LED flip chip packaging technology-based LED screen packaging process and LED screen
A flip-chip and LED screen technology, which is applied in the direction of identification devices, instruments, electrical components, etc., can solve the problems of poor heat dissipation, complicated LED display packaging process, and inability to make small pitches, so as to improve pixels and save soldering. Line link, solve the effect of internal virtual welding and disconnection
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[0041] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings. Among them, the orientation nouns such as "up" and "down" mentioned in this article are preceded by figure 1 orientation as a reference.
[0042] In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be more clearly and thoroughly understood, and the scope of the present invention can be fully conveyed to those skilled in the art.
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