Automatic equipment for wafer cutting

Abstract

The invention relates to the technical field of wafer cutting, in particular to automatic equipment for wafer cutting, which comprises a scribing machine body, a cutting mechanism mounted in the scribing machine body, a suction cup mechanism mounted in the scribing machine body and a placement table, a supporting shell is mounted on one side in the scribing machine body, and a moving mechanism is mounted on the supporting shell; according to the automatic equipment for wafer cutting, the supporting shell is arranged in the scribing machine body and located on the outer side of the placement table, the moving mechanism is arranged on the supporting shell, and meanwhile, the blowing and sucking mechanism is arranged on the moving mechanism, so that when a wafer is located over the placement table, the wafer can be blown out of the placement table; impurity particles on the lower surface of the wafer and the upper surface of the placing table can be detected and removed in advance, so that it is guaranteed that the wafer can be flatly placed on the placing table, and the phenomenon that the wafer is broken due to unevenness in the subsequent cutting process is prevented.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cutting, and in particular to an automated device for wafer cutting. Background Art

[0002] There are many methods for wafer dicing (cutting), among which mechanical dicing (blade cutting) is the most traditional method of wafer dicing. Blade cutting is a process of cutting wafers with a diamond blade. This is a purely physical cutting method to split wafers. Generally, wafers with a thickness of more than 100um are suitable for this dicing method. The diamond blade moves along the cutting path while rotating at high speed to completely cut through the wafer. At the same time, tax is used to cool the blade and wafer, reduce thermal damage, and remove debris generated by cutting.

[0003] At present, when the existing wafer is cut, the wafer is sucked onto the placement table inside the dicing machine through a suction cup. However, during the transportation and handling of the wafer, impurity particles in the environment are easily attached to the surface of the wafer, especially when located on the lower surface of the wafer, the wafer will become uneven after being placed on the placement table, which will further cause the wafer to break during the cutting process. For this reason, we propose an automated device for wafer cutting. Summary of the invention

[0004] The object of the present invention is to provide an automated device for wafer cutting to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automated device for wafer cutting, comprising a dicing machine body, a cutting mechanism installed inside the dicing machine body, a suction cup mechanism installed inside the dicing machine body, and a placement table, wherein the placement table is used to support and position the wafer during cutting, a support shell is installed on one side of the dicing machine body, a moving mechanism is installed on the support shell, and the moving mechanism is located outside the placement table;

[0006] The moving mechanism is connected to a blowing and sucking mechanism, which is used to detect and remove impurity particles on the upper surface of the placement table and the lower surface of the wafer when the wafer is located above the placement table, and detect and remove impurity particles on the upper surface of the wafer after the wafer is located on the upper surface of the placement table. The blowing and sucking mechanism sucks coolant on the surface of the wafer after the wafer is cut.

[0007] Among them, the moving mechanism includes a moving screw, a waterproof motor, a moving block and a support block, the moving screw is rotatably connected inside the support shell, the waterproof motor is installed on one side of the support shell, and the waterproof motor is used to drive the moving screw, the moving block is threadedly sleeved on the outside of the moving screw, the moving block slides through one side of the opening of the support shell, the support block is located on the outside of the support shell, and the support block is fixedly installed on the moving block, a U-shaped opening is provided on the side of the support block away from the support shell, and one end of the blowing and suction mechanism is installed at the U-shaped opening.

[0008] The blowing and suction mechanism includes a rotating shell, a first rotating shaft, a second rotating shaft, a rotating member, a guide mechanism, a first guide block, a second guide block, a synchronous connecting member and a blowing and suction member. The rotating shell passes through the U-shaped opening, and one end of the first rotating shaft and the second rotating shaft are respectively fixedly connected to the rotating shell;

[0009] The first rotating shaft is rotatably connected to the top of the U-shaped opening, the second rotating shaft passes through the bottom of the support block, and the second rotating shaft is rotatably connected to the support block, the rotating member is installed at the bottom of the support block, and the rotating member is used to drive the second rotating shaft;

[0010] The guide mechanism is installed on one side of the rotating shell, and the guide mechanism guides the first guide block and the second guide block respectively;

[0011] The first guide block and the second guide block are both installed with synchronous connecting parts on the side away from each other, and the first guide block and the second guide block are respectively connected to the guide mechanism through the synchronous connecting parts thereon, and the blowing and sucking parts are installed on the upper surfaces of the first guide block and the second guide block, and the blowing and sucking parts blow and suck the wafer and the placement table respectively, and the blowing and sucking mechanism is provided to achieve the effect of blowing away impurity particles, and at the same time achieve the effect of extracting debris and coolant.

[0012] The guide mechanism comprises a sliding rod, a fixed plate, a guide screw, a bidirectional threaded rod, a guide motor and a driving motor, one end of the sliding rod is fixedly connected to one end of the outer side of the rotating shell, and the other end of the sliding rod is fixedly connected to the fixed plate, the guide screw and the bidirectional threaded rod are respectively located on the outer side of the sliding rod, and the two ends of the guide screw and the bidirectional threaded rod are rotatably connected to the rotating shell and the fixed plate respectively, the guide motor is located inside the rotating shell, and the guide motor is used to drive the guide screw, the driving motor is located inside the rotating shell, and the driving motor is used to drive the bidirectional threaded rod, the first guide block and the second guide block are respectively slidably sleeved on the outer sides of the sliding rod, the guide screw and the bidirectional threaded rod, and the first guide block and the second guide block are respectively threadedly connected to the guide screw or the bidirectional threaded rod through a synchronous connecting piece, and the guide mechanism is provided to realize the function of supporting and connecting the first guide block and the second guide block.

[0013] Wherein, the synchronous connecting member comprises a first half-threaded sleeve, a second half-threaded sleeve, a first cross rod, a second cross rod and a bidirectional cylinder, two of the first half-threaded sleeve and the second half-threaded sleeve are provided, two of the first half-threaded sleeves are sleeved on the outside of the bidirectional threaded rod, two of the second half-threaded sleeves are sleeved on the outside of the guide screw rod, the first cross rod and the second cross rod are cross-distributed, and the second cross rod is provided with a moving opening for the first cross rod to pass through, and the first cross rod slides through the moving opening;

[0014] The two ends of the first cross rod are respectively fixedly connected to the first half threaded sleeve at the upper end and the second half threaded sleeve at the lower end, the two ends of the second cross rod are respectively fixedly connected to the first half threaded sleeve at the lower end and the second half threaded sleeve at the upper end, the two ends of the two-way cylinder are respectively fixedly connected to the first cross rod and the second cross rod, and the two-way cylinder is fixedly installed on the first guide block or the second guide block, and the synchronous connecting piece is provided to realize the function of connecting the first guide block and the second guide block to the guide screw rod or the two-way threaded rod respectively.

[0015] Wherein, the first guide block is provided with a protrusion, and the second guide block is provided with a groove at a position corresponding to the protrusion, so that the first guide block and the second guide block can cooperate with each other.

[0016] The blowing and suction component includes a first blowing and suction pipe, a second blowing and suction pipe, a straight pipe, a U-shaped pipe, a support, a positioning plate, a telescopic pipe, a transfer pipe, a suction component, a blower and a detection component. When the wafer is located directly above the placement table, the first blowing and suction pipe and the second blowing and suction pipe are located between the wafer and the placement table, and the first blowing and suction pipe and the second blowing and suction pipe are both provided with blowing and suction ports.

[0017] One end of the straight tube is connected to the first blowing and suction tube, the support member is located on the first guide block, and the support member is used to support the straight tube, one end of the U-shaped tube is connected to the second blowing and suction tube, two positioning plates are provided, the two positioning plates are fixedly mounted on the second guide block, and the two positioning plates are used to support the U-shaped tube;

[0018] The telescopic tubes are provided with two, one end of the two telescopic tubes is respectively connected with the straight tube and the U-shaped tube, one end of the straight tube is rotatably connected with the telescopic tube, the outer side of the telescopic tube close to one end of the straight tube is fixedly connected with a fixing frame, and the fixing frame is connected with the support member, one end of the two telescopic tubes located outside the dicing machine body is connected with the transfer tube, and the two ends of the bottom of the transfer tube are respectively installed with solenoid valves, and the two ends of the bottom of the transfer tube are respectively connected with the suction member and the blower;

[0019] There are two detection members, one of which is located on the support member and the other is located at the bottom of the second guide block, and the blowing and sucking member is provided to achieve the effect of blowing and sucking the foreign particles.

[0020] Wherein, the support member includes an intermediate plate, a support shaft, a swing plate, a swing motor, a protective shell, a connecting gear, an arc plate, a tooth block and a side plate, the intermediate plate is fixedly mounted on the top of the first guide block, the support shaft passes through the intermediate plate, and the support shaft is rotatably connected to the intermediate plate, the swing motor is fixedly mounted on the intermediate plate, and the swing motor is used to drive the support shaft, the protective shell is mounted on the intermediate plate, and the protective shell is used to protect the swing motor;

[0021] The other end of the support shaft is fixedly connected to the swing plate, the straight tube passes through the other end of the swing plate, and the straight tube is rotatably connected to the swing plate, one end of the fixed frame is fixedly connected to the straight tube, the connecting gear is fixedly sleeved on the outside of the straight tube, one end of the arc plate is fixedly connected to the side plate, and the side plate is fixedly installed on the first guide block, a plurality of tooth blocks are provided, and the plurality of tooth blocks are equidistantly distributed on the inner circle of the arc plate, and the connecting gear is meshedly connected with the tooth block;

[0022] One of the detection parts is installed on the side plate, and the support part is provided to support the straight pipe and the first blowing and suction pipe.

[0023] Among them, the detection part includes a light scattering sensor, the light scattering sensor located at the first guide block is fixedly installed on the side panel, and the light scattering sensor located at the second guide block is fixedly installed at the bottom of the second guide block. Through the detection part provided, the function of detecting impurity particles on the lower surface of the wafer and the upper surface of the placement table is realized.

[0024] Among them, the suction member includes a negative pressure pump and a liquid collecting shell, the liquid collecting shell is installed on the outside of the dicing machine body, the output end of the negative pressure pump is connected with the liquid collecting shell, and the input end of the negative pressure pump is connected with one end of the bottom of the transfer tube. Through the suction member, the debris on the surface of the wafer and the coolant are sucked through the first blowing and suction pipe and the second blowing and suction pipe.

[0025] The present invention has at least the following beneficial effects:

[0026] 1. When the present invention is in use, by providing a support shell inside the dicing machine body and outside the placement table, and providing a moving mechanism on the support shell, and providing a blowing and sucking mechanism on the moving mechanism, when the wafer is located directly above the placement table, the impurity particles on the lower surface of the wafer and the upper surface of the placement table can be detected and removed in advance, thereby ensuring that the wafer can be placed flat on the placement table, and preventing the wafer from breaking due to unevenness during subsequent cutting;

[0027] 2. After the wafer is placed on the placement table, the blowing and suction mechanism in the present invention can remove the impurity particles on the surface of the wafer again, thereby improving the wafer cutting accuracy;

[0028] 3. After the wafer is cut, the blowing and suction mechanism in the present invention can suck the coolant and debris on the surface of the wafer, and at the same time, it can reduce the movement of impurities relative to the wafer surface, further improve the accuracy of wafer cutting, and facilitate the subsequent drying of the wafer inside the dicing machine body. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 This is a schematic diagram of the structure of the placement table of the present invention;

[0031] Figure 3 This is a schematic diagram of the supporting shell structure of the present invention;

[0032] Figure 4 It is a schematic diagram of the structure of the first blowing and suction pipe and the second blowing and suction pipe of the present invention;

[0033] Figure 5 This is a schematic diagram of the structure of the mobile block of the present invention;

[0034] Figure 6 This is a schematic diagram of the support block structure of the present invention;

[0035] Figure 7 This is a schematic diagram of the rotating shell structure of the present invention;

[0036] Figure 8 It is a schematic diagram of the structure of the fixing plate of the present invention;

[0037] Fig. 9 This is a schematic diagram of the rotating shell structure of the present invention;

[0038] Fig.10 This is a schematic diagram of the structure of the first guide block of the present invention;

[0039] Fig.11 It is a schematic diagram of the U-shaped tube structure of the present invention;

[0040] Fig.12 It is a schematic diagram of the swing plate structure of the present invention.

[0041] In the figure: 1. Slicer body; 11. Cutting mechanism; 12. Suction cup mechanism; 13. Placement table; 2. Support shell; 3. Moving mechanism; 31. Moving screw rod; 32. Waterproof motor; 33. Moving block; 34. Support block; 341. U-shaped mouth; 4. Blowing and sucking mechanism; 41. Rotating shell; 42. First rotating shaft; 43. Second rotating shaft; 44. Rotating member; 441. Bottom shell; 442. Rotating motor; 443. First rotating gear; 444. Second rotating gear; 45. Guide mechanism; 451. Sliding rod; 452. Fixed plate; 453. Guide screw rod; 454. Bidirectional threaded rod; 455. Guide motor; 456. Drive motor; 46. First guide block; 461. Protrusion; 47 , the second guide block; 5, synchronous connecting piece; 51, the first half threaded sleeve; 52, the second half threaded sleeve; 53, the first cross rod; 54, the second cross rod; 55, the two-way cylinder; 6, the blowing and sucking piece; 61, the first blowing and sucking pipe; 62, the second blowing and sucking pipe; 63, the straight pipe; 64, the U-shaped pipe; 65, the supporting piece; 651, the middle plate; 652, the supporting shaft; 653, the swing plate; 654, the swing motor; 655, the protective shell; 656, the connecting gear; 657, the arc plate; 658, the gear block; 659, the side plate; 66, the positioning plate; 67, the telescopic tube; 68, the transfer tube; 7, the suction piece; 71, the negative pressure pump; 72, the liquid collecting shell; 8, the blower; 9, the detection piece; 91, the light scattering sensor. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Embodiment 1

[0044] See also Figures 1 to 3 , an automated device for wafer cutting, comprising a dicing machine body 1, a cutting mechanism 11 installed inside the dicing machine body 1, a suction cup mechanism 12 and a placement table 13 installed inside the dicing machine body 1, the placement table 13 is used to support and position the wafer when it is cut, and in the present invention, the cutting mechanism 11, the suction cup mechanism 12 and the placement table 13 are all existing mechanisms, so no further elaboration is made, and the placement table 13 is used to place the wafer, and the placement table 13 is used to fix the wafer, and the bottom of the placement table 13 is a matching mechanism, which enables the placement table 13 and the cutting mechanism 11 to cooperate with each other for precise wafer cutting, a support shell 2 is installed on one side of the dicing machine body 1, a moving mechanism 3 is installed on the support shell 2, and the moving mechanism 3 is located outside the placement table 13;

[0045] See also Figure 6 The moving mechanism 3 is connected to a blowing and sucking mechanism 4. When the wafer is located above the placement table 13, the blowing and sucking mechanism 4 is used to detect and remove impurity particles on the upper surface of the placement table 13 and the lower surface of the wafer. After the wafer is located on the upper surface of the placement table 13, the impurity particles on the upper surface of the wafer are detected and removed. After the wafer is cut, the blowing and sucking mechanism 4 sucks the coolant on the surface of the wafer.

[0046] The moving mechanism 3 includes a moving screw 31, a waterproof motor 32, a moving block 33 and a support block 34. The moving screw 31 is rotatably connected to the inside of the support shell 2. The waterproof motor 32 is installed on one side of the support shell 2, and the waterproof motor 32 is used to drive the moving screw 31. The moving block 33 is threadedly sleeved on the outside of the moving screw 31. The moving block 33 slides through one side of the opening of the support shell 2. The support block 34 is located on the outside of the support shell 2, and the support block 34 is fixedly installed on the moving block 33. A U-shaped opening 341 is provided on the side of the support block 34 away from the support shell 2, and one end of the blowing and suction mechanism 4 is installed at the U-shaped opening 341.

[0047] Specific implementation process: When the moving block 33 is driven, the waterproof motor 32 is operated to rotate the moving screw 31. While the moving screw 31 rotates, it provides driving force for the moving block 33. At this time, the moving block 33 moves horizontally relative to the supporting shell 2 under the limiting action of the supporting shell 2, thereby realizing the function of moving and adjusting the position of the moving block 33 relative to the supporting shell 2.

[0048] See also Figures 3 to 12 The blowing and sucking mechanism 4 includes a rotating shell 41, a first rotating shaft 42, a second rotating shaft 43, a rotating member 44, a guiding mechanism 45, a first guiding block 46, a second guiding block 47, a synchronous connecting member 5 and a blowing and sucking member 6. The rotating shell 41 passes through the U-shaped opening 341, and one end of the first rotating shaft 42 and the second rotating shaft 43 are respectively fixedly connected to the rotating shell 41;

[0049] The first rotating shaft 42 is rotatably connected to the top of the U-shaped opening 341, the second rotating shaft 43 passes through the bottom of the support block 34, and the second rotating shaft 43 is rotatably connected to the support block 34, the rotating member 44 is installed at the bottom of the support block 34, and the rotating member 44 is used to drive the second rotating shaft 43;

[0050] The guide mechanism 45 is installed on one side of the rotating shell 41, and the guide mechanism 45 guides the first guide block 46 and the second guide block 47 respectively. The first guide block 46 is provided with a protrusion 461, and the second guide block 47 is provided with a groove at a position corresponding to the protrusion 461;

[0051] A synchronous connecting piece 5 is installed on the side of the first guide block 46 and the second guide block 47 that are away from each other, and the first guide block 46 and the second guide block 47 are respectively connected to the guide mechanism 45 through the synchronous connecting piece 5 thereon, and the blowing and sucking piece 6 is installed on the upper surface of the first guide block 46 and the second guide block 47, and the blowing and sucking piece 6 blows and sucks the wafer and the placement table 13 respectively.

[0052] The guide mechanism 45 includes a slide bar 451, a fixed plate 452, a guide screw rod 453, a bidirectional threaded rod 454, a guide motor 455 and a drive motor 456. One end of the slide bar 451 is fixedly connected to one end of the outer side of the rotating shell 41, and the other end of the slide bar 451 is fixedly connected to the fixed plate 452. The guide screw rod 453 and the bidirectional threaded rod 454 are respectively located on the outer side of the slide bar 451, and the two ends of the guide screw rod 453 and the bidirectional threaded rod 454 are respectively rotatably connected to the rotating shell 41 and the fixed plate 452. The guide motor 455 is driven by the guide motor 456. 455 is located inside the rotating shell 41, and the guide motor 455 is used to drive the guide screw 453, the drive motor 456 is located inside the rotating shell 41, and the drive motor 456 is used to drive the bidirectional threaded rod 454, the first guide block 46 and the second guide block 47 are respectively slidably connected to the outside of the sliding rod 451, the guide screw 453 and the bidirectional threaded rod 454, and the first guide block 46 and the second guide block 47 are respectively threadedly connected to the guide screw 453 or the bidirectional threaded rod 454 through the synchronous connecting piece 5.

[0053] See also Fig.12 The synchronous connecting member 5 includes a first half threaded sleeve 51, a second half threaded sleeve 52, a first cross rod 53, a second cross rod 54 and a bidirectional cylinder 55. The first half threaded sleeve 51 and the second half threaded sleeve 52 are each provided with two, the two first half threaded sleeves 51 are sleeved on the outside of the bidirectional threaded rod 454, the two second half threaded sleeves 52 are sleeved on the outside of the guide screw rod 453, the first cross rod 53 and the second cross rod 54 are cross-distributed, and the second cross rod 54 is provided with a moving opening for the first cross rod 53 to pass through, and the first cross rod 53 slides through the moving opening;

[0054] The two ends of the first cross rod 53 are respectively fixedly connected to the first half threaded sleeve 51 at the upper end and the second half threaded sleeve 52 at the lower end, the two ends of the second cross rod 54 are respectively fixedly connected to the first half threaded sleeve 51 at the lower end and the second half threaded sleeve 52 at the upper end, the two ends of the two-way cylinder 55 are respectively fixedly connected to the first cross rod 53 and the second cross rod 54, and the two-way cylinder 55 is fixedly mounted on the first guide block 46 or the second guide block 47.

[0055] Specifically, by setting the first cross rod 53 and the second cross rod 54, the two first half-threaded sleeves 51 and the two second half-threaded sleeves 52 are respectively located on the outside of the guide screw rod 453 and the two-way threaded rod 454, and then the two-way cylinder 55 is operated, so that one end of the first cross rod 53 and the second cross rod 54 move in the opposite directions, and the other end of the first cross rod 53 and the second cross rod 54 move in the direction away from each other. At this time, the first state is: the two first half-threaded sleeves 51 are threadedly sleeved on the outside of the two-way threaded rod 454, the two second half-threaded sleeves 52 are away from the outside of the guide screw rod 453, and the two second half-threaded sleeves 52 do not contact the threads on the outside of the guide screw rod 453; the second state is: the two first half-threaded sleeves 51 are threadedly sleeved on the outside of the two-way threaded rod 454, and the two first half-threaded sleeves 51 are not in contact with the threads on the outside of the two-way threaded rod 454, and the two second half-threaded sleeves 52 are threadedly sleeved on the outside of the guide screw rod 453;

[0056] See also Figures 3 to 12 The blowing and suction member 6 includes a first blowing and suction pipe 61, a second blowing and suction pipe 62, a straight pipe 63, a U-shaped pipe 64, a supporting member 65, a positioning plate 66, a telescopic pipe 67, a transfer pipe 68, a suction member 7, a blower 8 and a detection member 9. When the wafer is located directly above the placement table 13, the first blowing and suction pipe 61 and the second blowing and suction pipe 62 are located between the wafer and the placement table 13, and blowing and suction ports are provided on the first blowing and suction pipe 61 and the second blowing and suction pipe 62;

[0057] One end of the straight tube 63 is connected to the first blowing and suction tube 61, the support member 65 is located on the first guide block 46, and the support member 65 is used to support the straight tube 63, one end of the U-shaped tube 64 is connected to the second blowing and suction tube 62, and two positioning plates 66 are provided, and the two positioning plates 66 are fixedly installed on the second guide block 47, and the two positioning plates 66 are used to support the U-shaped tube 64;

[0058] Two telescopic tubes 67 are provided, one end of the two telescopic tubes 67 is connected with the straight tube 63 and the U-shaped tube 64 respectively, one end of the straight tube 63 is rotatably connected with the telescopic tube 67, the outer side of the telescopic tube 67 close to one end of the straight tube 63 is fixedly connected with a fixing frame, and the fixing frame is connected with the support member 65, and one end of the telescopic tube 67 located on the outer side of the dicing machine body 1 is connected with the transfer tube 68, and the two ends of the bottom of the transfer tube 68 are respectively installed with electromagnetic valves, and the two ends of the bottom of the transfer tube 68 are respectively connected with the suction member 7 and the blower 8;

[0059] Two detection members 9 are provided, one detection member 9 is located on the support member 65 and the other detection member 9 is located at the bottom of the second guide block 47 .

[0060] The support member 65 includes an intermediate plate 651, a support shaft 652, a swing plate 653, a swing motor 654, a protective shell 655, a connecting gear 656, an arc plate 657, a tooth block 658 and a side plate 659. The intermediate plate 651 is fixedly mounted on the top of the first guide block 46. The support shaft 652 passes through the intermediate plate 651, and the support shaft 652 is rotatably connected to the intermediate plate 651. The swing motor 654 is fixedly mounted on the intermediate plate 651, and the swing motor 654 is used to drive the support shaft 652. The protective shell 655 is mounted on the intermediate plate 651, and the protective shell 655 is used to protect the swing motor 654.

[0061] The other end of the support shaft 652 is fixedly connected to the swing plate 653, the straight tube 63 passes through the other end of the swing plate 653, and the straight tube 63 is rotatably connected to the swing plate 653, one end of the fixed frame is fixedly connected to the straight tube 63, the connecting gear 656 is fixedly sleeved on the outside of the straight tube 63, one end of the arc plate 657 is fixedly connected to the side plate 659, and the side plate 659 is fixedly installed on the first guide block 46, a plurality of tooth blocks 658 are provided, and the plurality of tooth blocks 658 are equidistantly distributed on the inner circle of the arc plate 657, and the connecting gear 656 is meshedly connected with the tooth blocks 658;

[0062] One of the detection parts 9 is installed on the side plate 659.

[0063] See also Figure 4 The detection member 9 includes a light scattering sensor 91 , the light scattering sensor 91 located at the first guide block 46 is fixedly mounted on the side plate 659 , and the light scattering sensor 91 located at the second guide block 47 is fixedly mounted at the bottom of the second guide block 47 .

[0064] The suction member 7 includes a negative pressure pump 71 and a liquid collecting shell 72. The liquid collecting shell 72 is installed on the outside of the dicing machine body 1. The output end of the negative pressure pump 71 is connected to the liquid collecting shell 72, and the input end of the negative pressure pump 71 is connected to one end of the bottom of the transfer tube 68. Through the setting of the suction member 7, when impurities on the lower surface of the next wafer are blown away, the blower will run first to blow away the coolant inside the straight tube 63, the U-shaped tube 64, the telescopic tube 67, and the transfer tube 68 to avoid the influence of the coolant when removing impurities on the lower surface of the wafer and impurities on the upper surface of the placement table 13.

[0065] Specific implementation process: First, when the wafer moves to the top of the placement table 13, and at the same time, a certain distance is maintained between the wafer and the placement table 13. In this embodiment, the height is preferably 10 cm, then the moving block 33 moves to the rightmost end of the supporting shell 2. At this time, the rotating member 44 is operated to keep the rotating shell 41 and the moving block 33 parallel to each other. At this time, the sliding rod 451 at one end of the rotating shell 41 and the moving block 33 are maintained at a perpendicular state to each other. At this time, the first blowing and suction pipe 61 is located above the second blowing and suction pipe 62, and the blowing and suction port of the first blowing and suction pipe 61 is tilted upward, while the blowing and suction port of the second blowing and suction pipe 62 is tilted downward, and both blowing and suction ports are facing the inner side of the dicing machine body 1. At this time, the output end of the two-way cylinder 55 located on the first guide block 46 and the second guide block 47 extends out, and the two second half-threaded sleeves 52 at the first guide block 46 and the second guide block 47 are both threadedly sleeved on the outer side of the guide screw rod 453. At this time, the guide motor 455 is operated to make the guide screw rod 453 rotates, and when the guide screw rod 453 rotates, it provides driving forces for the two half-threaded sleeves at the first guide block 46 and the second guide block 47 respectively, and due to the limiting effect of the slide bar 451, at this time, the first guide block 46 and the second guide block 47 move along the outside of the placement table 13, and at this time, the blower 8 is running, and the solenoid valve at the blower 8 is opened, and the airflow is introduced into the straight pipe 63 and the U-shaped pipe 64 respectively through the transfer pipe 68 and the telescopic pipe 67, and finally blown out through the blowing and suction ports at the first blowing and suction pipe 61 and the second blowing and suction pipe 62 respectively, so as to achieve the effect of blowing away the particle impurities on the lower surface of the wafer and the upper surface of the placement table 13, and at the same time of blowing away, the light scattering sensor 91 is used to detect whether the lower surface of the wafer and the upper surface of the placement table 13 contain particle impurities, if so, the first blowing and suction pipe 61 and the second blowing and suction pipe 62 reciprocate to achieve the effect of fully blowing away the particle impurities on the lower surface of the wafer and the upper surface of the placement table 13;

[0066] Subsequently, when the impurities on the lower surface of the wafer and the upper surface of the placement table 13 are blown away, the wafer is stably placed on the upper surface of the placement table 13, and the placement table 13 simultaneously fixes the wafer, and the first blowing and suction pipe 61 and the second blowing and suction pipe 62 are driven by the guide screw 453 to move close to the support shell 2, and then, the swing motor 654 is operated to rotate the swing plate 653, and when the swing plate 653 rotates, the first blowing and suction pipe 61 is driven by the straight pipe 63 along the curved plate 65 7 is rotated, and due to the meshing action of the connecting gear 656 and the tooth block 658, the connecting gear 656 drives the straight tube 63 to rotate, that is, one end of the straight tube 63 rotates synchronously relative to the telescopic tube 67, and when the straight tube 63 rotates, the first blowing and suction pipe 61 is further rotated, until the swing plate 653 rotates 90 degrees, the direction of the blowing and suction port of the first blowing and suction pipe 61 and the direction of the blowing and suction port of the second blowing and suction pipe 62 are mirror images of each other, and then, through the moving mechanism 3 operates, so that the moving block 33 drives the supporting block 34 to move along the other end of the supporting shell 2 until it moves to the Y axis of the supporting shell 2, and then the rotating member 44 operates to rotate the rotating shell 41. At this time, the first blowing and suction pipe 61 and the second blowing and suction pipe 62 are located on both sides of the Y axis of the supporting shell 2, and at the same time, the first blowing and suction pipe 61 and the second blowing and suction pipe 62 are located on both sides of the Y axis of the placing table 13, and then the output ends of the two bidirectional cylinders 55 are retracted to make the two groups of first half threaded sleeves 51 respectively threadedly connected with the bidirectional threaded rod 454, so that the bidirectional threaded rod 454 is rotated by the driving motor 456, and when the bidirectional threaded rod 454 rotates, the two groups of first half threaded sleeves 51 are respectively provided with reverse driving force, so that the first guide block 46 and the second guide block 47 move in opposite directions, and at the same time, the blower 8 operates, so as to blow away the particles on the surface of the wafer through the first blowing and suction pipe 61 and the second blowing and suction pipe 62;

[0067] Finally, when the wafer cutting is completed, the negative pressure pump 71 is operated to generate negative pressure at the blowing and suction ports of the first blowing and suction pipe 61 and the second blowing and suction pipe 62, thereby sucking the debris and coolant on the upper surface of the wafer, and the first blowing and suction pipe 61 and the second blowing and suction pipe 62 move in opposite directions, so as to achieve the suction of the debris and the coolant, and then blow the coolant and the debris to the collecting trough set inside the dicing machine body 1, so as to facilitate the subsequent drying of the wafer.

[0068] Embodiment 2

[0069] See also Figure 8, Embodiment 2 is a further supplementary description of the rotating member 44 in Embodiment 1, specifically: the rotating member 44 includes a bottom shell 441, a rotating motor 442, a first rotating gear 443 and a second rotating gear 444, the bottom shell 441 is fixedly mounted on the bottom of the support block 34, the rotating motor 442 is fixedly mounted inside the bottom shell 441, the output end of the rotating motor 442 is fixedly connected to the first rotating gear 443, and the first rotating gear 443 is meshedly connected to the second rotating gear 444, and the second rotating gear 444 is fixedly sleeved on the outside of the second rotating shaft 43;

[0070] Thus, the first rotating gear 443 drives the second rotating gear 444 to rotate by operating the rotating motor 442. When the second rotating gear 444 rotates, the second rotating shaft 43 further drives the rotating shell 41 to rotate. Then, the rotating shell 41 rotates 90° forward or 90° reversely relative to the U-shaped opening 341 through the first rotating shaft 42 and the second rotating shaft 43.

[0071] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0072] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automated device for wafer cutting, comprising a wafer cutting machine body (1), a cutting mechanism (11) installed inside the wafer cutting machine body (1), a suction cup mechanism (12) installed inside the wafer cutting machine body (1) and a placement table (13), wherein the placement table (13) is used to support and position the wafer during cutting, and is characterized in that: A support shell (2) is installed on one side of the interior of the dicing machine body (1), a moving mechanism (3) is installed on the support shell (2), and the moving mechanism (3) is located outside the placement table (13); The moving mechanism (3) is connected to a blowing and sucking mechanism (4). When the wafer is located above the placement table (13), the blowing and sucking mechanism (4) is used to detect and remove impurity particles on the upper surface of the placement table (13) and the lower surface of the wafer. After the wafer is located on the upper surface of the placement table (13), the blowing and sucking mechanism (4) detects and removes impurity particles on the upper surface of the wafer. After the wafer is cut, the blowing and sucking mechanism (4) sucks cooling liquid from the surface of the wafer.

2. The automated device for wafer cutting according to claim 1, characterized in that: The moving mechanism (3) comprises a moving screw (31), a waterproof motor (32), a moving block (33) and a supporting block (34); the moving screw (31) is rotatably connected to the inside of the supporting shell (2); the waterproof motor (32) is mounted on one side of the supporting shell (2); and the waterproof motor (32) is used to drive the moving screw (31); the moving block (33) is threadedly sleeved on the outside of the moving screw (31); the moving block (33) slides through one side of an opening of the supporting shell (2); the supporting block (34) is located on the outside of the supporting shell (2); and the supporting block (34) is fixedly mounted on the moving block (33); a U-shaped opening (341) is provided on a side of the supporting block (34) away from the supporting shell (2); and one end of the blowing and suction mechanism (4) is mounted at the U-shaped opening (341).

3. The automated equipment for wafer cutting according to claim 1, characterized in that: The blowing and sucking mechanism (4) comprises a rotating shell (41), a first rotating shaft (42), a second rotating shaft (43), a rotating member (44), a guiding mechanism (45), a first guiding block (46), a second guiding block (47), a synchronous connecting member (5) and a blowing and sucking member (6); the rotating shell (41) passes through the U-shaped opening (341); one end of the first rotating shaft (42) and one end of the second rotating shaft (43) are respectively fixedly connected to the rotating shell (41); The first rotating shaft (42) is rotatably connected to the top of the U-shaped opening (341), the second rotating shaft (43) passes through the bottom of the support block (34), and the second rotating shaft (43) is rotatably connected to the support block (34), the rotating member (44) is mounted on the bottom of the support block (34), and the rotating member (44) is used to drive the second rotating shaft (43); The guide mechanism (45) is installed on one side of the rotating shell (41), and the guide mechanism (45) guides the first guide block (46) and the second guide block (47) respectively; A synchronous connecting piece (5) is installed on the side of the first guide block (46) and the second guide block (47) that are away from each other, and the first guide block (46) and the second guide block (47) are respectively connected to the guide mechanism (45) through the synchronous connecting piece (5) thereon, and the blowing and sucking piece (6) is installed on the upper surface of the first guide block (46) and the second guide block (47), and the blowing and sucking piece (6) blows and sucks the wafer and the placement table (13) respectively.

4. The automated equipment for wafer cutting according to claim 3, characterized in that: The guide mechanism (45) comprises a slide bar (451), a fixing plate (452), a guide screw (453), a bidirectional threaded rod (454), a guide motor (455) and a drive motor (456); one end of the slide bar (451) is fixedly connected to one end of the outer side of the rotating shell (41); the other end of the slide bar (451) is fixedly connected to the fixing plate (452); the guide screw (453) and the bidirectional threaded rod (454) are respectively located on the outer side of the slide bar (451); and the two ends of the guide screw (453) and the bidirectional threaded rod (454) are respectively rotatably connected to the rotating shell (41) and the fixing plate (452); The guide motor (455) is located inside the rotating shell (41), and the guide motor (455) is used to drive the guide screw (453). The drive motor (456) is located inside the rotating shell (41), and the drive motor (456) is used to drive the bidirectional threaded rod (454). The first guide block (46) and the second guide block (47) are respectively slidably sleeved on the outside of the sliding rod (451), the guide screw (453) and the bidirectional threaded rod (454), and the first guide block (46) and the second guide block (47) are respectively threadedly connected to the guide screw (453) or the bidirectional threaded rod (454) through a synchronous connecting piece (5).

5. The automated equipment for wafer cutting according to claim 3, characterized in that: The synchronous connecting member (5) comprises a first half-threaded sleeve (51), a second half-threaded sleeve (52), a first cross rod (53), a second cross rod (54) and a bidirectional cylinder (55), wherein two of the first half-threaded sleeve (51) and two of the second half-threaded sleeve (52) are provided, the two first half-threaded sleeves (51) are sleeved on the outside of the bidirectional threaded rod (454), the two second half-threaded sleeves (52) are sleeved on the outside of the guide screw rod (453), the first cross rod (53) and the second cross rod (54) are cross-distributed, and the second cross rod (54) is provided with a moving opening for the first cross rod (53) to pass through, and the first cross rod (53) slides through the moving opening; The two ends of the first cross rod (53) are respectively fixedly connected to the first half threaded sleeve (51) at the upper end and the second half threaded sleeve (52) at the lower end; the two ends of the second cross rod (54) are respectively fixedly connected to the first half threaded sleeve (51) at the lower end and the second half threaded sleeve (52) at the upper end; the two ends of the bidirectional cylinder (55) are respectively fixedly connected to the first cross rod (53) and the second cross rod (54); and the bidirectional cylinder (55) is fixedly mounted on the first guide block (46) or the second guide block (47).

6. The automated equipment for wafer cutting according to claim 4, characterized in that: The first guide block (46) is provided with a protrusion (461), and the second guide block (47) is provided with a groove at a position corresponding to the protrusion (461).

7. The automated equipment for wafer cutting according to claim 3, characterized in that: The blowing and suction component (6) comprises a first blowing and suction pipe (61), a second blowing and suction pipe (62), a straight pipe (63), a U-shaped pipe (64), a supporting component (65), a positioning plate (66), a telescopic pipe (67), a transfer pipe (68), a suction component (7), a blower (8) and a detection component (9); when the wafer is located directly above the placement table (13), the first blowing and suction pipe (61) and the second blowing and suction pipe (62) are located between the wafer and the placement table (13); and blowing and suction ports are provided on the first blowing and suction pipe (61) and the second blowing and suction pipe (62); One end of the straight tube (63) is in communication with the first blowing and suction tube (61); the support member (65) is located on the first guide block (46), and the support member (65) is used to support the straight tube (63); one end of the U-shaped tube (64) is in communication with the second blowing and suction tube (62); two positioning plates (66) are provided, and the two positioning plates (66) are fixedly mounted on the second guide block (47), and the two positioning plates (66) are used to support the U-shaped tube (64); The telescopic tubes (67) are provided with two, one end of each of the two telescopic tubes (67) is connected to the straight tube (63) and the U-shaped tube (64) respectively, one end of the straight tube (63) is rotatably connected to the telescopic tube (67), the outer side of the telescopic tube (67) close to one end of the straight tube (63) is fixedly connected to a fixing frame, and the fixing frame is connected to the support member (65), one end of each of the two telescopic tubes (67) located on the outer side of the dicing machine body (1) is connected to the transfer tube (68), and solenoid valves are installed at both ends of the bottom of the transfer tube (68), and the two ends of the bottom of the transfer tube (68) are respectively connected to the suction member (7) and the blower (8); Two detection members (9) are provided, one detection member (9) is located on the support member (65), and the other detection member (9) is located at the bottom of the second guide block (47).

8. The automated equipment for wafer cutting according to claim 7, characterized in that: The support member (65) comprises an intermediate plate (651), a support shaft (652), a swing plate (653), a swing motor (654), a protective shell (655), a connecting gear (656), an arc plate (657), a tooth block (658) and a side plate (659); the intermediate plate (651) is fixedly mounted on the top of the first guide block (46); the support shaft (652) passes through the intermediate plate (651), and the support shaft (652) is rotatably connected to the intermediate plate (651); the swing motor (654) is fixedly mounted on the intermediate plate (651), and the swing motor (654) is used to drive the support shaft (652); the protective shell (655) is mounted on the intermediate plate (651), and the protective shell (655) is used to protect the swing motor (654); The other end of the support shaft (652) is fixedly connected to the swing plate (653), the straight tube (63) passes through the other end of the swing plate (653), and the straight tube (63) is rotatably connected to the swing plate (653), one end of the fixed frame is fixedly connected to the straight tube (63), the connecting gear (656) is fixedly sleeved on the outside of the straight tube (63), one end of the arc plate (657) is fixedly connected to the side plate (659), and the side plate (659) is fixedly mounted on the first guide block (46), a plurality of tooth blocks (658) are provided, and the plurality of tooth blocks (658) are equidistantly distributed on the inner ring of the arc plate (657), and the connecting gear (656) is meshingly connected to the tooth block (658); One of the detection members (9) is mounted on the side plate (659).

9. The automated equipment for wafer cutting according to claim 8, characterized in that: The detection member (9) comprises a light scattering sensor (91), the light scattering sensor (91) located at the first guide block (46) being fixedly mounted on the side plate (659), and the light scattering sensor (91) located at the second guide block (47) being fixedly mounted on the bottom of the second guide block (47).

10. The automated equipment for wafer cutting according to claim 7, characterized in that: The suction member (7) comprises a negative pressure pump (71) and a liquid collecting shell (72); the liquid collecting shell (72) is mounted on the outside of the dicing machine body (1); the output end of the negative pressure pump (71) is connected to the liquid collecting shell (72); and the input end of the negative pressure pump (71) is connected to one end of the bottom of the transfer tube (68).

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