Smart phone with rear cover touch control structure

Abstract

The invention discloses an intelligent mobile phone with a rear cover touch control structure, which realizes stable signal transmission and power supply with an intelligent mobile phone main body through a touch control assembly by adopting a magnetic attraction connection mode, and ensures high sensitivity and reliability of touch control operation; according to the heat dissipation system, flexible heat conduction is achieved through extrusion protruding points made of silica gel materials and elastic heat conduction strips, expansion blocks made of thermal expansion polymer materials push heat dissipation deformation pieces to deform, and heat dissipation holes are dynamically opened so that the air convection heat dissipation efficiency can be enhanced; meanwhile, a color marking coating on the heat dissipation deformation sheet provides a visual temperature state indication function, a user can be reminded to stop using and disassemble the heat dissipation deformation sheet for heat dissipation in case of overheating, and the overall design ensures the heat dissipation efficiency and safety of equipment and the stability of the touch function while solving the problem of heat dissipation obstruction of the touch assembly; the touch screen has the remarkable advantages of being simple in structure, reliable in performance and high in heat dissipation and touch compatibility.

Description

Technical Field

[0001] The present invention relates to the technical field of smart phones, and more specifically to a smart phone with a back cover touch structure. Background Art

[0002] The back cover of smartphones is gradually being given more functions, and touch components are installed to realize multi-finger touch, gesture operation and other functions, further expanding the way users interact with the device. This design not only improves the functionality of smartphones, but also provides users with a more flexible and convenient operation experience. Especially in scenes such as games and office work, the back cover touch function can significantly enhance the user's efficiency and immersion, becoming an important direction for the expansion of smartphone functions.

[0003] However, in addition to being part of the device structure, the back cover of a smartphone also has an important heat dissipation function, which releases internal heat to the outside air through contact with the external environment. Existing devices all have a touch module fixed on the back cover. The covering of the touch component will hinder the normal transfer of heat, resulting in a decrease in the device's heat dissipation performance. The electrical components of the touch module will also generate additional heat during operation, further exacerbating the device's heat accumulation problem. If the heat dissipation design is insufficient, it will not only affect the performance of the device and the stability of the touch module, but may also shorten the service life of the entire device.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a smart phone with a back cover touch structure. Summary of the invention

[0005] The object of the present invention is to provide a smart phone with a back cover touch structure to solve the above-mentioned problem.

[0006] In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows: A smartphone with a back cover touch structure comprises: a smartphone body, a touch component, a touch integrated block and a mounting component, wherein the touch component is magnetically mounted on one end of the smartphone body; the touch component comprises a touch integrated block and a mounting component, wherein the touch integrated block is embedded in the mounting component, and a plurality of metal contacts are arranged on the touch integrated block for realizing signal transmission and power supply with the smartphone body; the touch integrated block comprises a protective shell, wherein a touch sensing layer, a light guide plate and a control circuit board electrically connected to the touch sensing layer are mounted in the protective shell; the mounting component comprises a mounting frame, wherein a heat sink is mounted on the inner wall of the mounting frame, wherein a plurality of evenly distributed heat dissipation holes are opened on the heat sink, and a heat dissipation component is mounted in the heat dissipation holes.

[0007] As a further improvement of the present invention, a plurality of evenly distributed extrusion protrusions are installed at the bottom end of the heat dissipation plate, and the corresponding shapes of the extrusion protrusions are set to be spherical.

[0008] As a further improvement of the present invention, the heat dissipation assembly includes a heat-conducting column arranged in the heat dissipation hole, and the bottom end of the heat-conducting column is fixedly connected to a plurality of evenly distributed elastic heat-conducting strips, and the corresponding shapes of the plurality of elastic heat-conducting strips are set to be truncated cones.

[0009] As a further improvement of the present invention, the materials corresponding to the extrusion protrusions and the elastic heat-conducting strips are both set to silicone material.

[0010] As a further improvement of the present invention, a plurality of evenly distributed heat-conducting rods are installed around the heat-conducting column, and one end of the plurality of heat-conducting rods away from the heat-conducting column is connected to the inner wall of the heat dissipation hole.

[0011] As a further improvement of the present invention, an expansion block is installed on the top of the heat-conducting column, the material of the expansion block is set to be a thermal expansion polymer material, and the expansion temperature range of the expansion block is 40-80°C.

[0012] As a further improvement of the present invention, a heat dissipation deformation sheet is installed at the top of the heat dissipation plate and located outside the heat dissipation hole, and the center of the heat dissipation deformation sheet is in contact with the expansion block.

[0013] As a further improvement of the present invention, a plurality of evenly distributed heat dissipation holes are provided on the heat dissipation deformation piece, and the heat dissipation holes are sealed due to the extrusion force of the heat dissipation deformation piece itself when the heat dissipation deformation piece is not deformed, and the heat dissipation holes are exposed when the heat dissipation deformation piece is deformed.

[0014] As a further improvement of the present invention, a color marking coating is coated on the heat dissipation deformation piece. When the heat dissipation deformation piece is subjected to different degrees of expansion, different colors are displayed in sequence. The color marking coating is a multi-layer structure, including a first color layer, a second color layer and a third color layer coated in sequence. The first color layer covers the topmost layer. When the heat dissipation deformation piece expands, the first color layer gradually stretches or peels off to expose the second color layer underneath. When it expands further, the third color layer is displayed.

[0015] As a further improvement of the present invention, the thickness of the multiple color layers in the color marking coating is 10-50 microns.

[0016] Compared with the prior art, the advantages of the present invention are: This solution combines the touch integrated block with the heat dissipation system. In order to solve the problem of the touch module hindering the heat dissipation of the back cover, the compatibility of the touch function and efficient heat dissipation is achieved through optimizing the structural design. The touch component adopts a magnetic connection method to achieve stable signal transmission and power supply with the smartphone body, ensuring high sensitivity and reliability of touch operation. The heat dissipation system realizes flexible heat conduction through the extrusion bumps and elastic thermal conductive strips of silicone material. The expansion blocks of thermal expansion polymer material push the heat dissipation deformation sheet to deform, dynamically open the heat dissipation holes to enhance the air convection heat dissipation efficiency. At the same time, the color-coded coating on the heat dissipation deformation sheet provides an intuitive temperature status indication function, which can remind users to stop using it and disassemble it for heat dissipation when it is overheated. The overall design solves the problem of heat dissipation obstruction of the touch component while ensuring the heat dissipation efficiency, safety and stability of the touch function of the device. It has the significant advantages of simple structure, reliable performance, and strong compatibility between heat dissipation and touch. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the touch control component of the present invention; Figure 3 It is a schematic diagram of the side cross-sectional structure of the touch control assembly of the present invention; Figure 4 For the present invention Figure 3 Schematic diagram of the structure at A in the middle; Figure 5 It is a schematic diagram of the structure of the heat dissipation assembly of the present invention; Figure 6 It is a schematic diagram of the structure of the heat dissipation component of the present invention when dissipating heat.

[0018] Description of the numbers in the figure: 1. Smart phone body; 2. Touch panel component; 3. Touch panel integrated block; 4. Mounting component; 5. Heat dissipation component; 41. Mounting frame; 42. Heat dissipation plate; 43. Extrusion bump; 44. Heat dissipation hole; 51. Thermal conductive column; 52. Elastic thermal conductive strip; 53. Thermal conductive rod; 54. Expansion block; 55. Heat dissipation deformation sheet. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention. Example

[0020] See also Figure 1-6A smartphone with a back cover touch structure comprises: a smartphone body 1, a touch component 2, a touch integrated block 3 and a mounting component 4, wherein the touch component 2 is magnetically mounted on one end of the smartphone body 1; the touch component 2 comprises a touch integrated block 3 and a mounting component 4, wherein the touch integrated block 3 is embedded in the mounting component 4, and a plurality of metal contacts are arranged on the touch integrated block 3 for realizing signal transmission and power supply with the smartphone body 1; the touch integrated block 3 comprises a protective shell, wherein a touch sensing layer, a light guide plate and a control circuit board electrically connected to the touch sensing layer are installed in the protective shell; the mounting component 4 comprises a mounting frame 41, wherein a heat sink 42 is installed on the inner wall of the mounting frame 41, wherein a plurality of evenly distributed heat dissipation holes 44 are opened on the heat sink 42, and a heat dissipation component 5 is installed in the heat dissipation holes 44.

[0021] Among them, the touch integrated block 3 realizes signal transmission and power supply connection with the smartphone body 1 through multiple metal contacts. The metal contacts are tightly fitted to the smartphone body 1 by magnetic attraction to ensure stable electrical connection and reliable touch response. The protective shell of the touch integrated block 3 integrates a touch sensing layer, a light guide plate and a control circuit board electrically connected to the touch sensing layer, wherein the touch sensing layer is responsible for sensing the user's touch operation and transmitting the signal to the control circuit board for processing; the light guide plate optimizes the light distribution when the screen is displayed or in touch state, and enhances the visual effect of the touch area. The overall structural design realizes high-sensitivity touch operation, and at the same time ensures efficient interaction between the touch signal and the smartphone body 1 through the stable transmission of metal contacts.

[0022] By innovatively combining the touch integrated block 3 with the heat dissipation system, a magnetic connection is used to achieve a stable electrical connection between the touch component 2 and the smartphone body 1, ensuring high sensitivity and reliability of touch operation. At the same time, the heat dissipation design realizes flexible heat conduction and electrical isolation through the extrusion bumps 43 of silicone material and the elastic heat conductive strips 52, avoiding damage to the back cover and enhancing thermal conductivity; the expansion block 54 of the thermal expansion polymer material drives the heat dissipation deformation sheet 55 to deform, dynamically adjusts the opening degree of the heat dissipation holes, and significantly improves the heat dissipation efficiency; the heat dissipation deformation sheet 55 coated with a color-coded coating also provides an intuitive temperature status indication function. The overall design has the characteristics of simple structure, stable performance, and high heat dissipation efficiency, while taking into account the electrical safety and reliability of the equipment, greatly improving the heat dissipation performance and touch experience of the smartphone.

[0023] A plurality of evenly distributed extrusion protrusions 43 are installed at the bottom end of the heat dissipation plate 42 , and the corresponding shape of the extrusion protrusions 43 is set to be spherical.

[0024] The structural design of the extrusion convex point 43 enables it to provide a larger contact area when in contact with the smartphone body 1. Since the convex point of the spherical structure has good distribution characteristics when subjected to force, it can evenly disperse the pressure, avoid damage to the back cover of the smartphone body 1 due to excessive local force, and at the same time enhance the fit with the back cover, thereby improving the heat transfer efficiency.

[0025] The extrusion convex points 43 are evenly distributed so as to cover most of the bottom area of ​​the heat sink 42, ensuring that the heat sink 42 can efficiently transfer heat to the smartphone body 1 through the multiple extrusion convex points 43, maximizing the heat absorption and heat dissipation effect. In addition, the spherical design can maintain stable contact and heat conduction performance when the surface of the smartphone body 1 is slightly deformed or bent, further improving the reliability of the heat dissipation system.

[0026] It not only provides excellent contact performance and thermal conductivity, but also realizes the functions of protecting the smartphone body 1 and efficiently dissipating heat through the flexibility and thermal conductivity of the silicone material. It has a simple structure, stable performance and high reliability.

[0027] The heat dissipation assembly 5 includes a heat-conducting column 51 disposed in the heat dissipation hole 44 . A plurality of evenly distributed elastic heat-conducting strips 52 are fixedly connected to the bottom end of the heat-conducting column 51 . The corresponding shapes of the plurality of elastic heat-conducting strips 52 are set to be truncated cones.

[0028] Among them, the heat-conducting column 51 serves as a core heat transfer component, which can transfer the heat generated by the back cover of the smartphone body 1 to other parts of the heat dissipation component 5 through absorption by the elastic heat-conducting strip 52, thereby achieving efficient heat transfer and diffusion.

[0029] The elastic thermally conductive strip 52 is fixed to the bottom end of the thermally conductive column 51 in an evenly distributed manner. Its flexible design can adapt to different shapes or slight deformations when in contact with the back cover of the smartphone body 1, ensuring good fit and thermal conductivity.

[0030] The corresponding shape of the heat-conducting rod 53 is set to be a truncated cone, and its design can provide a larger contact area. When the heat-conducting column 51 transfers heat, the truncated cone structure further transfers the heat to the heat dissipation plate 42 and the outside air, thereby enhancing the heat dissipation effect. In addition, the truncated cone-shaped heat-conducting rod 53 has good structural stability, can maintain efficient heat conduction performance in long-term use, and avoid the decline of heat dissipation performance due to deformation or fatigue.

[0031] The materials corresponding to the extrusion protrusions 43 and the elastic heat-conducting strips 52 are both set to be silicone materials.

[0032] The materials corresponding to the extruded convex points 43 and the elastic heat-conducting strips 52 are both set to be silicone materials. The silicone material has excellent flexibility, thermal conductivity and durability, so that the extruded convex points 43 and the elastic heat-conducting strips 52 can better adapt to different working conditions and provide efficient heat dissipation effects during the heat dissipation process. It can not only provide good flexibility and thermal conductivity, but also have high temperature resistance, anti-aging and excellent surface adaptability, so that the heat dissipation component can maintain efficient and stable heat dissipation effects during long-term use.

[0033] A plurality of evenly distributed heat-conducting rods 53 are installed around the heat-conducting column 51. The ends of the heat-conducting rods 53 away from the heat-conducting column 51 are connected to the inner wall of the heat dissipation hole 44. An expansion block 54 is installed on the top of the heat-conducting column 51. The material of the expansion block 54 is set to be a thermal expansion polymer material, and the expansion temperature range of the expansion block 54 is 40-80°C.

[0034] A heat dissipation deformation sheet 55 is installed at the top of the heat dissipation plate 42 and outside the heat dissipation hole 44 . The center of the heat dissipation deformation sheet 55 abuts against the expansion block 54 .

[0035] The heat dissipation deformation sheet 55 is provided with a plurality of evenly distributed heat dissipation holes. When the heat dissipation deformation sheet 55 is not deformed, the heat dissipation holes are sealed due to the extrusion force of the heat dissipation deformation sheet 55 itself. When the heat dissipation deformation sheet 55 is deformed, the heat dissipation holes are exposed.

[0036] Among them, after absorbing the heat transferred by the smartphone body 1, the heat-conducting column 51 can quickly disperse the heat to the multiple heat-conducting rods 53 surrounding it. The heat-conducting rods 53 are evenly distributed and connected to the inner wall of the heat dissipation hole 44, thereby forming an efficient heat transfer path. The heat-conducting rods 53 can not only further diffuse the heat, but also reduce the loss of heat during the transmission process, and finally transfer the heat to the heat dissipation plate 42 and the outside air through the heat dissipation hole 44 to achieve rapid heat dissipation.

[0037] An expansion block 54 is installed at the top of the heat-conducting column 51. The material of the expansion block 54 is set to be a thermal expansion polymer material, and the expansion temperature range of the expansion block 54 is 40-80°C. As a key component driven by temperature, the expansion block 54 has material characteristics that cause it to expand in volume when the set temperature range is reached, thereby pushing the heat dissipation deformation sheet 55 abutting against it to deform. By utilizing the controllable expansion characteristics of the thermal expansion polymer, the expansion block 54 can accurately respond to heat changes as the temperature rises. Within the common electronic equipment operating temperature range of 40-80°C, it is ensured that the deformation of the heat dissipation deformation sheet 55 can match the temperature condition of the device, providing a dynamic heat dissipation adjustment function.

[0038] A heat dissipation deformation sheet 55 is installed at the top of the heat dissipation plate 42 and outside the heat dissipation hole 44. The center of the heat dissipation deformation sheet 55 is in contact with the expansion block 54. The heat dissipation deformation sheet 55 can produce corresponding deformation as the temperature of the expansion block 54 expands through contact with the expansion block 54. The deformation of the heat dissipation deformation sheet 55 can not only increase its contact area with the external air, thereby improving the heat dissipation efficiency, but also further enhance the air convection effect through the heat dissipation holes specially designed on its surface, while releasing the heat inside the equipment.

[0039] The heat dissipation deformation sheet 55 is provided with a plurality of evenly distributed heat dissipation holes. When the heat dissipation deformation sheet 55 is in an undeformed state, the heat dissipation holes are sealed due to the extrusion pressure of the heat dissipation deformation sheet 55 itself. When the heat dissipation deformation sheet 55 is deformed, the heat dissipation holes are exposed. When it is not deformed, the heat dissipation deformation sheet 55 seals the heat dissipation holes by its own extrusion pressure, which can effectively isolate the entry of external dust or foreign objects, thereby protecting the internal components of the device.

[0040] When the heat dissipation deformation sheet 55 is deformed under the push of the expansion block 54, the heat dissipation holes thereon gradually open, and the heat inside the device can be exchanged with the external air through the holes, further enhancing the heat dissipation capacity. At the same time, the uniform distribution design of the heat dissipation holes ensures that the overall heat dissipation performance of the heat dissipation deformation sheet 55 is uniform, avoiding local overheating and improving the stability and reliability of the heat dissipation system.

[0041] In summary, the heat-conducting column 51, the heat-conducting rod 53, the expansion block 54 and the heat-dissipating deformation sheet 55 work together to form an intelligent and efficient heat dissipation system. The system uses the thermal expansion characteristics of the expansion block 54 to drive the heat-dissipating deformation sheet 55 to deform, thereby opening the heat-dissipating holes, significantly enhancing the heat dissipation effect, ensuring the normal operating temperature of the equipment, and realizing intelligent heat dissipation through the dynamic adjustment function of the heat-dissipating deformation sheet 55. At the same time, the sealing and opening design of the heat-dissipating holes takes into account the protection performance and heat dissipation performance of the equipment, and has the beneficial effects of simple structure, reliable performance and high heat dissipation efficiency.

[0042] It should be noted that the material of the expansion block 54 is set to be a thermal expansion polymer material, and its specific material is preferably polyvinylidene fluoride PVDF, which has excellent thermal expansion properties and mechanical stability, can produce stable and controllable volume expansion within the temperature range of 40-80°C, has a moderate expansion rate, and can effectively promote the deformation of the heat dissipation deformation sheet 55.

[0043] The thermal expansion coefficient of PVDF is generally 200-300 ppm / ℃, and its volume expansion rate can reach 1.2%-1.5% in the temperature range of 40-80℃. This expansion rate can provide sufficient driving force to make the heat dissipation deformation sheet 55 deform stably and gradually open the heat dissipation holes, thereby significantly enhancing the heat dissipation capacity of the device.

[0044] At the same time, PVDF has high mechanical strength and fatigue resistance. Even in long-term thermal expansion-contraction cycles, it can still maintain the stability of shape and performance, and will not affect the service life of the heat dissipation components due to fatigue loss.

[0045] The heat dissipation deformation sheet 55 is coated with a color-coded coating. When the heat dissipation deformation sheet 55 is expanded to different degrees, different colors are displayed in sequence. The color-coded coating is a multi-layer structure, including a first color layer, a second color layer and a third color layer coated in sequence. The first color layer covers the topmost layer. When the heat dissipation deformation sheet 55 expands, the first color layer is gradually stretched or peeled off to expose the second color layer underneath. When it expands further, the third color layer is displayed.

[0046] The thickness of the multiple color layers in the color coding coating is 10-50 microns.

[0047] Among them, the heat dissipation deformation sheet 55 is coated with a color marking coating, and the color marking coating is a multi-layer structure, including a first color layer, a second color layer and a third color layer coated in sequence. The coating indicates the degree of deformation of the heat dissipation deformation sheet 55 caused by the expansion block 54 by showing different colors, thereby intuitively reflecting the temperature or heat dissipation status of the equipment. The multi-layer structure design of the color marking coating enables it to show different colors at different stages of deformation of the heat dissipation deformation sheet 55. Users or equipment management systems can quickly judge the working status of the equipment through color changes.

[0048] When the heat dissipation deformation sheet 55 is in the initial flat state, the first color layer completely covers the outermost surface, and only the color of the first color layer can be seen from the outside, indicating that the device is in a low temperature or normal working state. As the heat dissipation deformation sheet 55 expands initially due to the push of the expansion block 54, the first color layer begins to be stretched, cracks appear or partially peels off, gradually exposing the second color layer below, and the color changes, indicating that the internal temperature of the device rises and enters the medium temperature range. When it expands further, the first color layer is completely peeled off or transparent, and the second color layer is completely revealed, indicating that the device has entered a higher temperature state. As the heat dissipation deformation sheet 55 expands to the maximum extent, the second color layer is also stretched or peeled off, and the third color layer appears, indicating that the device temperature has reached a high temperature critical state, indicating that further heat dissipation or protection measures need to be taken. The color change process is determined by the stretching and peeling characteristics of the coating. The coating thickness is 10-50 microns, which ensures that each layer of color appears in sequence at different expansion stages to avoid ambiguity caused by the simultaneous appearance of color layers.

[0049] The design principle of the color marking coating is based on the layered structure of the coating and the deformation characteristics of the material. The first color layer uses a flexible coating, such as polyurethane or elastic silicone, which has a low tensile strength and can crack or peel off when the heat dissipation deformation sheet 55 is slightly deformed, exposing the color layer below. The second and third color layers use high adhesion or high temperature resistant coatings, which are used for color display under moderate and maximum expansion states, respectively, to ensure that the color is clear and the coating performance is not affected by high temperature. The thickness of the color layer is designed to be 10-50 microns, which not only ensures the stability of the coating, but also enables it to display color layer by layer when deformed, forming an intuitive temperature indication effect.

[0050] The color change can intuitively reflect the deformation degree of the heat dissipation deformation sheet 55 and the temperature state of the equipment, which is convenient for users or systems to quickly judge the thermal state of the equipment; the multi-layer design of the color-coded coating provides graded indications of multi-level thermal states, corresponding to low temperature, medium temperature and high temperature states, which is helpful for precise control of the thermal management of the equipment; the structure is simple, the manufacturing cost is low, and no complex electronic sensors or additional power support are required, and it is suitable for wide application in smart devices, industrial equipment, consumer electronics and other fields; the coating material has stable performance, is not easy to fail due to high temperature or long-term use, and has good reliability and durability.

[0051] Through the above design, the color-coded coating is used in conjunction with the heat dissipation deformation sheet 55 to achieve a visual indication of the temperature status, effectively improving the intelligence level of the heat dissipation system and the safety of the equipment, while providing users with a more intuitive user experience.

[0052] It is worth noting that the use of extruded bumps 43 and elastic thermal conductive strips 52 made of silicone material, expansion blocks 54 made of thermal expansion polymer material, and heat sink 42 and heat dissipation deformation sheets 55 coated with insulating coatings can achieve electrical isolation between components while ensuring efficient heat transfer, effectively avoiding short circuits caused by direct metal contact or thermal expansion. The overall structure has both excellent thermal conductivity and electrical safety, ensuring that the device works stably during high-temperature heat dissipation, and significantly improving the reliability and service life of smartphones.

[0053] Working principle: The efficient heat dissipation and back cover touch function of the smartphone are realized through the collaborative work of the innovative touch component 2 and the heat dissipation system: the touch integrated block 3 is connected to the smartphone body 1 by magnetic attraction, the metal contacts realize signal transmission and power supply, the touch sensing layer inside it senses the user operation and processes the signal through the control circuit board, and the light guide plate optimizes the light distribution in the touch area to improve the touch performance; in the heat dissipation system, the spherical extrusion bumps 43 evenly distributed at the bottom of the heat dissipation plate 42 fit closely with the back cover of the smartphone body 1, providing a large area of ​​contact to enhance heat transfer, while the silicone material prevents damage to the back cover; the heat conductive column 51 arranged in the heat dissipation hole 44 It absorbs heat and transfers the heat to the heat sink 42 and the outside air through the elastic heat-conducting strip 52 and the truncated cone-shaped heat-conducting rod 53; the expansion block 54 is made of a thermal expansion polymer material. When the temperature reaches 40-80°C, it expands and pushes the heat dissipation deformation sheet 55 to deform. The heat dissipation deformation sheet 55 forms convection with the outside air by opening the heat dissipation holes to further release heat; the color-coded coating applied on the heat dissipation deformation sheet 55 displays different colors in sequence according to the degree of expansion, which intuitively indicates the temperature status of the device. The entire system combines heat conduction, dynamic deformation and temperature indication to not only achieve efficient heat dissipation, but also ensure the touch reliability and structural safety of the device.

[0054] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0055] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that those skilled in the art can understand.

Claims

1. A smart phone with a back cover touch structure, characterized in that: include: A smart phone body (1), wherein a touch control component (2) is magnetically mounted on one end of the smart phone body (1); A touch control component (2), the touch control component (2) comprising a touch control integrated block (3) and a mounting component (4), the touch control integrated block (3) being embedded in the mounting component (4), and the touch control integrated block (3) being provided with a plurality of metal contacts for realizing signal transmission and power supply with a smart phone body (1); A touch integrated block (3), the touch integrated block (3) comprising a protective shell, in which a touch sensing layer, a light guide plate and a control circuit board electrically connected to the touch sensing layer are installed; A mounting assembly (4), the mounting assembly (4) comprising a mounting frame (41), a heat sink (42) being mounted on an inner wall of the mounting frame (41), a plurality of evenly distributed heat sink holes (44) being formed on the heat sink (42), and a heat sink assembly (5) being mounted in the heat sink holes (44).

2. The smart phone with a rear cover touch structure according to claim 1, characterized in that: A plurality of evenly distributed extrusion convex points (43) are installed at the bottom end of the heat dissipation plate (42), and the corresponding shape of the extrusion convex points (43) is set to be spherical.

3. The smart phone with a rear cover touch structure according to claim 1, characterized in that: The heat dissipation component (5) comprises a heat-conducting column (51) arranged in the heat dissipation hole (44), the bottom end of the heat-conducting column (51) being fixedly connected to a plurality of evenly distributed elastic heat-conducting strips (52), and the corresponding shapes of the plurality of elastic heat-conducting strips (52) being set to be truncated cone-shaped.

4. The smart phone with a rear cover touch structure according to claim 2, characterized in that: The materials corresponding to the extrusion protrusions (43) and the elastic heat-conducting strips (52) are both set to be silicone materials.

5. The smart phone with a rear cover touch structure according to claim 3, characterized in that: A plurality of evenly distributed heat-conducting rods (53) are mounted around the heat-conducting column (51), and one end of the plurality of heat-conducting rods (53) away from the heat-conducting column (51) is connected to the inner wall of the heat dissipation hole (44).

6. The smart phone with a rear cover touch structure according to claim 5, characterized in that: An expansion block (54) is installed at the top of the heat-conducting column (51); the material of the expansion block (54) is set to be a heat-expanding polymer material, and the expansion temperature range of the expansion block (54) is 40-80°C.

7. The smart phone with a rear cover touch structure according to claim 1, characterized in that: A heat dissipation deformation sheet (55) is installed at the top end of the heat dissipation plate (42) and located outside the heat dissipation hole (44), and the center of the heat dissipation deformation sheet (55) is in contact with the expansion block (54).

8. The smart phone with a rear cover touch structure according to claim 7, characterized in that: The heat dissipation deformation sheet (55) is provided with a plurality of evenly distributed heat dissipation holes, and the heat dissipation holes are sealed due to the extrusion force of the heat dissipation deformation sheet (55) itself when the heat dissipation deformation sheet (55) is in an undeformed state, and the heat dissipation holes are exposed when the heat dissipation deformation sheet (55) is deformed.

9. The smart phone with a rear cover touch structure according to claim 7, characterized in that: The heat dissipation deformation sheet (55) is coated with a color marking coating, and when the heat dissipation deformation sheet (55) is expanded to different degrees, different colors are displayed in sequence, and the color marking coating is a multi-layer structure, comprising a first color layer, a second color layer and a third color layer that are coated in sequence, and the first color layer covers the uppermost layer, and when the heat dissipation deformation sheet (55) expands, the first color layer is gradually stretched or peeled off to expose the second color layer below, and the third color layer is displayed when it expands further.

10. The smart phone with a rear cover touch structure according to claim 9, characterized in that: The thickness of the multiple color layers in the color marking coating is 10-50 microns.

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