Method for making RF solenoid micro-inductor based on micro electro-mechanical system

A technology of micro-electromechanical systems and manufacturing methods, applied in the field of microelectronics, can solve problems affecting device performance, metal oxidation, etc., and achieve the effects of good repeatability, high operating frequency, and improved flatness

Inactive Publication Date: 2006-05-03
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, in the manufacturing process, RIE is used to etch the insulating material many tim

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Deposit a Cr / Cu bottom layer on the cleaned glass substrate with a thickness of 100 nm. For positive resist AZ4000 series, the photoresist thickness is 5 μm, the photoresist drying temperature is 95°C, and the drying time is 30 minutes; after exposing and developing the glass substrate on one side, the Cr / Cu bottom layer is etched by physical methods, and finally Remove all photoresist with acetone; sputter 300nm aluminum oxide film, and finally get double-sided overlay alignment symbols;

[0025] (2) Deposit a Cr / Cu bottom layer on the other side of the glass substrate with a thickness of 100 nm. The following processes are carried out on this surface.

[0026] (3) Shake the positive resist, the thickness of the photoresist is 10 μm, the drying temperature of the photoresist is 95 ° C, and the time is 30 minutes; expose and develop to obtain the bottom coil pattern; then electroplate the copper bottom coil with a thickness of 10 μm;

[0027] (4) Shake the positiv...

Embodiment 2

[0040] (1) Deposit a Cr / Cu bottom layer on the cleaned glass substrate with a thickness of 100 nm. The photoresist is AZ4000 series, the thickness of the photoresist is 6 μm, the drying temperature of the photoresist is 95 ° C, and the drying time is 30 minutes; after the glass substrate is exposed and developed on one side, the Cr / Cu bottom layer is etched by physical methods, and finally Remove all photoresist with acetone; sputter 300nm aluminum oxide film, and finally get double-sided overlay alignment symbols;

[0041] (2) Deposit a Cr / Cu bottom layer on the other side of the glass substrate with a thickness of 100 nm. The following processes are carried out on this surface.

[0042] (3) Shake the positive resist, the thickness of the photoresist is 5 μm, the drying temperature of the photoresist is 95 ° C, and the time is 30 minutes; expose and develop to obtain the bottom coil pattern; then electroplate the copper bottom coil with a thickness of 10 μm;

[0043] (4) Sh...

Embodiment 3

[0056] (1) Deposit a Cr / Cu bottom layer on the cleaned glass substrate with a thickness of 100 nm. For positive resist AZ4000 series, the thickness of the photoresist is 8 μm, the drying temperature of the photoresist is 95°C, and the drying time is 30 minutes; Remove all photoresist with acetone; sputter 300nm aluminum oxide film, and finally get double-sided overlay alignment symbols;

[0057] (2) Deposit a Cr / Cu bottom layer on the other side of the glass substrate with a thickness of 100 nm. The following processes are carried out on this surface.

[0058] (3) Shake the positive resist, the thickness of the photoresist is 8 μm, the drying temperature of the photoresist is 95 ° C, and the time is 30 minutes; expose and develop to obtain the bottom coil pattern; then electroplate the copper bottom coil with a thickness of 10 μm;

[0059] (4) Shake the positive resist, the thickness of the photoresist is 10 μm, the photoresist drying temperature is 95 ° C, and the time is 6...

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Abstract

The invention relates to a method for making audio frequency follow-up coil micro inductor based on micro Electro-Me-Chemical System. It adopts micro Electro-Me-Chemical System technology to process the cleared glass substrate to obtain two-sides nicking align sign to elevate the align accuracy when exposing; it adopts quasi-LIGA technology and thickness photoresist craft preparing the coil and photoresist die of the connecting conductor; it adopts electroplating technique to resolve the coil coiling and connecting conductor; it adopts medlin material as insulating layer and glazing technique to resolve the compression of the substrate; it adopts physics etching technique to detach the electric plating used conductor.

Description

technical field [0001] The invention relates to a method in the technical field of microelectronics, in particular to a method for manufacturing a radio frequency solenoid microinductor based on a microelectromechanical system. Background technique [0002] RF-MEMS (Radio Frequency-Micro-Electro-Mechanical Systems) devices are a new research field that has emerged in Micro-Electro-Mechanical Systems (MEMS) technology in recent years, that is, RF-MEMS is to use MEMS technology to make various radio frequency devices or systems for wireless communication. RF-MEMS devices and systems can be widely used in interstellar wireless communications, advanced mobile communications such as mobile phones, global positioning system GPS, microwave radar antennas, etc. Because RF-MEMS devices have many advantages, and can finally realize the high integration of passive devices and ICs, it is possible to develop a system integrated chip (SOC) that integrates information collection, processin...

Claims

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Application Information

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IPC IPC(8): H01F41/00B81B1/00H01L21/02
Inventor 周勇王西宁赵小林曹莹高孝裕
Owner SHANGHAI JIAO TONG UNIV
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