A diaphragm direct welding device and method for a moving coil planar combined earphone

Abstract

The present invention relates to a diaphragm direct welding device and method for a moving coil planar combined earphone. The device includes key components such as a solder application mechanism, an image positioning mechanism, a laser source and a galvanometer mechanism, a spraying mechanism, a displacement mechanism, and a controller. During the welding process, the device accurately identifies the position of the metal ring through the image positioning mechanism, and uses the laser source and the galvanometer mechanism to simultaneously perform laser welding of the welding holes on the metal ring and laser cutting of the diaphragm substrate outside the metal ring in a single scan, so that the size of the cut metal ring is equal to the size of the diaphragm substrate, avoiding the complex steps and errors of separately positioning the diaphragm in the prior art. The high-precision processing ability of the device ensures the accuracy and consistency of diaphragm production, improving production efficiency and product quality.

Description

Technical Field

[0001] The present invention relates to the technical field of welding equipment, and particularly relates to a diaphragm direct welding device and method for a moving coil planar combined earphone. Background Art

[0002] The moving coil planar combined earphone combines the advantages of moving coil earphones and planar earphones, providing a brand-new audio experience. Moving coil earphones dominate the market with their mature technology and wide applicability, while planar earphones, with their planar diaphragm design, can provide less distortion and a smoother frequency response. However, there are some problems in the traditional diaphragm preparation and assembly processes. Especially in the moving coil planar combined earphone, the positioning and assembly of the diaphragm are particularly crucial, which has a great influence on the sound field matching of the moving coil and planar speakers.

[0003] In the existing technology, the diaphragm is usually prepared first and then assembled with other components such as metal rings by welding or pasting. This method has some obvious defects. First, the alignment of the diaphragm becomes a difficult problem because the size and shape of the diaphragm need to be precisely matched with components such as metal rings, and the traditional assembly process is difficult to guarantee this accuracy. Second, the diaphragm is usually thin and is prone to moving during the bonding or welding process, resulting in inaccurate positioning and even possible damage to the diaphragm. These problems not only affect the sound quality performance of the earphone but also limit the improvement of production efficiency and product quality.

[0004] To solve these problems, the present invention proposes a diaphragm direct welding device for a moving coil planar combined earphone. This device directly performs welding operations on the diaphragm, avoiding multiple assembly and positioning steps in the traditional process, and greatly improving the connection accuracy and stability between the diaphragm and the metal ring. Summary of the Invention

[0005] To solve the above problems, the present invention provides a diaphragm direct welding device for a moving coil planar combined earphone, which is used for directly welding the planar earphone diaphragm of the moving coil planar combined earphone. The earphone diaphragm includes a diaphragm substrate and a metal ring, and welding holes for welding are provided on the metal ring. The device includes:

[0006] A solder application mechanism for applying solder to the welding holes on the metal ring;

[0007] An image positioning mechanism for positioning the position of the metal ring;

[0008] A laser source and a galvanometer mechanism. The laser emitted by the laser source is adjusted by the galvanometer mechanism to achieve laser welding of the welding holes on the metal ring and laser cutting of the position outside the metal ring;

[0009] The spraying mechanism includes a metal wire nozzle, which is used to spray metal wire on the diaphragm after welding to complete the processing of the metal layer on the diaphragm;

[0010] The displacement mechanism is used to drive the metal ring to move in the horizontal direction;

[0011] The controller is used to control the coordinated work of each mechanism;

[0012] Before welding, the size of the diaphragm substrate is larger than that of the metal ring. During welding, the controller controls the laser source and the galvanometer mechanism to perform laser scanning on the position outside the metal ring and the metal ring. Welding and laser cutting are carried out simultaneously during one circle of scanning; the size of the cut metal ring is equal to the size of the diaphragm substrate.

[0013] The displacement mechanism includes an XY-axis moving platform and a metal ring fixture. The metal ring fixture is used to fix the metal ring and maintain the stability of the metal ring during welding;

[0014] The image positioning mechanism includes a camera and marking points. The camera is arranged above the XY-axis moving platform, and the marking points are arranged on the outer ring of the metal ring fixture;

[0015] The marking points can be captured by the camera and are used to provide position marks during positioning calculation;

[0016] A backlight illuminating lamp is also arranged on the XY-axis moving platform, which is arranged at the center of the metal ring fixture and is used to provide light that can pass through the diaphragm substrate during the positioning of the upper metal ring to achieve the positioning of the upper metal ring.

[0017] The laser source is an infrared laser source. The laser is a continuous laser, emitting laser with a wavelength of 1064 nm or 10.6 μm. The maximum power of the laser is 10 kW to 50 kW, and the laser spot area is 30 - 500 mm 2 .

[0018] The solder application mechanism includes an application head and a scraper. The application head is used to evenly apply solder to the welding holes on the metal ring, and the scraper is used for scraping to ensure the uniformity of the solder layer.

[0019] The positioning of the image positioning mechanism is specifically as follows:

[0020] Use the camera to capture the marking points on the metal ring fixture and the welding holes on the metal ring, obtain their coordinate positions in the image, and determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system;

[0021] The specific calculation method is as follows:

[0022] Let the coordinates of the marking point in the image coordinate system be (x m ,ym ), the coordinates of the welding hole in the image coordinate system are (x h , y h ). Then the accurate position coordinates (X h , Y h ) are calculated by the following formula:

[0023] ,

[0024] ;

[0025] Among them, (X m , Y m ) are the known coordinates of the marked points in the actual space, and S is the scale factor between the image coordinate system and the actual space coordinate system.

[0026] The welding holes of the metal ring require a relatively high power density to achieve the melting of the solder and the welding of the metal ring, while the paper material of the diaphragm substrate requires a relatively low power density to achieve ablation; therefore, after the laser source emits the laser, the power density is shaped so that the center of the laser energy distribution is shifted;

[0027] After the laser spot is reflected by the galvanometer, during laser welding, the energy of the inner circle is greater than that of the outer circle, that is, during laser welding, the laser energy density irradiated on the metal ring is greater than the laser energy density irradiated on the diaphragm substrate outside the metal ring;

[0028] The laser power density irradiated on the metal ring is in the range of 10 4 to 10 6 W / cm². At the same time, the solder has good thermal absorption rate and thermal conductivity, can quickly absorb heat and melt the solder under laser irradiation, and the solder has better absorption rate and thermal conductivity than the diaphragm substrate. By using the difference in thermal absorption characteristics of these two materials, good fusion welding can be formed by adjusting the laser parameters.

[0029] The spraying mechanism includes a metal wire spray head, and the metal wire spray head is used to spray metal wire on the welded diaphragm, specifically:

[0030] According to the size of the diaphragm and the spraying requirements of the metal wire, the working parameters of the spraying mechanism are set, and the working parameters include spraying speed, spraying distance, spraying angle and spraying flow;

[0031] Driven by the controller, the metal wire spray head moves along a preset reciprocating serpentine route, and evenly sprays the metal wire on the surface of the welded diaphragm; the spacing and width of the serpentine route are set according to the size of the diaphragm and the spraying requirements of the metal wire to ensure that the entire surface of the diaphragm is evenly covered; during the spraying process, the moving speed and spraying flow of the metal wire spray head remain stable to ensure the uniform distribution and adhesion quality of the metal wire.

[0032] A method for diaphragm welding using a diaphragm direct welding device for a moving coil planar combination earphone, comprising:

[0033] Preparation stage: Place the lower metal ring on the metal ring fixture of the welding device, and align the welding holes on the lower metal ring approximately with the positioning points on the fixture;

[0034] First positioning: Use the camera of the image positioning mechanism to photograph the marking points on the metal ring fixture and the welding holes on the lower metal ring, and obtain their coordinate positions in the image; By calculating the relative position relationship between the marking points and the welding holes in the image coordinate system, determine the accurate position coordinates of the welding holes;

[0035] First solder application: Start the solder application mechanism, and the applicator evenly applies solder to the welding holes on the lower metal ring, and then the squeegee levels it to ensure the uniformity of the solder layer;

[0036] Second positioning: Place the diaphragm substrate on the metal ring, ensure that the size of the diaphragm substrate is larger than that of the metal ring, and place the upper metal ring on the diaphragm substrate; Determine whether the upper metal ring and the lower metal ring are aligned and make position adjustments;

[0037] Second solder application: Start the solder application mechanism, and the applicator evenly applies solder to the welding holes on the upper metal ring, and then the squeegee levels it to ensure the uniformity of the solder layer;

[0038] Laser welding and cutting: The controller adjusts the laser source and the galvanometer mechanism according to the positioning results, and simultaneously performs welding and laser cutting in one scan to make the size of the metal ring equal to the size of the diaphragm substrate;

[0039] Metal wire spraying: After welding is completed, start the spraying mechanism, and the metal wire nozzle moves along a preset reciprocating serpentine route under the drive of the controller, and evenly sprays the metal wire on the surface of the welded diaphragm.

[0040] Before welding, offset the energy distribution center of the laser spot to ensure that when laser welding is performed, the laser energy density irradiated on the metal ring is greater than the laser energy density irradiated on the diaphragm substrate outside the metal ring; The laser source emits continuous laser with a wavelength of 1064 nm or 10.6 μm, the power is between 10 kW and 50 kW, and the spot area is 30 - 500 mm².

[0041] Determine whether the upper metal ring and the lower metal ring are aligned and make position adjustments, specifically:

[0042] Turn on the backlight illumination lamp on the metal ring fixture, and use the camera of the image positioning mechanism to capture the marking points on the upper metal ring fixture and the welding holes on the metal ring, and obtain their coordinate positions in the image; by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system, determine the accurate position coordinates of the welding holes;

[0043] Judge whether the upper metal ring and the lower metal ring are aligned according to the image after the backlight illumination lamp illuminates, and at the same time compare whether the coordinates of the upper metal ring and the lower metal ring coincide according to the coordinate calculation result. If they are not aligned or do not coincide, adjust the position of the upper metal ring until they are aligned and the welding holes coincide.

[0044] The beneficial effects of the present invention are:

[0045] The traditional production process requires cutting first and then welding. These two steps often require different equipment and multiple positionings, increasing production time and costs. The present invention performs welding and laser cutting simultaneously in one scan, combines welding and cutting into one step, avoids the diaphragm positioning process, reduces the time for equipment switching and repeated positioning, and thus significantly improves production quality and production efficiency.

[0046] In the traditional production process, the positioning of the diaphragm needs to be very precise, otherwise it will affect the sound quality and performance of the earphone. The size of the metal ring after cutting in the present invention is equal to the size of the diaphragm substrate, avoiding the requirement of separately positioning the diaphragm in the prior art. Ensuring that the sizes of the metal ring and the diaphragm substrate are consistent, thus avoiding the complex steps of separately positioning the diaphragm and possible positioning errors, simplifying the production process and reducing the production difficulty.

[0047] The laser source and galvanometer mechanism in the equipment can accurately control the power, spot size and scanning path of the laser, ensuring the accuracy of welding and cutting. At the same time, the image positioning mechanism can accurately locate the position of the metal ring, providing accurate coordinate information for welding and cutting. This high-precision manufacturing method can meet the strict requirements of the moving coil planar combination earphone for the size, shape and connection quality of the diaphragm and the metal ring, improving the quality and performance of the product. Description of the Drawings

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

[0049] Attached Figure 1 is the device framework diagram of the present invention;

[0050] Appendix Figure 2 is a schematic structural diagram of the earphone of the present invention;

[0051] Appendix Figure 3 is a schematic structural diagram of the diaphragm of the present invention;

[0052] Appendix Figure 4 is a schematic diagram of the processing process of the diaphragm of the present invention;

[0053] Appendix Figure 5 is a schematic working diagram of the backlight illuminating lamp of the present invention;

[0054] Appendix Figure 6 is an energy distribution diagram of the laser spot of the present invention, where the left side is the low-energy area and the right side is the high-energy area.

[0055] Among them,

[0056] housing 1, moving coil loudspeaker 2, interface 3, flat panel loudspeaker 4, flat panel loudspeaker gasket 5, earplug 6, head beam assembly 7, diaphragm substrate 41, upper metal ring 42, metal wire 43, lower metal ring 44, welding hole 421, metal wire nozzle 8, camera 9, backlight illuminating lamp 91, laser source 10. Specific Embodiment

[0057] Embodiment 1:

[0058] Referring to Figures 1 to 6 , the present invention provides a direct welding device for the diaphragm of a moving coil and flat panel combined earphone, which is used for directly welding the flat panel earphone diaphragm of a moving coil and flat panel combined earphone. The earphone diaphragm includes a diaphragm substrate and a metal ring, and welding holes for welding are provided on the metal ring. The device includes:

[0059] A solder coating mechanism for coating solder on the welding holes of the metal ring;

[0060] An image positioning mechanism for positioning the position of the metal ring;

[0061] A laser source and a galvanometer mechanism. The laser emitted by the laser source is adjusted by the galvanometer mechanism to achieve laser welding of the welding holes on the metal ring and laser cutting of the position outside the metal ring;

[0062] A spraying mechanism, including a metal wire nozzle, for spraying metal wires on the diaphragm after welding to complete the processing of the metal layer on the diaphragm;

[0063] A displacement mechanism for driving the metal ring to move in the horizontal direction;

[0064] A controller for controlling the coordinated work of each mechanism;

[0065] Before welding, the size of the diaphragm substrate is larger than that of the metal ring. During welding, the controller controls the laser source and the galvanometer mechanism to perform laser scanning on the metal ring and the position outside the metal ring, and welding and laser cutting are carried out simultaneously during one circle of scanning; the size of the cut metal ring is equal to the size of the diaphragm substrate.

[0066] The displacement mechanism includes an XY-axis moving platform and a metal ring fixture. The metal ring fixture is used to fix the metal ring and maintain the stability of the metal ring during welding;

[0067] The image positioning mechanism includes a camera and marking points. The camera is arranged above the XY-axis moving platform, and the marking points are arranged on the outer ring of the metal ring fixture;

[0068] The marking points can be captured by the camera and are used to provide position marks during positioning calculation;

[0069] A backlight illuminating lamp is also arranged on the XY-axis moving platform, which is arranged at the center of the metal ring fixture and is used to provide light that can pass through the diaphragm substrate during the positioning of the upper metal ring to achieve the positioning of the upper metal ring.

[0070] The laser source is an infrared laser source, the laser is a continuous laser, and emits laser with a wavelength of 1064 nm or 10.6 μm. The maximum power of the laser is 10 kW to 50 kW, and the laser spot area is 30 - 500 mm 2 。

[0071] The solder application mechanism includes an application head and a squeegee. The application head is used to evenly apply solder to the welding holes on the metal ring, and the squeegee is used for leveling to ensure the uniformity of the solder layer.

[0072] The positioning of the image positioning mechanism is specifically as follows:

[0073] Use the camera to capture the marking points on the metal ring fixture and the welding holes on the metal ring, obtain their coordinate positions in the image, and determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system;

[0074] The specific calculation method is as follows:

[0075] Let the coordinates of the marking point in the image coordinate system be (x m , y m ), and the coordinates of the welding hole in the image coordinate system be (x h , y h ), then the accurate position coordinates (X h , Y h ) of the welding hole are calculated by the following formula:

[0076] ,

[0077] ;

[0078] Among them, (X m , Y m ) is the known coordinate of the marking point in the actual space, and S is the scale factor between the image coordinate system and the actual space coordinate system.

[0079] The welding holes of the metal ring require a relatively high power density to achieve the melting of the solder and the welding of the metal ring, while the paper material of the diaphragm substrate requires a relatively low power density to achieve ablation; therefore, after the laser source emits the laser, the power density is shaped so that the energy distribution center of the laser is shifted;

[0080] After the laser spot is reflected by the galvanometer, when laser welding is performed, the energy of the inner ring is greater than that of the outer ring, that is, when laser welding is performed, the laser energy density irradiated on the metal ring is greater than the laser energy density irradiated on the diaphragm substrate outside the metal ring;

[0081] The laser power density irradiated on the metal ring is in the range of 10 4 to 10 6 W / cm². At the same time, the solder has good heat absorption rate and thermal conductivity, and can quickly absorb heat and melt the solder under laser irradiation. The solder has better absorption rate and thermal conductivity than the diaphragm substrate. By utilizing the difference in heat absorption characteristics of these two materials, good fusion welding can be formed by adjusting the laser parameters.

[0082] The spraying mechanism includes a metal wire spray head, and the metal wire spray head is used to spray metal wire on the welded diaphragm, specifically:

[0083] According to the size of the diaphragm and the spraying requirements of the metal wire, set the working parameters of the spraying mechanism, and the working parameters include spraying speed, spraying distance, spraying angle and spraying flow rate;

[0084] Driven by the controller, the metal wire spray head moves along a preset reciprocating serpentine route, and evenly sprays the metal wire on the surface of the welded diaphragm; the spacing and width of the serpentine route are set according to the size of the diaphragm and the spraying requirements of the metal wire to ensure that the entire surface of the diaphragm is evenly covered; during the spraying process, the moving speed and spraying flow rate of the metal wire spray head remain stable to ensure the uniform distribution and adhesion quality of the metal wire.

[0085] Embodiment 2:

[0086] Refer to Figures 4 to 6 , the method for welding the diaphragm using the diaphragm direct welding equipment for the moving coil flat combination earphone includes:

[0087] Preparation stage: Place the lower metal ring on the metal ring fixture of the welding equipment, and roughly align the welding holes on the lower metal ring with the positioning points on the fixture;

[0088] First positioning: Use the camera of the image positioning mechanism to capture the marking points on the metal ring fixture and the welding holes on the lower metal ring, and obtain their coordinate positions in the image; Determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system;

[0089] First solder application: Start the solder application mechanism, and the applicator evenly applies solder to the welding holes on the lower metal ring. Subsequently, the squeegee levels it to ensure the uniformity of the solder layer;

[0090] Second positioning: Place the diaphragm substrate on the metal ring, ensure that the size of the diaphragm substrate is larger than that of the metal ring, and place the upper metal ring on the diaphragm substrate; Determine whether the upper metal ring and the lower metal ring are aligned and make position adjustments;

[0091] Second solder application: Start the solder application mechanism, and the applicator evenly applies solder to the welding holes on the upper metal ring. Subsequently, the squeegee levels it to ensure the uniformity of the solder layer;

[0092] Laser welding and cutting: The controller adjusts the laser source and the galvanometer mechanism according to the positioning results, and simultaneously performs welding and laser cutting in a single scan, making the size of the metal ring equal to the size of the diaphragm substrate;

[0093] Metal wire spraying: After welding is completed, start the spraying mechanism. The metal wire nozzle moves along a preset reciprocating serpentine path under the drive of the controller, and evenly sprays the metal wire on the surface of the welded diaphragm.

[0094] Before welding, offset the energy distribution center of the laser spot to ensure that when laser welding is performed, the laser energy density irradiated on the metal ring is greater than the laser energy density irradiated on the diaphragm substrate outside the metal ring; The laser source emits continuous laser with a wavelength of 1064 nm or 10.6 μm, the power is between 10 kW and 50 kW, and the spot area is 30 - 500 mm².

[0095] Determine whether the upper metal ring and the lower metal ring are aligned and make position adjustments. Specifically:

[0096] Turn on the backlight illumination lamp on the metal ring fixture, use the camera of the image positioning mechanism to capture the marking points on the upper metal ring fixture and the welding holes on the metal ring, and obtain their coordinate positions in the image; Determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system;

[0097] Judge whether the upper metal ring and the lower metal ring are aligned according to the image after illumination by the backlight illuminating lamp. At the same time, compare whether the coordinates of the upper metal ring and the lower metal ring coincide according to the coordinate calculation result. If they are not aligned or do not coincide, adjust the position of the upper metal ring until they are aligned and the welding holes coincide.

[0098] So far, the above-described embodiments have been described for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. The individual elements or features of a particular embodiment are generally not limited by the particular embodiment, but, where applicable, may be interchanged and used in selected embodiments even if not specifically shown or described. In many respects, the same elements or features may also be modified. Such variations are not considered to depart from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

[0099] Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those skilled in the art. To thoroughly understand the embodiments of this disclosure, numerous details are set forth, such as examples of specific parts, devices, and methods. Obviously, for those skilled in the art, specific details are not required, and the example embodiments may be implemented in many different forms, and neither should be construed as limiting the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

[0100] Herein, specific terms are used for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a" and "the" used herein may also be intended to include the plural forms. The terms "comprising" and "having" are inclusive and therefore specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. Unless explicitly indicated the order of execution, the method steps, processes, and operations described herein are not to be construed as necessarily requiring to be performed in the particular order discussed and shown. It should also be understood that additional or alternative steps may be employed.

Claims

1. A diaphragm direct welding device for a dynamic coil planar combined earphone, which is used for directly welding the planar earphone diaphragm of the dynamic coil planar combined earphone. The earphone diaphragm includes a diaphragm substrate and a metal ring, and welding holes for welding are arranged on the metal ring. It is characterized in that, Comprising: A solder application mechanism for applying solder to the welding holes on the metal ring; An image positioning mechanism for positioning the position of the metal ring; A laser source and a galvanometer mechanism. The laser emitted by the laser source is adjusted by the galvanometer mechanism to achieve laser welding of the welding holes on the metal ring and laser cutting of the position outside the metal ring; A spraying mechanism, including a metal wire spray head, for spraying metal wire on the diaphragm after welding to complete the processing of the metal layer on the diaphragm; A displacement mechanism for driving the metal ring to move in the horizontal direction; A controller for controlling the coordinated operation of each mechanism; Before welding, the size of the diaphragm substrate is larger than that of the metal ring. During welding, the controller controls the laser source and the galvanometer mechanism to perform laser scanning on the metal ring and the position outside the metal ring, and welding and laser cutting are performed simultaneously during one circle of scanning; the size of the cut metal ring is equal to the size of the diaphragm substrate; After the laser source emits laser light, the power density is shaped so that the center of the energy distribution of the laser spot shifts to one side, and during laser welding, the energy of the inner circle is greater than that of the outer circle; that is, during laser welding, the laser energy density irradiating the metal ring is greater than the laser energy density irradiating the diaphragm substrate outside the metal ring, and the laser power density irradiating the metal ring is within the range of 10 4 to 10 6 W / cm², and the area of the laser spot is 30 - 500 mm 2 .

2. The diaphragm direct welding device for a moving coil planar combined earphone according to claim 1, characterized in that: The displacement mechanism includes an XY-axis moving platform and a metal ring fixture. The metal ring fixture is used to fix the metal ring and maintain the stability of the metal ring during welding; The image positioning mechanism includes a camera and marking points. The camera is arranged above the XY-axis moving platform, and the marking points are arranged on the outer ring of the metal ring fixture; The marking points can be photographed by the camera and are used to provide position marks during positioning calculation; A backlight illuminating lamp is also arranged on the XY-axis moving platform, which is arranged at the center of the metal ring fixture and is used to provide light that can pass through the diaphragm substrate during the positioning of the upper metal ring to achieve the positioning of the upper metal ring.

3. The diaphragm direct welding device for a moving coil planar combined earphone according to claim 1, characterized in that: The laser source is an infrared laser source, the laser is a continuous laser, emitting laser with a wavelength of 1064 nm or 10.6 μm, and the maximum laser power is 10 kW to 50 kW.

4. The diaphragm direct welding device for a moving coil planar combined earphone according to claim 2, characterized in that: The solder application mechanism includes an application head and a scraper. The application head is used to evenly apply solder to the welding holes on the metal ring, and the scraper is used to scrape the solder flat.

5. The diaphragm direct welding device for a moving coil planar magnetic headphone according to claim 4, wherein The positioning of the said image positioning mechanism is specifically: Using the camera to photograph the marking points on the metal ring fixture and the welding holes on the metal ring, and by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system, the accurate position coordinates of the welding holes are determined; The specific calculation method is: Let the coordinates of the marked point in the image coordinate system be (x m , y m ), and the coordinates of the welding hole in the image coordinate system be (x h , y h ). Then the accurate position coordinates (X h , Y h ) of the welding hole are calculated by the following formula: X h =X m +(x h -x m )×S, Y h =Y m +(y h -y m )×S; Among them, (X m , Y m ) are the known coordinates of the marked points in the actual space, and S is the scale factor between the image coordinate system and the actual space coordinate system.

6. The diaphragm direct welding device for a moving coil planar combined earphone according to claim 5, characterized in that: The spraying mechanism includes a metal wire spray head. The metal wire spray head is used to spray metal wire on the welded diaphragm specifically as follows: According to the size of the diaphragm and the spraying requirements of the metal wire, the working parameters of the spraying mechanism are set. The working parameters include spraying speed, spraying distance, spraying angle, and spraying flow rate; The metal wire spray head moves along a preset reciprocating snake-shaped route under the drive of the controller and evenly sprays the metal wire on the surface of the welded diaphragm.

7. A method for diaphragm welding using the diaphragm direct welding device for moving coil planar combination earphones according to any one of claims 1-6, characterized in that Comprising: Preparation stage: Place the lower metal ring on the metal ring fixture of the welding equipment, and roughly align the welding holes on the lower metal ring with the positioning points on the fixture; First positioning: Use the camera of the image positioning mechanism to capture the marking points on the metal ring fixture and the welding holes on the lower metal ring, and obtain their coordinate positions in the image; By calculating the relative position relationship between the marking points and the welding holes in the image coordinate system, determine the accurate position coordinates of the welding holes; First solder application: Start the solder application mechanism, and the application head evenly applies solder to the welding holes on the lower metal ring, and then the squeegee levels it to ensure the uniformity of the solder layer; Second positioning: Place the diaphragm substrate on the metal ring, ensure that the size of the diaphragm substrate is larger than that of the metal ring, and place the upper metal ring on the diaphragm substrate; Determine whether the upper metal ring and the lower metal ring are aligned and make position adjustments; Second solder application: Start the solder application mechanism, and the application head evenly applies solder to the welding holes on the upper metal ring, and then the squeegee levels it to ensure the uniformity of the solder layer; Laser welding and cutting: The controller adjusts the laser source and the galvanometer mechanism according to the positioning results, and performs welding and laser cutting simultaneously in one scan to make the size of the metal ring equal to the size of the diaphragm substrate; Metal wire spraying: After welding is completed, start the spraying mechanism, and the metal wire nozzle moves along a preset reciprocating serpentine route under the drive of the controller, and evenly sprays the metal wire on the surface of the welded diaphragm.

8. The method for welding a diaphragm according to claim 7, wherein: Determine whether the upper metal ring and the lower metal ring are aligned and make position adjustments, specifically: Turn on the backlight illumination lamp on the metal ring fixture, use the camera of the image positioning mechanism to capture the marking points on the upper metal ring fixture and the welding holes on the metal ring, and determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; Judge whether the upper metal ring and the lower metal ring are aligned according to the image after backlight illumination, and at the same time compare whether the coordinates of the upper metal ring and the lower metal ring coincide according to the coordinate calculation results. If they are not aligned or do not coincide, make position adjustments to the upper metal ring until they are aligned and the welding holes coincide.

Images