Wafer model generation method, electronic equipment and storage medium

Abstract

The invention provides a wafer model generation method, electronic equipment and a storage medium, and the method comprises the steps: obtaining the parameter information of a wafer currently placed on a motion platform, the wafer being divided into a plurality of Shots, and the parameter information comprising the wafer size information and the Shot size information; drawing a wafer model corresponding to the wafer in a target drawing board area based on the parameter information, wherein the wafer model comprises the peripheral contour of the wafer and the boundary of each Shot; the offset of the circle center of the wafer on the moving table relative to the center of the target Shot is obtained; and adjusting the boundary position of each Shot in the wafer model based on the offset. According to the invention, the wafer model can be automatically generated, and mapping between the wafer model and the wafer entity on the motion table can be realized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer model generation method, electronic equipment and storage medium. Background Art

[0002] In the field of semiconductor manufacturing technology, a wafer usually refers to a silicon wafer used to make integrated circuits. In the process of making integrated circuits on a wafer, for the convenience of process manufacturing, the wafer will be divided into several exposure fields (Shot). Shot is usually used as the basic unit in production. The most typical one is the basic exposure unit, which is periodically repeated on the wafer. Each basic Shot unit contains one or more chips (Die). After all the integrated circuits on the wafer are manufactured, the wafer will be cut into several chips (Die). Each Die contains an independent integrated circuit that can realize the predetermined function, which is the basic unit for packaging and testing.

[0003] Usually, dies are arranged in two-dimensional regular patterns on wafers, and each die has a coordinate (the row and column of the wafer image). When establishing inspection and measurement recipes, engineers usually locate different dies by inputting different coordinates (row and column), which is time-consuming, labor-intensive, and not intuitive enough.

[0004] Therefore, it is urgent to generate a wafer model and realize the mapping between the wafer model and the wafer entity, so that engineers can control the motion stage of the measurement equipment to move the corresponding position of the wafer to the field of view of the camera module by clicking a certain position in the model. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a wafer model generation method, an electronic device and a storage medium, so as to automatically generate a wafer model and realize the mapping between the wafer model and the wafer entity on the moving table.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a wafer model generation method, comprising:

[0008] Acquire parameter information of a wafer currently placed on the moving table, wherein the wafer is divided into a plurality of shots, and the parameter information includes wafer size information and shot size information;

[0009] Drawing a wafer model corresponding to the wafer in a target drawing board area based on the parameter information, wherein the wafer model includes an outer peripheral contour of the wafer and a boundary of each Shot;

[0010] Obtaining the offset of the center of the wafer on the moving stage relative to the center of the target Shot;

[0011] Based on the offset, the boundary position of each Shot in the wafer model is adjusted.

[0012] Further, drawing a wafer model corresponding to the wafer in a target drawing board area based on the parameter information includes:

[0013] Based on the parameter information, determine the number of rows and columns of the Shot;

[0014] Based on the number of rows and columns of the Shot and the pixel value of the target artboard area, determine the pixel value occupied by a single Shot in the row direction and the column direction of the target artboard area;

[0015] Based on the pixel values ​​occupied by a single Shot in the row direction and the column direction of the target artboard area, drawing the boundary of each Shot in the target artboard area;

[0016] Based on the parameter information, the outer periphery of the wafer is drawn in the target drawing board area.

[0017] Furthermore, the step of obtaining the offset of the center of the wafer on the moving stage relative to the center of the target Shot includes:

[0018] Acquire the actual coordinates (waferCenterX, waferCenterY) of the center of the wafer on the moving stage based on the camera module;

[0019] Acquire the actual coordinates (shotCenterX, shotCenterY) of the center of the target Shot on the motion platform based on the camera module;

[0020] The absolute value of the coordinate deviation (differenceXAbs, differenceYAbs) between the center of the wafer and the center of the target Shot is calculated according to the following formula:

[0021] differenceXAbs=|waferCenterX-shotCenterX|

[0022] differenceYAbs=|waferCenterY-shotCenterY|

[0023] The offsets offsetX and offsetY of the center of the wafer relative to the center of the target Shot are calculated according to the following formula:

[0024] multiplex=[differenceXAbs / wafer.ShotX]

[0025] multipleY=[differenceYAbs / wafer.ShotY]

[0026] offsetX=differenceXAbs-multipleX*wafer.ShotX

[0027] offsetY=differenceYAbs-multipleY*wafer.ShotY

[0028] Among them, [] represents the rounding symbol, wafer.ShotX represents the width of a single Shot, and ShotY represents the height of a single Shot.

[0029] Further, adjusting the boundary position of each Shot in the wafer model based on the offset includes:

[0030] Adjust the starting pixel coordinates of each Shot in the target artboard area according to the following formula:

[0031] shotStartX'=shotStartX+(offsetX / wafer.ShotX)*shotPixcelX

[0032] shotStartY'=shotStartY+(offsetY / wafer.ShotY)*shotPixcelY

[0033] Wherein, (shotStartX', shotStartY') represents the starting pixel coordinates of each Shot in the target canvas area after adjustment, (shotStartX, shotStartY) represents the starting pixel coordinates of each Shot in the row direction and column direction of the target canvas area before adjustment, shotPixcelX, shotPixcelY represent the pixel values ​​occupied by a single Shot in the row direction and column direction of the target canvas area respectively;

[0034] The boundary of each Shot is redrawn based on the adjusted starting pixel coordinates.

[0035] Further, the obtaining of the actual coordinates (waferCenterX, waferCenterY) of the center of the wafer on the moving stage based on the camera module includes:

[0036] Acquiring actual coordinates of at least three points on the circumference of the wafer through the camera module;

[0037] Based on the actual coordinates of the at least three points, the actual coordinates of the center of the wafer on the moving stage are calculated.

[0038] Further, the obtaining of the actual coordinates (shotCenterX, shotCenterY) of the center of the target Shot on the motion platform based on the camera module includes:

[0039] Acquire the coordinates of the marking points on the target Shot and the Shots in the same row and column as the target Shot through the camera module;

[0040] Based on the coordinates of each of the marking points, the actual coordinates (shotCenterX, shotCenterY) of the center of the target Shot on the motion stage are calculated.

[0041] Further, after adjusting the boundary position of each Shot in the wafer model, the method further includes:

[0042] Obtaining a click position corresponding to a click operation in the wafer model;

[0043] The moving platform is controlled to move the position of the wafer corresponding to the click position to the target position.

[0044] Furthermore, each of the Shots includes a plurality of Dies, and the parameter information of the wafer further includes the number of Dies included in a single Shot in the row direction and the column direction respectively;

[0045] The method further includes: drawing the boundary of each Die based on the number of Dies contained in a single Shot in the row direction and the column direction respectively.

[0046] In a second aspect, the present invention provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the wafer model generation method as described above when executing the computer program.

[0047] In a third aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the wafer model generation method as described above.

[0048] By adopting the above technical solution, the present invention can not only quickly generate a wafer model, but also adjust the boundary position of the shot in the wafer model based on the offset of the center of the wafer on the moving table relative to the center of the target shot, thereby completing the calibration of the wafer model and realizing the mapping between the wafer model and the wafer entity. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 A software architecture diagram for implementing the wafer model generation method of embodiment 1 of the present invention;

[0050] Figure 2 for Figure 1 The architectural block diagram of the wafer abstraction module;

[0051] Figure 3 This is a flow chart of a wafer model generation method according to Embodiment 1 of the present invention;

[0052] Figure 4 An operation page diagram provided for the wafer model generation method according to Embodiment 1 of the present invention;

[0053] Figure 5 This is a hardware architecture diagram of an electronic device according to Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0055] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The singular forms "a", "the" and "the" used in the present disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0056] Example 1

[0057] This embodiment provides a wafer model generation method based on Figure 1 The software architecture shown in the figure is implemented. The software architecture uses C# language and object-oriented ideas to abstract the wafer and draw it into a wafer model to facilitate users to operate and use the model. Figure 1As shown, the software architecture specifically includes a parameter module, a wafer abstraction module, a unified interface and an operation page (UI) module.

[0058] In this embodiment, in order to achieve universality, the parameter module provides some basic necessary parameters of the wafer, and these parameters can be flexibly configured according to different requirements. For example, the parameter module may include WaferSize (wafer size), EdgeType (wafer type), Diameter (wafer diameter), ShotWidth (Shot width), ShotHeight (Shot height), DieNumInShotX (the number of Dies in the row direction of a single Shot), DieNumInShotY (the number of Dies in the column direction of a single Shot), etc.

[0059] In this embodiment, the wafer abstraction module can be further divided into Wafer unit, Shot unit and Die unit. This is because many Shots can be divided on an actual wafer, and each Shot can contain multiple Dies. In order to realize model generation, these three units are abstracted.

[0060] In this embodiment, in order to realize the integration and calling of the parameter module and the wafer abstraction module, a unified interface module is configured, which is convenient for both UI module calling and external software integration of the parameter module and the wafer abstraction module functions.

[0061] In this embodiment, the operation page module provides an operation page such as Figure 4 As shown, it is used to facilitate parameter setting, wafer model drawing, wafer model viewing, and supports users to click operations on the wafer model.

[0062] In this embodiment, the architecture of the wafer abstraction module is as follows: Figure 2 As shown, it includes Wafer unit, Die unit, Shot unit, RelativeOrigin unit, Common unit and Field unit. The following is a detailed introduction to each unit (one unit is a class):

[0063] The public properties of the Wafer unit provide the following parameters: WaferSize (wafer size), ShotX (Shot width), ShotY (Shot height), ShotNumX (number of shots in the wafer row direction), ShotNumY (number of shots in the wafer column direction), DieNumInShotX (number of dies in the Shot row direction), DieNumInShotY (number of dies in the Shot column direction), etc.

[0064] The public operation methods of the Wafer unit include Init, Draw, and Reset. Among them, Init is used to perform parameter initialization operations before model drawing; Draw is used to draw the wafer model; Reset is used to restore the drawn wafer model.

[0065] In this embodiment, multiple Die units are aggregated into a Shot unit. The public attributes of the Die unit include DieStatus (indicating the state of the Die, such as measurement prohibited state, measurement allowed state, shielded state, normal measurement result state, abnormal measurement result state, etc.), GlobleRow (the row where the current Die is located in the Wafer), GlobleColumn (the column where the current Die is located in the Wafer), InShotRow (the row where the current Die is located in the corresponding Shot), and InShotColumn (the column where the current Die is located in the corresponding Shot).

[0066] The public operation methods of the Die unit include Init, Draw, and Reset. Among them, Init is used to perform parameter initialization operations before Die drawing, Reset is used to restore Die drawing, and Draw is used to draw Die.

[0067] In this embodiment, multiple Shot units are aggregated into a Wafer unit. The properties and methods of Shot are similar to those of Die and will not be described in detail here.

[0068] In this embodiment, the Wafer unit depends on the RelativeOrigin unit, and when generating the wafer model, a Die is assumed to be the relative origin of the Wafer. The public properties provided by the RelativeOrigin unit include GlobleRow, GlobleColumn, MachineX, and MachineY. Among them, GlobleRow represents the row where the Die relative to the origin of the Wafer is located in the Wafer, GlobleColumn represents the column where the Die relative to the origin of the Wafer is located in the Wafer, MachineX represents the physical coordinates in the row direction corresponding to the Wafer relative to the origin, and MachineY represents the physical coordinates in the column direction corresponding to the Wafer relative to the origin.

[0069] In this embodiment, the Wafer unit, Shot unit, and Die unit all rely on the Field unit. The Field unit refers to the rectangular area of ​​the Shot unit and the Die unit, StartX (the starting point coordinates of the rectangular area in the row direction), StartY (the starting point coordinates of the rectangular area in the column direction), Width (the width of the rectangle), and Height (the height of the rectangle).

[0070] In this embodiment, a unified interface Common is provided, which provides the following public methods (functions):

[0071] DrawWaferShotDieGrid, this method is to draw the wafer model, including the outer contour of the wafer, the rectangular boundary of the shot and the rectangular boundary of the die;

[0072] FillAllShots, this method fills the rectangular area of ​​all shots within the wafer outline with color, making it easier to view the area where the shots are located;

[0073] FillSingleDie, this method fills the rectangle of a single Die with color, making it easier to see the area where the Die is located;

[0074] FillSelectedDies, this method is used to fill different colors for Dies in different states. For example, if the state of a Die is measurement prohibited, the Die will be filled with the color corresponding to the measurement prohibited state.

[0075] ReOrderDies, this method reorders all Dies in a Wafer. The sorting rule is to arrange the Die's GlobleRow and GlobleColumn in ascending order;

[0076] ClickWaferDie, this method is when you click the Die on the operation UI with the mouse, it will change the current Die status and adjust the Die color.

[0077] Based on the aforementioned software architecture, the process of the wafer model generation method in this embodiment is as follows: Figure 3 As shown, the specific steps include:

[0078] S1, obtaining parameter information of a wafer currently placed on the moving table, wherein the wafer can be divided into a plurality of shots, and the parameter information of the wafer includes wafer size information and shot size information, etc.

[0079] Among them, the wafer size information may include wafer.Diameter (wafer diameter) and the size of the wafer cut edge or notch; the shot size information may include the width (wafer.ShotX) and height (wafer.ShotY) of a single shot.

[0080] S2, based on the parameter information of the wafer, draw a wafer model corresponding to the wafer in the target drawing board area. The wafer model includes the outer peripheral contour of the wafer and the boundaries of each shot. The specific drawing process is as follows:

[0081] S21, determining the number of rows and columns of Shot based on the parameter information of the wafer.

[0082] Specifically, this embodiment determines the number of rows shotNumRow and the number of columns shotNumColum of Shot based on the wafer diameter and the width (wafer.ShotX) and height (wafer.ShotY) of a single Shot.

[0083] S22, based on the number of rows and columns of the Shot and the pixel value of the target canvas area, determine the pixel value occupied by a single Shot in the row direction and the column direction of the target canvas area.

[0084] For example, when the target artboard area (such as Figure 4 The dotted box in the figure is a square, and its pixel values ​​in the row and column directions are both Common.bitmapSize. The pixel value shotPixcelX occupied by a single Shot in the row direction is Common.bitmapSize / shotNumColum, and the pixel value shotPixcelY occupied in the column direction is Common.bitmapSize / shotNumRow.

[0085] S23, drawing the boundaries of each Shot in the target artboard area based on the pixel values ​​occupied by a single Shot in the row direction and the column direction in the target artboard area.

[0086] Specifically in this step, first determine the starting point of the Shot (the first Shot), for example, take the starting point of the target canvas area as the Shot starting point; then take the Shot starting point as a reference, and draw the rectangular boundaries of each Shot in the target canvas area according to the pixel values ​​occupied by a single Shot in the row and column directions of the target canvas area.

[0087] S24, based on the parameter information of the wafer, draw the outer periphery of the wafer in the target drawing board area.

[0088] Specifically, based on the ratio of the wafer diameter to the width / height of the shot, and the pixel values ​​occupied by a single shot in the row / column direction, the pixel values ​​occupied by the wafer diameter can be determined, and then the outer contour of the wafer can be drawn with the center of all shots as the center of the circle and the size of the cut edge or notch of the wafer. Figure 4 As shown, when the model is displayed on the operation page, the Shot that has no intersection with the wafer range may not be displayed on the page.

[0089] As mentioned above, each Shot may also include multiple Dies. In one practicable manner, the parameter information of the wafer also includes the number of Dies included in a single Shot in the row and column directions.

[0090] Based on this, after executing step S24, this embodiment may further execute the following step S25: based on the number of dies contained in a single shot in the row and column directions, draw the boundaries of each die within the outer contour of the wafer, such as Figure 4 shown.

[0091] Preferably, this embodiment further includes filling different colors for Dies in different states, and when the Die state changes, the filled color also changes accordingly.

[0092] S3, obtaining the offset of the center of the wafer on the moving stage relative to the center of the target Shot.

[0093] In this embodiment, considering that the actual relative position of the wafer and the Shot array when the wafer is placed on the moving table may not be consistent with the relative position of the two in the wafer model, it is necessary to determine the mapping relationship between the wafer model and the actual wafer. Therefore, this step is used to determine the offset of the center of the wafer relative to the center of the target Shot. The specific process is as follows:

[0094] S31, obtaining the actual coordinates waferCenterX and waferCenterY of the center of the wafer on the moving table through the camera module.

[0095] Specifically, firstly, the actual coordinates of at least three points on the circumference of the wafer are acquired through the camera module; then, based on the actual coordinates of the at least three points, the actual coordinates waferCenterX and waferCenterY of the center of the wafer in the row direction and column direction of the moving stage are calculated.

[0096] For example, through the camera module, find three points on the circumference of a circle. The coordinates of each point are recorded as (x1, y1), (x2, y2), and (x3, y3). Substitute them into the general equation of the circle A x 2 +A y 2 +Bx+CY=0, we can get the values ​​of A, B, and C, and then we can get waferCenterX=-B / (2*A), waferCenterY=-C / (2*A).

[0097] S32, obtaining the actual coordinates shotCenterX and shotCenterY of the center of the target Shot on the motion platform through the camera module.

[0098] In this embodiment, the target Shot is the Shot in the center of the Shot array. Since a marking point is set at the same position of each Shot, this step can first obtain the coordinates of the marking points on the target Shot, the Shots in the same row as the target Shot, and the Shots in the same column as the target Shot through the camera module; then calculate the actual coordinates shotCenterX and shotCenterY of the center of the target Shot in the row direction and column direction of the motion platform based on the coordinates of each marking point.

[0099] For example, assuming that the coordinates of the marker point in the target Shot are (ShotMechineX1, ShotMechineY1), the coordinates of the marker point in the Shot adjacent to the right of the target Shot are (ShotMechineX2, ShotMechineY2), and the coordinates of the marker point in the adjacent Shot below the target Shot are (ShotMechineX3, ShotMechineY3), then the center coordinates of the target Shot can be obtained as:

[0100] shotCenterX=(ShotMechineX1+ShotMechineX2) / 2

[0101] shotCenterY=(ShotMechineY1+ShotMechineY3) / 2

[0102] S33, calculate the absolute values ​​of the coordinate deviations differenceXAbs and differenceYAbs between the center of the wafer and the center of the target Shot in the row direction and column direction according to the following formula:

[0103] differenceXAbs=|waferCenterX-shotCenterX|

[0104] differenceYAbs=|waferCenterY-shotCenterY|

[0105] S34, calculate the offsets offsetX and offsetY of the center of the wafer relative to the center of the target Shot in the row direction and column direction according to the following formula:

[0106] multiplex=[differenceXAbs / wafer.ShotX]

[0107] multipleY=[differenceYAbs / wafer.ShotY]

[0108] offsetX=differenceXAbs-multipleX*wafer.ShotX

[0109] offsetY=differenceYAbs-multipleY*wafer.ShotY

[0110] Among them, [] represents the rounding symbol, wafer.ShotX represents the width of a single Shot, and ShotY represents the height of a single Shot.

[0111] S4, based on the offset of the center of the wafer relative to the center of the target shot, adjust the boundary position of each shot in the wafer model to achieve the mapping between the wafer model and the wafer entity. The specific adjustment process is as follows:

[0112] S41, based on the offsets offsetX and offsetY, adjust the starting pixel coordinates of Shot in the target artboard area according to the following formula:

[0113] shotStartX'=shotStartX+(offsetX / wafer.ShotX)*shotPixcelX

[0114] shotStartY'=shotStartY+(offsetY / wafer.ShotY)*shotPixcelY

[0115] Among them, shotStartX' and shotStartY' represent the starting pixel coordinates of the Shot in the row and column directions of the target canvas area after adjustment, shotStartX and shotStartY represent the starting pixel coordinates of the Shot in the row and column directions of the target canvas area before adjustment, and shotPixcelX and shotPixcelY represent the pixel values ​​occupied by a single Shot in the row and column directions of the target canvas area.

[0116] S42, redrawing the boundary of each Shot based on the adjusted starting pixel coordinates.

[0117] Specifically, the adjusted starting pixel coordinates shotStartX' and shotStartY' are used as the starting point of the first Shot, and the boundaries of each Shot are redrawn according to the pixel values ​​occupied by a single Shot in the row and column directions of the target canvas area to obtain the target wafer model. In the target wafer model, the positional relationship between the wafer and the Shot is consistent with the entity on the moving table.

[0118] S5, after obtaining the target wafer model, when the user clicks a certain position in the wafer model (such as clicking a certain Die / Shot), the click position corresponding to the click operation in the wafer model is obtained, and the motion stage is controlled to drive the position corresponding to the click position in the wafer to move to the target, such as within the field of view of the camera module. The image of the corresponding position of the wafer is presented in the field of view of the camera, which is convenient for establishing a recipe. For example, when the user clicks the Die / Shot in the ath row and bth column of the wafer model, the motion stage drives the Die / Shot in the ath row and bth column of the wafer to move to the field of view of the camera module.

[0119] It can be seen that the present invention can not only quickly generate a wafer model, but also adjust the boundary position of the shot in the wafer model based on the offset of the center of the wafer on the moving table relative to the center of the target shot in the row and column directions, thereby completing the calibration of the wafer model and realizing the mapping between the wafer model and the wafer entity.

[0120] Example 2

[0121] This embodiment provides an electronic device, which can be expressed in the form of a computing device (for example, a server device), including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the steps of the wafer model generation method provided in Embodiment 1 can be implemented when the processor executes the computer program.

[0122] Figure 5 FIG. 4 shows a schematic diagram of the hardware structure of this embodiment. Figure 5 As shown, the electronic device 30 specifically includes:

[0123] At least one processor 31, at least one memory 32, and a bus 33 for connecting different system components (including the processor 31 and the memory 32), wherein:

[0124] The bus 33 includes a data bus, an address bus, and a control bus.

[0125] The memory 32 includes a volatile memory, such as a random access memory (RAM) 321 and / or a cache memory 322 , and may further include a read-only memory (ROM) 323 .

[0126] The memory 32 also includes a program / utility 325 having a set (at least one) of program modules 324, such program modules 324 including but not limited to: an operating system, one or more application programs, other program modules and program data, each of which or some combination may include an implementation of a network environment.

[0127] The processor 31 executes various functional applications and data processing by running the computer program stored in the memory 32, such as the steps of the wafer model generation method provided in Embodiment 1 of the present invention.

[0128] The electronic device 30 can further communicate with one or more external devices 34 (e.g., keyboards, pointing devices, etc.). Such communication can be performed through an input / output (I / O) interface 35. In addition, the electronic device 30 can also communicate with one or more networks (e.g., local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) through a network adapter 36. The network adapter 36 communicates with other modules of the electronic device 30 through the bus 33. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the electronic device 30, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID (disk array) systems, tape drives, and data backup storage systems.

[0129] It should be noted that although several units / modules or sub-units / modules of the electronic device are mentioned in the above detailed description, this division is merely exemplary and not mandatory. In fact, according to the embodiments of the present application, the features and functions of two or more units / modules described above can be embodied in one unit / module. Conversely, the features and functions of one unit / module described above can be further divided into multiple units / modules to be embodied.

[0130] Example 3

[0131] This embodiment provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the steps of the wafer model generation method provided in Embodiment 1 are implemented.

[0132] The readable storage medium may include but is not limited to: a portable disk, a hard disk, a random access memory, a read-only memory, an erasable programmable read-only memory, an optical storage device, a magnetic storage device or any suitable combination of the above.

[0133] In a possible implementation manner, the present invention can also be implemented in the form of a program product, which includes a program code. When the program product is run on an electronic device, the program code is used to enable the electronic device to execute the steps of the wafer model generation method provided in Example 1.

[0134] The program code for executing the present invention may be written in any combination of one or more programming languages, and may be executed entirely on a user device, partially on a user device, as an independent software package, partially on a user device and partially on a remote device, or entirely on a remote device.

[0135] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A wafer model generation method, characterized in that: include: Acquire parameter information of a wafer currently placed on the moving table, wherein the wafer is divided into a plurality of shots, and the parameter information includes wafer size information and shot size information; Drawing a wafer model corresponding to the wafer in a target drawing board area based on the parameter information, wherein the wafer model includes an outer peripheral contour of the wafer and a boundary of each Shot; Obtaining the offset of the center of the wafer on the moving stage relative to the center of the target Shot; Based on the offset, the boundary position of each Shot in the wafer model is adjusted.

2. The wafer model generation method according to claim 1, characterized in that: Drawing a wafer model corresponding to the wafer in a target drawing board area based on the parameter information includes: Based on the parameter information, determine the number of rows and columns of the Shot; Based on the number of rows and columns of the Shot and the pixel value of the target artboard area, determine the pixel value occupied by a single Shot in the row direction and the column direction of the target artboard area; Based on the pixel values ​​occupied by a single Shot in the row direction and the column direction of the target artboard area, drawing the boundary of each Shot in the target artboard area; Based on the parameter information, the outer periphery of the wafer is drawn in the target drawing board area.

3. The wafer model generation method according to claim 1, characterized in that: The step of obtaining the offset of the center of the wafer on the moving stage relative to the center of the target Shot includes: Acquire the actual coordinates (waferCenterX, waferCenterY) of the center of the wafer on the moving stage based on the camera module; Acquire the actual coordinates (shotCenterX, shotCenterY) of the center of the target Shot on the motion platform based on the camera module; The absolute value of the coordinate deviation (differenceXAbs, differenceYAbs) between the center of the wafer and the center of the target Shot is calculated according to the following formula: differenceXAbs=|waferCenterX-shotCenterX| differenceYAbs=|waferCenterY-shotCenterY| The offsets offsetX and offsetY of the center of the wafer relative to the center of the target Shot are calculated according to the following formula: multiplex=[differenceXAbs / wafer.ShotX] multipleY=[differenceYAbs / wafer.ShotY] offsetX=differenceXAbs-multipleX*wafer.ShotX offsetY=differenceYAbs-multipleY*wafer.ShotY Among them, [] represents the rounding symbol, wafer.ShotX represents the width of a single Shot, and ShotY represents the height of a single Shot.

4. The wafer model generation method according to claim 3, characterized in that: The step of adjusting the boundary position of each Shot in the wafer model based on the offset includes: Adjust the starting pixel coordinates of each Shot in the target artboard area according to the following formula: shotStartX'=shotStartX+(offsetX / wafer.ShotX)*shotPixcelX shotStartY'=shotStartY+(offsetY / wafer.ShotY)*shotPixcelY Wherein, (shotStartX', shotStartY') represents the starting pixel coordinates of each Shot in the target canvas area after adjustment, (shotStartX, shotStartY) represents the starting pixel coordinates of each Shot in the row direction and column direction of the target canvas area before adjustment, shotPixcelX, shotPixcelY represent the pixel values ​​occupied by a single Shot in the row direction and column direction of the target canvas area respectively; The boundary of each Shot is redrawn based on the adjusted starting pixel coordinates.

5. The wafer model generation method according to claim 3, characterized in that: The method of obtaining the actual coordinates (waferCenterX, waferCenterY) of the center of the wafer on the moving stage based on the camera module includes: Acquiring actual coordinates of at least three points on the circumference of the wafer through the camera module; Based on the actual coordinates of the at least three points, the actual coordinates of the center of the wafer on the moving stage are calculated.

6. The wafer model generation method according to claim 3, characterized in that: The obtaining the actual coordinates (shotCenterX, shotCenterY) of the center of the target Shot on the motion platform based on the camera module includes: Acquire the coordinates of the marking points on the target Shot and the Shots in the same row and column as the target Shot through the camera module; Based on the coordinates of each of the marking points, the actual coordinates (shotCenterX, shotCenterY) of the center of the target Shot on the motion stage are calculated.

7. The wafer model generation method according to claim 1, characterized in that: After adjusting the boundary position of each Shot in the wafer model, the method further includes: Obtaining a click position corresponding to a click operation in the wafer model; The moving platform is controlled to move the position of the wafer corresponding to the click position to the target position.

8. The wafer model generation method according to claim 1, characterized in that: Each of the Shots includes a plurality of Dies, and the parameter information of the wafer also includes the number of Dies contained in a single Shot in the row direction and the column direction respectively; The method further includes: drawing the boundary of each Die based on the number of Dies contained in a single Shot in the row direction and the column direction respectively.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and capable of running on the processor, characterized in that: When the processor executes the computer program, the steps of the wafer model generation method according to any one of claims 1 to 8 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the wafer model generation method according to any one of claims 1 to 8 are implemented.

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