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Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system

A micro-electromechanical system and micro-inductance technology, applied in the field of microelectronics, can solve problems such as the influence of coil and magnetic core performance, high curing temperature of insulating materials, and difficulty in obtaining high-performance micro-inductance devices, etc. The effect of solving the circuit breaker

Inactive Publication Date: 2006-06-21
SHANGHAI JIAOTONG UNIV
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Problems solved by technology

Moreover, in the manufacturing process, the curing temperature of the insulating material used by the author is as high as 350 ° C, which will affect the performance of the coil and magnetic core, so it is difficult to obtain high-performance micro-inductance devices

Method used

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  • Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system
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  • Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system

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Embodiment Construction

[0049] The specific structure of the present invention will be further described below in conjunction with the accompanying drawings.

[0050] Micro-inductance device structure of the present invention such as figure 1 As shown, it is composed of substrate 1, pin 2, solenoid coil 3, and magnetic core 4. The solenoid coil 3 is based on the substrate 1, and two groups of connected three-dimensional coils are symmetrically wound around the rectangular closed magnetic core 4. A three-dimensional solenoid coil 3 , the two ends of the solenoid coil 3 are connected to the pin 2 .

[0051] figure 2 for figure 1 The sectional view of the structure along the direction A-A shows the longitudinal three-dimensional structure of the solenoid coil 3 of the present invention. like figure 2 As shown, the bottom coil 5 is arranged on the plane of the substrate 1, and the three-dimensional solenoid coil 3 is surrounded by the magnetic core 4. The solenoid coil 3 is formed by connecting the...

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Abstract

The invention provides a preparation method of a micro-electromechanical system magnetic core solenoid micro-inductance device. Using the micro-electromechanical system MEMS technology, the double-sided oxidized silicon wafer is processed to obtain double-sided overlay alignment symbols, so as to improve exposure during exposure. Alignment accuracy, use physical etching technology to remove the seed layer, and use one-time electroplating to connect the conductor. The prepared micro-inductance device is mainly composed of substrate, pin, coil, and magnetic core. Two groups of ring-shaped closed magnetic cores are symmetrically wound The connected three-dimensional solenoid coil is formed by connecting the bottom coil and the top coil through a connecting conductor, and the bottom coil, the top coil and the connecting conductor are separated by a polyimide insulating material and a magnetic core. The method of the invention avoids the undercutting phenomenon caused by the wet etching process, solves the three-dimensional winding of the coil and the insulation problem between layers and the electroplating problem of high aspect ratio, and greatly improves the inductance performance of the micro-inductance device.

Description

technical field [0001] The invention relates to a preparation method of a micro-electromechanical system (MEMS) magnetic core solenoid micro-inductance device. The prepared miniaturized and integrated magnetic core micro-inductance device is a key component for realizing a miniaturized DC-DC converter, and can be widely used Power supply for wireless communication, military / aerospace equipment, computer / peripheral equipment and other portable electronic products. It belongs to the technical field of microelectronics. Background technique [0002] In recent years, miniaturized portable electronic products such as mobile communication products CDMA (Code Division Multiple Access, Code Division Multiple Access), laptop computers, network products ADSL (Asymmetrical Digital Subscriber Loop, asymmetrical digital subscriber loop), microprocessors, digital cameras, Flash memory devices, audio, chargers, etc. are more and more popular and concerned by the market. The miniaturizati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/00B81C1/00B81C5/00H01F17/04H01F37/00B81C99/00
Inventor 周勇高孝裕周海涛陈吉安
Owner SHANGHAI JIAOTONG UNIV
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