SiC epitaxy disassembling and assembling method

Abstract

The invention relates to the technical field of semiconductors, in particular to a SiC epitaxy disassembly and assembly method, which can quickly realize the combination and disassembly actions between a graphite ring and a wafer or a graphite disc, improve the wafer positioning accuracy, independently realize the edge searching and deviation correction of the wafer or the graphite disc, save the reference calibration time, reduce the calculation complexity of equipment and improve the reliability of the equipment. The combined wafer, the graphite ring and the graphite disc are smoothly taken and placed in an epitaxial growth environment, and the processing quality is ensured.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, and in particular to a SiC epitaxial disassembly method. Background Art

[0002] Generally, a semiconductor device manufacturing process is performed by repeatedly performing a plurality of unit processes, such as an exposure process, an etching process, a diffusion process, a deposition process, and a metal process on a wafer, and the wafer loaded on a carrier within the facility is introduced or taken out by a wafer transfer device.

[0003] The wafer transfer device is equipped with a robot that supports the wafer at the front end of the arm. The wafer is transferred while being supported by the robot. The wafer is supported by a carrier during transfer, which facilitates the smooth loading of the wafer into the epitaxial device. However, the wafer and the carrier are always transferred as a whole during the transfer process, and the wafer or the carrier cannot be edge-finding operated separately, making it difficult to ensure the positioning accuracy of the wafer and the processing quality. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a SiC epitaxial disassembly method, which can quickly realize the merging and splitting actions between a graphite ring and a wafer or a graphite disk, improve the wafer positioning accuracy, independently realize the edge finding and deviation correction of the wafer or the graphite disk, save the reference calibration time, smoothly realize the taking and placing of the merged wafer, graphite ring and graphite disk and the epitaxial growth environment, reduce the equipment calculation complexity, and ensure the processing quality.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The present invention provides a SiC epitaxial disassembly method, comprising the following steps:

[0007] S01, a disk-ring placement box for storing merged graphite rings and graphite disks, a merging and splitting mechanism for splitting or merging graphite rings and wafers or graphite disks, and a correction platform for edge finding and deviation correction of graphite disks are provided, a manipulator is used to grab the merged graphite rings and graphite disks from the disk-ring placement box and put them into the merging and splitting mechanism, the merging and splitting mechanism is used to split the graphite disks and graphite rings, and the manipulator grabs the graphite disks to the correction platform for edge finding and deviation correction;

[0008] S02, an edge finder for finding the edge of a wafer and a storage box for storing wafers are provided, a robot grabs a wafer from the storage box and loads it into the edge finder for wafer edge finding, the robot puts the wafer after edge finding into a merging and splitting mechanism, and the merging and splitting mechanism merges the wafer and the graphite ring;

[0009] S03, the manipulator places the graphite disk after edge finding into the merging and splitting mechanism, the merging and splitting mechanism merges the graphite disk and the graphite ring to merge the wafer, the graphite ring and the graphite disk, and the manipulator places the merged wafer, the graphite ring and the graphite disk into the epitaxial growth environment;

[0010] S04, the robot takes out the merged wafer, graphite ring and graphite disk from the epitaxial growth environment and puts them into the merging and splitting mechanism, the merging and splitting mechanism separates the graphite disk from the graphite ring, the robot takes out the graphite disk from the merging and splitting mechanism, the merging and splitting mechanism separates the wafer from the graphite ring, the robot takes out the wafer from the merging and splitting mechanism, the robot puts the graphite disk into the merging and splitting mechanism, the merging and splitting mechanism merges the graphite disk and the graphite ring, and the robot takes out the merged graphite disk and the graphite ring;

[0011] S05. In step S01, the correction platform is provided with a third positioning reference, and the correction platform completes edge finding and correction of the graphite disk according to the third positioning reference to determine the position and angle of the graphite disk;

[0012] S06. In step S02, the edge finder is provided with a first positioning reference, and the edge finder completes edge finding and deviation correction of the wafer according to the first positioning reference to determine the position and angle of the wafer;

[0013] S07. In steps S01 to S03:

[0014] When the wafer, graphite ring and graphite disk are combined, the robot grabs or places the graphite disk to realize the overall transfer of the wafer, graphite ring and graphite disk;

[0015] When the graphite ring and the graphite disk are combined, the manipulator grabs or places the graphite disk to realize the overall transfer of the graphite ring and the graphite disk;

[0016] S08. When it is necessary to separate or merge the graphite ring and the wafer or graphite disk again, repeat steps S01 to S07.

[0017] The merging and splitting mechanism includes a base frame, a plurality of ring brackets connected to the top of the base frame, a tray and a lifting mechanism, wherein the ring brackets are distributed around the base frame, the lifting mechanism is drivingly connected to the tray, the base frame is penetrated with movable openings at the top and bottom, the output end of the lifting mechanism is penetrated through the movable opening, and the lifting mechanism drives the tray to move up and down, so that the tray moves up and down inside the ring bracket;

[0018] When the graphite ring and the graphite disk need to be separated, the lifting mechanism drives the tray to move upward to the required height, the manipulator grabs the merged graphite ring and the graphite disk and puts them into the merging and splitting mechanism, the ring bracket and the tray support the graphite ring and the graphite disk respectively, and the lifting mechanism drives the tray to move downward, so that the graphite disk moves downward synchronously with the tray to be separated from the graphite ring;

[0019] When the wafer and the graphite ring need to be separated, after the graphite disk and the graphite ring are separated, the manipulator moves the graphite disk out of the merging and splitting mechanism, and the lifting mechanism drives the tray to move upward inside the graphite ring, and the tray pushes the wafer upward away from the graphite ring, so that the wafer is separated from the graphite ring;

[0020] When the graphite ring and the graphite disk need to be merged, the ring bracket supports the graphite ring, and the lifting mechanism drives the tray to move upward to the required height on the inner side of the graphite ring. The manipulator places the wafer into the tray, and the lifting mechanism drives the tray to descend so that the wafer is supported by the graphite ring, thereby merging the wafer and the graphite ring. Then the lifting mechanism drives the tray to continue to descend to the required height, and the manipulator places the graphite disk after edge finding on the tray. The lifting mechanism drives the tray and the graphite disk to move upward to the required position, thereby merging the wafer, the graphite ring and the graphite disk.

[0021] The SiC epitaxial disassembly and assembly method further comprises a disassembly and edge-finding mechanism, which comprises a disassembly and assembly driving mechanism connected to the base frame, a disassembly and assembly ring light source, a surface light source and a collection device, wherein the disassembly and assembly driving mechanism is used to drive the base frame to move along the X-axis and the Y-axis and to make the base frame rotate, the disassembly and assembly ring light source is located between the base frame and the surface light source, the front end of the collection device passes through the surface light source and corresponds to the disassembly and assembly ring light source, the collection device is provided with a second positioning reference, and the collection device is electrically connected to the disassembly and assembly driving mechanism;

[0022] When the graphite ring is edge-finding, the ring bracket supports the graphite ring, the surface light source and the detachable ring light source provide supplementary light for the graphite ring and the acquisition device, the acquisition device takes visual photos to determine the position and angle of the graphite ring, and the detachable driving mechanism drives the base frame to move along the X-axis and / or Y-axis according to the data obtained by the acquisition device, and makes the base frame rotate, so that the graphite ring completes edge-finding and deviation correction according to the second positioning reference, thereby calibrating the position and angle of the graphite ring itself.

[0023] Among them, the SiC epitaxial disassembly and assembly method also includes an installation box and a protective cover installed on the top of the installation box, the installation box is provided with a movable channel connected to the protective cover, the bottom end of the lifting mechanism is installed on the inner side of the installation box, the top of the lifting mechanism is penetrated through the movable channel, the disassembly and assembly drive mechanism is installed in the protective cover, the top of the protective cover is provided with a disassembly and assembly notch, and the lifting mechanism and the disassembly and assembly drive mechanism are both penetrated through the disassembly and assembly notch.

[0024] The disassembly and assembly driving mechanism comprises a disassembly and assembly X-axis module installed outside the installation box and located in the protective cover, a disassembly and assembly Y-axis module drivingly connected to the disassembly and assembly X-axis module, and a disassembly and assembly rotating unit drivingly connected to the disassembly and assembly Y-axis module. The disassembly and assembly X-axis module drives the disassembly and assembly Y-axis module to move along the X-axis, and the disassembly and assembly Y-axis module drives the disassembly and assembly rotating unit to move along the Y-axis. A rotating disk is connected to the bottom of the base frame, and the disassembly and assembly rotating unit is drivingly connected to the rotating disk so that the base frame rotates.

[0025] The rotating disk is provided with a rotating hole connected with the movable port, the disassembling and assembling rotating unit is connected by driving with the disassembling and assembling support frame and the disassembling and assembling Y-axis module, a clearance space with upper and lower ends passing through is formed between the disassembling and assembling support frame and the rotating unit, the output end of the lifting mechanism passes through the clearance space, the rotating hole and the movable port and is connected with the tray, and the clearance space, the rotating hole and the movable port are all provided with a movable gap for the chassis to move along the X-axis or the Y-axis.

[0026] The lifting mechanism comprises a lifting unit installed on the installation box, an auxiliary bracket connected to the installation end of the lifting unit, an extension bracket connected to the output end of the lifting unit, and an extension rod connected to the extension bracket, the extension rod is connected to the tray, the extension rod is inserted into the clearance space, the rotation hole and the movable opening, and the extension bracket is slidably connected to the auxiliary bracket;

[0027] When the pallet needs to be moved, the lifting unit drives the extension frame, the extension rod and the pallet to rise and fall synchronously, so that the pallet moves to the desired position;

[0028] The auxiliary bracket is provided with an auxiliary support portion. When the detachable X-axis module or the detachable Y-axis module drives the base frame to move along the X-axis or the Y-axis, the bottom surface of the detachable support frame abuts against the auxiliary support portion.

[0029] The deflection correction platform includes a deflection correction table, a deflection correction driving mechanism connected to the deflection correction table, a deflection correction annular light source and a deflection correction collector. The deflection correction driving mechanism is used to drive the deflection correction table to move along the X-axis and the Y-axis and to make the deflection correction table rotate. The deflection correction annular light source is located between the deflection correction table and the deflection correction collector. The deflection correction collector corresponds to the deflection correction annular light source. The deflection correction collector is provided with a third positioning reference. The deflection correction collector is electrically connected to the deflection correction driving mechanism.

[0030] When the graphite disk is edge-finding, the manipulator places the graphite disk on the deflection correction table, the deflection correction annular light source supplements the graphite disk, the deflection correction collector visually takes photos to determine the position and angle of the graphite disk, and the deflection correction drive mechanism drives the deflection correction table to move along the X-axis and / or the Y-axis according to the data obtained by the deflection correction collector, and makes the deflection correction table rotate, so that the graphite disk completes edge-finding and deflection correction according to the third positioning reference, thereby calibrating the position and angle of the graphite disk itself;

[0031] The deflection correction driving mechanism includes a deflection correction X-axis module, a deflection correction Y-axis module drivingly connected to the deflection correction X-axis module, and a deflection correction rotation unit drivingly connected to the deflection correction Y-axis module. The deflection correction X-axis module drives the deflection correction Y-axis module to move along the X-axis, and the deflection correction Y-axis module drives the deflection correction rotation unit to move along the Y-axis. The deflection correction rotation unit is drivingly connected to the deflection correction table, and the deflection correction rotation unit is used to drive the deflection correction table to rotate.

[0032] Wherein, the ring bracket is provided with a ring support opening, and when the ring bracket supports the graphite ring, the bottom outer edge of the graphite ring extends into the ring support opening;

[0033] The bottom frame is provided with a tray accommodating opening connected to the movable opening, the tray accommodating opening cooperates with the bottom of the tray, and when the lifting mechanism drives the tray to move downward to a desired position, the bottom of the tray extends into the tray accommodating opening.

[0034] Wherein, an annular disk accommodating groove is arranged at the bottom end of the graphite ring, and when the graphite disk and the graphite ring are combined, the top outer edge of the graphite disk extends into the disk accommodating groove.

[0035] Wherein, the top of the graphite ring is provided with an annular sheet accommodating groove, and when the wafer and the graphite ring are combined, the outer edge of the bottom end of the wafer extends into the sheet accommodating groove.

[0036] Beneficial effects of the present invention:

[0037] The present invention can quickly realize the merging and splitting actions between the graphite ring and the wafer or the graphite disk, improve the wafer positioning accuracy, can independently realize the edge finding and deviation correction of the wafer or the graphite disk, save the reference calibration time, reduce the equipment calculation complexity, smoothly realize the taking and placing between the merged wafer, graphite ring and graphite disk and the epitaxial growth environment, and ensure the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the three-dimensional structure of the SiC epitaxial disassembly and assembly method of the present invention.

[0039] Figure 2 This is a schematic diagram of the structure when the graphite ring and graphite disk are combined.

[0040] Figure 3 Schematic diagram of the exploded structure with wafer, graphite ring and graphite disk.

[0041] Figure 4 A three-dimensional diagram showing the graphite ring, graphite disk and merging and splitting mechanism separated.

[0042] Figure 5 Schematic diagram of the exploded structure of the chassis and pallet.

[0043] Figure 6 Schematic diagram of the positional relationship between the tray, graphite ring and ring bracket before the wafer and graphite ring are separated.

[0044] Figure 7 It is a schematic diagram of the three-dimensional structure of the disassembled edge-finding mechanism.

[0045] Figure 8 It is a schematic diagram of the explosion structure with an installation box, a protective cover, a lifting mechanism and a disassembly and assembly drive mechanism.

[0046] Fig. 9 An exploded view of the drive mechanism, tray and chassis.

[0047] Fig.10 It is a three-dimensional diagram of the installation structure of the rotating disk.

[0048] Fig.11 It is a three-dimensional diagram of the exploded structure with a pallet, a base frame, a detachable rotating unit and a detachable supporting frame.

[0049] Fig.12 It is a three-dimensional diagram of the exploded structure with a pallet, a base frame and a detachable support frame.

[0050] Fig.13 It is a schematic diagram of the connection structure between the lifting mechanism, the installation box and the pallet.

[0051] Fig.14 It is a schematic diagram of the three-dimensional structure of the correction platform.

[0052] Fig.15 This is an exploded view of the correction drive mechanism and the correction platform.

[0053] Fig.16 Exploded view of the ring bracket and graphite ring.

[0054] Fig.17 It is a three-dimensional diagram of the partial structure of the graphite ring and graphite disk.

[0055] Fig.18 Schematic diagram of the explosion structure of the wafer and graphite ring.

[0056] 01. Wafer; 02. Graphite ring;

[0057] 021, disk receiving slot; 022, sheet receiving slot;

[0058] 03. Graphite plate;

[0059] 100. Storage box; 200. Ring placing box; 300. Manipulator; 400. Edge finder; 1. Merging and splitting mechanism;

[0060] 11. bottom frame; 111. movable opening; 112. rotating plate; 1121. rotating hole;

[0061] 113. Pan receiving opening;

[0062] 12. Ring bracket; 121. Ring support opening;

[0063] 13. Pallet; 14. Lifting mechanism;

[0064] 141. lifting unit; 142. auxiliary bracket; 1421. auxiliary support part;

[0065] 143. extension frame; 144. extension rod;

[0066] 2. Correction platform;

[0067] 21. Deviation correction platform; 22. Deviation correction driving mechanism;

[0068] 221. Deflection correction X-axis module; 222. Deflection correction Y-axis module; 223. Deflection correction rotation unit; 23. Deflection correction ring light source; 24. Deflection correction collector.

[0069] 3. Disassemble and assemble the edge-finding mechanism;

[0070] 31. Disassemble and assemble the driving mechanism;

[0071] 311. Disassemble the X-axis module; 312. Disassemble the Y-axis module; 313. Disassemble the rotation unit;

[0072] 3130, dismantle and assemble the support frame; 3131, make room;

[0073] 32. Disassembled ring light source; 33. Surface light source; 34. Collection equipment;

[0074] 4. Installation box; 410. Activity channel;

[0075] 5. Protective cover; 51. Disassembly and assembly gap. DETAILED DESCRIPTION

[0076] To facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with examples and drawings. Specific implementation methods of the present invention will be described below. It should be pointed out that in the specific description of these implementation methods, in order to provide a concise description, this specification cannot provide a detailed description of all features of the actual implementation methods.

[0077] refer to Figures 1 to 18 As shown, the present invention provides a SiC epitaxial disassembly method, comprising the following steps:

[0078] S01, a disk ring placement box 200 for storing merged graphite rings 02 and graphite disks 03, a merging and splitting mechanism 1 for splitting or merging the graphite ring 02 and the wafer 01 or the graphite disk 03, and a correction platform 2 for edge finding and correction of the graphite disk 03 are provided. A manipulator 300 is used to grab the merged graphite ring 02 and the graphite disk 03 from the disk ring placement box 200 and put them into the merging and splitting mechanism 1, the merging and splitting mechanism 1 is used to split the graphite disk 03 and the graphite ring 02, and the manipulator 300 grabs the graphite disk 03 to the correction platform 2 for edge finding and correction; in actual application, the manipulator 300 is a four-axis robot, and the manipulator 300 is provided with a suction arm to facilitate the smooth grabbing or placement of the wafer 01, the graphite ring 02 or the graphite disk 03.

[0079] S02. An edge finder 400 for finding the edge of wafer 01 and a storage box 100 for storing wafer 01 are provided. The robot 300 grabs wafer 01 from the storage box 100 and puts it into the edge finder 400 to find the edge of wafer 01. The robot 300 puts the wafer 01 after edge finding into the merging and splitting mechanism 1, and the merging and splitting mechanism 1 merges wafer 01 and graphite ring 02.

[0080] S03, the robot 300 puts the graphite disk 03 after edge finding into the merging and splitting mechanism 1, the merging and splitting mechanism 1 merges the graphite disk 03 with the graphite ring 02, so as to merge the wafer 01, the graphite ring 02 and the graphite disk 03, and the robot 300 puts the merged wafer 01, the graphite ring 02 and the graphite disk 03 into the epitaxial growth environment.

[0081] S04, the robot 300 takes out the merged wafer 01, graphite ring 02 and graphite disk 03 from the epitaxial growth environment and puts them into the merging and splitting mechanism 1, the merging and splitting mechanism 1 separates the graphite disk 03 from the graphite ring 02, the robot 300 takes out the graphite disk 03 from the merging and splitting mechanism 1, the merging and splitting mechanism 1 separates the wafer 01 from the graphite ring 02, the robot 300 takes out the wafer 01 from the merging and splitting mechanism 1, the robot 300 puts the graphite disk 03 into the merging and splitting mechanism 1, the merging and splitting mechanism 1 merges the graphite disk 03 and the graphite ring 02, and the robot 300 takes out the merged graphite disk 03 and the graphite ring 02.

[0082] S05. In step S01, the correction platform 2 is provided with a third positioning reference, and the correction platform 2 completes the edge-finding correction of the graphite disk 03 according to the third positioning reference to determine the position and angle of the graphite disk 03; specifically, the third positioning reference has been determined during the debugging process of the correction platform 2, and after the correction platform 2 completes the edge-finding correction of the graphite disk 03, the edge-finding correction of the graphite disk 03 is completed, and the correction platform 2 does not transmit the position and angle information of the graphite disk 03 to the edge finder 400 or the manipulator 300. The robot 300 can complete the transfer of the graphite disk 03 by a fixed grabbing or placing action, and the correction platform 2 can independently complete the edge finding and correction of the graphite disk 03, saving a lot of reference calibration time between the robot 3, the edge finder 4 and the correction platform 7, reducing the calculation complexity of the equipment, and effectively improving the positioning efficiency of the wafer 01, making it easy to quickly complete the splitting action of the graphite disk 03 and the graphite ring 02. Similarly, it is also easy to quickly realize the merging action of the graphite ring 02 and the graphite disk 03, thereby improving the splitting and merging efficiency.

[0083] S06. In step S02, the edge finder 400 is provided with a first positioning reference, and the edge finder 400 completes the edge finding and deflection correction of the wafer 01 according to the first positioning reference to determine the position and angle of the wafer 01; specifically, the first positioning reference has been determined during the debugging process of the edge finder 400, and after the edge finder 400 completes the edge finding and deflection correction of the wafer 01, the edge finding of the wafer 01 is ended, and the edge finder 400 transmits the position and angle information of the wafer 01 to the deflection correction platform 2 or the manipulator 300, thereby saving a lot of reference calibration time between the manipulator 300, the edge finder 400 and the deflection correction platform 2, reducing the calculation complexity of the equipment, facilitating the rapid completion of the merging action of the graphite ring 02 and the wafer 01, and effectively improving the positioning efficiency of the wafer 01; similarly, it is also convenient to quickly realize the splitting action of the graphite ring 02 and the wafer 01.

[0084] S07. In steps S01 to S03: when the wafer 01, the graphite ring 02 and the graphite disk 03 are combined, the robot 300 grabs or places the graphite disk 03 to achieve the overall transfer of the wafer 01, the graphite ring 02 and the graphite disk 03; when the graphite ring 02 and the graphite disk 03 are combined, the robot 300 grabs or places the graphite disk 03 to achieve the overall transfer of the graphite ring 02 and the graphite disk 03, which is convenient for the fast and stable transfer of the wafer 01, the graphite ring 02 or the graphite disk 03.

[0085] S08. When it is necessary to separate or merge the graphite ring 02 and the wafer 01 or the graphite disk 03 again, repeat steps S01 to S07.

[0086] refer to Figures 1 to 3As shown, therefore, the present application can quickly realize the merging and splitting actions between the graphite ring 02 and the wafer 01 or the graphite disk 03, improve the positioning accuracy of the wafer 01, can independently realize the edge finding and deviation correction of the wafer 01 or the graphite disk 03, save the reference calibration time, reduce the calculation complexity of the equipment, and smoothly realize the taking and placing between the merged wafer 01, graphite ring 02 and graphite disk 03 and the epitaxial growth environment, thereby ensuring the positioning accuracy of the wafer 01 and the processing quality.

[0087] refer to Figure 4 , 5 As shown, in this embodiment, the merging and splitting mechanism 1 includes a base frame 11, a plurality of ring brackets 12 connected to the top of the base frame 11, a tray 13 and a lifting mechanism 14, the ring brackets 12 are distributed around the base frame 11, the lifting mechanism 14 is drivingly connected to the tray 13, the base frame 11 is penetrated by a movable opening 111 from top to bottom, the output end of the lifting mechanism 14 is penetrated by the movable opening 111, and the lifting mechanism 14 drives the tray 13 to move up and down, so that the tray 13 moves up and down inside the ring bracket 12.

[0088] refer to Figure 6 As shown, when the graphite ring 02 and the graphite disk 03 need to be separated, the lifting mechanism 14 drives the tray 13 to move upward to the required height, the manipulator 300 grabs the merged graphite ring 02 and graphite disk 03 and puts them into the merging and splitting mechanism 1, and the graphite ring 02 and the graphite disk 03 are supported by the ring bracket 12 and the tray 13 respectively, and the lifting mechanism 14 drives the tray 13 to move downward, so that the graphite disk 03 moves downward synchronously with the tray 13 to be separated from the graphite ring 02, so as to quickly separate the graphite ring 02 from the graphite disk 03.

[0089] refer to Figure 5 As shown, in actual application, when it is necessary to separate the wafer 01 and the graphite ring 02, after the graphite disk 03 is separated from the graphite ring 02, the robot 300 moves the graphite disk 03 out of the merging and splitting mechanism 1, and the lifting mechanism 14 drives the tray 13 to move upward inside the graphite ring 02, and the tray 13 pushes the wafer 01 upward away from the graphite ring 02, so that the wafer 01 is separated from the graphite ring 02; refer to Figure 5 , 6 As shown, therefore, after the graphite disk 03 is separated from the graphite ring 02 and the graphite disk 03 is moved out of the merging and splitting mechanism 1, the wafer 01 can be separated from the graphite ring 02 by directly driving the tray 13 upward through the lifting mechanism 14, so that the robot 300 can quickly grab the wafer 01 separated from the merging and splitting mechanism 1.

[0090] When it is necessary to merge the graphite ring 02 and the graphite disk 03, the ring bracket 12 supports the graphite ring 02, and the lifting mechanism 14 drives the tray 13 to move upward to the required height inside the graphite ring 02. The manipulator 300 places the wafer 01 into the tray 13, and the lifting mechanism 14 drives the tray 13 to descend so that the wafer 01 is supported by the graphite ring 02, so that the wafer 01 and the graphite ring 02 are merged. Then the lifting mechanism 14 drives the tray 13 to continue to descend to the required height, and the manipulator 300 places the graphite disk 03 after edge finding is completed on the tray 13, and the lifting mechanism 14 drives the tray 13 and the graphite disk 03 to move upward to the required position, so that the wafer 01, the graphite ring 02 and the graphite disk 03 are merged. After the graphite ring 02 is merged with the wafer 01, the graphite ring 02 and the graphite disk 03 can be quickly merged, thereby improving the processing efficiency.

[0091] refer to Figure 1 , 7 As shown, in this embodiment, the SiC epitaxial disassembly and assembly method also includes a disassembly and edge-finding mechanism 3, which includes a disassembly and edge-finding mechanism 31, a disassembly and edge-finding mechanism 32, a surface light source 33 and a collection device 34 driven and connected to the base frame 11. The disassembly and assembly driving mechanism 31 is used to drive the base frame 11 to move along the X-axis and the Y-axis, and to make the base frame 11 rotate. The disassembly and assembly ring light source 32 is located between the base frame 11 and the surface light source 33. The front end of the collection device 34 passes through the surface light source 33 and corresponds to the disassembly and assembly ring light source 32. The collection device 34 is provided with a second positioning reference, and the collection device 34 is electrically connected to the disassembly and assembly driving mechanism 31.

[0092] In actual application, when the graphite ring 02 is edge-finding, the ring bracket 12 supports the graphite ring 02, the surface light source 33 and the detachable annular light source 32 provide supplementary light to the graphite ring 02 and the acquisition device 34, the acquisition device 34 visually photographs to determine the position and angle of the graphite ring 02, and the detachable driving mechanism 31 drives the base frame 11 to move along the X-axis and / or the Y-axis according to the data obtained by the acquisition device 34, and makes the base frame 11 rotate, so that the graphite ring 02 completes the edge-finding and deviation correction according to the second positioning reference, thereby calibrating the position and angle of the graphite ring 02 itself; specifically, the second positioning reference has been determined during the debugging process of the detachable edge-finding mechanism 3, and the detachable edge-finding mechanism 3 is for the graphite ring 02. After ring 02 completes edge finding and deflection correction, the edge finding of graphite ring 02 is ended, and the disassembled edge finding mechanism 3 does not transmit the position and angle information of graphite ring 02 to the edge finder 400, deflection correction platform 2 or manipulator 300. Manipulator 300 can complete the transfer of graphite ring 02 by fixed grasping or placing action, so that the edge finder 400, the disassembled edge finding mechanism 3 and the deflection correction platform 2 can independently complete the edge finding and deflection correction of wafer 01, graphite ring 02 and graphite disk 03 respectively, saving a lot of reference calibration time between manipulator 300, edge finder 400, deflection correction platform 2 and disassembled edge finding mechanism 3, reducing the calculation complexity of equipment, and effectively improving the positioning accuracy of graphite ring 02.

[0093] refer to Figure 8 As shown, in this embodiment, the SiC epitaxial disassembly and assembly method further includes an installation box 4 and a protective cover 5 installed on the top of the installation box 4, the installation box 4 is provided with an active channel 410 connected to the protective cover 5, the bottom end of the lifting mechanism 14 is installed on the inner side of the installation box 4, the top end of the lifting mechanism 14 is penetrated through the active channel 410, the disassembly and assembly driving mechanism 31 is installed in the protective cover 5, the installation box 4 and the protective cover 5 respectively cover the lifting mechanism 14 and the disassembly and assembly driving mechanism 31, effectively protecting the lifting mechanism 14 and the disassembly and assembly driving mechanism 31, and , so that the installation surfaces of the lifting mechanism 14 and the disassembling drive mechanism 31 have a height difference, that is, the travel arrangement of the tray 13 is met, and the disassembling drive mechanism 31 is installed near the middle of the lifting mechanism 14, so that the structural arrangement is compact and the space occupancy is reduced; a disassembling notch 51 is provided at the top of the protective cover 5, and the lifting mechanism 14 and the disassembling drive mechanism 31 are both penetrated in the disassembling notch 51, which is convenient for the normal use of the lifting mechanism 14 and the disassembling drive mechanism 31, and the installation and disassembly of the lifting mechanism 14 and the disassembling drive mechanism 31 do not affect each other, and the installation is convenient.

[0094] refer to Fig. 9As shown, in this embodiment, the disassembly and assembly driving mechanism 31 includes a disassembly and assembly X-axis module 311 installed on the outside of the installation box 4 and located in the protective cover 5, a disassembly and assembly Y-axis module 312 drivingly connected to the disassembly and assembly X-axis module 311, and a disassembly and assembly rotating unit 313 drivingly connected to the disassembly and assembly Y-axis module 312. The disassembly and assembly X-axis module 311 drives the disassembly and assembly Y-axis module 312 to move along the X-axis, and the disassembly and assembly Y-axis module 312 drives the disassembly and assembly rotating unit 313 to move along the Y-axis. The bottom of the base frame 11 is connected to a rotating disk 112, and the disassembly and assembly rotating unit 313 is drivingly connected to the rotating disk 112 so that the base frame 11 rotates; the rotating disk 112 is provided with a rotating hole 1121 connected to the movable port 111, and the disassembly and assembly rotating unit 313 adopts a disassembly and assembly support frame 3130 to drive and connect with the disassembly and assembly Y-axis module 312, refer to Fig.11 , 12 As shown, a clearance space 3131 penetrating through the upper and lower ends is formed between the disassembly support frame 3130 and the rotating unit 313, and the output end of the lifting mechanism 14 is connected to the tray 13 after passing through the clearance space 3131, the rotating hole 1121 and the movable opening 111. The clearance space 3131, the rotating hole 1121 and the movable opening 111 are all provided with a movable gap for the base frame 11 to move along the X-axis or Y-axis.

[0095] In actual application, the disassembling X-axis module 311 and the disassembling Y-axis module 312 are linear motors, oil cylinders or electric cylinders, and the disassembling rotating unit 313 adopts a rotary cylinder. By disassembling the X-axis module 311, the disassembling Y-axis module 312 and the disassembling rotating unit 313, the X-axis and / or Y-axis movement of the base frame 11 and the self-rotation of the base frame 11 are realized. The set clearance space 3131, the rotating hole 1121 and the movable opening 111 facilitate the normal operation of the jacking mechanism 14, and also provide the movable space required when the disassembling driving mechanism 31 drives the base frame 11, so that the corresponding transmission structure of the output end of the jacking mechanism 14 can be smoothly inserted into the disassembling driving mechanism 31, ensuring that the jacking mechanism 14 can stably drive the tray 13 to move, and the structural arrangement is compact, reducing space occupancy.

[0096] refer to Fig.13 As shown, in this embodiment, the lifting mechanism 14 includes a lifting unit 141 installed on the installation box 4, an auxiliary bracket 142 connected to the installation end of the lifting unit 141, an extension frame 143 connected to the output end of the lifting unit 141 and an extension rod 144 connected to the extension frame 143, the extension rod 144 is connected to the tray 13, the extension rod 144 is inserted into the make way space 3131, the rotating hole 1121 and the movable opening 111, and the extension frame 143 is slidably connected to the auxiliary bracket 142.

[0097] In actual application, the lifting unit 141 adopts an oil cylinder or an electric cylinder. When it is necessary to move the tray 13, the lifting unit 141 drives the extension frame 143, the extension rod 144 and the tray 13 to rise and fall synchronously, so that the tray 13 is moved to the desired position, so as to quickly realize the merging or splitting of the graphite ring 02 and the wafer 01 or the graphite disk 03; the connection distance between the lifting unit 141 and the tray 13 is extended by the extension frame 143 and the extension rod 144, which is conducive to installing the extension rod 144 in the narrow clearance space 3131, the rotating hole 1121 and the movable opening 111, so as to facilitate the stable connection of the tray 13, and stably support the extension frame 143 through the auxiliary bracket 142, and facilitate the extension frame 143 to stably slide on the auxiliary bracket 142, thereby improving the structural stability.

[0098] refer to Fig.13 As shown, the auxiliary bracket 142 is provided with an auxiliary support portion 1421. When the disassembling X-axis module 311 or the disassembling Y-axis module 312 drives the base frame 11 to move along the X-axis or Y-axis, the bottom surface of the disassembling support frame 3130 abuts against the auxiliary support portion 1421. The auxiliary support portion 1421 can stably support the disassembling X-axis module 311 and the disassembling Y-axis module 312, which is beneficial to the stable and normal use of the disassembling X-axis module 311 and the disassembling Y-axis module 312.

[0099] refer to Fig.14 , 15 As shown, in this embodiment, the deflection correction platform 2 includes a deflection correction table 21, a deflection correction driving mechanism 22 driven and connected to the deflection correction table 21, a deflection correction ring light source 23 and a deflection correction collector 24, the deflection correction driving mechanism 22 is used to drive the deflection correction table 21 to move along the X-axis and the Y-axis, and to make the deflection correction table 21 rotate, the deflection correction ring light source 23 is located between the deflection correction table 21 and the deflection correction collector 24, the deflection correction collector 24 corresponds to the deflection correction ring light source 23, the deflection correction collector 24 is provided with a third positioning reference, the deflection correction collector 24 and the deflection correction driving mechanism 22 are connected to the deflection correction table 21, and the deflection correction driving mechanism 22 is used to drive the deflection correction table 21 to move along the X-axis and the Y-axis, and to make the deflection correction table 21 rotate, the deflection correction ring light source 23 is located between the deflection correction table 21 and the deflection correction collector 24, the deflection correction collector 24 corresponds to the deflection correction ring light source 23, the deflection correction collector 24 is provided with a third positioning reference, the deflection correction collector 24 and the deflection correction driving mechanism 22 are connected to the deflection correction driving mechanism 22, the deflection correction driving mechanism 22 is used to drive the deflection correction table 21 to move along the X-axis and the Y-axis, and to make the deflection correction table 21 rotate, the deflection correction ring light source 23 is located between the deflection correction table 21 and the deflection correction collector 24, the deflection correction collector 24 corresponds to the deflection correction ring light source 23, the deflection correction collector 24 is provided with a third positioning reference Electrical connection; in actual application, when the graphite disk 03 is finding its edge, the manipulator 300 places the graphite disk 03 on the deflection correction table 21, and the deflection correction ring light source 23 provides supplementary light for the graphite disk 03. The deflection correction collector 24 takes visual photos to determine the position and angle of the graphite disk 03. The deflection correction drive mechanism 22 drives the deflection correction table 21 to move along the X-axis and / or Y-axis according to the data obtained by the deflection correction collector 24, and makes the deflection correction table 21 rotate, so that the graphite disk 03 completes the edge finding and deflection correction according to the third positioning reference, thereby calibrating the position and angle of the graphite disk 03 itself.

[0100] The deflection correction driving mechanism 22 includes a deflection correction X-axis module 221, a deflection correction Y-axis module 222 drivingly connected to the deflection correction X-axis module 221, and a deflection correction rotation unit 223 drivingly connected to the deflection correction Y-axis module 222. The deflection correction X-axis module 221 and the deflection correction Y-axis module 222 are linear motors, oil cylinders or electric cylinders, and the deflection correction rotation unit 223 is a servo motor, a rotary cylinder or a driving motor. The deflection correction X-axis module 221 drives the deflection correction Y-axis module 222 to move along the X-axis, and the deflection correction Y-axis module 222 drives the deflection correction rotation unit 223 to move along the Y-axis. The deflection correction rotation unit 223 is drivingly connected to the deflection correction table 21, and the deflection correction rotation unit 223 is used to drive the deflection correction table 21 to rotate, so as to meet the movement of the deflection correction table 21 along the X-axis and / or the Y-axis, and the rotation of the deflection correction table 21.

[0101] refer to Fig.16 As shown, in this embodiment, the ring bracket 12 is provided with a ring supporting opening 121. When the ring bracket 12 supports the graphite ring 02, the bottom outer edge of the graphite ring 02 extends into the ring supporting opening 121. The graphite ring 02 is supported by the ring supporting opening 121, which facilitates accurate positioning of the graphite ring 02.

[0102] refer to Figure 5 , 16 As shown, the base frame 11 is provided with a tray accommodating opening 113 connected to the movable opening 111, and the tray accommodating opening 113 cooperates with the bottom of the tray 13; in actual application, when the jacking mechanism 14 is not needed, the tray 13 can be driven downward to the desired position by the jacking mechanism 14, and the bottom of the tray 13 is extended into the tray accommodating opening 113, so that the structure is compact, the tray 13 can be accurately positioned, and it is also convenient to stably support the tray 13, improve the connection stability of the tray 13, and also convenient to close the jacking mechanism 14, which is beneficial to extend the service life of the jacking mechanism 14.

[0103] refer to Fig.17 As shown, in this embodiment, an annular disk accommodating groove 021 is provided at the bottom end of the graphite ring 02. When the graphite disk 03 is combined with the graphite ring 02, the top outer edge of the graphite disk 03 extends into the disk accommodating groove 021, so that part of the graphite disk 03 is hidden in the graphite ring 02. The structure is compact, space is saved, and the graphite disk 03 is accurately positioned in the graphite ring 02.

[0104] refer to Fig.18 As shown, in this embodiment, an annular sheet accommodating groove 022 is provided at the top of the graphite ring 02. When the wafer 01 and the graphite ring 02 are combined, the bottom outer edge of the wafer 01 extends into the sheet accommodating groove 022, so that part of the wafer 01 is hidden in the graphite ring 02. The structure is compact, space is saved, and it is beneficial to accurately position the wafer 01 in the graphite ring 02.

[0105] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A SiC epitaxial disassembly method, characterized in that: The following steps are involved: S01, a disk-ring placement box (200) for storing the merged graphite rings (02) and graphite disks (03), a merging and splitting mechanism (1) for splitting or merging the graphite rings (02) and wafers (01) or graphite disks (03), and a correction platform (2) for performing edge finding and deviation correction on the graphite disks (03) are provided, a manipulator (300) is used to grab the merged graphite rings (02) and graphite disks (03) from the disk-ring placement box (200) and put them into the merging and splitting mechanism (1), the merging and splitting mechanism (1) is used to split the graphite disks (03) and the graphite rings (02), and the manipulator (300) grabs the graphite disks (03) to the correction platform (2) for edge finding and deviation correction; S02, an edge finder (400) for finding the edge of a wafer (01) and a storage box (100) for storing the wafer (01) are provided, the robot (300) grabs the wafer (01) from the storage box (100) and puts it into the edge finder (400) to find the edge of the wafer (01), the robot (300) puts the wafer (01) after edge finding into the merging and splitting mechanism (1), and the merging and splitting mechanism (1) merges the wafer (01) and the graphite ring (02); S03, the robot (300) places the graphite disk (03) after edge finding into the merging and splitting mechanism (1), the merging and splitting mechanism (1) merges the graphite disk (03) with the graphite ring (02), so as to merge the wafer (01), the graphite ring (02) and the graphite disk (03), and the robot (300) places the merged wafer (01), the graphite ring (02) and the graphite disk (03) into an epitaxial growth environment; S04, the robot (300) takes out the merged wafer (01), graphite ring (02) and graphite disk (03) from the epitaxial growth environment and puts them into the merging and splitting mechanism (1), the merging and splitting mechanism (1) separates the graphite disk (03) from the graphite ring (02), the robot (300) takes out the graphite disk (03) from the merging and splitting mechanism (1), the merging and splitting mechanism (1) separates the wafer (01) from the graphite ring (02), the robot (300) takes out the wafer (01) from the merging and splitting mechanism (1), the robot (300) puts the graphite disk (03) into the merging and splitting mechanism (1), the merging and splitting mechanism (1) merges the graphite disk (03) and the graphite ring (02), and the robot (300) takes out the merged graphite disk (03) and the graphite ring (02); S05. In step S01, the correction platform (2) is provided with a third positioning reference, and the correction platform (2) completes edge finding and correction of the graphite disk (03) according to the third positioning reference to determine the position and angle of the graphite disk (03); S06. In step S02, the edge finder (400) is provided with a first positioning reference, and the edge finder (400) completes edge finding and deviation correction of the wafer (01) according to the first positioning reference to determine the position and angle of the wafer (01); S07. In steps S01 to S03: When the wafer (01), the graphite ring (02) and the graphite disk (03) are combined, the robot (300) grabs or places the graphite disk (03) to achieve the overall transfer of the wafer (01), the graphite ring (02) and the graphite disk (03); When the graphite ring (02) and the graphite disk (03) are combined, the manipulator (300) grabs or places the graphite disk (03) to achieve the overall transfer of the graphite ring (02) and the graphite disk (03); S08. When it is necessary to separate or merge the graphite ring (02) and the wafer (01) or the graphite disk (03) again, steps S01 to S07 are repeated.

2. The SiC epitaxial disassembly method according to claim 1, characterized in that: The merging and splitting mechanism (1) comprises a base frame (11), a plurality of ring brackets (12) connected to the top of the base frame (11), a tray (13) and a lifting mechanism (14); the ring brackets (12) are distributed around the base frame (11); the lifting mechanism (14) is drivingly connected to the tray (13); a movable opening (111) is passed through the base frame (11) from top to bottom; an output end of the lifting mechanism (14) is passed through the movable opening (111); the lifting mechanism (14) drives the tray (13) to move up and down, so that the tray (13) moves up and down inside the ring bracket (12); When the graphite ring (02) and the graphite disk (03) need to be separated, the lifting mechanism (14) drives the tray (13) to move upward to a required height, the manipulator (300) grabs the merged graphite ring (02) and the graphite disk (03) and puts them into the merging and splitting mechanism (1), the ring bracket (12) and the tray (13) respectively support the graphite ring (02) and the graphite disk (03), and the lifting mechanism (14) drives the tray (13) to move downward, so that the graphite disk (03) moves downward synchronously with the tray (13) and is separated from the graphite ring (02); When the wafer (01) and the graphite ring (02) need to be separated, after the graphite disk (03) is separated from the graphite ring (02), the robot (300) moves the graphite disk (03) out of the merging and splitting mechanism (1), and the lifting mechanism (14) drives the tray (13) to move upward inside the graphite ring (02), and the tray (13) pushes the wafer (01) upward away from the graphite ring (02), so that the wafer (01) is separated from the graphite ring (02); When the graphite ring (02) and the graphite disk (03) need to be merged, the ring bracket (12) supports the graphite ring (02), the lifting mechanism (14) drives the tray (13) to move upward to a desired height inside the graphite ring (02), the robot (300) places the wafer (01) into the tray (13), the lifting mechanism (14) drives the tray (13) to descend so that the wafer (01) is supported by the graphite ring (02), and the wafer (01) and the graphite ring (02) are merged, then the lifting mechanism (14) drives the tray (13) to continue to descend to a desired height, the robot (300) places the graphite disk (03) after edge finding is completed on the tray (13), the lifting mechanism (14) drives the tray (13) and the graphite disk (03) to move upward to a desired position, and the wafer (01), the graphite ring (02) and the graphite disk (03) are merged.

3. The SiC epitaxial disassembly method according to claim 2, characterized in that: The SiC epitaxial disassembly and assembly method further comprises a disassembly and assembly edge-finding mechanism (3), wherein the disassembly and assembly edge-finding mechanism (3) comprises a disassembly and assembly driving mechanism (31) connected to the base frame (11), a disassembly and assembly ring light source (32), a surface light source (33) and a collection device (34), wherein the disassembly and assembly driving mechanism (31) is used to drive the base frame (11) to move along the X-axis and the Y-axis and to make the base frame (11) rotate, the disassembly and assembly ring light source (32) is located between the base frame (11) and the surface light source (33), the front end of the collection device (34) passes through the surface light source (33) and corresponds to the disassembly and assembly ring light source (32), the collection device (34) is provided with a second positioning reference, and the collection device (34) is electrically connected to the disassembly and assembly driving mechanism (31); When the graphite ring (02) is edge-finding, the ring bracket (12) supports the graphite ring (02), the surface light source (33) and the detachable annular light source (32) provide supplementary light for the graphite ring (02) and the collection device (34), the collection device (34) visually photographs to determine the position and angle of the graphite ring (02), and the detachable driving mechanism (31) drives the base frame (11) to move along the X-axis and / or the Y-axis according to the data obtained by the collection device (34), and causes the base frame (11) to rotate, so that the graphite ring (02) completes edge-finding and deviation correction according to the second positioning reference, thereby calibrating the position and angle of the graphite ring (02) itself.

4. The SiC epitaxial disassembly method according to claim 3, characterized in that: The SiC epitaxial disassembly and assembly method further comprises an installation box (4) and a protective cover (5) installed on the top of the installation box (4); the installation box (4) is provided with a movable channel (410) connected to the protective cover (5); the bottom end of the lifting mechanism (14) is installed on the inner side of the installation box (4); the top end of the lifting mechanism (14) is penetrated through the movable channel (410); the disassembly and assembly drive mechanism (31) is installed in the protective cover (5); the top end of the protective cover (5) is provided with a disassembly and assembly notch (51); and the lifting mechanism (14) and the disassembly and assembly drive mechanism (31) are both penetrated through the disassembly and assembly notch (51).

5. The SiC epitaxial disassembly method according to claim 4, characterized in that: The disassembly and assembly driving mechanism (31) comprises a disassembly and assembly X-axis module (311) installed outside the installation box (4) and located inside the protective cover (5), a disassembly and assembly Y-axis module (312) drivingly connected to the disassembly and assembly X-axis module (311), and a disassembly and assembly rotating unit (313) drivingly connected to the disassembly and assembly Y-axis module (312); the disassembly and assembly X-axis module (311) drives the disassembly and assembly Y-axis module (312) to move along the X-axis, and the disassembly and assembly Y-axis module (312) drives the disassembly and assembly rotating unit (313) to move along the Y-axis; a rotating disk (112) is connected to the bottom of the base frame (11); and the disassembly and assembly rotating unit (313) is drivingly connected to the rotating disk (112) so that the base frame (11) rotates. The rotating disk (112) is provided with a rotating hole (1121) connected to the movable opening (111); the disassembling and assembling rotating unit (313) is connected to the disassembling and assembling Y-axis module (312) by driving through a disassembling and assembling support frame (3130); a clearance space (3131) passing through the upper and lower ends is formed between the disassembling and assembling support frame (3130) and the rotating unit (313); the output end of the lifting mechanism (14) passes through the clearance space (3131), the rotating hole (1121) and the movable opening (111) and is connected to the tray (13); the clearance space (3131), the rotating hole (1121) and the movable opening (111) are all provided with a movable gap for the bottom frame (11) to move along the X-axis or the Y-axis.

6. The SiC epitaxial disassembly method according to claim 5, characterized in that: The lifting mechanism (14) comprises a lifting unit (141) installed on the installation box (4), an auxiliary bracket (142) connected to the installation end of the lifting unit (141), an extension bracket (143) connected to the output end of the lifting unit (141), and an extension rod (144) connected to the extension bracket (143), wherein the extension rod (144) is connected to the tray (13), the extension rod (144) is inserted into the clearance space (3131), the rotating hole (1121) and the movable opening (111), and the extension bracket (143) is slidably connected to the auxiliary bracket (142); When the tray (13) needs to be moved, the lifting unit (141) drives the extension frame (143), the extension rod (144) and the tray (13) to rise and fall synchronously, so that the tray (13) moves to a desired position; The auxiliary bracket (142) is provided with an auxiliary support portion (1421). When the disassembling X-axis module (311) or the disassembling Y-axis module (312) drives the base frame (11) to move along the X-axis or the Y-axis, the bottom surface of the disassembling support frame (3130) abuts against the auxiliary support portion (1421).

7. The SiC epitaxial disassembly method according to claim 1, characterized in that: The deflection correction platform (2) comprises a deflection correction platform (21), a deflection correction driving mechanism (22) connected to the deflection correction platform (21), a deflection correction annular light source (23) and a deflection correction collector (24); the deflection correction driving mechanism (22) is used to drive the deflection correction platform (21) to move along the X-axis and the Y-axis and to make the deflection correction platform (21) rotate; the deflection correction annular light source (23) is located between the deflection correction platform (21) and the deflection correction collector (24); the deflection correction collector (24) corresponds to the deflection correction annular light source (23); the deflection correction collector (24) is provided with a third positioning reference; and the deflection correction collector (24) is electrically connected to the deflection correction driving mechanism (22); When the graphite disk (03) is edge-finding, the manipulator (300) places the graphite disk (03) on the deflection correction table (21), the deflection correction annular light source (23) supplements the graphite disk (03), the deflection correction collector (24) visually photographs to determine the position and angle of the graphite disk (03), and the deflection correction drive mechanism (22) drives the deflection correction table (21) to move along the X-axis and / or the Y-axis according to the data obtained by the deflection correction collector (24), and causes the deflection correction table (21) to rotate, so that the graphite disk (03) completes edge-finding and deflection correction according to the third positioning reference, thereby calibrating the position and angle of the graphite disk (03) itself; The deflection correction driving mechanism (22) comprises a deflection correction X-axis module (221), a deflection correction Y-axis module (222) drivingly connected to the deflection correction X-axis module (221), and a deflection correction rotation unit (223) drivingly connected to the deflection correction Y-axis module (222); the deflection correction X-axis module (221) drives the deflection correction Y-axis module (222) to move along the X-axis; the deflection correction Y-axis module (222) drives the deflection correction rotation unit (223) to move along the Y-axis; the deflection correction rotation unit (223) is drivingly connected to the deflection correction platform (21); and the deflection correction rotation unit (223) is used to drive the deflection correction platform (21) to rotate.

8. The SiC epitaxial disassembly method according to claim 2, characterized in that: The ring bracket (12) is provided with a ring supporting opening (121), and when the ring bracket (12) supports the graphite ring (02), the bottom outer edge of the graphite ring (02) extends into the ring supporting opening (121); The base frame (11) is provided with a tray accommodating opening (113) connected to the movable opening (111); the tray accommodating opening (113) cooperates with the bottom of the tray (13); when the lifting mechanism (14) drives the tray (13) to move downward to a desired position, the bottom of the tray (13) extends into the tray accommodating opening (113).

9. The SiC epitaxial decomposition method according to claim 1, characterized in that: The bottom end of the graphite ring (02) is provided with an annular disk accommodating groove (021), and when the graphite disk (03) and the graphite ring (02) are combined, the top outer edge of the graphite disk (03) extends into the disk accommodating groove (021).

10. The SiC epitaxial decomposition method according to claim 1, characterized in that: The top of the graphite ring (02) is provided with an annular sheet accommodating groove (022), and when the wafer (01) and the graphite ring (02) are combined, the outer edge of the bottom end of the wafer (01) extends into the sheet accommodating groove (022).

Images