Converter module, converter and charging pile

Abstract

The invention discloses a converter module, a converter and a charging pile, and relates to the technical field of converters. The converter module comprises an installation frame, a radiator, an IGBT component, a capacitor assembly, a first low-inductance busbar and a second low-inductance busbar. The radiator is arranged in the mounting frame; the IGBT component is arranged on the radiator; the capacitor assembly is arranged in the mounting frame; the first low-inductance busbar is stacked above the IGBT component and is electrically connected with the IGBT component; the second low-inductance busbar is at least partially stacked above the first low-inductance busbar, and the second low-inductance busbar is electrically connected with the IGBT component and the capacitor assembly. The first low-inductance busbar and the second low-inductance busbar are at least partially overlapped, electromagnetic fields of the positive busbar and the negative busbar of the overlapped part are mutually counteracted, and stray inductance is further reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of converters, and more specifically, to a converter module. In addition, the present invention also relates to a converter including the converter module and a charging pile including the converter. Background Art

[0002] In recent years, with the development of new energy electric vehicles, DCDC (direct current-to-direct current) converters have been widely used in the field of new energy electric vehicles and energy storage tram charging systems, and the requirements for charging system capacity and voltage levels are becoming increasingly higher.

[0003] The traditional two-level circuit topology has simple control, is limited by the voltage stress of the IGBT (Insulate-Gate Bipolar Transistor) device, has a low switching frequency, a large output ripple current, and a large filter inductor volume.

[0004] The current converter modules have a low degree of modularization, unreasonable component layout and connection methods, and high stray inductance. The converter stray inductance will cause a high voltage spike between the collector and emitter of the IGBT, resulting in greater electromagnetic interference and even damage to the insulated gate bipolar transistor (IGBT).

[0005] In summary, how to reduce the stray inductance of the converter module is a problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0006] In view of this, an object of the present invention is to provide a converter module, in which a first low-inductance busbar and a second low-inductance busbar are stacked to effectively reduce stray inductance.

[0007] Another object of the present invention is to provide a converter and a charging pile including the above converter module.

[0008] In order to achieve the above object, the present invention provides the following technical solutions:

[0009] A converter module, comprising:

[0010] Mounting frame;

[0011] A radiator is arranged in the installation frame;

[0012] IGBT components are arranged on the heat sink;

[0013] A capacitor assembly is arranged in the installation frame;

[0014] A first low-inductance busbar is stacked above the IGBT component and is electrically connected to the IGBT component;

[0015] The second low-inductance busbar is at least partially stacked above or below the first low-inductance busbar, and the second low-inductance busbar is electrically connected to the IGBT component and the capacitor assembly.

[0016] Optionally, the second low-sensitivity busbar completely covers the first low-sensitivity busbar.

[0017] Optionally, the capacitor assembly is arranged on one side of the IGBT component, and the first low-inductance busbar is only stacked above the IGBT component.

[0018] Optionally, the capacitor component includes a plurality of flying capacitors, and the plurality of flying capacitors are distributed in a matrix.

[0019] Optionally, the second low-inductance busbar includes a first portion stacked on top of the first low-inductance busbar, and a second portion stacked on top of the capacitor assembly, and the first portion and the second portion are an integrated structure.

[0020] Optionally, a bend is provided at a connection between the first portion and the second portion, and the bend faces the capacitor component.

[0021] Optionally, a plurality of temperature relays are provided on the surface of the radiator, and the temperature relays are used to monitor the surface temperature of the radiator. When the surface temperature of the radiator is greater than or equal to a preset value of the temperature relay, the temperature relay outputs a temperature alarm signal.

[0022] Optionally, at least two of the IGBT components are arranged at intervals on the surface of the heat sink, and the temperature relay is arranged in the gap between adjacent IGBT components.

[0023] Optionally, a surface of the temperature relay that is in contact with the heat sink is provided with a thermally conductive coating.

[0024] Optionally, a temperature sensor is provided in the IGBT component, and a driving assembly is provided above the second low-sensitivity busbar, the driving assembly includes a gate adapter board and a gate driver, the gate driver is electrically connected to the gate adapter board, the gate adapter board is electrically connected to the temperature sensor in the IGBT component and obtains the temperature information measured by the temperature sensor, and the gate driver is used to transmit the temperature information transmitted by the gate adapter board to the outside.

[0025] Optionally, the installation frame is provided with an air inlet, and the capacitor assembly is located at the air inlet.

[0026] Optionally, there are multiple air inlets, and the capacitor assembly is completely covered by the air inlets.

[0027] Optionally, the installation frame is provided with an external communication interface for connecting to an external signal.

[0028] A converter comprises the converter module described in any one of the above items.

[0029] A charging pile comprises the above-mentioned converter.

[0030] In the process of using the converter module provided by the present invention, the first low-inductance busbar is electrically connected to the IGBT component (Insulate-Gate Bipolar Transistor), and the second low-inductance busbar is electrically connected to the IGBT component and the capacitor assembly. Compared with directly electrically connecting the IGBT component and the capacitor assembly through the circuit, the circuit layout can be more optimized and the stray inductance can be reduced. In addition, in the present invention, the first low-inductance busbar and the second low-inductance busbar are at least partially overlapped, and the electromagnetic fields of the overlapped positive and negative rows cancel each other out, thereby further reducing the stray inductance.

[0031] In addition, the present invention also provides a converter and a charging pile including the above converter module. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0033] Figure 1 It is a schematic diagram of the front structure and IGBT layout of the converter module provided by the present invention;

[0034] Figure 2 An exploded schematic diagram of a partial structure of a converter module provided by the present invention;

[0035] Figure 3 This is a schematic side view of the converter module provided by the present invention.

[0036] Figure 1-Figure 3 middle:

[0037] 1 is the installation frame, 2 is the heat sink, 3 is the IGBT component, 4 is the capacitor assembly, 5 is the second low-inductance busbar, 6 is the first low-inductance busbar, 7 is the drive assembly, and 8 is the external communication interface. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] The core of the present invention is to provide a converter module, in which a first low-inductance busbar and a second low-inductance busbar are stacked to effectively reduce stray inductance.

[0040] Another core of the present invention is to provide a converter and a charging pile including the above converter module.

[0041] Please refer to Figures 1 to 3 .

[0042] The present specific embodiment discloses a converter module, comprising: a mounting frame 1, a heat sink 2, an IGBT component 3, a capacitor assembly 4, a first low-inductance busbar 6 and a second low-inductance busbar 5; the heat sink 2 is arranged in the mounting frame 1; the IGBT component 3 is arranged on the heat sink 2; the capacitor assembly 4 is arranged in the mounting frame 1; the first low-inductance busbar 6 is stacked on top of the IGBT component 3 and is electrically connected to the IGBT component 3; the second low-inductance busbar 5 is at least partially stacked on top of the first low-inductance busbar 6, and the second low-inductance busbar 5 is electrically connected to both the IGBT component 3 and the capacitor assembly 4.

[0043] It should be noted that the second low-sensitivity busbar 5 mentioned in this specific embodiment is at least partially stacked on top of the first low-sensitivity busbar 6, which means that the second low-sensitivity busbar 5 is arranged above the first low-sensitivity busbar 6, and the projection of the second low-sensitivity busbar 5 to the first low-sensitivity busbar 6 is at least partially located on the first low-sensitivity busbar 6, and no other components are arranged between the first low-sensitivity busbar 6 and the second low-sensitivity busbar 5.

[0044] In the process of using the converter module provided by this specific embodiment, the first low-inductance busbar 6 is electrically connected to the IGBT component 3 (Insulate-Gate Bipolar Transistor), and the second low-inductance busbar 5 is electrically connected to the IGBT component 3 and the capacitor assembly 4. Compared with directly electrically connecting the IGBT component 3 and the capacitor assembly 4 through the circuit, the circuit layout can be more optimized and the stray inductance can be reduced. In addition, in the present invention, the first low-inductance busbar 6 and the second low-inductance busbar 5 are at least partially overlapped, and the electromagnetic fields of the overlapped positive and negative rows cancel each other out, thereby further reducing the stray inductance.

[0045] On the other hand, the second low-inductance busbar 5 can completely cover the first low-inductance busbar 6 to increase the overlapping area between the first low-inductance busbar 6 and the second low-inductance busbar 5. During specific use, the electromagnetic fields of the stacked positive and negative rows cancel each other out, further reducing stray inductance.

[0046] In a specific embodiment, the capacitor assembly 4 is disposed on one side of the IGBT component 3, and the first low-inductance busbar 6 is only stacked above the IGBT component 3; Figure 1 As shown, the capacitor assembly 4 is arranged on the lower side of the IGBT component 3 .

[0047] In this specific embodiment, the capacitor assembly 4 and the IGBT component 3 are arranged separately, the structural layout is more reasonable, and during electrical connection, the layout of the connecting wires is more convenient, which can further reduce stray inductance.

[0048] On the one hand, the capacitor component 4 may include a plurality of flying capacitors, and the plurality of flying capacitors may be distributed in a matrix. Figure 1 As shown, the number of the femtoquard capacitors is 9, and the 9 femtoquard capacitors are arranged in a matrix of three rows and three columns.

[0049] like Figure 2 As shown, the first low-inductance busbar 6 is arranged above the IGBT component 3 and covers at least part of the IGBT component 3. The second low-inductance busbar 5 includes a first part stacked above the first low-inductance busbar 6 and a second part stacked above the capacitor component 4. The first part and the second part are an integrated structure.

[0050] In this specific embodiment, the second low-inductance busbar 5 can be set as an integrated first part and a second part. During the electrical connection process, the first part of the second low-inductance busbar 5 is electrically connected to the IGBT component 3, and the connecting terminal of the first part can be directly connected to the terminal of the IGBT component 3 by bolt press-fitting downwards. The second part of the second low-inductance busbar 5 is electrically connected to the capacitor assembly 4, and the connecting terminal of the second part can be directly connected to the capacitor terminal of the capacitor assembly 4 by bolt press-fitting downwards. This effectively shortens the length of the wire used for electrical connection and makes the structural layout of the line more reasonable.

[0051] like Figure 2 As shown, a bend is provided at the connection between the first part and the second part, and the bend is toward the capacitor component 4, so that the setting height of the second part is lower than the setting height of the first part.

[0052] In the specific setting process, since the first low-inductance busbar 6 is arranged on the upper surface of the IGBT component 3, the first part of the second low-inductance busbar 5 needs to be arranged above the first low-inductance busbar 6, and the second part of the second low-inductance busbar 5 is directly arranged above the capacitor assembly 4. In order to make the first part of the second low-inductance busbar 5 fit the first low-inductance busbar 6 as closely as possible, and the second part of the second low-inductance busbar 5 fits the upper surface of the capacitor assembly 4 as closely as possible, the first part of the second low-inductance busbar 5 and the second part of the second low-inductance busbar 5 have a certain height difference, so as to reasonably utilize the space and facilitate the arrangement of other components.

[0053] Specifically, the driving assembly 7 can be arranged above the second part of the second low-sensitivity busbar 5 to reasonably utilize the space formed by the height difference between the first part of the second low-sensitivity busbar 5 and the second part of the second low-sensitivity busbar 5 .

[0054] In a specific embodiment, a plurality of temperature relays are provided on the surface of the radiator 2, and the temperature relays are used to monitor the surface temperature of the radiator 2. When the surface temperature of the radiator 2 is greater than or equal to a preset value of the temperature relay, the temperature relay outputs a temperature alarm signal.

[0055] Specifically, at least two IGBT components 3 may be spaced apart on the surface of the heat sink 2, and the temperature relay may be disposed at the gap between adjacent IGBT components 3; of course, the temperature relay may also be disposed at other locations that meet the requirements, which may be determined based on actual conditions.

[0056] In this specific embodiment, the temperature relay can monitor the surface temperature of the radiator 2 and send out an alarm signal in time when the surface temperature of the radiator 2 exceeds a preset temperature, thereby avoiding malfunctions due to excessive temperature.

[0057] Furthermore, a thermal conductive coating may be provided on the surface of the temperature relay that is in contact with the heat sink 2 , so that the temperature relay can better sense the temperature of the surface of the heat sink 2 .

[0058] In a specific embodiment, if Figure 3 As shown, a temperature sensor is provided in the IGBT component 3, and a driving assembly 7 is provided above the second low-sensitivity busbar 5. The driving assembly 7 includes a gate adapter board and a gate driver. The gate driver is electrically connected to the gate adapter board. The gate adapter board is electrically connected to the temperature sensor in the IGBT component 3 and obtains the temperature information measured by the temperature sensor. The gate driver is used to transmit the temperature information transmitted by the gate adapter board to the outside.

[0059] During specific use, when the temperature sensor detects that the temperature on the surface of the radiator 2 is greater than or equal to the maximum value of the preset temperature, the temperature sensor sends the information to the gate adapter board, the gate adapter board transmits the acquired temperature information to the gate driver, and the gate driver transmits the temperature information to the outside.

[0060] Furthermore, the installation frame 1 may be provided with an external communication interface 8 for connecting with external signals.

[0061] In order to allow the capacitor assembly 4 to dissipate heat smoothly, an air inlet may be provided in the frame, and the capacitor assembly 4 is located at the air inlet to facilitate cooling of the capacitor assembly 4 and prevent the capacitor assembly 4 from overheating.

[0062] Specifically, the number of air inlets can be set to be multiple, and the multiple air inlets completely cover the capacitor assembly 4 to further improve the heat dissipation effect of the capacitor assembly 4.

[0063] In addition to the above-mentioned converter module, the present invention further provides a converter including the converter module disclosed in the above-mentioned embodiment. For the structures of other parts of the converter, please refer to the prior art and will not be described in detail herein.

[0064] The converter provided in this specific embodiment can be used to control the charging and discharging process of the battery, perform AC-DC conversion, and directly supply power to AC loads in the absence of a power grid, thereby effectively regulating power resources, balancing the differences in electricity consumption during the day and night and in different seasons, adjusting surpluses and shortages, and ensuring the safety of the power grid.

[0065] In addition to the above-mentioned converter, the present invention also provides a charging pile including the converter disclosed in the above-mentioned embodiment. For the structures of other parts of the charging pile, please refer to the prior art and will not be described in detail herein.

[0066] The charging pile mentioned in this specific embodiment can be used for charging new energy vehicles.

[0067] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. Any combination of all embodiments provided by the present invention is within the protection scope of this invention and will not be described in detail here.

[0068] The above is a detailed introduction to the converter module, converter and charging pile provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A converter module, characterized in that: include: Mounting frame (1); A radiator (2) is arranged in the installation frame (1); An IGBT component (3) is arranged on the heat sink (2); A capacitor assembly (4) is arranged in the installation frame (1); A first low-inductance busbar (6) is stacked above the IGBT component (3) and is electrically connected to the IGBT component (3); The second low-inductance busbar (5) is at least partially stacked on the first low-inductance busbar (6), and the second low-inductance busbar (5) is electrically connected to the IGBT component (3) and the capacitor assembly (4).

2. The converter module according to claim 1, characterized in that: The second low-sensitivity busbar (5) completely covers the first low-sensitivity busbar (6).

3. The converter module according to claim 1, characterized in that: The capacitor assembly (4) is arranged on one side of the IGBT component (3), and the first low-inductance busbar (6) is only stacked above the IGBT component (3).

4. The converter module according to claim 3, characterized in that: The capacitor component (4) comprises a plurality of flying capacitors, and the plurality of flying capacitors are distributed in a matrix shape.

5. The converter module according to claim 3, characterized in that: The second low-inductance busbar (5) comprises a first portion stacked on top of the first low-inductance busbar (6), and a second portion stacked on top of the capacitor assembly (4), wherein the first portion and the second portion are an integrated structure.

6. The converter module according to claim 5, characterized in that: A bend is provided at the connection between the first part and the second part, and the bend faces the capacitor component (4).

7. The converter module according to any one of claims 1 to 6, characterized in that: A plurality of temperature relays are arranged on the surface of the radiator (2), and the temperature relays are used to monitor the surface temperature of the radiator (2). When the surface temperature of the radiator (2) is greater than or equal to a preset value of the temperature relay, the temperature relay outputs a temperature alarm signal.

8. The converter module according to claim 7, characterized in that: At least two of the IGBT components (3) are arranged at intervals on the surface of the heat sink (2), and the temperature relay is arranged at a gap between adjacent IGBT components (3).

9. The converter module according to claim 8, characterized in that: The surface of the temperature relay that is in contact with the heat sink (2) is provided with a heat-conducting coating.

10. The converter module according to claim 7, characterized in that: A temperature sensor is arranged inside the IGBT component (3); a drive assembly (7) is arranged above the second low-sensitivity busbar (5); the drive assembly (7) comprises a gate adapter board and a gate driver; the gate driver is electrically connected to the gate adapter board; the gate adapter board is electrically connected to the temperature sensor inside the IGBT component (3) and obtains temperature information measured by the temperature sensor; the gate driver is used to transmit the temperature information transmitted by the gate adapter board to the outside.

11. The converter module according to any one of claims 1 to 6, characterized in that: The installation frame (1) is provided with an air inlet, and the capacitor assembly (4) is located at the air inlet.

12. The converter module according to claim 11, characterized in that: There are multiple air inlets, and the capacitor assembly (4) is completely covered by the air inlets.

13. The converter module according to any one of claims 1 to 6, characterized in that: The installation frame (1) is provided with an external communication interface (8) for connecting to an external signal.

14. A converter, characterized in that: The invention comprises the converter module as claimed in any one of claims 1 to 13.

15. A charging pile, characterized in that: Comprising the converter as claimed in claim 14.

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