Method and system for establishing wafer test temperature environment

Abstract

The invention discloses a method and system for establishing a wafer test temperature environment, and the method comprises the steps: continuously calibrating two same wafers at the same standard environment temperature, and enabling the parameters of temperature sensors of internal chips of the wafers to be consistent; processing the first wafer into a standard wafer; packaging the second wafer; an oil tank is used for controlling the temperature of the probe station and providing a constant-temperature environment; placing a second wafer in the oil tank, and reading a second temperature value acquired by the second wafer; calculating a temperature compensation value based on the second temperature value and the self-test temperature value of the oil tank; placing the first wafer on a probe station, and calibrating the target test environment temperature based on the temperature compensation value; the error between the first temperature value acquired by the first wafer and the target test environment temperature is stabilized in a preset error range; and after calibration, wafer testing is carried out on the first wafer in the current temperature environment.

Description

Technical Field

[0001] The present application relates to the field of wafer testing, and in particular, to a method and system for establishing a wafer testing temperature environment. Background Art

[0002] Wafer testing needs to be performed in a precisely controlled temperature environment to ensure the authenticity and reliability of the test data. The uniformity and stability of temperature not only affects the mechanical stability of the probe station, but is also the key to the true results of the test data. Through the oil tank, different temperature environments can be simulated to test the performance of the device under different working conditions. However, the constant temperature environment provided by the oil tank is limited. During the heat transfer process of the probe station, due to heat conduction loss or various other factors, the temperature provided by the oil tank cannot be fully transferred to the inside of the wafer to be tested. As a result, the actual temperature of the chip inside the wafer to be tested, that is, the wafer test environment temperature, is different from the temperature indicated by the oil tank. Summary of the invention

[0003] In order to solve the above technical problems, the present application provides a method and system for establishing a wafer test temperature environment, which can compensate for the error between the wafer test environment temperature and the temperature indicated by the oil tank. The accuracy of the temperature sensor is improved, and the impact of the temperature error on the wafer test is reduced. Specifically, the technical solution of the present application is as follows:

[0004] In a first aspect, the present application discloses a method for establishing a wafer test temperature environment, comprising the following steps:

[0005] Under the same standard ambient temperature, two identical wafers are calibrated continuously to make the parameters of the temperature sensors of their internal chips consistent; the first wafer is processed as a standard wafer; and the second wafer is packaged;

[0006] Use oil bath to control the temperature of the probe station and provide a constant temperature environment;

[0007] Placing the second wafer in the oil tank, reading a second temperature value collected by the second wafer; and calculating a temperature compensation value based on the second temperature value and a self-measured temperature value of the oil tank;

[0008] Placing the first wafer on the probe station, and calibrating the target test environment temperature based on the temperature compensation value; stabilizing the error between the first temperature value collected by the first wafer and the target test environment temperature within a preset error range;

[0009] After calibration, wafer testing is performed on the first wafer in the current temperature environment.

[0010] In some embodiments, placing the first wafer on the probe station, calibrating the target test environment temperature based on the temperature compensation value, and stabilizing the error between the first temperature value collected by the first wafer and the target test environment temperature within a preset error range comprises the following steps:

[0011] Adjusting the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature;

[0012] The first wafer is placed on a probe station, and after the temperature is stabilized, several detection points are selected for spot measurement, and the first temperature value collected by the first wafer is read and calculated;

[0013] Calculate the sum of the target test environment temperature and the temperature compensation value; and compare the sum with the first temperature value to determine whether the error is less than the preset error range; if so, the calibration is completed.

[0014] In some embodiments, the method for establishing a wafer test temperature environment further includes:

[0015] If the error is less than the preset error range, a calibrated label is added to the first wafer; if the error is not less than the preset error range, the target test environment temperature is reset and spot measurement is performed.

[0016] In some embodiments, the step of adjusting the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature comprises the following steps:

[0017] The temperature sensor is calibrated by adjusting the parameters of the temperature sensor to match the target test environment temperature.

[0018] In some embodiments, placing the first wafer on a probe station, selecting a number of detection points for spot measurement after the temperature is stabilized, and reading and calculating the first temperature value collected by the first wafer comprises the following steps:

[0019] A plurality of detection points are uniformly selected at the center and edge of the first wafer; one of the detection points is a chip in the wafer;

[0020] Place a probe at each selected chip to establish a connection between the probe and the chip, and read the temperature value measured by the chip;

[0021] An average value of the temperature values ​​measured by each selected chip is calculated, and the average value is used as the first temperature value.

[0022] In a second aspect, the present application further discloses a system for establishing a wafer test temperature environment, comprising:

[0023] The calibration module is used to continuously calibrate two identical wafers at the same standard ambient temperature to make the parameters of the temperature sensors of their internal chips consistent;

[0024] A packaging module, used to process the first wafer into a standard wafer; and also used to package the second wafer;

[0025] Use a constant temperature oil bath to control the temperature of the probe station and provide a constant temperature environment;

[0026] A temperature measurement module is used to place the second wafer in an oil tank, read a second temperature value collected by the second wafer; and calculate a temperature compensation value based on the second temperature value and a self-measured temperature value of the oil tank;

[0027] A calibration module is used to place the first wafer on the probe station and calibrate the target test environment temperature based on the temperature compensation value; so that the error between the first temperature value collected by the first wafer and the target test environment temperature is stabilized within a preset error range;

[0028] The testing module performs wafer testing on the first wafer in the current temperature environment after calibration.

[0029] In some embodiments, the calibration module is further used to adjust the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature;

[0030] The temperature measurement module is further used to place the first wafer on a probe station, select a number of detection points for spot measurement after the temperature is stable, and read and calculate the first temperature value collected by the first wafer;

[0031] The calibration module is also used to calculate the sum of the target test environment temperature and the temperature compensation value; and compare the sum with the first temperature value to determine whether the error is less than the preset error range; if so, the calibration is completed.

[0032] In some embodiments, the calibration module is further used to add a calibrated label to the first wafer if the error is less than the preset error range; if the error is not less than the preset error range, reset the target test environment temperature, and perform spot measurement by the temperature measurement module.

[0033] In some implementations, the calibration module is specifically used to calibrate the temperature sensor by adjusting parameters of the temperature sensor to match the target test environment temperature.

[0034] In some embodiments, the temperature measurement module is specifically used to evenly select a number of detection points at the center and edge positions of the first wafer; one detection point is a chip in the wafer; a probe is placed at each selected chip to establish a connection between the probe and the chip, and the temperature value measured by the chip is read; the average of the temperature values ​​measured by each selected chip is calculated, and the average is used as the first temperature value.

[0035] Compared with the prior art, the present invention has at least one of the following beneficial effects:

[0036] The method of establishing a wafer test temperature environment by this application can compensate for the temperature error between the wafer test environment and the laboratory oil tank. The finished packaged product is verified by the laboratory oil tank, and the error between the temperature reading of the chip in the oil tank environment and the temperature provided by the oil tank itself is greatly reduced. Provide a real and reliable temperature environment for wafer testing. The environment calibration steps of this application are simple, have little impact on the test cost, and are easy to promote. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The preferred implementation scheme will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present application.

[0038] Figure 1 A flowchart of the steps of an embodiment of a method for establishing a wafer test temperature environment according to the present application;

[0039] Figure 2 This is a structural block diagram of an embodiment of another system for establishing a wafer test temperature environment according to the present application. DETAILED DESCRIPTION

[0040] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0041] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections.

[0042] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0043] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0044] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In a specific implementation, the terminal device described in the embodiments of the present application includes, but is not limited to, other portable devices such as mobile phones, laptop computers, tutoring machines, or tablet computers with touch-sensitive surfaces (e.g., touch screen displays and / or touch pads). It should also be understood that in some embodiments, the terminal device is not a portable communication device, but a desktop computer with a touch-sensitive surface (e.g., touch screen displays and / or touch pads).

[0046] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0047] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0048] As a key device for wafer testing, the probe station works by precisely aligning the probes of the probe station with the PAD points on the device under test, communicating the stimulus signals output by the tester and providing signal feedback, and finally completing the acquisition of test data. The CHUCK is an important part of the probe station. The CHUCK is the part of the probe station used to fix and support the wafer, ensuring that the wafer remains stable during the test process.

[0049] Wafer testing, also known as Chip Probing or CP testing, is an important part of the semiconductor manufacturing process. It is located between wafer manufacturing and packaging. Its main purpose is to test each bare DIE (unpackaged chip) in the entire wafer to ensure that they basically meet the characteristics or design specifications of the device. Wafer testing needs to be performed in a precisely controlled temperature environment to ensure the authenticity and reliability of the test data. The uniformity and stability of temperature not only affects the mechanical stability of the probe station, but is also the key to affecting the true results of the test data.

[0050] An oil bath, also known as an oil bath or a constant temperature oil bath, is a device used to provide a stable temperature environment. It is widely used in laboratories, industrial production and scientific research to keep samples, chemical reactions, material testing, etc. at a constant temperature. The oil bath is able to control the temperature of the oil through a built-in heater and cooling system. Due to the large specific heat capacity of oil, the oil bath can provide good thermal stability, making the temperature change slow and uniform. Through the oil bath, different temperature environments can be simulated to test the performance of the device under different working conditions.

[0051] However, the constant temperature environment range provided by the oil tank is limited. During the heat transfer process of the probe station, due to heat conduction loss or other factors, the temperature provided by the oil tank cannot be completely transferred to the inside of the wafer to be tested. As a result, the actual temperature of the chip inside the wafer to be tested, that is, the wafer test environment temperature, is different from the temperature indicated by the oil tank.

[0052] The existing method of calibrating the wafer test temperature environment mainly relies on the use of thermocouple temperature measuring instruments to measure the temperature of the probe station as the standard of the wafer test environment temperature. The working principle of the thermocouple thermometer is based on the Seebeck effect, that is, when two conductors of different materials (called hot electrodes) form a closed loop and there is a temperature gradient at both ends, a current will be generated in the loop, and there will be an electromotive force and thermoelectric electromotive force between the two ends. The end with a higher temperature is called the working end (hot end), and the end with a lower temperature is called the free end (cold end). When measuring the ambient temperature of the probe station, the working end (hot end) of the thermocouple is placed near the stage or in direct contact to sense the actual temperature of the probe station. The cold end (free end) is connected to the measuring device and maintained at 0°C. The thermocouple thermometer determines the ambient temperature of the probe station by measuring the thermoelectric potential difference between the two ends of the thermocouple, that is, the temperature difference between the hot end and the cold end. If the temperature of the cold end changes, it needs to be recalculated to compensate for the impact of temperature changes on the measurement results. However, the cold end of the thermocouple may be affected by the ambient temperature. In practical applications, the error between the temperature measured by this method and the ambient temperature of the oil tank is between ±0.75 and 1.25°C. This still cannot overcome the technical problem that there is an error between the ambient temperature of the wafer test and the temperature indicated by the oil tank.

[0053] The present application provides a method for establishing a wafer test temperature environment, which can compensate for the error between the wafer test environment temperature and the temperature indicated by the oil tank, improve the accuracy of oil tank temperature calibration, and reduce the impact of temperature error on wafer testing.

[0054] Reference Manual Attached Figure 1 An embodiment of a method for establishing a wafer test temperature environment provided by the present application includes the following steps:

[0055] S100, under the same standard ambient temperature, continuously calibrate two identical wafers so that the parameters of the temperature sensors of the internal chips are consistent. The first wafer is processed as a standard wafer. The second wafer is packaged.

[0056] Specifically, two identical wafers refer to two wafers of the same model. More preferably, two identical wafers refer to two wafers of the same production batch and adjacent numbers. The purpose of calibrating two identical wafers is to ensure the consistency of the wafers.

[0057] The parameters of the temperature sensor include the accuracy, response time, linearity, stability and other parameters with temperature sensing characteristics. More preferably, the parameters also include the chip's analog-to-digital converter (ADC) parameters to ensure that the ADC can correctly read the analog signal of the temperature sensor. This includes setting the ADC's operating mode, sampling time, conversion mode, etc. to make its temperature adjustment consistent.

[0058] After calibration, one of the two wafers is reserved as a standard wafer (Golden Wafer). In the field of wafer testing, a standard wafer refers to a dedicated wafer used to calibrate and verify the performance of a wafer inspection system (SSIS). They usually contain particles or patterns of a specific size to ensure the dimensional accuracy and scanning uniformity of the inspection system.

[0059] The second wafer is packaged to create a test environment. The packaging protects the wafer from environmental hazards. The packaging process includes adding connection points or leads that allow the wafer to interact with the rest of the electronic system and bridge the gap between the internal and external circuits of the chip.

[0060] S200, uses an oil bath to control the temperature of the probe station and provide a constant temperature environment.

[0061] Specifically, the oil tank mainly provides a constant temperature environment in wafer testing to ensure the temperature stability during the test. The oil tank can be of the bottom stirring type, top stirring type, split circulation type, and jet type. The stirring device of the bottom stirring constant temperature tank is located at the bottom of the constant temperature tank, and the stirring is achieved by the rotation of the magnet driven by the motor.

[0062] In the actual wafer test setup, the probe station is usually placed above or next to the oil tank. The oil tank is responsible for providing a constant temperature environment, while the probe station is responsible for the precise positioning and testing of the wafer. The probe station's carrier (CHUCK) may be connected to the oil tank to use the constant temperature environment provided by the oil tank to control the temperature of the wafer and ensure the stability of the test conditions. In some embodiments, its carrier can be heated or cooled directly in the oil tank to achieve precise temperature control of the wafer.

[0063] S300, placing the second wafer in an oil tank, reading a second temperature value collected by the second wafer, and calculating a temperature compensation value based on the second temperature value and a self-measured temperature value of the oil tank.

[0064] Specifically, the second wafer (packaged finished product) is used to measure the chip temperature in the laboratory oil tank. After the oil tank temperature stabilizes, the internal temperature of the chip is read, which is recorded as A. The temperature of the oil tank at this time is B. The temperature compensation value is the difference between the second temperature value and the self-measured temperature value of the oil tank. That is, C = AB, C is the temperature value that needs to be compensated in the test environment. A is read by the temperature sensor in the second wafer. B is the temperature sensor that comes with the oil tank.

[0065] S400, placing the first wafer on the probe station, and calibrating the target test environment temperature based on the temperature compensation value; so that the error between the first temperature value collected by the first wafer and the target test environment temperature is stabilized within a preset error range.

[0066] Specifically, after obtaining the temperature compensation value C, the standard wafer setting (Golden Wafer Setup) test environment can be used. First, the temperature reading of the first wafer (Golden Wafer) is set to the target test environment temperature (TAGERT). After the test environment temperature stabilizes, select points at multiple positions on the Golden Wafer for point measurement, and measure the average of the chip temperature readings as the first temperature value. The first temperature value here is also the average calculated using the readings of the temperature sensor in the wafer chip.

[0067] S500: Perform wafer testing on the first wafer in the current temperature environment after calibration.

[0068] Specifically, the specific operation of wafer testing (CP testing) is to connect the exposed chip pins to the tester (Tester) through a probe (Probe) after the wafer is manufactured to perform chip testing. Wafer testing in a calibrated temperature environment can reduce the error between the temperature reading of the chip in the oil tank environment and the temperature provided by the oil tank itself. The temperature error of the packaged finished product can be controlled within the preset temperature error range. This improves the factory yield rate and reduces the cost of subsequent packaging and testing.

[0069] Another embodiment of the method for establishing a wafer test temperature environment in the present application is based on the above-mentioned embodiment of the method, and the step S400 specifically includes:

[0070] S410, adjusting the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature.

[0071] Specifically, the temperature sensor is calibrated, and the parameters of the temperature sensor are adjusted to match the target test environment temperature. More preferably, the target test environment temperature can be set based on the self-test temperature value of the oil tank.

[0072] S420, placing the first wafer on a probe station, selecting a number of detection points for spot measurement after the temperature is stabilized, and reading and calculating the first temperature value collected by the first wafer.

[0073] Specifically, in CP testing, spot testing refers to the action of a probe making a single contact with a test point (Pad) of a chip (Die) on a wafer during a wafer testing (Chip Probing) process.

[0074] The first temperature value is an average value of temperatures measured at a plurality of detection points.

[0075] Preferably, the number and positions of the selected detection points are set by the relevant technicians. More preferably, in order to ensure the accuracy of the mean calculation, it is necessary to pay attention to the uniform distribution of the positions of the lower probes when selecting the points. For example, one probe point is selected at each of the five positions of the top, bottom, left, right and center of the Golden Wafer.

[0076] S430, calculating the sum of the target test environment temperature and the temperature compensation value; and comparing the sum with the first temperature value to determine whether the error is less than the preset error range; if so, the calibration is completed.

[0077] Specifically, after the mean value is calculated, if the mean value is within the preset range, the calibration is completed, and the test can be started after the warm needle is completed. If it is not, the temperature setting and point measurement process need to be repeated.

[0078] Preferably, if the mean is within TAGERT+C±0.25°C, the calibration is completed. Wherein, TAGERT is the target test environment temperature. C is the temperature compensation value. 0.25 is the preset error range, that is, the allowable error. More preferably, the specific data of the preset error range is set by the technician. This application does not make specific limitations.

[0079] Another embodiment of the method for establishing a wafer test temperature environment of the present application, based on an embodiment of the above method, further includes: S440. If the error is less than the preset error range, add a calibrated label to the first wafer. S450, if the error is not less than the preset error range, return to step S300 to reset the target test environment temperature and perform spot measurement.

[0080] Specifically, after packaging the wafers with detection errors less than the preset error range, a PASS (test passed) label is added. The wafers that have passed the test are returned to the laboratory oil tank to verify whether the method of establishing a wafer test temperature environment in this application is effective. The final verification result is that the error is within ±0.25°C.

[0081] Another embodiment of the method for establishing a wafer test temperature environment in the present application, based on the above-mentioned embodiment of the method, step S420 includes the following sub-steps:

[0082] S421, evenly selecting a number of detection points at the center and edge of the first wafer. One of the detection points is a chip in the wafer.

[0083] S422, place a probe at each selected chip to establish a connection between the probe and the chip, and read a temperature value measured by the chip.

[0084] S423, calculating the average of the temperature values ​​measured by each of the selected chips, and taking the average as the first temperature value.

[0085] Specifically, after obtaining the temperature compensation value C, you can use the GOLDEN WAFER SETUP test environment. First, set up the test environment to TAGERT+C. After the test environment temperature stabilizes, test a TOUCHDOWN at each of the five positions of the GOLDEN WAFER, and measure the average of the chip temperature readings.

[0086] In the field of chip testing, "TOUCHDOWN" refers to the lowering of the probe. In this embodiment, testing a TOUCHDOWN means the action of the probe contacting the chip on the wafer during the wafer testing process. Specifically, "TOUCHDOWN" means that the probe station (Prober) lowers the probe to a specified position on the wafer so as to contact the contact point (Pad) or bump (Bump) of the chip to perform electrical testing. This process allows the tester (Tester) to send a test signal to the chip through the probe and receive a response signal from the chip to verify the function of the chip. The temperature compensation value is the difference between the second temperature value and the self-test temperature value of the oil tank.

[0087] Preferably, after selecting chips at multiple locations to obtain respective measured temperature data, other existing data processing methods may be used to select a representative value as the first temperature value, such as the median, mode, weighted average, etc. This embodiment is not specifically limited.

[0088] Based on the same technical concept, the present application also discloses a system for establishing a wafer test temperature environment, which can be used to implement any of the above methods for establishing a wafer test temperature environment. Specifically, an embodiment of a system for establishing a wafer test temperature environment of the present application is shown in the attached specification. Figure 2 As shown, including:

[0089] The calibration module is used to continuously calibrate two identical wafers at the same standard ambient temperature to make the parameters of the temperature sensors of their internal chips consistent.

[0090] The calibration module is used to continuously calibrate two identical wafers at the same standard ambient temperature to make the parameters of the temperature sensors of their internal chips consistent;

[0091] A packaging module, used to process the first wafer into a standard wafer; and also used to package the second wafer;

[0092] Use a constant temperature oil bath to control the temperature of the probe station and provide a constant temperature environment;

[0093] A temperature measurement module is used to place the second wafer in an oil tank, read a second temperature value collected by the second wafer; and calculate a temperature compensation value based on the second temperature value and a self-measured temperature value of the oil tank;

[0094] A calibration module is used to place the first wafer on the probe station and calibrate the target test environment temperature based on the temperature compensation value; so that the error between the first temperature value collected by the first wafer and the target test environment temperature is stabilized within a preset error range;

[0095] The testing module performs wafer testing on the first wafer in the current temperature environment after calibration.

[0096] Specifically, the temperature measurement module uses ATE test equipment, namely Automatic Test Equipment, to measure the temperature of the chip. The main structure of the ATE test equipment includes: Computer host (Host): used to control the test machine and communicate with the sorting machine. Main frame (Main Frame): used to store test instruments, integrated power supplies, test boards, etc. Test head (Test Head): built-in test board and test channel interface, and also docking probe station and sorting machine. Workstation (Workstation): for users to load / debug / execute test programs and store test results.

[0097] In one implementation of this embodiment, the calibration module is further used to adjust the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature.

[0098] The temperature measurement module is also used to place the first wafer on a probe station, select a number of detection points for spot measurement after the temperature is stable, and read and calculate the first temperature value collected by the first wafer.

[0099] The calibration module is also used to calculate the sum of the target test environment temperature and the temperature compensation value; and compare the sum with the first temperature value to determine whether the error is less than the preset error range; if so, the calibration is completed.

[0100] In another implementation of this embodiment, the temperature measurement module is specifically used to: uniformly select a number of detection points at the center and edge positions of the first wafer. One of the detection points is a chip in the wafer. A probe is placed at each selected chip to establish a connection between the probe and the chip, and the temperature value measured by the chip is read. The average of the temperature values ​​measured by each selected chip is calculated, and the average is used as the first temperature value. More preferably, a probe point is selected from each of the five positions in the top, bottom, left, and right of the first wafer (Golden Wafer) for point measurement.

[0101] The method of establishing a wafer test temperature environment in this application can compensate for the temperature error between the wafer test environment and the laboratory oil tank. The finished packaged product is verified by the laboratory oil tank, and the error between the chip temperature and the oil tank temperature in the oil tank environment is improved from ±0.75 to 1.25°C of the existing method to ±0.25°C. The calibration environment steps of this application are simple, have little impact on the test cost, and are easy to promote.

[0102] The present application provides another embodiment of a system for establishing a wafer test temperature environment. Based on the above system embodiment, in the system for establishing a wafer test temperature environment, the calibration module is further used to add a calibrated label to the first wafer if the error is less than the preset error range; if the error is not less than the preset error range, the target test environment temperature is reset, and the temperature measurement module is used to perform spot measurement.

[0103] In another embodiment of a system for establishing a wafer test temperature environment provided by the present application, based on the above system embodiment, the calibration module is specifically used to calibrate the temperature sensor by adjusting the parameters of the temperature sensor to match the target test environment temperature.

[0104] Optionally, adjust the chip's internal settings, which may involve configuring the chip's analog-to-digital converter (ADC) to ensure that it can correctly read the analog signal from the temperature sensor. The ADC reads the analog value of the channel connected to the temperature sensor and then converts this value into a digital value. Adjust the voltage of the temperature sensor and use a specific temperature conversion formula to convert the voltage value read by the ADC into the target temperature value.

[0105] The method and system for establishing a wafer test temperature environment of the present application have the same technical concept, and the technical details of the embodiments of the two are applicable to each other. In order to reduce repetition, they will not be repeated here.

[0106] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned program modules is used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different program modules as needed, that is, the internal structure of the device can be divided into different program units or modules to complete all or part of the functions described above. The program modules in the embodiment can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into a processing unit, and the above-mentioned integrated unit can be implemented in the form of hardware or in the form of software program units. In addition, the specific names of the program modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application.

[0107] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

Claims

1. A method for establishing a wafer test temperature environment, characterized in that: include: Under the same standard ambient temperature, two identical wafers are calibrated continuously to make the parameters of the temperature sensors in their internal chips consistent; Processing the first wafer into a standard wafer; packaging the second wafer; Use oil bath to control the temperature of the probe station and provide a constant temperature environment; Placing the second wafer in the oil tank, reading a second temperature value collected by the second wafer; and calculating a temperature compensation value based on the second temperature value and a self-measured temperature value of the oil tank; Placing the first wafer on the probe station, and calibrating the target test environment temperature based on the temperature compensation value; Stabilize the error between the first temperature value collected by the first wafer and the target test environment temperature within a preset error range; After calibration, wafer testing is performed on the first wafer in the current temperature environment.

2. A method for establishing a wafer test temperature environment as claimed in claim 1, characterized in that: The step of placing the first wafer on the probe station and calibrating the target test environment temperature based on the temperature compensation value; The method of stabilizing the error between the first temperature value collected by the first wafer and the target test environment temperature within a preset error range includes: Adjusting the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature; The first wafer is placed on a probe station, and after the temperature is stabilized, several detection points are selected for spot measurement, and the first temperature value collected by the first wafer is read and calculated; Calculate the sum of the target test environment temperature and the temperature compensation value; and compare the sum with the first temperature value to determine whether the error is less than the preset error range; if so, the calibration is completed.

3. A method for establishing a wafer test temperature environment as claimed in claim 2, characterized in that: Also includes: If the error is less than the preset error range, adding a calibrated label to the first wafer; If the error is not less than the preset error range, the target test environment temperature is reset and a spot test is performed.

4. A method for establishing a wafer test temperature environment as claimed in claim 2, characterized in that: The step of adjusting the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature comprises: The temperature sensor is calibrated by adjusting the parameters of the temperature sensor to match the target test environment temperature.

5. A method for establishing a wafer test temperature environment as claimed in claim 2, characterized in that: The method of placing the first wafer on a probe station, selecting a plurality of detection points for spot measurement after the temperature is stabilized, and reading and calculating the first temperature value collected by the first wafer comprises: A plurality of detection points are uniformly selected at the center and edge of the first wafer; one of the detection points is a chip in the wafer; Place a probe at each selected chip to establish a connection between the probe and the chip, and read the temperature value measured by the chip; An average value of the temperature values ​​measured by each selected chip is calculated, and the average value is used as the first temperature value.

6. A system for establishing a wafer test temperature environment, characterized in that: include: The calibration module is used to continuously calibrate two identical wafers at the same standard ambient temperature to make the parameters of the temperature sensors of their internal chips consistent; A packaging module, used to process the first wafer into a standard wafer; and also used to package the second wafer; Use a constant temperature oil bath to control the temperature of the probe station and provide a constant temperature environment; A temperature measurement module, used for placing the second wafer in the oil tank and reading a second temperature value collected by the second wafer; Calculating a temperature compensation value based on the second temperature value and the self-measured temperature value of the oil tank; A calibration module, used for placing the first wafer on the probe station and calibrating a target test environment temperature based on the temperature compensation value; Stabilize the error between the first temperature value collected by the first wafer and the target test environment temperature within a preset error range; The testing module performs wafer testing on the first wafer in the current temperature environment after calibration.

7. A system for establishing a wafer test temperature environment as claimed in claim 6, characterized in that: The calibration module is further used to adjust the chip configuration of the first wafer so that the temperature sensor of the internal chip thereof displays the target test environment temperature; The temperature measurement module is further used to place the first wafer on a probe station, select a number of detection points for spot measurement after the temperature is stable, and read and calculate the first temperature value collected by the first wafer; The calibration module is further used to calculate the sum of the target test environment temperature and the temperature compensation value; and compare the sum with the first temperature value to determine whether the error is less than the preset error range; If yes, the calibration is complete.

8. A system for establishing a wafer test temperature environment as claimed in claim 7, characterized in that: The calibration module is also used to add a calibrated label to the first wafer if the error is less than the preset error range; if the error is not less than the preset error range, reset the target test environment temperature and perform spot measurement by the temperature measurement module.

9. A system for establishing a wafer test temperature environment as claimed in claim 7, characterized in that: The calibration module is specifically used to calibrate the temperature sensor by adjusting the parameters of the temperature sensor to match the target test environment temperature.

10. The system for establishing a wafer test temperature environment as claimed in claim 7, characterized in that: The temperature measurement module is specifically used to uniformly select a number of detection points at the center and edge positions of the first wafer; one detection point is a chip in the wafer; a probe is placed at each selected chip to establish a connection between the probe and the chip, and the temperature value measured by the chip is read; the average of the temperature values ​​measured by each selected chip is calculated, and the average is used as the first temperature value.

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