Preparation process optimization method and system applied to high-frequency special capacitor

Abstract

The invention relates to the technical field of capacitor preparation, in particular to a preparation process optimization method and system applied to a high-frequency special capacitor, and the method comprises the steps: confirming a preparation environment, receiving a preparation instruction based on the preparation environment, and if the quality of a modified polypropylene film is not within a preset quality interval, determining that the modified polypropylene film is not in the preset quality interval; if yes, returning to the step of obtaining the modified polypropylene film according to the preparation instruction, and if the mass of the modified polypropylene film is within a preset mass interval, metallizing the modified polypropylene film by utilizing distillation equipment to obtain a metallized modified film; and completing the preparation process optimization method applied to the high-frequency special capacitor based on the sealed capacitor, the maximum power density report and the conductivity report. According to the invention, key parameters in the preparation process can be acquired and dynamically adjusted in real time, so that the accuracy of capacitor performance evaluation is improved.

Description

Technical Field

[0001] The invention relates to a method and system for optimizing the preparation process of a high-frequency special capacitor, and belongs to the technical field of capacitor preparation. Background Art

[0002] The method for optimizing the preparation process of high-frequency special capacitors is a method that integrates advanced automation equipment and precise control systems. By precisely controlling and optimizing each process step, the high performance and stability of capacitors in high-frequency applications are ensured to meet the needs of modern electronic equipment.

[0003] At present, the traditional preparation process of capacitors can no longer meet current requirements. Traditional processes usually rely on manual operations, resulting in inaccurate material weighing, which affects the final performance of the capacitor. In addition, the traditional process lacks the necessary precise control in key steps such as cutting, winding and gold spraying, which may lead to structural instability of the capacitor core, further affecting the electrical performance of the capacitor. Therefore, how to obtain and dynamically adjust the key parameters in the preparation process in real time to improve the accuracy of capacitor performance evaluation is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present invention provides a method for optimizing the preparation process of a high-frequency dedicated capacitor, the main purpose of which is to obtain and dynamically adjust key parameters in the preparation process in real time to improve the accuracy of capacitor performance evaluation and reduce excessive consumption of time and human resources.

[0005] To achieve the above object, the present invention provides a method for optimizing the preparation process of a high-frequency dedicated capacitor, comprising:

[0006] Confirm the preparation environment, which includes: automatic loader, distillation equipment, laser cutting machine, spray robot, temperature and humidity sensor, feeding system, conveyor belt, automated assembly system, vacuum chamber, capacitor housing, laser heater, multi-stage temperature control furnace, precision balance, robotic arm, vacuum pump, vacuum pressure sensor, conveying system and plasma generator;

[0007] Receiving a preparation instruction based on a preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a high-precision balance, and weighing the modified polypropylene film using the high-precision balance to obtain a mass of the modified polypropylene film;

[0008] Determine whether the quality of the modified polypropylene film is within a preset quality range;

[0009] If the quality of the modified polypropylene film is not within the preset quality range, returning to the step of obtaining the modified polypropylene film according to the preparation instruction;

[0010] If the quality of the modified polypropylene film is within a preset quality range, the modified polypropylene film is metallized using a distillation device to obtain a metallized modified film;

[0011] Using a laser cutting machine and a preset width to cut the metallized modified film to obtain metallized film strips;

[0012] The metallized film strip is wound in a preset staggered manner to obtain a capacitor core, and gold is sprayed on both ends of the capacitor core by a spraying robot to obtain an electrode capacitor core;

[0013] Using a pre-established heat treatment method to heat treat the electrode capacitor core to obtain a heat-treated electrode;

[0014] Assembling the capacitor housing and the heat-treated electrode by using an automated assembly system to obtain a primary capacitor, and sealing the primary capacitor by using a sealing material to obtain a sealed capacitor;

[0015] Calculate the maximum power density of sealed capacitors using pre-built power density formulas and get a maximum power density report;

[0016] Calculate the conductivity of sealed capacitors using pre-built conductivity formulas and obtain conductivity performance reports;

[0017] Based on sealed capacitors, maximum power density reports and conductive performance reports, a preparation process optimization method for high-frequency dedicated capacitors was completed.

[0018] Optionally, the confirming the preparation environment includes:

[0019] Using a temperature and humidity sensor and a preset monitoring frequency to monitor the temperature and humidity in the preparation environment, and obtaining a temperature data set and a humidity data set;

[0020] If it is confirmed that there is temperature data in the temperature data set that is not in the preset temperature range, the temperature in the preparation environment is adjusted using the pre-built central air conditioner until the temperature data in the temperature data set are all in the preset temperature range, thereby obtaining an adapted temperature environment;

[0021] If there is humidity data in the humidity data set that is higher than the preset humidity threshold, the humidity in the preparation environment is reduced by using a pre-built dehumidifier until the humidity data in the humidity data set are all equal to the preset humidity threshold, thereby obtaining the adapted humidity;

[0022] If there is humidity data in the humidity data set that is lower than the preset humidity threshold, the humidity in the preparation environment is increased by using a pre-built humidifier until the humidity data in the humidity data set are all equal to the preset humidity threshold, thereby obtaining an adapted humidity environment;

[0023] Confirm the preparation environment based on the adaptation temperature environment and the adaptation humidity environment.

[0024] Optionally, the modified polypropylene film is metallized by using a distillation device to obtain a metallized modified film, comprising:

[0025] The modified polypropylene film is conveyed to a conveyor belt by using a feeding system to obtain a film to be conveyed;

[0026] The film to be transported is conveyed to the vacuum chamber by a conveyor belt to obtain a vacuum chamber film, and the position of the vacuum chamber film is adjusted by a mechanical arm and a preset position to obtain an adjusted film;

[0027] The air in the vacuum chamber is evacuated by a vacuum pump, and the pressure in the vacuum chamber is monitored by a vacuum pressure sensor to obtain an absolute vacuum environment, and the pre-constructed mixed gas is transported to the absolute vacuum environment by a conveying system and a preset gas mixing ratio to obtain a mixed vacuum environment, wherein the mixed gas includes: oxygen and hydrogen;

[0028] Starting a plasma generator disposed in the mixed vacuum environment, wherein the power and processing time of the plasma generator are preset, and using the started plasma generator to remove surface impurities of the adjusted film to obtain a clean film;

[0029] Obtaining tantalum metal;

[0030] The metal tantalum is transported into a pre-built crucible by a conveyor belt to obtain the metal tantalum to be heated, the metal tantalum to be heated is heated by a laser heater to obtain tantalum vapor, and the tantalum vapor and the clean film are used to obtain a metallized modified film.

[0031] Optionally, obtaining metallic tantalum includes:

[0032] According to a preset mixing ratio, the pre-constructed tantalate, magnesium chips and sodium chloride are mixed to obtain a mixture;

[0033] Using an automatic charging machine to charge the mixture into a crucible to obtain a mixture to be heated;

[0034] Heating the crucible based on the mixture to be heated and the multi-stage temperature control furnace to obtain a heated mixture, wherein the multi-stage temperature control furnace includes: temperature setting, time setting, heating mode and temperature monitoring;

[0035] Turn off the multi-stage temperature control furnace based on the time setting, and use the temperature sensor to detect the multi-stage temperature control furnace after being turned off in real time to obtain temperature data, wherein the temperature sensor presets the time threshold;

[0036] If it is confirmed that the temperature data is greater than a preset temperature threshold, the temperature of the multi-stage temperature control furnace is reduced by using a pre-built fan until the temperature data is less than or equal to the preset temperature threshold, and the heated mixture is taken out by using a pre-built automatic material taking arm to obtain a heated mixture;

[0037] Using a pre-constructed automatic pickling machine to pickle the heated mixture to obtain a pickled mixture, and using a pre-constructed flushing device to wash the pickled mixture to obtain a washed mixture;

[0038] The cleaned mixture is dried using a pre-built drying machine, a preset temperature and a preset drying time to obtain metallic tantalum.

[0039] Optionally, the step of spraying gold on both ends of the capacitor core using a spraying robot to obtain an electrode capacitor core comprises:

[0040] Among them, the spraying robot includes: a camera and an intelligent alarm system;

[0041] Using a camera to photograph the two ends of the capacitor core to obtain a spraying area image, and using pre-built image processing software to analyze the spraying area image to obtain an analyzed image;

[0042] Use pre-built computer vision technology to determine whether there are any missed spray areas in the analyzed image;

[0043] If there is a missed spraying area in the analyzed image, the intelligent alarm system will sound an alarm and record the position of the missed spraying area. The spraying robot will be used to repair the position of the missed spraying area to obtain a repaired capacitor core. The repaired capacitor core is used as the capacitor core, and the process returns to the above step of photographing the two ends of the capacitor core with a camera until there is no missed spraying area in the analyzed image, and an electrode capacitor core is obtained.

[0044] Optionally, the power density formula is as follows:

[0045]

[0046] Where W represents the maximum power density of the sealed capacitor, α represents the environmental compensation coefficient, U represents the rated voltage of the sealed capacitor, R represents the internal resistance of the sealed capacitor, and D represents the diameter of the sealed capacitor cylinder. represents the power factor, β represents the temperature coefficient, T represents the preparation environment temperature, γ represents the humidity coefficient, P represents the preparation environment humidity, and H represents the height of the sealed capacitor.

[0047] Optionally, the method of calculating the conductive performance of the sealed capacitor using a pre-built conductive formula to obtain a conductive performance report includes:

[0048] The conductivity formula is as follows:

[0049]

[0050] R1=ESR+α T T1+α p P1+α V V+R2

[0051] Where, I(t) represents the current of the sealed capacitor, U(t) represents the voltage of the sealed capacitor, Z(ω,T,L,C,ESR) represents the total impedance of the sealed capacitor, ω represents the angular frequency of the electrical signal, T1 represents the operating temperature of the sealed capacitor, L represents the equivalent inductance inside the sealed capacitor, C represents the capacitance value of the sealed capacitor, ESR represents the equivalent series resistance of the sealed capacitor, R1 represents the total resistance of the sealed capacitor, α T represents the temperature coefficient, α p represents the pressure coefficient, α V represents stress coefficient, P1 represents preparation environment pressure, V represents stress voltage, and R2 represents variable resistance;

[0052] If the current of the sealed capacitor is greater than or equal to the preset current threshold, the conductive performance of the sealed capacitor is confirmed to be good, and a conductive performance report is obtained;

[0053] Otherwise, the conductivity of the sealed capacitor is confirmed to be poor, and a conductivity report is obtained.

[0054] Optionally, the step of sealing the primary capacitor with a sealing material to obtain a sealed capacitor comprises:

[0055] Using a robotic arm to place the primary capacitor in a preset sealing mold to obtain a capacitor to be sealed;

[0056] Using a pre-built camera to photograph the capacitor to be sealed, the area to be sealed is obtained;

[0057] Obtaining a sealing material, wherein the sealing material includes a resin and a curing agent, and injecting the sealing material into a pre-built automatic glue coating machine to obtain an automatic glue injection machine, and applying the sealing material to the area to be sealed by using the automatic glue injection machine to obtain a capacitor after application;

[0058] Curing the coated capacitor using a pre-built curing device to obtain a cured capacitor, wherein the curing device is preset with a curing temperature and a curing time;

[0059] The sealing performance index of the capacitor after curing is detected by using a pre-built leakage current detection formula, and the sealed capacitor is obtained based on the sealing performance index.

[0060] Optionally, the method of detecting the sealing performance index of the cured capacitor using a pre-built leakage current detection formula, and obtaining the sealed capacitor based on the sealing performance index, comprises:

[0061] The leakage current detection formula is as follows:

[0062]

[0063] Among them, S P Indicates the sealing performance index of the capacitor after curing, I leak represents leakage current, V1 represents applied voltage, t test represents the test time, and A1 represents the surface area of ​​the sealed area in the capacitor after curing;

[0064] If the sealing performance index is greater than a preset standard threshold, a resealing operation is performed on the cured capacitor until the sealing performance index is less than or equal to the preset standard threshold, thereby obtaining a sealed capacitor;

[0065] If the sealing performance index is less than or equal to the preset standard threshold, the cured capacitor is confirmed as a sealed capacitor.

[0066] To achieve the above object, the present invention also provides a preparation process optimization system for high-frequency dedicated capacitors, comprising:

[0067] A preparation environment confirmation module is used to confirm the preparation environment, wherein the preparation environment includes: an automatic loader, a distillation device, a laser cutting machine, a spraying robot, a temperature and humidity sensor, a feeding system, a conveyor belt, an automated assembly system, a vacuum chamber, a capacitor housing, a laser heater, a multi-stage temperature control furnace, a precision balance, a robotic arm, a vacuum pump, a vacuum pressure sensor, a conveying system and a plasma generator, receiving a preparation instruction based on the preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a precise balance, weighing the modified polypropylene film using the precise balance to obtain the mass of the modified polypropylene film, judging whether the mass of the modified polypropylene film is within a preset mass range, and if the mass of the modified polypropylene film is not within the preset mass range, returning to the step of obtaining the modified polypropylene film according to the preparation instruction;

[0068] A metallization cutting module is used to metallize the modified polypropylene film by using a distillation device to obtain a metallized modified film if the quality of the modified polypropylene film is within a preset quality range, and to cut the metallized modified film by using a laser cutting machine and a preset width to obtain metallized film strips;

[0069] The winding and heat treatment module is used to wind the metallized film strip in a preset staggered manner to obtain a capacitor core, spray gold on both ends of the capacitor core using a spraying robot to obtain an electrode capacitor core, and heat treat the electrode capacitor core using a pre-established heat treatment method to obtain a heat-treated electrode;

[0070] The capacitor performance evaluation module is used to assemble the capacitor housing and the heat-treated electrode using an automated assembly system to obtain a primary capacitor, seal the primary capacitor using a sealing material to obtain a sealed capacitor, calculate the maximum power density of the sealed capacitor using a pre-built power density formula to obtain a maximum power density report, calculate the conductive performance of the sealed capacitor using a pre-built conductive formula to obtain a conductive performance report, and complete the preparation process optimization method for high-frequency special capacitors based on the sealed capacitor, the maximum power density report and the conductive performance report.

[0071] In order to solve the above problem, the present invention further provides an electronic device, the electronic device comprising:

[0072] A memory storing at least one instruction;

[0073] The processor executes the instructions stored in the memory to implement the above-mentioned method for optimizing the preparation process of high-frequency dedicated capacitors.

[0074] In order to solve the above problems, the present invention also provides a computer-readable storage medium, in which at least one instruction is stored. The at least one instruction is executed by a processor in an electronic device to implement the above-mentioned preparation process optimization method for high-frequency dedicated capacitors.

[0075] Compared with the problems described in the background technology, the present invention first confirms the preparation environment, wherein the preparation environment includes: an automatic loader, a distillation device, a laser cutting machine, a spraying robot, a temperature and humidity sensor, a feeding system, a conveyor belt, an automated assembly system, a vacuum chamber, a capacitor housing, a laser heater, a multi-stage temperature control furnace, a precision balance, a robotic arm, a vacuum pump, a vacuum pressure sensor, a conveying system and a plasma generator. The present invention ensures the stability of the preparation environment by real-time monitoring and automatic adjustment of temperature and humidity, receives a preparation instruction based on the preparation environment, obtains a modified polypropylene film according to the preparation instruction, calibrates a precision balance, obtains a precise balance, weighs the modified polypropylene film using the precise balance, and obtains the quality of the modified polypropylene film. The present invention ensures high-quality preparation data by accurately calibrating a balance and accurately weighing the modified polypropylene film, and determines whether the quality of the modified polypropylene film is within a preset quality range. If the quality of the modified polypropylene film is not within the preset quality range, the step of obtaining the modified polypropylene film according to the preparation instruction is returned. If the quality of the modified polypropylene film is within the preset quality range, the modified polypropylene film is metalized by using a distillation device to obtain a metallized modified film. The present invention ensures that the modified polypropylene film meets the preset standard through strict quality control and subsequent metallization treatment, and improves the performance and reliability of the final product. The metallized modified film is cut by using a laser cutting machine and a preset width to obtain a metallized film strip. The present invention ensures that the metallized modified film is cut into strips of preset width by precise laser cutting technology, and the metallized film strips are wound by a preset staggered method to obtain a capacitor core, and gold is sprayed on both ends of the capacitor core by a spraying robot to obtain an electrode capacitor core. The present invention realizes precise monitoring and automatic repair of the gold spraying process of the capacitor core by integrating a camera, an intelligent alarm system and computer vision technology to ensure the spraying quality, and heat-treats the electrode capacitor core by a pre-constructed heat treatment method to obtain a heat-treated electrode. The present invention optimizes the physical and chemical properties of the electrode capacitor core by a heat treatment procedure, and assembles the capacitor shell and the heat-treated electrode by an automated assembly system to obtain a primary capacitor, which is beneficial to The primary capacitor is sealed with a sealing material to obtain a sealed capacitor. The present invention ensures that the sealing performance of the sealed capacitor meets the standard through a comprehensive sealing process and leakage current detection. The maximum power density of the sealed capacitor is calculated using a pre-constructed power density formula to obtain a maximum power density report. The present invention uses the power density formula for precise calculation to ensure the qualification of the sealed capacitor. The conductive performance of the sealed capacitor is calculated using a pre-constructed conductive formula to obtain a conductive performance report. The present invention uses precise conductive formula analysis to ensure the conductive performance of the sealed capacitor, thereby improving the safety and stability of the equipment. Based on the sealed capacitor, the maximum power density report and the conductive performance report, a preparation process optimization method for high-frequency special capacitors is completed.Therefore, the present invention can acquire and dynamically adjust key parameters in the preparation process in real time to improve the accuracy of capacitor performance evaluation and reduce excessive consumption of time and human resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Figure 1 A schematic flow chart of a method for optimizing a manufacturing process for a high-frequency dedicated capacitor provided in accordance with an embodiment of the present invention;

[0077] Figure 2 A functional module diagram of a system for optimizing the manufacturing process of high-frequency dedicated capacitors provided by an embodiment of the present invention;

[0078] Figure 3 A schematic diagram of the structure of an electronic device for implementing the method for optimizing the preparation process of a high-frequency dedicated capacitor provided by an embodiment of the present invention;

[0079] Description of reference numerals:

[0080] 1. Electronic device; 10. Processor; 11. Memory; 12. Bus.

[0081] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0082] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0083] The embodiment of the present application provides a method for optimizing the preparation process for high-frequency dedicated capacitors. The execution subject of the method for optimizing the preparation process for high-frequency dedicated capacitors includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided by the embodiment of the present application. In other words, the method for optimizing the preparation process for high-frequency dedicated capacitors can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc.

[0084] Reference Figure 1 FIG. 1 is a flow chart of a method for optimizing a manufacturing process for high-frequency dedicated capacitors according to an embodiment of the present invention. In this embodiment, the method for optimizing a manufacturing process for high-frequency dedicated capacitors includes:

[0085] S1. Confirm the preparation environment.

[0086] Specifically, the preparation environment includes: automatic loader, distillation equipment, laser cutting machine, spray robot, temperature and humidity sensor, temperature sensor, feeding system, conveyor belt, automated assembly system, vacuum chamber, capacitor housing, laser heater, multi-stage temperature control furnace, precision balance, robotic arm, vacuum pump, vacuum pressure sensor, conveying system and plasma generator.

[0087] It should be explained that the conveyor belt described in the embodiment of the present invention is a tool for conveying the modified polypropylene film from the feeding system to the vacuum chamber and conveying the metal tantalum into the crucible. The automated assembly system is a system for assembling the capacitor housing and the electrode capacitor core together. The vacuum chamber refers to a closed container used for the surface treatment and metallization process of the modified polypropylene film.

[0088] It is understood that the capacitor housing refers to the outer protective shell of the capacitor, which is used to encapsulate the shell of the heat-treated electrode. The precision balance is a tool used to accurately measure the quality of the modified polypropylene film to ensure that the quality of the modified polypropylene film used is within the preset quality range. The robotic arm is a tool used to accurately adjust the position of the film in a vacuum chamber.

[0089] It should also be explained that the vacuum pump is a device used to establish an absolute vacuum environment to provide the necessary conditions for the plasma processing step. The vacuum pressure sensor is a sensor used to monitor the pressure in the vacuum chamber to ensure that the required vacuum degree is reached and maintained. The plasma generator is a device that generates plasma in a vacuum environment to remove impurities on the surface of the film.

[0090] Specifically, the confirmation of the preparation environment includes:

[0091] Using a temperature and humidity sensor and a preset monitoring frequency to monitor the temperature and humidity in the preparation environment, and obtaining a temperature data set and a humidity data set;

[0092] If it is confirmed that there is temperature data in the temperature data set that is not in the preset temperature range, the temperature in the preparation environment is adjusted using the pre-built central air conditioner until the temperature data in the temperature data set are all in the preset temperature range, thereby obtaining an adapted temperature environment;

[0093] If there is humidity data in the humidity data set that is higher than the preset humidity threshold, the humidity in the preparation environment is reduced by using a pre-built dehumidifier until the humidity data in the humidity data set are all equal to the preset humidity threshold, thereby obtaining the adapted humidity;

[0094] If there is humidity data in the humidity data set that is lower than the preset humidity threshold, the humidity in the preparation environment is increased by using a pre-built humidifier until the humidity data in the humidity data set are all equal to the preset humidity threshold, thereby obtaining an adapted humidity environment;

[0095] Confirm the preparation environment based on the adaptation temperature environment and the adaptation humidity environment.

[0096] It should be explained that the temperature and humidity sensor is a sensor used to detect the temperature and humidity in the preparation environment to ensure that the environmental conditions during the preparation process are stable and do not affect the quality of the product. The monitoring frequency refers to the time interval between the temperature and humidity sensor collecting data. The central air conditioner is a device used to adjust the temperature of the preparation environment to ensure that it remains within a preset temperature range. The temperature range refers to the range within which the temperature in the preparation environment should be maintained based on the analysis of a large amount of temperature data.

[0097] It is understood that the humidity threshold refers to a pre-set humidity value used to determine whether the humidity in the preparation environment is within an acceptable range. A dehumidifier refers to a device used to reduce the moisture content in the preparation environment. A humidifier refers to a device used to increase the moisture content in the preparation environment.

[0098] S2. receiving a preparation instruction based on a preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a high-precision balance, and weighing the modified polypropylene film using the high-precision balance to obtain a mass of the modified polypropylene film.

[0099] It should be explained that the preparation instruction is an instruction used to control the coordinated work of various devices and systems in the automated preparation process. Modified polypropylene film refers to a special film obtained by modifying ordinary polypropylene film, which is used to manufacture capacitors for high-frequency applications.

[0100] Exemplarily, a precision balance is selected, and the precision balance is placed on a stable table. The precision balance is started, and a set of 100-gram standard weights is selected. The 100-gram standard weights are gently placed on the weighing pan of the precision balance using a robotic arm. The reading on the precision balance display is observed to ensure that the precision balance display shows 100.0000 grams. If the reading is inaccurate, multiple calibration operations are performed until the reading is stable and accurate. After the calibration is completed, the standard weights are removed to obtain a precision balance. The modified polypropylene film is placed on the precision balance using a robotic arm to obtain the mass of the modified polypropylene film.

[0101] S3. Determine whether the quality of the modified polypropylene film is within a preset quality range. If the quality of the modified polypropylene film is not within the preset quality range, return to the step of obtaining the modified polypropylene film according to the preparation instruction. If the quality of the modified polypropylene film is within the preset quality range, metallize the modified polypropylene film using a distillation device to obtain a metallized modified film.

[0102] In detail, the modified polypropylene film is metallized by using a distillation device to obtain a metallized modified film, comprising:

[0103] The modified polypropylene film is conveyed to a conveyor belt by using a feeding system to obtain a film to be conveyed;

[0104] The film to be transported is conveyed to the vacuum chamber by a conveyor belt to obtain a vacuum chamber film, and the position of the vacuum chamber film is adjusted by a mechanical arm and a preset position to obtain an adjusted film;

[0105] The air in the vacuum chamber is evacuated by a vacuum pump, and the pressure in the vacuum chamber is monitored by a vacuum pressure sensor to obtain an absolute vacuum environment, and the pre-constructed mixed gas is transported to the absolute vacuum environment by a conveying system and a preset gas mixing ratio to obtain a mixed vacuum environment, wherein the mixed gas includes: oxygen and hydrogen;

[0106] Starting a plasma generator disposed in the mixed vacuum environment, wherein the power and processing time of the plasma generator are preset, and using the started plasma generator to remove surface impurities of the adjusted film to obtain a clean film;

[0107] Obtaining tantalum metal;

[0108] The metal tantalum is transported into a pre-built crucible by a conveyor belt to obtain the metal tantalum to be heated, the metal tantalum to be heated is heated by a laser heater to obtain tantalum vapor, and the tantalum vapor and the clean film are used to obtain a metallized modified film.

[0109] Importantly, the preset position is a specific position pre-defined in the vacuum chamber. Position adjustment refers to placing the film in a precise position in the vacuum chamber by the robot during the metallization process. The gas mixture ratio refers to the ratio of oxygen and hydrogen introduced into the vacuum environment.

[0110] It is understood that the mass interval refers to a preset mass range used to ensure the accuracy of the mass weighing of the modified polypropylene film. The distillation equipment refers to a device used to heat the metal tantalum to tantalum vapor and attach it to the surface of the modified polypropylene film by deposition to form a metallized modified film. The conveying system refers to a system for conveying a mixed gas of a preset proportion to a vacuum chamber in an absolute vacuum environment. The feeding system described in the embodiment of the present invention is a system for conveying a modified polypropylene film from a storage location to a conveyor belt.

[0111] It should be explained that an absolute vacuum environment refers to an environment in which the air in the container is completely evacuated through a vacuum pump to reach a state close to an absolute vacuum. A mixed vacuum environment refers to an environment in which a mixed gas of a preset proportion is delivered into a vacuum chamber through a conveying system on the basis of absolute vacuum, thereby forming a vacuum environment containing a specific gas composition. A crucible refers to a container used to hold tantalum metal and heat the tantalum metal to a gaseous state under the action of a laser heater. The tantalum metal to be heated refers to the tantalum metal material that has not yet been heated. A laser heater refers to a heating device that uses a laser beam as a heat source to heat the tantalum metal in a crucible, causing it to melt and further evaporate into tantalum vapor.

[0112] Furthermore, obtaining metallic tantalum includes:

[0113] According to a preset mixing ratio, the pre-constructed tantalate, magnesium chips and sodium chloride are mixed to obtain a mixture;

[0114] Using an automatic charging machine to charge the mixture into a crucible to obtain a mixture to be heated;

[0115] Heating the crucible based on the mixture to be heated and the multi-stage temperature control furnace to obtain a heated mixture, wherein the multi-stage temperature control furnace includes: temperature setting, time setting, heating mode and temperature monitoring;

[0116] Turn off the multi-stage temperature control furnace based on the time setting, and use the temperature sensor to detect the multi-stage temperature control furnace after being turned off in real time to obtain temperature data, wherein the temperature sensor presets the time threshold;

[0117] If it is confirmed that the temperature data is greater than a preset temperature threshold, the temperature of the multi-stage temperature control furnace is reduced by using a pre-built fan until the temperature data is less than or equal to the preset temperature threshold, and the heated mixture is taken out by using a pre-built automatic material taking arm to obtain a heated mixture;

[0118] Using a pre-constructed automatic pickling machine to pickle the heated mixture to obtain a pickled mixture, and using a pre-constructed flushing device to wash the pickled mixture to obtain a washed mixture;

[0119] The cleaned mixture is dried using a pre-built drying machine, a preset temperature and a preset drying time to obtain metallic tantalum.

[0120] It should be explained that the automatic loader is a device used to automatically load the pre-mixed mixture of tantalate, magnesium chips and sodium chloride into the crucible. The multi-stage temperature control furnace is a heating device used to heat the crucible containing the mixture. The temperature sensor refers to a sensor used to monitor the temperature in the multi-stage temperature control furnace in real time and transmit the temperature data to the control system. The time threshold is a value used to determine the length of time for the multi-stage temperature control furnace to heat.

[0121] It should also be explained that a fan is a device used to quickly reduce the temperature in the multi-stage temperature control furnace until the temperature reaches below a preset temperature threshold after the multi-stage temperature control furnace is turned off. An automatic pickling machine is a device that removes surface impurities of a heated mixture by chemical methods. An automatic feeder is a device that automatically removes a heated mixture from a multi-stage temperature control furnace. A dryer is a device used to remove moisture from the surface of a washed mixture.

[0122] Exemplarily, according to a preset mixing ratio of 1:1:2, 100 grams of tantalate, 100 grams of magnesium chips and 200 grams of sodium chloride are weighed and placed in a pre-constructed mixer for mixing to obtain a mixture. The automatic loader evenly loads the mixture into a crucible to obtain a mixture to be heated. The maximum temperature of the multi-stage temperature control furnace is set to 1200°C, and the heating time is 3 hours. The pre-constructed gradient heating mode is used to first increase the temperature to 600°C at a rate of 5°C per minute, and then continue to increase the temperature to 1200°C after keeping warm for 30 minutes. The temperature in the multi-stage temperature control furnace is monitored in real time by temperature monitoring. When the heating time reaches 3 hours, the multi-stage temperature control furnace is automatically turned off, and the temperature in the furnace after being turned off is detected in real time by a temperature sensor. If the multi-stage temperature control furnace is turned off within 10 minutes after the multi-stage temperature control furnace is turned off, The temperature in the furnace is 700°C, which is higher than the preset temperature threshold of 600°C. The fan is started to cool the multi-stage temperature control furnace. The cooling is continued until the temperature data in the multi-stage temperature control furnace is 400°C, which is less than or equal to the preset temperature threshold of 600°C. The heated mixture is taken out from the multi-stage temperature control furnace by an automatic material taking arm to obtain a heated mixture. The heated mixture is placed in an automatic pickling machine, pickled with dilute sulfuric acid, and the pickling time is set to 30 minutes to obtain a pickled mixture. The pickled mixture is placed in a flushing device, washed with deionized water, and the washing time is set to 10 minutes to obtain a washed mixture. The temperature of the dryer is set to 100°C, and the drying time is set to 1 hour. The washed mixture is placed in a dryer for drying to obtain metallic tantalum.

[0123] It is understood that the mixer is a device for mixing tantalate, magnesium chips and sodium chloride. Dilute sulfuric acid is a solution for cleaning surface impurities of the heated mixture. The gradient heating mode refers to a mode in which a specific heating effect is achieved by gradually increasing the temperature.

[0124] S4. Cut the metallized modified film using a laser cutting machine and a preset width to obtain metallized film strips.

[0125] It should be explained that the laser cutting machine is a device used to cut metallized modified films.

[0126] For example, there is a metallized modified film with a size of 100×50. Xiao Zhang sets the cutting width of the laser cutting machine to 5 mm, and adjusts the appropriate laser power and cutting speed according to the material of the film. The film is placed flat on the workbench of the laser cutting machine and fixed with a clamp. The laser cutting machine is started and begins to cut from one end of the film to the other to obtain a metallized film strip. The width of the metallized film strip is 5 mm.

[0127] S5. Wind the metallized film strip in a preset staggered manner to obtain a capacitor core, and use a spraying robot to spray gold on both ends of the capacitor core to obtain an electrode capacitor core.

[0128] It should be explained that the staggered edge method refers to a method in which the edges of adjacent film strips are staggered when winding the film strips instead of being directly aligned.

[0129] Exemplarily, there are three metallized film strips, namely film strip A, film strip B and film strip C. The edges of the first film strip A are aligned and winding begins. When winding the second film strip B, one end of film strip B is staggered with one end of film strip A, so that the edge of film strip B is offset from film strip A by 1 mm. Continue winding, and stagger one end of the third film strip C with one end of film strip B, so that the edge of film strip C is slightly offset from film strip B by 1 mm to obtain a capacitor core.

[0130] In detail, the method of using a spraying robot to spray gold on both ends of the capacitor core to obtain an electrode capacitor core includes:

[0131] Among them, the spraying robot includes: a camera and an intelligent alarm system;

[0132] Using a camera to photograph the two ends of the capacitor core to obtain a spraying area image, and using pre-built image processing software to analyze the spraying area image to obtain an analyzed image;

[0133] Use pre-built computer vision technology to determine whether there are any missed spray areas in the analyzed image;

[0134] If there is a missed spraying area in the analyzed image, the intelligent alarm system will sound an alarm and record the position of the missed spraying area. The spraying robot will be used to repair the position of the missed spraying area to obtain a repaired capacitor core. The repaired capacitor core is used as the capacitor core, and the process returns to the above step of photographing the two ends of the capacitor core with a camera until there is no missed spraying area in the analyzed image, and an electrode capacitor core is obtained.

[0135] It should be explained that the spraying robot is a robot used to spray gold on both ends of the capacitor core and form electrodes. The intelligent alarm system is a system used to detect whether there is any leakage in the spraying area. Computer vision technology is a technology used to analyze the state of the spraying area in the analyzed image. Computer vision technology is an existing technology and will not be described in detail here.

[0136] S6. Use a pre-established heat treatment method to heat treat the electrode capacitor core to obtain a heat-treated electrode.

[0137] It should be explained that the heat treatment method is a heating method used to improve the performance of the electrode capacitor core.

[0138] For example, Xiao Zhang took out an electrode capacitor core that had been sprayed with a metal layer, set the temperature of the multi-stage temperature control furnace to a°C and the time to 30 minutes, and adopted a gradual heating mode. He placed the electrode capacitor core into the multi-stage temperature control furnace, started the heat treatment program, and heated it according to the preset temperature and time to obtain a heat-treated electrode.

[0139] S7. Assemble the capacitor housing and the heat-treated electrode using an automated assembly system to obtain a primary capacitor, and seal the primary capacitor using a sealing material to obtain a sealed capacitor.

[0140] In detail, the method of sealing the primary capacitor with a sealing material to obtain a sealed capacitor includes:

[0141] Using a robotic arm to place the primary capacitor in a preset sealing mold to obtain a capacitor to be sealed;

[0142] Using a pre-built camera to photograph the capacitor to be sealed, the area to be sealed is obtained;

[0143] Obtaining a sealing material, wherein the sealing material includes a resin and a curing agent, and injecting the sealing material into a pre-built automatic glue coating machine to obtain an automatic glue injection machine, and applying the sealing material to the area to be sealed by using the automatic glue injection machine to obtain a capacitor after application;

[0144] Curing the coated capacitor using a pre-built curing device to obtain a cured capacitor, wherein the curing device is preset with a curing temperature and a curing time;

[0145] The sealing performance index of the capacitor after curing is detected by using a pre-built leakage current detection formula, and the sealed capacitor is obtained based on the sealing performance index.

[0146] It should be explained that the sealing mold is a mold used to fix the capacitor and ensure that the sealing material can be applied to the part that needs to be sealed. The curing temperature is the specific temperature value required for the process of converting the sealing material from liquid to solid by heating. The curing time refers to the time required for the sealing material to completely turn into a solid state at the curing temperature. Automatic glue coating machine is a device used to accurately apply sealing materials.

[0147] Further, the method of using a pre-built leakage current detection formula to detect the sealing performance index of the cured capacitor and obtaining the sealed capacitor based on the sealing performance index includes:

[0148] The leakage current detection formula is as follows:

[0149]

[0150] Among them, S P Indicates the sealing performance index of the capacitor after curing, I leak represents leakage current, V1 represents applied voltage, t test represents the test time, and A1 represents the surface area of ​​the sealed area in the capacitor after curing;

[0151] If the sealing performance index is greater than a preset standard threshold, a resealing operation is performed on the cured capacitor until the sealing performance index is less than or equal to the preset standard threshold, thereby obtaining a sealed capacitor;

[0152] If the sealing performance index is less than or equal to the preset standard threshold, the cured capacitor is confirmed as a sealed capacitor.

[0153] It should be explained that leakage current refers to the current that passes through abnormal paths inside or outside the cured capacitor when voltage is applied to the cured capacitor. Applied voltage refers to the voltage value applied to both ends of the cured capacitor during the test. Test time refers to the total duration of leakage current detection when voltage is applied. The standard threshold refers to the value used to determine whether the sealing performance of the cured capacitor meets the qualified standard.

[0154] It is understood that a sealed capacitor refers to a capacitor that has been sealed and has passed a leakage current test to confirm that the sealing performance is qualified. The sealing performance index is an indicator used to quantitatively evaluate the sealing performance of the capacitor after curing.

[0155] S8. Calculate the maximum power density of the sealed capacitor using the pre-built power density formula and obtain a maximum power density report.

[0156] In detail, the power density formula is as follows:

[0157]

[0158] Where W represents the maximum power density of the sealed capacitor, α represents the environmental compensation coefficient, U represents the rated voltage of the sealed capacitor, R represents the internal resistance of the sealed capacitor, and D represents the diameter of the sealed capacitor cylinder. represents the power factor, β represents the temperature coefficient, T represents the preparation environment temperature, γ represents the humidity coefficient, P represents the preparation environment humidity, and H represents the height of the sealed capacitor.

[0159] It should be explained that the maximum power density of a sealed capacitor is the ratio of the maximum power that a sealed capacitor can withstand under given conditions to the unit volume. The environmental compensation factor refers to the factor used to compensate for the impact of the environment on the performance of a sealed capacitor. The rated voltage of a sealed capacitor refers to the maximum voltage that a sealed capacitor can withstand under normal working conditions.

[0160] It is understood that the internal resistance of a sealed capacitor refers to the resistance inside the sealed capacitor. The diameter of the sealed capacitor cylinder refers to the lateral dimension of the sealed capacitor shape. The power factor refers to the ratio of the useful power actually consumed by the sealed capacitor in the AC circuit to the total input power. The temperature coefficient is a coefficient used to describe the trend of the performance of the sealed capacitor with temperature changes.

[0161] It should also be explained that the preparation environment temperature refers to the environment temperature of the sealed capacitor during the preparation process. The humidity coefficient is a coefficient used to describe the trend of the performance of the sealed capacitor changing with humidity. The preparation environment humidity refers to the environment humidity of the sealed capacitor during the preparation process. The height of the sealed capacitor refers to the longitudinal dimension of the capacitor's appearance. The maximum power density report is a report used to describe whether the sealed capacitor is qualified. If the maximum power density of the sealed capacitor is greater than or equal to the preset maximum power density threshold, the maximum power density report shows qualified, otherwise, the maximum power density report shows unqualified.

[0162] S9. Use the pre-built conductive formula to calculate the conductive properties of the sealed capacitor and obtain a conductive properties report. Based on the sealed capacitor, the maximum power density report and the conductive properties report, complete the preparation process optimization method for high-frequency dedicated capacitors.

[0163] In detail, the conductive performance of the sealed capacitor is calculated using a pre-built conductive formula to obtain a conductive performance report, including:

[0164] The conductivity formula is as follows:

[0165]

[0166] R1=ESR+α T T1+α p P1+α V V+R2

[0167] Where, I(t) represents the current of the sealed capacitor, U(t) represents the voltage of the sealed capacitor, Z(ω,T,L,C,ESR) represents the total impedance of the sealed capacitor, ω represents the angular frequency of the electrical signal, T1 represents the operating temperature of the sealed capacitor, L represents the equivalent inductance inside the sealed capacitor, C represents the capacitance value of the sealed capacitor, ESR represents the equivalent series resistance of the sealed capacitor, R1 represents the total resistance of the sealed capacitor, α T represents the temperature coefficient, α p represents the pressure coefficient, α V represents stress coefficient, P1 represents preparation environment pressure, V represents stress voltage, and R2 represents variable resistance;

[0168] If the current of the sealed capacitor is greater than or equal to the preset current threshold, the conductive performance of the sealed capacitor is confirmed to be good, and a conductive performance report is obtained;

[0169] Otherwise, the conductivity of the sealed capacitor is confirmed to be poor, and a conductivity report is obtained.

[0170] It should be explained that the current of a sealed capacitor refers to the current intensity passing through the sealed capacitor. The voltage of a sealed capacitor refers to the voltage applied across the sealed capacitor. The total impedance of a sealed capacitor refers to the impedance of the sealed capacitor to the AC signal under the angular frequency of the electrical signal and the operating temperature of the sealed capacitor. The angular frequency of an electrical signal refers to the frequency obtained by multiplying the frequency of the electrical signal by 2π.

[0171] It is understood that the equivalent inductance inside the sealed capacitor refers to the equivalent inductance inside the sealed capacitor, which is determined by the structure and material of the sealed capacitor. The capacitance value of the sealed capacitor is the value of the capacitance of the sealed capacitor. The equivalent series resistance of the sealed capacitor refers to a resistor in series with the capacitance element inside the sealed capacitor. The temperature coefficient refers to the coefficient of the sensitivity of the performance of the sealed capacitor to temperature changes.

[0172] Importantly, the pressure coefficient refers to the coefficient of the sensitivity of the performance of the sealed capacitor to changes in environmental pressure. The stress coefficient refers to the coefficient of the sensitivity of the performance of the sealed capacitor to changes in stress voltage. The preparation environmental pressure refers to the environmental pressure in the preparation process of the sealed capacitor. The stress voltage refers to the additional voltage applied to the sealed capacitor. The variable resistance refers to other variable resistance components that may exist in the sealed capacitor.

[0173] Compared with the problems described in the background technology, the present invention first confirms the preparation environment, wherein the preparation environment includes: an automatic loader, a distillation device, a laser cutting machine, a spraying robot, a temperature and humidity sensor, a feeding system, a conveyor belt, an automated assembly system, a vacuum chamber, a capacitor housing, a laser heater, a multi-stage temperature control furnace, a precision balance, a robotic arm, a vacuum pump, a vacuum pressure sensor, a conveying system and a plasma generator. The present invention ensures the stability of the preparation environment by real-time monitoring and automatic adjustment of temperature and humidity, receives a preparation instruction based on the preparation environment, obtains a modified polypropylene film according to the preparation instruction, calibrates a precision balance, obtains a precise balance, weighs the modified polypropylene film using the precise balance, and obtains the quality of the modified polypropylene film. The present invention ensures high-quality preparation data by accurately calibrating a balance and accurately weighing the modified polypropylene film, and determines whether the quality of the modified polypropylene film is within a preset quality range. If the quality of the modified polypropylene film is not within the preset quality range, the step of obtaining the modified polypropylene film according to the preparation instruction is returned. If the quality of the modified polypropylene film is within the preset quality range, the modified polypropylene film is metalized by using a distillation device to obtain a metallized modified film. The present invention ensures that the modified polypropylene film meets the preset standard through strict quality control and subsequent metallization treatment, and improves the performance and reliability of the final product. The metallized modified film is cut by using a laser cutting machine and a preset width to obtain a metallized film strip. The present invention ensures that the metallized modified film is cut into strips of preset width by precise laser cutting technology, and the metallized film strips are wound by a preset staggered method to obtain a capacitor core, and gold is sprayed on both ends of the capacitor core by a spraying robot to obtain an electrode capacitor core. The present invention realizes precise monitoring and automatic repair of the gold spraying process of the capacitor core by integrating a camera, an intelligent alarm system and computer vision technology to ensure the spraying quality, and heat-treats the electrode capacitor core by a pre-constructed heat treatment method to obtain a heat-treated electrode. The present invention optimizes the physical and chemical properties of the electrode capacitor core by a heat treatment procedure, and assembles the capacitor shell and the heat-treated electrode by an automated assembly system to obtain a primary capacitor, which is beneficial to The primary capacitor is sealed with a sealing material to obtain a sealed capacitor. The present invention ensures that the sealing performance of the sealed capacitor meets the standard through a comprehensive sealing process and leakage current detection. The maximum power density of the sealed capacitor is calculated using a pre-constructed power density formula to obtain a maximum power density report. The present invention uses the power density formula for precise calculation to ensure the qualification of the sealed capacitor. The conductive performance of the sealed capacitor is calculated using a pre-constructed conductive formula to obtain a conductive performance report. The present invention uses precise conductive formula analysis to ensure the conductive performance of the sealed capacitor, thereby improving the safety and stability of the equipment. Based on the sealed capacitor, the maximum power density report and the conductive performance report, a preparation process optimization method for high-frequency special capacitors is completed.Therefore, the present invention can acquire and dynamically adjust key parameters in the preparation process in real time to improve the accuracy of capacitor performance evaluation and reduce excessive consumption of time and human resources.

[0174] like Figure 2 1 is a functional module diagram of a system for optimizing the manufacturing process of high-frequency dedicated capacitors provided by an embodiment of the present invention.

[0175] The preparation process optimization system 100 for high-frequency dedicated capacitors of the present invention can be installed in an electronic device. According to the functions implemented, the preparation process optimization system 100 for high-frequency dedicated capacitors can include a preparation environment confirmation module 101, a metallization cutting module 102, a winding and heat treatment module 103 and a capacitor performance evaluation module 104. The module of the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0176] The preparation environment confirmation module 101 is used to confirm the preparation environment, wherein the preparation environment includes: an automatic loader, a distillation device, a laser cutting machine, a spraying robot, a temperature and humidity sensor, a feeding system, a conveyor belt, an automated assembly system, a vacuum chamber, a capacitor housing, a laser heater, a multi-stage temperature control furnace, a precision balance, a robotic arm, a vacuum pump, a vacuum pressure sensor, a conveying system and a plasma generator, receiving a preparation instruction based on the preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a precise balance, weighing the modified polypropylene film using the precise balance to obtain the quality of the modified polypropylene film, judging whether the quality of the modified polypropylene film is within a preset quality range, and if the quality of the modified polypropylene film is not within the preset quality range, returning to the step of obtaining the modified polypropylene film according to the preparation instruction;

[0177] The metallization cutting module 102 is used to metallize the modified polypropylene film using a distillation device to obtain a metallized modified film if the quality of the modified polypropylene film is within a preset quality range, and to cut the metallized modified film using a laser cutting machine and a preset width to obtain metallized film strips;

[0178] The winding and heat treatment module 103 is used to wind the metallized film strip in a preset staggered manner to obtain a capacitor core, spray gold on both ends of the capacitor core using a spraying robot to obtain an electrode capacitor core, and heat treat the electrode capacitor core using a pre-established heat treatment method to obtain a heat-treated electrode;

[0179] The capacitor performance evaluation module 104 is used to assemble the capacitor housing and the heat-treated electrode using an automated assembly system to obtain a primary capacitor, seal the primary capacitor using a sealing material to obtain a sealed capacitor, calculate the maximum power density of the sealed capacitor using a pre-constructed power density formula to obtain a maximum power density report, calculate the conductive performance of the sealed capacitor using a pre-constructed conductive formula to obtain a conductive performance report, and complete a preparation process optimization method for high-frequency dedicated capacitors based on the sealed capacitor, the maximum power density report and the conductive performance report.

[0180] In detail, the modules in the system 100 for optimizing the manufacturing process of high-frequency dedicated capacitors in the embodiment of the present invention are used in the same manner as described above. Figure 1 The same technical means as the preparation process optimization method for high-frequency special capacitors described in the specification and can produce the same technical effects will not be repeated here.

[0181] like Figure 3 , which is a schematic diagram of the structure of an electronic device for implementing a method for optimizing the preparation process of a high-frequency dedicated capacitor provided by an embodiment of the present invention.

[0182] The electronic device 1 may include a processor 10, a memory 11 and a bus 12, and may also include a computer program stored in the memory 11 and executable on the processor 10, such as a program for optimizing a method for preparing a high-frequency dedicated capacitor.

[0183] Wherein, the memory 11 includes at least one type of readable storage medium, and the readable storage medium includes flash memory, mobile hard disk, multimedia card, card-type memory (for example: SD or DX memory, etc.), magnetic memory, disk, optical disk, etc. The memory 11 may be an internal storage unit of the electronic device 1 in some embodiments, such as a mobile hard disk of the electronic device 1. The memory 11 may also be an external storage device of the electronic device 1 in other embodiments, such as a plug-in mobile hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device 1. Further, the memory 11 also includes an internal storage unit of the electronic device 1 and an external storage device. The memory 11 can not only be used to store application software and various types of data installed in the electronic device 1, such as the code of the preparation process optimization method program applied to high-frequency dedicated capacitors, but also can be used to temporarily store data that has been output or is to be output.

[0184] The processor 10 may be composed of an integrated circuit in some embodiments, for example, a single packaged integrated circuit, or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and combinations of various control chips, etc. The processor 10 is the control core (Control Unit) of the electronic device, and uses various interfaces and lines to connect various components of the entire electronic device, and executes or executes programs or modules stored in the memory 11 (such as a preparation process optimization method program for high-frequency dedicated capacitors, etc.), and calls data stored in the memory 11 to execute various functions of the electronic device 1 and process data.

[0185] The bus 12 may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus 12 may be divided into an address bus, a data bus, a control bus, etc. The bus 12 is configured to realize connection and communication between the memory 11 and at least one processor 10, etc.

[0186] Figure 3 Only an electronic device with components is shown, and those skilled in the art will understand that Figure 3 The structure shown does not constitute a limitation on the electronic device 1, and may include fewer or more components than shown in the figure, or combine certain components, or arrange the components differently.

[0187] For example, although not shown, the electronic device 1 may also include a power source (such as a battery) for supplying power to each component. Preferably, the power source may be logically connected to the at least one processor 10 through a power management device, so that the power management device can realize functions such as charging management, discharging management, and power consumption management. The power source may also include any components such as one or more DC or AC power sources, recharging devices, power failure detection circuits, power converters or inverters, power status indicators, etc. The electronic device 1 may also include a variety of sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be repeated here.

[0188] Furthermore, the electronic device 1 may also include a network interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is generally used to establish a communication connection between the electronic device 1 and other electronic devices.

[0189] Optionally, the electronic device 1 may further include a user interface, which may be a display, an input unit (such as a keyboard), or a standard wired interface or a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, and an OLED (Organic Light-Emitting Diode) touch device. The display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the electronic device 1 and to display a visual user interface.

[0190] It should be understood that the embodiment is for illustration only and the scope of the patent application is not limited to this structure.

[0191] The program of the method for optimizing the manufacturing process for high-frequency dedicated capacitors stored in the memory 11 of the electronic device 1 is a combination of multiple instructions. When running in the processor 10, the following can be achieved:

[0192] Confirm the preparation environment, which includes: automatic loader, distillation equipment, laser cutting machine, spray robot, temperature and humidity sensor, feeding system, conveyor belt, automated assembly system, vacuum chamber, capacitor housing, laser heater, multi-stage temperature control furnace, precision balance, robotic arm, vacuum pump, vacuum pressure sensor, conveying system and plasma generator;

[0193] Receiving a preparation instruction based on a preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a high-precision balance, and weighing the modified polypropylene film using the high-precision balance to obtain a mass of the modified polypropylene film;

[0194] Determine whether the quality of the modified polypropylene film is within a preset quality range;

[0195] If the quality of the modified polypropylene film is not within the preset quality range, returning to the step of obtaining the modified polypropylene film according to the preparation instruction;

[0196] If the quality of the modified polypropylene film is within a preset quality range, the modified polypropylene film is metallized using a distillation device to obtain a metallized modified film;

[0197] Using a laser cutting machine and a preset width to cut the metallized modified film to obtain metallized film strips;

[0198] The metallized film strip is wound in a preset staggered manner to obtain a capacitor core, and gold is sprayed on both ends of the capacitor core by a spraying robot to obtain an electrode capacitor core;

[0199] Using a pre-established heat treatment method to heat treat the electrode capacitor core to obtain a heat-treated electrode;

[0200] Assembling the capacitor housing and the heat-treated electrode by using an automated assembly system to obtain a primary capacitor, and sealing the primary capacitor by using a sealing material to obtain a sealed capacitor;

[0201] Calculate the maximum power density of sealed capacitors using pre-built power density formulas and get a maximum power density report;

[0202] The conductive performance of the sealed capacitor is calculated using a pre-built conductive formula to obtain a conductive performance report. Based on the sealed capacitor, the maximum power density report and the conductive performance report, a preparation process optimization method for high-frequency dedicated capacitors is completed.

[0203] Specifically, the specific implementation method of the processor 10 for the above instructions can refer to Figures 1 to 3 The description of the relevant steps in the corresponding embodiments will not be repeated here.

[0204] Furthermore, if the module / unit integrated in the electronic device 1 is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a mobile hard disk, a magnetic disk, an optical disk, a computer memory, and a read-only memory (ROM).

[0205] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor of an electronic device, the computer program can implement:

[0206] Confirm the preparation environment, which includes: automatic loader, distillation equipment, laser cutting machine, spray robot, temperature and humidity sensor, feeding system, conveyor belt, automated assembly system, vacuum chamber, capacitor housing, laser heater, multi-stage temperature control furnace, precision balance, robotic arm, vacuum pump, vacuum pressure sensor, conveying system and plasma generator;

[0207] Receiving a preparation instruction based on a preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a high-precision balance, and weighing the modified polypropylene film using the high-precision balance to obtain a mass of the modified polypropylene film;

[0208] Determine whether the quality of the modified polypropylene film is within a preset quality range;

[0209] If the quality of the modified polypropylene film is not within the preset quality range, returning to the step of obtaining the modified polypropylene film according to the preparation instruction;

[0210] If the quality of the modified polypropylene film is within a preset quality range, the modified polypropylene film is metallized using a distillation device to obtain a metallized modified film;

[0211] Using a laser cutting machine and a preset width to cut the metallized modified film to obtain metallized film strips;

[0212] The metallized film strip is wound in a preset staggered manner to obtain a capacitor core, and gold is sprayed on both ends of the capacitor core by a spraying robot to obtain an electrode capacitor core;

[0213] Using a pre-established heat treatment method to heat treat the electrode capacitor core to obtain a heat-treated electrode;

[0214] Assembling the capacitor housing and the heat-treated electrode by using an automated assembly system to obtain a primary capacitor, and sealing the primary capacitor by using a sealing material to obtain a sealed capacitor;

[0215] Calculate the maximum power density of sealed capacitors using pre-built power density formulas and get a maximum power density report;

[0216] Calculate the conductivity of sealed capacitors using pre-built conductivity formulas and obtain conductivity performance reports;

[0217] Based on sealed capacitors, maximum power density reports and conductive performance reports, a preparation process optimization method for high-frequency dedicated capacitors was completed.

[0218] In the several embodiments provided by the present invention, it should be understood that the disclosed devices, systems and methods can be implemented in other ways. For example, the system embodiments described above are only illustrative, and actual implementation may have other division methods.

[0219] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0220] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0221] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0222] In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the system claim can also be implemented by one unit or device through software or hardware. The second and other words are used to indicate names, but not to indicate any particular order.

[0223] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for optimizing the preparation process of a high-frequency dedicated capacitor, characterized in that: The method comprises: Confirm the preparation environment, which includes: automatic loader, distillation equipment, laser cutting machine, spray robot, temperature and humidity sensor, feeding system, conveyor belt, automated assembly system, vacuum chamber, capacitor housing, laser heater, multi-stage temperature control furnace, precision balance, robotic arm, vacuum pump, vacuum pressure sensor, conveying system and plasma generator; Receiving a preparation instruction based on a preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a high-precision balance, and weighing the modified polypropylene film using the high-precision balance to obtain a mass of the modified polypropylene film; Determine whether the quality of the modified polypropylene film is within a preset quality range; If the quality of the modified polypropylene film is not within the preset quality range, returning to the step of obtaining the modified polypropylene film according to the preparation instruction; If the quality of the modified polypropylene film is within a preset quality range, the modified polypropylene film is metallized using a distillation device to obtain a metallized modified film; Using a laser cutting machine and a preset width to cut the metallized modified film to obtain metallized film strips; The metallized film strip is wound in a preset staggered manner to obtain a capacitor core, and gold is sprayed on both ends of the capacitor core by a spraying robot to obtain an electrode capacitor core; Using a pre-established heat treatment method to heat treat the electrode capacitor core to obtain a heat-treated electrode; Assembling the capacitor housing and the heat-treated electrode by using an automated assembly system to obtain a primary capacitor, and sealing the primary capacitor by using a sealing material to obtain a sealed capacitor; Calculate the maximum power density of sealed capacitors using pre-built power density formulas and get a maximum power density report; Calculate the conductivity of sealed capacitors using pre-built conductivity formulas and obtain conductivity performance reports; Based on sealed capacitors, maximum power density reports and conductive performance reports, a preparation process optimization method for high-frequency dedicated capacitors was completed.

2. The method for optimizing the preparation process of a high-frequency dedicated capacitor according to claim 1, characterized in that: The confirmation of the preparation environment includes: Using a temperature and humidity sensor and a preset monitoring frequency to monitor the temperature and humidity in the preparation environment, and obtaining a temperature data set and a humidity data set; If it is confirmed that there is temperature data in the temperature data set that is not in the preset temperature range, the temperature in the preparation environment is adjusted using the pre-built central air conditioner until the temperature data in the temperature data set are all in the preset temperature range, thereby obtaining an adapted temperature environment; If there is humidity data in the humidity data set that is higher than the preset humidity threshold, the humidity in the preparation environment is reduced by using a pre-built dehumidifier until the humidity data in the humidity data set are all equal to the preset humidity threshold, thereby obtaining the adapted humidity; If there is humidity data in the humidity data set that is lower than the preset humidity threshold, the humidity in the preparation environment is increased by using a pre-built humidifier until the humidity data in the humidity data set are all equal to the preset humidity threshold, thereby obtaining an adapted humidity environment; Confirm the preparation environment based on the adaptation temperature environment and the adaptation humidity environment.

3. The method for optimizing the preparation process of a high-frequency dedicated capacitor according to claim 2, characterized in that: The modified polypropylene film is metallized by using a distillation device to obtain a metallized modified film, comprising: The modified polypropylene film is conveyed to a conveyor belt by using a feeding system to obtain a film to be conveyed; The film to be transported is conveyed to the vacuum chamber by a conveyor belt to obtain a vacuum chamber film, and the position of the vacuum chamber film is adjusted by a mechanical arm and a preset position to obtain an adjusted film; The air in the vacuum chamber is evacuated by a vacuum pump, and the pressure in the vacuum chamber is monitored by a vacuum pressure sensor to obtain an absolute vacuum environment, and the pre-constructed mixed gas is transported to the absolute vacuum environment by a conveying system and a preset gas mixing ratio to obtain a mixed vacuum environment, wherein the mixed gas includes: oxygen and hydrogen; Starting a plasma generator disposed in the mixed vacuum environment, wherein the power and processing time of the plasma generator are preset, and using the started plasma generator to remove surface impurities of the adjusted film to obtain a clean film; Obtaining tantalum metal; The metal tantalum is transported into a pre-built crucible by a conveyor belt to obtain the metal tantalum to be heated, the metal tantalum to be heated is heated by a laser heater to obtain tantalum vapor, and the tantalum vapor and the clean film are used to obtain a metallized modified film.

4. The method for optimizing the preparation process for high-frequency dedicated capacitors according to claim 3, characterized in that: The step of obtaining metallic tantalum comprises: According to a preset mixing ratio, the pre-constructed tantalate, magnesium chips and sodium chloride are mixed to obtain a mixture; Using an automatic charging machine to charge the mixture into a crucible to obtain a mixture to be heated; Heating the crucible based on the mixture to be heated and the multi-stage temperature control furnace to obtain a heated mixture, wherein the multi-stage temperature control furnace includes: temperature setting, time setting, heating mode and temperature monitoring; Turn off the multi-stage temperature control furnace based on the time setting, and use the temperature sensor to detect the multi-stage temperature control furnace after being turned off in real time to obtain temperature data, wherein the temperature sensor presets the time threshold; If it is confirmed that the temperature data is greater than a preset temperature threshold, the temperature of the multi-stage temperature control furnace is reduced by using a pre-built fan until the temperature data is less than or equal to the preset temperature threshold, and the heated mixture is taken out by using a pre-built automatic material taking arm to obtain a heated mixture; Using a pre-constructed automatic pickling machine to pickle the heated mixture to obtain a pickled mixture, and using a pre-constructed flushing device to wash the pickled mixture to obtain a washed mixture; The cleaned mixture is dried using a pre-built drying machine, a preset temperature and a preset drying time to obtain metallic tantalum.

5. The method for optimizing the preparation process for high-frequency dedicated capacitors according to claim 4, characterized in that: The coating robot is used to spray gold on both ends of the capacitor core to obtain an electrode capacitor core. include: Among them, the spraying robot includes: a camera and an intelligent alarm system; Using a camera to photograph the two ends of the capacitor core to obtain a spraying area image, and using pre-built image processing software to analyze the spraying area image to obtain an analyzed image; Use pre-built computer vision technology to determine whether there are any missed spray areas in the analyzed image; If there is a missed spraying area in the analyzed image, the intelligent alarm system will sound an alarm and record the position of the missed spraying area. The spraying robot will be used to repair the position of the missed spraying area to obtain a repaired capacitor core. The repaired capacitor core is used as the capacitor core, and the process returns to the above step of photographing the two ends of the capacitor core with a camera until there is no missed spraying area in the analyzed image, and an electrode capacitor core is obtained.

6. The method for optimizing the preparation process for high-frequency dedicated capacitors according to claim 5, characterized in that: The power density formula is as follows: Where W represents the maximum power density of the sealed capacitor, α represents the environmental compensation coefficient, U represents the rated voltage of the sealed capacitor, R represents the internal resistance of the sealed capacitor, and D represents the diameter of the sealed capacitor cylinder. represents the power factor, β represents the temperature coefficient, T represents the preparation environment temperature, γ represents the humidity coefficient, P represents the preparation environment humidity, and H represents the height of the sealed capacitor.

7. The method for optimizing the preparation process for high-frequency dedicated capacitors according to claim 6, characterized in that: The conductive performance of the sealed capacitor is calculated using the pre-built conductive formula to obtain a conductive performance report. include: The conductivity formula is as follows: R1=ESR+α T T1+a p N1+a V V+R2 Where, I(t) represents the current of the sealed capacitor, U(t) represents the voltage of the sealed capacitor, Z(ω,T,L,C,ESR) represents the total impedance of the sealed capacitor, ω represents the angular frequency of the electrical signal, T1 represents the operating temperature of the sealed capacitor, L represents the equivalent inductance inside the sealed capacitor, C represents the capacitance value of the sealed capacitor, ESR represents the equivalent series resistance of the sealed capacitor, R1 represents the total resistance of the sealed capacitor, α T represents the temperature coefficient, α p represents the pressure coefficient, α V represents stress coefficient, P1 represents preparation environment pressure, V represents stress voltage, and R2 represents variable resistance; If the current of the sealed capacitor is greater than or equal to the preset current threshold, the conductive performance of the sealed capacitor is confirmed to be good, and a conductive performance report is obtained; Otherwise, the conductivity of the sealed capacitor is confirmed to be poor, and a conductivity report is obtained.

8. The method for optimizing the preparation process for high-frequency dedicated capacitors according to claim 7, characterized in that: The method of sealing the primary capacitor with a sealing material to obtain a sealed capacitor comprises: Using a robotic arm to place the primary capacitor in a preset sealing mold to obtain a capacitor to be sealed; Using a pre-built camera to photograph the capacitor to be sealed, the area to be sealed is obtained; Obtaining a sealing material, wherein the sealing material includes a resin and a curing agent, and injecting the sealing material into a pre-built automatic glue coating machine to obtain an automatic glue injection machine, and applying the sealing material to the area to be sealed by using the automatic glue injection machine to obtain a capacitor after application; Curing the coated capacitor using a pre-built curing device to obtain a cured capacitor, wherein the curing device is preset with a curing temperature and a curing time; The sealing performance index of the capacitor after curing is detected by using a pre-built leakage current detection formula, and the sealed capacitor is obtained based on the sealing performance index.

9. The method for optimizing the preparation process for high-frequency dedicated capacitors according to claim 8, characterized in that: The pre-built leakage current detection formula is used to detect the sealing performance index of the capacitor after curing, and the sealed capacitor is obtained based on the sealing performance index. include: The leakage current detection formula is as follows: Among them, S P Indicates the sealing performance index of the capacitor after curing, I leak represents leakage current, V1 represents applied voltage, t test represents the test time, and A1 represents the surface area of ​​the sealed area in the capacitor after curing; If the sealing performance index is greater than a preset standard threshold, a resealing operation is performed on the cured capacitor until the sealing performance index is less than or equal to the preset standard threshold, thereby obtaining a sealed capacitor; If the sealing performance index is less than or equal to the preset standard threshold, the cured capacitor is confirmed as a sealed capacitor.

10. A system for optimizing the manufacturing process of high-frequency special capacitors, characterized in that: The system comprises: A preparation environment confirmation module is used to confirm the preparation environment, wherein the preparation environment includes: an automatic loader, a distillation device, a laser cutting machine, a spraying robot, a temperature and humidity sensor, a feeding system, a conveyor belt, an automated assembly system, a vacuum chamber, a capacitor housing, a laser heater, a multi-stage temperature control furnace, a precision balance, a robotic arm, a vacuum pump, a vacuum pressure sensor, a conveying system and a plasma generator, receiving a preparation instruction based on the preparation environment, obtaining a modified polypropylene film according to the preparation instruction, calibrating a precision balance to obtain a precise balance, weighing the modified polypropylene film using the precise balance to obtain the mass of the modified polypropylene film, judging whether the mass of the modified polypropylene film is within a preset mass range, and if the mass of the modified polypropylene film is not within the preset mass range, returning to the step of obtaining the modified polypropylene film according to the preparation instruction; A metallization cutting module is used to metallize the modified polypropylene film by using a distillation device to obtain a metallized modified film if the quality of the modified polypropylene film is within a preset quality range, and to cut the metallized modified film by using a laser cutting machine and a preset width to obtain metallized film strips; The winding and heat treatment module is used to wind the metallized film strip in a preset staggered manner to obtain a capacitor core, spray gold on both ends of the capacitor core using a spraying robot to obtain an electrode capacitor core, and heat treat the electrode capacitor core using a pre-established heat treatment method to obtain a heat-treated electrode; The capacitor performance evaluation module is used to assemble the capacitor housing and the heat-treated electrode using an automated assembly system to obtain a primary capacitor, seal the primary capacitor using a sealing material to obtain a sealed capacitor, calculate the maximum power density of the sealed capacitor using a pre-built power density formula to obtain a maximum power density report, calculate the conductive performance of the sealed capacitor using a pre-built conductive formula to obtain a conductive performance report, and complete the preparation process optimization method for high-frequency special capacitors based on the sealed capacitor, the maximum power density report and the conductive performance report.

Images