The invention relates to an LED
flip chip packaging technology-based LED screen packaging technology and an LED screen, and the packaging technology comprises the steps:
welding an IC, a
resistor, a
capacitor, a power supply seat and a connection terminal on a PCB, and obtaining a first PCB; cleaning the first PCB, and uniformly expanding the plurality of LED flip chips by using a
wafer expander; printing
solder paste on the first PCB, fixing LED flip chips on the first PCB through a die bonder, enabling every three LED chips to form a pixel point, detecting the pixel point through AOI detection equipment, and putting qualified LED chips into a
reflow soldering furnace to be welded into a second PCB; using the AOI detection equipment for detecting the second PCB, using a molding press to carry out out vacuum molding on the qualified second PCB to obtain a third PCB, after baking molding is carried out, according to the needed specification and size,
cutting off unnecessary process edges, and carrying out
coating or film pasting is carried out on the lamp face of the module. The surface is made to be black, the
contrast ratio of the product is improved, and the color uniformity and consistency are improved, and the display effect is better; and each pixel point only needs six
metal bonding points, so that a
wire bonding link is omitted.