An intelligent silver wire bonding system for efficient power management of power supplies

Abstract

The present invention provides an intelligent silver wire bonding system for efficient power management of a power supply, which relates to the technical field of silver wire bonding. The system includes a load, a load detection module, a power supply module, a power catalysis module, and a power management module. The load is used for welding silver wires. The load detection module is used to detect the total power of the load and the sub-powers of each unit within the load. The power supply module is used to provide an initial voltage for the power catalysis module. The power catalysis module is used to classify the initial voltage and output a classified voltage. The power management module is used to adaptively adjust the classified voltage in combination with the sub-powers and calculate the set of partial voltages required by the load. By classifying the initial voltage through the power catalysis module, the present invention reduces the energy loss of each stage and optimizes the power conversion efficiency in real time according to the load change.

Description

Technical Field

[0001] The present invention relates to the technical field of silver wire bonding, and particularly to an intelligent silver wire bonding system for efficient power management of a power supply. Background Art

[0002] Silver wire bonding technology is a microelectronic packaging technology mainly used for connecting a chip to an external circuit during the manufacturing process of semiconductor devices. This technology involves connecting a fine silver wire (usually with a diameter between a few micrometers and dozens of micrometers) to the chip pad by means of thermocompression or ultrasonic bonding, and then connecting it to an external circuit board.

[0003] The key steps of silver wire bonding technology include selecting a suitable silver wire, whose diameter and material need to meet specific electrical and mechanical performance requirements; coating a layer of solder or adhesive on the chip pad to enhance the connection strength between the silver wire and the chip; using a precision mechanical device to place the silver wire between the chip pad and the external circuit board; making the silver wire form a firm connection with the pad by means of thermocompression or ultrasonic bonding; thermocompression bonding uses heat and pressure to fuse the silver wire and the pad together, while ultrasonic bonding uses the energy generated by ultrasonic vibration to achieve the connection; after bonding, the connection needs to be inspected and tested to ensure that its electrical performance and mechanical strength meet the requirements.

[0004] The intelligent silver wire bonding system adopts intelligent control algorithms to monitor the power of the power supply in real time and adjust the power output according to the actual needs of the device. The system also integrates high-precision sensors for real-time monitoring of key parameters such as power, current, and voltage of the power supply, providing accurate data support for the intelligent control algorithm. In addition, the system can intelligently adjust the bonding parameters of the silver wire, such as bonding pressure, temperature, etc., according to the power and current requirements monitored in real time to optimize the connection performance. At the same time, the system has a fault detection and diagnosis function, which can monitor abnormal conditions during the bonding process in real time and troubleshoot them in time to ensure the stable operation of the system.

[0005] Although the existing silver wire bonding systems can perform silver wire bonding operations normally, the power management of the power supply is not efficient enough, especially when dealing with high-power-consuming devices, and there is room for improvement in the handling of the device temperature. Summary of the Invention

[0006] The present invention provides an intelligent silver wire bonding system for efficient power management of a power supply to solve the defects in the prior art that the power management of the power supply is not efficient enough, especially when dealing with high-power-consuming devices, and there is room for improvement in the handling of the device temperature.

[0007] On the one hand, the present invention provides an intelligent silver wire bonding system for efficient power management of a power supply, including: a load, a load detection module, a power supply module, a power catalysis module, and a power management module;

[0008] The load is used for welding the bonded silver wire;

[0009] The load detection module is used for detecting the total power of the load and the sub - powers of each unit within the load;

[0010] The power supply module is used for providing an initial voltage for the power catalysis module;

[0011] The power catalysis module is used for grading the initial voltage and outputting a graded voltage;

[0012] The power management module is used for combining the sub - powers, adaptively adjusting the graded voltage, and calculating the set of partial voltages required by the load.

[0013] An intelligent silver wire bonding system for efficient power management of a power supply according to the present invention, the load includes: a wire supply unit, a welding unit, a high - frequency vibration unit, a pressure control unit, and a temperature control unit;

[0014] The wire supply unit is used for supplying the bonded silver wire to the welding unit;

[0015] The welding unit is used for welding the bonded silver wire;

[0016] The high - frequency vibration unit is used for providing welding heat energy for silver wire bonding;

[0017] The pressure control unit is used for providing contact pressure for the bonded silver wire;

[0018] The temperature control unit is used for regulating the welding heat energy of the high - frequency vibration unit.

[0019] An intelligent silver wire bonding system for efficient power management of a power supply according to the present invention, the load detection module includes a load sniffing unit and a power calculation unit;

[0020] The load sniffing unit is used for sniffing the number of sub - units of the load and node information;

[0021] The power calculation unit is used for combining the node information and calculating the working power and standby power of the sub - units.

[0022] An intelligent silver wire bonding system for efficient power management of a power supply according to the present invention, the power catalysis module includes a primary conversion unit, an intermediate conversion unit, a final conversion unit, and a feedback control unit;

[0023] The primary conversion unit is used for eliminating the noise voltage in the initial voltage and outputting the intermediate voltage required by the intermediate conversion unit;

[0024] The intermediate conversion unit is used for combining the rated voltage of the load, regulating the intermediate voltage, and outputting a callback voltage;

[0025] The final conversion unit is used to output a compensation voltage, finely adjust the callback voltage, and output a stepped voltage to the load;

[0026] The feedback control unit is used to monitor the real-time change of the initial voltage, adjust the voltage conversion ratio and compensation voltage of the intermediate conversion unit, so that the callback voltage remains constant.

[0027] For an intelligent silver wire bonding system with efficient power management provided by the present invention, the calculation formula of the noise voltage is expressed as:

[0028] ;

[0029] In the formula, V md is the intermediate voltage, V in is the initial voltage, V n is the noise voltage.

[0030] For an intelligent silver wire bonding system with efficient power management provided by the present invention, the power catalytic module further includes a current regulation unit, and the current regulation unit is used to adjust the stepped current received by the load in combination with the stepped voltage.

[0031] For an intelligent silver wire bonding system with efficient power management provided by the present invention, the power management module includes a power integration unit, a control strategy unit and an automatic regulation unit;

[0032] The power integration unit is used to combine the working power and the standby power and output a power step collection;

[0033] The control strategy unit is used to perform priority allocation and power limitation on the load in combination with the power step collection;

[0034] The automatic regulation unit is used to send the priority allocation and power limitation information to the current regulation unit to adjust the stepped current.

[0035] For an intelligent silver wire bonding system with efficient power management provided by the present invention, the specific steps of the control strategy unit for priority allocation and power limitation include:

[0036] Combining the sub-power of each unit in the load and the working state of each unit in the load to perform a priority score on each unit in the load and output a score value;

[0037] Performing different power deliveries according to the priorities of each unit; the higher the priority, the closer the delivered power is to the maximum rated power of each unit; when the priority is low, the delivered power is closer to the minimum rated power value of each unit, and the lowest is the minimum rated power value.

[0038] An intelligent silver wire bonding system for efficient power management according to the present invention, the specific steps for the temperature control unit to adjust the welding heat energy include:

[0039] Set the rated temperature required for silver wire bonding;

[0040] Use a thermocouple to measure the real-time temperature of the solder joint;

[0041] Combine the real-time temperature and the rated temperature, and use the PID control method to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit.

[0042] An intelligent silver wire bonding system for efficient power management according to the present invention further includes a gas protection module for filling an inert gas into the load to prevent the bonded silver wire from oxidizing at high temperatures.

[0043] An intelligent silver wire bonding system for efficient power management provided by the present invention outputs a compensation voltage through a final conversion unit, micro-adjusts the callback voltage, and outputs a hierarchical voltage to the load to achieve precise control of the voltage output of each unit, thereby achieving the effect of saving energy consumption and improving system stability; by scoring the priority of each unit in the load and delivering different powers according to the priority of each unit, it can ensure that the most important load unit obtains sufficient power when needed, can maximize the use of limited power resources, and improve the overall system efficiency and performance.

[0044] An intelligent silver wire bonding system for efficient power management provided by the present invention combines the real-time temperature and the rated temperature, and uses the PID control method to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit, which helps to improve the working efficiency of the high-frequency vibration unit, reduce energy loss, and increase the service life of the high-frequency vibration unit. Brief Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0046] Figure 1 It is a schematic structural diagram of an intelligent silver wire bonding system for efficient power management provided by Embodiment 1 of the present invention. Detailed Embodiments

[0047] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0048] Embodiment 1:

[0049] The following Figure 1 describes an intelligent silver wire bonding system for efficient power management of a power supply according to the present invention.

[0050] Figure 1 is a schematic structural diagram of an intelligent silver wire bonding system for efficient power management of a power supply provided by an embodiment of the present invention.

[0051] As Figure 1 shown, an intelligent silver wire bonding system for efficient power management of a power supply provided by an embodiment of the present invention includes: a load, a load detection module, a power supply module, a power catalysis module, and a power management module.

[0052] The load is used for silver wire bonding of silver wires. Silver wire bonding is a product used to replace traditional gold wires in the LED and IC industries. Its main component is single crystal silver, with a content generally of 90%-99%, and the rest are various trace elements. The advantages of silver wire bonding are that it is cheap, about one-fifth of the gold wire of the same wire diameter; at the same time, it has good electrical conductivity, solderability, reflectivity, and heat dissipation. The main components of silver wires include pure silver and alloys containing palladium (Pd) or gold (Au). The use of these alloys helps to improve the performance of silver wires, for example, by solid solution strengthening and grain refinement to increase the fracture load of silver wire bonding. Silver wire bonding is an important link in the semiconductor packaging process, and it forms a connection between the lead and the chip through ultrasonic welding, thermocompression welding, etc.

[0053] The load includes: a wire feeding unit, a welding unit, a high-frequency vibration unit, a pressure control unit, and a temperature control unit. The wire feeding unit is used to supply bonding silver wires to the welding unit. The wire feeding unit is usually located above or on the side of the welding head and is responsible for supplying silver wires to the welding point. The wire feeding unit is directly connected to the welding unit, and usually uses a conveying system to transport silver wires to the welding point. The welding unit is used to perform silver wire bonding on the bonding silver wires. The high-frequency vibration unit is used to provide welding heat energy for silver wire bonding. The pressure control unit is used to provide contact pressure for the bonding silver wires. The temperature control unit is used to adjust the welding heat energy of the high-frequency vibration unit. The welding unit ensures stable and reliable electrical connection between electronic components. In this process, the high-frequency vibration unit is responsible for providing the required welding heat energy for silver wire bonding, using the heat generated by high-frequency vibration to accelerate the melting and bonding of welding materials, thereby forming a strong welding point. At the same time, the pressure control unit is responsible for providing precise contact pressure for the bonding silver wires to ensure good contact between the silver wires and the substrate, promoting welding quality and avoiding possible welding defects. Through appropriate contact pressure, the welding effect can be enhanced, and the mechanical strength and conductivity of the welding point can be improved. In addition, the temperature control unit is used to adjust the welding heat energy of the high-frequency vibration unit to ensure that the temperature is maintained within the optimal range during the welding process to prevent material damage or degradation of welding point quality caused by excessive temperature.

[0054] The specific steps for the temperature control unit to adjust the welding heat energy include:

[0055] Set the rated temperature required for silver wire bonding. Set the rated temperature for silver wire bonding according to the melting point of the bonding silver wire.

[0056] Use a thermocouple to measure the real-time temperature of the welding point. A temperature measuring device composed of wires of two different metals welded together to form two junctions. When these two junctions are at different temperatures, a weak voltage (thermal electromotive force) will be generated in the circuit, and its magnitude is proportional to the temperature difference. This enables the thermocouple to measure temperature changes. Firmly contact the sensing end (the side of the welding point) of the thermocouple to the surface of the welding point. Some thermally conductive glue or mechanical fixtures can be used to ensure good contact. Connect the leads of the thermocouple to a temperature recorder or multimeter, ensuring good connection to avoid inaccurate readings. Before welding, the thermocouple can be calibrated first to ensure its accuracy. A known temperature source can be referred to for comparison. Before starting welding, start the temperature recorder to monitor the temperature of the welding point in real time. During the welding process, observe and record the temperature changes.

[0057] Combine the real-time temperature with the rated temperature, and use the PID control method to adjust the output power of the high-frequency vibration unit to regulate the heat generation of the high-frequency vibration unit. Transmit the real-time temperature data to the control system (such as a microcontroller, PLC, or computer) and compare it with the rated operating temperature. The PID control algorithm has the advantages of being simple and easy to understand, easy to implement, strong adaptability, and can optimize the performance by adjusting the gain coefficients.

[0058] The output formula of the PID controller is expressed as:

[0059] ;

[0060] In the formula, u(t) is the output of the controller, that is, the control signal. Kp is the proportional gain, Kb is the integral gain, Kd is the derivative gain, and e(t) is the error at the current moment, that is, the temperature difference between the real-time temperature and the rated temperature. is the integral of the error, is the derivative of the error. The calculation formula of e(t) is expressed as:

[0061] ;

[0062] In the formula, r(t) is the rated temperature, and y(t) is the real-time temperature.

[0063] The load detection module is used to detect the total power of the load and the sub-power of each unit within the load to ensure the efficient operation and safe management of the system. The load detection module includes a load sniffing unit and a power calculation unit. The load sniffing unit is used to sniff the number of sub-units of the load and node information. This process can not only provide a detailed view of the load structure but also help to detect potential faults or abnormalities in a timely manner. The power calculation unit is used to calculate the working power and standby power of the sub-units in combination with the node information. Accurate power analysis provides strong support for load management and optimization, and also lays a foundation for energy efficiency improvement and cost control. Through this comprehensive load detection scheme, users can monitor the power usage of the system in real time, thereby performing effective energy management to ensure the stability and economy of the equipment.

[0064] The power supply module is used to provide the initial voltage for the power catalysis module and regulate it through the power catalysis module to ensure that the load can start and operate normally. It meets the requirements of different loads through a stable and reliable voltage output, helping to maintain the overall performance and function of the system. The power supply module usually has multiple protection mechanisms, such as overvoltage, overcurrent, and short-circuit protection, to prevent equipment damage caused by abnormal current.

[0065] The power catalytic module is used to classify the initial voltage by combining the total power and the sub - power, and output the classified voltage, which is used to improve the output efficiency of the power supply, reduce losses, improve the power factor, etc. By designing a multi - stage power conversion topology, the energy transfer is optimized at each level, and unnecessary energy losses are reduced, thereby improving the overall efficiency. The power catalytic module includes a primary conversion unit, an intermediate conversion unit, a final conversion unit, and a feedback control unit. The primary conversion unit is used to eliminate the noise in the initial voltage and output the intermediate voltage required by the intermediate conversion unit. The primary conversion unit monitors the initial voltage input by the power supply module, denoises the initial voltage using a filter to obtain a low - noise voltage signal, and then outputs the created voltage signal as the intermediate voltage to the intermediate conversion unit. The formula for noise reduction of the initial voltage is expressed as:

[0066] ;

[0067] In the formula, V md is the intermediate voltage, V in is the initial voltage, that is, the voltage output by the power supply. V n is the noise voltage. The noise voltage refers to the non - periodic or random interference signal superimposed on the signal power supply. These noises may come from thermal noise, electromagnetic interference, radio frequency interference, or power fluctuations, etc., thus affecting the normal operation of the equipment. The calculation formula of the noise voltage is expressed as:

[0068] ;

[0069] ;

[0070] ;

[0071] In the formula, V j is the comprehensive noise voltage, V s is the thermal noise voltage, V i is the voltage value at each sampling point, m is the total number of sampling points, i is any sampling point, k is the Boltzmann constant (1.38 × 10^-23 J / K), T is the absolute temperature, R is the resistance value of the load, and Δf is the bandwidth. The range of the bandwidth Δf is expressed as: 1kHz ≤ Δf ≤ 100kHz. The bandwidth usually refers to the frequency range in which the signal can be effectively transmitted or processed. In noise analysis, the bandwidth is defined as the frequency range of the signal or noise in the system, usually expressed in hertz (Hz). The larger the bandwidth, the larger the value of the noise voltage usually is.

[0072] The intermediate conversion unit is used to adjust the intermediate voltage in combination with the rated voltage of the load and output a callback voltage. The process of outputting the callback voltage occurs at the load end. The callback voltage is the voltage value obtained by adjusting the intermediate voltage upward or downward according to the minimum rated voltage at the load end. When the value of the intermediate voltage is lower than the minimum rated voltage at the load end, the intermediate voltage needs to be increased. When the value of the intermediate voltage is higher than the minimum rated voltage at the load end, the intermediate voltage needs to be decreased.

[0073] The final conversion unit is used to output a compensation voltage, finely adjust the callback voltage, and output a stepped voltage to the load. The stepped voltage is the callback voltage after fine adjustment. The feedback control unit is used to monitor the real-time change of the initial voltage, adjust the compensation voltage of the intermediate conversion unit, and keep the callback voltage constant. This constancy is very important for ensuring the normal operation of the device and avoiding damaging the load.

[0074] The calculation formula for the compensation voltage is expressed as:

[0075] ;

[0076] where V fb is the compensation voltage, V md is the intermediate voltage, V a is the rated voltage of each unit in the load. The rated voltage of the load usually lies within a range and can be adjusted according to the power management module.

[0077] The power catalysis module further includes a current regulation unit, which is used to adjust the stepped current received by the load in combination with the stepped voltage. The current regulation unit can precisely control the current flowing to the load to match the requirements of the load, thereby improving the efficiency. Specifically, a current source can be used to control the current flowing to the load to ensure that the output current matches the stepped current. The current source can provide a fixed current value regardless of the change of the load. Its output voltage will be adjusted according to the change of the load to keep the current constant. In reality, however, the current output of the current source may fluctuate when the load changes. Using a negative feedback control circuit to monitor the output current in real time and adjust the input signal can greatly reduce the fluctuation. A linear voltage regulator or a switching voltage regulator can also be selected to improve the stability of the power supply.

[0078] The power management module is used to combine sub - powers, adaptively adjust hierarchical voltages, and calculate the set of partial voltages required by the load. The power management module includes a power integration unit, a control strategy unit, and an automatic regulation unit. The power integration unit is used to combine the working power and the standby power and output a set of power grades. The power integration unit can monitor the working power and the standby power in real - time, thereby optimizing the utilization rate of the power supply. The working power refers to the power consumption of the device in the normal operating state, while the standby power refers to the power consumption of the device in the non - working state. In an application environment where the load changes frequently, the flexibility and adaptability of the power integration unit are particularly important. It can not only ensure the stable operation of the device under high load conditions but also effectively reduce energy consumption in the standby state, thereby extending the overall service life of the device. The control strategy unit is used to combine the set of power grades, assign priorities to the load, and limit the power. The control strategy unit can dynamically adjust the power distribution to ensure that important loads can still obtain sufficient power supply in the case of power shortage. After clarifying the load priorities, the control strategy unit will calculate the power limit according to the power supply and the current power demand. This includes evaluating the total power distribution capacity of the system and the current power usage situation to ensure that at any time, the total consumption of all loads does not exceed the power supply capacity of the system. The automatic regulation unit is used to send the priority assignment and power limit information to the current regulation unit to adjust the hierarchical current.

[0079] The specific steps for the control strategy unit to perform priority assignment and power limit include:

[0080] Score the priorities of each unit in the load by combining the sub - powers of each unit in the load and the working states of each unit in the load, and output the score value.

[0081] The priorities of each unit in the load can be divided according to functionality, power consumption, running time, and working state. Except for the condition of the working state, the division criteria for each priority of the other conditions are: high priority (3 points), medium priority (2 points), and low priority (1 point). When dividing by functionality, high priority usually represents key devices, which are crucial for the normal operation of the system. Medium priority represents important devices, which affect the work efficiency to a certain extent. Low priority represents non - key devices, which have a relatively small impact on the overall function. Under the condition of power consumption, high priority usually means that the power demand is greater than 30% of the available power of the system, medium priority means that the power demand is between 10% and 30% of the available power of the system, and low priority means that the power demand is less than 10% of the available power of the system. Running time represents the proportion of the relative running time among each unit. Assuming the production line operates continuously for 24 hours a day, the running time of each unit does not include the time occupied by standby time and the proportion of the total time. The larger the proportion, the higher the priority. And the working state of each unit is scored 1 when working and 0 when on standby.

[0082] Combined with the above priority division strategy, the specific division criteria for the scoring values of each unit in each load are shown in Table 1 as follows:

[0083] Table 1:

[0084] Load cell Functionality Power consumption Running time Operating status Rating value Wire feeding unit 3 1 3 1 8 Welding unit 3 3 3 1 10 High-frequency vibration unit 3 3 3 1 10 Pressure control unit 2 1 3 1 7 Temperature control unit 3 2 2 1 8

[0085] Different power transmissions are carried out according to the priorities of each unit. The higher the priority, the closer the transmitted power is to the maximum rated power of each unit. When the priority is low, the transmitted power is closer to the minimum rated power value of each unit, and the lowest is the minimum rated power value. The specific calculation formula for the required transmitted power is expressed as:

[0086] ;

[0087] ;

[0088] In the formula, P 0 is the maximum rated power of any unit in the load, P min is the minimum rated power of any unit in the load, P 1 is the required transmitted power, and α is the scoring value. The calculation method of the minimum rated power is P min =V min ·I min . In the formula, V min is the minimum rated voltage of the unit, and I min is the minimum rated current of the unit. The power management module calculates the voltage distribution of each unit at the obtained priority in combination with the priorities of each unit in the load. The compensation voltage output of the final conversion unit is controlled with this voltage distribution. In order to achieve precise control of the voltage output of each unit, so as to achieve the effect of saving energy consumption and improving system stability.

[0089] The gas protection module is used to fill the load with inert gas to prevent the bonding silver wire from oxidizing at high temperature. The bonding silver wire is selected because of its excellent electrical conductivity and thermal conductivity, but it is easy to oxidize in a high-temperature environment, affecting its performance and lifespan. The role of the gas protection module is to provide a protective gas during the bonding process, usually an inert gas such as nitrogen or argon, to prevent the silver wire from reacting with oxygen in the air at high temperature. This protection measure significantly improves the stability and reliability of the silver wire bonding, ensuring the high-efficiency performance of the entire power management system during long-term operation.

[0090] In summary, an intelligent silver wire bonding system for efficient power management of the present invention can ensure that the most important load units obtain sufficient power when needed by assigning priority scores to each unit in the load and delivering different powers according to the priorities of each unit, which can maximize the utilization of limited power resources and improve the overall system efficiency and performance. By outputting a compensation voltage through the final conversion unit, micro-adjusting the callback voltage, and outputting a graded voltage to the load, the voltage output of each unit can be precisely controlled, thereby achieving the effects of saving energy consumption and improving system stability. By combining the real-time temperature with the rated temperature and using the PID control method to adjust the output power of the high-frequency vibration unit to regulate the heat generation of the high-frequency vibration unit, it helps to improve the working efficiency of the high-frequency vibration unit, reduce energy loss, and increase the service life of the high-frequency vibration unit.

[0091] Embodiment 2:

[0092] Different from Embodiment 1, the output mode of the compensation voltage in Embodiment 1 can be achieved by using an operational amplifier. Operational amplifiers are usually configured with differential amplifiers or followers. A differential amplifier is used to compare two different voltages and amplify the difference between them. This is very effective for implementing voltage compensation, especially when it is necessary to compare a reference voltage and a feedback voltage. A follower is an operational amplifier configuration with a high input impedance and a low output impedance, which is used to provide voltage buffering while transmitting the input voltage. This is very useful for preventing voltage changes caused by the load. Among them, the configuration steps of the differential amplifier include:

[0093] Determine the input voltage to be compensated and the target output voltage.

[0094] Design a circuit to compare the input voltage and the target input voltage.

[0095] Select a suitable operational amplifier according to parameters such as load capacity, bandwidth, and distortion. The output of the differential amplifier can be expressed by the following formula:

[0096] ;

[0097] In the formula, V out is the compensation voltage, V + is the positive input voltage, V - is the negative input voltage, and A is the gain value. The gain of a standard differential amplifier can be set by resistors:

[0098] ;

[0099] In the formula, R f is the feedback resistor, R in is the input resistor, R 1 and R3 is the upstream resistor, R 2 and R 4 are the downstream resistors. R 1 is the resistor connected to the NAND inverting input terminal (V + ). R 3 is part of the resistor connected to the inverting input terminal (V - ), and is used to set the current and feedback path. R 2 is the resistor connected between the inverting input terminal (V - ) and the output terminal (V out ), which helps to set the feedback current. R 4 is the resistor connected between the inverting input terminal (V - ) and the ground, which affects the input impedance and feedback configuration. If a higher gain is required, a larger feedback resistor can be selected.

[0100] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art can understand and implement it without creative labor.

[0101] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course also by hardware. Based on this understanding, the above technical solution, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An intelligent silver wire bonding system with efficient power management, characterized in that: include: Load, load detection module, power module, power catalysis module and power management module; The load is used to weld the bonding silver wire; The load detection module is used to detect the total power of the load and the divided power of each unit in the load; the load detection module includes a load sniffing unit and a power calculation unit; The load sniffing unit is used to sniff the number of subunits and node information of the load; The power calculation unit is used to calculate the working power and standby power of the subunit in combination with the node information; The power supply module is used to provide an initial voltage for the power catalytic module; The power catalytic module is used to grade the initial voltage and output a graded voltage; the power catalytic module includes a primary conversion unit, a secondary conversion unit, a final conversion unit and a feedback control unit; The primary conversion unit is used to eliminate the noise voltage in the initial voltage and output the intermediate voltage required by the intermediate conversion unit; the calculation formula of the noise voltage is expressed as: ； Where V md is the intermediate voltage, V in is the initial voltage, V n is the noise voltage; The intermediate conversion unit is used to adjust the intermediate voltage in combination with the rated voltage of the load and output a callback voltage; The final conversion unit is used to output a compensation voltage, fine-tune the callback voltage, and output the graded voltage to the load; the calculation formula of the compensation voltage is expressed as: ； Where V fb is the compensation voltage, V md is the intermediate voltage, V a is the rated voltage of each unit in the load; The feedback control unit is used to monitor the real-time change of the initial voltage, adjust the voltage conversion ratio of the intermediate conversion unit and the compensation voltage, so that the callback voltage remains constant; the power catalytic module also includes a current control unit, and the current control unit is used to adjust the graded current received by the load in combination with the graded voltage; The power management module is used to combine the divided power, adaptively adjust the graded voltage, and calculate the divided voltage set required by the load; the power management module includes a power integration unit, a control strategy unit and an automatic adjustment unit; The power integration unit is used to combine the working power and the standby power to output a power classification set; The control strategy unit is used to assign priorities and limit power to the loads in combination with the power classification set; The automatic adjustment unit is used to send the priority allocation and the power limitation information to the current control unit to adjust the graded current.

2. The intelligent silver wire bonding system with high efficiency power management according to claim 1, characterized in that: The load includes: a wire supply unit, a welding unit, a high-frequency vibration unit, a pressure control unit, and a temperature control unit; The wire supply unit is used to supply the bonding silver wire to the welding unit; The welding unit is used to weld the bonding silver wire; The high-frequency vibration unit is used to provide welding heat energy for the silver wire bonding; The pressure control unit is used to provide contact pressure for the bonding silver wire; The temperature control unit is used to adjust the welding heat energy of the high-frequency vibration unit.

3. The intelligent silver wire bonding system with high efficiency power management according to claim 1, characterized in that: The specific steps of the control strategy unit performing the priority allocation and the power limitation include: Prioritize each unit in the load based on the power distribution of each unit in the load and the working status of each unit in the load, and output the score value; Different power transmission is performed according to the priority of each unit; the higher the priority, the closer the transmitted power is to the maximum rated power of each unit; when the priority is low, the closer the transmitted power is to the minimum rated power value of each unit, and the lowest is the minimum rated power value.

4. The intelligent silver wire bonding system with high efficiency power management according to claim 2, characterized in that: The specific steps of the temperature control unit regulating the welding heat energy include: Set the rated temperature required for silver wire bonding; Use thermocouples to measure the real-time temperature of the solder joint; Combining the real-time temperature with the rated temperature, a PID control method is used to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit.

5. The intelligent silver wire bonding system with high efficiency power management according to claim 4, characterized in that: A gas protection module is also included, which is used to fill the load with an inert gas to prevent the bonding silver wire from being oxidized at high temperature.

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