Immersion server and immersion liquid cooling system

Abstract

The present disclosure relates to the field of refrigeration technology, and discloses an immersion server and an immersion liquid cooling system. The immersion server comprises an immersion chamber, a heat exchange device, a first joint and a second joint. The immersion chamber is internally provided with a server mainboard, and the server mainboard is provided with a target processing unit. The heat exchange device is in contact with the target processing unit, and is used for heat exchange with the target processing unit. The first joint is used for connecting the immersion chamber and a refrigeration system. The second joint is used for connecting the heat exchange device and the refrigeration system. The immersion liquid cooling system comprises a server rack and a refrigeration system. The server rack is provided with at least one mounting slot, and the mounting slot is used for mounting the immersion server. The refrigeration system is used for providing a cooled first fluid for the immersion chamber of the immersion server, and providing a cooled second fluid for the heat exchange device of the immersion server. The present disclosure can solve the problem of poor heat dissipation effect of the immersion liquid cooling system when the heat flow density of the server is extremely high.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of refrigeration, in particular to an immersion server and an immersion liquid cooling system. BACKGROUND

[0002] At present, the immersion liquid cooling system is to immerse the server mainboard in a closed cavity filled with refrigerant. When the server is running, the refrigerant in the cavity exchanges heat with each component of the server. The high-temperature refrigerant after heat exchange is pumped out and sent to the plate heat exchanger. After heat exchange with the cold water supplied by the outdoor cooling tower, it is returned to the cavity again. However, this immersion liquid cooling system uses natural convection of refrigerant for heat exchange, and the heat exchange capacity is limited, resulting in poor heat dissipation effect of the immersion liquid cooling system when the heat flux density of the server is too high. SUMMARY

[0003] Therefore, the present disclosure provides an immersion server and an immersion liquid cooling system to solve the problem of poor heat dissipation effect of the immersion liquid cooling system when the heat flux density of the server is too high.

[0004] In a first aspect, the present disclosure provides an immersion server, which comprises:

[0005] an immersion chamber, wherein a server mainboard is arranged in the immersion chamber, and a target processing unit is arranged on the server mainboard;

[0006] a heat exchange device, which is in contact with the target processing unit, and is used for heat exchange with the target processing unit;

[0007] a first joint, which is used for connecting the immersion chamber and a refrigeration system, and the refrigeration system is used for providing a first fluid for cooling the immersion chamber;

[0008] a second joint, which is used for connecting the heat exchange device and the refrigeration system, and the refrigeration system is also used for providing a second fluid for cooling the heat exchange device.

[0009] In a second aspect, the present disclosure provides an immersion liquid cooling system, which comprises:

[0010] a server rack, wherein at least one installation slot is arranged on the server rack, and the installation slot is used for installing the above-mentioned immersion server;

[0011] a refrigeration system, which is connected to the first joint and the second joint of the immersion server, and is used for providing the first fluid for cooling the immersion chamber of the immersion server, and providing the second fluid for cooling the heat exchange device of the immersion server.

[0012] The immersion server and the immersion liquid cooling system provided by the embodiments of the present disclosure are sealed by the immersion chamber, and the heat exchange device is arranged to contact the target processing unit on the server mainboard. Meanwhile, the immersion server is provided with a first joint and a second joint. The first joint is used to connect the immersion chamber and the refrigeration system to provide the first fluid for the immersion chamber. The second joint is used to connect the heat exchange device and the refrigeration system to provide the second fluid for the heat exchange device. Therefore, the cooling fluid output by the refrigeration system can be divided into two paths to enter the immersion server, one path enters the immersion chamber to provide the cold energy for each component on the server mainboard, and the other path enters the heat exchange device to provide the cold energy for the target processing unit. The first fluid flowing through the immersion chamber can be returned to the refrigeration system through the first joint to be cooled for the next round of refrigeration after absorbing the heat of each component. The second fluid flowing through the heat exchange device can also be returned to the refrigeration system through the second joint or an open structure through the immersion chamber to be cooled for the next round of refrigeration after absorbing the heat of the target component, so as to complete the heat dissipation cycle. Therefore, the target processing unit can be immersed in the first fluid to exchange heat with the cooled first fluid, and can also exchange heat with the heat exchange device, so as to effectively absorb the heat generated by the target processing unit. Moreover, the heat exchange device is also immersed in the first fluid, which helps to improve the heat exchange efficiency of the heat exchange device, so as to realize effective cooling of the immersion server when the heat flux density of the immersion server is very high, and achieve a better heat dissipation effect. In addition, the immersion server is sealed, so that multiple immersion servers can be placed in the form of a server rack to fully utilize the height space of the data center room and improve the power density per unit area of the room. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the specific embodiments of the present disclosure or the prior art, the drawings needed to be used in the specific embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0014] Figure 1 is a structural schematic diagram of an immersion liquid cooling system in the related art;

[0015] Figure 2 is a schematic diagram of immersion cooling in the related art;

[0016] Figure 3 is a structural schematic diagram of an immersion server according to an embodiment of the present disclosure;

[0017] Figure 4 is a structural schematic diagram of a first immersion liquid cooling system according to an embodiment of the present disclosure;

[0018] Figure 5 is a structural schematic diagram of another immersion server according to an embodiment of the present disclosure;

[0019] Figure 6 is a structural schematic diagram of a second immersion liquid cooling system according to an embodiment of the present disclosure;

[0020] Figure 7 is a structural schematic diagram of a third immersion liquid cooling system according to an embodiment of the present disclosure;

[0021] Figure 8 is a front view schematic diagram of a server rack according to an embodiment of the present disclosure;

[0022] Figure 9 is a back view schematic diagram of a server rack according to an embodiment of the present disclosure;

[0023] Figure 10 is a back view schematic diagram of another server rack according to an embodiment of the present disclosure.

[0024] its reference signs are as follows: 1, immersion server; 11, immersion chamber; 12, heat exchange device; 13, first joint; 14, second joint; 15, server mainboard; 2, refrigeration system; 21, first distribution unit; 211, first heat exchange subunit; 212, first circulation subunit; 213, first filtration subunit; 22, second distribution unit; 221, second heat exchange subunit; 222, second circulation subunit; 223, second filtration subunit; 23, refrigeration device; 3, server rack; 31, third joint; 32, fourth joint; 33, main liquid distributor; 331, first liquid distributor; 332, second liquid distributor; 34, main liquid collector; 341, first liquid collector; 342, second liquid collector. DETAILED DESCRIPTION

[0025] To make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present disclosure.

[0026] With the increasing energy consumption of data centers and the increasing power density of chips, the power density of a single cabinet of a general server is greatly improved. The traditional air cooling method is not capable of dealing with high-power density servers, and is difficult to achieve all-year natural cooling due to the influence of local meteorological conditions of the data center.

[0027] Under the dual pressures of energy shortage and rising energy costs, data centers not only need to ensure high-performance computing, but also need to reduce the cooling and heat dissipation energy consumption of servers and the PUE (Power Usage Effectiveness) index for evaluating the energy efficiency of data centers, in order to save energy, reduce energy consumption, and reduce carbon emissions.

[0028] Under this background, immersion cooling is widely used in server cooling. Immersion cooling completely immerses the mainboard, CPU, memory and other high-heat components of the server in refrigerant, and uses the temperature difference or phase change of the liquid to transfer heat, so as to achieve the purpose of cooling the server.

[0029] Compared with air cooling, immersion cooling has the following advantages: first, the refrigerant directly contacts the heat-generating components without contact thermal resistance, and the cooling effect is better. Second, the specific heat capacity of liquid is higher than that of air, and the heat transfer per unit volume is as high as thousands of times, so the heat transfer efficiency is high, and high heat flux density cooling can be achieved. Third, immersion cooling can solve the cooling problem of all components of the server at one time. Fourth, under suitable immersion conditions, the CPU and other electronic components are not affected by external temperature, humidity, air quality, etc., and the temperature is constant, which can effectively improve the reliability and service life of electronic components. Fifth, immersion cooling can use the cold water of an outdoor cooling tower for cooling, which is energy-efficient, so it can achieve all-year natural cooling in any area, and the PUE can reach about 1.1. Sixth, the refrigerant used in immersion cooling is an insulating refrigerant, and even if it leaks, it will not cause a short circuit of the server. Seventh, immersion cooling needs to be equipped with additional fans, heat sinks, etc., which can greatly reduce the noise of the data center room and achieve the effect of silent room. Eighth, immersion liquid cooling does not need a cooling machine, a precision air conditioner in the room, under-floor air supply, and cold and hot channel isolation, etc., which simplifies the structure of the room and reduces the construction difficulty and engineering quantity of the room.

[0030] In the related art, for example, Figure 1As shown, the immersion liquid cooling system using immersion cooling is to immerse the server mainboard in the immersion tank filled with refrigerant. When the server is running, the refrigerant in the tank exchanges heat with each component of the server. The high-temperature refrigerant after heat exchange is pumped out and sent to the plate heat exchanger. After heat exchange with the cold water supplied by the outdoor cooling tower, the temperature of the refrigerant is reduced. The cooled refrigerant is filtered by the filter and then flows back to the immersion tank. The pump, plate heat exchanger, filter, and related pipeline sensors, valves, and other accessories are integrated into a cooling dispensing unit (CDU).

[0031] As shown in the related art, Figure 2 The cooling dispensing unit is integrated with the immersion tank, and the cooling dispensing unit is provided with a power supply interface, a weak current circuit interface, and water supply and return pipes for liquid supply and return. When maintenance is needed, the upper cover of the immersion tank needs to be opened, and the server mainboard needs to be vertically plugged in for maintenance. Therefore, the immersion tank usually adopts a horizontal structure and is placed flat on the ground. This results in a larger floor area of the immersion tank than the cabinet using air cooling, and the height space cannot be fully utilized. When the power density of the server is high, the power density per square meter of the server is higher than that of air cooling. However, when the power density of the server is low, the power density per square meter of the server room using the immersion liquid cooling system in the related art is the same as or even lower than that of the server room using air cooling, which is contrary to the original intention of improving the power density of the server room.

[0032] Moreover, in the immersion liquid cooling system in the related art, the refrigerant flows to the central processing unit of the server mainboard from the bottom liquid distributor and uses natural convection heat exchange, which has limited heat exchange capacity and poor heat dissipation effect when the heat flux density of the server is high.

[0033] In addition, in other related technologies, a liquid cooling and air cooling combined heat dissipation method is also proposed. However, in this heat dissipation method, only the chips and part of the components of the cold plate server use liquid cooling, and the other components of the server need to use air cooling. Therefore, two sets of heat dissipation systems, air cooling and liquid cooling, are needed, and natural cooling cannot be achieved.

[0034] Therefore, according to the embodiments of the present disclosure, an immersion server is provided. As shown in the Figure 3 The immersion server 1 includes an immersion chamber 11, a heat exchange device 12, a first joint 13, and a second joint 14. The immersion chamber 11 is provided with a server mainboard 15, and the server mainboard 15 is provided with a target processing unit. The heat exchange device 12 is in contact with the target processing unit, and the heat exchange device 12 is used for heat exchange with the target processing unit. As shown in the Figure 4As shown, the first joint 13 is used to connect the immersion chamber 11 and the refrigeration system 2, and the refrigeration system 2 is used to provide the first fluid for the immersion chamber 11. The second joint 14 is used to connect the heat exchange device 12 and the refrigeration system 2, and the refrigeration system 2 is also used to provide the second fluid for the heat exchange device 12.

[0035] It should be noted that the server mainboard 15 is provided with a plurality of components, and the target processing unit is a component on the server mainboard 15 to be cooled. For example, the target processing unit is a component on the server mainboard 15 with the highest heat, a component with heat exceeding a preset heat threshold, a component with the highest power density, or a component with a power density exceeding a preset power threshold.

[0036] Optionally, the target processing unit is a chip.

[0037] The heat exchange device 12 is arranged above the target processing unit, or the heat exchange device 12 is arranged below the target processing unit. The position of the heat exchange device 12 can be adjusted according to actual conditions, and the installation position of the heat exchange device 12 needs to ensure that the heat exchange device 12 can effectively exchange heat with the target processing unit. If there are multiple target processing units, a corresponding heat exchange device 12 can be provided for each target processing unit, and the heat exchange devices 12 can be connected in series or in parallel.

[0038] For example, the fluid inlet of the first heat exchange device 12 is connected with the second joint 14, the fluid outlet of the first heat exchange device 12 is connected with the fluid inlet of the second heat exchange device 12, and so on, the fluid outlet of the n-1th heat exchange device 12 is connected with the fluid inlet of the nth heat exchange device 12, and the fluid outlet of the nth heat exchange device 12 is connected with the second joint 14, thereby forming a second fluid circuit with the refrigeration system 2. Wherein, n is the total number of heat exchange devices 12. Alternatively, the fluid inlet and the fluid outlet of each heat exchange device 12 are connected with the second joint 14, thereby forming a second fluid circuit with the refrigeration system 2. In addition, the connection mode between the heat exchange devices 12 can also be adjusted according to actual conditions, which is not limited herein.

[0039] It should be noted that the first fluid and the second fluid are insulating liquids. The first fluid and the second fluid can use the same insulating liquid, or different insulating liquids.

[0040] The immersion server provided by the embodiment is used for individually sealing the server mainboard 15 by the immersion chamber 11, and is configured with the heat exchange device 12 in contact with the target processing unit on the server mainboard 15. In the immersion server 1, the first joint 13 and the second joint 14 are further arranged. The first joint 13 is used for connecting the immersion chamber 11 and the refrigeration system 2, so as to provide the first fluid cooled by the refrigeration system 2 for the immersion chamber 11. The second joint 14 is used for connecting the heat exchange device 12 and the refrigeration system 2, so as to provide the second fluid cooled by the refrigeration system 2 for the heat exchange device 12. Therefore, the cooling fluid output by the refrigeration system 2 can be divided into two paths to enter the immersion server 1, one path enters the immersion chamber 11 to provide the cold quantity for each component on the server mainboard 15, and the other path enters the heat exchange device 12 to provide the cold quantity for the target processing unit. After absorbing the heat of each component, the first fluid flowing through the immersion chamber 11 can return to the refrigeration system 2 through the first joint 13 to be cooled again to enter the next round of refrigeration. Meanwhile, after absorbing the heat of the target component, the second fluid flowing through the heat exchange device 12 can return to the refrigeration system 2 through the second joint 14 or an open structure through the immersion chamber 11 to be cooled again to enter the next round of refrigeration, so as to complete the heat dissipation cycle. In this way, the target processing unit can not only be immersed in the first fluid to exchange heat with the cooled first fluid, but also exchange heat with the heat exchange device 12, so as to effectively absorb the heat generated by the target processing unit. Meanwhile, the heat exchange device 12 is also immersed in the first fluid, which helps to improve the heat exchange efficiency of the heat exchange device 12, so as to realize effective cooling of the immersion server 1 when the heat flux density of the immersion server 1 is very high, and achieve a better heat dissipation effect.

[0041] In some optional embodiments, as shown in Figure 4 The first joint 13 includes a first flow supply interface and a first flow return interface. One end of the first flow supply interface is connected with the fluid inlet of the immersion chamber 11, and the other end of the first flow supply interface is used for being connected with the fluid outlet of the refrigeration system 2. One end of the first flow return interface is connected with the fluid outlet of the immersion chamber 11, and the other end of the first flow return interface is used for being connected with the fluid inlet of the refrigeration system 2.

[0042] In some optional embodiments, as shown in Figure 3 and Figure 4 When the first fluid and the second fluid are of the same type, the fluid inlet of the heat exchange device 12 is connected with the second joint 14, and the fluid outlet of the heat exchange device 12 is connected with the immersion chamber 11.

[0043] Further, in the case that the fluid outlet of the heat exchange device 12 is connected to the immersion chamber 11, the second joint 14 only includes a second flow supply interface. One end of the second flow supply interface is connected to the fluid inlet of the heat exchange device 12, and the other end of the second flow supply interface is used to be connected to the fluid outlet of the refrigeration system 2.

[0044] Exemplarily, in the case that the first fluid and the second fluid are the same type of fluorinated liquid, since the fluid types of the first fluid and the second fluid are the same, the first fluid and the second fluid can be mixed, and thus the fluid outlet of the heat exchange device 12 can be connected to the immersion chamber 11, and the fluid in the immersion chamber 11 can be returned to the refrigeration system 2 only through the first return flow interface in the first joint 13.

[0045] Optionally, the heat exchange device 12 is an open cold plate, or other heat exchange device with cooling channels exposed to the outside.

[0046] In other optional embodiments, as shown in Figure 5 the second joint 14 includes a second flow supply interface and a second return flow interface. One end of the second flow supply interface is connected to the fluid inlet of the heat exchange device 12, and the other end of the second flow supply interface is used to be connected to the fluid outlet of the refrigeration system 2. One end of the second return flow interface is connected to the fluid outlet of the heat exchange device 12, and the other end of the second return flow interface is used to be connected to the fluid inlet of the refrigeration system 2.

[0047] Exemplarily, as shown in Figure 6 the fluid inlet of the heat exchange device 12 is connected to the second flow supply interface of the second joint 14, and the fluid outlet of the heat exchange device 12 is connected to the second return flow interface of the second joint 14, thereby forming a second fluid return circuit with the refrigeration system 2.

[0048] In some optional embodiments, in the case that the fluid types of the first fluid and the second fluid are the same, as shown in Figure 6 the refrigeration system 2 can only include a first distribution unit 21, and the first distribution unit 21 is connected to the first joint 13 and the second joint 14 respectively. The first distribution unit 21 provides the immersion chamber 11 and the heat exchange device 12 with cooled first fluid and second fluid respectively.

[0049] In other optional embodiments, as shown in Figure 7 the refrigeration system 2 includes a first distribution unit 21 and a second distribution unit 22. The first joint 13 is used to connect the immersion chamber 11 and the first distribution unit 21. The second joint 14 is used to connect the heat exchange device 12 and the second distribution unit 22.

[0050] It should be noted that the first distribution unit 21 and the second distribution unit 22 are cold distribution units. The first fluid and the second fluid provided by the first distribution unit 21 and the second distribution unit 22 can be the same kind of fluid or different kinds of fluid. In addition, the supply liquid temperature of the first distribution unit 21 and the supply liquid temperature of the second distribution unit 22 can be the same or different. That is, the temperature of the first fluid and the temperature of the second fluid can be the same or different. If the heat flux density of the target processing unit is very high, the temperature of the second fluid provided by the second distribution unit 22 can be lower than the temperature of the first fluid provided by the first distribution unit 21, thereby solving the heat dissipation problem of the target processing unit.

[0051] The immersion server provided by the embodiment can be used in the case where the refrigeration system 2 includes the first distribution unit 21 and the second distribution unit 22. The first joint 13 is used to connect the immersion chamber 11 and the first distribution unit 21, and the second joint 14 is used to connect the heat exchange device 12 and the second distribution unit 22. Therefore, different kinds of fluid can be provided for the heat exchange device 12 and the immersion chamber 11 by using the first distribution unit 21 and the second distribution unit 22 according to the requirements and the difference of the contact materials, so as to be suitable for more application scenarios.

[0052] Further, as shown in Figure 7 One end of the first supply flow interface of the first joint 13 is connected with the fluid inlet of the immersion chamber 11, and the other end of the first supply flow interface is used to communicate with the fluid outlet of the first distribution unit 21. One end of the first return flow interface of the first joint 13 is connected with the fluid outlet of the immersion chamber 11, and the other end of the first return flow interface is used to communicate with the fluid inlet of the first distribution unit 21.

[0053] It can be understood that the first supply flow interface is used to provide the first fluid output by the first distribution unit 21 to the immersion chamber 11, and the first return flow interface is used to guide the first fluid in the immersion chamber 11 after absorbing heat to the first distribution unit 21, so as to cool the first fluid in the first distribution unit 21.

[0054] The immersion server provided by the embodiment can be used in the case where the refrigeration system 2 includes the first distribution unit 21 and the second distribution unit 22. The first joint 13 is used to connect the immersion chamber 11 and the first distribution unit 21, and the second joint 14 is used to connect the heat exchange device 12 and the second distribution unit 22. Therefore, different kinds of fluid can be provided for the heat exchange device 12 and the immersion chamber 11 by using the first distribution unit 21 and the second distribution unit 22 according to the requirements and the difference of the contact materials, so as to be suitable for more application scenarios.

[0055] Further, one end of the second flow supply interface of the second joint 14 is connected with the fluid inlet of the heat exchange device 12, and the other end of the second flow supply interface is used to communicate with the fluid outlet of the second distribution unit 22. One end of the second flow return interface of the second joint 14 is connected with the fluid outlet of the heat exchange device 12, and the other end of the second flow return interface is used to communicate with the fluid inlet of the second distribution unit 22.

[0056] The second joint 14 is configured with the second flow supply interface and the second flow return interface, so that the cooled second fluid provided by the second distribution unit 22 and the second fluid absorbing heat in the heat exchange device 12 can be controlled respectively, so as to accurately adjust the flow of the second fluid input into the heat exchange device 12 and the flow of the second fluid output to the second distribution unit 22, thereby effectively regulating the temperature in the heat exchange device 12 and improving the heat dissipation effect.

[0057] In some optional embodiments, the first joint 13 and the second joint 14 are arranged on the same outer surface of the immersion chamber 11, so as to be connected with the refrigeration system 2. For example, the first joint 13 and the second joint 14 are arranged at the rear end of the immersion server 1 or the immersion chamber 11.

[0058] In some optional embodiments, the heat exchange device 12 is a cold plate. For example, an open cold plate or a closed cold plate. The open cold plate is only applicable to the case that the fluid types of the first fluid and the second fluid are the same. The closed cold plate does not limit the fluid types of the first fluid and the second fluid.

[0059] It should be noted that, in addition to the cold plate, other heat exchange devices 12 such as finned heat exchange tubes can also be used according to actual needs, and the heat exchange device 12 is not limited herein.

[0060] The immersion server provided in the embodiment has a compact cold plate structure and high heat exchange efficiency. Compared with other heat exchange devices, the cold plate has small size, light weight and large heat transfer area. Therefore, when the cold plate is used as the heat exchange device 12, the target processing unit and other small-volume components are not easily damaged whether the heat exchange device 12 is installed above the target processing unit or at other positions. At the same time, since the cold plate uses indirect cooling, the target processing unit can be prevented from being corroded by the second fluid.

[0061] In the embodiment, an immersion liquid cooling system is also provided, which includes a server rack 3 (RACK) and the refrigeration system 2. Wherein, as Figure 8As shown, the server rack 3 is provided with at least one installation slot, and the installation slot is used to install the immersion server 1. The refrigeration system 2 is connected with the first joint 13 and the second joint 14 of the immersion server 1, and the refrigeration system 2 is used to provide the immersion chamber 11 of the immersion server 1 with the first fluid for cooling and provide the heat exchange device 12 of the immersion server 1 with the second fluid for cooling.

[0062] Specifically, as shown in the figure, the installation slots are arranged in layers in the height direction of the server rack 3. Figure 8

[0063] The immersion liquid cooling system provided by the embodiment does not need to be provided with an additional immersion cavity because the immersion server 1 is sealed as a single unit. A plurality of immersion servers 1 can be placed in the form of the server rack 3 to form an immersion cabinet. The immersion server 1 is immersed by the three-dimensional cabinet form, the height space of the data center room can be fully utilized, the power density per unit area of the room is improved, and the floor area of a single cabinet is reduced.

[0064] In some optional embodiments, the refrigeration system 2 includes a first distribution unit 21. In the case where the first fluid and the second fluid are of the same type, the first distribution unit 21 is used to provide the immersion chamber 11 of the immersion server 1 with the first fluid for cooling and provide the heat exchange device 12 of the immersion server 1 with the second fluid for cooling.

[0065] In another optional embodiment, the refrigeration system 2 includes the first distribution unit 21 and a second distribution unit 22. The first distribution unit 21 is connected with the first joint 13 of the immersion server 1, and the first distribution unit 21 is used to provide the immersion chamber 11 of the immersion server 1 with the first fluid for cooling. The second distribution unit 22 is connected with the second joint 14 of the immersion server 1, and the second distribution unit 22 is used to provide the heat exchange device 12 of the immersion server 1 with the second fluid for cooling.

[0066] The immersion liquid cooling system provided by the embodiment is provided with the first distribution unit 21 and the second distribution unit 22 of the refrigeration system 2, the first distribution unit 21 is connected with the first joint 13 of the immersion server 1, and the second distribution unit 22 is connected with the second joint 14 of the immersion server 1. Therefore, different types of fluids can be provided for the heat exchange device 12 and the immersion chamber 11 of the immersion server 1 by the first distribution unit 21 and the second distribution unit 22 according to the requirements and the difference of the contact materials, so as to be suitable for more application scenarios.

[0067] Specifically, the fluid inlet of the first distribution unit 21 is connected with the first return interface of the first joint 13. The fluid outlet of the first distribution unit 21 is connected with the first liquid supply interface of the first joint 13.

[0068] ​Specifically, the fluid inlet of the second distribution unit 22 is connected with the second return interface of the second joint 14 to communicate with the fluid outlet of the heat exchange device 12. The fluid outlet of the second distribution unit 22 is connected with the second supply interface of the second joint 14 to communicate with the fluid inlet of the heat exchange device 12.

[0069] Specifically, the first distribution unit 21 and the second distribution unit 22 are cold distribution units.

[0070] It should be noted that the supply temperature of the first distribution unit 21 and the second distribution unit 22 can be the same or different.

[0071] In some optional embodiments, the supply temperature of the first distribution unit 21 and the second distribution unit 22 is different.

[0072] Specifically, the first distribution unit 21 and the second distribution unit 22 can be used to provide fluids with different temperatures for the immersion chamber 11 and the heat exchange device 12, respectively, according to actual needs. For example, if the heat flux density of the target processing unit is very high, a fluid with a temperature much lower than that in the immersion chamber 11, i.e., the temperature of the second fluid is lower than that of the first fluid, can be provided for the heat exchange device 12 to solve the heat dissipation problem of the target processing unit. At the same time, since the heat exchange device 12 is immersed in the first fluid, there is no need to worry about the condensation problem of the heat exchange device 12 even if the temperature of the second fluid is very low. Moreover, in the case that the first fluid and the second fluid are the same insulating liquid, there is no need to worry about the leakage of the second fluid.

[0073] The immersion liquid cooling system provided in the embodiment can flexibly adjust the temperature of the heat exchange device 12 and the immersion chamber 11 according to different heat dissipation needs, so that the heat exchange efficiency is further improved, since the supply temperature of the first distribution unit 21 and the second distribution unit 22 is different.

[0074] Further, the supply temperature of the first distribution unit 21 is higher than that of the second distribution unit 22. The first distribution unit 21 includes a first heat exchange subunit 211, and the second distribution unit 22 includes a second heat exchange subunit 221, which is connected with the fluid inlet of the first heat exchange subunit 211 at the cold end.

[0075] It should be noted that the first heat exchange sub-unit 211 is used for heat exchange with the first fluid flowing through the first distribution unit 21, and the second heat exchange sub-unit 221 is used for heat exchange with the second fluid flowing through the second distribution unit 22. Specifically, the hot end of the first heat exchange sub-unit 211 is in contact with the first fluid flowing through the first distribution unit 21, the hot end of the first heat exchange sub-unit 211 absorbs the heat of the first fluid, and transmits the absorbed heat to the cold end of the first heat exchange sub-unit 211, and exchanges heat with the cooling medium flowing through the cold end of the first heat exchange sub-unit 211, so as to achieve the purpose of cooling the first fluid. The hot end of the second heat exchange sub-unit 221 is in contact with the second fluid flowing through the second distribution unit 22, the hot end of the second heat exchange sub-unit 221 absorbs the heat of the second fluid, and transmits the absorbed heat to the cold end of the second heat exchange sub-unit 221, and exchanges heat with the cooling medium flowing through the cold end of the second heat exchange sub-unit 221, so as to achieve the purpose of cooling the second fluid.

[0076] It should be noted that if the liquid supply temperature of the second distribution unit 22 is low, the temperature of the fluid entering and exiting the second distribution unit 22 is also low. Therefore, the cooling medium (i.e. water) after heat exchange of the second heat exchange sub-unit 221 in the second distribution unit 22 can be used to dissipate heat for the first heat exchange sub-unit 211 in the first distribution unit 21, so as to utilize the waste heat. Different heat sources can also be used to match different heat demand, and the cooling medium (i.e. water) after heat exchange of the first and second heat exchange sub-units can be delivered to the data center or the heat demand scene around the data center.

[0077] The immersion liquid cooling system provided by the embodiment can connect the fluid outlet at the cold end of the second heat exchange sub-unit 221 to the fluid inlet at the cold end of the first heat exchange sub-unit 211 when the liquid supply temperature of the first distribution unit 21 is higher than the liquid supply temperature of the second distribution unit 22. Therefore, the cooling medium after heat exchange of the second heat exchange sub-unit 221 can be used to dissipate heat for the first heat exchange sub-unit 211, so as to utilize the waste heat.

[0078] In other optional embodiments, the liquid supply temperature of the second distribution unit 22 is higher than the liquid supply temperature of the first distribution unit 21, and the fluid outlet at the cold end of the first heat exchange sub-unit 211 is connected to the fluid inlet at the cold end of the second heat exchange sub-unit 221.

[0079] The liquid supply temperature of the first distribution unit 21 and the liquid supply temperature of the second distribution unit 22 can be adjusted according to actual conditions, which is not limited herein.

[0080] In some optional embodiments, the refrigeration system 2 further comprises a refrigeration device 23, and the refrigeration device 23 is used to provide the cooling medium for the first distribution unit 21 and the second distribution unit 22. Optionally, the refrigeration device 23 is a cooling tower, and the cooling medium is water.

[0081] Further, as shown in Figure 6 the first distribution unit 21 further comprises a first circulation sub-unit 212 and a first filtration sub-unit 213. The fluid inlet of the first circulation sub-unit 212 is connected to the first return interface of the first joint 13 via the fluid inlet of the first distribution unit 21, and the fluid outlet of the first circulation sub-unit 212 is connected to the fluid inlet of the first heat exchange sub-unit 211 arranged at the hot end. The fluid outlet of the first heat exchange sub-unit 211 arranged at the hot end is connected to the fluid inlet of the first filtration sub-unit 213, the fluid inlet of the first heat exchange sub-unit 211 arranged at the cold end is connected to the fluid outlet of the refrigeration device 23, and the fluid outlet of the first heat exchange sub-unit 211 arranged at the cold end is connected to the fluid inlet of the refrigeration device 23. The fluid outlet of the first filtration sub-unit 213 is connected to the first liquid supply interface of the first joint 13 via the fluid outlet of the first distribution unit 21. It should be noted that if the cooling medium after being exchanged by the second heat exchange sub-unit 221 provides cold energy for the first heat exchange sub-unit 211, the cold end of the first heat exchange sub-unit 211 can not be connected to the refrigeration device 23.

[0082] Further, as shown in Figure 7 the second distribution unit 22 further comprises a second circulation sub-unit 222 and a second filtration sub-unit 223. The fluid inlet of the second circulation sub-unit 222 is connected to the second return interface of the second joint 14 via the fluid inlet of the second distribution unit 22, and the fluid outlet of the second circulation sub-unit 222 is connected to the fluid inlet of the second heat exchange sub-unit 221 arranged at the hot end. The fluid outlet of the second heat exchange sub-unit 221 arranged at the hot end is connected to the fluid inlet of the second filtration sub-unit 223, the fluid inlet of the second heat exchange sub-unit 221 arranged at the cold end is connected to the fluid outlet of the refrigeration device 23, and the fluid outlet of the second heat exchange sub-unit 221 arranged at the cold end is connected to the fluid inlet of the refrigeration device 23. The fluid outlet of the second filtration sub-unit 223 is connected to the second liquid supply interface of the second joint 14 via the fluid outlet of the second distribution unit 22. It should be noted that if the cooling medium after being exchanged by the first heat exchange sub-unit 211 provides cold energy for the second heat exchange sub-unit 221, the cold end of the second heat exchange sub-unit 221 can not be connected to the refrigeration device 23.

[0083] Optionally, the first circulation sub-unit 212 and the second circulation sub-unit 222 are circulation pumps.

[0084] Optionally, the first heat exchange sub-unit 211 and the second heat exchange sub-unit 221 are plate heat exchangers.

[0085] Optionally, the first filtration sub-unit 213 and the second filtration sub-unit 223 are filters.

[0086] In some optional embodiments, the first fluid provided by the first distribution unit 21 is of the same type as the second fluid provided by the second distribution unit 22.

[0087] In some other optional embodiments, the first fluid provided by the first distribution unit 21 is of a different type from the second fluid provided by the second distribution unit 22.

[0088] It should be noted that when the first fluid and the second fluid used by the heat exchange device 12 and the immersion chamber 11 are different, the first distribution unit 21 and the second distribution unit 22 can be used to provide two different types of fluids for the heat exchange device 12 and the immersion chamber 11 according to actual needs, such as different types of fluorinated liquids, fluorinated liquid and oil-based refrigerants, or other combinations. At this time, the temperatures of the first fluid and the second fluid can be the same or different, which is not limited herein.

[0089] The immersion liquid cooling system provided by the embodiment can provide different fluids according to the materials of the heat exchange device 12 and the immersion chamber 11, expand the selection range of fluids, and thus realize flexible matching of fluids to be suitable for more application scenarios.

[0090] In some optional embodiments, the first fluid and the second fluid each include at least one of a fluorinated liquid, a fluorinated liquid and oil-based refrigerant, or other refrigerants.

[0091] In some optional embodiments, as shown in Figure 9 The server rack 3 includes a third joint 31 corresponding to the mounting slot and a fourth joint 32 corresponding to the mounting slot. The third joint 31 is adapted to the first joint 13, and the third joint 31 is used to connect the first joint 13 of the corresponding immersion server 1 and the refrigeration system 2. The fourth joint 32 is adapted to the second joint 14, and the fourth joint 32 is used to connect the second joint 14 of the corresponding immersion server 1 and the refrigeration system 2.

[0092] It should be noted that the first joint 13 and the third joint 31, and the second joint 14 and the fourth joint 32 can be quick joints or other connection modes, which are not limited herein.

[0093] The immersion liquid cooling system provided by the embodiment can provide different fluids according to the materials of the heat exchange device 12 and the immersion chamber 11, expand the selection range of fluids, and thus realize flexible matching of fluids to be suitable for more application scenarios.

[0094] In some optional embodiments, as shown in Figure 9 The server rack 3 further comprises a main distributor 33. The fluid inlet of the main distributor 33 is connected with the fluid outlet of the refrigeration system 2, and the fluid outlets of the main distributor 33 are respectively connected with the fluid supply interface of the third joint 31 and the fluid supply interface of the fourth joint 32, the fluid supply interface of the third joint 31 being used to supply the first fluid to the first joint 13, and the fluid supply interface of the fourth joint 32 being used to supply the second fluid to the second joint 14.

[0095] In some optional embodiments, as shown in Figure 9 The server rack 3 further comprises a main collector 34. The fluid inlets of the main collector 34 are respectively connected with the fluid return interface of the third joint 31 and the fluid return interface of the fourth joint 32, and the fluid outlet of the main collector 34 is connected with the fluid inlet of the refrigeration system 2, the fluid return interface of the third joint 31 being used to collect the first fluid returned by the first joint 13, and the fluid return interface of the fourth joint 32 being used to collect the second fluid returned by the second joint 14.

[0096] It should be noted that the fluid return interface of the fourth joint 32 is connected with the second fluid return interface of the second joint 14 only when the second joint 14 is provided with the second fluid return interface, so as to collect the second fluid returned by the second joint 14. If the fluid types of the first fluid and the second fluid are the same, the fluid outlet of the heat exchange device 12 is connected with the immersion chamber 11, and the second joint 14 is not provided with the second fluid return interface, then the fluid return interface of the fourth joint 32 does not need to collect the second fluid returned by the second joint 14.

[0097] Specifically, as shown in Figure 9 The fluid supply interface of the third joint 31 and the fluid supply interface of the fourth joint 32 are arranged on the main distributor 33, and the fluid return interface of the third joint 31 and the fluid return interface of the fourth joint 32 are arranged on the main collector 34. The fluid supply interface of the third joint 31 and the fluid supply interface of the fourth joint 32 are arranged on the main distributor 33 in correspondence with the positions of the mounting slots and are arranged at intervals. The fluid return interface of the third joint 31 and the fluid return interface of the fourth joint 32 are arranged on the main collector 34 in correspondence with the positions of the mounting slots and are arranged at intervals. In addition, in order to facilitate the connection of the first joint 13 and the third joint 31, the connection of the second joint 14 and the fourth joint 32, and the mounting of the third joint 31 and the fourth joint 32 to the immersion server 1 to the mounting slots, the mounting position of the first joint 13 matches the mounting position of the third joint 31 when the third joint 31 is mounted to the mounting slots, and the mounting position of the second joint 14 matches the mounting position of the fourth joint 32 when the fourth joint 32 is mounted to the mounting slots.

[0098] Specifically, the main distributor 33 and the main collector 34 are arranged on one side of the server rack 3. For example, the main distributor 33 and the main collector 34 are respectively arranged on the left and right sides of the back of the server rack 3.

[0099] The immersion liquid cooling system provided by the embodiment is provided with the main distributor 33 and the main collector 34 on the server rack 3. Therefore, the main distributor 33 can be used to distribute the cooling capacity to the immersion server 1, and the main collector 34 can be used to converge the hot fluid of the immersion server 1 and then send the hot fluid into the refrigeration system 2 to complete the heat dissipation cycle.

[0100] In some optional embodiments, as shown in Figure 10 If the refrigeration system 2 includes the first distribution unit 21 and the second distribution unit 22, the first distribution unit 21 is connected to the first joint 13 of the immersion server 1, and the second distribution unit 22 is connected to the second joint 14 of the immersion server 1. Then, the main distributor 33 includes the first distributor 331 and the second distributor 332. The fluid inlet of the first distributor 331 is connected to the fluid outlet of the first distribution unit 21, and the fluid outlet of the first distributor 331 is connected to the flow interface of the third joint 31. The fluid inlet of the second distributor 332 is connected to the fluid outlet of the second distribution unit 22, and the fluid outlet of the second distributor 332 is connected to the flow interface of the fourth joint 32.

[0101] The immersion liquid cooling system provided by the embodiment is provided with the first distributor 331 and the second distributor 332 on the server rack 3 for the first distribution unit 21 and the second distribution unit 22. Therefore, the first distributor 331 and the second distributor 332 can be used to effectively distribute the cooling capacity provided by the first distribution unit 21 and the second distribution unit 22.

[0102] In some optional embodiments, as shown in Figure 10 If the refrigeration system 2 includes the first distribution unit 21 and the second distribution unit 22, the first distribution unit 21 is connected to the first joint 13 of the immersion server 1, and the second distribution unit 22 is connected to the second joint 14 of the immersion server 1. Then, the main collector 34 includes the first collector 341 and the second collector 342. The fluid inlet of the first collector 341 is connected to the flow interface of the third joint 31, and the fluid outlet of the first collector 341 is connected to the fluid inlet of the first distribution unit 21. The fluid inlet of the second collector 342 is connected to the flow interface of the fourth joint 32, and the fluid outlet of the second collector 342 is connected to the fluid inlet of the second distribution unit 22.

[0103] The immersion liquid cooling system provided by the embodiment is provided with the first collector 341 and the second collector 342 on the server rack 3 for the first distribution unit 21 and the second distribution unit 22. Therefore, the first collector 341 and the second collector 342 can be used to effectively converge the fluid flowing back from the immersion chamber 11 and the heat exchange device 12 of the immersion server 1 to be delivered to the corresponding distribution unit.

[0104] It should be noted that in order to facilitate the distinction and connection, the first distributor 331 and the second distributor 332 are arranged side by side on one side of the server rack 3, and the first collector 341 and the second collector 342 are arranged side by side on the other side of the server rack 3. For example Figure 10 As shown from left to right, they are the first distributor 331, the second distributor 332, the second collector 342, and the first collector 341.

[0105] Specifically, as Figure 10 shown, the fluid supply interface of the third connector 31 is arranged on the first distributor 331, the fluid supply interface of the fourth connector 32 is arranged on the second distributor 332, the fluid return interface of the third connector 31 is arranged on the first collector 341, and the fluid return interface of the fourth connector 32 is arranged on the second collector 342.

[0106] It should be noted that after the immersion server 1 and the immersion liquid cooling system of the present disclosure are adopted, the following application modes can be obtained:

[0107] The first kind is that the immersion chamber 11 and the heat exchange device 12 adopt the same fluid, the refrigeration system 2 adopts one distribution unit, such as the first distribution unit 21, and the first distribution unit 21 provides the cooling fluid for the immersion chamber 11 and the heat exchange device 12. At this time, the fluid outlet of the heat exchange device 12 (such as an open cold plate) is connected with the immersion chamber 11, and the second connector 14 between the refrigeration system 2 and the heat exchange device 12 is only provided with a second fluid supply interface. Alternatively, the second connector 14 between the refrigeration system 2 and the heat exchange device 12 is provided with a second fluid supply interface and a second fluid return interface, and the fluid outlet of the heat exchange device 12 (such as a closed cold plate) is connected with the refrigeration system 2 through the second fluid return interface of the second connector 14.

[0108] The second kind is that the immersion chamber 11 and the heat exchange device 12 adopt the same fluid, and the refrigeration system adopts two distribution units, such as the first distribution unit 21 and the second distribution unit 22, the first distribution unit 21 provides the first cooling fluid for the immersion chamber 11, and the second distribution unit 22 provides the second cooling fluid for the heat exchange device 12. Among them, the fluid outlet of the heat exchange device 12 (such as an open cold plate) is connected with the immersion chamber 11, and the second connector 14 between the second distribution unit 22 and the heat exchange device 12 is only provided with a second fluid supply interface.

[0109] Third, the immersion chamber 11 and the heat exchange device 12 use the same kind of fluid, and the refrigeration system uses two distribution units, such as the first distribution unit 21 and the second distribution unit 22. The first distribution unit 21 provides the immersion chamber 11 with the first fluid for cooling, and the second distribution unit 22 provides the heat exchange device 12 with the second fluid for cooling. Among them, the second joint 14 between the second distribution unit 22 and the heat exchange device 12 is provided with a second flow interface and a second return flow interface, and the fluid outlet of the heat exchange device 12 (such as a closed cold plate) is connected with the second distribution unit 22 through the second return flow interface of the second joint 14.

[0110] Fourth, the immersion chamber 11 and the heat exchange device 12 use different kinds of fluid, and the fluid temperature of the immersion chamber 11 and the heat exchange device 12 is different. The refrigeration system uses two distribution units, such as the first distribution unit 21 and the second distribution unit 22. The first distribution unit 21 provides the immersion chamber 11 with the first fluid for cooling, and the second distribution unit 22 provides the heat exchange device 12 with the second fluid for cooling.

[0111] Fifth, the immersion chamber 11 and the heat exchange device 12 use different kinds of fluid, and the fluid temperature of the immersion chamber 11 and the heat exchange device 12 is the same. The refrigeration system uses two distribution units, such as the first distribution unit 21 and the second distribution unit 22. The first distribution unit 21 provides the immersion chamber 11 with the first fluid for cooling, and the second distribution unit 22 provides the heat exchange device 12 with the second fluid for cooling.

[0112] In the above-mentioned application mode, if the immersion chamber 11 and the heat exchange device 12 use the same kind of fluid, and the second joint 14 is provided with a second flow interface and a second return flow interface, then the first joint 13 and the second joint 14 need to be provided with corresponding quick connection interfaces (i.e. the flow interface and the return flow interface of the third joint 31 and the fourth joint 32) respectively. At this time, the flow and the return flow each need two quick connection interfaces, the two flow quick connection interfaces can share a manifold (Mainfold) connected with the refrigeration system 2, and the two return flow quick connection interfaces can share a manifold connected with the refrigeration system 2. The flow and the return flow need at least two manifolds.

[0113] If the same kind of fluid is used in the immersion chamber 11 and the heat exchange device 12, in the second application mode, only one quick connection interface is needed for the first return flow interface of the first joint 13 (i.e. the return flow interface of the third joint 31), and two quick connection interfaces are needed for the first supply flow interface of the first joint 13 and the second supply flow interface of the second joint 14 (i.e. the supply flow interfaces of the third joint 31 and the fourth joint 32), at this time, two quick connection interfaces are needed for the supply flow, and one quick connection interface is needed for the return flow, the two quick connection interfaces for the supply flow can share one mainfold connected with the refrigeration system 2, and at least two mainfolds are needed for the supply flow and the return flow.

[0114] If different kinds of fluid are used in the immersion chamber 11 and the heat exchange device 12, corresponding quick connection interfaces are needed for the supply flow interfaces and the return flow interfaces of the first joint 13 and the second joint 14 (i.e. the supply flow interfaces and the return flow interfaces of the third joint 31 and the fourth joint 32), at this time, two quick connection interfaces are needed for the supply flow and the return flow, one mainfold connected with the refrigeration system 2 is needed for each of the two quick connection interfaces for the supply flow, and one mainfold connected with the refrigeration system 2 is needed for each of the two quick connection interfaces for the return flow, and at least four mainfolds are needed for the supply flow and the return flow.

[0115] It is worth mentioning that the immersion server 1 and the immersion liquid cooling system of the present disclosure have the following advantages compared with the related art: first, the immersion server 1 is individually sealed, so it can be immersed in a three-dimensional cabinet form, which can make full use of the height space of the computer room, improve the power density per unit area of the computer room, and reduce the floor area of a single cabinet. Second, the target processing unit (such as a chip) of the immersion server 1 is covered with a heat exchange device 12 (such as a cold plate), which can solve the heat dissipation bottleneck of the target processing unit caused by natural convection when the original TANK is immersed. At the same time, the target processing unit is immersed in the first fluid and covered by the heat exchange device 12, so the heat dissipation efficiency is high. Third, since the heat exchange device 12 is immersed in the first fluid, it helps to cool the heat exchange device 12. Fourth, without the aid of an auxiliary air cooling system, it can also solve the heat dissipation of other components on the server mainboard 15 except the target processing unit, thereby achieving natural cooling all year round. Fifth, the heat exchange device 12 can use insulating liquid, so even if it leaks, it will not affect the server. Sixth, the same fluid can be used in the heat exchange device 12 and the immersion chamber 11, and the fluid temperature can be the same or different. Even if it leaks, there is no need to worry about the problem of fluid mixing. Seventh, different types of fluids can be used in the heat exchange device 12 and the immersion chamber 11 according to the needs and the difference in fluid contact materials, so as to realize flexible combination of fluids and adapt to different application scenarios and ranges. Eighth, the present disclosure adds a sealed immersion chamber 11 to a single service mainboard, and sets a liquid distributor and a liquid collector in the server rack 3, which is similar to the form of the liquid distributor and the liquid collector of the cold plate cabinet. Only the immersion interface needs to be added, and the existing immersion server 1 and server cabinet are less changed. Ninth, the insulating liquid can be used as the first fluid and the second fluid, which reduces the sealing requirements of the heat exchange device 12 and the cutout, and even other connection methods can be used in addition to quick connection.

[0116] It can be understood that the immersion server 1 and the immersion liquid cooling system of the present disclosure combine the advantages of immersion cooling and cold plate cooling, and can achieve 100% liquid cooling. It can also solve the problem of local hot spots when the chip is immersed, thereby realizing the heat dissipation demand of ultra-high power density and improving the computing service output per unit area.

[0117] As a specific application example, the immersion server 1 is configured with the first joint 13 and the second joint 14, and the server rack 3 is configured with the third joint 31 and the fourth joint 32. The immersion server 1 and the immersion liquid cooling system of the present disclosure are used in a data center. Whenever a new immersion server 1 is connected to the server rack 3, the first joint 13 of the immersion server 1 is connected to the corresponding third joint 31 of the server rack 3, and the second joint 14 of the immersion server 1 is connected to the corresponding fourth joint 32 of the server rack 3, so as to communicate the immersion server 1 with the refrigeration system 2 of the immersion liquid cooling system, thereby cooling the immersion server 1 when the immersion server 1 is working.

[0118] Although the embodiments of the present disclosure are described in conjunction with the drawings, various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present disclosure, and such modifications and changes fall within the scope defined by the appended claims.

Claims

1. An immersed server, characterized in that, The immersion server comprises: an immersion chamber, wherein a server mainboard is arranged in the immersion chamber, and a target processing unit is arranged on the server mainboard; a heat exchange device, which is in contact with the target processing unit and is used for heat exchange with the target processing unit; a first joint, which is used for connecting the immersion chamber and a first distribution unit of a refrigeration system, and the refrigeration system is used for providing a first fluid for cooling the immersion chamber; a second joint, which is used for connecting the heat exchange device and a second distribution unit of the refrigeration system, and the refrigeration system is also used for providing a second fluid for cooling the heat exchange device; wherein the first distribution unit comprises a first heat exchange subunit, the second distribution unit comprises a second heat exchange subunit, the second heat exchange subunit is connected to the fluid outlet of the cold end and the fluid inlet of the first heat exchange subunit, and the supply liquid temperature of the first distribution unit is higher than the supply liquid temperature of the second distribution unit.

2. The sink server of claim 1, wherein, The first joint comprises: a first fluid supply interface, one end of which is connected to the fluid inlet of the immersion chamber, and the other end of which is used for being connected to the fluid outlet of the first distribution unit; a first fluid return interface, one end of which is connected to the fluid outlet of the immersion chamber, and the other end of which is used for being connected to the fluid inlet of the first distribution unit.

3. The sink server of claim 1, wherein, The second joint comprises: a second fluid supply interface, one end of which is connected to the fluid inlet of the heat exchange device, and the other end of which is used for being connected to the fluid outlet of the second distribution unit; a second fluid return interface, one end of which is connected to the fluid outlet of the heat exchange device, and the other end of which is used for being connected to the fluid inlet of the second distribution unit.

4. The sink server of claim 1, wherein, The fluid inlet of the heat exchange device is connected to the second joint, and the fluid outlet of the heat exchange device is connected to the immersion chamber.

5. An immersion liquid cooling system characterized by, The immersion liquid cooling system comprises: a server rack, wherein at least one mounting slot is arranged on the server rack, and the mounting slot is used for mounting the immersion server according to any one of claims 1 to 4; a refrigeration system, wherein the refrigeration system comprises a first distribution unit and a second distribution unit, the first distribution unit is connected to the first joint of the immersion server and is used for providing a first fluid for cooling the immersion chamber of the immersion server, the second distribution unit is connected to the second joint of the immersion server and is used for providing a second fluid for cooling the heat exchange device of the immersion server, the supply liquid temperature of the first distribution unit is higher than the supply liquid temperature of the second distribution unit, the first distribution unit comprises a first heat exchange subunit, and the second distribution unit comprises a second heat exchange subunit, and the second heat exchange subunit is connected to the fluid outlet of the cold end and the fluid inlet of the first heat exchange subunit.

6. The immersion liquid cooling system of claim 5, wherein, The first fluid provided by the first distribution unit and the second fluid provided by the second distribution unit are of the same type.

7. The immersion liquid cooling system of claim 5, wherein, The first fluid provided by the first distribution unit is of a different fluid type than the second fluid provided by the second distribution unit.

8. The immersion liquid cooling system of claim 5, wherein, The server rack comprises: a third joint corresponding to the mounting slot, the third joint being adapted to the first joint, the third joint being configured to communicate the first joint of the corresponding submerged server with the refrigeration system; a fourth joint corresponding to the mounting slot, the fourth joint being adapted to the second joint, the fourth joint being configured to communicate the second joint of the corresponding submerged server with the refrigeration system.

9. The immersion liquid cooling system of claim 8, wherein, The server rack further comprises: a main distributor, a fluid inlet of the main distributor being connected to a fluid outlet of the refrigeration system, fluid outlets of the main distributor being connected to a fluid supply interface of the third joint and a fluid supply interface of the fourth joint respectively, the fluid supply interface of the third joint being configured to supply the first joint with a first fluid, the fluid supply interface of the fourth joint being configured to supply the second joint with a second fluid; a main collector, fluid inlets of the main collector being connected to a fluid return interface of the third joint and a fluid return interface of the fourth joint respectively, a fluid outlet of the main collector being connected to a fluid inlet of the refrigeration system, the fluid return interface of the third joint being configured to collect the first fluid returned by the first joint, the fluid return interface of the fourth joint being configured to collect the second fluid returned by the second joint.

10. The immersion liquid cooling system of claim 9, wherein, The main distributor comprises: a first distributor, a fluid inlet of the first distributor being connected to a fluid outlet of the first distribution unit, a fluid outlet of the first distributor being connected to the fluid supply interface of the third joint; a second distributor, a fluid inlet of the second distributor being connected to a fluid outlet of the second distribution unit, a fluid outlet of the second distributor being connected to the fluid supply interface of the fourth joint.

11. The immersion liquid cooling system of claim 10, wherein, The main collector comprises: a first collector, a fluid inlet of the first collector being connected to the fluid return interface of the third joint, a fluid outlet of the first collector being connected to a fluid inlet of the first distribution unit; a second collector, a fluid inlet of the second collector being connected to the fluid return interface of the fourth joint, a fluid outlet of the second collector being connected to a fluid inlet of the second distribution unit.

Images