Display module and display device

Abstract

This application relates to a display module and a display device; the display module includes a display panel, a support layer, a flexible circuit board, and an auxiliary structure; the display panel includes a display portion and a bonding portion located on the side of the display portion away from the display surface; the support layer is disposed on the side of the display portion away from the display surface and is located between the display portion and the bonding portion; the flexible circuit board includes a connecting portion and a circuit board body, one end of the connecting portion is connected to the bonding portion, and the other end of the connecting portion is connected to the circuit board body; the auxiliary structure is connected to the circuit board body and is attached to the side of the support layer away from the display portion; wherein, at least a portion of the orthographic projection of the auxiliary structure on the support layer does not overlap with the orthographic projection of the flexible circuit board on the support layer, and the material of the auxiliary structure includes a metallic material; this application can improve the yield of the bending process of the display module and improve the stability of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] As users have higher and higher requirements for display modules, such as longer battery life, OEMs have begun to reduce the size of various components.

[0003] In display modules, flexible circuit boards are often placed on the back side of the display panel, which takes up a certain amount of space. In order to save space on the back side of the display panel to meet higher user needs, such as increasing the size of the battery to improve battery life, the size of the flexible circuit board needs to be reduced, resulting in a smaller area of ​​the flexible circuit board.

[0004] Currently, in the bending process of flexible printed circuit boards (FPCBs), bending equipment is often used to control the placement of the FPCB on the back side of the display panel. However, due to the small area of ​​the FPCB, it is difficult to adsorb and control the FPCB using bending equipment, which leads to a decrease in the yield of the FPCB bending process. Summary of the Invention

[0005] This application provides a display module and display device that can improve the yield of the bending process of the display module and improve the stability of the display module.

[0006] This application provides a display module, which includes:

[0007] The display panel includes a display section and a mounting section located on the side of the display section away from the display surface;

[0008] A support layer is disposed on the side of the display unit away from the display surface and is located between the display unit and the bonding part;

[0009] A flexible circuit board includes a connecting part and a circuit board body, wherein one end of the connecting part is connected to the binding part, and the other end of the connecting part is connected to the circuit board body;

[0010] An auxiliary structure is connected to the main body of the circuit board and is attached to the side of the support layer away from the display section.

[0011] Wherein, at least a portion of the auxiliary structure's orthographic projection on the support layer does not overlap with the orthographic projection of the flexible circuit board on the support layer, and the material of the auxiliary structure includes metallic materials.

[0012] In one embodiment of this application, the circuit board body is located on the side of the connection portion away from the bonding portion, the orthographic projection of the auxiliary structure on the support layer does not overlap with the orthographic projection of the bonding portion on the support layer, and the circuit board body is attached to the side of the auxiliary structure away from the support layer.

[0013] In one embodiment of this application, the auxiliary structure includes a first sub-part that is attached to the circuit board body and a second sub-part that is connected to the first sub-part. The orthographic projection of the first sub-part on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second sub-part on the support layer is located outside the orthographic projection of the circuit board body on the support layer.

[0014] The second sub-part is located on the side of the circuit board body away from the connecting part.

[0015] In one embodiment of this application, the display module further includes a first adhesive layer disposed between the circuit board body and the auxiliary structure, and a second adhesive layer disposed between the support layer and the auxiliary structure;

[0016] Wherein, the orthographic projection of the first adhesive layer on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second adhesive layer on the support layer is located within the orthographic projection of the auxiliary structure on the support layer.

[0017] In one embodiment of this application, the material of the auxiliary structure and the material of the support layer both include the same metallic material.

[0018] In one embodiment of this application, the circuit board body is attached to the side of the support layer away from the display portion;

[0019] The auxiliary structure is connected to the side of the circuit board body away from the connecting part, and the orthographic projection of the auxiliary structure on the support layer does not overlap with the orthographic projection of the circuit board body on the support layer.

[0020] In one embodiment of this application, the circuit board body includes a plurality of sub-layers stacked together, and the auxiliary structure is connected to at least one of the sub-layers;

[0021] The auxiliary structure is made of the same material as the connected sublayer.

[0022] In one embodiment of this application, the display module further includes a third adhesive layer disposed between the support layer and the circuit board body, and a fourth adhesive layer disposed between the support layer and the auxiliary structure, wherein the thickness of the fourth adhesive layer is less than the thickness of the third adhesive layer.

[0023] In one embodiment of this application, the third adhesive layer is connected to the fourth adhesive layer, and the material of the third adhesive layer is the same as that of the fourth adhesive layer.

[0024] In one embodiment of this application, the thickness of the auxiliary structure is less than the thickness of the circuit board body.

[0025] In one embodiment of this application, a groove is provided on the side of the support layer away from the display portion, and at least the auxiliary structure is attached to the groove.

[0026] In one embodiment of this application, the distance from the side of the auxiliary structure away from the display portion to the bottom of the groove is less than or equal to the depth of the groove.

[0027] In one embodiment of this application, the depth of the groove is less than or equal to half the thickness of the support layer.

[0028] In one embodiment of this application, the orthographic projection of the auxiliary structure onto the support layer is located within the groove, and the area of ​​the orthographic projection of the auxiliary structure onto the support layer is smaller than the area of ​​the groove.

[0029] In one embodiment of this application, the display module includes a bending area, the support layer includes a patterned structure disposed within the bending area, and the groove is located outside the bending area.

[0030] In one embodiment of this application, the display module further includes:

[0031] A cover plate is disposed on the side of the display panel away from the support layer;

[0032] A first backplate is disposed between the display unit and the support layer;

[0033] A buffer layer is disposed between the first back plate and the support layer;

[0034] The second backplate is disposed between the binding part and the support layer.

[0035] In accordance with the above objectives of this application, embodiments of this application also provide a display device, the display device including the display module.

[0036] This application provides a display module and display device. By adding an auxiliary structure connected to the main body of the circuit board, and at least part of the auxiliary structure is not overlapped with the main body of the circuit board, the auxiliary structure that is not overlapped with the main body of the circuit board can be used to be adsorbed by the adsorption device of the bending device to complete the bending process of the display module. The auxiliary structure is attached to the side of the support layer away from the display part and does not need to be removed. Therefore, stress will not be generated on the main body of the circuit board due to the removal of the auxiliary structure, reducing the probability of the main body of the circuit board falling off. This can improve the yield of the bending process of the display module and improve the stability of the display module.

[0037] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0040] Figure 1 A schematic diagram of the structure of a display panel provided in one embodiment;

[0041] Figure 2 and Figure 3 A schematic diagram of the Bending process structure of a display panel provided in one embodiment;

[0042] Figure 4 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0043] Figure 5 and Figure 6 This is a schematic diagram of a Bending process structure for a display panel provided in an embodiment of this application;

[0044] Figure 7 A schematic diagram of a flexible circuit board and auxiliary structure provided in an embodiment of this application;

[0045] Figure 8 A top view schematic diagram of the auxiliary structure and the second adhesive layer provided in the embodiments of this application;

[0046] Figure 9A side view schematic diagram of the auxiliary structure, the first adhesive layer and the second adhesive layer provided in the embodiments of this application;

[0047] Figure 10 A top view schematic diagram of the auxiliary structure and the first adhesive layer provided in the embodiments of this application;

[0048] Figure 11 Provided for the embodiments of this application Figure 1 and Figure 4 The bar chart shown displays the impact resistance test results of the module.

[0049] Figure 12 Another structural schematic diagram of the display panel provided in the embodiments of this application;

[0050] Figure 13 A schematic diagram of an auxiliary structure and circuit board body provided in an embodiment of this application;

[0051] Figure 14 This is a schematic diagram of another structure of the auxiliary structure and the main body of the circuit board provided in the embodiments of this application.

[0052] Explanation of reference numerals in the attached figures:

[0053] 1. Display panel; 2. Support plate; 3. Flexible circuit board; 4. Adhesive layer; 5. Support film;

[0054] 10. Display panel; 11. Display section; 12. Binding section; 13. Bending section; 101. Display surface;

[0055] 20. Support layer; 201. Groove;

[0056] 30. Flexible printed circuit board; 31. Circuit board body; 32. Connector; 301. Component area; 311. Sublayer;

[0057] 40. Auxiliary structure; 401. Adsorption region;

[0058] 51. First adhesive layer; 52. Second adhesive layer; 53. Third adhesive layer; 54. Fourth adhesive layer;

[0059] 61. Cover plate; 62. Fifth adhesive layer; 63. Polarizing film; 641. First back plate; 642. Second back plate; 65. Buffer layer; 66. Spacer layer; 67. Bending protection section. Detailed Implementation

[0060] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0061] Please combine Figure 1 , Figure 2 as well as Figure 3 In one embodiment, the display module includes a display panel 1, a support plate 2 disposed on the back side of the display panel 1, and a flexible circuit board 3 attached to the side of the support plate 2 away from the display panel. The flexible circuit board 3 is bonded to the support plate 2 through an adhesive layer 4. In the bending process of the flexible circuit board 3, because the area of ​​the flexible circuit board 3 is compressed, the bending device cannot directly adsorb the flexible circuit board 3. Therefore, a support film 5 is attached to the flexible circuit board 3, and the bending device adsorbs the support film 5, thereby driving the flexible circuit board 3 to bend. However, when the adhesion between the support film 5 and the flexible circuit board 3 is insufficient, the support film 5 is prone to detachment, which in turn prevents the flexible circuit board 3 from being pulled to the preset position. Figure 3 As shown, currently, the yield of bending is often improved by enhancing the adhesion between the support film 5 and the flexible circuit board 3. However, when the support film 5 is removed, the adhesive layer 4 and the support board 2 will fall off and separate due to the large adhesion between the support film 5 and the flexible circuit board 3. This will cause the flexible circuit board 3 to interfere with other components of the display module, seriously affecting the bending yield and stability of the display module.

[0062] Please refer to Figure 4 This application provides a display module, which includes a display panel 10, a support layer 20, a flexible circuit board 30, and an auxiliary structure 40. The display panel 10 includes a display part 11 and a binding part 12 located on the side of the display part 11 away from the display surface 101. The support layer 20 is disposed on the side of the display part 11 away from the display surface 101 and is located between the display part 11 and the binding part 12. The flexible circuit board 30 includes a connecting part 32 and a circuit board body 31. One end of the connecting part 32 is connected to the binding part 12, and the other end of the connecting part 32 is connected to the circuit board body 31. The auxiliary structure 40 is connected to the circuit board body 31 and is attached to the side of the support layer 20 away from the display part 11.

[0063] Wherein, at least a portion of the orthographic projection of the auxiliary structure 40 onto the support layer 20 does not overlap with the orthographic projection of the flexible circuit board 30 onto the support layer 20, and the material of the auxiliary structure 40 includes metallic materials.

[0064] In the implementation process, this application embodiment adds an auxiliary structure 40 connected to the circuit board body 31, and at least part of the auxiliary structure 40 is not overlapped with the circuit board body 31. Therefore, the auxiliary structure 40 that does not overlap with the circuit board body 31 can be used to adsorb with the adsorption device of the bending device to complete the bending process of the display module. The auxiliary structure 40 is attached to the side of the support layer 20 away from the display part 11 and does not need to be removed. Therefore, removing the auxiliary structure 40 will not cause stress to the circuit board body 31, reducing the probability of the circuit board body 31 falling off. This can improve the yield of the bending process of the display module and improve the stability of the display module.

[0065] It should be noted that one end of the display panel 10 is bent and extends away from the display surface 101. Specifically, the display panel 10 also includes a bent portion 13 connecting the display part 11 and the binding part 12. The display part 11 may be straight, the binding part 12 is located on the side of the display part 11 away from the display surface 101, and the bent portion 13 is bent and connected between the end of the display part 11 and the end of the binding part 12.

[0066] In some embodiments, the display module further includes a cover plate 61 disposed on one side of the display surface 101 of the display unit 11, a third adhesive layer 62 disposed between the display unit 11 and the cover plate 61, and a polarizer 63 disposed between the third adhesive layer 62 and the display unit 11. The polarizer 63 is bonded to the cover plate 61 through the third adhesive layer 62, and the polarizer 63 can be attached to the display surface 101 of the display unit 11.

[0067] In some embodiments, the display module may not include the polarizer 63, the cover plate 61 may be directly attached to the display surface 101 of the display unit 11 through the third adhesive layer 62, and the display panel 10 may be an OLED display panel. A color filter layer may be added to the display panel 10 to achieve the functions of filtering, reducing reflection and replacing the polarizer.

[0068] In some embodiments, the display module further includes a first back plate 641 disposed between the display portion 11 and the support layer 20, a buffer layer 65 disposed between the first back plate 641 and the support layer 20, a second back plate 642 disposed between the binding portion 12 and the support layer 20, a spacer portion 66 disposed between the second back plate 642 and the support layer 20, and a bending protection portion 67 covering the outer side of the bending portion 13.

[0069] The support layer 20, the first back plate 641, the buffer layer 65, the second back plate 642, and the spacer portion 66 are all located inside the bend of the bending portion 13, while the bending protection portion 67 covers the outside of the bend of the bending portion 13.

[0070] In some embodiments, the material of the buffer layer 65 may include at least one of polyimide, polyurethane rubber, silicone-containing polyurethane rubber, and foam, so as to provide support and cushioning for the display panel. The material of the support layer 20 may include stainless steel, aluminum alloy, or titanium alloy, so as to provide support and protection for the display panel.

[0071] In this embodiment, one end of the flexible circuit board 30 is connected to the bonding portion 12, and the other end of the flexible circuit board 30 extends away from the bonding portion 12 and is attached to the side of the support layer 20 away from the display portion 11. Specifically, the flexible circuit board 30 includes a connecting portion 32 and a circuit board body 31 connected to each other, and the connecting portion 32 is connected to the bonding portion 12. The circuit board body 31 extends away from the bonding portion 12 and is attached to the side of the support layer 20 away from the display portion 11, that is, the circuit board body 31 is located on the side of the connecting portion 32 away from the bonding portion 12.

[0072] In some embodiments, the circuit board body 31 is provided with a device area 301 for arranging lines, circuits and components.

[0073] Please combine Figure 4 , Figure 5 as well as Figure 6 The display module provided in this application embodiment includes an auxiliary structure 40, and the auxiliary structure 40 is connected to the flexible circuit board 30. The auxiliary structure 40 is attached to the side of the support layer 20 away from the display part 11.

[0074] Wherein, the orthographic projection of the auxiliary structure 40 on the support layer 20 does not overlap with the orthographic projection of the binding part 12 on the support layer 20, and at least part of the auxiliary structure 40 is not overlapped with the flexible circuit board 30. The auxiliary structure 40 that is not overlapped with the flexible circuit board 30 is provided with an adsorption area 401 for adsorption with the adsorption device of the Bending device, such as adsorption with the suction nozzle of the Bending device.

[0075] In the bending process of the display module, the adsorption device of the bending equipment adsorbs the adsorption area 401 on the auxiliary structure 40, and the bending equipment pulls the auxiliary structure 40 and the flexible circuit board 30 to the side of the display part 11 away from the display surface 101, such as... Figure 6 As shown; then, the circuit board body 31 is attached to the side of the support layer 20 away from the display part 11, and the auxiliary structure 40 is attached to the side of the support layer 20 away from the display part 11. On the one hand, the auxiliary structure 40 does not need to be removed, thus avoiding the generation of large stress on the circuit board body 31 due to the removal of the auxiliary structure 40, reducing the probability of the circuit board body 31 peeling off due to stress, reducing the probability of the circuit board body 31 interfering with other components of the display module due to detachment, and improving the yield of the display module in the bending process; on the other hand, this application can increase the adhesion between the auxiliary structure 40 and the circuit board body 31 to ensure that the bending device can pull the circuit board body 31 to the preset position for attachment, further improving the yield of the bending process of the display module.

[0076] In some embodiments, the thickness of the auxiliary structure 40 is less than the thickness of the circuit board body 31. Therefore, the auxiliary structure 40 added in this embodiment has less impact on the spatial arrangement of other devices in the display module relative to the circuit board body 31, and is more conducive to increasing the arrangement space of other devices in the display module, such as increasing the volume of the battery in the display module, so that the display module has a longer battery life.

[0077] In one embodiment of this application, please refer to Figure 4 , Figure 7 , Figure 8 , Figure 9 as well as Figure 10 In this embodiment, the circuit board body 31 is attached to the side of the auxiliary structure 40 away from the support layer 20.

[0078] The auxiliary structure 40 includes a first sub-part 41 that is attached to the circuit board body 31 and a second sub-part 42 connected to the first sub-part 41. The orthographic projection of the first sub-part 41 on the support layer 20 is located within the orthographic projection of the circuit board body 31 on the support layer 20, and the orthographic projection of the second sub-part 42 on the support layer 20 is located outside the orthographic projection of the circuit board body 31 on the support layer 20. The circuit board body 31 is attached to the side of the first sub-part 41 away from the display part 11, and the adsorption area 401 can be disposed on the first sub-part 41.

[0079] It is understandable that since the side of the circuit board body 31 close to the support layer 20 can be attached to the auxiliary structure 40, the adhesion between the circuit board body 31 and the auxiliary structure 40 can be effectively improved. This makes it easier for the auxiliary structure 40 to move the circuit board body 31 to a preset position on the back of the display part 11 for attachment, thereby improving the yield of the bending process of the display module.

[0080] In some embodiments, the second sub-part 42 is located on the side of the circuit board body 31 away from the connection part 32, that is, the orthographic projection of the second sub-part 42 on the support layer 20 is located on the side of the orthographic projection of the circuit board body 31 on the support layer 20 away from the orthographic projection of the connection part 32 on the support layer 20.

[0081] In some embodiments, the distance L1 from the first sub-part 41 to the second sub-part 42 can be greater than or equal to 7.5 mm and less than or equal to 8.5 mm. For example, the distance L1 can be 7.5 mm, 7.6 mm, 7.7 mm, 7.8 mm, 7.9 mm, 8 mm, 8.1 mm, 8.2 mm, 8.3 mm, 8.4 mm or 8.5 mm.

[0082] In some embodiments, the material of the auxiliary structure 40 may include a metallic material, such as stainless steel or aluminum alloy, or the material of the auxiliary structure 40 and the material of the support layer 20 may both be the same material, for example, the material of the auxiliary structure 40 and the material of the support layer 20 may both be stainless steel.

[0083] In some embodiments, the display module further includes a first adhesive layer 51 disposed between the circuit board body 31 and the auxiliary structure 40, and a second adhesive layer 52 disposed between the support layer 20 and the auxiliary structure 40; the auxiliary structure 40 is attached to the side of the support layer 20 away from the display portion 11 through the second adhesive layer 52, and the circuit board body 31 is attached to the side of the auxiliary structure 40 away from the support layer 20 through the first adhesive layer 51.

[0084] Wherein, the orthographic projection of the first adhesive layer 51 on the support layer 20 lies within the orthographic projection of the circuit board body 31 on the support layer 20, and the orthographic projection of the second adhesive layer 52 on the support layer 20 lies within the orthographic projection of the auxiliary structure 40 on the support layer 20; that is, the edge of the first adhesive layer 51 can be recessed relative to the edge of the circuit board body 31 to avoid the first adhesive layer 51 exceeding the coverage area of ​​the circuit board body 31 due to factors of bonding accuracy; the edge of the second adhesive layer 52 can be recessed relative to the edge of the auxiliary structure 40 to avoid the second adhesive layer 52 exceeding the coverage area of ​​the auxiliary structure 40 due to factors of bonding accuracy.

[0085] Furthermore, the orthographic projection of the first adhesive layer 51 onto the support layer 20 does not exceed the coverage area of ​​the orthographic projection of the auxiliary structure 40 onto the support layer 20. For example, the edge of the first adhesive layer 51 can be flush with the edge of the first sub-part 41 so that the adhesion area between the circuit board body 31 and the auxiliary structure 40 is maximized.

[0086] In some embodiments, the thickness of the second adhesive layer 52 is less than the thickness of the first adhesive layer 51, so as to reduce the sum of the thicknesses of the second sub-part 42 and the second adhesive layer 52, thereby reducing the impact of the second sub-part 42 and the second adhesive layer 52 on the arrangement space of other devices in the display module.

[0087] In some embodiments, a groove 201 is formed on the side of the support layer 20 away from the display portion 11, and at least the auxiliary structure 40 is attached to the groove 201. That is, the auxiliary structure 40 and the second adhesive layer 52 are located in the groove 201, which can effectively reduce the overall thickness of the display module after the addition of the auxiliary structure 40. Furthermore, since the auxiliary structure 40 is set in the groove 201, the placement of the auxiliary structure 40 can avoid affecting the arrangement space of other devices. In particular, since the material of the auxiliary structure 40 includes metal, the auxiliary structure 40 has good support. When the auxiliary structure 40 is attached to the groove 201, it can compensate for the reduced support of the support layer 20 due to the groove 201.

[0088] In one embodiment of this application, the distance from the side of the auxiliary structure 40 away from the display portion 11 to the bottom of the groove 201 is less than or equal to the depth of the groove 201; more preferably, the side of the auxiliary structure 40 away from the display portion 11 is flush with the portion of the support layer 20 where the groove 201 is not provided.

[0089] In some embodiments, the depth of the groove 201 is less than or equal to half the thickness of the support layer 20. On the one hand, the groove 201 can be set to save space of the display module, and on the other hand, it can also ensure the support performance of the support layer 20.

[0090] In some embodiments, the orthographic projection of the auxiliary structure 40 on the support layer 20 is located within the groove 201, and the area of ​​the orthographic projection of the auxiliary structure 40 on the support layer 20 is smaller than the area of ​​the groove 201, so as to facilitate the attachment of the auxiliary structure 40 to the groove 201 and reduce the probability of interference during the attachment process.

[0091] In some embodiments, the distance L2 between the orthographic projection area of ​​the auxiliary structure 40 on the support layer 20 and the sidewall of the groove 201 is greater than or equal to 0.6 mm and less than or equal to 0.7 mm. For example, the distance L2 can be 0.6 mm, 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, 0.66 mm, 0.67 mm, 0.68 mm, 0.69 mm, or 0.7 mm.

[0092] In one specific embodiment of this application, the first adhesive layer 51 can be a conductive thermosetting adhesive with a thickness of 0.05 mm, and the auxiliary structure 40 can be stainless steel with a thickness of 0.05 mm. The first adhesive layer 51 is bonded to the auxiliary structure 40, and the edge of the first adhesive layer 51 is flush with the edge of the first sub-part 41. Then, the side of the first adhesive layer 51 away from the auxiliary structure 40 is bonded to the circuit board body 31 and cured after high temperature. Further, the second adhesive layer 52 can be a conductive adhesive with a thickness of 0.025 mm, and the side of the auxiliary structure 40 away from the first adhesive layer 51 is bonded to the second adhesive layer 52. The inward distance of the edge of the second adhesive layer 52 relative to the edge of the auxiliary structure 40 can be 0.2 mm. Next, a groove 201 is formed on the support layer 20, and the auxiliary structure 40 is attached to the groove 201 through the second adhesive layer 52. The depth of the groove 201 can be 0.075 mm, and the thickness of the support layer 20 can be 0.15 mm.

[0093] Furthermore, the embodiments of this application provide for Figure 1 The diagram shows the module structure and Figure 4 The illustrated module structure underwent an impact resistance test to verify the features provided in the embodiments of this application. Figure 4 The impact resistance of the display module shown is as follows; and the results are as follows Figure 11 The bar chart shown has a comparative example of... Figure 1 The image shows the impact resistance test data of the display module. An example is shown below. Figure 4 The image shows the impact resistance test of the display module, and is composed of... Figure 11 It can be seen that the impact resistance of the display module provided in this application embodiment will not decrease due to the setting of the auxiliary structure 40.

[0094] It should be noted that the display module also includes a bending area, and the display part 11 is bent in the bending area. The support layer 20 includes a patterned structure disposed in the bending area to reduce bending stress, and the groove 201 is disposed outside the bending area.

[0095] In some embodiments, the patterned structure may be disposed on the side of the support layer 20 away from the display portion 11, or on the side of the support layer 20 close to the display portion 11, or it may be configured as a through hole penetrating the support layer 20; and the groove 201 may be formed in the same process as the patterned structure.

[0096] Continuing from the above, in this embodiment, an auxiliary structure 40 is attached to the side of the support layer 20 away from the display part 11, while the circuit board body 31 is directly attached to the side of the auxiliary structure 40 away from the support layer 20. Thus, the auxiliary structure 40, which does not overlap with the circuit board body 31, can be used to adsorb with the adsorption device of the bending equipment to complete the bending process of the display module. Furthermore, since the auxiliary structure 40 and the circuit board body 31 are layered and attached to the side of the support layer 20 away from the display part 11, they do not need to be removed. Therefore, removing the auxiliary structure 40 will not cause stress to the circuit board body 31, reducing the probability of the circuit board body 31 detaching. This improves the yield of the bending process of the display module and enhances the stability of the display module.

[0097] In another embodiment of this application, please refer to Figure 12 In this embodiment, the circuit board body 31 is attached to the side of the support layer 20 away from the display part 11, that is, both the circuit board body 31 and the support layer 20 are attached to the side of the support layer 20 away from the display part 11.

[0098] In some embodiments, one end of the auxiliary structure 40 is connected to the side of the circuit board body 31 away from the connecting portion 32, and the other end of the auxiliary structure 40 extends in a direction away from the circuit board body 31 and is attached to the side of the support layer 20 away from the display portion 11. The orthographic projection of the auxiliary structure 40 on the support layer 20 does not overlap with the orthographic projection of the circuit board body 31 on the support layer 20.

[0099] In some embodiments, the display module further includes a third adhesive layer 53 disposed between the support layer 20 and the circuit board body 31, and a fourth adhesive layer 54 disposed between the support layer 20 and the auxiliary structure 40, wherein the thickness of the fourth adhesive layer 54 is less than or equal to the thickness of the third adhesive layer 53.

[0100] Specifically, when the thickness of the fourth adhesive layer 54 is less than the thickness of the third adhesive layer 53, the sum of the thicknesses of the auxiliary structure 40 and the fourth adhesive layer 54 can be reduced, thereby reducing the impact of the auxiliary structure 40 and the fourth adhesive layer 54 on the arrangement space of other components in the display module. When the thickness of the fourth adhesive layer 54 is equal to the thickness of the third adhesive layer 53, the side of the auxiliary structure 40 near the fourth adhesive layer 54 is flush with the side of the circuit board body 31 near the third adhesive layer 53, which can effectively reduce stress and lower the probability of the circuit board body 31 being damaged due to stress.

[0101] In some embodiments, the third adhesive layer 53 is connected to the fourth adhesive layer 54, and the material of the third adhesive layer 53 is the same as that of the fourth adhesive layer 54, that is, the third adhesive layer 53 and the fourth adhesive layer 54 can be an integral structure.

[0102] In some embodiments, the auxiliary structure 40 and the circuit board body 31 contain the same material; specifically, the circuit board body 31 is a multilayer board structure, that is, the circuit board body 31 includes a plurality of sub-layers 311 stacked together, and the auxiliary structure 40 is connected to at least one of the sub-layers 311; wherein, the auxiliary structure 40 and the connected sub-layer 311 are made of the same material, that is, the auxiliary structure 40 and the at least one connected sub-layer 311 are an integrated structure.

[0103] It should be noted that the auxiliary structure 40 is connected to at least one of the sub-layers 311 that is closer to the support layer 20, so that the auxiliary structure 40 can be set closer to the support layer 20, reducing the impact of the auxiliary structure 40 on the arrangement space of other devices in the display module.

[0104] In some embodiments, the circuit board body 311 includes signal lines and electrical components disposed in a plurality of sub-layers 311, wherein the signal lines and electrical components may be made of a metallic material; then the auxiliary structure 40 may be made of the same metallic material as the signal lines and electrical components to prepare a metal film layer, so as to increase the support and rigidity of the auxiliary structure 40, and the metal film layer in the auxiliary structure 40 is insulated from the signal lines and electrical components in the circuit board body 311, and there is no signal transmission relationship.

[0105] In some embodiments, the auxiliary structure 40 is connected to one of the sublayers 311, such as... Figure 13 As shown, or the auxiliary structure 40 is connected to the two sub-layers 311, such as Figure 14 As shown.

[0106] In some embodiments, a groove 201 is formed on the side of the support layer 20 away from the display part 11. The auxiliary structure 40 and the circuit board body 31 are both attached to the groove 201. That is, the circuit board body 31 and the auxiliary structure 40 are located in the groove 201 through the third adhesive layer 53 and the fourth adhesive layer 54, respectively. This can effectively reduce the overall thickness of the display module after the addition of the auxiliary structure 40. Furthermore, since the auxiliary structure 40 and the circuit board body 31 are attached to the groove 201, the placement of the auxiliary structure 40 can avoid affecting the arrangement space of other devices. Since the material of the auxiliary structure 40 includes metal, the auxiliary structure 40 has good support. When the auxiliary structure 40 is attached to the groove 201, it can compensate for the reduced support of the support layer 20 caused by the groove 201.

[0107] It should be noted that the circuit board body 31 is attached to the groove 201, that is, the circuit board body 31 is attached to the bottom of the groove 201 through the third adhesive layer 53. However, because the circuit board body 31 is relatively thick, the circuit board body 31 will protrude outside the groove 201.

[0108] In one embodiment of this application, the distance from at least a portion of the auxiliary structure 40 away from the display portion 11 to the bottom of the groove 201 is less than or equal to the depth of the groove 201; more preferably, at least a portion of the auxiliary structure 40 away from the display portion 11 is flush with the portion of the support layer 20 where the groove 201 is not provided.

[0109] In some embodiments, the depth of the groove 201 is less than or equal to half the thickness of the support layer 20. On the one hand, the groove 201 can be set to save space of the display module, and on the other hand, it can also ensure the support performance of the support layer 20.

[0110] In some embodiments, the orthographic projection of the auxiliary structure 40 on the support layer 20 and the orthographic projection of the circuit board body 31 on the support layer 20 are both located within the groove 201. The sum of the orthographic projection area of ​​the auxiliary structure 40 on the support layer 20 and the orthographic projection area of ​​the circuit board body 31 on the support layer 20 is less than the area of ​​the groove 201, so as to facilitate the attachment of the auxiliary structure 40 and the circuit board body 31 to the bottom of the groove 201 and reduce the probability of interference of the auxiliary structure 40 during the attachment process.

[0111] In some embodiments, the distance between the projected area of ​​the auxiliary structure 40 on the support layer 20 and the sidewall of the groove 201 is greater than or equal to 0.6 mm and less than or equal to 0.7 mm. For example, the distance L2 can be 0.6 mm, 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, 0.66 mm, 0.67 mm, 0.68 mm, 0.69 mm, or 0.7 mm.

[0112] It should be noted that the display module also includes a bending area, and the display part 11 is bent in the bending area. The support layer 20 includes a patterned structure disposed in the bending area to reduce bending stress, and the groove 201 is disposed outside the bending area.

[0113] In some embodiments, the patterned structure may be disposed on the side of the support layer 20 away from the display portion 11, or on the side of the support layer 20 close to the display portion 11, or it may be configured as a through hole penetrating the support layer 20; and the groove 201 may be formed in the same process as the patterned structure.

[0114] Continuing from the above, in this embodiment, the auxiliary structure 40 is formed by a portion of the film layer in the circuit board body 31 with a multilayer board structure. That is, the auxiliary structure 40 and the circuit board body 31 are an integrated structure, without the need for additional film layers, simplifying the process and reducing costs. Furthermore, the auxiliary structure 40 is a portion of the circuit board body 31 extending away from the connecting portion 32. Therefore, the auxiliary structure 40 and the circuit board body 31 do not overlap. Consequently, the auxiliary structure 40 can be used to adsorb with the adsorption device of the bending device to complete the bending process of the display module. Moreover, both the auxiliary structure 40 and the circuit board body 31 are attached to the side of the support layer 20 away from the display portion 11, without the need for removal. This prevents stress on the circuit board body 31 caused by removing the auxiliary structure 40, reducing the probability of the circuit board body 31 detaching. This improves the yield of the bending process of the display module and enhances the stability of the display module.

[0115] In addition, this application embodiment also provides a display device, which includes the display module described in the above embodiments.

[0116] It is understood that since the display device has the same display module as in the above embodiments, the display device has the same beneficial effects as the display module, which will not be repeated here.

[0117] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0118] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0119] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0120] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display module, characterized in that, include: The display panel includes a display section and a mounting section located on the side of the display section away from the display surface; A support layer is disposed on the side of the display unit away from the display surface and is located between the display unit and the bonding part; A flexible circuit board includes a connecting part and a circuit board body, wherein one end of the connecting part is connected to the binding part, and the other end of the connecting part is connected to the circuit board body; An auxiliary structure is connected to the main body of the circuit board and is attached to the side of the support layer away from the display section. The circuit board body is located on the side of the connecting part away from the binding part, the orthographic projection of the auxiliary structure on the support layer does not overlap with the orthographic projection of the binding part on the support layer, and the circuit board body is attached to the side of the auxiliary structure away from the support layer; Wherein, at least a portion of the orthographic projection of the auxiliary structure on the support layer does not overlap with the orthographic projection of the flexible circuit board on the support layer. The material of the auxiliary structure includes a metallic material. The auxiliary structure includes a first sub-part that is attached to the circuit board body and a second sub-part connected to the first sub-part. The orthographic projection of the first sub-part on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second sub-part on the support layer is located outside the orthographic projection of the circuit board body on the support layer. The second sub-part is located on the side of the circuit board body away from the connecting portion.

2. The display module according to claim 1, characterized in that, The display module further includes a first adhesive layer disposed between the circuit board body and the auxiliary structure, and a second adhesive layer disposed between the support layer and the auxiliary structure; Wherein, the orthographic projection of the first adhesive layer on the support layer is located within the orthographic projection of the circuit board body on the support layer, and the orthographic projection of the second adhesive layer on the support layer is located within the orthographic projection of the auxiliary structure on the support layer.

3. The display module according to claim 1, characterized in that, The auxiliary structure and the support layer are both made of the same metallic material.

4. The display module according to claim 1, characterized in that, The thickness of the auxiliary structure is less than the thickness of the circuit board body.

5. The display module according to any one of claims 1 to 4, characterized in that, The support layer has a groove on the side away from the display section, and at least the auxiliary structure is attached to the groove.

6. The display module according to claim 5, characterized in that, The distance from the side of the auxiliary structure away from the display to the bottom of the groove is less than or equal to the depth of the groove.

7. The display module according to claim 5, characterized in that, The depth of the groove is less than or equal to half the thickness of the support layer.

8. The display module according to claim 5, characterized in that, The orthographic projection of the auxiliary structure onto the support layer is located within the groove, and the area of ​​the orthographic projection of the auxiliary structure onto the support layer is smaller than the area of ​​the groove.

9. The display module according to claim 5, characterized in that, The display module includes a bending area, the support layer includes a patterned structure disposed within the bending area, and the groove is located outside the bending area.

10. The display module according to claim 1, characterized in that, The display module also includes: A cover plate is disposed on the side of the display panel away from the support layer; A first backplate is disposed between the display unit and the support layer; A buffer layer is disposed between the first back plate and the support layer; The second backplate is disposed between the binding part and the support layer.

11. A display device, characterized in that, The display device includes a display module as described in any one of claims 1 to 10.

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