic diagram of an embodiment of the present disclosure when the gasket is installed between an inner frame and an outer frame.

[0154] As shown in FIG. 12 and FIG. 13 , the conductive member is a gasket 22 , which is disposed between the inner frame 1 and the outer frame 2 .

[0155] As shown in FIG12 , the gasket 22 includes a gasket body 221 and a gasket elastic arm 222 extending from the gasket body 221, wherein the gasket body 221 and the gasket extension arm 222 form a non-closed ring shape, and the hollow portion in the ring shape forms a hollow portion 223. A gasket protrusion 224 is provided on at least one of the upper surface and the lower surface of the gasket body 221 and the gasket elastic arm 222. The gasket protrusion 224 can be provided in at least two forms, that is, one gasket protrusion 224 is provided on the gasket elastic arm 222, and one or more gasket protrusions 224 can be provided on the gasket body 221. For example, as shown in FIG12 , four gasket protrusions 224 can be provided, respectively located at the three corners of the gasket body 221 and the top of the gasket elastic arm 222, but the invention is not limited thereto.

[0156] The gasket protrusions 224 can be provided on both the upper and lower surfaces of the gasket body 221 and the gasket elastic arms 222, and respectively abut the inner frame 1 and the outer frame 2 to ensure a stable electrical connection between the inner frame 1 and the outer frame 2. Typically, the gasket protrusions 224 are formed by a process such as stamping. Therefore, when the gasket protrusions 224 can be provided on both the upper and lower surfaces of the gasket body 221 and the gasket elastic arms 222, the gasket protrusions 224 on the upper surface and the gasket protrusions 224 on the lower surface are provided at different positions.

[0157] Alternatively, the gasket protrusion 224 may be provided on only one of the upper surface and the lower surface of the gasket body 221 and the gasket elastic arm 222. For example, the gasket protrusion 224 may be provided on the upper surface of the gasket body 221 and the gasket elastic arm 222 to contact one of the inner frame 1 and the outer frame 2. In this case, the lower surface of the gasket body 221 is welded to the other of the inner frame 1 and the outer frame 2, while the lower surface of the elastic arm 222 is not welded to the other of the inner frame 1 and the outer frame 2, so as to ensure elastic contact between the inner frame 1 and the outer frame 2, thereby avoiding the problem of unstable electrical connection caused by direct hard contact between the inner frame 1 and the outer frame 2, and ensuring stable electrical connection between the inner frame 1 and the outer frame 2. Alternatively, referring to Figure 13, the gasket protrusion 224 can also be set on the lower surface of the gasket body 221 and the gasket elastic arm 222 to contact one of the inner frame 1 and the outer frame 2 (Figure 3 shows the outer frame 2, but is not limited to this). At this time, the upper surface of the gasket body 221 is welded to the inner frame 1, while the upper surface of the elastic arm 222 is not welded to the inner frame 1.

[0158] Figure 13 shows an example of a gasket assembly installed between the inner and outer frames 1 and 2, where the gasket protrusion 224 is provided only on the lower surfaces of the gasket body 221 and the gasket elastic arms 222. As shown in Figure 13, the gasket 22 is clamped between the inner and outer frames 1 and 2 by a fastening member 5. Specifically, the gasket 22 is positioned between the inner and outer frames 1 and 2, and the fastening member 5 is passed through the hollow region 223 of the gasket 22. The gasket body 221 and the gasket elastic arms 222 then surround the fastening member 5, bringing the gasket protrusion 224 into contact with the inner frame 1. Therefore, when the inner and outer frames 1 and 2 are fastened together by the fastening member 5, the gasket 22 can be securely abutted against the gasket 22, thereby ensuring a stable electrical connection between the two frames. As shown in Figure 13, the gasket protrusion 224 can be formed, for example, by a process such as stamping, with the gasket protrusion 224 provided on the lower surface of the gasket 22, leaving the upper surface of the gasket 22 recessed.

[0159] FIG. 14 is a schematic diagram of a connection piece 23 according to an embodiment of the present disclosure, and FIG. 15 is a schematic diagram of an embodiment of the present disclosure when the connection piece is installed between an inner frame and an outer frame.

[0160] As shown in Figures 14 and 15 , the conductive member is a connecting piece 23. The connecting piece 23 includes a first arm 231, a second arm 232 that is spaced apart from the first arm 231, and a connecting portion 233 that connects the first and second arms 231 and 232. The first and second arms 231 and 232 extend from the connecting portion 232. The connecting portion 232 can have a curved shape as shown in Figure 14 , but is not limited thereto. The connecting portion 232 can also have any other shape as long as it can connect the first and second arms 231 and 232.

[0161] The first arm 231 may be connected to the inner frame 1, and the second arm 232 may be connected to the outer frame 2. Preferably, the first arm 231 may be welded to the inner frame 1, and the second arm 232 may be welded to the outer frame 2, but is not limited thereto.

[0162] For example, the inner frame 1 and the outer frame 2 can be fitted in a concave-convex manner. In particular, in the area connected to the connecting piece 23, the inner frame 1 has a concave portion or a convex portion, and the outer frame 2 has a convex portion or a concave portion fitted with the concave portion or the convex portion.

[0163] For example, as shown in FIG15 , the inner frame 1 has a recessed portion 331. The outer frame 2 has a protruding portion 332 that fits into the recessed portion 331. The connecting piece 23 is provided on the same side of the inner frame 1 and the outer frame 2. The first arm 231 can be welded to the outer frame 2, and the second arm 232 can be welded to the inner frame 1. However, the present disclosure is not limited thereto.

[0164] Due to the concave-convex interlocking structure of the inner frame 1 and the outer frame 2 , accurate alignment is possible and misalignment of the inner frame 1 and the outer frame 2 can be effectively avoided when the connecting piece 23 is installed.

[0165] Alternatively, the connecting piece 23 can be set arbitrarily. For example, the connecting piece 23 can be set between the inner frame 1 and the outer frame 2, and the first arm 231 can be welded to the outer frame 2 and the second arm 232 can be welded to the inner frame 1, as long as a stable electrical connection between the inner frame 1 and the outer frame 2 is ensured.

[0166] In some embodiments, an electronic device is disclosed, comprising the above-mentioned middle frame assembly. The electronic device may be any electronic device, such as an electronic device having a display function, a communication function, and / or a storage function, and the electronic device may be, for example, a smartphone, a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a tablet computer, a personal digital assistant (PDA), a laptop computer, a digital camera, an e-book reader, a portable multimedia player, a handheld device with a wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, a wearable device, a 5G terminal device, etc., and the present disclosure is not limited thereto. According to the embodiments of the present disclosure, the weight of the middle frame assembly can be reduced, thereby reducing the weight of the electronic device and improving portability.

[0167] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the scope of protection of the present disclosure.

Claims

1. A middle frame assembly, comprising an inner frame and an outer frame arranged around the inner frame, wherein: The inner frame includes a first metal material, and the outer frame includes a second metal material. The density of the first metal material is lower than that of the second metal material.

2. The middle frame assembly according to claim 1, wherein: The density of the first metal material is lower than or equal to 70% of the density of the second metal material.

3. The middle frame assembly according to claim 1, wherein: The first metal material of the inner frame includes one or more selected from magnesium alloy, zinc alloy and copper alloy.

4. The middle frame assembly according to claim 1, wherein: The second metal material of the outer frame includes one or more selected from aluminum alloy, stainless steel and titanium alloy.

5. The middle frame assembly according to claim 4, wherein: The second metal material is disposed on the outer surface of the outer frame.

6. The middle frame assembly according to claim 1, wherein: One or both of the inner frame and the outer frame is a single-layer frame.

7. The middle frame assembly according to claim 1, wherein: One or both of the inner frame and the outer frame is a laminated frame having a multi-layer structure.

8. The middle frame assembly according to claim 1, wherein: An adhesive layer is provided between the inner frame and the outer frame.

9. The middle frame assembly according to claim 8, wherein: A portion having a height difference between the inner frame and the outer frame is arranged in a slope shape, and the adhesive layer is arranged on the sloped portion.

10. The middle frame assembly according to claim 8, wherein: The inner frame and the outer frame are fastened by a fastening member.

11. The middle frame assembly according to claim 10, wherein: The fastening member is a locking screw, and at least one of the inner frame and the outer frame is provided with a through hole, and the fastening member passes through the through hole to fix the inner frame and the outer frame.

12. The middle frame assembly according to claim 11, wherein: One of the inner frame and the outer frame is provided with the through hole, and the other of the inner frame and the outer frame is provided with a threaded hole, and the fastening member passes through the through hole and is fastened into the threaded hole.

13. The middle frame assembly according to claim 1, wherein: A conductive member electrically connecting the outer frame and the inner frame is provided between the outer frame and the inner frame.

14. The middle frame assembly according to claim 13, wherein: The conductive member is a spring, which includes a spring base and a spring probe extending from the spring base. The spring base contacts one of the inner frame and the outer frame, and the spring probe contacts the other of the inner frame and the outer frame.

15. The middle frame assembly according to claim 14, wherein: The spring base is welded to one of the inner frame and the outer frame, and the spring probe abuts against the other of the inner frame and the outer frame.

16. The middle frame assembly according to claim 13, wherein: The conductive member is a gasket, which includes a gasket body and a gasket elastic arm extending from the gasket body, a gasket convex bump is provided on at least one of the upper surface and the lower surface of the gasket body, and the gasket convex bump is provided on at least one of the upper surface and the lower surface of the gasket elastic arm, and The gasket is clamped between the inner frame and the outer frame by a fastening member. The gasket body and the gasket elastic arm surround the fastening member. The gasket convex bump abuts against at least one of the inner frame and the outer frame.

17. The middle frame assembly according to claim 16, wherein: The gasket convex bumps are provided on the upper surface and the lower surface of the gasket body and the gasket elastic arm, and respectively abut the inner frame and the outer frame, and the gasket convex bumps are provided at different positions on the upper surface of the gasket body and the gasket elastic arm and on the lower surface of the gasket body and the gasket elastic arm; or The gasket convex bump is only provided on the upper surface of the gasket body and the gasket elastic arm, and the lower surface of the gasket body where the gasket convex bump is not provided is welded to the inner frame or the outer frame; or The gasket bulge is only provided on the lower surface of the gasket body and the gasket elastic arm, and the upper surface of the gasket body where the gasket bulge is not provided is welded to the inner frame or the outer frame.

18. The middle frame assembly according to claim 13, wherein: The conductive member is a connecting piece, which includes a first arm, a second arm opposite to the first arm with a gap therebetween, and a connecting portion connecting the first arm and the second arm, the first arm and the second arm extend from the connecting portion respectively, the first arm is connected to the inner frame, and the second arm is connected to the outer frame.

19. The middle frame assembly according to claim 18, wherein: The inner frame has a recessed portion or a protruding portion in a region connected to the connecting piece, and the outer frame has a protruding portion or a recessed portion engaged with the recessed portion or the protruding portion.

20. An electronic device comprising: The middle frame assembly according to any one of claims 1 to 19.

21. An electronic device comprising: The middle frame assembly according to any one of claims 1 to 19; Structural parts of the electronic equipment; as well as The inner frame and the outer frame are combined with the structural member by the fastening member.

22. The electronic device according to claim 21, wherein A through hole is formed in one of the inner frame and the outer frame and the structural member, and a threaded hole is formed in the other of the inner frame and the outer frame. The fastening member passes through the through hole and is fastened into the threaded hole.

23. The electronic device according to claim 21, wherein The structural member is provided with a threaded hole, the inner frame and the outer frame are both provided with a through hole, and the fastening member passes through the through hole and is fastened into the threaded hole.

24. The electronic device according to claim 21, wherein One of the inner frame and the outer frame has a recessed portion, and the other has a protruding portion that fits into the recessed portion. At least one of the inner frame and the outer frame is fastened to the structural member by the fastening member, and one of the concave portion and the convex portion is sandwiched between the structural member and the other of the concave portion and the convex portion.

25. The electronic device according to claim 21, wherein The structural member includes a plurality of stacked structural members, and the inner frame and the outer frame are fastened to the plurality of structural members by the fastening member.

26. The electronic device according to claim 21, wherein The structural member is a bracket structural member, a rotating shaft structural member or a PCB board.

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